五、新型說明: 【新型所屬之技術領域】 本新型是有關於一種熱管,且特別是有關於一種薄形 執管。 ί、、、 Ρ 【先前技術】 一般來說,電子設備於運轉過程中會產生熱量,若不 將此熱量有效率地排除,輕則電子設備容易發生當機的狀 況,嚴重時則可能會燒毁電子設備中的電子元件,而造成 財產損失或讓使用者受到傷害。因此,設計者通常都會在 電子設備中設置散熱模組。 近年來,由於電子晶片具有較高的效能,因此也會產 生較南的溫度*使得對應電子晶片的散熱模組也越來越重 要。熱管便為一種常用的散熱裝置。熱管的内壁具有毛細 結構,其内具有工作流體。當熱管的一端置於如電子晶片 的較高溫處,另一端置於較低溫處時,高溫處之毛細結構 所吸附的工作流體會開始蒸發。蒸發的氣體聚集在管内的 空間,並因壓力的因素使氣態的流體往熱管的低溫處流 動。當氣態的流體到達低溫處時便開始冷凝成液態的流 體,並由低溫處的毛細結構吸附循環使用。 輕薄已成為電子設備的設計趨勢,為此,熱管的厚度 也因高度限制而跟著減少。然而,在熱管厚度過薄的情形 下,熱管的散熱效率亦受到限制。 【新型内容】 度限型的目㈣是在提供-種齡,應用在有高 J的電子設備中,以提升熱管的散熱效率。 依照本新型-實施例’提出—種熱管,包含第一部份 二f二部份。第二部份連接並與第一部份之一端導通,第 :部份沿熱管之短軸向τ延伸,第—部份的截面高 t::的戴面高度。熱管呈扁平狀。其中熱管之ί面形 一立在另一實施例中,熱管更包含第三部份,連接並與第 j伤之另一端導通。第三部份沿熱管之短軸向下延伸, 々二部份的截面高度大於第二部份的截面高度。其中 之截面形狀可以為U形。 、… 本新型之另一態樣為一種應用熱管的電子設備,包含 基板、電子稀與熱管。電子元件設置於基板上,熱管設 置於電子元件上。其中熱管沿短軸超出電子元件之部份朝 基板彎折。熱管呈扁平狀。 在一實施例中,熱管包含第一部份與第二部份,第一 部伤位於電子元件外側,第二部份位於電子元件上,連接 並與第部份之一端導通,第一部份沿熱管之短軸朝基板 延伸,第一部份的截面高度大於第二部份的截面高度。熱 管之截面形狀可為L形。 在另一實施例中’熱管更包含第三部份,位於電子元 件外側,連接並與第二部份之另一端導通,第三部份沿熱 管之短軸朝基板延伸’第三部份的截面高度大於第二部份 的截面高度。熱管之裁面形狀可為U形。 料==元:外侧向下彎折,有效利用電子元件 一板之fam而可以在不增加 情形下,增加熱管的空氣流道,提升熱管之度的 【實施方式】 以下將以圖式及詳細說明清楚說明本新叙精神,任 何所屬技術領域巾具有通常知識者在瞭解本新型之較 施例後’當可由本新型所教示之技術,加以改變及㈣, 其並不脫離本新型之精神與範圍。 參照第1圖,其繪示應用本新型之熱管一實施例的電 子設備的示意圖。電子設備_包含有殼體細、電子元 件(發熱源)300、熱管4〇〇,以及基板5〇㈧基板5〇〇位 於殼體200中,電子元件3〇〇設置於基板5〇〇上。熱管4〇〇 設置於電子το件300上,並接觸電子元件3〇〇以對電子元 件300進行散熱。在現今薄形化趨勢的考量下,元件堆疊 的咼度亦受到限制,本新型所提出的熱管4⑼可以有效利 用電子設備100中的空間,在不增加熱管4〇〇高度的前提 下’加大熱管400的空氣流道。 電子設備100可以為筆記型電腦、平板電腦、手機或 其他手持式電子裳置’電子元件3〇〇可以為中央處理器、 晶片組或繪圖晶片等,基板5〇〇可以為電路板。以本實施 例為例’電子設備1〇〇可為筆記型電腦,電子元件3〇〇可 為中央處理器晶片,基板500為中央處理器基板。電子元 件300設置於基板500上,且通常基板500之面積大於電 子元件300,使得電子元件300與基板5〇〇之間形成有段 差。熱管400便運用此電子元件3〇〇與基板5〇〇之間的空 間’加大熱管400内的空氣流道。 具體地說’熱管400大致呈扁平狀,以配合電子設備 100之向度限制。熱管400沿短軸X的一端在電子元件3〇〇 外侧向基板500的方向向下延伸,以局部地增加熱管4〇〇 的厚度。此短軸X尤其是指熱管4qq壓扁之後的橫向短 軸。換句話說,熱管400包含第一部分410以及第二部分 420,第一部分410朝該基板方向延伸。於一具體實施例 中’第一部分410與第二部分42〇互相垂直。熱管4〇〇超 出於电子元件300外緣之第一部份41〇的截面高度hi大於 熱管400位於電子元件300上之第二部份420的截面高度 。第一部份410可以接觸或是不接觸電子元件3〇〇,第 二部份420則與電子元件300相接觸。熱管400之截面形 狀近似於L形。相較於傳統一字形的設計(僅具備第一部 分410),本新型之熱管400有效利用電子元件300與基板 500之間的空間’在不增加電子設備1〇〇之整體高度的情 形下,增加熱管400中的空氣流道’以提升熱管4〇〇的散 熱效率。 參照第2圖’其為第1圖中之熱管4〇〇的刮面圖。熱 管400包含有管壁402與形成於管壁402上的毛細結構 404。空氣流道406由管壁402所定義’以供流體或是其所 轉換成的氣體在其内流動。毛細結構4 〇4可以為微溝渠、 燒結粒子或是金屬網。熱管400之戴面形狀近似於L形。 熱管400可以為一體成形地製程,第一部份41〇與第二部 份420為相互連接並導通。熱管4〇〇之第一部份410的戴 面高度hi大於第二部份420的截面高度h2。本熱管400 增加了從侧面向下延伸的第一部份410’藉以增加熱管400 中空氣流道406的空間,提升熱管400的散熱效率。 參照第3圖,其繪示應用本新型之熱管另一實施例的 電子設備的示意圖。電子設備1〇〇包含有殼體200、電子 元件300、熱管400,以及基板500。基板500位於殼體200 中,電子元件300設置於基板500上。熱管400設置於電 子元件300上,並接觸電子元件300以對電子元件300進 行散熱。本實施例中,熱管400除了從電子元件300 —側 向基板500方向延伸的第一部份410’與位於電子元件300 上方的第二部份420外’更包含有從電子元件300另一側 向基板500方向延伸的第三部份430。即熱管400沿短轴X 的一端向下彎折形成第一部份410 ’熱管400沿短軸X的 另一端向下彎折形成第三部份430。第一部份410與第三 部份430分別位於第二部份420的相對兩侧’亦即,第一 部份410與第三部份430位於電子元件300的兩側。第一 部份410與第三部份430可以接觸或是不接觸電子元件 300,第二部份420與電子元件300接觸。熱管400之截面 形狀近似於ϋ形。相較於傳統一字形的設計’本新型之熱 管400有效利用電子元件3以與基板500之間的空間,在 不增加電子設備100之整體高度的情形下’增加熱管400 中的空氣流道’以提升熱管4⑻的散熱效率。 參照第4圖’其為第3圖中之熱管400的刮面圖。熱 管400包含有管壁402與形成於管壁402上的毛細結構 404。空氣流道406由管壁402所定義,以供流體或是其所 轉換成的氣體在其内流動。毛細結構404可以為微溝渠、 燒結粒子或是金屬網。熱管400之戴面形狀近似於u形。 熱管400可以為一體成形地製程’熱管4⑼可以經由 壓扁管徑後再彎折呈上述之L形或疋U形。熱管400之f 壁402的材料可以為導熱性佳的銅。 第一部份410、第二部份42〇與第三部份43〇為相互 連接並導通。熱管400之第一部份的截面高度hi大於 第二部份420的截面高度h2,熱管4⑽之第三部份430的 戴面高度h3大於第二部份420的截面高度h2。本熱管400 增加了從側面向下延伸的第一部份410與第三部份430, 藉以增加熱管40Q中空氣流道406的空間,提升熱管400 的散熱效率。 於一具體實施例中,第一部份410的截面高度hi與第 三部份430的截面高度h3可視實際需求而使其高度相同或 不相同。 熱管400可以為一體成形地製程’熱管4〇〇可以經由 壓扁管徑後再彎折呈上述之L形或是U形◊熱管4〇〇之管 壁402的材料可以為導熱性佳的銅。 由上述本新型較佳實施例可知,應用本新型具有下列 優點。本熱管從電子元件外侧向下彎折,有效利用電子元 ^與基板之間的空間,而可以在不增加電子設備整體高度 隋形下,增加熱管的空氣流道,提升熱管之散熱效率。 ^隹、、本新型已以一較佳實施例揭露如上,然其並非用 神本新型’任何熟習此技藝者,在不脫離本新型之精 軏圍内,當可作各種之更動與潤飾,因此本新型之保 M426263 護範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 為讓本新型之上述和其他目的、特徵、優點與實施例 能更明顯易懂,所附圖式之詳細說明如下: 第1圖繪示應用本新型之熱管一實施例的電子設備的 示意圖。 