CN216668394U - Thin plate type loop heat pipe - Google Patents

Abstract

The utility model relates to the technical field of heat dissipation devices, in particular to a thin plate type loop heat pipe which comprises a shell, wherein the shell comprises a first shell plate and a second shell plate which are oppositely covered and are in edge sealing connection, an evaporation cavity, a vapor channel, a condensation cavity, a liquid channel, a compensation cavity and an auxiliary fluid channel are formed between the first shell plate and the second shell plate, liquid-phase working media are stored in the compensation cavity, a first capillary structure which divides the evaporation cavity into a first vapor cavity and a second vapor cavity is arranged in the evaporation cavity, the second vapor cavity is positioned between the first vapor cavity and the compensation cavity, the second vapor cavity and the compensation cavity are separated through the first capillary structure, the first vapor cavity and the second vapor cavity are respectively communicated to the condensation cavity through the vapor channel and the auxiliary fluid channel, and the condensation cavity is communicated to the compensation cavity through the liquid channel. And all parts of the loop heat pipe are integrated between the two shell plates, so that the manufacturing process is simpler and more efficient. The second steam cavity and the auxiliary fluid channel are additionally arranged, so that the heat transfer temperature difference of the loop heat pipe can be reduced.

Description

Thin plate type loop heat pipe

Technical Field

The utility model relates to the technical field of heat dissipation devices, in particular to a thin plate type loop heat pipe.

Background

In recent years, many electronic devices have been developed to be ultra-thin and compact, and the amount of heat generated has been increasing. Conventional heat pipes are increasingly unable to meet the heat dissipation requirements of electronic devices.

Loop heat pipes are an advanced phase change heat transfer technology. The loop heat pipe comprises five basic components: evaporator (containing capillary wick), vapor line, condenser, liquid line and compensator. The five parts are connected in sequence to form a closed loop, and a working medium circularly flows in the closed loop. The working principle of the loop heat pipe is as follows: the evaporator contacts with a heat source, the liquid working medium is vaporized on the surface of the capillary core in the evaporator, the vaporized vapor working medium enters the condenser along the vapor pipeline, the vapor working medium is released and condensed into the liquid working medium in the condenser, then the liquid working medium flows to the compensator along the liquid pipeline to infiltrate the capillary core in the evaporator, and the liquid working medium is heated and then is vaporized to enter the next cycle. Compared with the traditional heat pipe, the loop heat pipe has larger heat transfer capacity, longer heat transfer distance and more flexible arrangement form.

However, the existing loop heat pipe has a large thickness, and the main components are usually arranged separately and connected by welding, which complicates the process. In addition, when the loop heat pipe works normally, the pressure and the temperature of the evaporator are both higher than those of the compensator, so that a heat load leaking from the evaporator to the compensator exists, which is called heat leakage. When the loop heat pipe is miniaturized, the heat leakage problem from the evaporator to the compensator is more prominent, and the heat transfer efficiency of the loop heat pipe is greatly reduced. Therefore, the existing loop heat pipe cannot meet the heat dissipation requirements of ultra-thin and compact electronic equipment with high heat flow density.

SUMMERY OF THE UTILITY MODEL

The technical problem to be solved by the utility model is to provide a thin plate type loop heat pipe with simple and efficient manufacturing process and small heat transfer temperature difference, so as to overcome the defects in the prior art.

In order to solve the technical problems, the utility model adopts the following technical scheme: the utility model provides a sheet metal type loop heat pipe, which comprises a housin, the casing includes relative lid and edge sealing connection's first coverboard and second coverboard, be formed with the evaporation chamber between first coverboard and the second coverboard, the steam body passageway, the condensation chamber, liquid channel, compensation chamber and auxiliary fluid passageway, liquid phase working medium has been stored to the compensation intracavity, the evaporation intracavity is equipped with the first capillary structure who separates into first steam chamber and second steam chamber with the evaporation chamber, second steam chamber is located between first steam chamber and the compensation chamber, keep apart through first capillary structure between second steam chamber and the compensation chamber, first steam chamber communicates to the condensation chamber through the steam body passageway, the condensation chamber communicates to the compensation chamber through liquid channel, auxiliary fluid passageway communicates second steam chamber and liquid channel.

Preferably, a flow channel is arranged in the condensation chamber.

Preferably, two ends of the auxiliary fluid channel are respectively connected with the second steam cavity and the liquid channel.

Preferably, both ends of the auxiliary fluid channel are respectively connected with the second steam cavity and the condensation cavity.

Preferably, a concave area is etched on the inner wall of the first shell plate and/or the second shell plate, and an evaporation cavity, a vapor channel, a condensation cavity, a liquid channel, a compensation cavity and an auxiliary fluid channel are formed between the first shell plate and the second shell plate at the concave area.

Preferably, the shell is annular, and the evaporation cavity, the vapor channel, the condensation cavity, the liquid channel and the compensation cavity are sequentially arranged along the circumferential direction of the shell to form a closed loop.

Preferably, the auxiliary fluid channel is located at one side of the vapor channel and shares a sealing edge of the housing with the vapor channel, or the auxiliary fluid channel is located at one side of the liquid channel and shares a sealing edge of the housing with the liquid channel.

Preferably, the secondary fluid passage has a sealing edge that is independent of the vapor and liquid passages.

Preferably, the first capillary structure and the shell are of a split structure, and the first capillary structure is one or more of a combination of a silk screen, a powder sintered material, a metal felt, a fiber bundle, a foam metal and a laminated perforated metal sheet.

Preferably, a concave structure is arranged at one end of the first capillary structure, which is close to the compensation cavity, and a second steam cavity is formed between the concave structure and the shell.

