TWI736470B - Heat dissipation device - Google Patents
Heat dissipation device Download PDFInfo
- Publication number
- TWI736470B TWI736470B TW109139367A TW109139367A TWI736470B TW I736470 B TWI736470 B TW I736470B TW 109139367 A TW109139367 A TW 109139367A TW 109139367 A TW109139367 A TW 109139367A TW I736470 B TWI736470 B TW I736470B
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- casing
- heat dissipation
- air inlet
- air outlet
- Prior art date
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
本發明是有關於一種散熱裝置,且特別是有關於一種可提高平板電腦散熱效率之散熱裝置。The present invention relates to a heat dissipation device, and particularly relates to a heat dissipation device that can improve the heat dissipation efficiency of a tablet computer.
隨著手持行動裝置效能及處理速度倍增,隨之而來的也令內部電子元件產生高熱反應,並傳導至手持裝置整體,令使用者產生燙手的現象發生以及電子元件過熱產生燒毀的狀態,則必需對內部電子元件進行解熱之方案。 現行手持行動裝置通常會以設置中框或以殼體的方式作為基礎乘載各項電子元件及觸控螢幕等單元的基座,而中框或殼體通常為透過機械加工的一體式之結構體,故該項業者則於行動裝置內部透過增設銅薄片、石墨片、薄型熱管、兩相流熱交換單元等輔助熱傳元件,將內部電子元件所產生之熱量擴散散熱或引導至遠端進行解熱熱傳導。With the doubling of the performance and processing speed of handheld mobile devices, the internal electronic components will also generate a high thermal response, which is transmitted to the entire handheld device, causing the user to burn hands and the electronic components will burn out due to overheating. It is necessary to de-heat the internal electronic components. Current handheld mobile devices usually use a middle frame or a casing as the base to mount various electronic components and touch screens. The middle frame or casing is usually an integrated structure through machining. Therefore, the company adds auxiliary heat transfer elements such as copper sheets, graphite sheets, thin heat pipes, two-phase flow heat exchange units, etc. inside the mobile device to diffuse and dissipate the heat generated by the internal electronic components or guide it to the remote end. Antipyretic heat conduction.
因此,如何能夠有效提昇手持裝置的散熱效率,為首要改善之缺失。Therefore, how to effectively improve the heat dissipation efficiency of the handheld device is the primary improvement.
本發明提供一種散熱裝置,透過煙囪式的散熱通道,可產生煙囪效應,增加散熱的效率。The invention provides a heat dissipation device, which can generate a chimney effect through a chimney-type heat dissipation channel and increase the efficiency of heat dissipation.
本發明提出一種散熱裝置,包括:一殼體;以及數個散熱片,係容置於該殼體內,每一該些散熱片係排列組合以形成數個通風通道於該殼體內。The present invention provides a heat dissipation device, including: a housing; and a plurality of heat sinks, which are accommodated in the housing, and each of the heat sinks is arranged and combined to form a plurality of ventilation channels in the housing.
在本發明之一實施例中,上述之殼體更包括一進風口及一出風口。In an embodiment of the present invention, the above-mentioned housing further includes an air inlet and an air outlet.
在本發明之一實施例中,上述之通風通道係貫通該進風口及該出風口。In an embodiment of the present invention, the above-mentioned ventilation channel passes through the air inlet and the air outlet.
在本發明之一實施例中,上述之進風口係設置於該殼體之下端面。In an embodiment of the present invention, the above-mentioned air inlet is provided on the lower end surface of the casing.
在本發明之一實施例中,上述之出風口係設置於該殼體之上端面。In an embodiment of the present invention, the above-mentioned air outlet is provided on the upper end surface of the casing.
在本發明之一實施例中,上述之該進風口及該出風口之設置,係依據熱空氣上升原理。In an embodiment of the present invention, the above-mentioned arrangement of the air inlet and the air outlet is based on the principle of hot air rising.
在本發明之一實施例中,上述之該些散熱片係以兩兩垂直的方式排列組合。In an embodiment of the present invention, the above-mentioned heat sinks are arranged and combined in a vertical manner.
在本發明之一實施例中,上述之該些散熱片係形成數個煙囪式通風通道於該殼體內In an embodiment of the present invention, the above-mentioned radiating fins form a plurality of chimney-type ventilation channels in the housing
在本發明之一實施例中,上述之該散熱裝置內接於一平板電腦。In an embodiment of the present invention, the aforementioned heat dissipation device is internally connected to a tablet computer.
本發明提出一種散熱裝置,適用於一平板電腦,包括:一殼體,設置於該平板電腦之背殼上,該殼體設置一進風口及一出風口;以及數個散熱片,係容置於該殼體內,每一該些散熱片係排列組合以對應該進風口及該出風口,形成數個通風通道於該殼體內。The present invention provides a heat dissipation device suitable for a tablet computer, comprising: a casing arranged on the back casing of the tablet computer, the casing is provided with an air inlet and an air outlet; and a plurality of heat sinks for accommodating In the casing, each of the radiating fins is arranged and combined to correspond to the air inlet and the air outlet to form a plurality of ventilation channels in the casing.
