WO2024021719A1

WO2024021719A1 - Vapor chamber and electronic device

Info

Publication number: WO2024021719A1
Application number: PCT/CN2023/091296
Authority: WO
Inventors: 吴召洪
Original assignee: 荣耀终端有限公司
Priority date: 2022-07-29
Filing date: 2023-04-27
Publication date: 2024-02-01
Also published as: CN117529010A

Abstract

The present application discloses a vapor chamber and an electronic device. The vapor chamber comprises a first cover plate and a second cover plate, the second cover plate is snap-fitted to the first cover plate to form a sealed cavity, at least one composite capillary structure is arranged in the sealed cavity at intervals, and steam channels are formed on two sides of each composite capillary structure. The composite capillary structure comprises a porous capillary structure and a channel capillary structure which are both filled with a cooling medium. The steam channels and the composite capillary structure are of a left-right parallel structure, and the overall height of the vapor chamber can be decreased by decreasing the height of the composite capillary structure, so as to achieve lightening and thinning. Meanwhile, by adoption of composite design of the porous capillary structure and the channel capillary structure, the high capillary force action of the porous capillary structure and the high permeability of the channel capillary structure are utilized, so that the composite capillary structure can decrease the flow resistance of working medium transmission and promote rapid transmission of a working medium, thereby realizing reduction of the overall thickness of the vapor chamber without attenuation of performance, and meeting the lightening and thinning requirements for an electronic device.

Description

A kind of vapor chamber and electronic equipment

This application claims priority to the Chinese patent application submitted to the State Intellectual Property Office on July 29, 2022, with the application number 202210910720.6 and the invention title "A vapor chamber and electronic equipment", the entire content of which is incorporated by reference in in this application.

Technical field

The present application relates to the technical field of terminal equipment, and in particular to a vapor chamber and electronic equipment.

Background technique

The vapor chamber (VC for short) is a heat dissipation device that can be used in electronic equipment, including mobile phones, tablets, laptops, etc. The inner wall of the vapor chamber has a capillary structure filled with cooling medium. The vapor chamber can use the cooling medium to quickly and evenly dissipate the heat of the mobile phone system chip, and then use the capillary action of the capillary structure to return the cooling medium to the heat source, thereby reducing the temperature of the mobile phone and ensuring that the mobile phone will not affect the user's use due to excessive temperature. .

As the trend of thinner and lighter electronic equipment has become the mainstream, the heat dissipation devices used in corresponding electronic equipment must be thinned simultaneously to meet the demand for thinner and lighter electronic equipment. However, the current thickness of the vapor chamber is generally ≥0.30mm. The vapor chamber is too thick and cannot meet the needs of the development of thinner and lighter electronic equipment.

Contents of the invention

This application provides a vapor chamber and electronic equipment to solve the problem that the vapor chamber is too thick and cannot ensure the thinness and lightness of electronic equipment.

In a first aspect, the application provides a vapor chamber, including: a first cover plate; a second cover plate, the second cover plate is buckled on the first cover plate to form a sealed cavity, and the The inside of the sealed cavity is a negative pressure environment; a composite capillary structure, at least one of the composite capillary structures is arranged at intervals in the sealed cavity, and each of the composite capillary structures is in contact with the first cover plate and the second Between the cover plates; at least one of the composite capillary structures separates the sealed cavity into at least one sub-cavity, which is used to form a steam channel; the composite capillary structure includes a porous capillary structure and a channel capillary structure, the porous capillary structure and the channel capillary structure are connected, the porous capillary structure and the channel capillary structure are filled with cooling medium, the cooling medium is between the channel capillary structure, the porous capillary structure and Gas-liquid circulation occurs between the steam channels. Here, the composite capillary structure and the steam channel in the vapor chamber are parallel structures. By reducing the height of the composite wick structure, the overall height of the vapor chamber can be reduced and made thinner and lighter. At the same time, the composite design of porous capillary structure and channel capillary structure is adopted, using the high capillary force of the porous capillary structure and the high permeability of the channel capillary structure, so that the composite capillary structure can reduce the flow resistance of the working fluid transmission and promote the process. The rapid transportation of quality enables the overall thickness of the vapor chamber to be thinned without performance degradation, thus meeting the demand for thinner and lighter electronic equipment.

In the embodiment of the present application, the porous capillary structure is located above the channel capillary structure; the porous capillary structure is in contact between the first cover plate and the channel capillary structure, and the channel capillary structure The structure is in contact between the porous capillary structure and the second cover plate, and communication between the porous capillary structure and the channel capillary structure is achieved through the cooling medium. Here, the porous capillary structure is responsible for heating itself and the cooling medium in the channel capillary structure to generate The steam is transferred to the steam channel, and the porous capillary structure absorbs the liquid condensed when the steam encounters cold and transfers it to the channel capillary structure, thereby realizing the gas-liquid circulation of the cooling medium.

In the embodiment of the present application, the channel capillary structure includes at least one cylinder and at least one channel, each of the cylinders is arranged at intervals, and one end of each of the cylinders is connected to the porous capillary structure. The other ends of each of the columns are connected to the second cover; the channel is formed between two adjacent columns, and the cooling medium is filled in the channel. Here, the channel capillary structure includes several channels, and each channel is filled with cooling medium. When heated to generate steam, it can simultaneously dissipate a large amount of heat generated by the electronic device and improve the heat dissipation efficiency.

In the embodiment of the present application, the vapor chamber includes a low-temperature area and a high-temperature area; in the high-temperature area, the cooling medium in the channel absorbs heat to generate the first steam, and the cooling medium in the porous capillary structure absorbs heat to generate the second steam. Steam, the first steam passes through the porous capillary structure and is combined with the second steam and is transferred to the steam channel. The steam channel transfers the first steam and the second steam to the low temperature area to achieve heat transfer. Dispersion; in the low-temperature area, the first steam and the second steam in the steam channel are condensed into cooling medium, and the cooling medium flows back to the high-temperature area through the porous capillary structure and the channel capillary structure to realize gas-liquid circulation. Here, gas-liquid circulation is realized through the gas-liquid two-phase change of the cooling medium, so that the heat in the high-temperature area of the vapor chamber is conducted to the low-temperature area and dissipated.

In the embodiment of the present application, the porous capillary structure is located on one side of the channel capillary structure, and the porous capillary structure is in contact between the first cover plate and the second cover plate, and the channel One end of the capillary structure is connected to the second cover plate, and the other end of the channel capillary structure is spaced apart from the first cover plate. Here, the composite capillary structure adopts a left-right structure. The multiple channels of the channel capillary structure are directly connected to different steam channels. The steam generated by the cooling medium in the channel when heated can be simultaneously transferred to the steam channels on both sides of itself, which is more efficient. .

In this embodiment of the present application, the channel capillary structure includes at least one cylinder and at least one channel, and each of the cylinders is spaced on opposite sides of the porous capillary structure, and the cylinder is connected to the porous capillary structure. The channels are formed between porous capillary structures, and the cooling medium is filled in the channels; in the high-temperature area of the vapor chamber, the cooling medium in the channels generates first steam after absorbing heat, and transfers it to the in the steam channel, and the cooling medium in the porous capillary structure generates second steam after absorbing heat and transfers it to the steam channel, and the steam channel transfers the first steam and the second steam to the low temperature area, Realize heat dissipation; in the low-temperature area of the vapor chamber, the first steam and the second steam in the steam channel are condensed into cooling medium, and the cooling medium flows back to high temperature through the porous capillary structure and the channel capillary structure area to achieve gas-liquid circulation. Here, gas-liquid circulation is realized through the gas-liquid two-phase change of the cooling medium, so that the heat in the high-temperature area of the vapor chamber is conducted to the low-temperature area and dissipated.