Preferably, the first capillary structure and the housing are of an integral structure, a plurality of first microchannels are etched on the inner wall of the first shell plate at the evaporation cavity, a plurality of second microchannels are etched on the inner wall of the second shell plate at the evaporation cavity, and the first microchannels and the second microchannels are arranged in a crossed manner to form the first capillary structure.

Preferably, a groove is further etched in the evaporation cavity on the inner wall of the second shell plate, the groove and the second micro channel are separated and independent from each other, one end of the first micro channel is crossed with the second micro channel, the other end of the first micro channel extends to be crossed with the groove, and the groove, the second shell plate, the first micro channel and the first shell plate form a second steam cavity together.

Preferably, a second capillary structure is arranged in the condensation cavity, and the second capillary structure extends to the evaporation cavity through one or more of the vapor channel, the liquid channel and the auxiliary fluid channel and is in contact with or connected with the first capillary structure.

Preferably, the second capillary structure is a third microchannel etched on the inner wall of the first shell plate and/or the second shell plate, or the second capillary structure is one or more of a wire mesh, a powder sintered material, a metal felt, a fiber bundle, a metal foam, and a laminated perforated metal sheet.

Preferably, a third capillary structure is provided in one or more of the condensation chamber, the vapor passage, the liquid passage and the auxiliary fluid passage.

Preferably, the third capillary structure is a fourth microchannel etched on the inner wall of the first shell plate and/or the second shell plate, or the third capillary structure is one or more of a combination of a wire mesh, a powder sintered material, a metal felt, a fiber bundle, a metal foam and a laminated perforated metal sheet.

Preferably, the shell is bent at any one or more positions except the evaporation cavity.

Compared with the prior art, the utility model has the remarkable progress that:

on one hand, the thin-plate loop heat pipe adopts the structure that two shell plates are oppositely covered and the edges are hermetically connected, and an evaporation cavity, a vapor channel, a condensation cavity, a liquid channel, a compensation cavity and an auxiliary fluid channel are formed between the two shell plates, so that all parts of the loop heat pipe are integrated between the two shell plates, the structure is greatly simplified, the overall thickness of the thin-plate loop heat pipe can be obviously reduced, and the manufacturing process is simpler and more efficient. On the other hand, compared with the existing loop heat pipe, the thin plate type loop heat pipe is additionally provided with the second steam cavity and the auxiliary fluid channel, so that heat leakage from the evaporation cavity to the compensation cavity is thermally isolated by the second steam cavity, namely, part of working medium caused by the heat leakage is vaporized in the second steam cavity, the vaporized working medium in the second steam cavity flows into the liquid channel through the auxiliary fluid channel and finally returns to the compensation cavity to complete circulation, the working medium in the second steam cavity is vaporized to absorb most of the heat leakage from the evaporation cavity to the compensation cavity, and the heat leakage into the compensation cavity can be remarkably reduced, so that the heat transfer temperature difference of the thin plate type loop heat pipe is effectively reduced, and the heat transfer performance of the thin plate type loop heat pipe is ensured. Therefore, the thin plate type loop heat pipe can well meet the heat dissipation requirement of ultra-thin and compact electronic equipment with high heat flow density.

Drawings

Fig. 1 is a schematic view of a split structure of a first embodiment of a thin plate-type loop heat pipe of the present invention.

Fig. 2 is a partially enlarged schematic view of fig. 1.

Fig. 3 is a schematic view of the use of the first embodiment of the thin plate-type loop heat pipe of the present invention.

Fig. 4 is a schematic structural view of a second embodiment of the thin plate-type loop heat pipe of the present invention.

Fig. 5 is a schematic view of a split structure of the first capillary structure in the third embodiment of the thin plate-type loop heat pipe of the present invention.

Fig. 6 is a schematic structural view of a fourth embodiment of the thin plate-type loop heat pipe of the present invention.

Fig. 7 is a schematic view showing the use of a fourth embodiment of the thin plate-type loop heat pipe of the present invention.

Fig. 8 is a schematic structural view of a fifth embodiment of the thin plate-type loop heat pipe of the present invention.

Fig. 9 is a schematic structural view of a sixth embodiment of the thin plate-type loop heat pipe of the present invention.

Wherein the reference numerals are as follows:

100 thin plate type loop heat pipe

1 casing

11 first shell plate

11a first microchannel

12 second shell plate

12a second microchannel

12b groove

12c channel

2 Evaporation chamber

21 first capillary structure

22 first steam chamber

23 second steam chamber

3 gas channel

4 condensation chamber

41 flow passage

42 second capillary structure

5 liquid channel

6 compensating chamber

7 auxiliary fluid channel

8 third capillary structure

200 electronic device

201 outer casing

202. 203, 204 heat source

Detailed Description

The following describes embodiments of the present invention in further detail with reference to the accompanying drawings. These embodiments are merely illustrative of the present invention and are not intended to limit the present invention.

In the description of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.

As shown in fig. 1 to 9, an embodiment of the thin plate type loop heat pipe of the present invention.

