TWI620496B - Fanless electronic device and heat dissipation structure thereof - Google Patents

Abstract

A fanless electronic device includes a housing, a ventilating panel, an electronic component, and a heat sink. The ventilating plate is connected to the housing and defines an accommodating space together with the housing, and the venting plate has a plurality of venting holes. The electronic component is disposed in the accommodating space, and the heat dissipation plate is disposed between the electronic component and the ventilating plate, wherein the heat dissipation plate has a plurality of heat dissipation holes, and the plurality of heat dissipation holes respectively correspond to the plurality of vent holes. Thereby, a double-layer heat dissipation structure is formed to facilitate hot air rectification and dispersion, thereby dispersing the heat distribution region. And reduce the flow resistance of the air, increase the thermal diffusion effect, in order to achieve the effect of improving the heat dissipation effect.

Description

Fanless electronic device and heat dissipation structure thereof

The invention relates to a fanless electronic device, in particular to a fanless electronic device capable of effectively utilizing air convection cooling and a heat dissipating structure thereof.

With the development of technology, electronic products are becoming more and more popular. However, because the components inside the electronic products generate heat during operation, the temperature of the electronic products increases. Therefore, it is often necessary to provide a heat sink to cool the electronic product to facilitate the use and operation of the electronic product.

In the prior art, a common heat sink such as a fan. By providing a fan inside the electronic product, air convection is generated by the rotation of the fan, so that the air dissipates heat to the components inside the electronic product, thereby achieving the effect of cooling.

However, since the fan has a certain volume, if a fan is provided, the volume of the electronic product increases. On the other hand, in a small-sized electronic product, it is more difficult to provide a fan for heat dissipation, and it is also easy to be unstable due to shaking caused by the rotation of the fan.

In addition, due to the characteristics of air convection, the hot air naturally rises, which causes the heat to concentrate on the upper half of the electronic product, resulting in poor cooling effect. Moreover, the local temperature of the electronic product is too high, which will affect the operation of the electronic product itself, and there are risks in use.

Therefore, how to develop a fanless electronic device and its heat dissipation structure that are different from each other to improve the problems and shortcomings in the prior art, and to reduce the volume of the electronic product while dispersing the heat distribution area to achieve the heat dissipation effect. Efficacy is a key issue in the current technical field.

The main purpose of the present invention is to provide a fanless electronic device and a heat dissipating structure thereof, which solve and improve the problems and disadvantages of the foregoing prior art.

Another object of the present invention is to provide a fanless electronic device and a heat dissipating structure thereof, which are provided with a ventilating plate having a venting hole and a heat dissipating plate having a venting hole to form a double-layer heat dissipating structure for assisting hot air rectification and dispersion, thereby further The distribution area of the heat dissipation.

Another object of the present invention is to provide a fanless electronic device and a heat dissipating structure thereof, wherein a heat dissipating plate is disposed between the electronic component and the ventilating plate to increase a heat transfer path and disperse a heat distribution area, thereby improving the heat dissipating effect.

Another object of the present invention is to provide a fanless electronic device and a heat dissipating structure thereof, which are provided with a ventilating plate and a heat dissipating plate having the same opening ratio, and the venting holes respectively correspond to the heat dissipating holes to reduce the air flow resistance and increase the heat. Diffusion effect and achieve the effect of improving heat dissipation.

In order to achieve the above object, a preferred embodiment of the present invention provides a fanless electronic device including: a housing; a venting plate connected to the housing and defining an accommodating space together with the housing, wherein The ventilating plate has a plurality of venting holes; an electronic component is disposed in the accommodating space; and a heat dissipating plate is disposed between the electronic component and the ventilating plate, wherein the heat dissipating plate has a plurality of louvers, and The plurality of louvers are respectively corresponding to the plurality of vent holes.

