JP4998933B2 - Heat transfer system - Google Patents

Description

  This specification relates to a heat transfer system for use in a periodic heat exchange system.

  The present application claims the benefit of US Pat.

  US Pat. No. 6,099,033 (“HEAT TRANSFER SYSTEM FOR A CYCLICAL HEATE EXCHANGE SYSTEM”) dated Oct. 28, 2003, is incorporated herein by reference.

  The present application is similar to that of Patent Document 3 (prior to Patent Document 3 dated October 2, 2003, "Application for Heat Transfer System", which was claimed prior to Patent Document 4 dated October 2, 2003, which was incorporated herein by reference. It is a continuation-in-part application of an evaporator (EVAFORATOR FOR HEAT TRANSFER SYSTEM).

  This application is a continuation-in-part of Patent Document 7, dated June 29, 2001 claiming the benefit of Patent Document 6, dated June 24, 2002 and claiming the benefit of Patent Document 8, dated June 30, 2000. This is a continuation-in-part application of Patent Document 5 dated June 24, 2003.

  A heat transfer system is used to transport heat from one location (heat source) to another location (heat sink). The heat transfer system can be used for on- or off-earth applications. For example, the heat transfer system can be incorporated into a satellite installation that operates in a zero or low gravity environment. As another example, a heat transfer system can be used in electronic equipment that is often required to be cold during operation.

The loop heat pipe (LHP) and capillary pump loop (CPL) are passive two-phase heat transfer systems. Each comprises an evaporator thermally coupled with a heat source, a condenser thermally coupled with a heat sink, a fluid flowing between the evaporator and the condenser, and a fluid container for expansion of the fluid. The fluid in the heat transfer system can be referred to as the working fluid. The evaporator includes a core having a primary wick and a fluid flow path. The heat gained by the evaporator is transported to the condenser where it is dissipated. These systems utilize the capillary pressure generated in the pore wick in the evaporator to drive the circulation of the working fluid from the evaporator to the condenser and back to the evaporator. The first feature that distinguishes between LHP and CPL is the location of the container of the loop used to store excess fluid that is drained from the loop during operation. Generally, the CPL container is placed far from the evaporator, while the LHP container is placed in the same location as the evaporator.
US Provisional Patent Application No. 60 / 421,737 Specification US provisional patent application (number not shown) US new application (no number) U.S. Patent No. 60 / 415,424 US patent application Ser. No. 10 / 602,022 US Provisional Patent Application No. 60 / 391,006 US patent application Ser. No. 09 / 896,561 US Provisional Patent Application No. 60 / 215,588 Specification US Pat. No. 6,382,309 Specification

  In one general aspect, a heat transfer system for a periodic heat exchange system has a wall configured to be coupled to a portion of the periodic heat exchange system and a primary wick coupled to the wall. An evaporator and a condenser coupled to the evaporator to form a closed loop that contains the working fluid are provided.

  The evaporator includes one or more of the following aspects. For example, the condenser has a vapor inlet and a liquid outlet, and the heat transfer system has a vapor line that communicates between the vapor outlet and the vapor inlet, and a liquid return line that communicates between the liquid outlet and the liquid inlet. Prepare.

  The evaporator comprises a liquid barrier containing a working fluid inside the liquid barrier, the working fluid flowing only along the inside of the liquid barrier and between the wall where the primary wick is heated and the inside of the liquid barrier. Positioned between. In addition, the evaporator is located between the primary wick and the heated wall and extends to the vapor outlet, and the vapor discharge passage is located between the liquid barrier and the primary wick and draws liquid from the liquid inlet. A liquid flow path is provided.

  The working fluid is passively moved through the heat transfer system.

  The working fluid is moved through the heat transfer system without using an external pump.

  The working fluid in the heat transfer system varies between liquid and vapor when the working fluid passes through or is in one or more of the evaporator, condenser, vapor line, and liquid return line. To do.

  The working fluid is moved passively through the heat transfer system.

  The working fluid is moved through the heat transfer system through the use of a wick.

  The heat transfer system further comprises fins that are thermally coupled to the condenser to discharge heat to the surrounding environment.

  In another general aspect, a thermodynamic system comprises a periodic heat exchange system and a heat transfer system coupled to the periodic heat exchange system to cool a portion of the periodic heat exchange system. The heat transfer system is connected to the evaporator to form a wall configured to be coupled to a portion of the periodic heat exchange system, a primary wick coupled to the wall, and a closed loop containing the working fluid. With a coupled condenser.

  Examples include one or more of the following features. An evaporator is integrated with the periodic heat exchange system. An evaporator is thermally coupled to parts of the periodic heat exchange system. The periodic heat exchange system comprises a Stirling heat exchange system. The periodic heat exchange system includes a refrigeration system. A heat transfer system is coupled to the hot side of the periodic heat exchange system. A thermodynamic system heat transfer system is coupled to the cold side of the periodic heat exchange system.

  In another general aspect, the method utilizes the system described above.

  The evaporator can be used in a suitable two-phase heat transfer system for use in terrestrial or extraterrestrial applications. For example, heat transfer systems can be used in electronic equipment that often requires cooling during operation or during laser diode applications.

  In a suitable heat transfer system in which the heat source is formed as a plane, a planar evaporator can be used. An annular evaporator can be used in any suitable heat transfer system in which the heat source is formed as a cylindrical surface.

  A heat transfer system using an annular evaporator can gain the advantage of gravity when used in terrestrial applications, and therefore LHP is appropriate for mass production. Earth applications often specify the heat capture surface and the direction of the heat sink, and an annular evaporator is advantageous for operation in gravity.

  The heat transfer system is thermally coupled to cool the periodic heat exchange system because the evaporator of the heat transfer system and the part of the heat exchange system cooled by the heat transfer system are thermally and spatially coupled. To provide an efficient and spatially efficient system. For example, if the part to be cooled (also known as a heat source) is cylindrical, the heat transfer system can comprise an annular evaporator. The use of a heat transfer system allows the use of a cylindrical heat exchange system, which allows it to be used in commercial practical applications for cooling cabinets.

  Integrated integration of the evaporator or condenser into the heat source of the periodic heat exchange system can minimize package dimensions. On the other hand, if the evaporator or condenser is clamped on the heat source, the placement and replacement of parts is easy.

  The heat transfer system can be used to cool a periodic heat exchange system having a cylindrical structure, such as a free piston Stirling cycle. The heat transfer system provides an efficient fluid line connection (one vapor phase and semi-cooled liquid return line connection) to or from an annular condenser assembly that is equally efficiently packaged. provide.

  The heat transfer system incorporates a condenser that is efficiently packaged, such as a planar condenser formed in an annular cross section with a wide air heat exchange surface attached, such as a corrugated fin material.

  The heat transfer system combines an effective heat transfer mechanism (evaporator and condenser) to couple the Stirling cycle fluid (helium) to the final heat sink (ambient air). Naturally, a great improvement in the efficiency of the Stirling cycle (for example up to 50%) is provided.

  The evaporator and condenser of the heat transfer system can be independently designed and optimized. This allows the option of attaching an appropriate number to the periodic heat exchange system. Furthermore, the heat transfer system is not affected by the direction of gravity because the wick is built into the evaporator.

  The heat transfer system provides efficient cooling at a commercially acceptable cost for a small package cabinet such as a refrigerator or vending machine.

  According to one embodiment, an annular evaporator is clamped on a periodic heat exchange system and is thermally coupled with thermal grease to facilitate assembly and maintenance. According to another embodiment, an annular evaporator is an interference fit over a periodic heat exchange system to provide easy assembly with improved thermal efficiency. According to a further embodiment, an annular evaporator is formed integrally with the periodic heat exchange system to provide further improved thermal efficiency.

  The heat transfer system includes a condenser having finned inner and outer annular portions to efficiently transfer heat to the air in a reduced package space. The condenser can be formed by bending or extruding with a roll.

  The loop heat pipe of the present invention provides an efficient package with a cylindrical refrigerator by adapting the traditional cylindrical form of the LHP evaporator to a flat “flat” shape that can be rolled into an annulus. .

  Although heat transfer system packages have been described in connection with several embodiments, it is not meant to be limited to these embodiments. Although described with respect to the use of cabinet cooling such as home refrigerators, vending machines, or over-the-counter refrigeration systems, those skilled in the art will be small and energy efficient using the heat transfer system described herein. Many other useful applications of good and environmentally friendly refrigeration equipment will be appreciated.

  Other features and advantages will be apparent from the description, drawings, and claims.

  As described above, in the loop heat pipe (LHP), the reservoir coexists with the evaporator. Therefore, the reservoir is thermally and fluidly connected to the evaporator through a heat pipe conduit. In this way, the fluid from the reservoir is sent to the evaporator so that the first core of the evaporator can become fully wet or “primed” during activation. In addition, the LHP design also reduces the loss of liquid from the evaporator's first core during steady state or transient operation of the evaporator within the heat transport system. In addition, non-condensable gas vapors or bubbles (NCG bubbles) are discharged from the evaporator core through the heat pipe conduit to the reservoir.

  Prior LHPs require liquid to be present in the reservoir before starting or using power to the LHP evaporator. However, if the working fluid in the LHP is in a supercritical state prior to activation of the LHP, no liquid will be present in the reservoir prior to activation. The supercritical state is a state where the temperature of the LHP is higher than the critical temperature of the working fluid. The critical temperature of a fluid is the highest temperature at which the fluid can exhibit a liquid-vapor equilibrium. For example, if the working fluid is a cryogenic fluid, i.e. a fluid with a boiling point lower than -150 <0> C, or if the working fluid is a sub-ambient fluid, i.e. an environment where the LHP is operating. For fluids with boiling points below temperature, LHP becomes supercritical.

  Conventional LHP requires that the liquid returning to the evaporator be subcooled, that is, cooled to a temperature below the boiling point of the working fluid. Due to such constraints, it is not practical to operate the LHP below ambient temperature. For example, if the working fluid is a cryogenic fluid, the LHP may operate in an environment having a temperature above the boiling point of the fluid.