Referring to fig. 1, 2 and 9, the thin plate type loop heat pipe 100 of the present embodiment includes a housing 1, the housing 1 includes a first shell plate 11 and a second shell plate 12, the first shell plate 11 and the second shell plate 12 are covered relatively, and edges of the first shell plate 11 and the second shell plate 12 are hermetically connected to form a sealed edge of the housing 1, so that an inner sealed space of the housing 1 is formed between the first shell plate 11 and the second shell plate 12. An evaporation cavity 2, a vapor channel 3, a condensation cavity 4, a liquid channel 5, a compensation cavity 6 and an auxiliary fluid channel 7 are formed between the first shell plate 11 and the second shell plate 12. Be equipped with first capillary structure 21 in the evaporation chamber 2, first capillary structure 21 separates into first steam chamber 22 and second steam chamber 23 with evaporation chamber 2, and second steam chamber 23 is located between first steam chamber 22 and the compensation chamber 6, keeps apart through first capillary structure 21 between second steam chamber 23 and the compensation chamber 6, also keeps apart through first capillary structure 21 between second steam chamber 23 and the first steam chamber 22. The first capillary structure 21 is permeable to liquid phase working medium and prevents vapor phase working medium from circulating between the second vapor cavity 23 and the compensation cavity 6 and between the second vapor cavity 23 and the first vapor cavity 22. The first vapor chamber 22 is communicated to the condensation chamber 4 through the vapor passage 3, the condensation chamber 4 is communicated to the compensation chamber 6 through the liquid passage 5, and the auxiliary fluid passage 7 is communicated with the second vapor chamber 23 and the liquid passage 5. The liquid phase working medium is stored in the compensation cavity 6, and the liquid phase working medium in the compensation cavity 6 can infiltrate and infiltrate the first capillary structure 21 in the evaporation cavity 2.

Referring to fig. 3, the thin plate loop heat pipe 100 of the present embodiment may be accommodated in a housing 201 of an electronic device 200 when in use, the housing 201 of the electronic device 200 has a heat source 202 therein, and the evaporation cavity 2 of the thin plate loop heat pipe 100 is in contact with the heat source 202, and the operation principle thereof is as follows: the evaporation cavity 2 is contacted with the heat source 202 to absorb the heat of the heat source 202, the liquid phase working medium in the first steam cavity 22 is vaporized on the surface of the first capillary structure 21, the vaporized vapor phase working medium enters the condensation cavity 4 through the vapor channel 3, and after heat release and condensation of the condensation cavity 4, the vaporized vapor phase working medium returns to the compensation cavity 6 and the evaporation cavity 2 through the liquid channel 5, so that one cycle of circulation is completed; meanwhile, because the temperature and the pressure in the evaporation cavity 2 are higher than those of the working medium in the compensation cavity 6, the evaporation cavity 2 starts to conduct heat to the compensation cavity 6, when the heat is conducted to the second steam cavity 23, the liquid-phase working medium in the second steam cavity 23 is heated and vaporized, and most of the heat conducted from the evaporation cavity 2 to the compensation cavity 6 is absorbed, so that the heat leaked into the compensation cavity 6 is obviously reduced, the vaporized vapor-phase working medium in the second steam cavity 23 flows into the liquid channel 5 through the auxiliary fluid channel 7 and returns to the compensation cavity 6 and the evaporation cavity 2 through the liquid channel 5, and therefore another cycle is completed; two cycles are performed simultaneously in parallel.

On one hand, the thin-plate loop heat pipe 100 of the embodiment adopts a structure that two shell plates are oppositely covered and are connected in an edge sealing manner, and an evaporation cavity 2, a vapor channel 3, a condensation cavity 4, a liquid channel 5, a compensation cavity 6 and an auxiliary fluid channel 7 are formed between the two shell plates, so that each part of the loop heat pipe is integrated between the two shell plates, the structure is greatly simplified, the whole thickness of the thin-plate loop heat pipe 100 can be obviously reduced, and the manufacturing process is simpler and more efficient. On the other hand, compared with the existing loop heat pipe, the thin-plate loop heat pipe 100 of the present embodiment is additionally provided with the second vapor cavity 23 and the auxiliary fluid channel 7, so that the heat leakage from the evaporation cavity 2 to the compensation cavity 6 is thermally isolated by the second vapor cavity 23, that is, part of the working medium caused by the heat leakage is vaporized in the second vapor cavity 23, the vaporized gaseous working medium in the second vapor cavity 23 flows into the liquid channel 5 through the auxiliary fluid channel 7 and finally returns to the compensation cavity 6 to complete the circulation, the working medium in the second vapor cavity 23 vaporizes and absorbs most of the heat leakage from the evaporation cavity 2 to the compensation cavity 6, and the heat leakage into the compensation cavity 6 can be significantly reduced, thereby effectively reducing the heat transfer temperature difference of the thin-plate loop heat pipe 100 and ensuring the heat transfer performance of the thin-plate loop heat pipe 100. Therefore, the thin plate loop heat pipe 100 of the present embodiment can well meet the heat dissipation requirements of ultra-thin and compact electronic devices with high heat flux density.

In this embodiment, the manner of communicating the second vapor chamber 23 with the liquid passage 5 through the auxiliary fluid passage 7 is not limited.

Referring to fig. 1, 4, 6 and 8, in one embodiment, the two ends of the auxiliary fluid channel 7 are respectively connected with the second vapor cavity 23 and the condensation cavity 4, and the condensation cavity 4 is communicated with the liquid channel 5, thereby realizing that the auxiliary fluid channel 7 is communicated with the second vapor cavity 23 and the liquid channel 5. The vaporized vapor phase working medium in the second steam cavity 23 enters the condensation cavity 4 through the auxiliary fluid channel 7, and after heat release and condensation are carried out in the condensation cavity 4, the vapor phase working medium returns to the compensation cavity 6 through the liquid channel 5 along with the condensation working medium flowing through the vapor channel 3.

Referring to fig. 9, in another embodiment, the two ends of the auxiliary fluid channel 7 are connected to the second vapor chamber 23 and the liquid channel 5, respectively, i.e. the auxiliary fluid channel 7 is directly connected to the liquid channel 5. The vaporized vapor phase working medium in the second vapor cavity 23 directly enters the liquid channel 5 through the auxiliary fluid channel 7, and because the vapor phase working medium has less mass, the vapor phase working medium gradually releases heat and is condensed in the flowing process along the auxiliary fluid channel 7 and the liquid channel 5, and finally returns to the compensation cavity 6.

