TWM570001U - Heat dissipation structure of mobile device - Google Patents

Abstract

The heat dissipation structure of the mobile device comprises a heat conductor made of a metal material, and the heat conduction system is disposed on the outer casing of the mobile device through the insert molding technology, and the first surface and the second surface of the disposed heat conductor are respectively Located on the outer side and the inner side of the mobile device, when the mobile device generates thermal energy due to operation, the thermal energy is absorbed by the thermal conductor, and the thermal energy is discharged through the first surface to achieve a heat dissipation effect; and the thermal conductor can also be connected to the mobile device. The heat sources are in contact with each other, thereby forming a good heat conduction flow for heat dissipation. In particular, the metal heat conductor can also serve as an inlet for wireless charging or a function of an antenna.

Description

Mobile device heat dissipation structure

The present invention relates to a mobile device heat dissipation structure, and more particularly to a mobile device heat dissipation structure having heat conduction and heat dissipation effects.

In order to facilitate communication between people, communication devices have become more and more popular, and have gradually become one of the necessary items for people's livelihood. In order to enhance the use and effectiveness of communication devices, relevant operators have installed independent devices in communication devices. The operating system enables users to customize the functions of the expansion of communication devices, resulting in the development of related products such as smart phones and tablets.

In the development of electronic devices, increasingly higher computing performance and processing chips with high operating clocks have become the trend of today, but this has also caused more problems in heat dissipation. Moreover, the development of electronic devices has become lighter and shorter. For the design trend, the relative heat dissipation efficiency of the electronic device is relatively difficult under the trend of achieving high computational efficiency and lightness and shortness.

When the conventional electronic device is in operation, when the internal wafer or processor is operated or processed, the temperature of the wafer or the processor itself will rise, thereby generating high-temperature heat, for ultra-thin notebook computers, tablet computers, In the case of smart mobile phones and other hand-held thin and light mobile devices, in order to overcome the heat dissipation problem, only simple opening, heat conduction, heat convection, etc. can be used, but these heat dissipation methods cannot be loaded with high-performance wafers or processors. The heat generated.

As the current handheld mobile device becomes more efficient, its internal central processing unit Yuan is moving towards dual-core or quad-core and even higher performance. However, the faster the processing efficiency of the central processing unit is, the more heat it generates will be higher, so how to achieve fast in ultra-thin volume. Thermal and heat dissipation has also become a very important issue.

It can be seen that the above-mentioned conventional heat dissipation structure does have many defects, and it is not a good designer, but needs to be improved.

In view of the shortcomings derived from the above-mentioned heat dissipation structure, the creators of this case have improved and innovated, and after years of painstaking research, they finally succeeded in researching and developing the heat dissipation structure of this mobile device.

The purpose of this creation is to provide a heat dissipation structure for a mobile device having heat conduction and heat dissipation effects.

In order to achieve the above object, the heat dissipation structure of the mobile device of the present invention comprises: a heat conductor comprising opposite first and second faces, and a plurality of sides formed between the first face and the second face, the side The upper part is provided with at least one slot; an outer casing body is made of an insulating material, and the heat conductor is fixed by insert molding technology, so that the insulating material is embedded in the cavity of the side of the heat conductor, and the heat conductor is The first side and the second side are respectively disposed on the inner side and the outer side of the outer casing.

The heat dissipation structure of the mobile device disclosed in the present invention, wherein the heat conduction system is made of a metal material having a heat conducting function.

The mobile device heat dissipation structure disclosed in the present invention, wherein the heat conduction system can be designed to recognize an image of an action device or a LOGO graphic.

The heat dissipation structure of the mobile device disclosed in the present invention, wherein the surface of the heat conductor is Sprayed with heat-dissipating material to accelerate heat dissipation.

The heat dissipation structure of the mobile device disclosed in the present invention, wherein the first surface or the second surface of the heat conductor is provided with a convex or concave structure to increase the heat dissipation area.

The heat dissipation structure of the mobile device disclosed in the present invention, wherein the structure between the outer casing and the heat conductor is a thick to thin connection structure.

Compared with the prior art, the present invention has the following effects: the creation of the heat conductor is arranged on one side of the mobile device to absorb the heat generated by the mobile device during operation, and the other is used for absorption. The heat energy is removed, and the heat source and the heat source in the mobile device are further contacted with each other, thereby directly absorbing heat energy, improving the heat conduction in the mobile device, and achieving better heat dissipation effect; in particular, the heat conductor can With wireless charging and antenna function.

1‧‧‧ Thermal Conductor

11‧‧‧ first side

12‧‧‧ second side

13‧‧‧ side

14‧‧‧Slots

2‧‧‧Outer casing

3‧‧‧heat source

The first figure is a three-dimensional exploded view of the heat dissipation structure of the present mobile device.

The second figure is a three-dimensional combination diagram of the heat dissipation structure of the creation mobile device.

The third figure is a schematic diagram of the first fixed structure of the heat dissipation structure of the present mobile device.