  Referring to FIG. 1, heat transport system 100 is designed to overcome the limitations of conventional LHP. The heat transport system 100 includes a heat transfer system 105 and a priming system 110. Since the priming system 110 is configured to convert the fluid in the heat transfer system 105 to a liquid, the heat transfer system 105 is primed. As used in this description, the term “fluid” is a generic term that refers to both liquid and vapor substances that are in equilibrium at saturation.

  The heat transfer system 105 includes a main evaporator 115 and a condenser 120 connected to the main evaporator 115 by a liquid pipe 125 and a vapor pipe 130. The condenser 120 is in thermal communication with a heat sink 165 and the main evaporator 115 is in thermal communication with a heat source Qin 116. In addition, the system 105 includes a high temperature reservoir 147 connected to the steam line 130 to provide additional pressure confinement when needed. In particular, the high temperature reservoir 147 increases the volume of the system 100. If the working fluid is at a critical temperature or higher than the maximum temperature at which the working fluid can exhibit a liquid-vapor equilibrium, its pressure is proportional to the mass of the system 100 (filling amount) and inversely proportional to the volume of the system. Increasing the volume of the hot reservoir 147 decreases the filling pressure.

  The main evaporator 115 includes a container 117 that houses a first core 140 in which a core 135 is formed. The main evaporator 115 includes a bayonet tube 142 and a second core 135 within the core 135. The bayonet tube 142, the first core 140, and the second core 145 form a liquid passage 143, a first vapor passage 144, and a second vapor passage 146. The second core 145 provides phase control or liquid / vapor separation within the core 135. This is as discussed in U.S. Patent No. 6,057,096, which is incorporated herein by reference in its entirety. As shown, the main evaporator 115 has three ports. It includes a liquid inlet 137 to the liquid passage 143, a vapor outlet 132 from the second vapor passage 146 to the vapor line 130, a fluid outlet 139 from the liquid passage 143 (and possibly the first vapor passage 144 as discussed below). It is. The structure of the three-port evaporator is discussed in detail below with respect to FIGS. 5A and 5B.

  The priming system 110 includes a second or priming evaporator 150 connected to the steam line 130 and a reservoir 155 coexisting with the second evaporator 150. The reservoir 155 is connected to the core 135 of the main evaporator 115 by the second fluid pipe 160 and the second condenser 122. The second fluid pipe 160 is connected to the fluid outlet 139 of the main evaporator 115. In addition, the priming system 110 includes a controlled heat source Qsp 151 that is in thermal communication with the second evaporator 150.

  The second evaporator 150 includes a container 152 that houses a first core 190, and a core 185 is formed in the first core 190. The second evaporator 150 includes a bayonet tube 153 and a second wick 180 that extends from the core 185 through the conduit 175 to the reservoir 155. The second wick 180 provides a capillary connection between the reservoir 155 and the second evaporator 150. The bayonet tube 153, the first core 190 and the second core 180 are connected to the fluid passage 182 connected to the fluid pipe 160, the first steam passage 181 connected to the reservoir 155, and the second pipe connected to the steam pipe 130. A steam passage 183 is formed. The reservoir 155 is thermally and fluidly connected to the core 185 of the second evaporator 150 via the liquid passage 182, the second core 180, and the first vapor passage 181. Vapor and / or NCG bubbles from the core 185 of the second evaporator 150 are discharged to the reservoir 155 through the first vapor passage 181. The condensable liquid is returned from the reservoir 155 to the second evaporator 150 through the second core 180. The first core 190 is fluidly connected to the liquid from the core 185 to the heat source Qsp151, and when the second evaporator 150 is heated, the liquid on the outer surface of the first core 190 evaporates. The steam is formed in the second steam passage 183.

  Since the reservoir 155 is pre-cooled, it can operate at a lower temperature than the temperature at which the heat transfer system 105 operates if it is cooled and not heated by a cooling source. In one embodiment, the reservoir 155 and the second condenser 122 are in thermal communication with a heat sink 165 that is thermally connected to the condenser 120. For example, the shunt 170 can be used to attach the reservoir 155 to the heat sink 165. The shunt 170 is made from aluminum or a material with good thermal conductivity. In this way, the temperature of the reservoir 155 follows the temperature of the condenser 120.

  FIG. 2 shows an embodiment of the heat transport system 100. In this embodiment, condensers 120 and 122 are attached to a cryocooler 200. This functions as a refrigerator and conducts heat from the condensers 120, 122 to the heat sink 165. Further, in the embodiment of FIG. 2, the pipes 125, 130, and 160 are wound in order to reduce the necessary space of the heat transport system 100.

  Although not shown in FIGS. 1 and 2, for example, elements such as the reservoir 155 and the main evaporator 115 are equipped with temperature sensors and can be used for diagnostics and testing.

  Still referring to FIG. 3, the system 100 performs the procedure 300 to transport heat from the heat source Qin 116 and so that the main evaporator 115 is wetted with liquid prior to activation. Procedure 300 is particularly useful when heat transfer system 105 is in a supercritical state. Prior to the start of the procedure 300, the system 100 is filled with a working fluid at a specific pressure called “filling pressure”.

  Initially, the reservoir 155 is pre-cooled, for example, by attaching the reservoir 155 to the heat sink 165 (step 305). The reservoir 155 may be precooled to a temperature below the critical temperature of the working fluid. As discussed, the critical temperature is the highest temperature at which the working fluid can exhibit a liquid-vapor equilibrium. For example, if the fluid is ethane, the critical temperature is 33 ° C. and the reservoir 155 is cooled below 33 ° C. Since the temperature of the reservoir 155 is lowered below the critical temperature of the working fluid, the reservoir 155 is partially filled with the condensate formed by the working fluid. The liquid formation in the reservoir 155 wets the second wick 180 and the first wick 190 of the second evaporator 150 (step 310).

  Meanwhile, power is applied to the priming system 110 by applying heat from the heat source Qsp 151 to the second evaporator 150 to facilitate or initiate the circulation of fluid in the heat transfer system 105 (step 315). . The vapor generated by the second evaporator 150 is sent through the vapor pipe 130 and through the condenser 120 by the capillary pressure at the boundary between the first core 190 and the second vapor passage 183 (step 320). ). When the vapor reaches the condenser 120, it is converted to a liquid (step 325). The liquid formed in the condenser 120 is sent to the main evaporator 115 of the heat transfer system 105 (step 330). When the main evaporator 115 is at a temperature higher than the critical temperature of the fluid, the liquid entering the main evaporator 115 evaporates and cools the main evaporator 115. This process (steps 315-330) continues with the main evaporator 115 reaching the set point temperature (step 335). At that set point, the main evaporator holds the liquid, gets wet, and can operate as a capillary pump. In one embodiment, the set point temperature is the temperature at which reservoir 155 is cooled. In other embodiments, the set point temperature is below the critical temperature of the working fluid. In another embodiment, the set point temperature is higher than the temperature at which the reservoir 155 is cooled.

  When the set temperature is reached (step 335), the system 100 operates in the main mode (step 340), and heat from the heat source Qin 116 used for the main evaporator 115 is transferred to the heat transfer system 105 in the main mode. Is transmitted by. In particular, in the main mode, the main evaporator 115 is pumped by a capillary to facilitate the circulation of the working fluid through the heat transfer system 105. Further, in the main mode, the set point temperature of the reservoir 155 is lowered. Since the temperature of the main evaporator 115 closely follows the temperature of the reservoir 155, the rate at which the heat transfer system 105 cools during the main mode depends on the precooling of the reservoir 155. In addition, although not required, a heater can be used to further control or regulate the temperature of the reservoir 155 during the main mode. Further, in the main mode, the power applied to the second evaporator 150 by the heat source Qsp 151 is reduced, so that the heat transfer system 105 is lowered to the normal operating temperature for the fluid. For example, in the main mode, the heat load from the heat source Qsp151 to the second evaporator 150 is maintained at a value equal to or exceeding the heat state shown below. In one embodiment, the heat load from the heat source Qsp is maintained at about 5-10% of the heat load applied from the heat source Qin 116 to the main evaporator 115.

  In this particular embodiment, the main mode is initiated by a determination that the set point temperature has been reached (step 335). In other embodiments, the main mode is initiated at other times or other initiation factors. For example, the main mode is initiated after the priming system is wet (step 310) or after the reservoir is pre-cooled (step 305).

  At any point during operation, the heat transfer system 105 may experience a thermal condition that results from a thermal condition across the first core 140 and parasitic heat applied to the liquid piping 125. Both conditions cause vapors to form on the liquid side of the evaporator. In particular, the thermal condition across the first core 140 creates a liquid in the core 135 and forms a vapor bubble. If bubbles are left in the core 135, they will grow and prevent liquid supply to the first wick 140, resulting in a failure of the main evaporator 115. The inflow of parasitic heat into the liquid line 125 (referred to as “parasitic heat gains”) forms vapor from the liquid in the liquid line 125.

  In order to reduce the adverse effects of the above thermal conditions, the priming system 110 operates at a power level Qsp 151 that is greater than or equal to the sum of its thermal conditions and parasitic thermal gain. For example, as described above, the priming system 110 can operate at 5-10% of the power to the heat transfer system 105. In particular, the fluid containing the foam and liquid mixture is discharged from the core 135 for delivery to the second fluid line 160 leading to the second condenser 122. In particular, the vapor formed in the core 135 moves directly around the bayonet tube 143 to the fluid outlet port 139. The steam formed in the first passage 144 moves through the second core 145 (if the hole size of the second core 145 is large enough to accept the steam bubbles), or Alternatively, it flows to the fluid outlet port 139 by moving through an opening at the end of the second core 145 in the vicinity of the outlet port 139 that becomes an obvious passage from the first vapor passage 144 to the outlet port 139. . The second condenser 122 condenses the bubbles in the fluid and pushes the fluid into the reservoir 155 for reintroduction into the heat transfer system 105.

