CN216245752U - Loop heat pipe and assembly for reducing heat transfer temperature difference of loop heat pipe - Google Patents

Abstract

The utility model relates to the technical field of heat dissipation devices, in particular to a component for reducing heat transfer temperature difference of a loop heat pipe and the loop heat pipe comprising the component. By additionally arranging the second steam cavity and the auxiliary pipeline, part of working medium is vaporized in the second steam cavity due to heat leakage from the evaporator to the compensator, the vaporized working medium enters the auxiliary pipeline and finally returns to the compensator through the liquid pipeline, circulation is completed, most of the heat leakage is absorbed by vaporization, the heat leakage into the compensator can be obviously reduced, and the heat transfer temperature difference of the loop heat pipe is reduced.

Description

Loop heat pipe and assembly for reducing heat transfer temperature difference of loop heat pipe

Technical Field

The utility model relates to the technical field of heat dissipation devices, in particular to a component for reducing heat transfer temperature difference of a loop heat pipe and the loop heat pipe comprising the component for reducing the heat transfer temperature difference of the loop heat pipe.

Background

Heat pipes have long been dominant in the field of electronic heat dissipation. However, in recent years, the performance of chips is higher and higher, the heat productivity is continuously multiplied, the performance of the existing heat pipe is limited, the increasing heat dissipation requirements of the chips cannot be met, and the development of the heat pipe cannot be matched with the chips.

The loop heat pipe is an advanced thermal control product developed to meet the complex and harsh thermal control requirements of the spacecraft. The loop heat pipe comprises five basic components: evaporator (containing capillary wick), vapor line, condenser, liquid line and compensator. The five parts are connected in sequence to form a closed loop, and a working medium circularly flows inside the closed loop. The working principle of the loop heat pipe is as follows: the evaporator contacts with a heat source, the liquid working medium is vaporized on the surface of the capillary core in the evaporator to generate the driving force of working medium circulation, the vaporized vapor working medium enters the condenser along the vapor pipeline, is released and condensed into the liquid working medium in the condenser, then flows to the compensator along the liquid pipeline to infiltrate the capillary core in the evaporator, and the liquid working medium is heated and then is vaporized to enter the next circulation.

The loop heat pipe has all the advantages of the heat pipe, and overcomes the inherent defects and shortcomings of the heat pipe. The heat pipe is provided with a sintered capillary core on the inner wall of the pipe, and the loop heat pipe is provided with a reinforced capillary core in the evaporator, so that the power is stronger. The loop heat pipe is provided with a vapor pipeline and a liquid pipeline which separate vapor working medium and liquid working medium channels, and the vapor pipeline and the liquid pipeline are both light pipes, and the flowing resistance of the working medium is smaller, so that the loop heat pipe has stronger heat transfer capacity than the heat pipe, and can reach more than 10 times of the heat pipe. The product is converted into a civil product and has great value.

However, since the loop heat pipe works normally, the pressure and temperature of the evaporator are higher than those of the compensator, so there is a heat load leaking from the evaporator to the compensator, which is called heat leakage. According to the working principle of the loop heat pipe, the heat leakage needs to be offset by increasing the supercooling degree of the liquid working medium which flows back from the condenser so as to maintain the heat balance of the compensator, and the larger the heat leakage is, the larger the supercooling degree of the liquid working medium which flows back is, so that the larger heat transfer temperature difference exists at the cold end and the hot end of the loop heat pipe, and the heat transfer performance of the loop heat pipe is influenced. Especially when the heat-dissipating device is applied to heat dissipation of civil devices such as chips, CPUs and the like, the heat leakage problem is more prominent because the heat source has large heat productivity and large heat flux density, and the heat transfer temperature difference of the loop heat pipe is larger, so that the heat-dissipating device cannot be applied practically.

Therefore, in order to make the loop heat pipe suitable for the civil field, reducing the heat transfer temperature difference of the loop heat pipe becomes a problem to be solved urgently.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a method and an assembly for reducing the temperature difference in heat transfer of a loop heat pipe, so as to overcome the above-mentioned drawbacks of the prior art.

In order to solve the technical problems, the utility model adopts the following technical scheme:

the utility model provides a method for reducing heat transfer temperature difference of a loop heat pipe, which is characterized in that a second steam cavity is arranged between a first steam cavity and a compensator of an evaporator, the first steam cavity and the second steam cavity and the compensator are isolated by capillary structures, the first steam cavity is communicated with a steam pipeline, and the second steam cavity is communicated with a liquid pipeline by an auxiliary pipeline.

Preferably, a working medium channel communicated with the liquid pipeline is additionally arranged in the condenser, and the auxiliary pipeline is communicated with the second steam cavity and the working medium channel.

Preferably, an auxiliary condenser is provided on the auxiliary line.

Preferably, the auxiliary line is passed through a condenser.

The utility model also provides a component for reducing the heat transfer temperature difference of the loop heat pipe, which comprises an evaporator and a compensator, wherein the evaporator comprises a shell and a capillary structure, a first steam cavity for communicating with a steam pipeline and a second steam cavity for communicating with an auxiliary pipeline are formed between the capillary structure and the shell, the auxiliary pipeline is used for communicating with a liquid pipeline, the second steam cavity is positioned between the first steam cavity and the compensator, and the first steam cavity and the second steam cavity and the compensator are isolated by the capillary structure.