In this embodiment, it is preferable that a recessed area is etched on an inner wall of the first shell plate 11 and/or the second shell plate 12, and the evaporation cavity 2, the vapor channel 3, the condensation cavity 4, the liquid channel 5, the compensation cavity 6 and the auxiliary fluid channel 7 are formed between the first shell plate 11 and the second shell plate 12 at the recessed area. That is, a concave area may be etched on the inner wall of one of the first shell plate 11 and the second shell plate 12, the inner wall of the other is a flat surface, the concave area on one shell plate and the flat surface on the other shell plate are relatively covered to form an inner sealed space of the housing 1, and the evaporation cavity 2, the vapor channel 3, the condensation cavity 4, the liquid channel 5, the compensation cavity 6 and the auxiliary fluid channel 7 are formed in the sealed space; alternatively, recessed areas may be etched on both the inner wall of the first shell plate 11 and the inner wall of the second shell plate 12, the recessed areas on the two shell plates are covered with each other to form an inner sealed space of the housing 1, and the evaporation chamber 2, the vapor passage 3, the condensation chamber 4, the liquid passage 5, the compensation chamber 6 and the auxiliary fluid passage 7 are formed in the sealed space. Herein, the inner wall of the first shell plate 11 and the inner wall of the second shell plate 12 refer to the wall surfaces of the first shell plate 11 and the second shell plate 12 which are opposite to each other.

Referring to fig. 1, in the present embodiment, a flow passage 41 is preferably provided in the condensation chamber 4. The vaporized vapor phase working medium in the evaporation cavity 2 enters the condensation cavity 4 through the vapor channel 3 and the auxiliary fluid channel 7, flows along the flow channel 41 in the condensation cavity 4 and releases heat and condenses outwards. A plurality of flow passages 41 may be provided, and the plurality of flow passages 41 may be provided in parallel. The flow channel 41 may be formed by etching on the inner wall of the first shell plate 11 and/or the second shell plate 12 at the location of the condensation chamber 4. That is, the flow channel 41 may be etched in the inner wall of one of the first shell plate 11 and the second shell plate 12, or the flow channel 41 may be etched in both the inner wall of the first shell plate 11 and the inner wall of the second shell plate 12.

Referring to fig. 1, in the present embodiment, preferably, the casing 1 is annular, and the evaporation chamber 2, the vapor passage 3, the condensation chamber 4, the liquid passage 5 and the compensation chamber 6 are sequentially arranged along the circumference of the casing 1 to form a closed loop. Thus, the sealing edges of the housing 1 include an outer circumferential sealing edge and an inner circumferential sealing edge, and the evaporation chamber 2, the vapor passage 3, the condensation chamber 4, the liquid passage 5, and the compensation chamber 6 are formed between the outer circumferential sealing edge and the inner circumferential sealing edge of the housing 1.

The arrangement position of the auxiliary fluid passage 7 is not limited. For example, referring to fig. 1, 6 and 8, the secondary fluid passage 7 may be located at one side of the vapor passage 3 and share the sealing edge of the housing 1 with the vapor passage 3, i.e., the secondary fluid passage 7 may be disposed in parallel with the vapor passage 3 and formed between the outer and inner peripheral sealing edges of the housing 1. Alternatively, the auxiliary fluid channel 7 may be located at one side of the liquid channel 5 and share the sealing edge of the housing 1 with the liquid channel 5, i.e. the auxiliary fluid channel 7 may be juxtaposed with the liquid channel 5 and formed between the outer and inner peripheral sealing edges of the housing 1. Still alternatively, referring to fig. 4 and 9, the auxiliary fluid channel 7 may have a sealing edge independent from the vapor channel 3 and the liquid channel 5, so that a space can be formed between the auxiliary fluid channel 7 and the vapor channel 3, and between the auxiliary fluid channel 7 and the liquid channel 5. In practical applications, the arrangement form of the auxiliary fluid channel 7 may be selected and determined according to conditions such as the use condition and the installation position of the electronic device 200, so as to better adapt to different electronic devices 200 and use environments.

In the present embodiment, the shape and the structural form of the first capillary structure 21 are not limited.

Referring to fig. 2, in one embodiment, the first capillary structure 21 and the housing 1 may be a split structure, the first capillary structure 21 may be bonded to the inner wall of the first shell plate 11 or the inner wall of the second shell plate 12 by sintering or welding, and the first capillary structure 21 may be one or more of a mesh, a powder sintered material, a metal felt, a fiber bundle, a foamed metal, and a laminated perforated metal sheet. Preferably, a concave structure may be provided on an end of the first capillary structure 21 close to the compensation chamber 6, and a second vapor chamber 23 is formed between the concave structure and the housing 1.

