CN104735960B - A kind of radiator - Google Patents

A kind of radiator Download PDF

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Publication number
CN104735960B
CN104735960B CN201510085843.0A CN201510085843A CN104735960B CN 104735960 B CN104735960 B CN 104735960B CN 201510085843 A CN201510085843 A CN 201510085843A CN 104735960 B CN104735960 B CN 104735960B
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China
Prior art keywords
coating
outer tube
pipe
inner tube
sub
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CN201510085843.0A
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CN104735960A (en
Inventor
邓剑玉
金兴倍
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Dongguan Baili Electronic Technology Co ltd
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Dongguan City Is With Fast Metal Science And Technology Ltd
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Abstract

A kind of heat-dissipating pipe, is made of the sub- pipe of the heat dissipation of one or more tubuloses arranged in parallel.The sub- pipe that radiates is arranged to door opening shape either semicircle or half elliptic, the sub- pipe that radiates is provided with outer tube, inner tube and cavity, outer tube sleeve is arranged on inner tube and outer tube and inner tube sealing welding at port, outer tube outer wall face is provided with the first coating, outer tube wall face is provided with the second coating, the outside wall surface of inner tube is provided with the 3rd coating, the surface of 3rd coating is provided with the capillary function layer being made of the metal dust with rough surface structure, the cavity of sealing is formed between inner tube and outer tube, set filled with coolant in cavity and in vacuum, second coating, 3rd coating is not chemically reacted with coolant.The sub- pipe that radiates is additionally provided with the ascending pipe for injecting coolant.Outer tube wall face is provided with multiple is provided with the pillar for being abutted against with the second groove towards concave first groove in outer tube outer wall face direction and the second groove, the outside wall surface of inner tube.The heat-dissipating pipe is small, and heat dissipation effect is good.