In the embodiment of the present application, the channel capillary structure includes several columns and at least one channel. Each of the columns is spaced apart on the same side of the porous capillary structure. Two adjacent columns The channel is formed between the column and the porous capillary structure, and each channel is filled with the cooling medium; in the high temperature area of the vapor chamber, the channel The cooling medium in the channel generates the first steam after absorbing heat and transfers it to the steam channel; and the cooling medium in the porous capillary structure generates the second steam after absorbing heat and transfers it to the steam channel. , the steam channel transfers the first steam and the second steam to the low-temperature area to realize the dissipation of heat; in the low-temperature area of the vapor chamber, the first steam and the second steam in the steam channel are condensed into cooling medium, the The cooling medium flows back to the high-temperature area through the porous capillary structure and the channel capillary structure to realize gas-liquid circulation. Through the gas-liquid two-phase change of the cooling medium, gas-liquid circulation is realized, so that the heat in the high-temperature area of the vapor chamber is conducted to the low-temperature area and dissipated.

In the embodiment of the present application, the number of the channels is 1 to 3, and the width of each of the channels is different, or each channel has a different width. The widths of the channels are the same. Here, multiple channels are provided to reduce liquid phase resistance and improve liquid phase medium return efficiency.

In the embodiment of the present application, the channel capillary structure and the second cover plate are integrally formed through an etching process, which can ensure the stability of the channel capillary structure.

In the embodiment of the present application, the width of the steam channel is 0.5 to 2 times the width of the composite capillary structure, which can ensure the steam transfer rate and thereby improve the heat dissipation efficiency.

In the embodiment of the present application, the sealed cavity is further provided with a support column, the support column is in contact between the first cover plate and the second cover plate, and the support column is used to maintain the The shape of the sealed cavity. Here, the support column can be used to resist the deformation of the vapor chamber caused by the difference in internal and external atmospheric pressure and other external forces, so as to prevent the steam channel and the composite capillary structure from being crushed and causing the vapor chamber to fail.

In a second aspect, this application provides an electronic device, including a body, a housing, and the vapor chamber described in the first aspect. Here, the composite capillary structure and the steam channel in the vapor chamber are parallel structures. By reducing the height of the composite wick structure, the overall height of the vapor chamber can be reduced and made thinner and lighter. At the same time, the composite design of porous capillary structure and channel capillary structure is adopted, using the high capillary force of the porous capillary structure and the high permeability of the channel capillary structure, so that the composite capillary structure can reduce the flow resistance of the working fluid transmission and promote the process. The rapid transportation of quality enables the overall thickness of the vapor chamber to be thinned without performance degradation, thus meeting the demand for thinner and lighter electronic equipment.

An embodiment of the present application provides a vapor chamber and electronic equipment. The vapor chamber includes a first cover plate and a second cover plate. The second cover plate is fastened to the first cover plate to form a sealed cavity. In the sealed cavity At least one composite capillary structure is spaced in the body, and steam channels are formed on both sides of each composite capillary structure. The composite capillary structure includes interconnected porous capillary structures and channel capillary structures. Both the porous capillary structure and the channel capillary structure are filled with cooling medium. The steam generated by the cooling medium when heated can be transferred to the steam channels on both sides of the composite capillary structure at the same time. That is, the same steam channel can receive the steam from the adjacent two sides of the composite capillary structure. The steam generated when the medium cooling medium is heated has a higher transmission rate and thus a higher heat dissipation efficiency; and the steam channel and the composite capillary structure are left and right parallel structures. The overall height of the vapor chamber can be reduced by reducing the height of the composite capillary structure to achieve Light and thin. At the same time, the composite design of porous capillary structure and channel capillary structure is adopted, using the high capillary force of the porous capillary structure and the high permeability of the channel capillary structure, so that the composite capillary structure can reduce the flow resistance of the working fluid transmission and promote the process. The rapid transportation of quality enables the overall thickness of the vapor chamber to be thinned without performance degradation, thus meeting the demand for thinner and lighter electronic equipment.

Description of drawings

In order to explain the technical solution of the present application more clearly, the drawings required to be used in the embodiments will be briefly introduced below. It is obvious that for those of ordinary skill in the art, without exerting any creative effort, Other drawings can also be obtained from these drawings.

Figure 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.

Figure 2 is a schematic structural diagram of a first vapor chamber provided by an embodiment of the present application.

Figure 3 is a schematic structural diagram of the first composite capillary structure provided by the embodiment of the present application.

Figure 4 is a schematic diagram of the size marks of the first composite capillary structure provided by the embodiment of the present application.

FIG. 5A is a schematic diagram of the heat dissipation path during the working medium evaporation stage of the first vapor chamber provided by the embodiment of the present application.

FIG. 5B is a schematic diagram of the heat dissipation path during the working fluid condensation stage of the first vapor chamber provided by the embodiment of the present application.

Figure 6 is a schematic structural diagram of a second vapor chamber provided by an embodiment of the present application.

Figure 7 is a schematic structural diagram of the second composite capillary structure provided by the embodiment of the present application.

FIG. 8A is a schematic diagram of the heat dissipation path during the evaporation stage of the working medium of the second vapor chamber provided by the embodiment of the present application.

FIG. 8B is a schematic diagram of the heat dissipation path during the working fluid condensation stage of the second vapor chamber provided by the embodiment of the present application.

Figure 9 is a schematic structural diagram of a third vapor chamber provided by an embodiment of the present application.

Figure 10 is a schematic structural diagram of the third composite capillary structure provided by the embodiment of the present application.

FIG. 11A is a schematic diagram of the heat dissipation path during the working medium evaporation stage of the third vapor chamber provided by the embodiment of the present application.

FIG. 11B is a schematic diagram of the heat dissipation path during the working fluid condensation stage of the third vapor chamber provided by the embodiment of the present application.

Figure 12 is a schematic structural diagram of a fourth vapor chamber provided by an embodiment of the present application.

Figure 13 is a schematic structural diagram of the fourth composite capillary structure provided by the embodiment of the present application.

Figure 14 is a schematic structural diagram of a fifth vapor chamber provided by an embodiment of the present application.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. Based on the embodiments of the present application, other embodiments obtained by those of ordinary skill in the art without any creative work shall fall within the protection scope of the present application.

Hereinafter, the terms “first”, “second”, etc. are used for descriptive purposes only and shall not be understood as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features. Thus, features defined by "first," "second," etc. may explicitly or implicitly include one or more of such features. In the description of this application, unless otherwise stated, "plurality" means two or more.

In addition, in this application, directional terms such as "upper", "lower", "top", and "bottom" are defined relative to the schematically placed directions of the components in the drawings. It should be understood that these directional terms are relative concepts, which are used for relative description and clarification, and may change accordingly according to changes in the orientation of the components in the drawings.

Electronic devices described in the embodiments of the present application include but are not limited to mobile phones, notebook computers, tablet computers, laptop computers, personal digital assistants or wearable devices. The following description takes the electronic device as a mobile phone.

As shown in FIG. 1 , an electronic device 100 includes a body 101 and a shell 102 . The shell 102 is installed on the body 101 . For example, the shell 102 and the body 101 can be installed by welding. The housing 102 may be a battery cover of the electronic device 100, and the battery cover is close to the battery of the display device. The body 101 may include system chips, batteries and other components, which generate heat during operation. To achieve heat dissipation, a vapor chamber 200 can be provided on the housing 102 or the body 101, and the heat generated by the electronic device 100 can be dissipated through the vapor chamber 200.

