TWM593125U - Flexible circuit board with mark protection member - Google Patents

Abstract

A flexible circuit board with a mark protector includes a carrier board, a patterned circuit layer, a mark and a mark protection group, the patterned circuit layer and the mark are arranged on the carrier board, the mark protection group has at least A first protection element, a second protection element, a first gap and a second gap, the first protection element, the second protection element, the first gap and the second gap circle form a protection zone, The mark is located in the protected area.

Description

Flexible circuit board with marking protector

This creation is about a flexible circuit board, especially a flexible circuit board with a mark protection group.

A conventional flexible circuit board is provided with a metal mark on a carrier board for subsequent process positioning. However, since the flexible circuit board is transported or stored in a winding manner during the manufacturing process, it is set The metal mark on the carrier board may be pressed or rubbed by a surface of the carrier board because the flexible circuit substrate is wound up, causing the metal mark to detach from the carrier board or causing the edge of the metal mark Abrasion, or recessed on a surface of the carrier board, when the metal mark is detached from the carrier board, the edge of the metal mark is worn or recessed on the carrier board, will cause an image capture device and cannot capture the metal mark If the image is aligned, and the alignment is not possible, it will be judged as a reject by a recognition system, that is, the subsequent process cannot be performed.

A flexible circuit substrate with a mark protector of the present invention has the main purpose of avoiding that a mark provided on a carrier board is pressed or rubbed, which causes the mark to detach from the carrier board, wear out, and sink into the carrier board.

A flexible circuit substrate with a mark protector of the present invention includes a carrier board, a patterned circuit layer, a mark and a mark protection group, the carrier board has a circuit layout area and at least a mark setting area, the pattern The circuit layer is arranged in the circuit layout area, the mark is arranged in the mark arrangement area, a first height of the mark has a first height from the carrier board, the mark protection group is arranged in the mark arrangement area, The mark protection group has at least a first protection element, a second protection element, a first gap and a second gap, the first gap is located at a first end of the first protection element and the second protection element Between a third end of the second end, the second gap is located between a second end of the first protector and a fourth end of the second protector, a second exposure of the first protector There is a second height between the surface and the carrier board, the second height is not less than the first height, the first protection member, the second protection member, the first notch and the second notch circle form a protection Area, the mark is located in the protected area.

In this creation, the mark is located in the protection zone by the first protection piece, the second protection piece, the first gap and the second gap circle, and by the second height of the first protection piece It is smaller than the first height of the mark to avoid that the mark is pressed or rubbed, which causes the mark to detach from the carrier board, wear and sink into the carrier board.

Please refer to FIGS. 1, 2 and 3, a first embodiment of a flexible circuit substrate 100 with a marking protector, the flexible circuit substrate 100 includes a carrier 110 and a patterned circuit layer 120. A mark 130 and a mark protection group 140. The material of the carrier 110 is selected from polyimide (Polyimide, PI), but not limited to this, the carrier 110 has a circuit layout area 111 and at least A mark setting area 112. In this embodiment, the mark setting area 112 is located in a portion 100a to be removed of the flexible circuit substrate 100. After the manufacturing process of the flexible circuit substrate 100 is completed, the position to be removed The portion 100a will be removed. However, in different embodiments, the mark setting area 112 is not located in the portion 100a of the flexible circuit substrate 100 to be removed. When the process of the flexible circuit substrate 100 is completed After that, both the mark setting area 112 and the circuit layout area 111 are reserved.

Referring to FIGS. 1 and 2, the patterned circuit layer 120 is disposed in the circuit layout area 111, the mark 130 and the mark protection group 140 are disposed in the mark setting area 112, and the mark protection group 140 has at least a first protection The component 141, a second protection component 142, a first gap 143 and a second gap 144, the first protection component 141 and the second protection component 142 are selected from strip, block, wave, arc, etc. Three-dimensional convex rib, the first notch 143 is located between a first end 141a of the first protector 141 and a third end 142a of the second protector 142, the second notch 144 is located at the first Between a second end 141b of the protector 141 and a fourth end 142b of the second protector 142, the first protector 141, the second protector 142, the first notch 143 and the second The notch 144 is surrounded by a protection zone 150. The protection zone 150 may be selected from the area of a multi-shaped pattern. The mark 130 is located in the protection zone 150. The mark 130 is selected from a geometric three-dimensional figure, and the geometric three-dimensional figure may have Three-dimensional graphics at right angles are preferred.