Referring to fig. 5, in another embodiment, the first capillary structure 21 and the housing 1 may be an integral structure, a plurality of first microchannels 11a are etched on the inner wall of the first shell plate 11 at the evaporation cavity 2, a plurality of second microchannels 12a are etched on the inner wall of the second shell plate 12 at the evaporation cavity 2, and the first microchannels 11a and the second microchannels 12a are both channels which have extremely small widths and can permeate liquid-phase working medium and block vapor-phase working medium. The first microchannel 11a is arranged to intersect with the second microchannel 12a, and the first microchannel 11a and the second microchannel 12a intersect with each other to form a structure having an extremely small pore size and a capillary force, that is, a first capillary structure 21. Meanwhile, the first capillary structure 21 forms a first vapor chamber 22 with the first shell plate 11 and the second shell plate 12. Preferably, a channel 12c is formed on the inner wall of the second shell plate 12 at the evaporation cavity 2, the channel 12c is communicated with the second micro-channel 12a, a first steam cavity 22 is formed between the channel 12c and the first shell plate 11, and the vaporized vapor-phase working medium can escape along the channel 12c and be collected into the steam channel 3. Preferably, a groove 12b is further etched on the inner wall of the second shell plate 12 at the evaporation cavity 2, the groove 12b is separated from the second microchannel 12a, the groove 12b is separated from the channel 12c, one end of the first microchannel 11a is arranged to intersect with the second microchannel 12a, and the other end of the first microchannel 11a extends to be arranged to intersect with the groove 12b, the second shell plate 12, the first microchannel 11a, and the first shell plate 11 together form a second vapor cavity 23, since the groove 12b is separated from the second microchannel 12a, the groove 12b is separated from the channel 12c, and the first microchannel 11a intersecting with the groove 12b is a part of the first capillary structure 21, the first microchannel 11a itself has the property of permeating liquid phase working medium and blocking vapor phase working medium, the second vapor chamber 23 is thus separated from the first vapor chamber 22 by the first capillary structure 21. Thereby, the first capillary structure 21 is a part of the housing 1. Preferably, the width of the first microchannel 11a and the width of the second microchannel 12a are both less than 0.3 mm. The second microchannels 12a are preferably arranged at intervals to form channels, which facilitate the escape of the working medium after vaporization.

In the present embodiment, referring to fig. 1, preferably, a second capillary structure 42 may be disposed in the condensation chamber 4. The second capillary structure 42 may extend to the evaporation chamber 2 through one or more of the vapor passage 3, the liquid passage 5 and the auxiliary fluid passage 7 and contact or connect with the first capillary structure 21. Fig. 1 only shows the case where the second capillary structure 42 extends through the vapor channel 3 to the evaporation cavity 2 and is in contact with or connected to the first capillary structure 21. The second capillary structure 42 can guide the liquid-phase working medium in the condensation cavity 4 to the first capillary structure 21 in the evaporation cavity 2, so that the liquid-phase working medium infiltrates the first capillary structure 21, thereby avoiding the first capillary structure 21 from being in a dry state before the thin-plate loop heat pipe 100 of the embodiment is started, and ensuring that the thin-plate loop heat pipe 100 can be normally started.

In the present embodiment, the shape and the structural form of the second capillary structure 42 are not limited.

In an embodiment, the second capillary structure 42 and the housing 1 may be an integral structure, and the second capillary structure 42 is a third microchannel etched on an inner wall of the first shell plate 11 and/or the second shell plate 12, that is, the second capillary structure 42 may be formed by etching the third microchannel on an inner wall of one of the first shell plate 11 and the second shell plate 12, or the second capillary structure 42 may be formed by etching the third microchannel on both the inner wall of the first shell plate 11 and the inner wall of the second shell plate 12. Preferably, the width of the third microchannel is less than 0.3 mm. The second capillary structure 42 is thus part of the housing 1.

In another embodiment, the second capillary structure 42 and the housing 1 may be a split structure, the second capillary structure 42 may be bonded to the inner wall of the first shell plate 11 or the inner wall of the second shell plate 12 by sintering or welding, and the second capillary structure 42 may also be one or more of a combination of a wire mesh, a powder sintered material, a metal felt, a fiber bundle, a metal foam, and a laminated metal sheet.

In this embodiment, referring to fig. 6, it is preferable that a third capillary structure 8 is provided in one or more of the condensation chamber 4, the vapor passage 3, the liquid passage 5, and the auxiliary fluid passage 7. Only the third capillary structure 8 is shown in fig. 6 in the condensation chamber 4 and the liquid channel 5. Referring to fig. 7, a compact electronic device 200 such as a smart phone, a tablet computer, a notebook computer, a wearable electronic device, etc. generally has a plurality of heat sources 202, 203, 204 with distributed positions, when the thin plate type loop heat pipe 100 of this embodiment is adopted, the evaporation cavity 2 can contact the heat source 202 with the largest heat generation amount in the electronic device 200, and the third capillary structure 8 arranged in the condensation cavity 4, the vapor channel 3, the liquid channel 5 and the auxiliary fluid channel 7 can correspondingly contact other heat sources 203, 204 with relatively smaller heat generation amounts of the electronic device 200 according to the installation positions. The evaporation cavity 2 absorbs heat of a heat source 202, liquid phase working mediums in the first steam cavity 22 and the second steam cavity 23 are heated and vaporized, the vaporized vapor phase working mediums respectively flow along the steam channel 3 and the auxiliary fluid channel 7, heat is released outwards through the shell 1 and the shell 201 of the electronic device 200 in thermal contact with the shell in the flowing process, so that part of the vapor phase working mediums are condensed into a liquid phase, the part of the liquid phase working mediums are adsorbed by the third capillary structures 8 arranged in the steam channel 3 and the auxiliary fluid channel 7 in the flowing process of the steam channel 3 and the auxiliary fluid channel 7, the liquid phase working mediums can be vaporized again by absorbing heat of the heat source corresponding to the part of the liquid phase working mediums, flow forwards along a circulating loop, and the process of condensation-revaporization of the heat source with the outwards released heat is repeated until the liquid phase working mediums enter the condensation cavity 4; when the liquid-phase working medium condensed in the condensation cavity 4 flows in the condensation cavity 4 and the liquid channel 5, the liquid-phase working medium is adsorbed by the third capillary structure 8 arranged in the condensation cavity 4 and the liquid channel 5, and can be vaporized by absorbing heat of a heat source corresponding to the liquid-phase working medium, so that part of the liquid-phase working medium is in a vapor phase, and the vapor-phase working medium can be condensed again by releasing heat outwards through the shell 1 and the shell 201 of the electronic device 200 in thermal contact with the shell in the flowing process of the liquid channel 5, continuously flows forwards along the circulating loop, and repeats the vaporization-outward releasing heat recondensing process until entering the compensation cavity 6. Thus, the thin-plate loop heat pipe 100 of the present embodiment can simultaneously dissipate heat from a plurality of heat sources of the electronic device 200 in its circulation circuit, and has a very high heat dissipation capability.