The vapor chamber 200 is usually also called a vapor chamber, a superconducting thermal plate, a thermal conductive plate, etc. Vapor chamber (VC for short) uses the liquid phase boiling phase of the working medium (cooling medium) in the sealed cavity to change into the gas phase to absorb heat, and the gas phase condensation to the liquid phase to release heat. Capillary force is used as the liquid phase working fluid transport. The movement force completes the phase change cycle of the gas-liquid phase in the hot and cold areas (high and low temperature areas) of the vapor chamber, thereby achieving efficient heat exchange by utilizing latent heat of phase change, heat conduction, convection and other methods.

The vapor chamber 200 provided in the embodiment of the present application is applied to electronic equipment and related modules, structural parts, functional parts, etc. with heat dissipation functions.

As electronic devices 100 become lighter and thinner, corresponding heat dissipation devices (such as the vapor chamber 200 ) used in the electronic device 100 must be thinned simultaneously. The thickness of the currently commonly used vapor chamber 200 is generally ≥0.30 mm. This vapor chamber 200 is too thick and cannot meet the needs of the development of thinner and lighter electronic devices 100 .

In order to reduce the thickness of the vapor chamber 100, an embodiment of the present application provides a vapor chamber 200 that adopts a composite capillary structure. plan. The composite capillary structure includes a porous capillary structure and a channel capillary structure. The porous capillary structure can provide high capillary force, and the channel capillary structure has high permeability. The composite capillary structure with high capillary force and high permeability can reduce the flow resistance of the working fluid transmission, promote the rapid transportation of the working fluid, and achieve the thinning of the overall thickness of the vapor chamber 200 without deteriorating the performance, thus meeting the needs of electronics. The demand for device 100 to be thinner and lighter. In the embodiment of the present application, the thickness of the vapor chamber 200 is less than 0.3 mm. For example, the thickness of the vapor chamber 200 may be 0.2 mm, 0.25 mm, etc.

As shown in Figure 2, the embodiment of the present application provides a vapor chamber 200, which includes: a first cover plate 10, a second cover plate 20, a composite capillary structure 30, a cooling medium, and the like. The second cover plate 20 is fastened to the first cover plate 10 to form a sealed cavity. The second cover plate 20 and the first cover plate 10 can be connected by welding and sealing.

The first cover plate 10 and the second cover plate 20 are made of the same material, and both can be made of copper or copper alloy materials, or other materials that have good thermal conductivity and do not react chemically with the cooling medium. In other embodiments, the first cover plate 10 and the second cover plate 20 can also be made of carbon fiber, graphene, graphite sheets and other materials. If it is necessary to increase the deformation resistance of the vapor chamber 200, the first cover plate 10 and the second cover plate 20 can also be made of stainless steel, titanium metal, titanium alloy, tungsten alloy and other materials.

The inside of the sealed cavity is a negative pressure environment. The sealed cavity is used to prevent the loss of cooling medium, maintain a vacuum negative pressure state, and play a certain role in resisting deformation. The cooling medium can be water, deionized water, methanol, acetone, etc. The following description assumes that the cooling medium is water.

At least one composite capillary structure 30 is disposed at intervals within the sealed cavity. Each composite capillary structure 30 is in contact between the first cover 10 and the second cover 20 , that is, one end of each composite capillary structure 30 is in contact with the first cover 10 The other end of each composite capillary structure 30 is connected to the second cover plate 20 . At least one composite capillary structure 30 can be spaced apart in any direction to divide the sealed cavity into at least one sub-cavity, and the sub-cavity is used to form the steam channel 40. For example, if five composite capillary structures 30 are arranged at intervals in the sealed cavity, the five composite capillary structures 30 can divide the sealed cavity into six sub-cavities to obtain six vapor channels 40 .

The plurality of composite capillary structures 30 arranged at intervals in the sealing cavity can be arranged at equal intervals or at unequal intervals. The following description takes the example of multiple composite capillary structures 30 arranged at equal intervals as an example. The composite capillary structure 30 is used to form capillary force to transport the cooling medium, complete the entire power cycle and then complete the thermodynamic cycle, which is the key to maintaining two-phase heat exchange. In addition, the composite capillary structure 30 is also used to maintain the shape of the sealed cavity and prevent the vapor chamber 200 from being deformed by external forces.

The steam channel 40 is used to realize the transmission of steam, that is, to realize the transmission of steam generated from the high-temperature area of the vapor chamber 200 to the low-temperature area, so as to realize the dissipation of heat. In order to ensure the transmission rate and thereby improve the heat dissipation efficiency, based on the content of Figure 4, the width W40 of the steam channel 40 is 0.5 to 2 times the width W30 of the composite capillary structure 30. For example, it is preferred that the width W40 of the steam channel 40 is 1 to 1.5 times the width W30 of the composite capillary structure 30 .

In order to improve or maintain the heat dissipation performance of the vapor chamber 200 while reducing the thickness of the vapor chamber 200 , in the embodiment of the present application, the composite wick structure 30 may be composed of interconnected porous wick structures 50 and channel wick structures 60 . The porous capillary structure 50 provides high capillary force, and the channel capillary structure 60 provides high permeability. The composite capillary structure 30 can then reduce the flow resistance in the transmission of the working fluid (cooling medium), promote the rapid transportation of the working fluid, and achieve high performance. Without attenuation, the overall thickness of the vapor chamber 200 is reduced.

Both the porous capillary structure 50 and the channel capillary structure 60 are filled with cooling medium. The vapor chamber 200 includes a low-temperature area and a high-temperature area. The two areas are determined according to specific work scenario needs. They can be the entire first cover plate 10 or the entire second cover plate 20 , or they can be the first cover plate 10 or the second cover plate 20 . A certain part of the second cover plate 20. When the electronic device 100 When the heat generated by a certain component (heat source) is conducted to the vapor chamber 200, the part of the vapor chamber 200 that receives the heat is a high temperature area, and the other end of the vapor chamber 200 is a low temperature area. The heat source is located on the second cover plate 20 side, that is, on the channel capillary structure 60 side. For example, the left side of the second cover 20 of the vapor chamber 200 is the first to receive the heat generated by a certain component in the electronic device 100 , then the left side of the second cover 20 is a high-temperature area, and the second cover 20 The right side of is the low temperature area.

When heat is conducted to the high-temperature area of the vapor chamber 200, the cooling medium (such as water) in each composite capillary structure 30 provided in the sealed cavity begins to vaporize after being heated in a low vacuum environment, that is, the cooling medium absorbs heat. Rapid expansion is mentioned to produce a gas phase (eg steam). The gas phase cooling medium (such as steam) is transmitted to the steam channel 40 in the sealed cavity that communicates with the composite capillary structure 30, and quickly spreads along the steam channel 40 to the low temperature area. When the gas-phase cooling medium enters the low-temperature area, it condenses due to cold and condenses into a liquid state. The heat accumulated during evaporation is released through condensation, so that the heat in the high-temperature area of the vapor chamber 200 is transferred to the low-temperature area and dissipated. Wherein, the part where heat is dissipated in the low-temperature area of the vapor chamber 200 may be the first cover plate 10 and/or the second cover plate 20 . The condensed cooling medium (for example, condensed into water) returns to the high-temperature area of the vapor chamber 200 through the capillary action of the composite capillary structure 30 . The above process will be repeated inside the sealed cavity, and the cooling medium will circulate between the channel capillary structure 60 , the porous capillary structure 50 and the steam channel 40 to realize the transfer and export of heat, thereby realizing the heat dissipation of the electronic device 100 .

The heat dissipation function of the vapor chamber 200 is mainly realized through the gas-liquid two-phase change of the cooling medium. The heat dissipation process of the vapor chamber 200 includes four main steps: conduction, evaporation, convection, and condensation. The internal vaporization of the vapor chamber 200 continues, and its internal pressure will maintain a balance as the temperature changes. The vapor chamber 200 has a large size coverage and a flexible layout. Its size specifications can be designed according to the actual size and distribution of the heat source, so as to flexibly cover the heat source and realize heat dissipation for multiple heat sources at the same time.