Preferably, the capillary structure is a unitary structure.

Preferably, the capillary structure is a split structure, the capillary structure comprises a capillary core and a capillary tissue, the capillary core and the shell form a first steam cavity, the capillary tissue forms a second steam cavity, and the capillary core is in contact with or connected with the capillary tissue.

Preferably, the capillary structure is provided with a concave structure at the communication position of the evaporator and the auxiliary pipeline, and a second steam cavity is formed between the concave structure and the shell.

Preferably, the capillary structure is provided with a first channel and a plurality of second channels, the first channel is located at the position where the evaporator is communicated with the auxiliary pipeline, the plurality of second channels are distributed on the capillary structure and are communicated with the first channel, and a second steam cavity is formed between the first channel and the shell together with the plurality of second channels.

Preferably, the housing is provided with a convex structure at a position where the evaporator communicates with the auxiliary line, and a second vapor chamber is formed between the convex structure and the capillary structure.

Preferably, the wall surface of the shell at the position where the evaporator is communicated with the auxiliary pipeline is thinned to form a groove, and a second steam cavity is formed between the groove and the capillary structure.

Preferably, a porous structure is arranged in the second steam cavity.

The utility model further provides a loop heat pipe, which comprises the component for reducing the heat transfer temperature difference of the loop heat pipe.

Preferably, the steam generator further comprises a steam pipeline, a condenser, a liquid pipeline and an auxiliary pipeline, wherein the steam pipeline is communicated with the first steam cavity and the inlet of the condenser, the liquid pipeline is communicated with the compensator and the outlet of the condenser, and the auxiliary pipeline is communicated with the second steam cavity and the liquid pipeline.

Preferably, a working medium channel communicated with the liquid pipeline is arranged in the condenser, and the auxiliary pipeline is communicated with the second steam cavity and the working medium channel.

Preferably, an auxiliary condenser is provided on the auxiliary line.

Preferably, the auxiliary line passes through a condenser.

Compared with the prior art, the utility model has the remarkable progress that:

according to the utility model, the second steam cavity and the auxiliary pipeline are additionally arranged, so that heat leakage from the evaporator to the compensator is thermally isolated by the second steam cavity, namely, part of working medium caused by the heat leakage is vaporized in the second steam cavity, the vaporized gaseous working medium in the second steam cavity enters the auxiliary pipeline and finally returns to the compensator through the liquid pipeline to complete circulation, the working medium in the second steam cavity is vaporized to absorb most of the heat leakage from the evaporator to the compensator, the heat leakage into the compensator can be remarkably reduced, the heat transfer temperature difference of the loop heat pipe is effectively reduced, and the advantageous performance of the loop heat pipe can be brought into play in the civil field.

Drawings

FIG. 1 is a schematic cross-sectional view of a first embodiment of an assembly for reducing the temperature differential in a loop heat pipe according to the present invention.

FIG. 2 is a schematic cross-sectional view of a second embodiment of an assembly for reducing the temperature differential in the heat transfer of a loop heat pipe according to the present invention.

FIG. 3 is a schematic cross-sectional view of a third embodiment of an assembly for reducing the temperature differential in the heat transfer of a loop heat pipe according to the present invention.

FIG. 4 is a schematic diagram of a fourth embodiment of an assembly for reducing the temperature difference in the heat transfer of a loop heat pipe according to the present invention.

Fig. 5 is a schematic view of the internal structure of fig. 4.

FIG. 6 is a schematic diagram of a fifth embodiment of an assembly for reducing the temperature difference in the heat transfer of a loop heat pipe according to the present invention.

Fig. 7 is a schematic cross-sectional view of fig. 6.

FIG. 8 is a schematic diagram of a sixth embodiment of an assembly for reducing the temperature difference in the heat transfer of a loop heat pipe according to the present invention.

Fig. 9 is a schematic cross-sectional view of fig. 8.

Fig. 10 is a schematic structural diagram of a first embodiment of the loop heat pipe in the present invention.

Fig. 11 is a schematic structural diagram of a second embodiment of the loop heat pipe in the present invention.

Fig. 12 is a schematic structural diagram of a third embodiment of the loop heat pipe in the present invention.

Fig. 13 is a schematic structural diagram of a fourth embodiment of the loop heat pipe in the present invention.

Wherein the reference numerals are as follows:

1 evaporator

11 casing

12 capillary wick

13 first steam chamber

2 gas pipeline

3 condenser

31 working medium channel

4 liquid line

5 compensator

6 auxiliary line

7 second steam chamber

71 first channel

72 second channel

8 capillary tissue

9 auxiliary condenser

Detailed Description

The following describes an embodiment of the present invention in further detail with reference to fig. 1 to 13. These embodiments are merely illustrative of the present invention and are not intended to limit the present invention.

In the description of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.