It should be noted that, during operation, the heat source position and the heat dissipation position of the compact electronic device 200 are not limited to the positions of the heat sources 202, 203, and 204 shown in fig. 7, and in fact, due to the compact and miniaturized structures of the electronic device 200 and the thin plate-type loop heat pipe 100, the heat source and the heat dissipation of the electronic device 200 may exist at any position on the entire circulation loop of the thin plate-type loop heat pipe 100, and the heat dissipation position of the electronic device 200 may cover the entire thin plate-type loop heat pipe 100.

Therefore, it should be noted that, when the thin plate type loop heat pipe 100 of the present embodiment is used, the vapor phase working medium vaporized in the first vapor cavity 22 and the second vapor cavity 23 respectively enters the vapor channel 3 and the auxiliary fluid channel 7, the vapor phase working medium will release heat to the outside through the casing 1 and the casing 201 of the electronic device 200 in thermal contact with the casing in the process of flowing along the vapor channel 3 and the auxiliary fluid channel 7, so that a part of the vapor phase working medium is condensed into a liquid phase, and the part of the liquid phase working medium will directly flow into the condensation cavity 4 in the process of flowing along the vapor channel 3 and the auxiliary fluid channel 7 if not passing through the heat dissipation position of the electronic device 200; if the heat dissipation part of the electronic device 200 is accessed, the absorbed heat is vaporized again, and the heat continues to flow forward along the circulation loop, and the above-mentioned external heat release condensation-heat absorption re-vaporization process is repeated until the heat enters the condensation cavity 4. Therefore, the vapor passage 3 and the auxiliary fluid passage 7 actually have a condensing function. The liquid-phase working medium condensed in the condensation cavity 4 enters the liquid channel 5, and in the process that the liquid-phase working medium flows along the liquid channel 5, if the liquid-phase working medium does not pass through the heat dissipation part of the electronic equipment 200, the liquid-phase working medium directly flows into the compensation cavity 6; if the heat dissipation position of the electronic device 200 is accessed, the heat is absorbed and vaporized, so that part of the liquid-phase working medium is in a vapor phase, and the vapor-phase working medium is externally released and condensed by the shell 1 and the shell 201 of the electronic device 200 in thermal contact with the shell in the process of flowing along the liquid channel 5, and continuously flows forwards along the circulating loop, and the processes of heat absorption vaporization-externally released heat recondensing are repeated until the vapor-phase working medium enters the compensation cavity 6. Thus, the liquid channel 5 actually has a condensing function as well. Therefore, in the circulation loop of the thin plate loop heat pipe 100 of the present embodiment, the whole of the vapor channel 3, the auxiliary fluid channel 7, the condensation chamber 4 and the liquid channel 5 can be regarded as a condensation region, and the working medium flows in the region of the circulation loop except the evaporation chamber 2, and can present repeated cycles of condensation-vaporization-recondensation for multiple times, and finally flows into the compensator 6 as a liquid phase working medium.

In this embodiment, the shape and the structural form of the third capillary structure 8 are not limited.

In an embodiment, the third capillary structure 8 and the housing 1 may be an integral structure, and the third capillary structure 8 is a fourth microchannel etched on an inner wall of the first shell plate 11 and/or the second shell plate 12, that is, the third capillary structure 8 may be formed by etching the fourth microchannel on an inner wall of one of the first shell plate 11 and the second shell plate 12, or the third capillary structure 8 may be formed by etching the fourth microchannel on both the inner wall of the first shell plate 11 and the inner wall of the second shell plate 12. Preferably, the fourth microchannel has a width of less than 0.3 mm. Thereby, the third capillary structure 8 is part of the housing 1.

In another embodiment, the third capillary structure 8 and the housing 1 may be a split structure, the third capillary structure 8 may be bonded to the inner wall of the first shell plate 11 or the inner wall of the second shell plate 12 by sintering or welding, and the third capillary structure 8 may also be one or more of a combination of a wire mesh, a powder sintered material, a metal felt, a fiber bundle, a metal foam, and a laminated metal sheet with holes.

Referring to fig. 1, 4, 6 and 9, the case 1 of the thin plate-type loop heat pipe 100 of the present embodiment may be flat. Referring to fig. 8, the housing 1 of the thin plate loop heat pipe 100 of the present embodiment may be bent at one or more positions other than the evaporation chamber 2, and fig. 8 only shows the case where the housing is bent at the condensation chamber 4 and the liquid passage 5, respectively. Thus, the thin-plate loop heat pipe 100 of the present embodiment can match the compact spatial layout of the electronic apparatus 200, and flexible arrangement of the thin-plate loop heat pipe 100 of the present embodiment within the housing 201 of the electronic apparatus 200 according to the compact spatial layout of the electronic apparatus 200 is achieved.

The material of the case 1 of the thin plate loop heat pipe 100 of the present embodiment is not limited. For example, the first shell plate 11 and the second shell plate 12 may be made of metal sheets, such as copper sheets with excellent thermal conductivity, and the two can be bonded by diffusion welding. The housing 1 may be made of a non-metal material.

In the present embodiment, the first shell plate 11 and the second shell plate 12 are preferably thin plates, and the thickness of the thin plates may be 0.2mm to 3 mm. The thicknesses of the first shell plate 11 and the second shell plate 12 may be the same or different.

The working medium in the thin plate type loop heat pipe 100 of the present embodiment can be reasonably selected according to the working temperature requirement.

Six specific embodiments of the thin-plate loop heat pipe 100 of the present embodiment are provided below.