Figure 3 is a schematic structural diagram of the first composite capillary structure provided by the embodiment of the present application. Figure 4 is a schematic diagram of the size marks of the first composite capillary structure provided by the embodiment of the present application.

As shown in Figures 3 and 4, in the embodiment of the present application, the composite capillary structure 30 has an upper and lower structure. Exemplarily, the porous wick structure 50 is located above the channel wick structure 60 . The porous wick structure 50 is in contact between the first cover plate 10 and the channel wick structure 60 , and the channel wick structure 60 is in contact between the porous wick structure 50 and the second cover plate 20 . That is to say, one end of the porous capillary structure 50 is connected to the first cover plate 10 , the other end of the porous capillary structure 50 is connected to one end of the channel capillary structure 60 , and the other end of the channel capillary structure 60 is connected to the second cover plate 20 . The porous capillary structure 50 and the channel capillary structure 60 may be connected by welding.

The porous capillary structure 50 may be made of metal particles, such as copper powder. The copper powder is made into a porous capillary structure 50 using a sintering process. Among them, the porous capillary structure 50 can be a powder porous capillary structure, which has strong water absorption capacity. There are a large number of pore structures 51 in the porous capillary structure 50, and the cooling medium is filled into the pore structures 51. The capillary force of the porous capillary structure 50 is greater than the capillary of conventionally used copper mesh, thereby providing high capillary force and providing conditions for long-distance transportation of working fluid.

The channel capillary structure 60 includes at least one column 61 and at least one channel 62. The at least one column 61 is spaced apart so that a channel 62 is formed between two adjacent columns 61, and the channel 62 is filled with cooling medium. One end of each column 61 is connected to the porous capillary structure 50 , and the other end of each column 61 is connected to the second cover plate 20 .

The respective columns 61 can be arranged at equal intervals, so that the widths W62 of the formed channels 62 are the same; the respective columns 61 can also be arranged at unequal intervals, so that the widths W62 of the formed channels 62 are different. The width W62 of the channel 62 can be between 0.05 mm and 0.5 mm. For example, the width W62 of the channel 62 is preferably between 0.1 mm and 0.3 mm. The number of channels 62 may be 1 to 3. For example, the number of channels 62 is preferably 1 to 2. If there are 2 channels 62, Then three columns 61 need to be provided, and the three columns 61 are spaced apart to form two channels 62. Multiple channels can be installed to reduce liquid phase resistance and improve liquid phase medium reflux efficiency.

Each column 61 in the channel capillary structure 60 is perpendicular to the bottom surface of the porous capillary structure 50 , so that the channel 62 formed by each column 61 is perpendicular to and in contact with the porous capillary structure 50 . Cooling medium is filled between the porous capillary structure 50 and the channel capillary structure 60 , and the porous capillary structure 50 and the channel capillary structure 60 are connected, so that the cooling medium can be transferred between the porous capillary structure 50 and the channel capillary structure 60 . Exemplarily, the channel 62 of the channel capillary structure 60 and the hole structure 51 of the porous capillary structure 50 are communicated through a cooling medium.

The width W50 of the porous capillary structure 50 and the width W60 of the channel capillary structure 60 can be the same. Then the width W61 of the cylinder 61 depends on the number of cylinders 61, the number of channels 62, the width W62 of the channel 62 and the porous capillary The width of structure 50 is W50, etc.

In some embodiments, the channel capillary structure 60 and the second cover plate 20 are integrally formed through an etching process, which can ensure the stability of the channel capillary structure 60 . The channel capillary structure 60 is made of the same material as the second cover plate 20 . When the second cover plate 20 is formed, at least one column 61 is simultaneously etched on the second cover plate 20 according to the above parameters to form the channel capillary structure 60 . The copper powder is formed by sintering to obtain the porous capillary structure 50 , and then the porous capillary structure 50 is fixed above the channel capillary structure 60 by welding to form the composite capillary structure 30 .

The channel capillary structure 60 and the second cover plate 20 are made of the same material. The channel capillary structure 60 has the ability to absorb water and will bind water. The water absorption capacity of the channel capillary structure 60 may be lower than that of the porous capillary structure 50 , but the channel capillary structure 60 has a high permeability.

In some embodiments, the overall width W30 of the composite capillary structure 30 using an upper and lower structure may be 0.5 mm to 1.5 mm. For example, the overall width W30 of the composite capillary structure 30 is preferably 0.8 mm to 1.3 mm. The height of the steam channel, the height H30 of the composite capillary structure 30 and the height of the sealed cavity formed in the vapor chamber 200 are the same, and are all between 0.12 mm and 0.19 mm. The height H50 of the porous wick structure 50 is approximately 6 to 9 times the height H60 of the channel wick structure 60 . For example, the height H60 of the channel capillary structure 60 may be between 0.01 mm and 0.04 mm, and the height H50 of the porous capillary structure 50 may be between 0.08 mm and 0.18 mm. In other embodiments, the height H50 of the porous wick structure 50 and the height H60 of the channel wick structure 60 may be determined based on the preset design thickness of the vapor chamber 200 , and the preset design thickness meets the requirement of thinning the vapor chamber 200 .

In the embodiment of the present application, the thickness of the vapor chamber 200 is less than 0.3mm, and the height H30 of the composite capillary structure 30 is between 0.12mm and 0.19mm, so the thicknesses of the first cover plate 10 and the second cover plate 20 are both less than 0.055mm. Target value within mm~0.09mm. For example, when the height H30 of the composite capillary structure 30 is 0.12mm, the thicknesses of the first cover plate 10 and the second cover plate 20 are both less than 0.09mm (target value), for example, they can be 0.08mm or 0.07mm. , 0.06mm, 0.05mm, etc. When the height H30 of the composite capillary structure 30 is 0.19mm, the thicknesses of the first cover plate 10 and the second cover plate 20 are both less than 0.055mm (target value), for example, they can be 0.054mm, 0.053mm, 0.04mm, 0.03mm, 0.02mm, etc. The thicknesses of the first cover plate 10 and the second cover plate 20 may be the same or different, and preferably the thicknesses are the same. The smaller the thickness of the first cover plate 10 and the second cover plate 20 is, the smaller the thickness of the vapor chamber 200 is, and thus the thinner and lighter the electronic device 100 is.

FIG. 5A is a schematic diagram of the heat dissipation path during the working medium evaporation stage of the first vapor chamber provided by the embodiment of the present application. FIG. 5B is a schematic diagram of the heat dissipation path during the working fluid condensation stage of the first vapor chamber provided by the embodiment of the present application.

As shown in FIG. 5A , when the first type of vapor chamber 200 is used to dissipate the heat generated by various components in the electronic device 100 , in the high-temperature area of the vapor chamber 200 , the cooling medium in the channel capillary structure 60 absorbs heat to generate a third One steam q1. If the channel capillary structure 60 includes two channels 62, the cooling medium in each channel 62 absorbs heat and generates heat respectively. The corresponding first steam q1 (including: q11, q12). The cooling medium in the porous capillary structure 50 absorbs heat to generate second steam q2. The channel 62 communicates with the porous capillary structure 50 , so the first steam q1 generated by the channel capillary structure 60 is transmitted upward into the porous capillary structure 50 . The porous capillary structure 50 combines the received first steam q1 and the self-generated second steam q2 to jointly transmit it into the steam channel 40 . Since the steam channels 40 are connected to both sides of a composite capillary structure 30, the porous capillary structure 50 can transmit steam q1 and q2 to the steam channels 40 on both left and right sides. The steam channel 40 transfers the first steam q1 and the second steam q2 to the low-temperature area of the vapor chamber 200 to realize heat dissipation.