第2圖為第1圖中之熱管的剖面圖。 Φ 第3圖繪示應用本新型之熱管另一實施例的電子設備 的示意圖。 第4圖為第3圖中之熱管的剖面圖。V. New description: [New technical field] The present invention relates to a heat pipe, and in particular to a thin tube. ί,,, Ρ [Prior Art] Generally, electronic equipment generates heat during operation. If this heat is not effectively removed, electronic equipment is prone to crash conditions. In severe cases, it may burn. Destroy electronic components in electronic equipment, causing property damage or injury to users. Therefore, designers often set thermal modules in electronic devices. In recent years, due to the high performance of electronic wafers, a souther temperature* has also been generated, making the heat dissipation module corresponding to the electronic chip more and more important. The heat pipe is a commonly used heat sink. The inner wall of the heat pipe has a capillary structure with a working fluid therein. When one end of the heat pipe is placed at a higher temperature such as an electronic wafer and the other end is placed at a lower temperature, the working fluid adsorbed by the capillary structure at a high temperature starts to evaporate. The vaporized gas collects in the space inside the tube, and the gaseous fluid flows toward the low temperature of the heat pipe due to the pressure. When the gaseous fluid reaches a low temperature, it begins to condense into a liquid fluid, which is recycled by the capillary structure at a low temperature. Lightness and thinness have become the design trend of electronic equipment. For this reason, the thickness of the heat pipe is also reduced by the height limit. However, in the case where the thickness of the heat pipe is too thin, the heat dissipation efficiency of the heat pipe is also limited. [New content] The limited type of object (4) is provided in the age of the application, and is applied to electronic devices with high J to improve the heat dissipation efficiency of the heat pipe. A heat pipe according to the present invention-embodiment includes a first portion, two f portions. The second portion is connected and electrically connected to one end of the first portion, the first portion extends along the short axis τ of the heat pipe, and the cross-section of the first portion is high t:: the wearing height. The heat pipe is flat. Wherein the shape of the heat pipe is in another embodiment, the heat pipe further comprises a third portion connected and electrically connected to the other end of the jth injury. The third portion extends down the short axis of the heat pipe, and the height of the section of the second portion is greater than the height of the section of the second portion. The cross-sectional shape thereof may be U-shaped. Another aspect of the present invention is an electronic device using a heat pipe, comprising a substrate, an electronic thinning and a heat pipe. The electronic component is disposed on the substrate, and the heat pipe is disposed on the electronic component. The heat pipe is bent toward the substrate along a portion of the short axis that extends beyond the electronic component. The heat pipe is flat. In one embodiment, the heat pipe includes a first portion and a second portion, the first portion is located outside the electronic component, and the second portion is located on the electronic component, connected and electrically connected to one end of the first portion, the first portion Extending along the short axis of the heat pipe toward the substrate, the cross-sectional height of the first portion is greater than the cross-sectional height of the second portion. The heat pipe may have an L-shaped cross section. In