Description

A kind of radiator
Technical field
The present invention relates to electronic product radiating technical field, more particularly to a kind of radiator.
Background technology
Good heat dissipation performance is to ensure that the important leverage that electronic product effectively works, in electronic product generally use aluminium or The radiating block of the materials such as person's copper radiates, the larger product of partial volume also have by liquid such as water or other coolants into Row cooling heat dissipation etc..But as electronic product gradually minimizes, it is desirable to which the volume of radiator is also less and less, traditional Radiator does not adapt to require.
In the prior art, for the heat dissipation problem of electronic product such as CPU etc., also there is what is radiated by heat sink, but It is that this mode still has the defects of volume is larger.
Therefore in view of the shortcomings of the prior art, a kind of small, radiator that heat dissipation performance is good is provided to overcome existing skill Art deficiency is very necessary.
The content of the invention
Radiator is provided it is an object of the invention to avoid the deficiencies in the prior art part, there is easy to operate, system The characteristics of standby efficient, product quality is good.
The object of the present invention is achieved by the following technical measures.
A kind of radiator, is made of the sub- pipe of the heat dissipation of one or more tubuloses, when being made of the more sub- pipes of heat dissipation, In arranged in parallel between the more sub- pipes of heat dissipation.
Preferably, the sub- pipe of above-mentioned heat dissipation is arranged to door opening shape either semicircle or half elliptic.
Preferably, the sub- pipe of above-mentioned heat dissipation is provided with outer tube, inner tube and cavity, and the outer tube sleeve is arranged on said inner tube and in end Sealing welding at mouthful, the outer tube outer wall face are provided with the first coating, and the outer tube wall face is provided with the second coating, described interior The outside wall surface of pipe is provided with the 3rd coating, and the surface of the 3rd coating is provided with by the metal powder with rough surface structure The capillary function layer that end is formed, forms the cavity of sealing, cooling is filled with the cavity between said inner tube and the outer tube Liquid is simultaneously set in vacuum, and second coating, the 3rd coating are not chemically reacted with the coolant.
Preferably, above-mentioned outer tube, the tube body that said inner tube is metal material.
Preferably, above-mentioned second coating is identical with the 3rd coating.
Preferably, the sub- pipe of above-mentioned heat dissipation is additionally provided with the ascending pipe for injecting coolant, and the ascending pipe is arranged at institute State outer tube and either said inner tube position or be arranged at the connecting portion of said inner tube and outer tube.
Preferably, above-mentioned capillary function layer is made of copper powder.
Preferably, the internal face of above-mentioned inner tube is provided with the 4th coating.
Preferably, above-mentioned outer tube wall face is provided with multiple recessed towards concave first groove in outer tube outer wall face direction and second Groove, the outside wall surface of said inner tube are provided with the pillar for being connect with the second groove phase, and the pillar corresponds to and is connected to institute State the second groove.
Preferably, above-mentioned first groove is arranged to strip either circle or diamond shape or other irregular shapes, described Second groove is provided in round.
Radiator provided by the invention, is made of the sub- pipe of the heat dissipation of one or more tubuloses, when by more heat dissipation When pipe is formed, in arranged in parallel between the more sub- pipes of heat dissipation.By the radiator, radiator is installed on fever during use The surface of part, can be radiated by the sub- pipe that radiates, and have the characteristics of small, heat dissipation effect is good.
Embodiment
The invention will be further described with the following Examples.
Embodiment 1.
The present embodiment provides a kind of radiator, is made of the sub- pipe of the heat dissipation of more tubuloses, is between the more sub- pipes of heat dissipation It is arranged in parallel.The sub- pipe of heat dissipation of tubulose using when be assemblied in heat generating member surface, can in time by heat generating member produce heat shift. Using the structure of tubulose, the volume of radiator can be reduced, be adapted to the growth requirement of miniaturization of electronic products.Need what is illustrated It is that the quantity of the sub- pipe of heat dissipation for forming radiator is flexibly set according to being actually needed, three be not limited in the present embodiment, When heat generating member power is smaller, one may be set to be.
In the present embodiment, the sub- pipe that radiates is arranged to door opening shape, so as to be contacted with heat generating member maximum area so that fever Transfer distributes the heat produced in the part course of work in time.It should be noted that the shape for the sub- pipe that radiates refers to single dissipate The overall structure of heater pipe, its structure are not limited to the door opening shape of the present embodiment, may be alternatively provided as semicircle or semiellipse Shape or other shapes, depending on specifically used situation.
The sub- pipe that radiates is provided with outer tube, inner tube and cavity, and outer tube sleeve is arranged on inner tube and outer tube and the interior seal of tube at port Welding.Tube body is defined either internally or externally with the central shaft of inner tube, outer tube, corresponding corresponding internal face and outside wall surface, distance The near face of body central axis is internal face, and the one side remote apart from body central axis is outside wall surface.Outer tube outer wall face is provided with first Coating, outer tube wall face are provided with the second coating, and the outside wall surface of inner tube is provided with the 3rd coating, and the surface of the 3rd coating is set There is the capillary function layer being made of the metal dust with rough surface structure, the cavity of sealing formed between inner tube and outer tube, Set filled with coolant in cavity and in vacuum, the second coating, the 3rd coating are not chemically reacted with coolant.It is preferred that The internal face of inner tube is provided with the 4th coating.
Outer tube and inner tube are the tube body of the metal material with Thermal conductivity, such as copper pipe, aluminum pipe, good to realize Good heat-conductive characteristic.On the one hand the first coating that outer tube outer wall face is set is used in time pass the heat that heat generating components produces Lead, be on the other hand used in time distribute the heat conducted, therefore the first coating is also with excellent heat dispersion performance The coating that material is prepared.Second coating in outer tube wall face, the 3rd coating in outer wall of inner tube face are used to prevent in cavity Coolant is chemically reacted with outer tube, inner tube, due to the setting of the second coating, the 3rd coating, coolant in cavity not with Outer tube, inner tube chemically react, and the second coating could be provided as identical with the 3rd coating.
The sub- pipe that radiates is additionally provided with the ascending pipe for injecting coolant, ascending pipe be arranged at outer tube or inner tube position or Person is arranged at the connecting portion of inner tube and outer tube, after by outer tube, inner tube sealing welding, then is injected into cavity by ascending pipe cold But liquid and vacuumize, then ascending pipe is sealed and obtains finished product heat dissipation son pipe.
The capillary function layer being made of the metal dust with rough surface structure that the surface of 3rd coating is set, capillary Functional layer is specifically made of copper powder.By capillary function layer, the interstitial site in copper powder, which absorbs, at normal temperatures coolant, works as hair When warmware produces heat, copper powder in cavity promotes coolant to be moved, so as to form chamber because capillary phenomenon can think outer discharge The propulsion power of internal coolant movement, promotes coolant flow in time to shift heat.
In order to effectively carry out heat transfer, outer tube wall face is provided with multiple recessed towards outer tube outer wall face direction concave first Groove and the second groove, the outside wall surface of inner tube are provided with the pillar for being connect with the second groove phase, and pillar corresponds to and is connected to second Groove.First groove is arranged to strip, and either circle or diamond shape or other irregular shapes, the second groove are provided in round. Pillar and the second groove are used to effectively support outer tube and inner tube, with the locus inside formation, prevent outer tube, inner tube to be heated Influence of crust deformation cavity body structure is produced afterwards, is effectively moved beneficial to internal coolant.
Radiator provided by the invention, is made of the sub- pipe of the heat dissipation of one or more tubuloses, when by more heat dissipation When pipe is formed, in arranged in parallel between the more sub- pipes of heat dissipation.By the radiator, radiator is installed on fever during use The surface of part, has compact, can adapt to the demand of miniaturization of electronic products development.And using capillary effect and pass through The sub- pipe that radiates radiates, and has the characteristics that heat dissipation effect is good.
Finally it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention rather than the present invention is protected The limitation of scope, although being explained in detail with reference to preferred embodiment to the present invention, those of ordinary skill in the art should manage Solution, can to technical scheme technical scheme is modified or replaced equivalently, without departing from technical solution of the present invention essence and Scope.