As shown in FIG. 5B , in the low-temperature area of the vapor chamber 200 , the first steam q1 and the second steam q2 in the steam channel 40 are cooled to produce a condensation phenomenon, and together they condense into a liquid cooling medium y0 (such as water), and by condensation Releases the heat accumulated during evaporation. The porous capillary structure 50 absorbs water, and then the condensed cooling medium y0 flows back to the high temperature area through the porous capillary structure 50 and is filled in the porous capillary structure 50 as the cooling medium y2. The channel capillary structure 60 also has the ability to absorb water. Therefore, the condensed water can also flow back to the high temperature area through the channel capillary structure 60 and be filled in the channel capillary structure 60 as cooling media y11 and y12. Since the porous capillary structure 50 and the channel capillary structure 60 are connected and connected by welding, there may be a gap between them. Then the condensed water can also enter the porous capillary structure 50 (filled as cooling medium y2) and/or the channel capillary structure 60 (filled as cooling media y11, y12) through the gap, and then pass through the porous capillary structure 50 and/or the channel capillary structure 60 (filled as cooling media y11, y12). Or the channel capillary structure 60 flows back to the high temperature area. The condensed cooling medium can be transferred between the porous capillary structure 50 and the channel capillary structure 60. For example, the cooling medium y2 in the porous capillary structure 50 is transmitted downward to the channel capillary structure 60 and passes through the channel capillary structure. Each channel 62 in 60 flows back to the high temperature area respectively, and the condensed cooling medium y0 is filled in each channel 62 of the channel capillary structure 60 as cooling media y11 and y12. Through the gas-liquid two-phase change of the cooling medium, gas-liquid circulation is realized, so that the heat in the high-temperature area of the vapor chamber 200 is transferred to the low-temperature area and dissipated. It should be noted that the process of the porous capillary structure 50 adsorbing the condensed water and the process of the channel capillary structure 60 adsorbing the condensed water can be performed simultaneously.

In the embodiment of the present application, the composite capillary structure 30 and the steam channel 40 in the vapor chamber 200 are parallel structures. The composite capillary structure 30 and the steam channel 40 are adjacent to each other on the left and right. The steam generated by the cooling medium in the composite capillary structure 30 can be heated at the same time. Transfer to the steam channels 40 on both sides of itself, that is, the same steam channel 40 can receive the steam generated by the heating of the cooling medium in the composite capillary structures 30 on adjacent sides, with a higher transmission rate and higher heat dissipation efficiency; and it can also By reducing the height of the composite capillary structure 30, the overall height of the vapor chamber 200 is reduced to achieve lightness and thinness. At the same time, the composite design of the porous capillary structure 50 and the channel capillary structure 60 is adopted, the high capillary force of the porous capillary structure 50 is utilized, and the high permeability of the channel capillary structure 60 is utilized, so that the composite capillary structure 30 can reduce the transmission of working fluid. The flow resistance promotes the rapid transportation of the working medium, allowing the overall thickness of the vapor chamber 200 to be reduced without performance degradation, thereby meeting the need for the thinner and lighter electronic device 100 .

Figure 6 is a schematic structural diagram of a second vapor chamber provided by an embodiment of the present application. Figure 7 is a schematic structural diagram of the second composite capillary structure provided by the embodiment of the present application.

As shown in FIG. 6 , the embodiment of the present application provides a vapor chamber 200 . The structure of the vapor chamber 200 is different from the structure of the vapor chamber 200 shown in FIG. 2 in the style of the composite capillary structure 30 . For other characteristics, refer to The corresponding contents of the vapor chamber 200 shown in FIG. 2 will not be described again here.

As shown in FIG. 7 , in the embodiment of the present application, the composite capillary structure 30 has a left-right structure. Exemplarily, the porous wick structure 50 is located on one side of the channel wick structure 60 . The porous capillary structure 50 is in contact between the first cover plate 10 and the second cover plate 20 , one end of the channel capillary structure 60 is connected to the second cover plate 20 , and the other end of the channel capillary structure 60 is suspended in the air, that is, the channel The other end of the capillary structure 60 is not in contact with the first cover plate 10 and has a certain distance.

When the channel capillary structure 60 includes a channel 62 (not shown in the figure), a column 61 is spaced on one side of the porous capillary structure 50, and a channel is formed between the column 61 and the porous capillary structure 50. 62. Fill the channel 62 with cooling medium. When the channel capillary structure 60 includes two channels 62 , a possible method is to locate the porous capillary structure 50 between the channel capillary structures 60 . Two cylinders 61 are provided, so that each cylinder 61 is spaced apart on opposite sides of the porous capillary structure 50, and a corresponding channel 62 is formed between each cylinder 61 and the porous capillary structure 50. The two grooves The channels 62 are located on opposite sides of the porous capillary structure.

Since the columns 61 located on the left and right sides of the porous capillary structure 50 are not in contact with the first cover plate 10 , the channel 62 formed by the columns 61 and the porous capillary structure 50 can directly communicate with the steam channel 40 .

In some embodiments, the overall width W30 of the composite capillary structure 30 using a left-right structure may be 0.5 mm to 1.5 mm. For example, the overall width W30 of the composite capillary structure 30 is preferably 0.8 mm to 1.3 mm. Compared with the first composite capillary structure 30 shown in Figure 3, if the overall width of the composite capillary structure 30 in the embodiment of the present application is the same as the overall width of the first composite capillary structure 30 shown in Figure 3, then the corresponding The width of the porous wick structure 50 is reduced. The height H50 of the porous capillary structure 50 is the same as the height of the steam channel 40 and the height of the sealed cavity of the vapor chamber 200, both ranging from 0.12 mm to 0.19 mm. The height H60 of the channel capillary structure 60 can be between 0.01 mm and 0.04 mm. The height H50 of the porous wick structure 50 is approximately 6 to 9 times the height H60 of the channel wick structure 60 .

The channel capillary structure 60 is directly connected to the steam channel 40. The channel capillary structure 60 can bind water due to capillary action, and the porous capillary structure 50 can also bind water due to capillary action. Therefore, it can be ensured that the water in the channel 21 will not overflow into the steam channel 40 . In addition, the water filled in the channel 62 is calculated and there will be no excess water. Both the channel capillary structure 60 and the porous capillary structure 50 have different degrees of water absorption capacity. In order to ensure that the condensed water in the low-temperature area of the steam channel 40 can flow back to the high-temperature area of the vapor chamber 200 again, the height H60 of the channel capillary structure 60 is set. Below the height H50 of the porous capillary structure 50. The porous capillary structure 50 is responsible for absorbing the water condensed on the wall surface of the steam channel 40 in the low-temperature area, and then the water absorbed by the porous capillary structure 50 is transferred to the channel capillary structure 60 . The channel capillary structure 60 can also absorb the steam channel 40 at the same time. Water condensed in the channels and/or on the walls in low temperature areas.

FIG. 8A is a schematic diagram of the heat dissipation path during the evaporation stage of the working medium of the second vapor chamber provided by the embodiment of the present application. FIG. 8B is a schematic diagram of the heat dissipation path during the working fluid condensation stage of the second vapor chamber provided by the embodiment of the present application.