Referring to fig. 1 to 3, a first embodiment of a thin plate type loop heat pipe 100 of the present embodiment is shown. In the first embodiment, the first shell plate 11 and the second shell plate 12 are covered oppositely and connected with each other in a sealing way to form the annular shell 1, and the shell 1 is flat. The inner walls of the first shell plate 11 and/or the second shell plate 12 are etched with recessed areas, an evaporation cavity 2, a vapor channel 3, a condensation cavity 4, a liquid channel 5, a compensation cavity 6 and an auxiliary fluid channel 7 are formed between the first shell plate 11 and the second shell plate 12 at the recessed areas, and the evaporation cavity 2, the vapor channel 3, the condensation cavity 4, the liquid channel 5 and the compensation cavity 6 are sequentially arranged along the circumferential direction of the shell 1 and communicated with one another to form a closed loop. The evaporation cavity 2 is internally provided with a first capillary structure 21 which divides the evaporation cavity 2 into a first steam cavity 22 and a second steam cavity 23, the first capillary structure 21 and the shell 1 are of a split structure, one end of the first capillary structure 21, which is close to the compensation cavity 6, is provided with a concave structure, a second steam cavity 23 is formed between the concave structure and the shell 1, the second steam cavity 23 and the compensation cavity 6 are isolated through the first capillary structure 21, the second steam cavity 23 and the first steam cavity 22 are also isolated through the first capillary structure 21, the first steam cavity 22 is communicated to the condensation cavity 4 through a steam channel 3, the second steam cavity 23 is communicated to the condensation cavity 4 through an auxiliary fluid channel 7, and the auxiliary fluid channel 7 is positioned on one side of the steam channel 3 and shares the sealing edge of the shell 1 with the steam channel 3. A plurality of flow channels 41 are provided in the condensation chamber 4. The condensation chamber 4 is further provided with a second capillary structure 42, the second capillary structure 42 extends to the evaporation chamber 2 through one or more of the vapor passage 3, the liquid passage 5 and the auxiliary fluid passage 7 and is in contact with or connected with the first capillary structure 21, and only the second capillary structure 42 extends to the evaporation chamber 2 through the vapor passage 3 and is in contact with or connected with the first capillary structure 21 is shown in the figure. The second capillary structure 42 is an integral structure or a split structure with the housing 1. In use, the thin plate loop heat pipe 100 is housed in the case 201 of the electronic device 200, and is in contact with the heat source 202 of the electronic device 200 via the evaporation chamber 2.

Referring to fig. 4, a second embodiment of the thin plate-type loop heat pipe 100 of the present embodiment is shown. The second embodiment is substantially the same as the first embodiment, and the same points are not described again, except that in the second embodiment, the auxiliary fluid channel 7 has a sealing edge independent from the vapor channel 3 and the liquid channel 5, and a separation space is formed between the auxiliary fluid channel 7 and the vapor channel 3, and between the auxiliary fluid channel 7 and the liquid channel 5.

Referring to fig. 5, a third embodiment of the thin plate-type loop heat pipe 100 of the present embodiment is shown. The third embodiment is substantially the same as the first embodiment, and the same parts are not repeated, except that in the third embodiment, the first capillary structure 21 and the housing 1 are an integral structure, a plurality of first microchannels 11a are etched on the inner wall of the first shell plate 11 at the evaporation cavity 2, a plurality of second microchannels 12a are etched on the inner wall of the second shell plate 12 at the evaporation cavity 2, and the first microchannels 11a and the second microchannels 12a are arranged in a crossing manner to form the first capillary structure 21. Meanwhile, a first vapor cavity 22 is formed between the first capillary structure 21 and the first shell plate 11 and the second shell plate 12, a groove 12b is also etched at the first capillary structure 21, and a second vapor cavity 23 is formed between the groove 12b and the housing 1.

Referring to fig. 6 and 7, a fourth embodiment of the thin plate-type loop heat pipe 100 of the present embodiment is shown. The fourth embodiment is substantially the same as the first embodiment, and the description of the same parts is omitted, except that in the fourth embodiment, a third capillary structure 8 is provided in one or more of the condensation chamber 4, the vapor passage 3, the liquid passage 5, and the auxiliary fluid passage 7, and only the third capillary structure 8 is provided in the condensation chamber 4 and the liquid passage 5. When in use, the evaporation cavity 2 contacts a heat source 202 with the largest heat generation amount in the electronic device 200, and the third capillary structures 8 arranged in the condensation cavity 4, the vapor channel 3, the liquid channel 5 and the auxiliary fluid channel 7 correspondingly contact other heat sources 203 and 204 with relatively smaller heat generation amounts of the electronic device 200 according to installation positions. The third capillary structure 8 and the shell 1 are of an integrated structure or a split structure.

Referring to fig. 8, it is a fifth embodiment of the thin plate type loop heat pipe 100 of the present embodiment. The fifth embodiment is substantially the same as the first embodiment, and the same parts are not described again, except that in the fifth embodiment, the housing 1 may be bent at any one or more positions except the evaporation cavity 2, and only the bending at the condensation cavity 4 and the liquid channel 5 is shown in the figure.

Referring to fig. 9, a sixth embodiment of the thin plate-type loop heat pipe 100 of the present embodiment is shown. The sixth embodiment is substantially the same as the first embodiment, and the same points are not described again, except that in the sixth embodiment, the auxiliary fluid channel 7 has a sealing edge independent from the vapor channel 3 and the liquid channel 5, and a separation space is formed between the auxiliary fluid channel 7 and the vapor channel 3, and between the auxiliary fluid channel 7 and the liquid channel 5. And, the auxiliary fluid passage 7 is directly connected to the liquid passage 5.