本發明因將散熱片與系統組成一封閉系統空間,散熱片外增加另一個系統外殼,使散熱片外空間與系統是分開的。如此系統在散熱片區域開孔不影響系統的防水防塵,且開孔大小不受安規限制。且在散熱片上方與下方區域開孔,可產生煙囪效應,增加散熱的能力。In the present invention, the heat sink and the system form a closed system space, and another system casing is added outside the heat sink, so that the space outside the heat sink is separated from the system. In this way, the opening of the system in the heat sink area does not affect the waterproof and dustproof of the system, and the size of the opening is not restricted by safety regulations. And opening holes in the upper and lower areas of the heat sink can produce a chimney effect and increase the heat dissipation capacity.
為讓本發明之上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式,作詳細說明如下。In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific examples are given in conjunction with the accompanying drawings, which are described in detail as follows.
圖1是本發明之散熱裝置的外觀示意圖。在圖1中,散熱裝置適用於一平板電腦,散熱裝置包括一殼體110及一散熱片組120,殼體110包括一進風口111及一出風口112,散熱片組120係容置於該殼體內,散熱片組120中的每一該些散熱片係兩兩互相垂直排列,並形成數個通風通道於該殼體110內。FIG. 1 is a schematic diagram of the appearance of the heat sink of the present invention. In FIG. 1, the heat sink is suitable for a tablet computer. The heat sink includes a
於本實施例中,通風通道係貫通該進風口及該出風口。In this embodiment, the ventilation channel passes through the air inlet and the air outlet.
於本實施例中,進風口係設置於該殼體之下端面。In this embodiment, the air inlet is arranged on the lower end surface of the casing.
於本實施例中,出風口係設置於該殼體之上端面。In this embodiment, the air outlet is provided on the upper end surface of the casing.
於本實施例中,該進風口及該出風口之設置,係依據熱空氣上升原理。In this embodiment, the setting of the air inlet and the air outlet is based on the principle of hot air rising.
於本實施例中,該些散熱片係形成數個煙囪式通風通道於該殼體內。In this embodiment, the radiating fins form a plurality of chimney-type ventilation channels in the housing.
於本實施例中,散熱裝置內接於一平板電腦。In this embodiment, the heat sink is internally connected to a tablet computer.
圖2是本發明之散熱裝置與平板電腦組合之的剖面圖。在圖2中可知,平板電腦具有本體的系統外殼210以包覆螢幕220、主機板230及處理器240等元件。2 is a cross-sectional view of the combination of the heat sink and the tablet computer of the present invention. As shown in FIG. 2, the tablet computer has a main system housing 210 to cover the
因此,散熱裝置係結合在平板電腦的非螢幕端面,將熱氣透過散熱裝置之殼體110內的散熱片組120的煙囪式通風通道以進行散熱,散熱片組120區域之殼體110開孔不影響平板電腦的防水防塵,且開孔大小不受安規限制。且在散熱片組120上方與下方區域開孔,可產生煙囪效應,依據熱空氣上升原理,增加散熱的能力Therefore, the heat sink is integrated on the non-screen end surface of the tablet computer, and the heat is transmitted through the chimney ventilation channel of the heat sink set 120 in the
請同時參閱圖3、圖4、圖5,圖3是本發明之散熱裝置的進風口示意圖,圖4是本發明之散熱裝置的出風口示意圖,圖5是本發明之散熱裝置一實施例示意圖。Please refer to FIGS. 3, 4, and 5 at the same time. FIG. 3 is a schematic diagram of the air inlet of the heat sink of the present invention, FIG. 4 is a schematic view of the air outlet of the heat sink of the present invention, and FIG. 5 is a schematic diagram of an embodiment of the heat sink of the present invention .
在圖5中,主要是用以說明當平板與一外接鍵盤500結合時,可在外接鍵盤500設置一風扇510,將外接鍵盤500運作所產生的熱氣往散熱裝置吹,由散熱裝置殼體110的進風口111進,透過散熱片組120的煙囪式通風通道,由散熱裝置殼體110的出風口112出,以進一步提高散熱的效果。In FIG. 5, it is mainly used to illustrate that when the tablet is combined with an
綜上所述,本發明主要特徵在於將散熱片與殼體組成一封閉系統空間,散熱片外增加另一個系統外殼,使散熱片外空間與系統是分開的,系統在散熱片區域可開孔,不影響系統的防水防塵,並可在散熱片區域產生煙囪效應散熱,增加整體散熱的能力。In summary, the main feature of the present invention is that the heat sink and the housing form a closed system space, and another system shell is added outside the heat sink to separate the space outside the heat sink from the system, and the system can be opened in the heat sink area. , Does not affect the waterproof and dustproof of the system, and can produce chimney effect heat dissipation in the heat sink area, increasing the overall heat dissipation capacity.