As shown in FIG. 8A , when the second vapor chamber 200 is used to dissipate the heat generated by various components in the electronic device 100 , in the high-temperature area of the vapor chamber 200 , the cooling medium in the channel capillary structure 60 absorbs heat. First steam is generated. If the channel capillary structure 60 includes two channels 62, the cooling medium in each channel 62 absorbs heat and generates corresponding first steam q11 and q12 respectively. Each channel 62 is connected to the steam channel 40 , so the first steam q11 and q12 generated by each channel 62 can be directly transferred to the steam channel 40 . Exemplarily, the channel 62 located on the left side of the porous capillary structure 50 transfers the corresponding first steam q11 to the steam channel 40 located on the left side of the porous capillary structure 50, and the channel 62 located on the right side of the porous capillary structure 50 will correspondingly The first steam q12 is passed into the steam channel 40 located on the right side of the porous capillary structure 50 . The cooling medium in the porous capillary structure 50 generates second steam q2 after absorbing heat, and transmits it to the steam channel 40 . In the same way, the porous capillary structure 50 transmits the second steam q2 generated by itself to the steam channels 40 on the left and right sides respectively. The steam channel 40 transfers the first steam q11/q12 and the second steam q2 to the low temperature area of the vapor chamber 200 to realize heat dissipation.

As shown in FIG. 8B , in the low-temperature area of the vapor chamber 200 , the first steam q11 / q12 and the second steam q2 in the steam channel 40 are cooled to produce a condensation phenomenon, and are condensed together into the cooling medium y0 (such as water), and through condensation Releases the heat accumulated during evaporation. The porous capillary structure 50 absorbs water, and the condensed cooling medium passes through the porous capillary structure 50 and the channel hair. The fine structure 60 flows back to the high temperature area to realize gas-liquid circulation. Specifically, the condensed cooling medium flows back to the high temperature area through the porous capillary structure 50 and is filled in the porous capillary structure 50 as the cooling medium y2. The cooling medium y2 in the porous capillary structure 50 is transmitted downward to the bottom position opposite to the channel capillary structure 60, and is transferred from the bottom position to the channel capillary structures 60 located on opposite sides of the porous capillary structure 50, and passes through the channel capillary Each channel 62 located on opposite sides of the porous capillary structure 50 in the structure 60 flows back to the high temperature area respectively, and the condensed cooling medium y0 is filled in each channel 62 of the channel capillary structure 60 as the cooling media y11 and y12. In addition, the channel capillary structure 60 also has the ability to absorb water. The condensed cooling medium y0 can be directly adsorbed by the channel capillary structure 60 and filled in each channel 62 of the channel capillary structure 60 as cooling media y11' and y12'. . For example, the condensed cooling media y11 and y11' are filled in the same channel 62, and the cooling media y12 and y12' are filled in the same channel 62. Through the gas-liquid two-phase change of the cooling medium, gas-liquid circulation is realized, so that the heat in the high-temperature area of the vapor chamber 200 is transferred to the low-temperature area and dissipated.

In the embodiment of the present application, the composite capillary structure 30 and the steam channel 40 in the vapor chamber 200 are parallel structures. The composite capillary structure 30 and the steam channel 40 are adjacent to each other on the left and right. The steam generated by the cooling medium in the composite capillary structure 30 can be heated at the same time. It is transmitted to the steam channels 40 on both sides of the composite capillary structure 30, that is, the same steam channel 40 can receive the steam generated by the heating of the cooling medium in the composite capillary structures 30 on adjacent sides, with a higher transmission rate and thus a higher heat dissipation efficiency. Moreover, the overall height of the vapor chamber 200 can also be reduced by reducing the height of the composite capillary structure 30 to achieve lightness and thinness. At the same time, the composite design of the porous capillary structure 50 and the channel capillary structure 60 is adopted, the high capillary force of the porous capillary structure 50 is utilized, and the high permeability of the channel capillary structure 60 is utilized, so that the composite capillary structure 30 can reduce the transmission of working fluid. The flow resistance promotes the rapid transportation of the working fluid; at the same time, the multiple channels 62 of the channel capillary structure 60 are directly connected to different steam channels 40, which can improve the evaporation efficiency of the channel capillary structure 60 and achieve performance without degradation. Under this condition, the overall thickness of the vapor chamber 200 is reduced, thereby meeting the demand for thinner and lighter electronic equipment 100 .

Figure 9 is a schematic structural diagram of a third vapor chamber provided by an embodiment of the present application. Figure 10 is a schematic structural diagram of the third composite capillary structure provided by the embodiment of the present application.

As shown in Figure 9, the embodiment of the present application provides a vapor chamber 200. The structure of the vapor chamber 200 is different from the structure of the vapor chamber 200 shown in Figures 2 and 6 in the style of the composite capillary structure 30 and other characteristics. Reference may be made to the corresponding content of the vapor chamber 200 shown in FIG. 2 and FIG. 6 , which will not be described again here.

As shown in Figure 10, the difference between the embodiment of the present application and the composite capillary structure 30 shown in Figure 7 is that when the channel capillary structure 60 includes two channels 62, a feasible method is to combine the porous capillary structure with The structure 50 and the channel capillary structure 60 are arranged around. And the channel capillary structure 60 includes two cylinders 61 , each cylinder 61 is spaced apart on the same side of the porous capillary structure 50 . Exemplarily, a first channel 621 is formed between the two cylinders 61, and a second channel 622 is also formed between the cylinder 61 close to the porous capillary structure 50 and the porous capillary structure 50. The two channels (621, 622 ) is located on the same side of the porous capillary structure 50, and each channel (621, 622) is filled with cooling medium.

Since the two cylinders 61 located on the same side of the porous capillary structure 50 are not in contact with the first cover 10, the two channels (621, 622) formed by the two cylinders 61 and the porous capillary structure 50 can be directly Connected to the steam channel 40. In addition, the remaining characteristics of the composite capillary structure 30 shown in FIG. 10 can be referred to the characteristics of the composite capillary structure 30 shown in FIG. 7 (including relative positions and parameters of components, etc.), and will not be described again here.

In some embodiments, the overall width of the composite capillary structure 30 using a left and right structure may be the same as the overall width of the composite capillary structure 30 also using a left and right structure as shown in FIG. 7 .

FIG. 11A is a schematic diagram of the heat dissipation path during the working medium evaporation stage of the third vapor chamber provided by the embodiment of the present application. Figure 11B This is a schematic diagram of the heat dissipation path in the working fluid condensation stage of the third vapor chamber provided by the embodiment of the present application.

As shown in FIG. 11A , when the third vapor chamber 200 is used to dissipate the heat generated by various components in the electronic device 100 , in the high-temperature area of the vapor chamber 200 , the cooling medium in the channel capillary structure 60 absorbs heat. First steam is generated. If the channel capillary structure 60 includes two channels 621 and 622, the cooling medium in each channel 621 and 622 generates first steam q11 and q12 after absorbing heat. The two channels 621 and 622 are both connected to the steam channel 40, and since the two channels 621 and 622 are located on the same side of the porous capillary structure 50, then the first steam q11 and q11 generated by the two channels 621 and 622 are q12 can be passed directly into the vapor channel 40 located on the left side of the porous capillary structure 50. The cooling medium in the porous capillary structure 50 generates second steam q2 after absorbing heat. Steam channels 40 are connected to both sides of the same porous capillary structure 50, and the porous capillary structure 50 transmits the second steam q2 generated by itself to the left and right respectively. in the steam channels 40 on both sides. The steam channel 40 transfers the first steam (q11 and q12) and the second steam q2 to the low temperature area of the vapor chamber 200 to realize heat dissipation.