  Similarly, in order to reduce the inflow of parasitic heat to the liquid pipe 125, the second fluid pipe 160 and the liquid pipe 125 are coaxially arranged, the second fluid pipe 160 surrounds the liquid pipe 125, Insulate from heat. This embodiment is discussed in detail below with reference to FIGS. 8A and 8B. As a result of this configuration, ambient heat may form vapor bubbles in the second fluid line 160 instead of in the liquid line 125. As discussed, fluid flows from the main evaporator 115 to the second condenser 122 due to capillary action that occurs in the second core 145. Due to the flow of this fluid and the temperature of the second condenser 122 being relatively low, the vapor bubbles in the second fluid line 160 pass through the condenser 122 where they condense into liquid and enter the reservoir 155. Sent.

  FIG. 4 shows data at the time of the test. In this example, prior to activation of main evaporator 115 at time 410, temperature 400 of main evaporator 115 is significantly higher than temperature 405 of reservoir 155 that has been pre-cooled (step 305) to the set point temperature. Since the priming system 110 is wet (step 310), power Qsp 450 is applied to the second evaporator 150 at time 452 (step 315) and liquid is sent to the main evaporator 115 (step 330). The temperature 400 of the main evaporator 115 decreases until the temperature 405 of the reservoir 155 is reached at time 410. Power Qin 460 is applied to main evaporator 115 at time 462. At that time, the system 100 operates in the LHP mode (step 340). As shown, the power input Qin 460 to the main evaporator 115 is kept relatively low while the main evaporator 115 is cooled. Furthermore, the temperatures 470 and 475 of the second fluid line 160 and the liquid line 125 are shown, respectively. After time 410, temperatures 470 and 475 follow temperature 400 of main evaporator 115, respectively. Furthermore, due to heat transfer between the second evaporator 150 and the reservoir 155, the temperature 415 of the second evaporator 150 closely follows the temperature 405 of the reservoir 155.

  As mentioned, in one embodiment, ethane may be used as the fluid in the heat transfer system 105. The reason generally indicated above is that the critical temperature of ethane is 33 ° C., but the system 100 can be started from the critical state at a temperature of 70 ° C. Since power Qsp is applied to the second evaporator 150, the temperature of the condenser 120 and reservoir 155 rapidly decreases (between times 452 and 410). A trim heater can be used to control the temperature of the reservoir 155 and hence the condenser 120 to -10 ° C. A 10 watt heat load or power input Qsp is applied to the second evaporator 150 to start the main evaporator 115 from a critical temperature of 70 ° C. When the main evaporator 115 gets wet, both the power input from the heat source Qsp 151 to the second evaporator 150 and the power applied to the trim heater are reduced to bring the temperature of the system 100 to a nominal operating temperature of about −50 ° C. To lower. For example, if a 40 watt power input Qin is applied to the main evaporator 115 during main mode, the power input Qas to the second evaporator 150 is approximately 3 while operating at -45 ° C. Reduce to watts to reduce the 3 watts lost due to thermal conditions (above). As another example, the main evaporator 115 can be operated with a power input Qin of about 10 watts to about 40 watts, 5 watts is added to the second evaporator 150, and the temperature 405 of the reservoir 155 is about -45 ° C.

  5A and 5B, in one embodiment, main evaporator 115 is designed as a three-port evaporator 500 (of the design shown in FIG. 1). In general, in the three-port evaporator 500, the liquid flows to the liquid inlet 505 to the core 510 formed by the first core 540. Also, fluid from the core 510 flows from a fluid outlet 512 to a pre-cooled reservoir (such as reservoir 155). The fluid and the core 510 are accommodated in a container 515 made of, for example, aluminum. In particular, fluid flowing from the liquid inlet 505 to the core 510 flows through the bayonet tube 520 to the liquid flow path 521 that flows around. Fluid can flow through the second core 525 and the annular artery 535 (such as the second core 145 of the evaporator 115) made from the core material 530. The core material 530 separates the annular artery 535 from the first vapor channel 560. Since the power from the heat source Qin 116 is applied to the evaporator 500, the liquid from the core 510 enters the first core 540 and evaporates, and the formed vapor includes one or more vapor grooves 545. It flows freely along the steam flow path 565 and exits from the steam outlet 550 to the steam pipe 130. Vapor bubbles formed in the first vapor passage 560 of the core 510 exit from the core 510 through the first vapor passage 560 to the fluid outlet 512. As described above, the vapor bubbles in the first passage 560 pass through the second core 525 if the hole size of the second core 525 is large enough to accept the vapor bubbles. Yes. Alternatively or additionally, the vapor bubbles in the first vapor passage 560 may pass through the liquid passage 521 or through the opening in the second wick 525 formed at an appropriate location along the second wick 525. Enters fluid outlet 512.

  Referring to another embodiment of FIG. 6, the main evaporator 115 is designed as a 4-port evaporator 600, which is the design shown in US Pat. In summary, also highlighting aspects that are different from the structure of a three-port evaporator, liquid enters the evaporator 600, through the fluid inlet 605, through the bayonet 610, and into the core 615. The liquid in the core 615 enters the first core 620 and the evaporator, and the formed steam freely flows along the steam groove 625, exits the steam outlet 630, and enters the steam pipe 130. A second core 633 in the core 615 separates the liquid in the core from the vapor or bubbles in the core (which occurs when heating the liquid in the core 615). Liquid containing bubbles formed in the first fluid passage 635 in the second core 633 flows out of the fluid outlet 640 and in the vapor passage 642 located between the second core 633 and the first core 620. Vapor or bubbles formed in the vapor flow out of the vapor outlet 645.

  Still referring to FIG. 7, a heat transport system 700 is shown, in which the main evaporator is a four-port evaporator 600. The system 700 includes one or more heat transfer systems 705 and a priming system 710 that is configured to convert the fluid in the heat transfer system 705 to a liquid that wets the heat transfer system 705. The 4-port evaporator 600 is connected to one or more condensers 715 by a steam pipe 720 and a fluid pipe 725. The priming system 710 includes a pre-cooled reservoir 730 that is fluidly and thermally connected to the priming evaporator 735.

  The design conditions of the heat transport system 100 include activation of the main evaporator 115 from a supercritical state, management of parasitic heat leakage, heat conduction across the first core 140, precooling of the low temperature reservoir 155, and heat transfer system. Confining the working fluid in 105 at an ambient temperature above the critical temperature. To accommodate these design requirements, the body of the evaporator 115 or 150 or the container (such as the container 515) can be made from 6063 standard aluminum extrusion. Also, the first core 140 and / or 190 can be manufactured from a core with a fine hole. In one embodiment, evaporator 115 or 150 has an outer diameter of about 0.625 inches and a container length of about 6 inches. The reservoir 155 may use an aluminum shunt 170 to pre-cool the end plate of the radiator 165. In addition, a heater such as (kapton heater) can be attached to the side of the reservoir 155.

  In one embodiment, the steam pipe 130 is made of a smooth wall stainless steel pipe having an outer diameter (OD) of 3/16 inch, and the liquid pipe 125 and the second fluid pipe 160 are made of smooth wall stainless steel having an outer diameter of 1/8 inch. Made of steel pipe. The pipes 125, 130, 160 are bent to a tortuous route and are gold plated to minimize parasitic thermal gain. Further, the pipes 125, 130, 160 can be placed in a stainless steel box and the heater can be used to simulate the specific environment under test. The stainless steel box may be insulated with multilayer insulation (MLI) to minimize heat leakage through the wall of the heat sink 165.

  In one embodiment, the condenser 122 and the second fluid line 160 are fabricated from a 0.25 inch outer diameter tube. The tube is bonded to the wall of the heat sink 165 using, for example, epoxy. Each wall plate of the heat sink 165 is an 8 × 19 inch aluminum heat sink for direct condensation using a surface plate having a thickness of 1/16 inch. A Kapton heater is attached to the wall plate of the heat sink 165 near the condenser 120 to prevent accidental freezing of the working fluid. During operation, the temperature of the entire system 100 is monitored using a temperature sensor such as a thermocouple.

  The heat transport system 100 may be implemented in an environment where the critical temperature of the working fluid of the heat transfer system 105 is lower than the ambient temperature in which the system 100 is operating. The heat transport system 100 can be used to cool elements that require cryogenic cooling.

  With reference to FIGS. 8A-8D, the heat transport system 100 may be implemented in a microminiature cryogenic system 800. In the micro system 800, the pipes 125, 130, 160 are made of a flexible material and can be a coil structure 805 to save space. The micro system 800 can be operated at −238 ° C. using neon fluid. The power input Qin 116 is about 0.3 to 2.5 watts. In the microminiature system 800, a low temperature element (or heat source that requires low temperature cooling) 816 is connected to a low temperature cooling source such as a cryocooler 810 connected to cool the condensers 120, 122.

  The micro system 800 can perform traditional thermal switching to reduce mass, increase flexibility, and provide thermal switching capability when compared to a system that isolates vibrations. Traditional thermal switching and vibration-isolated systems have two flexible conductive links (FCLs), low temperature to form a loop that conducts heat from the cold element to the cold source. It requires a thermal switch (CTSW) and a conduction bar (CB). In the micro system 800, the thermal performance is improved because the number of mechanical boundaries is reduced. In systems that perform traditional thermal switching and isolate vibration, the thermal state at the mechanical boundary accounts for a high proportion of thermal gain. The CB and the two FCLs are replaced by low mass, flexible, thin-walled tubes used in the coil structure 805 of the micro system 800.

  Furthermore, the micro-system 800 can function over a wide range of heat transport distances and can have a structure in which a cooling source (such as a cryocooler 810) is remotely located from the cryogenic element 816. The coil structure 805 has a low mass and low surface area, thus reducing the parasitic thermal gain through the pipes 125 and 160. The configuration of the cooling source 810 in the microminiature system 800 facilitates integration and packaging of the system 800 and reduces vibration at the cooling source 810. This is especially important when using infrared sensors. In one embodiment, the micro system 800 is tested with neon and operates at 25-40K.