The loop heat pipe comprises an evaporator 1, a vapor pipeline 2, a condenser 3, a liquid pipeline 4 and a compensator 5, wherein the evaporator 1 comprises a shell 11 and a capillary core 12, a first vapor cavity 13 communicated with the vapor pipeline 2 is formed between the capillary core 12 and the shell 11, the vapor pipeline 2 is communicated with the first vapor cavity 13 and an inlet of the condenser 3, the liquid pipeline 4 is communicated with an outlet of the compensator 5 and an outlet of the condenser 3, the compensator 5 is isolated from the first vapor cavity 13 of the evaporator 1 through the capillary core 12, and the capillary core 12 can permeate liquid-phase working medium and prevent the gas-phase working medium from flowing between the compensator 5 and the first vapor cavity 13. The working principle of the loop heat pipe is as follows: the evaporator 1 contacts a heat source, a liquid working medium is vaporized on the surface of the capillary core 12 in the evaporator 1 to generate a driving force for working medium circulation, the vaporized vapor working medium enters the vapor pipeline 2 from the first vapor cavity 13 and enters the condenser 3 along the vapor pipeline 2, heat is released in the condenser 3 and condensed into the liquid working medium, the liquid working medium enters the liquid pipeline 4 from the condenser 3 and flows to the compensator 5 along the liquid pipeline 4, then the liquid working medium permeates and soaks the capillary core 12 in the evaporator 1, and the liquid working medium is heated and then is evaporated to enter the next circulation.

The heat transfer temperature difference of the loop heat pipe is caused by the heat load (heat leakage) leaked from the evaporator 1 to the compensator 5, and the larger the heat leakage is, the larger the heat transfer temperature difference of the loop heat pipe is. The heat conduction through the shell 11 and the capillary wick 12 between the loop heat pipe evaporator 1 and the compensator 5 is an important source of heat leakage, so that the heat leakage into the compensator 5 can be reduced by reducing the heat conduction, the heat transfer temperature difference of the loop heat pipe is reduced, and the advantageous performance of the loop heat pipe can be played in the civil field. Based on the above, the utility model provides a method for reducing the heat transfer temperature difference of the loop heat pipe, which is realized by reducing the heat leaked into the compensator 5. The utility model also provides a component for reducing the heat transfer temperature difference of the loop heat pipe, and the component can realize the method for reducing the heat transfer temperature difference of the loop heat pipe. The utility model further provides a loop heat pipe, which comprises the component for reducing the heat transfer temperature difference of the loop heat pipe.

Example one

Referring to fig. 10-12, an embodiment provides an embodiment of the method of reducing the temperature difference of the loop heat pipe heat transfer according to the present invention.

The method for reducing the heat transfer temperature difference of the loop heat pipe in the first embodiment is that the second steam cavity 7 is arranged between the first steam cavity 13 of the evaporator 1 and the compensator 5, the first steam cavity 13 and the second steam cavity 7 and the compensator 5 are isolated through capillary structures, the capillary structures can permeate liquid-phase working media and prevent gas-phase working media from flowing between the first steam cavity 13 and the second steam cavity 7 and between the second steam cavity 7 and the compensator 5, the first steam cavity 13 is communicated with the steam pipeline 2, and the second steam cavity 7 is communicated with the liquid pipeline 4 through the auxiliary pipeline 6. Therefore, when the evaporator 1 is contacted with a heat source to absorb heat, the working medium in the first steam cavity 13 is vaporized, the vaporized steam working medium enters the condenser 3 through the steam pipeline 2, and after heat release and condensation, the vaporized steam working medium returns to the compensator 5 and the evaporator 1 through the liquid pipeline 4, so that one cycle of circulation is completed; meanwhile, because the temperature and the pressure in the evaporator 1 are higher than those of the working medium in the compensator 5, the evaporator 1 starts to conduct heat to the compensator 5, when the heat is conducted to the second steam cavity 7, the working medium in the second steam cavity 7 is heated and vaporized, and most of the heat conducted from the evaporator 1 to the compensator 5 is absorbed, so that the heat leaked into the compensator 5 is obviously reduced, the vaporized gaseous working medium in the second steam cavity 7 flows into the liquid pipeline 4 along the auxiliary pipeline 6, and returns to the compensator 5 along with the condensed working medium flowing through the steam pipeline 2 through the liquid pipeline 4, so that another cycle is completed; two cycles are performed simultaneously in parallel.

Therefore, in the method for reducing the heat transfer temperature difference of the loop heat pipe in the first embodiment, by additionally arranging the second steam cavity 7 and the auxiliary pipeline 6, the heat leakage from the evaporator 1 to the compensator 5 is thermally isolated by the second steam cavity 7, that is, part of the working medium caused by the heat leakage is vaporized in the second steam cavity 7, the vaporized gaseous working medium in the second steam cavity 7 enters the auxiliary pipeline 6 and finally returns to the compensator 5 through the liquid pipeline 4, so as to complete the circulation, the working medium in the second steam cavity 7 vaporizes and absorbs most of the heat leakage from the evaporator 1 to the compensator 5, and the heat leakage into the compensator 5 can be significantly reduced, thereby effectively reducing the heat transfer temperature difference of the loop heat pipe, and enabling the advantageous performance of the loop heat pipe to be exerted in the civil field.

In this embodiment one, the capillary structure may include a capillary wick 12 and a capillary tissue 8. A first steam cavity 13 is formed between the capillary core 12 and the shell 11, a second steam cavity 7 is formed between the capillary tissue 8 and the shell 11, the capillary tissue 8 isolates the first steam cavity 13 from the second steam cavity 7, the capillary tissue 8 isolates the second steam cavity 7 from the compensator 5, and the capillary tissue 8 can permeate liquid-phase working medium and prevent gas-phase working medium from flowing between the first steam cavity 13 and the second steam cavity 7 and between the second steam cavity 7 and the compensator 5. The capillary wick 12 and the capillary tissue 8 can be an integrated structure, that is, the capillary tissue 8 is a part of the capillary wick 12, and the capillary structure formed thereby is an integrated structure. The capillary wick 12 and the capillary tissue 8 can also be in a split structure which is in contact or connected, and the capillary structure formed by the structure is in a split structure.