In order to achieve the above object, a preferred embodiment of the present invention provides a heat dissipation structure suitable for a fanless electronic device having a housing and an electronic component disposed in the housing. The heat dissipation structure includes: a ventilation plate connected to the housing, wherein the ventilation plate has a plurality of ventilation holes; and a heat dissipation plate disposed between the electronic component and the ventilation plate, wherein the heat dissipation plate has A plurality of heat dissipation holes, and the plurality of heat dissipation holes respectively correspond to the plurality of ventilation holes.

1‧‧‧Fanless electronic devices

2‧‧‧Shell

3‧‧‧ ventilation panels

30, 30a, 30b‧‧‧ ventilation holes

4‧‧‧Electronic components

5‧‧‧heating plate

50, 50a, 50b‧‧‧ vents

C‧‧‧ accommodating space

D‧‧‧ separation distance

W‧‧‧ inner wall

D1‧‧‧Down

D2‧‧‧ outside diameter

1 is a schematic view showing the structure of a fanless electronic device of a preferred embodiment of the present invention.

Figure 2 is a cross-sectional view showing the fanless electronic device and its heat dissipation structure of the preferred embodiment of the present invention.

Figure 3 is a cross-sectional view showing a fanless electronic device and a heat dissipating structure thereof in another preferred embodiment of the present invention.

FIG. 4 is a schematic view showing the heat dissipation of the fanless electronic device and the heat dissipation structure thereof according to the preferred embodiment of the present invention.

FIG. 5 is a schematic view showing the heat dissipation of the fanless electronic device and the heat dissipation structure thereof according to another preferred embodiment of the present invention.

Some exemplary embodiments embodying the features and advantages of the present invention are described in detail in the following description. It is to be understood that the present invention is capable of various modifications in various aspects, and is not intended to limit the scope of the invention.

Please refer to FIG. 1 and FIG. 2 , wherein FIG. 1 is a schematic structural view of a fanless electronic device according to a preferred embodiment of the present invention, and FIG. 2 is a view showing a fanless electronic device and a heat dissipation structure thereof according to a preferred embodiment of the present invention. Sectional view. As shown in FIG. 1 and FIG. 2, the fanless electronic device 1 of the present invention includes a housing 2, a ventilating plate 3, an electronic component 4, and a heat sink 5, wherein the fanless electronic device 1 can be, for example, a sharer (Switch). Or a router, the electronic component 4 can be, for example, a circuit board, but not limited thereto. In some embodiments, the ventilating plate 3 is made of a plastic material, and the heat dissipating plate 5 is made of a material having a high thermal conductivity coefficient, such as copper or aluminum, but not limited thereto.

According to the concept of the present invention, the ventilating plate 3 is connected to the casing 2 and defines the accommodating space C together with the casing 2, and the ventilating plate 3 has a plurality of venting holes 30. The electronic component 4 is disposed in the accommodating space C, and the heat dissipation plate 5 is disposed between the electronic component 4 and the ventilating plate 3, wherein the heat dissipation plate 5 has a plurality of heat dissipation holes 50, and the plurality of heat dissipation holes 50 respectively correspond to the plurality of heat dissipation holes 50 A ventilation hole 30 is provided.

In other words, each of the venting holes 30 is located at the position of the ventilating plate 3, corresponding to the position of each of the louvers 50 located at the heat radiating plate 5. It should be noted that the dotted portions of the ventilating plate 3 and the heat dissipating plate 5 shown in FIGS. 2 and 3 are actually connected structures, so as to clearly highlight the positions of the venting holes 30 and the louvers 50, The dotted line indicates it.

In some embodiments, the ventilating plate 3 and the heat dissipating plate 5 are connected to the housing 2 through the engaging structure, but are not limited thereto. In other embodiments, the fanless electronic device 1 may include two ventilation plates 3 and two heat dissipation plates 5, and the two ventilation plates 3 are respectively disposed on opposite sides of the casing 2, and the two heat dissipation plates 5 are Correspondingly, it is disposed between the two ventilation plates 3 and the electronic component 4, but is not limited thereto.