  With reference to FIGS. 9A-9C, the heat transport system 100 may be adjustably mounted or implemented in a Gimbaled system 1005. Among them, the main evaporator 115 and a part of the pipes 125, 160, 130 are attached so as to rotate within a range of ± 45 degrees around the height axis 1020, and the pipes 125, 160, 130 are attached. Are attached to rotate around an azimuth axis 1025 within a range of ± 220 degrees. The pipes 125, 160, and 130 are formed of thin-walled pipes and are wound around a spiral around each rotation axis. System 1005 is thermally connected to a cryogenic element (or a heat source that requires cryogenic cooling) 1016. The cryogenic element 1016 is like a cryogenic cooling source such as a cryocooler 1010 connected to cool the condensers 120, 122 from something like a cryogenic telescope sensor. Since the cooling source 1010 is located on the geostationary spacecraft 1060, it reduces the mass at the cryogenic telescope. The motor torque to control the rotation of the pipes 125, 160, 130, the power requirements of the system 1005, the controls required for the spacecraft 1060, and the positioning accuracy of the sensor 1016 are improved. The cryocooler 1010 and the radiator or heat sink 165 are moved from the sensor 1016 to reduce vibrations in the sensor 1016. In one example, when the working fluid is nitrogen, the system 1005 is tested to operate within the range of 70-115K.

  The heat transfer system 105 may be used for medical purposes or for applications where the equipment must be cooled below ambient temperature. As another example, the heat transfer system 105 is used to cool an infrared (IR) sensor. Infrared sensors are used at low temperatures to reduce ambient noise. The heat transfer system 105 can be used to cool the vending machine. In many cases, vending machines contain items that are preferably cooled below ambient temperature. The heat transfer system 105 may be used to cool elements such as a computer display or hard drive such as a laptop computer, handheld computer or desktop computer. The heat transfer system 105 may be used to cool one or more elements in a transportation device such as an automobile or aircraft.

  Other embodiments are within the scope of the claims. For example, the condenser 120 and the heat sink 165 can be designed as an integrated system, such as a radiator. Similarly, the second condenser 122 and the heat sink 165 can be formed from a single radiator. The heat sink 165 can be a passive heat sink (such as a radiator) or a cryocooler that actively cools the condensers 120, 122.

  In other embodiments, the temperature of the reservoir 155 is controlled using a heater. In another embodiment, reservoir 155 is heated using parasitic heat.

  In another embodiment, a coaxial insulating ring is formed and placed between the liquid line 125 and the second fluid line 160, and the second fluid line 160 surrounds the insulating ring.

Evaporator design The evaporator is an integral part of the two-phase heat transfer system. For example, as shown in FIGS. 5A and 5B above, the evaporator 500 includes an evaporator body or container 515 that is in contact with a first core 540 surrounding the core 510. The core 510 forms a flow path for the working fluid. The first core 540 is surrounded at its periphery by a plurality of peripheral flow channels or steam grooves 545. Channel 545 collects vapor at the boundary between wick 540 and evaporator body 515. Channel 545 is in contact with vapor outlet 550. In order to discharge the steam formed in the evaporator 115, the steam is supplied into the steam pipe and then supplied into the condenser.

  The evaporator 500 and the other evaporators described above are often cylindrical. That is, the evaporator core forms a cylindrical passage through which the working fluid passes. The fact that the evaporator is cylindrical is useful for cooling applications in which the heat transfer surface is cylindrical and hollow. In many cooling applications, it is necessary to remove heat from a heat source having a flat surface. For this type of application, the evaporator may be modified to include a flat conductive saddle to fit the installed portion of the heat source having a flat surface. For example, such a design is shown in US Pat.

  Cylindrical evaporators tend to meet the thermodynamic constraints of LHP operation (ie, minimize heat leakage to the reservoir). Normal equilibrium operation needs to occur due to LHP operation constraints due to the amount of LHP subcooling. Furthermore, cylindrical evaporators are relatively easy to process, handle, machine and process.

  However, as will be shown later, it can be designed in a flat shape for more natural attachment to a flat heat source.

Planar Design Referring to FIG. 10, an evaporator 1000 for a heat transfer system includes a heating wall 1005, a liquid barrier 1010, a first core 1015 between the heating wall and the inside of the liquid barrier 1010, a vapor removal channel 1020, A liquid flow channel 1025 is included.

  The heating wall 1005 is intimately connected to the first core 1015. The liquid barrier 1010 holds the working fluid inside the liquid barrier 1010 so that the working fluid flows only along the inside of the liquid barrier 1010. The liquid barrier 1010 closes the evaporator envelope to collect and distribute the working fluid through the liquid flow channel 1025. The vapor removal channel 1020 is located at the boundary between the evaporation surface 1017 of the first core 1015 and the heating wall 1005. A liquid flow channel 1025 is located between the liquid barrier 1010 and the first core 1015.

  The heating wall 1005 functions as a heat transfer surface for the heat source. For example, the heating wall 1005 is made of a thermally conductive material such as a thin metal plate. The material chosen for the heating wall 1005 can typically withstand the internal pressure of the working fluid.

  The steam removal channel 1020 is designed to balance the fluid resistance of the channel 1020 and the heat conduction through the heating wall 1005 to the first core 1015. The channel 1020 can be formed on the surface by electroetching, machining, or other convenient method.

  The vapor removal channel 1020 is shown as a groove inside the heating wall 1005. However, the vapor removal channel can be designed and arranged in several different ways based on the chosen design method. For example, according to other embodiments, the vapor removal channel 1020 can be grooved or embedded in the outer surface of the first core 1015 so that they are below the surface of the first core 1015. To be. The design of the vapor removal channel 1020 is selected to be easy and convenient to manufacture and to closely approach one or more of the following guidelines.

  First, the hydraulic diameter of the steam removal channel 1020 should be sufficient to handle the steam flow generated on the evaporation surface 1017 of the first core 1015 without causing a significant pressure drop. Second, the contact surface between the heating wall 1005 and the first core 1015 should be maximized to allow effective heat transfer from the heat source to the evaporation surface of the first core 1015. Third, the thickness 1030 of the heated wall 1005 in contact with the first core 1015 should be minimized. As the thickness 1030 increases, evaporation at the surface of the first core 1015 decreases and vapor transport through the vapor removal channel 1020 decreases.

  The evaporator 1000 is assembled from separate parts. Instead, the evaporator 1000 can be made as a single piece by in-situ sintering of the first wick 1015 between two walls having a special mandrel to form channels on both sides of the wick. it can.

  The first wick 1015 provides an evaporation surface 1017 to pump or supply working fluid from the liquid flow channel 1025 to the evaporation surface of the first wick 1015.

  Several conditions are related to the size and design of the first core 1015. The thermal conductivity of the first wick 1015 should be sufficiently low to reduce heat leakage from the evaporation surface 1017 through the first wick 1015 to the liquid flow channel 1025. Furthermore, heat leakage is also affected by the linear dimensions of the first core 1015. For this reason, the linear dimensions of the first core 1015 should be optimized to reduce heat leakage. For example, heat leakage can be reduced by increasing the thickness 1019 of the first core 1015. However, increasing the thickness 1019 increases the fluid resistance of the first core 1015 against the flow of the working fluid. With the LHP design in use, the fluid resistance of the working fluid by the first core 1015 can be significant, and it is important to properly balance these factors.

  The force that pumps the working fluid of the heat transfer system is the difference in temperature or pressure between the vapor side and the liquid side of the first core. The pressure difference is maintained by the first core and is maintained by appropriately managing the heat balance of the incoming working fluid.

  Liquid returning from the condenser to the evaporator passes through the liquid return line and is slightly subcooled. The subcooling to some extent cancels out heat leakage through the first core and from the surroundings to the reservoir in the liquid return line. Liquid subcooling maintains the thermal balance of the reservoir. However, there are other useful ways to maintain the thermal balance of the reservoir.

  One method is a systematic heat exchange between the reservoir and the environment. In the case of an evaporator having a planar design such as is often used for ground use, the heat transfer system includes a heat exchange fin in the reservoir and / or the liquid barrier 1010 of the evaporator 1000. The natural convection forces at these fins provide subcooling and reduce stress on the condenser and reservoir of the heat transfer system.

  Either the temperature of the reservoir or the temperature difference between the reservoir and the evaporation surface 1017 of the primary wick 1015 passes through the heat transfer system. Supports circulation of the working fluid. Some heat transfer systems require an additional amount of subcooling. Even if the condenser is completely blocked, the required amount is larger than the condenser can make.

  In the design of the evaporator 1000, three variables need to be managed. First, the organization and design of the liquid flow channels 1025 needs to be determined. Second, the venting of the vapor from the liquid flow channel 1025 needs to be accounted for. Third, the evaporator 1000 should be designed to ensure that liquid fills the liquid flow channel 1025. These three variables are interrelated and thus should be considered and optimized together to form an effective heat transfer system.

  As already mentioned, it is important to obtain an appropriate balance between the heat leak to the liquid side of the evaporator and the pumping capability of the first wick. This balancing process cannot be performed independently of the optimization of the condenser providing subcooling because it is larger in the condenser to allow greater heat leakage in the evaporator design. This is because sub-cooling needs to be performed. The longer the condenser, the greater the hydraulic losses in the fluid line, which requires various wick materials with better pumping capability.

  In operation, when power from a heat source is applied to the evaporator 1000, liquid from the liquid flow channel 1025 enters the first wick, evaporates, and flows freely along the vapor removal channel 1020. Vapor is formed. Liquid flow into the evaporator 1000 is provided by the liquid flow channel 1025. The liquid flow channel 1025 replaces liquid evaporated on the vapor side of the first wick 1015 and sufficient liquid to replace the liquid evaporated on the liquid side of the first wick 1015. To supply.