In this first embodiment, it is preferable that the second steam chamber 7 is partially or completely filled with a porous structure (not shown) for supporting.

In the first embodiment, the communication mode between the auxiliary line 6 and the liquid line 4 is not limited, and any one of the following three modes may be preferably used.

Referring to fig. 10, in a first preferred communication manner between the auxiliary line 6 and the liquid line 4, a working medium channel 31 for communicating the liquid line 4 may be additionally disposed inside the condenser 3, two ends of the auxiliary line 6 are respectively communicated with the second steam chamber 7 and the working medium channel 31, and are communicated with the liquid line 4 through the working medium channel 31 and an outlet of the condenser 3, so as to realize that the auxiliary line 6 is communicated with the second steam chamber 7 and the liquid line 4. Therefore, the vaporized working medium in the second steam cavity 7 enters the auxiliary pipeline 6, flows into the condenser 3 through the auxiliary pipeline 6 and the working medium channel 31, releases heat in the condenser 3, is condensed, and returns to the compensator 5 through the liquid pipeline 4 along with the condensed working medium flowing through the steam pipeline 2.

Referring to fig. 11, in a second preferred mode of communication between the auxiliary line 6 and the liquid line 4, an auxiliary condenser 9 may be disposed on the auxiliary line 6, and both ends of the auxiliary line 6 communicate with the second vapor chamber 7 and the liquid line 4, respectively. Therefore, the vaporized working medium in the second vapor cavity 7 enters the auxiliary pipeline 6, flows through the auxiliary condenser 9 through the auxiliary pipeline 6, is condensed, enters the liquid pipeline 4, and finally returns to the compensator 5.

Referring to fig. 12, in a third preferred mode of communicating the auxiliary line 6 with the liquid line 4, the auxiliary line 6 may pass through the condenser 3, both ends of the auxiliary line 6 communicate with the second vapor chamber 7 and the liquid line 4, respectively, and a part of the auxiliary line 6 is located at the condenser 3 side. Therefore, the vaporized working medium in the second steam cavity 7 flows in the auxiliary pipeline 6 after entering the auxiliary pipeline 6 and flows through the condenser 3, can be condensed by using the cold energy of the condenser 3, then enters the liquid pipeline 4 and finally returns to the compensator 5.

The method for reducing the heat transfer temperature difference of the loop heat pipe breaks through the principle limitation of the loop heat pipe for spaceflight, the heat leakage is reduced without depending on the limitation of materials and working media, the method can adopt more favorable materials, working media and matched processes to adapt to the heat dissipation requirements of civil high power and high heat flow density, and compared with the prior art that the heat transfer temperature difference is generally higher than 35 ℃ when the same working media and similar capillary structures are adopted in the loop heat pipe technology, the method for reducing the heat transfer temperature difference of the loop heat pipe can reduce the heat transfer temperature difference of the loop heat pipe to be lower than 5-10 ℃, so that the improved performance of the loop heat pipe can meet the heat dissipation requirements of civil chips and power electronic devices.

Example two

Referring to fig. 1 to 9, the second embodiment provides an embodiment of the assembly for reducing the temperature difference of the loop heat pipe in heat transfer according to the present invention. The assembly for reducing the heat transfer temperature difference of the loop heat pipe in the second embodiment can realize the method for reducing the heat transfer temperature difference of the loop heat pipe in the first embodiment.

The second component for reducing the heat transfer temperature difference of the loop heat pipe comprises an evaporator 1 and a compensator 5, wherein the evaporator 1 comprises a shell 11 and a capillary structure, a first steam cavity 13 used for being communicated with a steam pipeline 2 and a second steam cavity 7 used for being communicated with an auxiliary pipeline 6 are formed between the capillary structure and the shell 11, the auxiliary pipeline 6 is used for being communicated with a liquid pipeline 4, the liquid pipeline 4 is communicated with the compensator 5, the second steam cavity 7 is located between the first steam cavity 13 and the compensator 5, the first steam cavity 13 and the second steam cavity 7 are isolated from each other through the capillary structure, and the second steam cavity 7 and the compensator 5 are isolated from each other through the capillary structure. The capillary structure can permeate liquid phase working medium and prevent gas phase working medium from circulating between the first steam cavity 13 and the second steam cavity 7 and between the second steam cavity 7 and the compensator 5.

In the second embodiment of the assembly for reducing the heat transfer temperature difference of the loop heat pipe, by additionally arranging the second steam cavity 7 and the auxiliary pipeline 6, heat leakage from the evaporator 1 to the compensator 5 is thermally isolated by the second steam cavity 7, when the evaporator 1 transfers heat to the compensator 5 and conducts heat to the second steam cavity 7, the working medium in the second steam cavity 7 is heated and vaporized, the vaporized gaseous working medium in the second steam cavity 7 enters the auxiliary pipeline 6, and finally returns to the compensator 5 through the liquid pipeline 4, so that circulation is completed. Working medium in the second steam cavity 7 is vaporized to absorb most of heat leakage from the evaporator 1 to the compensator 5, and heat leakage into the compensator 5 can be obviously reduced, so that the heat transfer temperature difference of the loop heat pipe is effectively reduced, and the advantage performance of the loop heat pipe can be brought into play in the civil field.