Claims (1)

  1. A kind of 1. radiator, it is characterised in that:It is made of the sub- pipe of the heat dissipation of one or more tubuloses, when by more heat dissipation When pipe is formed, in arranged in parallel between the more sub- pipes of heat dissipation;
    The sub- pipe of heat dissipation is arranged to door opening shape either semicircle or half elliptic;
    The sub- pipe of the heat dissipation is provided with outer tube, inner tube and cavity, the outer tube sleeve be arranged on said inner tube and at port outer tube with Inner tube sealing welding, the outer tube outer wall face are provided with the first coating, and the outer tube wall face is provided with the second coating, described interior The outside wall surface of pipe is provided with the 3rd coating, and the surface of the 3rd coating is provided with by the metal powder with rough surface structure The capillary function layer that end is formed, forms the cavity of sealing, cooling is filled with the cavity between said inner tube and the outer tube Liquid is simultaneously set in vacuum, and second coating, the 3rd coating are not chemically reacted with the coolant;
    The outer tube, the tube body that said inner tube is metal material;
    Second coating is identical with the 3rd coating;
    The sub- pipe of heat dissipation is additionally provided with the ascending pipe for injecting coolant, and the ascending pipe is arranged at the outer tube or institute State inner tube position or be arranged at the connecting portion of said inner tube and outer tube;
    The capillary function layer is made of copper powder;
    The internal face of said inner tube is provided with the 4th coating;
    The outer tube wall face is provided with multiple towards concave first groove in outer tube outer wall face direction and the second groove, said inner tube Outside wall surface be provided with pillar for being connect with the second groove phase, the pillar corresponds to and is connected to second groove.
CN201510085843.0A 2015-02-20 2015-02-20 A kind of radiator Active CN104735960B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510085843.0A CN104735960B (en) 2015-02-20 2015-02-20 A kind of radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510085843.0A CN104735960B (en) 2015-02-20 2015-02-20 A kind of radiator

Publications (2)

Publication Number Publication Date
CN104735960A CN104735960A (en) 2015-06-24
CN104735960B true CN104735960B (en) 2018-05-01

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CN (1) CN104735960B (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007017115A (en) * 2005-07-11 2007-01-25 ▲玉▼成化工有限公司 Heat pipe
US7460367B2 (en) * 2007-03-05 2008-12-02 Tracewell Systems, Inc. Method and system for dissipating thermal energy from conduction-cooled circuit card assemblies which employ remote heat sinks and heat pipe technology
TWM426263U (en) * 2011-11-14 2012-04-01 Quanta Comp Inc Heat pipe and electronic apparatu using the same
CN202836291U (en) * 2012-01-19 2013-03-27 奇鋐科技股份有限公司 Improved structure of heat pipe
CN203534305U (en) * 2013-08-29 2014-04-09 东莞泰硕电子有限公司 Heat pipe
CN204131905U (en) * 2014-09-18 2015-01-28 联想(北京)有限公司 Electronic equipment
CN204408834U (en) * 2015-02-20 2015-06-17 东莞市同迅金属科技有限公司 A kind of heat abstractor

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007017115A (en) * 2005-07-11 2007-01-25 ▲玉▼成化工有限公司 Heat pipe
US7460367B2 (en) * 2007-03-05 2008-12-02 Tracewell Systems, Inc. Method and system for dissipating thermal energy from conduction-cooled circuit card assemblies which employ remote heat sinks and heat pipe technology
TWM426263U (en) * 2011-11-14 2012-04-01 Quanta Comp Inc Heat pipe and electronic apparatu using the same
CN202836291U (en) * 2012-01-19 2013-03-27 奇鋐科技股份有限公司 Improved structure of heat pipe
CN203534305U (en) * 2013-08-29 2014-04-09 东莞泰硕电子有限公司 Heat pipe
CN204131905U (en) * 2014-09-18 2015-01-28 联想(北京)有限公司 Electronic equipment
CN204408834U (en) * 2015-02-20 2015-06-17 东莞市同迅金属科技有限公司 A kind of heat abstractor

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Effective date of registration: 20231101

Address after: Room 301, No. 3, Qixiang, Nanzha Wenming Road, Humen Town, Dongguan City, Guangdong Province, 523000

Patentee after: Dongguan Baili Electronic Technology Co.,Ltd.

Address before: 523187 Dongguan Tongxun Metal Technology Co., Ltd., Nange Industrial Zone, Daojiao Town, Dongguan City, Guangdong Province

Patentee before: DONGGUAN TONGXUN METAL SCIENCE & TECHNOLOGY Co.,Ltd.

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