  The evaporator 1000 has a second wick 1040 that provides phase management on the liquid side of the evaporator 1000 and supports the supply of the first wick 1015 in critical modes of operation. (As discussed above). The second wick 1040 is formed between the liquid flow channel 1025 and the first wick 1015. The second wick can be a mesh screen (as shown in FIG. 10), an advanced complex artery, or a slab wick structure. In addition, the evaporator 1000 may have a vapor vent channel 1045 at the interface between the first wick 1015 and the second wick 1040.

  Heat conduction through the first wick 1015 initiates the evaporation of the working fluid at an inappropriate location near or in the liquid side of the evaporator 1000 in the liquid flow channel 1025. The vapor release channel 1045 provides the undesired vapor away from the wick and into the two-phase reservoir.

  The fine pore structure of the first wick 1015 can create significant flow resistance for the liquid. It is therefore important to optimize the number, shape and design of the liquid flow channels 1025. The goal of this optimization is to support a uniform or near uniform feed flow to the vaporization surface 1017. Further, when the thickness 1019 of the first wick 1015 is reduced, the liquid flow channel 1025 can be a far away space.

  The evaporator 1000 requires significant vapor pressure in order to operate with a particular working fluid within the evaporator 1000. The use of a working fluid having a high vapor pressure can cause several problems associated with pressure containment of the evaporator envelope. Conventional solutions to the pressure containment problem, such as thickening the evaporator wall, are not always effective. For example, in a planar evaporator having a considerable flat area, the wall becomes too thick, so that the temperature difference increases and the heat conduction of the evaporator decreases. In addition, even a microscopic deformation of the wall due to the pressure containment results in a loss of contact between the wall and the first wick. Such loss of contact affects the heat transfer through the evaporator. The microscopic deformation of the wall then creates difficulties in the interface between the evaporator, the heat source and any external cooling equipment.

Annular design
Referring to FIGS. 10-13, the annular evaporator 1100 is formed by effectively rolling the planar evaporator 1000 so that the first wick 1015 is turned back into itself to form an annular shape. The The evaporator 1100 can be used in applications where the heat source has a cylindrical outer profile, or in applications where the heat source is shaped as a cylinder. The annular shape combines the strength of the pressure containment cylinder with the curved interface surface for best contact with the cylindrically shaped heat source.

  The evaporator 1100 includes a heated wall 1105, a first wick 1115 positioned between the heated wall 1105 and the liquid barrier wall 1110, a vapor removal channel (vapor removal channel). channels) 1120 and a liquid flow channel 1125. The liquid barrier wall 1110 is coaxial with the first wick 1115 and the heated wall 1105.

  The heated wall 1105 is in intimate contact with the first wick 1115. The liquid barrier wall 1110 has a working fluid inside the liquid barrier wall 1110 such that the working fluid flows only along the inside of the liquid barrier wall 1110. The liquid barrier wall 1110 closes the envelope of the evaporator and helps to organize and distribute the working fluid through the liquid flow channel 1125.

  A vapor removal channel 1120 is disposed at the interface between the evaporation surface 1117 of the first wick 1115 and the unheated wall 1105. The liquid flow channel 1125 is disposed between the liquid barrier wall 1110 and the first wick 1115. The heated wall 1105 acts as a heat acquisition surface, and the steam generated on this surface is removed by the steam removal channel 1120.

  The first wick 1115 fills the volume between the heated wall 1105 and the liquid barrier wall 1110 of the evaporator 1100 to provide reliable reverse meniscus evaporation.

  The evaporator 1100 can also be equipped with a heat exchange fin 1150 that contacts the liquid barrier wall 1110 to cold bias the liquid barrier wall 1110. The liquid flow channel 1125 receives liquid from a liquid inlet 1155 and the vapor removal channel 1120 extends to a vapor outlet 1160 to provide vapor to it.

  The evaporator 1100 can be used in a heat transfer system having an annular reservoir 1165 adjacent to the first wick 1115. The reservoir 1165 may be cold biased with heat exchange fins 1150 that extend across the reservoir 1165. The cold bias of the reservoir 1165 allows utilization of the entire condenser area without having to generate subcooling in the condenser. Excessive cooling provided by cold biasing the reservoir 1165 and the evaporator 1100 compensates for parasitic heat leaks through the first wick 1115 to the liquid side of the evaporator 1100. To do.

  In another embodiment, the evaporator design can be inverted, evaporation characteristics can be provided on the outer periphery, and liquid return characteristics can be provided on the inner periphery. .

  The annular shape of the evaporator 1100 provides one or more of the following or additional advantages. First, problems associated with pressure containment are reduced or eliminated within the annular evaporator 1100. Second, the first wick 1115 does not need to be sintered inside, thus providing more space for a more complex design on the vapor and liquid side of the first wick 1115.

  14A-H, an annular evaporator 1400 having a liquid inlet 1455 and a vapor outlet 1460 is shown. The annular evaporator 1400 includes a heated wall 1700 (FIGS. 14G, 14H, and 17A-D), a liquid barrier wall 1500 (FIGS. 14G, 14H, 15A, and 15B), an inner side of the heated wall 1700 and the liquid barrier wall 1500. A first wick 1600 (FIGS. 14G, 14H and 16A-D), a vapor removal channel 1465 (FIG. 14H), and a liquid flow channel 1505 (FIGS. 14H and 15B). The annular evaporator 1400 also includes a ring 1800 (FIGS. 14G and 18A-D) that ensures a spacing between the heated wall 1700 and the liquid barrier wall 1500, and a support for the liquid barrier wall 1500 and the first wick 1600. A ring 1900 at the base of the evaporator 1400 (FIGS. 14G, 14H and 19A-D). The heated wall 1700, the liquid barrier wall 1500, the ring 1800, the ring 1900, and the wick 1600 are preferably formed of stainless steel.

  The upper portion of the evaporator 1400 (ie, above the wick 1600) has an expansion volume 1470 (FIG. 14H). The liquid flow channel 1505 formed in the liquid barrier wall 1500 is supplied by the liquid inlet 1455. The wick 1600 separates the liquid flow channel 1505 from the vapor removal channel 1465, which vapor removal channel passes through a vapor annulus 1475 (FIG. 14H) formed in the ring 1900. To 1460. The vapor channel 1465 may be photo-etched on the surface of the heated wall 1700.

  The evaporators disclosed herein can operate with any combination of materials, dimensions and arrangements as long as they embody the features described above. Without any limitation besides the above criteria, the evaporator can be made of any geometry and material. The only design limitations are that the applicable materials are compatible with each other, and the working fluid takes into account structural limitations, corrosion, non-condensable gas generation, and lifetime issues. Is to be selected.

  Many terrestrial applications may incorporate an LHP (LHP) with a ring evaporator 1100. The orientation of the annular evaporator in the gravitational field is predetermined by the nature of the application and the shape of the hot surface.

Cyclic heat exchange system (Cyclic Heat Exchange System)
A cyclic heat exchange system consists of one or more heat transfer systems to control the temperature in the area of the heat exchange system. The cyclic heat exchange system may be, for example, a cyclic heat exchange system, a Stirling heat exchange system (also known as a Stirling engine), or an air conditioning system. Any system operating using a thermodynamic cycle such as

  Referring to FIG. 20, the Stirling heat exchange system 2000 utilizes a known type of environmentally friendly and efficient refrigeration cycle. The Stirling system 2000 has four repeated operations: a heat addition operation at a constant temperature (constant temperature heat rejection operation), a constant volume heat rejection operation, and a heat removal operation at a constant temperature ( It works by directing a working fluid (eg, helium) through a constant temperature heat rejection operation and a constant volume heat addition operation at constant temperature.

  The Stirling System 2000 is a Global Cooling Model's model M100B {Asen, Ohio, 94N. Free Piston Stirling Cooler {designed as FPSC), such as Global Cooling Manufacturing (available from Global Cooling Manufacturing, 94N. Columbias Rd., Athens, Ohio), Columbus Road The The FPSC 2000 has a linear motor portion 2005 that houses a linear motor (not shown) that receives an AC power input 2010. The FPSC 2000 includes a heat acceptor 2015, a regenerator 2020, and a heat remover 2025. The FP2000 has a balance mass 2030 coupled to the body of the linear motor in the linear motor portion 2005 to absorb vibration during operation of the FPSC. The FCC 2000 has a charge port 2035. The FP2000 has internal components such as those shown in FPSC 2100 in FIG.

  The FPSC 2100 has a linear motor 2105 housed in the linear motor portion 2110. The linear motor portion 2110 houses a piston 2115 coupled at one end to a flat spring 2120 and at the other end to a displacer 2125. The displacer 2125 is coupled to an expansion space 2130 and a compression space 2135 that form the cold and hot sides, respectively. The heat receiving unit 2015 is installed on the cold side 2130, and the heat removing unit is installed on the hot side 2135. The FP 2100 also has a balance mass 2140 coupled to the linear motor portion 2110 to absorb vibration during operation of the FP 2100.

Referring to FIG. 22, in one embodiment, the SFP 2200 includes a heat removing portion 2205 made of copper sleeve and a heat receiving portion 2210 which may be a copper sleeve. The heat removal unit 2205 has an outer diameter of about 100 mm to provide a heat removal surface of 166 cm ² that can provide a heat flux of 6 W / cm ² when operating in a temperature range of 20-70 ° C. (OD)} and a width of about 53 mm. The heat receiving portion 2210 has an order of about 100 mm and a width of about 37 mm to provide a 115 cm ² heat receiving surface capable of providing a heat flux of 5.2 W / cm ² in a temperature range of −30-5 ° C. .

  In short, in operation, the FCC is filled with a coolant (such as helium gas), which is shuttled back and forth by the combined motion of the piston and the displacer. In an ideal system, heat energy is removed to the environment through the heat removal section while the coolant is compressed by the piston, and heat energy is removed from the environment through the heat receiving section while the coolant expands. Extracted.