In the second embodiment, the capillary structure may include a capillary wick 12 and a capillary tissue 8. The capillary core 12 and the shell 11 form a first steam cavity 13, the capillary tissue 8 and the shell 11 form a second steam cavity 7, the capillary tissue 8 separates the first steam cavity 13 from the second steam cavity 7, and the capillary tissue 8 separates the second steam cavity 7 from the compensator 5, so that the capillary tissue is close to the compensator 5. The capillary tissue 8 can permeate liquid phase working medium and prevent gas phase working medium from circulating between the first steam cavity 13 and the second steam cavity 7 and between the second steam cavity 7 and the compensator 5.

Referring to fig. 1, fig. 3, fig. 7 and fig. 9, the capillary wick 12 and the capillary tissue 8 may be a unitary structure, that is, the capillary tissue 8 is a part of the capillary wick 12, and thus the capillary structure is a unitary structure.

Referring to fig. 2, the capillary wick 12 and the capillary tissue 8 can also be a split structure that is in contact or connected, and the capillary structure formed by the split structure is a split structure.

In the second embodiment, it is preferable that a part or the whole of the second steam chamber 7 may be filled with a porous structure (not shown in the figure) to play a supporting role.

In the second embodiment, referring to fig. 1, 2, 3, 6 to 9, the evaporator 1 may have a cylindrical structure; referring to fig. 4 and 5, the evaporator 1 may also be of a flat plate-shaped structure.

In the second embodiment, the formation method of the second steam chamber 7 is not limited, and any one of the following four methods may be preferably used.

Referring to fig. 1, 2 and 5, in a first preferred form of forming the second vapor chamber 7, the capillary structure is provided with a concave structure at the location of the communication between the evaporator 1 and the auxiliary line 6, the concave structure being provided on the capillary structure 8 adjacent to the compensator 5, the concave structure forming the second vapor chamber 7 with the housing 11.

Referring to fig. 3, in a second preferred form of forming the second vapor chamber 7, the housing 11 is provided with a convex structure at the location of the communication of the evaporator 1 with the auxiliary line 6, which convex structure forms the second vapor chamber 7 with the capillary structure 8 adjacent to the compensator 5.

Referring to fig. 6, 7 and 9, in a third preferred form of forming the second vapor chamber 7, a first channel 71 and a plurality of second channels 72 are provided on the capillary structure, the first channel 71 is located at a position where the evaporator 1 communicates with the auxiliary line 6, the plurality of second channels 72 are distributed on the capillary structure and are all communicated with the first channel 71, and the first channel 71 and the plurality of second channels 72 jointly form the second vapor chamber 7 with the housing 11.

In a fourth preferred form of forming the second vapor chamber 7, the wall of the housing 11 at the location of the connection of the evaporator 1 to the auxiliary line 6 is thinned to form a recess, which forms the second vapor chamber 7 with the capillary structure 8 adjacent to the compensator 5.

Six specific embodiments of the assembly for reducing the temperature difference of the loop heat pipe in the second embodiment are provided below.

Referring to fig. 1, it is a first embodiment of the assembly for reducing the temperature difference of the loop heat pipe in the second embodiment. In the first embodiment of the assembly, the evaporator 1 is a cylindrical structure, the evaporator 1 comprises a shell 11 and a capillary structure, the capillary structure comprises a capillary wick 12 and a capillary tissue 8, a first vapor cavity 13 is formed between the capillary wick 12 and the shell 11, the first vapor cavity 13 is communicated with the vapor line 2, a second vapor cavity 7 is formed between the capillary tissue 8 and the shell 11, the second vapor cavity 7 is communicated with the auxiliary line 6, and the auxiliary line 6 is used for being communicated with the liquid line 4. The capillary tissue 8 separates the first vapor cavity 13 from the second vapor cavity 7, the capillary tissue 8 separates the second vapor cavity 7 from the compensator 5, and the capillary tissue 8 is a part of the capillary core 12, so that the formed capillary structure is a one-piece structure. The capillary structure 8 close to the compensator 5 is provided with a concave structure at the communication position of the evaporator 1 and the auxiliary pipeline 6, the concave structure forms an annular groove around the capillary structure 8, and a second steam cavity 7 is formed between the annular groove and the shell 11. The second steam chamber 7 may be partially or completely filled with a porous structure (not shown) for supporting.

Referring to fig. 2, a second embodiment of the assembly for reducing the temperature difference of the loop heat pipe in the second embodiment is shown. The second embodiment of the assembly is substantially the same as the first embodiment of the assembly, and the same parts are not repeated, except that in the second embodiment of the assembly, the capillary wick 12 and the capillary tissue 8 are in a split structure which is in contact or connected, and the capillary structure formed by the split structure is a split structure.