Please refer to FIG. 3, in this embodiment, the mark 130 and the patterned circuit layer 120 are made of a metal material, for example, the mark 130 and the patterned circuit layer 120 are etched by a metal plate (not shown) But not limited to this. In this embodiment, at least one of the first protection member 141 or the second protection member 142 is made of a metal material, preferably, the The mark 130, the patterned circuit layer 120, the first protection member 141 and the second protection member 142 are made of the same metal material, and at least one of the first protection member 141 or the second protection member 142 Not electrically connected to the patterned circuit layer 120. In FIGS. 1, 2 and 3, it is shown that the first protection member 141 and the second protection member 142 are not electrically connected to the patterned circuit layer 120, please Referring to FIG. 4, however, in different embodiments, at least one of the first protection member 141 or the second protection member 142 is electrically connected to the patterned circuit layer 120 when the first protection member 141 Or one of the second protection members 142 is electrically connected to the patterned circuit layer 120, the first protection member 141 or the second protection member 142 can be used as a test pad of the patterned circuit layer 120, A testing device is used to test the electrical properties of the patterned circuit layer 120.

Please refer to FIG. 4, the first notch 143 is located between the first end 141 a of the first protector 141 and the third end 142 a of the second protector 142, the The second end portion 141b and the fourth end portion 142b of the second protection member 142 are connected to the patterned circuit layer 120, the first protection member 141, the second protection member 142 and the first notch 143 and the pattern The protective circuit layer 120 is surrounded by the chemical circuit layer 120. Similarly, the mark 130 is located in the protective region 150.

Please refer to FIG. 5, which is a second embodiment of the creation, the mark 130 is made of a non-metallic material, at least one of the first protection member 141 or the second protection member 142 is made of a non-metal It is made of metal material. In Figure 5, both the first protection member 141 and the second protection member 142 are made of the non-metallic material, but it is not limited to this. In different embodiments, when When one of the first protection member 141 or the second protection member 142 is made of non-metallic material, the other is made of metal material.

Please refer to FIG. 5, the first notch 143 is located between the first end 141 a of the first protection member 141 and the third end 142 a of the second protection member 142, the The second end 141b is connected to the fourth end 142b of the second protector 142 and the solder resist layer 160, the first protector 141, the second protector 142 and the first notch 143 and the solder resist The layer 160 encloses the protection zone 150, and similarly, the mark 130 is located in the protection zone 150.

Please refer to FIGS. 3 and 5. In the first and second embodiments, the flexible circuit substrate 100 further includes a solder mask 160. The solder mask 160 is disposed in the circuit layout area 111 and covers the The circuit layer 120 is patterned. The solder resist layer 160 is made of a non-metallic material. Please refer to FIG. 3. In the first embodiment, the solder resist layer 160 exposes the mark 130 and the first protector 141 And the second protection member 142, please refer to FIG. 5, in the second embodiment, the solder resist layer 160 and at least one of the first protection member 141 or the second protection member 142 are made of the non-metallic material Made, and at least one of the first protection member 141 or the second protection member 142 is not connected to the solder mask 160. In FIG. 5, the first protection member 141 and the second protection are shown The component 142 is not connected to the solder mask 160, please refer to FIG. 6, however, in different embodiments, at least one of the first protective member 141 or the second protective member 142 is connected to the solder mask 160 connection.

Please refer to FIGS. 3 and 5, a first exposed surface 131 of the mark 130 has a first height H1 between the carrier 110, and a second exposed surface 141c of the first protector 141 reaches the carrier 110 There is a second height H2 between the third exposed surface 142c of the second protection member 142 and the carrier board 110 has a third height H3, the second height H2 is not less than the first height H1, the The third height H3 is not less than the first height H1. Preferably, the second height H2 is equal to the first height H1, and the third height H3 is equal to the second height H2.