  Referring to FIG. 23, a thermodynamic system 2300 includes a cyclic heat exchange system (eg, systems 2000, 2100, 2200) such as a cyclic heat exchange system 2305 and a portion 2315 of the cyclic heat exchange system 2305 with heat. Coupled heat transfer system 2310. The cyclic heat exchange system 2305 is cylindrical and the heat transfer system 2310 is shaped to surround a portion 2315 of the cyclic heat exchange system 2305 to remove heat from the portion 2315. In this embodiment, the portion 2315 is the hot side of the cyclic heat exchange system 2305 (ie, the heat removal section). The thermodynamic system 2300 is also positioned on the hot side of the cyclic heat exchange system 2305 to force air over the condenser of the heat transfer system 2310 and thus provide additional convective cooling. It has a fan 2320.

The cold side 2335 of the cyclic heat exchange system 2305 (ie, the heat receiver) is thermally coupled to a CO ₂ reluxer 2340 of a thermosyphon 2345. The thermosyphon 2345 is a cold-side heat exchanger configured to cool air in the thermodynamic system 2300 that is forced across the heat exchanger 2350 by a fan 2355. exchanger) 2350.

  Referring to FIG. 24, in another embodiment, the thermodynamic system 2400 includes a cyclic heat exchange system such as a cyclic heat exchange system 2405 (eg, the system 2000, 2100, 2200) and the cyclic heat exchange. A heat transfer system 2410 thermally coupled to the hot side 2415 of the system 2405. The thermodynamic system 2400 includes a heat transfer system 2420 that is thermally coupled to the cold side 2425 of the cyclic heat exchange system 2405. The thermodynamic system 2400 also includes fans 2430 and 2435. The fan 2430 is positioned on the hot side 2415 for pumping air through the condenser of the heat transfer system 2410. The fan 2435 is positioned on the cold side 2425 for pumping air through the condenser of the heat transfer system 2420.

  Referring to FIG. 25, in one embodiment, the thermodynamic system 2500 includes a heat transfer system 2505 coupled with a cyclic heat exchange system, such as a cyclic heat exchange system 2510. The heat transfer system 2505 is used to cool the hot side of the cyclic heat exchange system 2510. The heat transfer system 2505 includes an annular evaporator 2520 having an expansion volume (or reservoir) 2525, a liquid return line that provides fluid flow between the liquid outlet 2535 of the condenser 2540 and the liquid inlet of the evaporator 2520. 2530. The heat transfer system 2505 also has a vapor line 2545 that provides fluid flow between the vapor outlet of the evaporator 2520 and the vapor inlet 2550 of the condenser 2540.

  The condenser 2540 is made of smooth wall tubing and is equipped with heat exchange fins 2555 or fin stock to enhance heat exchange outside the tube.

  The evaporator 2520 is sandwiched between the heated wall 2565 and the liquid barrier wall 2570 and has a first wick 2560 that separates the liquid and the vapor. The liquid barrier wall 2570 is cold biased by heat exchange fins 2575 formed along the outer surface of the wall 2565. The heat exchange fin 2575 provides subcooling to the reservoir 2525 and the entire liquid side of the evaporator 2520. The heat exchange fin 2575 of the evaporator 2520 may be designed to be separated from the heat exchange fin 2555 of the condenser 2540.

A liquid return line 2530 extends into a reservoir 2525 disposed above the first wick 2560, and the liquid return line 2530 and a vapor removal channel at the interface between the first wick 2560 and the heated wall; If any, vapor bubbles are released into the reservoir 2525. Typically the working fluid for the heat transfer system 2505 includes methanol, butane, CO _2, propylene and ammonia (but not limited to).

  An evaporator 2520 is attached to the hot side 2515 of the cyclic heat exchange system 2510. In one embodiment, this attachment is integral so that the evaporator 2520 is an integral part of the cyclic heat exchange system 2510. In another embodiment, the attachment is not integral so that the evaporator 2520 can be clamped to the outer surface of the hot side 2510. The heat transfer system 2505 is cooled by a forced convection sink, which can be provided by a simple fan 2580. Alternatively, the heat transfer system 2505 is cooled by natural or draft convection.

  Initially, liquid phase working fluid is collected in the evaporator 2520, the liquid return line 2530, and the lower portion of the condenser 2540. The first wick 2560 is wet because of capillary forces. As soon as heat is applied (eg, the cyclic heat exchange system 2510 is switched on), the first wick 2560 begins to generate steam, which is the steam removal channel of the evaporator 2520 (steam of the evaporator 1100). (Similar to removal channel 1120), through the vapor outlet of the evaporator 2520, and into the vapor line 2545.

  Steam then enters the condenser 2540 at the top of the condenser 2540. The condenser 2540 condenses the vapor into a liquid that is collected at the bottom of the condenser 2540. The liquid is forced into the reservoir 2525 due to a pressure differential between the reservoir 2525 and the bottom of the condenser 2540. Liquid from the reservoir 2525 enters the liquid flow channel of the evaporator 2520. The liquid flow channel of the evaporator 2520 is configured like the channel 1125 of the evaporator 1100 and is appropriately sized and arranged to provide an appropriate liquid replacement for the vaporized liquid. The capillary pressure created by the first wick 2560 withstands the overall LHP pressure drop and prevents vapor bubbles from traveling through the first wick 2560 toward the liquid flow channel. Enough.

  If the cold bias discussed above is sufficient to compensate for increased heat leakage across the first wick 2560 caused by an increase in the surface area of the annulus heat exchange surface relative to the surface area of the liquid flow channel. If present, the liquid flow channel of the evaporator 2520 can be replaced by a simple ring.

  Referring to FIGS. 26-28, the heat transfer system 2600 has an evaporator 2605 coupled to a cyclic heat exchange system 2610 and an expansion volume 2615 coupled to the evaporator 2605. The vapor channel of the evaporator 2605 feeds a vapor line 2620 that feeds a series of channels 2625 in the condenser 2630. The condensed liquid from the condenser 2630 is collected in a liquid return channel 2635. The heat transfer system 2600 also has a fin stock 2640 that is thermally coupled to the condenser 2630.

  The evaporator 2605 includes a heated wall 2700, a liquid barrier wall 2705, a first wick 2710 positioned between the heated wall 2700 and the inside of the liquid barrier wall 2705, a vapor removal channel 2715, and a liquid flow channel 2720. The liquid barrier wall 2705 is coaxial with the first wick 2710 and the heated wall 2700. The liquid flow channel 2720 is supplied by a liquid return channel 2725 and the vapor removal channel 2715 is supplied into a vapor outlet 2730.

  The heated wall 2700 is in intimate contact with the first wick 2710. The liquid barrier wall 2705 contains a working fluid on the inside of the liquid barrier wall 2705 so that the working fluid flows only along the inside of the liquid barrier wall 2705. The liquid barrier wall 2705 closes the evaporator envelope and helps to organize and distribute the working fluid through the liquid flow channel 2720.

  In one embodiment, the evaporator 2605 has a height of about 2 inches and the expansion volume 2615 has a height of about 1 inch. The evaporator 2605 and the expansion volume 2615 are wound around a portion of a cyclic heat exchange system 2610 having an outer diameter of 10.16 cm (4 inches). The steam line 2620 has a radius of about 1/8 inch. The cyclic heat exchange system 2610 has about 58 condenser channels 2625, each condenser channel 2625 having a length of about 2 inches and a radius of about 0.012 inches. The channel 2625 is widened so that the width of the capacitor 2630 is approximately 40 inches. The liquid return channel 2725 has a radius of about 1/16 inch. The heat exchanger 2800 (with the condenser 2630 and the finstock 2640) is approximately 101.6 cm (40 inches) long and produces a cylindrical heat exchanger having an outer diameter of approximately 20.32 cm (8 inches). (See FIGS. 30, 33, and 34). The evaporator 2605 has a cross-sectional width 2750 defined by the heated wall 2700 and the liquid barrier wall 2705 of about 1/8 inch. The vapor removal channel 2715 has a width of about 0.020 inches and a depth of about 0.020 inches, and is about 25 channels per 25.4 mm to make 25 channels. They are separated from each other by 0.508 mm (0.020 inches).

  As described above, the heat transfer system (such as system 2310) is thermally coupled to a portion of the cyclic heat exchange system (such as portion 2315). Thermal coupling between the heat transfer system and the part is possible by any suitable method. In one embodiment, if the evaporator of the heat transfer system is thermally coupled to the hot side of the cyclic heat exchange system, the evaporator surrounds and contacts the hot side, and the hot side and the evaporator The thermal coupling may be made possible by a thermal grease compound placed between the two. In another embodiment, if the evaporator of the heat transfer system is thermally coupled to the hot side of the cyclic heat exchange system, the evaporator is connected to a steam channel into the hot side of the cyclic heat exchange system. May be made integrally with the hot side of the cyclic heat exchange system.

  With reference to FIGS. 30-32, the heat transfer system 3000 is packaged around a cyclic heat exchange system 3005. The heat transfer system 3000 has a condenser 3010 that surrounds an evaporator 3015. Vaporized working fluid exits the evaporator 3015 through a steam outlet 3020 connected to the condenser 3010. The capacitor 3010 loops around and doubles back inside itself at junction 3025 (doubles back inside itself).

  The cyclic heat exchange system 3005 is surrounded by an evaporator 3015 in the vicinity of the heat removal surface 3100. The evaporator 3015 is in intimate contact with the heat removal surface 3100. A refrigeration assembly (which is a combination of a cyclic heat exchange system 3005 and a heat transfer system 3000) is installed in the tube 3205, and the fan 3210 pumps air to the exhaust channel 3035 through the fin of the condenser 3010. Therefore, it is installed at the end of the tube 3205.

  The evaporator 3015 has a wick 3215 in which the working fluid absorbs heat from the heat removal surface 3100 and changes phase from liquid to vapor. The heat transfer system 3000 has a reservoir 3220 at the top of the evaporator 3015 that provides an expanded volume. For simplicity of illustration, the evaporator 3015 is illustrated in this figure as a simple hatched block that does not show internal details. Such internal details are discussed elsewhere in this description.