Referring to fig. 3, a third embodiment of the assembly for reducing the temperature difference of the loop heat pipe in the second embodiment is shown. The third embodiment of the assembly is substantially identical to the first embodiment of the assembly described above and will not be described again in detail, with the difference that in the third embodiment of the assembly, the housing 11 is provided, at the location of the communication between the evaporator 1 and the auxiliary line 6, with a convex structure forming, around the circumference of the housing 11, an annular groove in the housing 11, which forms the second vapor chamber 7 with the capillary structure 8 adjacent to the compensator 5.

Referring to fig. 4 and 5, a fourth embodiment of the assembly for reducing the temperature difference of the loop heat pipe in the second embodiment is shown. The fourth embodiment of the assembly is substantially the same as the first embodiment of the assembly, and the description thereof is omitted, except that in the fourth embodiment of the assembly, the evaporator 1 is a flat plate-shaped structure, the capillary structure is provided with a concave structure at a position where the evaporator 1 is communicated with the auxiliary pipeline 6, the concave structure extends along the length direction of the capillary structure 8 to form a straight groove, the length direction of the capillary structure 8 is defined as a direction perpendicular to a direction in which the evaporator 1 conducts heat to the compensator 5, and a second vapor cavity 7 is formed between the straight groove and the housing 11. In a fourth embodiment of the assembly, the capillary tissue 8 may be a part of the capillary wick 12, and the capillary structure formed thereby is an integral structure, or the capillary wick 12 and the capillary tissue 8 may be a split structure that are in contact or connected, and the capillary structure formed thereby is a split structure.

Referring to fig. 6 and 7, a fifth embodiment of the assembly for reducing the temperature difference of the loop heat pipe in the second embodiment is shown. The fifth embodiment of the assembly is substantially the same as the first embodiment of the assembly, and the same parts are not repeated, except that in the fifth embodiment of the assembly, the capillary structure 8 close to the compensator 5 is provided with a first channel 71 and a plurality of second channels 72, the first channel 71 is located at the position where the evaporator 1 communicates with the auxiliary line 6, the plurality of second channels 72 are distributed on the capillary structure and are communicated with the first channel 71, each second channel 72 extends along the circumferential direction of the outer peripheral surface of the capillary structure 8 to form an annular channel, the plurality of second channels 72 are distributed on the outer peripheral surface of the capillary structure 8 at intervals along the axial direction of the capillary structure 8, the first channels 71 extend along the axial direction of the capillary structure 8 on the outer peripheral surface of the capillary structure 8 to communicate with all the second channels 72, the first channels 71 and the plurality of second channels 72 together form a second vapor chamber 7 with the housing 11, the auxiliary line 6 communicates with the first channel 71.

Referring to fig. 8 and 9, a sixth embodiment of the assembly for reducing the temperature difference of the loop heat pipe in the second embodiment is shown. The sixth embodiment of the assembly is substantially the same as the first embodiment of the assembly, and the description thereof is omitted, except that in the sixth embodiment of the assembly, the capillary structure 8 close to the compensator 5 is provided with a first channel 71 and a plurality of second channels 72, the first channel 71 is located at the position where the evaporator 1 communicates with the auxiliary line 6, the plurality of second channels 72 are distributed on the capillary structure and are communicated with the first channel 71, each of the second channels 72 is an axial slot which is opened in the capillary structure 8 and extends along the axial direction of the capillary structure 8, the plurality of second channels 72 are distributed at intervals in the circumferential direction of the capillary structure 8 in the capillary structure 8, the first channel 71 extends along the circumferential direction of the capillary structure 8 on the outer circumferential surface of the capillary structure 8 to form an annular channel and communicates with all the second channels 72, the first channel 71 and the plurality of second channels 72 together form the second vapor cavity 7 with the housing 11, the auxiliary line 6 communicates with the first channel 71.

The assembly for reducing the heat transfer temperature difference of the loop heat pipe breaks through the principle limitation of the loop heat pipe for spaceflight, reduces heat leakage without depending on the limitation of materials and working media, can adopt more favorable materials, working media and matching process to adapt to the heat dissipation requirements of civil high power and high heat flow density, and compared with the prior art that the heat transfer temperature difference is generally higher than 35 ℃ when the same working media and similar capillary structures are adopted in the loop heat pipe technology, the assembly for reducing the heat transfer temperature difference of the loop heat pipe in the second embodiment can reduce the heat transfer temperature difference of the loop heat pipe to be lower than 5-10 ℃, so that the improved performance of the loop heat pipe can meet the heat dissipation requirements of civil chips and power electronic devices.

EXAMPLE III

Referring to fig. 10 to 13, the third embodiment provides an embodiment of the loop heat pipe according to the present invention based on the second embodiment of the assembly for reducing the temperature difference of the loop heat pipe in heat transfer. The loop heat pipe of the third embodiment comprises the component for reducing the heat transfer temperature difference of the loop heat pipe of the second embodiment.

Further, the loop heat pipe of the third embodiment further includes a vapor line 2, a condenser 3, a liquid line 4 and an auxiliary line 6, the vapor line 2 communicates the first vapor chamber 13 with the inlet of the condenser 3, the liquid line 4 communicates the compensator 5 with the outlet of the condenser 3, and the auxiliary line 6 communicates the second vapor chamber 7 with the liquid line 4.