another embodiment, the heat pipe further includes a third portion located outside the electronic component, connected and electrically connected to the other end of the second portion, and the third portion extends along the short axis of the heat pipe toward the substrate. The height of the section is greater than the height of the section of the second part. The shape of the heat pipe can be U-shaped. Material == Yuan: The outer side is bent downwards, and the fam of the electronic component board can be effectively utilized, and the air flow path of the heat pipe can be increased without increasing the situation, and the degree of the heat pipe is increased. [Embodiment] The following will be in the drawings and details. The description clearly states the spirit of this new narration, and any technical field of the art has a general knowledge of the present invention, and can be changed and (4) by the techniques taught by the present invention, without departing from the spirit of the present invention. range. Referring to Fig. 1, there is shown a schematic view of an electronic device to which an embodiment of the heat pipe of the present invention is applied. The electronic device_ includes a case thin, an electronic component (heat source) 300, a heat pipe 4, and a substrate 5A. The substrate 5 is placed in the case 200, and the electronic component 3 is disposed on the substrate 5. The heat pipe 4 is disposed on the electronic component 300 and contacts the electronic component 3 to dissipate heat from the electronic component 300. In the current trend of thinning, the twist of the component stack is also limited. The heat pipe 4 (9) proposed by the present invention can effectively utilize the space in the electronic device 100, and increase the height of the heat pipe without increasing the height of the heat pipe. The air flow path of the heat pipe 400. The electronic device 100 can be a notebook computer, a tablet computer, a mobile phone or other handheld electronic device. The electronic component 3 can be a central processing unit, a chip set or a graphics chip, etc., and the substrate 5 can be a circuit board. Taking this embodiment as an example, the electronic device 1 can be a notebook computer, the electronic component 3 can be a central processing unit chip, and the substrate 500 is a central processing unit substrate. The electronic component 300 is disposed on the substrate 500, and generally the area of the substrate 500 is larger than the electronic component 300 such that a step is formed between the electronic component 300 and the substrate 5A. The heat pipe 400 uses the space between the electronic component 3 and the substrate 5 to increase the air flow path in the heat pipe 400. Specifically, the heat pipe 400 is substantially flat to match the dimension of the electronic device 100. The heat pipe 400 extends downward in the direction of the substrate 500 outside the electronic component 3A along one end of the short axis X to locally increase the thickness of the heat pipe 4''. This short axis X especially refers to the lateral short axis after the heat pipe 4qq is flattened. In other words, the heat pipe 400 includes a first portion 410 and a second portion 420 that extends in the direction of the substrate. In a specific embodiment, the first portion 410 and the second portion 42 are perpendicular to each other. The heat pipe 4A exceeds the cross-sectional height hi of the first portion 41 of the outer edge of the electronic component 300 to be greater than the cross-sectional height of the second portion 420 of the heat pipe 400 on the electronic component 300. The