  The vaporized working fluid exits the evaporator 3015 through the vapor outlet 3020 and enters the vapor line 3040 of the condenser 3010. The working fluid flows down from the vapor line 3040 and through the channel 3045 of the condenser 3010 to the liquid return line 3050. As the working fluid flows through the channel 3045 of the condenser 3010, it loses heat through the fins to the air passing between the fins and changes phase from vapor to liquid. The air that has passed through the fin 3030 of the condenser 3010 flows away through an exhaust channel 3035. The liquefied working fluid {and possibly some uncondensed vapor} flows from the liquid return line 3050 through the liquid return port 3055 and back into the evaporator 3015.

  Referring to FIGS. 33 and 34, a heat transport system 3300 surrounds a portion of a cyclic heat exchange system 3302 that is in turn surrounded by an exhaust channel 3305. The heat transport system 3300 includes an evaporator 3310 having an upper portion surrounding the cyclic heat exchange system 3302. A steam port 3315 connects the evaporator 3310 to the steam line 3312 of the condenser 3320. The steam line 3312 has an outer region that swivels around the evaporator 3310 and then doubles back on itself at junction 3325 and swivels back around the evaporator 3310 in the opposite direction. Form an internal region. The heat transport system 3300 also has a cooling fin 3330 on the condenser 3320.

  The heat transport system 3300 also has a liquid return port 3400 that provides a path for condensed working fluid from the liquid line 3405 of the condenser 3320 to return to the evaporator 3310.

  As described above, the interface between the evaporator 3310 and the heat removal surface of the cyclic heat exchange system 3302 may be implemented by one of several alternative embodiments.

  Referring to FIG. 35, in one embodiment, the evaporator 3500 slips over the heat removal surface 3502 of the cyclic heat exchange system 3505. The evaporator 3500 has a heated wall 3510, a liquid barrier wall 3515, and a wick 3520 sandwiched between the walls 3510 and 3515. The wick 3520 is equipped with a vapor channel 3525 and a liquid flow channel 3530 is formed in the liquid barrier wall 3515 in a simple manner for clarity.

  The evaporator 3500 may be slid over the cyclic heat exchange system 3505 and held in position using a clamp 3600 (shown in FIG. 36). A thermally conductive grease is applied between the cyclic heat exchange system 3050 and the heated wall 3510 of the evaporator 3500 to assist in heat transfer. In an alternative embodiment, the vapor channel 3525 is formed in the heated wall 3510 instead of in the wick 3520.

  Referring to FIG. 37, in another embodiment, the evaporator 3700 is fitted with an interference fit onto the heat removal surface 3702 of the cyclic heat exchange system 3705. The evaporator 3700 includes a heated wall 3710, a liquid barrier wall 3715, and a wick 3720 sandwiched between the walls 3710 and 3715. The evaporator 3700 is sized to have an interference fit with the heat removal surface 3702 of the cyclic heat exchange system 3705.

  As the evaporator 3700 is heated, its inner diameter expands to allow the evaporator to slip over the unheated heat removal surface 3702. As the evaporator 3700 cools, it contracts to secure it in an interference fit on the cyclic heat exchange system 3705. Because of the tightness of the fit, no heat transfer grease is required to enhance heat transfer. The wick 3720 is equipped with a steam channel 3725. In an alternative embodiment, the vapor channel is formed in the heated wall 3710 instead of in the wick 3720. A liquid flow channel 3730 is formed in the liquid barrier wall 3715 in a simple form for clarity.

  Referring to FIG. 38, in another embodiment, the evaporator 3800 is fitted onto a heat removal surface 3802 of a cyclic heat exchange system 3805, and the previously designed features in the evaporator 3800 are now the heat removal surface. It is integrally formed in 3802. In particular, the evaporator 3800 and the heat removal surface 3802 are made together as an integrated assembly. The heat removal surface 3802 is modified to have a vapor channel 3825, and in this manner the heat removal surface 3802 acts as a heated wall for the evaporator 3800.

  The evaporator 3800 has a wick 3820 and a liquid barrier wall 3815 formed around the modified heat removal surface 3802, the wick 3820 and the liquid barrier wall 3815 comprising a sealed evaporator 3800. Bonded integrally to the heat removal surface 3802 to form. Liquid flow channel 3830 is drawn in a simplified form for clarity. In this way, a hybrid cyclical heat exchange system with an integrated evaporator is formed. This integral construction provides improved thermal properties compared to the clamp-on construction and the interference fit structure because the cyclic heat exchange system and the clump-on construction. This is because the thermal resistance with the evaporator wick is reduced.

  Referring to FIG. 29, graphs 2900 and 2905 show the maximum temperature of the surface of the cyclic heat exchange system to be cooled by the heat transfer system and the cooling of the heat transfer system and the cyclic heat exchange system. The relationship between the surface area of the interface between the part and the power is shown. The maximum temperature indicates the maximum amount of heat removal. In graph 2900, the interface between the portion and the heat transfer system was accomplished with a thermal grease compound. In graph 2905, the heat transfer system was made integral with the part.

As shown, with an air flow of about 8.495 m ³ / min (300 CFM) and if the interface is a thermally conductive grease interface, the maximum amount of heat removal is the heat exchange surface area 2910 {eg, about 9.29 m ² (100 ft ² )} will fall within a maximum heat removal surface temperature 2907 (eg, 70 ° C.). When the evaporator is made integral with the part by forming a vapor channel directly in the heat removal surface, the heat removal surface has a very small heat exchange surface area and the highest heat removal surface temperature of the thermal grease interface. Will work below.

  Referring to FIG. 39, a condenser 3900 is formed with fins 3905 that provide thermal communication between the air or environment and the vapor line 3910 of the condenser 3900. The steam line 3910 is coupled to a steam outlet 3915 that connects to an evaporator 3920 positioned within the condenser 3900.

  40-43, in one embodiment, the condenser 3900 is stacked and passes through a flat plate 4000 of the condenser 3900 between a vapor head 3925 and a liquid head 3930. Are formed with extending flow channels. Copper is a suitable material for use in making the multilayer capacitor. The laminated capacitor 3900 includes a base 4200 having a fluid flow channel 4205 formed therein, and a top layer 4210 is bonded to the base 4200 to cover and seal the fluid flow channel 4205. ing. The fluid flow channel 4205 is designed as a trench formed in the base 4200 and is sealed under the top layer 4210. The grooves for the fluid flow channel 4205 may be formed by chemical etching, electrochemical etching, machining, or electrical discharge machining processes.

  44-45, in another embodiment, the condenser 3900 is extruded and a small flow channel 4400 extends through the flat plate 4405 of the condenser 3900. Aluminum is a suitable material for use in such extruded capacitor. The extruded flat plate 4405 with microchannels extends between the vapor header 4410 and the liquid header 4415. In addition, corrugated finstock 4420 is bonded {eg, brazed or epoxyd) to both sides of the flat plate 4405.

  Reference is made to FIG. 46, which is a cross-sectional view of one side of a heat transfer system 4600 coupled to a cyclic heat exchange system 4605. This figure shows the relative dimensions that provide a particularly compact packaging of the heat transfer system. In this figure, fins 4610 are drawn 90 degrees out of phase for ease of illustration. In order to cool the heat removal surface 4615 of the cyclic heat exchange system 4605 having a diameter of about 10.16 cm (4 inches), the evaporator 4620 has a thickness of about 0.25 inches. The radial thickness of the capacitor is approximately 1.75 inches. This provides an overall dimension of about 8 inches of packaging (combination of heat transfer system 4600 and cyclic heat exchange system 4605).

  As discussed, the evaporator used in the heat transfer system is equipped with a wick. Since a wick is used in the evaporator of the heat transfer system, the condenser may be located anywhere with respect to the evaporator and with respect to gravity. For example, the condenser may be positioned above the evaporator (relative to the pull of gravity), below the evaporator (relative to the pull of gravity), or adjacent to the evaporator, and thus the same gravity as the evaporator Receive a pull.

  Other embodiments are within the scope of the following claims.

  Note that the terms Stirling engine, Stirling heat exchange system, and free piston Stirling cooler were cited in the above examples. However, the features and principals described in connection with these embodiments may be applied to other engines that can convert between mechanical energy and thermal energy.

  Furthermore, the features and main points of the above description are that any heat engine, such as a thermodynamic system that can experience a cycle, ie a sequence of transformations that ultimately returns it to its original state ( (heat engine) may also be applied. If all transformations in the cycle are reversible, the cycle is reversible and the heat transfer occurs in the opposite direction, and the amount of work done switches the symbol. The simplest reversible cycle is the Carnot cycle, which exchanges heat with two heat reservoirs.