The working principle of the loop heat pipe in the third embodiment is as follows: when the evaporator 1 is contacted with a heat source to absorb heat, the working medium in the first steam cavity 13 is vaporized, the vaporized vaporous working medium enters the condenser 3 through the steam pipeline 2, and returns to the compensator 5 and the evaporator 1 through the liquid pipeline 4 after heat release and condensation, so that one cycle of circulation is completed; meanwhile, because the temperature and the pressure in the evaporator 1 are higher than those of the working medium in the compensator 5, the evaporator 1 starts to conduct heat to the compensator 5, when the heat is conducted to the second steam cavity 7, the working medium in the second steam cavity 7 is heated and vaporized, and most of the heat conducted from the evaporator 1 to the compensator 5 is absorbed, so that the heat leaked into the compensator 5 is obviously reduced, the vaporized gaseous working medium in the second steam cavity 7 flows into the liquid pipeline 4 along the auxiliary pipeline 6, and returns to the compensator 5 along with the condensed working medium flowing through the steam pipeline 2 through the liquid pipeline 4, so that another cycle is completed; two cycles are performed simultaneously in parallel.

Therefore, in the loop heat pipe of the third embodiment, by additionally providing the second vapor cavity 7 and the auxiliary pipeline 6, heat leakage from the evaporator 1 to the compensator 5 is thermally isolated by the second vapor cavity 7, that is, part of the working medium caused by the heat leakage is vaporized in the second vapor cavity 7, the vaporized working medium in the second vapor cavity 7 enters the auxiliary pipeline 6 and finally returns to the compensator 5 through the liquid pipeline 4, so as to complete circulation, the working medium in the second vapor cavity 7 vaporizes and absorbs most of the heat leakage from the evaporator 1 to the compensator 5, so that the heat leakage into the compensator 5 can be significantly reduced, thereby effectively reducing the heat transfer temperature difference of the loop heat pipe, and enabling the advantageous performance of the loop heat pipe to be exerted in the civil field.

In the loop heat pipe of the third embodiment, the communication mode between the auxiliary line 6 and the liquid line 4 is not limited, and any one of the following three modes may be preferably used.

Referring to fig. 10, in a first preferred communication manner between the auxiliary line 6 and the liquid line 4, a working medium channel 31 for communicating the liquid line 4 may be additionally disposed inside the condenser 3, two ends of the auxiliary line 6 are respectively communicated with the second steam chamber 7 and the working medium channel 31, and are communicated with the liquid line 4 through the working medium channel 31 and an outlet of the condenser 3, so as to realize that the auxiliary line 6 is communicated with the second steam chamber 7 and the liquid line 4. Therefore, the vaporized working medium in the second steam cavity 7 enters the auxiliary pipeline 6, flows into the condenser 3 through the auxiliary pipeline 6 and the working medium channel 31, releases heat in the condenser 3, is condensed, and returns to the compensator 5 through the liquid pipeline 4 along with the condensed working medium flowing through the steam pipeline 2.

Referring to fig. 11, in a second preferred mode of communication between the auxiliary line 6 and the liquid line 4, an auxiliary condenser 9 may be disposed on the auxiliary line 6, and both ends of the auxiliary line 6 communicate with the second vapor chamber 7 and the liquid line 4, respectively. Therefore, the vaporized working medium in the second vapor cavity 7 enters the auxiliary pipeline 6, flows through the auxiliary condenser 9 through the auxiliary pipeline 6, is condensed, enters the liquid pipeline 4, and finally returns to the compensator 5.

Referring to fig. 12 and 13, in a third preferred mode of communicating the auxiliary line 6 with the liquid line 4, the auxiliary line 6 may pass through the condenser 3, both ends of the auxiliary line 6 communicate with the second vapor chamber 7 and the liquid line 4, respectively, and a part of the auxiliary line 6 is located at the condenser 3 side. Therefore, the vaporized working medium in the second steam cavity 7 flows in the auxiliary pipeline 6 after entering the auxiliary pipeline 6 and flows through the condenser 3, can be condensed by using the cold energy of the condenser 3, then enters the liquid pipeline 4 and finally returns to the compensator 5.

Four specific implementations of the loop heat pipe of the third embodiment are provided below.

Referring to fig. 10, a first embodiment of the loop heat pipe of the third embodiment is shown. In the first embodiment of the loop heat pipe, the structure of the first embodiment of the assembly for reducing the heat transfer temperature difference of the loop heat pipe in the second embodiment is adopted, the vapor pipeline 2 is communicated with the inlet of the first vapor cavity 13 and the inlet of the condenser 3, the liquid pipeline 4 is communicated with the outlet of the compensator 5 and the outlet of the condenser 3, the auxiliary pipeline 6 is communicated with the second vapor cavity 7 and the liquid pipeline 4, the auxiliary pipeline 6 and the liquid pipeline 4 are communicated in a manner that the working medium channel 31 communicated with the liquid pipeline 4 is arranged in the condenser 3, and the auxiliary pipeline 6 is communicated with the second vapor cavity 7 and the working medium channel 31. Of course, the structure of any other embodiment of the component for reducing the heat transfer temperature difference of the loop heat pipe in the second embodiment can also be adopted in the first embodiment of the loop heat pipe.

Referring to fig. 11, a second embodiment of the loop heat pipe of the third embodiment is shown. The second embodiment of the loop heat pipe is substantially the same as the first embodiment of the loop heat pipe, and the same parts are not described again, except that in the second embodiment of the loop heat pipe, an auxiliary condenser 9 is disposed on the auxiliary pipeline 6 in a manner that the auxiliary pipeline 6 is communicated with the liquid pipeline 4.

