AU2001277174A1 - High-efficiency computer thermal management apparatus and method - Google Patents

High-efficiency computer thermal management apparatus and method

Info

Publication number
AU2001277174A1
AU2001277174A1 AU2001277174A AU7717401A AU2001277174A1 AU 2001277174 A1 AU2001277174 A1 AU 2001277174A1 AU 2001277174 A AU2001277174 A AU 2001277174A AU 7717401 A AU7717401 A AU 7717401A AU 2001277174 A1 AU2001277174 A1 AU 2001277174A1
Authority
AU
Australia
Prior art keywords
management apparatus
thermal management
efficiency computer
computer thermal
efficiency
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001277174A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ADVANCED TECHNOLOGIES Ltd
Original Assignee
ADVANCED TECHNOLOGIES Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ADVANCED TECHNOLOGIES Ltd filed Critical ADVANCED TECHNOLOGIES Ltd
Publication of AU2001277174A1 publication Critical patent/AU2001277174A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Sustainable Development (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
AU2001277174A 2000-07-27 2001-07-26 High-efficiency computer thermal management apparatus and method Abandoned AU2001277174A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US62716300A 2000-07-27 2000-07-27
US09627163 2000-07-27
US67950700A 2000-10-05 2000-10-05
US09679507 2000-10-05
PCT/US2001/023446 WO2002010661A1 (en) 2000-07-27 2001-07-26 High-efficiency computer thermal management apparatus and method

Publications (1)

Publication Number Publication Date
AU2001277174A1 true AU2001277174A1 (en) 2002-02-13

Family

ID=27090353

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001277174A Abandoned AU2001277174A1 (en) 2000-07-27 2001-07-26 High-efficiency computer thermal management apparatus and method

Country Status (3)

Country Link
AU (1) AU2001277174A1 (en)
TW (1) TW505776B (en)
WO (1) WO2002010661A1 (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7004240B1 (en) 2002-06-24 2006-02-28 Swales & Associates, Inc. Heat transport system
US7931072B1 (en) 2002-10-02 2011-04-26 Alliant Techsystems Inc. High heat flux evaporator, heat transfer systems
US8109325B2 (en) 2000-06-30 2012-02-07 Alliant Techsystems Inc. Heat transfer system
US7549461B2 (en) 2000-06-30 2009-06-23 Alliant Techsystems Inc. Thermal management system
US8136580B2 (en) * 2000-06-30 2012-03-20 Alliant Techsystems Inc. Evaporator for a heat transfer system
US7251889B2 (en) 2000-06-30 2007-08-07 Swales & Associates, Inc. Manufacture of a heat transfer system
US8047268B1 (en) 2002-10-02 2011-11-01 Alliant Techsystems Inc. Two-phase heat transfer system and evaporators and condensers for use in heat transfer systems
ATE319972T1 (en) 2000-06-30 2006-03-15 Swales Aerospace PHASE CONTROL IN A CAPILLARY EVAPORATOR
US7708053B2 (en) 2000-06-30 2010-05-04 Alliant Techsystems Inc. Heat transfer system
ATE420333T1 (en) * 2002-10-02 2009-01-15 Swales & Associates Inc EVAPORATOR FOR A HEAT TRANSFER SYSTEM
AU2003285045A1 (en) * 2002-10-28 2004-05-25 Swales And Associates, Inc. Heat transfer system
US7126822B2 (en) 2003-03-31 2006-10-24 Intel Corporation Electronic packages, assemblies, and systems with fluid cooling
US6845625B1 (en) * 2003-10-01 2005-01-25 Intel Corporation Reversible two-phase and refrigeration loop
CN100457379C (en) * 2003-10-28 2009-02-04 斯沃勒斯联合公司 Manufacture of a heat transfer system
US7661464B2 (en) 2005-12-09 2010-02-16 Alliant Techsystems Inc. Evaporator for use in a heat transfer system
JP2008085144A (en) * 2006-09-28 2008-04-10 Sanyo Electric Co Ltd Cooler
CN107219905A (en) * 2017-05-27 2017-09-29 崔启煜 A kind of efficient radiating apparatus in computer cabinet
TWI709209B (en) 2019-10-25 2020-11-01 研能科技股份有限公司 Liquid heat dissipation module
TWI722838B (en) * 2020-03-18 2021-03-21 英業達股份有限公司 Electronic device and fluid driving device
US11622471B2 (en) * 2021-06-24 2023-04-04 Quanta Computer Inc. Cooling method for a cold plate module
TWI824552B (en) * 2022-06-08 2023-12-01 英業達股份有限公司 Liquide cooling device and liquide cooling system

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2723187B1 (en) * 1994-07-29 1996-09-27 Centre Nat Etd Spatiales ENERGY TRANSFER SYSTEM BETWEEN A HOT SOURCE AND A COLD SOURCE

Also Published As

Publication number Publication date
TW505776B (en) 2002-10-11
WO2002010661A1 (en) 2002-02-07

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