Please refer to FIG. 1 and FIG. 2, this creation does not connect the first protection member 141 to the second protection member 142, but at the first end 141 a of the first protection member 141 and the second protection member 142 The first notch 143 is provided between the third ends 142a, and the second notch is provided between the second end 141b of the first protector 141 and the fourth end 142b of the second protector 142 The purpose of 144 is because the carrier 110 has different elastic coefficients from the first protection member 141 and the second protection member 142, so when the first protection member 141 is connected to the second protection member 142, the When the flexible circuit substrate 100 is used, the first protection member 141 and the second protection member 142 will wind up the flexible circuit substrate 100 and cause stress to concentrate on the connection between the first protection member 141 and the second protection member 142 When the stress is concentrated on the connection position, it is easy to cause the first protection member 141 and the second protection member 142 to warp or make the first protection member 141 and the second protection member 142 detach from the carrier board 110, so that The flexible circuit substrate 100 generates fine particles during the manufacturing process and contaminates the flexible circuit substrate 100, which will affect the process yield of the flexible circuit substrate 100. The first notch 143 and the second The notch 144 is used to release the stress generated by the first protection member 141 and the second protection member 142 due to the winding of the flexible circuit board 100 when the flexible circuit board 100 is wound up, which can avoid the first A protection member 141 and the second protection member 142 are raised or separated from the carrier 110.

In addition, since the second height H2 is not less than the first height H1 and the third height H3 is not less than the first height H1, when the flexible circuit substrate 100 is wound up, the first protection member 141 and The second protection member 142 interferes with the carrier board 110 to prevent the mark 130 in the protection zone 150 from contacting the carrier board 110 when the flexible circuit substrate 100 is wound up, causing the mark 130 to detach from the carrier board 110. Wear and dent in the carrier 110.

The scope of protection of this creation shall be subject to the scope defined in the appended patent application. Any changes and modifications made by those who are familiar with this skill without departing from the spirit and scope of this creation shall fall within the scope of protection of this creation. .

100: flexible circuit board 100a: Department to be removed 110: carrier board 111: Circuit layout area 112: Mark setting area 120: Patterned circuit layer 130: Mark 131: The first appearance 140: Mark protection group 141: First protector 141a: first end 141b: Second end 141c: Second appearance 142: Second protector 142a: third end 142b: Fourth end 142c: third appearance 143: The first gap 144: Second gap 150: protected area 160: solder mask H1: first height H2: second height H3: third height

Figure 1: The top view of the flexible circuit board of this creation. Figure 2: The top view of the flexible circuit board of this creation. Figure 3: A cross-sectional view of the flexible circuit board of this creation. Figure 4: Top view of the flexible circuit board of this creation. Figure 5: A cross-sectional view of the flexible circuit board of this creation. Figure 6: Top view of the flexible circuit board of this creation.

100: flexible circuit board

100a: Department to be removed

110: carrier board

111: Circuit layout area

112: Mark setting area

120: Patterned circuit layer

130: Mark

140: Mark protection group

141: First protector

141a: first end

141b: Second end

142: Second protector

142a: third end

142b: Fourth end

143: The first gap

144: Second gap

150: protected area

Claims (20)