雖然本發明以前述實施例揭露如上,然其並非用以限定本發明,任何熟習相像技藝者,在不脫離本發明之精神和範圍內,所作更動與潤飾之等效替換,仍為本發明之專利保護範圍Although the present invention is disclosed in the foregoing embodiments as above, it is not intended to limit the present invention. Anyone who is familiar with similar skills, without departing from the spirit and scope of the present invention, makes changes and modifications equivalent to replacements, still belongs to the present invention. Patent protection scope
110:殼體 111:進風口 112:出風口 120:散熱片組 210:系統外殼 220:螢幕 230:主機板 240:處理器 500:外接鍵盤 510:風扇 110: shell 111: air inlet 112: air outlet 120: heat sink group 210: System shell 220: screen 230: Motherboard 240: processor 500: External keyboard 510: Fan
圖1是本發明之散熱裝置的外觀示意圖。 圖2是本發明之散熱裝置與平板電腦組合之的剖面圖。 圖3是本發明之散熱裝置的進風口示意圖。 圖4是本發明之散熱裝置的出風口示意圖。 圖5是本發明之散熱裝置一實施例示意圖。 FIG. 1 is a schematic diagram of the appearance of the heat sink of the present invention. 2 is a cross-sectional view of the combination of the heat sink and the tablet computer of the present invention. Fig. 3 is a schematic diagram of the air inlet of the heat sink of the present invention. Fig. 4 is a schematic diagram of the air outlet of the heat dissipation device of the present invention. Fig. 5 is a schematic diagram of an embodiment of the heat dissipation device of the present invention.
110:殼體 110: shell
111:進風口 111: air inlet
112:出風口 112: air outlet
120:散熱片組 120: heat sink group
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW109139367A TWI736470B (en) | 2020-11-11 | 2020-11-11 | Heat dissipation device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW109139367A TWI736470B (en) | 2020-11-11 | 2020-11-11 | Heat dissipation device |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI736470B true TWI736470B (en) | 2021-08-11 |
TW202219695A TW202219695A (en) | 2022-05-16 |
Family
ID=78283217
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109139367A TWI736470B (en) | 2020-11-11 | 2020-11-11 | Heat dissipation device |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI736470B (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201013368A (en) * | 2008-09-26 | 2010-04-01 | Inventec Corp | Housing structure of portable electronic device |
WO2018067129A1 (en) * | 2016-10-04 | 2018-04-12 | Hewlett-Packard Development Company, L.P. | Airflow channels between housings |
CN209417622U (en) * | 2018-10-12 | 2019-09-20 | 深圳市中科创威科技有限公司 | A kind of tablet computer with integrated radiating backboard |
CN210578708U (en) * | 2020-01-09 | 2020-05-19 | 普罗旺斯科技(深圳)有限公司 | Mobile phone heat dissipation device |
-
2020
- 2020-11-11 TW TW109139367A patent/TWI736470B/en active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201013368A (en) * | 2008-09-26 | 2010-04-01 | Inventec Corp | Housing structure of portable electronic device |
WO2018067129A1 (en) * | 2016-10-04 | 2018-04-12 | Hewlett-Packard Development Company, L.P. | Airflow channels between housings |
CN209417622U (en) * | 2018-10-12 | 2019-09-20 | 深圳市中科创威科技有限公司 | A kind of tablet computer with integrated radiating backboard |
CN210578708U (en) * | 2020-01-09 | 2020-05-19 | 普罗旺斯科技(深圳)有限公司 | Mobile phone heat dissipation device |
Also Published As
Publication number | Publication date |
---|---|
TW202219695A (en) | 2022-05-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI468100B (en) | Mobile computing device | |
TWI479984B (en) | Portable electronic device | |
TW201329679A (en) | Electronic device having a passive heat exchange device | |
TW201339813A (en) | Electronic device | |
WO2020134871A1 (en) | Shell structure and terminal device | |
US8356656B2 (en) | Heat dissipation device and method | |
TW201914401A (en) | Heat dissipation module and electronic device | |
TW200406663A (en) | Computer main body cooling system | |
TWM619677U (en) | Electronic device | |
TWI736470B (en) | Heat dissipation device | |
TWM242991U (en) | Heat sink device with multi-directional air inlets | |
US7558065B2 (en) | Air guide with heat pipe and heat sink and electronic apparatus equipped with the same | |
TWI564699B (en) | Heat sink assembly and graphics card module | |
TWI642347B (en) | Electronic assembly | |
TWI334079B (en) | ||
TW201407314A (en) | Electronic device and heat dissipation module | |
CN218244191U (en) | Heat sink device | |
TWM635791U (en) | Electronic device | |
US20220046833A1 (en) | Electronic device | |
TWI688332B (en) | Heat dissipation system | |
US20220061196A1 (en) | Diversion structure for heat dissipation of display card | |
TWI620496B (en) | Fanless electronic device and heat dissipation structure thereof | |
TWI655533B (en) | Electronic device | |
TWM607691U (en) | Electronic device | |
TWM629379U (en) | Heat dissipation system for notebook computer |