As shown in FIG. 11B , in the low-temperature area of the vapor chamber 200 , the first steam ( q11 and q12 ) and the second steam q2 in the steam channel 40 generate a condensation phenomenon when they are cooled, and they are condensed together into the cooling medium y0 (such as water). The heat accumulated during evaporation is released by condensation. The porous capillary structure 50 absorbs water, and then the condensed cooling medium flows back to the high temperature area through the porous capillary structure 50 and the channel capillary structure 60 to achieve gas-liquid circulation. Specifically, the condensed cooling medium flows back to the high temperature area through the porous capillary structure 50 and is filled in the porous capillary structure 50 as the cooling medium y2. The cooling medium y2 in the porous capillary structure 50 is transported downward to the bottom position opposite to the channel capillary structure 60, and is transferred from the bottom position to the second channel 622 adjacent to the porous capillary structure 50, and is filled as the cooling medium y12 in in the second channel 622. The cooling medium y12 then transfers the condensed cooling medium to the adjacent first channel 621 through the second channel 622, and is filled in the first channel 621 as the cooling medium y11. In addition, the channel capillary structure 60 also has the ability to absorb water. The condensed cooling medium y0 can be directly adsorbed by the channel capillary structure 60 and filled in each channel 62 of the channel capillary structure 60 as cooling media y11' and y12'. . Exemplarily, the condensed cooling media y11 and y11' are filled in the first channel 621, and the cooling media y12 and y12' are filled in the second channel 622. Through the gas-liquid two-phase change of the cooling medium, gas-liquid circulation is realized, so that the heat in the high-temperature area of the vapor chamber 200 is transferred to the low-temperature area and dissipated.

In the embodiment of the present application, the composite capillary structure 30 and the steam channel 40 in the vapor chamber 200 are parallel structures. The composite capillary structure 30 and the steam channel 40 are adjacent to each other on the left and right. The steam generated by the cooling medium in the composite capillary structure 30 can be heated at the same time. It is transmitted to the steam channels 40 on both sides of the composite capillary structure 30, that is, the same steam channel 40 can receive the steam generated by the heating of the cooling medium in the composite capillary structures 30 on adjacent sides, with a higher transmission rate and thus a higher heat dissipation efficiency. Moreover, the overall height of the vapor chamber 200 can also be reduced by reducing the height of the composite capillary structure 30 to achieve lightness and thinness. At the same time, the composite design of the porous capillary structure 50 and the channel capillary structure 60 is adopted, the high capillary force of the porous capillary structure 50 is utilized, and the high permeability of the channel capillary structure 60 is utilized, so that the composite capillary structure 30 can reduce the transmission of working fluid. The flow resistance promotes the rapid transportation of the working medium; at the same time, the multiple channels 62 of the channel capillary structure 60 are directly connected to the same steam channel 40, which can improve the evaporation efficiency of the channel capillary structure 60 and achieve performance without degradation. Under this condition, the overall thickness of the vapor chamber 200 is reduced, thereby meeting the demand for thinner and lighter electronic equipment 100 .

Figure 12 is a schematic structural diagram of a fourth vapor chamber provided by an embodiment of the present application. Figure 13 is a schematic structural diagram of the fourth composite capillary structure provided by the embodiment of the present application.

As shown in Figure 12, the embodiment of the present application provides a vapor chamber 200. The structure of the chamber 200 is different from the structure of the chamber 200 shown in Figures 2, 6 and 9 in the style of the composite capillary structure 30. , the remaining characteristics may refer to the corresponding content of the vapor chamber 200 shown in FIG. 2, FIG. 6, and FIG. 9, and will not be described again here.

As shown in Figure 13, in the embodiment of the present application, the difference from the composite capillary structure 30 shown in Figure 10 is that several columns 61 are respectively provided on opposite sides of the porous capillary structure 50, so that in the porous capillary structure Several grooves 62 are formed on opposite sides of 50 respectively. For example, when two columns 61 are respectively provided on opposite sides of the porous wick structure 50, two channels 62 are formed on opposite sides of the porous wick structure 50. Then, a composite capillary structure 30 has four channels 62. The more channels 62 there are, not only can the evaporation efficiency be improved, but the flow resistance can be further reduced, further promoting the rapid transport of the working medium.

The remaining characteristics of the composite capillary structure 30 shown in FIG. 13 can be referred to the characteristics of the composite capillary structure 30 shown in FIG. 10 (including relative positions and parameters of components, etc.), and will not be described again here. Similarly, the heat dissipation path of the vapor chamber 200 shown in FIG. 12 can be referred to the heat dissipation path of the vapor chamber 200 shown in FIG. 9 , which will not be described again here.

As shown in Figure 14, the sealed cavity of the vapor chamber 200 is also provided with a support column 70. The support column 70 is abutted between the first cover plate 10 and the second cover plate 20. The support column 70 is used to maintain the sealed cavity. The shape of the body is maintained, that is, the shape of the vapor chamber 200 is maintained. Although the composite capillary structure 30 in the vapor chamber 200 has a certain supporting effect and can maintain the shape of the sealed cavity. However, by providing support columns 70 in the vapor chamber 200, this support effect can be further improved.

The support column 70 can be applied in the vapor chamber 200 provided in any of the aforementioned embodiments. At least one support column 70 can be disposed in the sealed cavity of the vapor chamber 200. Each support column 70 can be disposed between two adjacent composite capillary structures 30, and can also be disposed between the first (last) composite capillary structure 30 and the third composite capillary structure 30. between the ends of a cover plate 10. A steam channel 40 is formed between the support column 70 and the adjacent composite capillary structure 30 , or a steam channel 40 is formed between the support column 70 and the end of the first cover plate 10 . The support column 70 can be used to resist the deformation of the vapor chamber 200 caused by the difference in internal and external atmospheric pressure and other external forces, so as to prevent the steam channel 40 and the composite capillary structure 30 from being flattened and causing the vapor chamber 200 to fail.

The support pillar 70 can be integrally formed with the first cover plate 10 or the second cover plate 20 through an etching process to improve the connection stability between the support pillar 70 and the first cover plate 10 or the second cover plate 20 and avoid damage between the two. The bonding or welding process simplifies the processing process. It can be understood that in the embodiment of the present application, the material of the support pillar 70 is the same as the material of the first cover plate 10 or the second cover plate 20 , for example, it can be copper or copper alloy. By combining the support column 70 with the high-strength first cover plate 10 and the second cover plate 20 , the strength of the entire vapor chamber 200 can also be ensured.

In the embodiment of the present application, the composite capillary structure 30 and the steam channel 40 in the vapor chamber 200 are parallel structures, and a composite design of the porous capillary structure 50 and the channel capillary structure 60 is used. The high capillary force of the porous capillary structure 50 is used. The high permeability of the channel capillary structure 60 allows the composite capillary structure 30 to reduce the flow resistance of the working fluid transmission and promote the rapid transportation of the working fluid; at the same time, at least one support column 70 can also be provided in the sealed cavity to ensure uniform heat Plate 200 strength. The above solution can achieve thinning of the overall thickness of the vapor chamber 200 without performance degradation, thereby meeting the demand for thinner and lighter electronic equipment 100 .

In some embodiments, in the vapor chamber 200 shown in FIG. 2 , since the composite capillary structure 30 adopts an up-and-down structure, the cross-sectional shape of the steam channel 40 formed in the sealed cavity is a regular shape, such as a rectangle. In the vapor chamber 200 shown in FIGS. 6 , 9 and 12 , since the composite capillary structure 30 adopts a left-right structure, the cross-sectional shape of the steam channel 40 formed in the sealed cavity is irregular.

When the cross-sectional shape of the steam channel 40 is an irregular shape, the steam channel 40 having an irregular shape has a wider top end and a narrower bottom end. Then, when setting the proportional relationship between the width W40 of the steam channel 40 and the width W30 of the composite capillary structure 30, the width of the top end of the irregular-shaped steam channel 40 can be used as a benchmark, or the width of the top of the irregular-shaped steam channel 40 can be used as a reference. The bottom width is the basis.