1 is a schematic diagram of a heat transfer system. FIG. 2 is a diagram of an embodiment of a heat transfer system schematically illustrated by FIG. 1. Fig. 2 shows a flow diagram of the progress of heat transfer using a heat transfer system. 4 is a graph showing temperature changes of various components of the heat transfer system during the process flow of FIG. FIG. 2 is a diagram of a three-port main evaporator shown in the heat transfer system of FIG. 1. It is sectional drawing of the main evaporator obtained along 5B-5B of FIG. 5A. FIG. 2 is a diagram of a 4-port main evaporator that can be integrated into the heat transfer system shown in FIG. 1. 1 is a schematic diagram of one embodiment of a heat transfer system. It is a perspective view of the application example which uses a heat transfer system. FIG. 8C is a cross-sectional view of the fluid conduit taken along 8C-8C of FIG. 8A. 9 is a schematic diagram of an embodiment of the heat transfer system of FIGS. 8A and 9A, respectively. It is a perspective view of the application example which uses a heat transfer system. It is sectional drawing of a planar evaporator. It is an axial sectional view of an annular evaporator. It is radial direction sectional drawing of the annular evaporator of FIG. FIG. 13 is an enlarged view of a portion of the radial cross section of the annular evaporator of FIG. 12. It is a perspective view of the annular evaporator of FIG. FIG. 14B is a partially cut away plan view of the annular evaporator of FIG. 14A. FIG. 14B is an enlarged cross-sectional view of a portion of the annular evaporator of FIG. 14B. 14D is a cross-sectional view taken along line 14D-14D of the annular evaporator of FIG. 14B. FIG. 14D is an enlarged view of a portion of the annular evaporator of FIG. 14D. FIG. 14B is a cut perspective view of the annular evaporator of FIG. 14A. 14B is a detailed cut perspective view of the annular evaporator of FIG. 14G. FIG. 14B is a flat detail view of a liquid barrier formed in the shell ring element of the annular evaporator of FIG. 14A. FIG. FIG. 15B is a cross-sectional view taken along line 15B-15B of the fluid barrier of FIG. 15A. FIG. 14B is a perspective view of a primary wick of the annular evaporator of FIG. 14A. FIG. 16B is a plan view of the primary wick of FIG. 16A. FIG. 17C is a cross-sectional view taken along line 16C-16C of the primary wick of FIG. 16B. FIG. 17D is an enlarged view of a portion of the primary wick of FIG. 16C. FIG. 14B is a perspective view of a heated wall formed in the annular ring of the annular evaporator of FIG. 14A. FIG. 17B is a plan view of the heated wall of FIG. 17A. FIG. 18B is a cross-sectional view taken along line 17C-17C of the heated wall of FIG. 17B. FIG. 17B is an enlarged view of a portion of the heated wall of FIG. 17C. FIG. 17B is a perspective view of the ring separating the heated wall of FIG. 17A from the liquid barrier of FIG. 15A. FIG. 18B is a plan view of the ring of FIG. 18A. FIG. 19 is a cross-sectional view taken along line 18-18C of the ring of FIG. 18B. FIG. 18C is an enlarged view of a portion of the ring of FIG. 18C. FIG. 14B is a perspective view of the ring of the annular evaporator of FIG. 14A. FIG. 19B is a plan view of the ring of FIG. 19A. FIG. 19B is a cross-sectional view taken along line 19C-19C of the ring of FIG. 19B. FIG. 20 is an enlarged view of a portion of the ring of FIG. 19C. 1 is a perspective view of a periodic heat exchange system that can be cooled using a heat transfer system. FIG. FIG. 21 is a cross-sectional view of a periodic heat exchange system, such as the periodic heat exchange system of FIG. FIG. 21 is a side view of a periodic heat exchange system, such as the periodic heat exchange system of FIG. 20. 1 is a schematic illustration of a first embodiment of a periodic heat exchange system having a periodic heat exchange system and a heat transfer system. 2 is a schematic diagram of a second embodiment of a periodic heat exchange system having a periodic heat exchange system and a heat transfer system. 14 is a schematic diagram of a heat transfer system using an evaporator designed according to the principles of FIGS. It is an exploded view by the function of the heat transfer system of FIG. FIG. 26 is a partial detailed cross-sectional view of an evaporator used in the heat transfer system of FIG. 25. It is a perspective view of the heat exchanger used in the heat transfer system of FIG. FIG. 6 is a graph of the surface area of an intermediate surface between a heat transfer system and a heat source of a periodic heat exchange system versus temperature of the heat source of the periodic heat exchange system. 1 is a plan view of a heat transfer system packaged around a portion of a periodic heat exchange system. FIG. FIG. 31 is a partial cross-sectional elevational view (taken along line 31-31) of a heat transfer system packaged around the periodic heat exchange system of FIG. 30. FIG. 31 is an elevational view in partial section (obtained in detail 3200) of an intermediate surface between the heat transfer system of FIG. 30 and a periodic heat exchange system. 2 is a top perspective view of a heat transfer system attached to a periodic heat exchange system. FIG. FIG. 34 is a bottom perspective view of a heat transfer system attached to the periodic heat exchange system of FIG. 33. FIG. 3 is a partial cross-sectional view of an intermediate surface between an evaporator and a periodic heat exchange system of a heat transfer system with the evaporator clamped on the periodic heat exchange system. FIG. 36 is a side view of a clamp used to clamp an evaporator on the periodic heat exchange system of FIG. 35. FIG. 3 is a partial cross-sectional view of an intermediate surface between an evaporator and a periodic heat exchange system of the heat transfer system, formed by an interference fit between the evaporator and the periodic heat exchange system; is there. FIG. 3 is a partial cross-sectional view of an intermediate surface between an evaporator of a heat transfer system and the system by periodic heat exchange and formed by forming an evaporator integrally with the periodic heat exchange system; . It is a top view of the condenser of a heat transfer system. FIG. 40 is a partial cross-sectional view taken along line 40-40 of the condenser of FIG. 39. It is detailed sectional drawing of the condenser which has a laminated structure. It is detail sectional drawing of the condenser which has an extrusion structure. It is a detailed cross-sectional perspective view of the condenser which has an extrusion structure. FIG. 2 is a cross-sectional view of one side of a heat transfer system that is packaged around a periodic heat exchange system. Like numbers refer to like elements in the various drawings.

Claims (18)

A heat transfer system for a periodic heat exchange system, operating using a thermodynamic cycle,
A wall configured to be thermally coupled to a portion of the periodic heat exchange system to control a temperature of the portion of the periodic heat exchange system, and a primary wick fluidly coupled to the wall An evaporator coupled to the expansion volume, and a condenser fluidly coupled to the evaporator to form a closed loop containing a working fluid for the heat transfer system;
The condenser comprises a vapor inlet and a liquid outlet, a vapor line providing communication between the vapor outlet and the vapor inlet, and a liquid return line providing communication between the liquid outlet and the liquid inlet. Prepared,
The evaporator and expansion volume are arranged to wrap around a portion of the periodic heat exchange system;
The evaporator
A liquid barrier containing the working fluid inside the liquid barrier such that the working fluid flows only along the inside of the liquid barrier and having a primary wick disposed between the wall and the inside of the liquid barrier;
A steam discharge passage disposed in an intermediate common plane between the primary wick and the wall;
And a fluid flow path disposed between the wall of the liquid barrier and the primary wick and receiving liquid from the liquid inlet .   The heat transfer system of claim 1, wherein the working fluid is passively moved through the heat transfer system.   The heat transfer system of claim 2, wherein the working fluid is moved through the heat transfer system without the use of an external pump.   The working fluid changes between liquid and vapor when the working fluid passes or is in one or more of an evaporator, a condenser, a vapor line and a liquid return line. The heat transfer system according to claim 1.   The heat transfer system of claim 1, wherein the evaporator is annular in shape and surrounds a portion of the periodic heat transfer system.   The heat transfer system of claim 1, wherein the working fluid is moved through the heat transfer system by use of a wick.   The heat transfer system of claim 1, further comprising fins thermally coupled to the condenser for removing heat to the surrounding environment. A periodic heat exchange system , and a heat transfer system thermally coupled to the periodic heat exchange system to cool a portion of the periodic heat exchange system;
The heat transfer system comprises an evaporator that surrounds a portion of the periodic heat exchange system;
The evaporator
A wall configured to be thermally coupled to a portion of the periodic heat exchange system;
A primary wick fluidly coupled to the wall;
A steam discharge passage disposed intermediate between the primary wick and the wall;
A liquid barrier containing the working fluid inside the liquid barrier such that the working fluid flows only along the inside of the liquid barrier and having a primary wick disposed between the wall and the inside of the liquid barrier;
A steam discharge passage disposed in an intermediate common plane between the primary wick and the wall;
A fluid flow path disposed between the wall of the liquid barrier and the primary wick and receiving liquid from the liquid inlet;
A condenser fluidly coupled to the evaporator to form a closed loop containing a working fluid for a heat transfer system;
The condenser comprises a vapor inlet and a liquid outlet, a vapor line providing communication between the vapor outlet and the vapor inlet, and a liquid return line providing communication between the liquid outlet and the liquid inlet. A thermodynamic system characterized by comprising.   The thermodynamic system of claim 8, wherein the evaporator is integrated with a periodic heat exchange system.   The thermodynamic system of claim 8, wherein the evaporator is fastened to the periodic heat exchange system.   The thermodynamic system of claim 8, wherein the periodic heat exchange system comprises a Stirling heat exchange system.   The thermodynamic system of claim 8, wherein the periodic heat exchange system comprises a refrigeration system.   The thermodynamic system of claim 8, wherein the heat transfer system is coupled to a high temperature side of the periodic heat exchange system.   The thermodynamic system of claim 8, wherein the heat transfer system is coupled to a cold side of the periodic heat exchange system. A method for controlling the temperature of a portion of a periodic heat exchange system comprising:
Thermally coupling the evaporator wall coupled to the expansion volume to the periodic heat exchange system to control the temperature of a portion of the periodic heat exchange system;
Fluidly coupling the primary wick to the wall,
Fluidly coupling the condenser to the evaporator to form a closed loop containing a working fluid for the heat transfer system;
The condenser comprises a vapor inlet and a liquid outlet, a vapor line providing communication between the vapor outlet and the vapor inlet, and a liquid return line providing communication between the liquid outlet and the liquid inlet. Prepared,
The evaporator and expansion volume are arranged to wrap around a portion of the periodic heat exchange system to thermally couple the wall to the periodic heat exchange system;
The evaporator contains a working fluid inside the liquid barrier so that the working fluid flows only along the inside of the liquid barrier, and a liquid barrier in which a primary wick is disposed between the wall and the inside of the liquid barrier. And a vapor discharge passage disposed on an intermediate common surface between the primary wick and the wall, and a fluid flow path disposed between the wall of the liquid barrier and the primary wick and receiving liquid from the liquid inlet And a method comprising:   The heat transfer system of claim 1 wherein a portion is a heat removal surface of a cylindrical heat exchange system and the evaporator has an inner diameter that expands to slide over the portion.   The heat transfer system of claim 1, wherein the cylindrical heat exchanger has one cylindrical heat exchange system.   The heat transfer system of claim 1 wherein the evaporator wall is thermally connected to the outer wall of the cylindrical heat exchange system portion.

Images