According to the concept of the present case, the ventilation plate 3 and the heat dissipation plate 5 can be further included in a heat dissipation structure. For example, the present invention provides a heat dissipation structure suitable for a fanless electronic device 1 in which no fan is electrically The sub-device 1 has a housing 2 and an electronic component 4, and the electronic component 4 is disposed in the housing 2, and the heat dissipation structure includes a ventilation panel 3 and a heat dissipation plate 5. The ventilating plate 3 is connected to the casing 2, and the ventilating plate 3 has a plurality of venting holes 30. The heat dissipation plate 5 is disposed between the electronic component 4 and the ventilation plate 3, wherein the heat dissipation plate 5 has a plurality of heat dissipation holes 50, and the plurality of heat dissipation holes 50 are respectively disposed corresponding to the plurality of ventilation holes 30.

In other words, the fanless electronic device and the heat dissipating structure thereof in the present invention form a double-layer heat dissipating structure by providing a ventilating plate having a vent hole and a heat dissipating plate having a venting hole to facilitate hot air rectification and dispersion, thereby dispersing the heat distribution. region.

Please refer to Figure 2 again. As shown in Fig. 2, the heat sink 5 is spaced apart from the ventilating panel 3 by a distance D to increase the heat convection path. In some embodiments, the separation distance D is greater than or equal to 1 mm and less than or equal to 5 mm, ie, 1 mm ≦ D ≦ 5 mm, but is not limited thereto. According to the concept of the present case, the separation distance D should not be too large. When the separation distance D is excessively large, the air entering by the vent hole 30 generates a backflow, so that the air that actually enters the accommodating space C is reduced.

Please refer to FIG. 3, which is a cross-sectional view showing a fanless electronic device and a heat dissipating structure thereof according to another preferred embodiment of the present invention. As shown in FIG. 3, the heat dissipating plate 5 may be disposed in a manner spaced apart from the ventilating plate 3 by a distance D, or may be attached to the ventilating plate 3 as in the present embodiment to increase the heat conduction path. Thereby, when the heat passes through the heat dissipation plate 5, it can be diffused by heat conduction, so that the heat dissipation effect of the fanless electronic device 1 is improved.

In some embodiments, the opening size of each of the ventilation holes 30 is equal to the size of the opening of each of the heat dissipation holes 50, and the opening ratio of the ventilation plate 3 is equal to the opening ratio of the heat dissipation plate 5. That is, the ratio of the total area of all the vent holes 30 to the area of the ventilating plate 3 is equal to the ratio of the total area of all the louvers 50 to the area of the ventilating plate 3, but is not limited thereto.

In other words, the fanless electronic device and the heat dissipating structure of the present invention are provided by the heat dissipating plate between the electronic component and the ventilating plate to increase the heat transfer path and disperse the heat distribution area, thereby improving the heat dissipation effect. Moreover, the ventilation plate and the heat dissipation plate having the same opening ratio are disposed, and the ventilation holes respectively correspond to the heat dissipation holes, thereby reducing the flow resistance of the air, increasing the heat diffusion effect, and achieving the effect of improving the heat dissipation effect.

Please refer to FIG. 4 and FIG. 1 and FIG. 2 , wherein FIG. 4 is a schematic diagram showing the heat dissipation of the fanless electronic device and the heat dissipation structure of the preferred embodiment of the present invention. As shown in FIG. 1, FIG. 2, and FIG. 4, the fanless electronic device 1 of the present invention is convected by air, and the outside air enters the casing 2 through the vent hole 30a, and is disposed on the heat sink 5 and the electrons via the heat dissipation hole 50a. The components 2 are exchanged for heat. After the heat exchange, the air exits the casing 2 through the other heat dissipation holes 50b and the other ventilation holes 30b, so that the electronic components 2 are cooled and cooled down.