A flexible circuit board with a marking protector, including: A carrier board with a circuit layout area and at least one mark setting area; A patterned circuit layer, disposed in the circuit layout area; A mark provided in the mark setting area, a first height from the first exposed surface of the mark to the carrier board; and A mark protection group is disposed in the mark installation area, the mark protection group has at least a first protection element, a second protection element, a first gap and a second gap, the first gap is located on the first protection element Between a first end of the second protector and a third end of the second protector, the second gap is located between a second end of the first protector and a fourth end of the second protector There is a second height between a second exposed surface of the first protector and the carrier board, the second height is not less than the first height, the first protector, the second protector, the first A notch and the second notch circle form a protection zone, and the mark is located in the protection zone. The flexible circuit board with a mark protector as described in item 1 of the patent application scope, wherein the second height is equal to the first height. The flexible circuit board with a marking protector as described in item 1 or 2 of the patent application scope, wherein a third height from the third exposed surface of the second protector to the carrier board, the third The height is not less than the first height. The flexible circuit board with a mark protector as described in item 3 of the patent application scope, wherein the third height is equal to the second height. The flexible circuit substrate with a mark protector as described in item 1 of the patent application scope, wherein the mark and the patterned circuit layer are made of a metal material. The flexible circuit board with a mark protector as described in item 1 of the patent application scope, wherein the mark is made of a non-metallic material. The flexible circuit board with a mark protection member as described in item 1, 5 or 6 of the patent application scope, wherein at least one of the first protection member or the second protection member is made of a metal material. The flexible circuit board with a marking protector as described in item 1, 5 or 6 of the patent application scope, wherein at least one of the first protector or the second protector is made of a non-metallic material . The flexible circuit board with a mark protector as described in item 8 of the patent application scope further includes a solder mask layer, which is disposed in the circuit layout area and covers the patterned circuit layer, the solder mask The layer is made of this non-metallic material. The flexible circuit board with a marking protector as described in item 9 of the patent application scope, wherein at least one of the first protector or the second protector is not connected to the solder mask. The flexible circuit substrate with a marking protector as described in item 7 of the patent application scope, wherein at least one of the first protector or the second protector is not electrically connected to the patterned circuit layer. The flexible circuit substrate with a marking protector as described in item 7 of the patent application scope, wherein at least one of the first protector or the second protector is electrically connected to the patterned circuit layer. A flexible circuit board with a marking protector, including: A carrier board with a circuit layout area and at least one mark setting area; A patterned circuit layer, disposed in the circuit layout area; A solder mask layer, which is disposed in the circuit layout area and covers the patterned circuit layer; A mark provided in the mark setting area, a first height from the first exposed surface of the mark to the carrier board; and A mark protection group is disposed in the mark installation area, the mark protection group has at least a first protection member, a second protection member and a first notch, the first notch is located at a first end of the first protection member And a third end of the second protector, a second end of the first protector and a fourth end of the second protector are connected to the solder mask, the first protection There is a second height between a second exposed surface of the component and the carrier board, the second height is not less than the first height, the first protection member, the second protection member, the first notch and the solder resist The layer circle forms a protection zone, and the mark is located in the protection zone. The flexible circuit board with a mark protector as described in item 13 of the patent application scope, wherein the second height is equal to the first height. The flexible circuit board with a marking protector as described in item 13 or 14 of the patent application scope, wherein a third height from the third exposed surface of the second protector to the carrier board, the third The height is not less than the first height. The flexible circuit board with a mark protector as described in item 15 of the patent application range, wherein the third height is equal to the second height. A flexible circuit board with a marking protector, including: A carrier board with a circuit layout area and at least one mark setting area; A patterned circuit layer, disposed in the circuit layout area; A mark provided in the mark setting area, a first height from the first exposed surface of the mark to the carrier board; and A mark protection group is disposed in the mark installation area, the mark protection group has at least a first protection member, a second protection member and a first notch, the first notch is located at a first end of the first protection member And a third end of the second protector, a second end of the first protector and a fourth end of the second protector are connected to the patterned circuit layer, the first A second height between the second exposed surface of the protection member and the carrier board is not less than the first height, the first protection member, the second protection member, the first notch and the pattern The circuit layer circle forms a protection zone, and the mark is located in the protection zone. The flexible circuit substrate with a mark protector as described in item 17 of the patent application scope, wherein the second height is equal to the first height. The flexible circuit board with a marking protector as described in item 17 or 18 of the patent application scope, wherein a third height from the third exposed surface of the second protector to the carrier board, the third The height is not less than the first height. The flexible circuit board with a mark protector as described in item 19 of the patent application range, wherein the third height is equal to the second height.

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