Referring to fig. 12, a third embodiment of the loop heat pipe of the third embodiment is shown. The third embodiment of the loop heat pipe is substantially the same as the first embodiment of the loop heat pipe, and the same parts are not described again, except that in the third embodiment of the loop heat pipe, the auxiliary pipeline 6 is communicated with the liquid pipeline 4 by the auxiliary pipeline 6 passing through the condenser 3.

Referring to fig. 13, a fourth embodiment of the loop heat pipe of the third embodiment is shown. The fourth embodiment of the loop heat pipe is basically the same as the third embodiment of the loop heat pipe, and the details of the same parts are omitted, except that the fourth embodiment of the loop heat pipe adopts the structure of the fourth embodiment of the component for reducing the heat transfer temperature difference of the loop heat pipe in the second embodiment.

The third loop heat pipe of the embodiment breaks through the principle limitation of the loop heat pipe for spaceflight, reduces heat leakage without depending on the limitation of materials and working media, can adopt more favorable materials, working media and matching processes to adapt to the heat dissipation requirements of civil high power and high heat flux density, and compared with the prior loop heat pipe technology that the heat transfer temperature difference is generally higher than 35 ℃ when the same working media and similar capillary structures are adopted, the heat transfer temperature difference of the third loop heat pipe of the embodiment can be reduced to be lower than 5-10 ℃, therefore, the improved performance of the loop heat pipe can meet the heat dissipation requirements of civil chips and power electronic devices.

The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and substitutions can be made without departing from the technical principle of the present invention, and these modifications and substitutions should also be regarded as the protection scope of the present invention.

Claims (13)

1. The component for reducing the heat transfer temperature difference of the loop heat pipe is characterized by comprising an evaporator (1) and a compensator (5), wherein the evaporator (1) comprises a shell (11) and a capillary structure, a first steam cavity (13) used for being communicated with a steam pipeline (2) and a second steam cavity (7) used for being communicated with an auxiliary pipeline (6) are formed between the capillary structure and the shell (11), the auxiliary pipeline (6) is used for being communicated with a liquid pipeline (4), the second steam cavity (7) is located between the first steam cavity (13) and the compensator (5), and the first steam cavity (13) and the second steam cavity (7) and the compensator (5) are isolated through the capillary structure.

2. An assembly for reducing the temperature differential in a heat transfer of a loop heat pipe as recited in claim 1 wherein said capillary structure is a unitary structure.

3. The assembly for reducing the temperature difference of heat transfer of a loop heat pipe according to claim 1, wherein the capillary structure is a split structure and comprises a capillary core (12) forming the first vapor cavity (13) with the shell (11) and a capillary tissue (8) forming the second vapor cavity (7) with the shell (11), and the capillary core (12) is in contact with or connected with the capillary tissue (8).

4. An assembly for reducing the temperature difference of heat transfer of a loop heat pipe according to claim 1, characterized in that the capillary structure is provided with a concave structure at the communication position of the evaporator (1) and the auxiliary line (6), and the concave structure and the shell (11) form the second vapor cavity (7) therebetween.

5. An assembly for reducing the temperature difference of heat transfer of a loop heat pipe according to claim 1, wherein the capillary structure is provided with a first channel (71) and a plurality of second channels (72), the first channel (71) is located at a position where the evaporator (1) communicates with the auxiliary line (6), the plurality of second channels (72) are distributed on the capillary structure and are communicated with the first channel (71), and the first channel (71) and the plurality of second channels (72) jointly form the second steam cavity (7) with the casing (11).

6. An assembly for reducing the temperature difference of a loop heat pipe in heat transfer according to claim 1, characterized in that the housing (11) is provided with a convex structure at the communication position of the evaporator (1) and the auxiliary line (6), and the convex structure and the capillary structure form the second vapor cavity (7) therebetween.

7. A loop heat pipe heat transfer temperature difference reducing assembly according to claim 1, wherein the wall surface of the casing (11) at the communication position of the evaporator (1) and the auxiliary pipeline (6) is thinned to form a groove, and the second vapor cavity (7) is formed between the groove and the capillary structure.

8. An assembly for reducing the temperature difference of heat transfer of a loop heat pipe according to claim 1, wherein a porous structure is arranged in the second steam cavity (7).

9. A loop heat pipe comprising an assembly for reducing the temperature difference in the heat transfer of the loop heat pipe as claimed in any one of claims 1 to 8.

10. A loop heat pipe according to claim 9, further comprising a vapor line (2), a condenser (3), a liquid line (4) and an auxiliary line (6), the vapor line (2) communicating the first vapor chamber (13) with an inlet of the condenser (3), the liquid line (4) communicating the compensator (5) with an outlet of the condenser (3), the auxiliary line (6) communicating the second vapor chamber (7) with the liquid line (4).

11. A loop heat pipe according to claim 10, wherein a working medium channel (31) communicating with the liquid pipeline (4) is provided inside the condenser (3), and the auxiliary pipeline (6) communicates the second vapor chamber (7) with the working medium channel (31).

12. A loop heat pipe according to claim 10, wherein an auxiliary condenser (9) is provided on the auxiliary line (6).

13. A loop heat pipe according to claim 10, characterized in that the auxiliary line (6) passes through the condenser (3).

Images