first portion 410 can be in contact with or not in contact with the electronic component 3, and the second portion 420 is in contact with the electronic component 300. The heat pipe 400 has a cross-sectional shape that approximates an L shape. Compared with the traditional inline design (only the first portion 410), the heat pipe 400 of the present invention effectively utilizes the space between the electronic component 300 and the substrate 500 to increase without increasing the overall height of the electronic device 1 The air flow path in the heat pipe 400 is used to increase the heat dissipation efficiency of the heat pipe 4〇〇. Referring to Fig. 2, it is a scraped surface view of the heat pipe 4'' in Fig. 1. The heat pipe 400 includes a tube wall 402 and a capillary structure 404 formed on the tube wall 402. Air flow passage 406 is defined by tube wall 402 for the flow of fluid or gas into which it is converted. The capillary structure 4 〇4 may be a microchannel, a sintered particle or a metal mesh. The wear shape of the heat pipe 400 is approximately L-shaped. The heat pipe 400 may be integrally formed, and the first portion 41A and the second portion 420 are connected to each other and electrically connected. The wearing height hi of the first portion 410 of the heat pipe 4 is greater than the sectional height h2 of the second portion 420. The heat pipe 400 adds a first portion 410' extending downward from the side to increase the space of the air flow passage 406 in the heat pipe 400, thereby improving the heat dissipation efficiency of the heat pipe 400. Referring to Fig. 3, there is shown a schematic view of an electronic device to which another embodiment of the heat pipe of the present invention is applied. The electronic device 1A includes a housing 200, an electronic component 300, a heat pipe 400, and a substrate 500. The substrate 500 is located in the housing 200, and the electronic component 300 is disposed on the substrate 500. The heat pipe 400 is disposed on the electronic component 300 and contacts the electronic component 300 to dissipate heat from the electronic component 300. In this embodiment, the heat pipe 400 includes a first portion 410' extending from the side of the electronic component 300 toward the substrate 500 and a second portion 420 located above the electronic component 300, and further includes the other side of the slave electronic component 300. A third portion 430 extending in the direction of the substrate 500. That is, the heat pipe 400 is bent downward along one end of the short axis X to form a first portion 410. The heat pipe 400 is bent downward along the other end of the short axis X to form a third portion 430. The first portion 410 and the third portion 430 are respectively located on opposite sides of the second portion 420, that is, the first portion 410 and the third portion 430 are located on both sides of the electronic component 300. The first portion 410 and the third portion 430 may or may not be in contact with the electronic component 300, and the second portion 420 may be in contact with the electronic component 300. The heat pipe 400 has a cross-sectional shape that approximates a dome shape. Compared with the conventional inline design, the heat pipe 400 of the present invention effectively utilizes the space between the electronic component 3 and the substrate 500 to increase the air flow path in the heat pipe 400 without increasing the overall height of the electronic device 100. In order to improve the heat dissipation efficiency of the heat pipe 4 (8). Referring to Fig. 4, it is a plan view of the heat pipe 400 in Fig. 3. The heat pipe 400 