The fourth figure is a schematic diagram of the second fixed structure of the heat dissipation structure of the creation mobile device.

The fifth figure is a schematic diagram of the third fixed structure of the heat dissipation structure of the creation mobile device.

The sixth figure is a schematic diagram of another implementation structure of the heat conductor of the heat dissipation structure of the creation mobile device.

The seventh figure is a schematic diagram of another implementation structure of the heat dissipation structure of the present mobile device.

In order to make the above and other purposes, features and advantages of the present creation more obvious, DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the preferred embodiments are described in detail with reference to the accompanying drawings.

Referring to the first to third figures, the heat dissipation structure of the mobile device includes: a heat conductor 1, which is made of a metal material having a heat conducting function, especially for aluminum or copper with excellent heat conduction. The material is not limited to the material; the heat conductor 1 includes two opposite first faces 11 and second faces 12, and a plurality of side faces 13 are formed between the first faces 11 and the second faces 12, The side surface 13 is provided with a groove (groove or groove or serrated groove) 14, and the outer shape of the heat conductor 1 can be designed to be an image of the identification mobile device, such as a mobile device LOGO; a mobile device outer casing 2, for accommodating the heat conductor 1, the heat conductor 1 and the outer shell 2 can be combined with each other through insert molding technology, and the outer shell 2 can be the side of the heat conductor 1 13 is completely covered, and since the side surface 13 of the heat conductor 1 is provided with a groove 14 (groove or convex groove or zigzag groove), the plastic of the outer casing 2 can be embedded in the groove 14 (groove or a convex groove or a serrated groove, so that the heat conductor 1 is stably disposed on the outer casing 2; the heat conductor 1 and the outer After the bodies 2 are combined with each other, the first surface 11 of the heat conductor 1 is exposed on the outer surface of the outer casing 2, and the second surface 12 is disposed on the inner surface of the outer casing 2 so as to be located inside the mobile device, as the mobile device When heat is generated due to operation, heat is absorbed through the heat conductor 1, and heat energy is discharged through the first surface 11 to achieve a heat dissipation effect.

Please refer to the fourth and fifth figures, which are respectively a schematic diagram of the fixed structure between the heat conductor 1 and the outer casing 2. In the embodiment, in order to improve the heat absorption and heat dissipation effect of the heat conductor 1, the outer casing 2 and the heat conduction are provided. The body 1 is designed from a thick to thin structure. In order to stabilize the heat conductor 1 on the outer casing 2, the outer casing 2 can be used to enhance the heat dissipation effect.

Referring to FIG. 6 again, in order to further improve the heat absorption and heat dissipation effect of the heat conductor 1, the heat dissipation material may be sprayed on the heat conductor 1 or the first surface 11 or the second surface 12 of the heat conductor 1 may be convex. The concave structure is arranged, thereby increasing the heat dissipation speed, the heat dissipation effect, and the heat dissipation area.

Referring to the seventh embodiment, in the embodiment, the heat conductor 1 can also contact the heat source 3 in the mobile device, and directly absorb the heat source 3 through the heat conductor 1, thereby forming a good heat conduction flow. Cooling.

In addition, the heat conductor 1 can also have a wireless charging inlet function or an antenna function.

The detailed description above is a detailed description of one of the possible embodiments of the present invention, and the embodiment is not intended to limit the scope of the patents, and the equivalent implementations or modifications that are not included in the spirit of the present invention should be included in The patent scope of this case. The scope of protection of this creation should be as described in the scope of the patent application described later.

Claims (9)

A heat dissipation structure for a mobile device includes: a heat conductor including opposite first and second faces, and a plurality of sides formed between the first face and the second face, and at least one of the sides a casing; the outer casing is made of an insulating material, and the heat conductor is fixed by insert molding technology, so that the insulating material is embedded in the cavity of the side of the heat conductor, and the first side and the second side of the heat conductor The faces are respectively disposed on the inner side and the outer side of the outer casing. The heat dissipation structure of the mobile device according to claim 1, wherein the heat conduction system is made of a metal material having a heat conduction function. The mobile device heat dissipation structure according to claim 1, wherein the heat conductor is designed to recognize an image of the mobile device. The heat dissipation structure of the mobile device according to claim 1, wherein the heat conduction system is sprayed with a heat dissipation material to increase the heat dissipation speed and effect. The heat dissipation structure of the mobile device according to claim 1, wherein the first surface or the second surface of the heat conductor is provided with a convex or concave structure to increase the heat dissipation area. The mobile device heat dissipation structure according to claim 1, wherein the structure between the outer casing and the heat conductor is a thick to thin connection structure. The mobile device heat dissipation structure according to claim 1, wherein the heat conduction system can serve as a wireless charging inlet. The mobile device heat dissipation structure according to claim 1, wherein the heat conduction system can function as an antenna. The mobile device heat dissipation structure according to claim 1, wherein the groove on the side of the heat conductor is a groove or a groove or a serration.