The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and substitutions can be made without departing from the technical principle of the present invention, and these modifications and substitutions should also be regarded as the protection scope of the present invention.

Claims (17)

1. The thin-plate loop heat pipe is characterized by comprising a shell (1), wherein the shell (1) comprises a first shell plate (11) and a second shell plate (12) which are oppositely covered and are in edge sealing connection, an evaporation cavity (2), a gas channel (3), a condensation cavity (4), a liquid channel (5), a compensation cavity (6) and an auxiliary fluid channel (7) are formed between the first shell plate (11) and the second shell plate (12), liquid-phase working medium is stored in the compensation cavity (6), a first capillary structure (21) which divides the evaporation cavity (2) into a first steam cavity (22) and a second steam cavity (23) is arranged in the evaporation cavity (2), the second steam cavity (23) is positioned between the first steam cavity (22) and the compensation cavity (6), and the second steam cavity (23) is separated from the compensation cavity (6) through the first capillary structure (21), the first steam cavity (22) is communicated to the condensation cavity (4) through the steam channel (3), the condensation cavity (4) is communicated to the compensation cavity (6) through the liquid channel (5), and the auxiliary fluid channel (7) is communicated with the second steam cavity (23) and the liquid channel (5).

2. A thin plate type loop heat pipe as claimed in claim 1, wherein a flow channel (41) is provided in the condensation chamber (4).

3. A thin plate type loop heat pipe according to claim 1, wherein both ends of the auxiliary fluid channel (7) are connected to the second vapor chamber (23) and the liquid channel (5), respectively.

4. A thin plate type loop heat pipe as claimed in claim 1, wherein both ends of the auxiliary fluid channel (7) are connected to the second vapor chamber (23) and the condensation chamber (4), respectively.

5. A thin plate type loop heat pipe according to claim 1, wherein a recessed region is etched on an inner wall of the first shell plate (11) and/or the second shell plate (12), and the evaporation cavity (2), the vapor channel (3), the condensation cavity (4), the liquid channel (5), the compensation cavity (6) and the auxiliary fluid channel (7) are formed between the first shell plate (11) and the second shell plate (12) at the recessed region.

6. The thin-plate type loop heat pipe according to claim 1, wherein the case (1) has a ring shape, and the evaporation chamber (2), the vapor passage (3), the condensation chamber (4), the liquid passage (5), and the compensation chamber (6) are arranged in this order in a circumferential direction of the case (1) to constitute a closed loop.

7. A thin-plate type loop heat pipe according to claim 6, wherein the auxiliary fluid channel (7) is located on the side of the vapor channel (3) and shares the sealing edge of the case (1) with the vapor channel (3), or the auxiliary fluid channel (7) is located on the side of the liquid channel (5) and shares the sealing edge of the case (1) with the liquid channel (5).

8. A thin plate type loop heat pipe according to claim 6, wherein the auxiliary fluid channel (7) has a sealing edge independent from the vapor channel (3) and the liquid channel (5).

9. A thin-plate type loop heat pipe according to claim 1, wherein the first wick structure (21) is a split structure with the case (1), and the first wick structure (21) is one of a wire mesh, a powder sintered material, a metal felt, a fiber bundle, a metal foam, and a laminated perforated metal sheet.

10. A sheet-type loop heat pipe according to claim 9, characterized in that the end of the first wick structure (21) close to the compensation chamber (6) is provided with a concave structure, which forms the second vapor chamber (23) with the housing (1).

11. A thin plate type loop heat pipe according to claim 1, wherein the first capillary structure (21) is a unitary structure with the case (1), a plurality of first microchannels (11a) are etched on an inner wall of the first shell plate (11) at the evaporation cavity (2), a plurality of second microchannels (12a) are etched on an inner wall of the second shell plate (12) at the evaporation cavity (2), and the first microchannels (11a) and the second microchannels (12a) are arranged to intersect to form the first capillary structure (21).

12. A thin plate type loop heat pipe according to claim 11, wherein a groove (12b) is further etched on the inner wall of the second shell plate (12) at the evaporation cavity (2), the groove (12b) and the second micro channel (12a) are separated and independent from each other, one end of the first micro channel (11a) is arranged to intersect with the second micro channel (12a), and the other end of the first micro channel (11a) extends to be arranged to intersect with the groove (12b), and the groove (12b), the second shell plate (12), the first micro channel (11a), and the first shell plate (11) together form the second vapor cavity (23).

13. A thin-plate type loop heat pipe according to claim 1, wherein a second capillary structure (42) is provided in the condensation chamber (4), the second capillary structure (42) extending to the evaporation chamber (2) through one or more of the vapor channel (3), the liquid channel (5) and the auxiliary fluid channel (7) and being in contact with or connected to the first capillary structure (21).

14. A thin-plate type loop heat pipe according to claim 13, wherein the second capillary structure (42) is a third microchannel etched on an inner wall of the first shell plate (11) and/or the second shell plate (12), or the second capillary structure (42) is one of a mesh, a powder sintered material, a metal felt, a fiber bundle, a foamed metal, and a laminated perforated metal sheet.

15. A thin plate type loop heat pipe according to claim 1, wherein a third capillary structure (8) is provided in one or more of the condensation chamber (4), the vapor channel (3), the liquid channel (5) and the auxiliary fluid channel (7).

16. A thin-plate type loop heat pipe according to claim 15, wherein the third wick structure (8) is a fourth microchannel etched on the inner wall of the first shell plate (11) and/or the second shell plate (12), or the third wick structure (8) is one of a mesh, a powder sintered material, a metal felt, a fiber bundle, a foamed metal, and a laminated perforated metal sheet.

17. The thin plate type loop heat pipe as claimed in claim 1, wherein the case (1) is bent in a bent shape at any one or more positions except the evaporation chamber (2).

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