includes a tube wall 402 and a capillary structure 404 formed on the tube wall 402. The air flow passage 406 is defined by the tube wall 402 for the fluid or the gas into which it is converted to flow. The capillary structure 404 can be a microchannel, a sintered particle, or a metal mesh. The wear shape of the heat pipe 400 is approximately u-shaped. The heat pipe 400 may be integrally formed. The heat pipe 4 (9) may be bent into a L-shaped or U-shaped U shape as described above by crushing the pipe diameter. The material of the wall 402 of the heat pipe 400 may be copper having good thermal conductivity. The first portion 410, the second portion 42A and the third portion 43 are connected and electrically connected. The cross-sectional height hi of the first portion of the heat pipe 400 is greater than the cross-sectional height h2 of the second portion 420, and the wearing height h3 of the third portion 430 of the heat pipe 4 (10) is greater than the cross-sectional height h2 of the second portion 420. The heat pipe 400 increases the first portion 410 and the third portion 430 extending downward from the side surface, thereby increasing the space of the hollow air flow path 406 of the heat pipe 40Q, and improving the heat dissipation efficiency of the heat pipe 400. In one embodiment, the cross-sectional height hi of the first portion 410 and the cross-sectional height h3 of the third portion 430 may be the same or different in height depending on actual needs. The heat pipe 400 can be an integrally formed process. The heat pipe 4 can be bent by the flattened pipe diameter and then bent into the L-shaped or U-shaped heat pipe 4〇〇. The material of the pipe wall 402 can be copper with good thermal conductivity. . It will be apparent from the above-described preferred embodiments of the present invention that the application of the present invention has the following advantages. The heat pipe is bent downward from the outside of the electronic component, and the space between the electronic component and the substrate is effectively utilized, and the air flow path of the heat pipe can be increased without increasing the overall height of the electronic device, thereby improving the heat dissipation efficiency of the heat pipe. The present invention has been disclosed in a preferred embodiment as above, but it is not a novelty of any of the skilled artisans, and can be used for various changes and retouchings without departing from the essence of the present invention. Therefore, the scope of this new type of M426263 protection shall be subject to the definition of the patent application scope attached. BRIEF DESCRIPTION OF THE DRAWINGS In order to make the above and other objects, features, advantages and embodiments of the present invention more obvious, the detailed description of the drawings is as follows: Figure 1 shows an embodiment of a heat pipe to which the present invention is applied. Schematic diagram of the electronic device. Fig. 2 is a cross-sectional view of the heat pipe in Fig. 1. Φ Fig. 3 is a schematic view showing an electronic device to which another embodiment of the heat pipe of the present invention is applied. Figure 4 is a cross-sectional view of the heat pipe in Figure 3.
【主要元件符號說明】 100 :電子設備 200 :殼體 300 :電子元件 400 :熱管 402 :管壁 404 :毛細結構 406 :空氣流道 410 :第一部份 420 :第二部份 430 :第三部份 500 :基板 hi、h2、h3 :截面高度 X :短軸[Main component symbol description] 100: electronic device 200: housing 300: electronic component 400: heat pipe 402: pipe wall 404: capillary structure 406: air flow path 410: first portion 420: second portion 430: third Part 500: Substrate hi, h2, h3: section height X: short axis