In some embodiments, the number of composite capillary structures 30 provided in the vapor chamber 200 may be determined based on the size of the vapor chamber 200 . The various drawings on which the embodiments of this application are based only illustrate the number of composite capillary structures 30 and do not limit the number of composite capillary structures 30 provided.

An embodiment of the present application provides a vapor chamber and electronic equipment. The vapor chamber 200 includes a first cover plate 10 and a second cover plate 20 . The second cover plate 20 is fastened to the first cover plate 10 to form a sealed cavity. body, at least one composite capillary structure 30 is spaced in the sealed cavity, and steam channels 40 are formed on both sides of each composite capillary structure 30 . The composite wick structure 30 includes interconnected porous wick structures 50 and channel wick structures 60 . Both the porous capillary structure 50 and the channel capillary structure 60 are filled with cooling medium. The steam generated by the cooling medium when heated can be transferred to the steam channels 40 on both sides of the composite capillary structure 30 at the same time. That is, the same steam channel 40 can receive steam from adjacent The steam generated by the heating of the cooling medium in the composite capillary structures 30 on both sides has a higher transmission rate and thus a higher heat dissipation efficiency; and the steam channel 40 and the composite capillary structure 30 are left and right parallel structures, which can be achieved by reducing the height of the composite capillary structure 30 Reduce the overall height of the vapor chamber to make it thinner and lighter. At the same time, the composite design of the porous capillary structure 50 and the channel capillary structure 60 is adopted, the high capillary force of the porous capillary structure 50 is utilized, and the high permeability of the channel capillary structure 60 is utilized, so that the composite capillary structure 30 can reduce the transmission of working fluid. The flow resistance promotes the rapid transportation of the working fluid, allowing the overall thickness of the vapor chamber 200 to be reduced without performance degradation, thereby meeting the demand for thinner and lighter electronic equipment.

It should be noted that those skilled in the art will easily come up with other embodiments of the present application after considering the specification and practicing the application disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary technical means in the technical field that are not disclosed in this application. . It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.

It is to be understood that the present application is not limited to the precise structures described above and illustrated in the accompanying drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the application is limited only by the appended claims.

Claims

A vapor chamber, which is characterized in that it includes:

first cover plate (10);

a second cover plate (20), the second cover plate (20) is buckled on the first cover plate (10) to form a sealed cavity, and the inside of the sealed cavity is a negative pressure environment;

Composite capillary structure (30), at least one of the composite capillary structures (30) is arranged at intervals in the sealed cavity, and each of the composite capillary structures (30) is in contact with the first cover plate (10) and the Between the second cover plate (20); at least one of the composite capillary structures (30) divides the sealed cavity into at least one sub-cavity, and the sub-cavity is used to form a steam channel (40);

The composite capillary structure (30) includes a porous capillary structure (50) and a channel capillary structure (60). The porous capillary structure (50) and the channel capillary structure (60) are connected. The porous capillary structure (50) is connected to the channel capillary structure (60). (50) and the channel capillary structure (60) are filled with cooling medium, and the cooling medium occurs between the channel capillary structure (60), the porous capillary structure (50) and the steam channel (40) Gas-liquid circulation.
The vapor chamber according to claim 1, wherein the porous capillary structure (50) is located above the channel capillary structure (60); the porous capillary structure (50) is in contact with the first Between a cover plate (10) and the channel capillary structure (60), the channel capillary structure (60) is in contact with the porous capillary structure (50) and the second cover plate (20) During this time, communication is achieved between the porous capillary structure (50) and the channel capillary structure (60) through the cooling medium.
The vapor chamber according to claim 2, characterized in that the channel capillary structure (60) includes at least one cylinder (61) and at least one channel (62), each of the cylinders (61) Arranged at intervals, one end of each column (61) is connected to the porous capillary structure (50), and the other end of each column (61) is connected to the second cover (20) ; The channel (62) is formed between two adjacent columns (61), and the cooling medium is filled in the channel (62).
The vapor chamber according to claim 3, wherein the vapor chamber includes a low temperature area and a high temperature area;

In the high-temperature region, the cooling medium in the channel (62) absorbs heat to generate first steam, and the cooling medium in the porous capillary structure (50) absorbs heat to generate second steam. The first steam passes through the porous structure (50). The capillary structure (50), combined with the second steam, is transferred to the steam channel (40), and the steam channel (40) transfers the first steam and the second steam to the low temperature area to realize the dissipation of heat;

In the low temperature region, the first steam and the second steam in the steam channel (40) are condensed into cooling medium, and the cooling medium flows back to high temperature through the porous capillary structure (50) and the channel capillary structure (60) area to achieve gas-liquid circulation.
The vapor chamber according to claim 1, characterized in that the porous capillary structure (50) is located on one side of the channel capillary structure (60), and the porous capillary structure (50) is in contact with the Between the first cover plate (10) and the second cover plate (20), one end of the channel capillary structure (60) and the second cover plate (20) Connected, the other end of the channel capillary structure (60) is spaced from the first cover plate (10).
The vapor chamber according to claim 5, characterized in that the channel capillary structure (60) includes at least one cylinder (61) and at least one channel (62), each of the cylinders (61) are respectively spaced apart on opposite sides of the porous capillary structure (50). The channel (62) is formed between the column (61) and the porous capillary structure (50). The channel (62) ) is filled with the cooling medium;

In the high-temperature area of the vapor chamber, the cooling medium in the channel (62) generates first steam after absorbing heat and transfers it to the steam channel (40), and the porous capillary structure (50) The cooling medium inside generates second steam after absorbing heat and transfers it to the steam channel (40). The steam channel (40) transfers the first steam and the second steam to the low temperature area to realize the dissipation of heat;

In the low temperature area of the vapor chamber, the first steam and the second steam in the steam channel (40) are condensed into cooling medium, and the cooling medium passes through the porous capillary structure (50) and the channel capillary structure (60) ) flows back to the high temperature area to achieve gas-liquid circulation.
The vapor chamber according to claim 5, characterized in that the channel capillary structure (60) includes several cylinders (61) and at least one channel (62), each of the cylinders (61) They are respectively arranged at intervals on the same side of the porous capillary structure (50), and the channel (62) is formed between two adjacent columns (61). The column (61) and the porous capillary The channels (62) are formed between the structures (50), and each of the channels (62) is filled with the cooling medium;

In the high-temperature area of the vapor chamber, the cooling medium in the channel (62) generates first steam after absorbing heat and transfers it to the steam channel (40), and the porous capillary structure (50) The cooling medium inside generates second steam after absorbing heat and transfers it to the steam channel (40). The steam channel (40) transfers the first steam and the second steam to the low temperature area to realize the dissipation of heat;

In the low temperature area of the vapor chamber, the first steam and the second steam in the steam channel (40) are condensed into cooling medium, and the cooling medium passes through the porous capillary structure (50) and the channel capillary structure (60) ) flows back to the high temperature area to achieve gas-liquid circulation.
The vapor chamber according to any one of claims 3, 6, and 7, characterized in that the number of the channels (62) is 1 to 3, and the width of each of the channels (62) does not vary. The same, or the width of each of the channels (62) is the same.
The vapor chamber according to any one of claims 1 to 7, characterized in that the channel capillary structure (60) and the second cover plate (20) are integrally formed through an etching process.
The vapor chamber according to any one of claims 1 to 7, characterized in that the width of the steam channel (40) is 0.5 to 2 times the width of the composite capillary structure (30).
The vapor chamber according to any one of claims 1 to 7, characterized in that a support column (70) is further provided in the sealed cavity, and the support column (70) abuts against the first cover. plate (10) and the second cover plate (20) The support column (70) is used to maintain the shape of the sealed cavity.
An electronic device, characterized in that it includes a body, a housing and the vapor chamber according to any one of claims 1-11.