Please refer to FIG. 5 and FIG. 1 and FIG. 2 , wherein FIG. 5 is a schematic diagram showing the heat dissipation of the fanless electronic device and the heat dissipation structure thereof according to another preferred embodiment of the present invention. As shown in Fig. 1, Fig. 2, and Fig. 5, the outer diameter d2 of the vent hole 30 of the portion of the ventilating plate of the present invention is larger than the inner diameter d1, and the inner diameter d1 is equal to the diameter of the heat dissipation hole 50. In addition, the inner wall W of the portion of the venting holes 30 is a tapered structure, such that the venting holes 30 are tapered from the outside to the inside, and in some embodiments, the inner wall W is a beveled surface, but none of them This is limited. Thereby, the flow resistance of the air is reduced, the air flowing into and out of the vent hole 30 is increased, and the heat diffusion effect is increased, thereby further improving the heat dissipation effect.

In summary, the present invention provides a fanless electronic device and a heat dissipating structure thereof. By providing a ventilating plate having a venting hole and a heat dissipating plate having a venting hole, a double-layer heat dissipating structure is formed to facilitate hot air rectification and dispersion, and further The distribution area of the heat dissipation. Moreover, by providing a heat dissipation plate between the electronic component and the ventilation plate, the heat transfer path is increased, and the heat distribution area is dispersed to improve the heat dissipation effect. At the same time, through the provision of the ventilation plate and the heat dissipation plate having the same opening ratio, and the ventilation holes respectively correspond to the heat dissipation holes, the flow resistance of the air is reduced, the heat diffusion effect is increased, and the heat dissipation effect is improved.

Even though the present invention has been described in detail by the above-described embodiments, it can be modified by those skilled in the art, and is not intended to be protected by the appended claims.

Claims (9)

A fanless electronic device includes: a casing; a venting plate connected to the casing and defining an accommodating space together with the casing, wherein the ventilating plate has a plurality of venting holes; an electronic component And the heat dissipation plate is disposed between the electronic component and the ventilation plate, wherein the heat dissipation plate has a plurality of heat dissipation holes, and the plurality of heat dissipation holes respectively correspond to the plurality of ventilation holes The portion of the vent has an inner diameter and an outer diameter, and the outer diameter is greater than the inner diameter. The fanless electronic device of claim 1, wherein the ventilating plate is made of a plastic material, and the heat dissipating plate is made of a material having a high thermal conductivity coefficient. The fanless electronic device of claim 1, wherein the heat dissipation plate is spaced apart from the ventilation plate by a distance. The fanless electronic device of claim 3, wherein the separation distance is greater than or equal to 1 mm and less than or equal to 5 mm. The fanless electronic device of claim 1, wherein the heat dissipation plate is attached to the ventilation plate. The fanless electronic device of claim 1, wherein the air enters the housing through a vent hole, and is disposed between the heat dissipation plate and the electronic component via a heat dissipation hole. And exiting the housing through another heat dissipation hole and another ventilation hole to dissipate heat and cool the electronic component. The fanless electronic device of claim 1, wherein an opening size of each of the ventilation holes is equal to an opening size of each of the heat dissipation holes, and an opening ratio of the ventilation plate is coupled to the heat dissipation plate. The opening ratio is equal. The fanless electronic device of claim 1, wherein the inner wall of the venting hole of the portion is a tapered structure. A heat dissipation structure is applicable to a fanless electronic device. The fanless electronic device has a casing and an electronic component, and the electronic component is disposed in the casing. The heat dissipation structure includes: a ventilation plate, and the casing The body plate is connected to the body, wherein the ventilating plate has a plurality of venting holes; and a heat dissipating plate is disposed between the electronic component and the ventilating plate, wherein the heat dissipating plate has a plurality of louvers, and the plurality of louvers are respectively Corresponding to the plurality of venting holes, wherein the venting portion has an inner diameter and an outer diameter, and the outer diameter is greater than the inner diameter.