TWI763333B - Roll-up circuit board - Google Patents

Abstract

A roll-up circuit board includes a flexible substrate, a patterned metal layer and at least one stiffener. The patterned metal layer has a first pattern and a second pattern, and a gap not smaller than 50 µm exists between the first and second patterns. The stiffener is located between the first and second patterns for enhancing bending strength of the flexible substrate under and between the first and second patterns. Consequently, the first and second patterns are protected from damage, caused by the flexible substrate, while the circuit board is rolled up and are available for optical sensing.

Description

Roll-up circuit board

The present invention relates to a roll-up circuit substrate, in particular to a roll-up circuit board with at least one reinforcing member disposed between two pattern portions of a patterned metal layer.

In the process of manufacturing a circuit substrate, in order to check whether a plurality of circuits or a solder mask on a carrier board is abnormal, a pair of alignment marks are usually set on the carrier board for an optical sensor to align and perform subsequent testing.

Since the carrier board is flexible, when the circuit substrate is rolled up, the carrier board touches the alignment mark, so that the optical sensing element cannot identify the alignment mark, thereby making the circuit The board was judged to be defective.

The main purpose of the present invention is to provide a reinforcing piece between a first pattern portion and a second pattern portion of a patterned metal layer, and the height of the reinforcing piece is not lower than the height of the first pattern portion and the second pattern portion. height, the reinforcing piece is used to increase the flexural strength of the flexible carrier located under the reinforcing piece, so as to avoid the exposed surfaces of the first pattern portion and the second pattern portion when the roll-up circuit substrate is rolled up It is crushed and cannot be viewed through an optical sensor.

A roll-up circuit substrate of the present invention includes a flexible carrier, a patterned metal layer and at least one reinforcing member, the flexible carrier has a first surface and a second surface, and the patterned metal layer is disposed on the On the first surface, the patterned metal layer at least includes a first pattern portion and a second pattern portion, the first pattern portion includes a first base portion and a first conducting portion, and the first conducting portion is disposed on the On the first base, the first base and the first conducting portion are made of different materials, the first pattern portion is selected from one of a pair of alignment marks or a conducting circuit, and the first pattern portion has a first a height, the second pattern portion includes a second base portion and a second lead portion, the second lead portion is disposed on the second base portion, the second base portion and the second lead portion are made of different materials, The second pattern portion is selected from another alignment mark, the second pattern portion has a second height, there is a first gap between the first pattern portion and the second pattern portion, and the first gap is not less than 50 Micrometer, the reinforcing piece is disposed on the first surface, and the reinforcing piece is located between the first pattern portion and the second pattern portion, the reinforcing piece has a third height, and the third height is not lower than the first pattern portion height and the second height.

In the present invention, the flexural strength of the flexible carrier is increased by the reinforcing member, and the third height of the reinforcing member is not lower than the first height of the first pattern portion and the first height of the second pattern portion. The two heights can prevent the exposed surfaces of the first pattern portion and the second pattern portion from being crushed and unable to be inspected by the optical sensor when the flexible carrier is rolled up.

Please refer to FIGS. 1 and 2A, which are an embodiment of the present invention. Please refer to FIG. 2B, which is another embodiment of the present invention. A roll-up circuit substrate can be reeled (not shown) Rolling, the rolling circuit substrate includes a flexible carrier 100, a patterned metal layer 200 and at least one reinforcing member 300, the flexible carrier 100 has a first surface 110 and a second surface 120, the patterned The metal layer 200 is disposed on the first surface 110. The patterned metal layer 200 at least includes a first pattern portion 210 and a second pattern portion 220. The first pattern portion 210 is selected from a pair of alignment marks or a conductive connection One of the lines, the second pattern portion 220 is selected from another alignment mark.

Please refer to FIGS. 2A and 2B. In this embodiment, the patterned metal layer 200 is made of a metal plate (not shown in the figure) through a patterning process (such as an etching process) and a bonding layer process (such as electroplating, coating) In this embodiment, the bonding layer is a tin layer, but the present invention does not limit the formation method or material of the patterned metal layer 200 by this.

Please refer to FIGS. 1 , 2A and 2B, the first pattern portion 210 includes a first base portion 211 and a first conducting portion 212 , the first conducting portion 212 is disposed on the first base portion 211 , and the first The base portion 211 and the first conducting portion 212 are made of different materials. The second pattern portion 220 includes a second base portion 221 and a second conducting portion 222 . The second conducting portion 222 is disposed on the second base portion 221 . , the second base portion 221 and the second conductive portion 222 are made of different materials. In this embodiment, the first base portion 211 and the second base portion 221 are made by an etching process. The material of the second base portion 221 is copper, the first conductive portion 212 and the second conductive portion 222 are made by an electroplating process, and the material of the first conductive portion 212 and the second conductive portion 222 is Tin, the first pattern portion 210 has a first height H1, the second pattern portion 220 has a second height H2, please refer to FIGS. 2A, 2B and 3, the first pattern portion 210 and the second pattern portion There is a first gap G1 between 220, and the first gap G1 is not less than 50 microns.

Please refer to Figures 1, 2A and 2B, the reinforcing member 300 is disposed on the first surface 110, and the reinforcing member 300 is located between the first pattern portion 210 and the second pattern portion 220, please refer to Figure 2A, Two reinforcing members 300 are disposed between the first pattern portion 210 and the second pattern portion 220 , or, referring to FIG. 2B , one reinforcing member 300 is disposed between the first pattern portion 210 and the second pattern portion 220 The reinforcing member 300, but the present invention does not limit the number of the reinforcing member 300. The reinforcing member 300 is used to increase the flexural strength of the flexible carrier 100 located under the reinforcing member 300, so as to avoid rolling up the roll-up type When the circuit substrate is used, the exposed surfaces of the first pattern portion 210 and the second pattern portion 220 are crushed and cannot be inspected by the optical sensor.

Please refer to FIGS. 1 and 2A. Preferably, when the first gap G1 is not less than 70 microns, the roll-up circuit substrate includes two reinforcing members 300, each of which is adjacent to the first pattern portion 210 and the first pattern portion 210 respectively. The second pattern portion 220 .

Referring to FIGS. 2A and 3, along a direction of a virtual longitudinal axis Y, there is a second gap G2 between the reinforcing member 300 adjacent to the first pattern portion 210 and the first pattern portion 210. The second The gap G2 is not greater than 35 microns. Preferably, along the other direction of the virtual longitudinal axis Y, there is a third gap G3 between the reinforcing member 300 adjacent to the second pattern portion 220 and the second pattern portion 220 , the third gap G3 is not greater than 35 microns.

Please refer to Figures 1 and 2A, the reinforcing member 300 has a third height H3, the third height H3 is not lower than the first height H1 and the second height H2, the reinforcing member 300 can avoid the rolling up When the type circuit substrate is used, the exposed surfaces of the first pattern portion 210 and the second pattern portion 220 are crushed and cannot be inspected by an optical sensor.

Please refer to FIGS. 1 , 2A and 2B. In this embodiment, the reinforcing member 300 is formed from the metal plate through the patterning process and the bonding layer process. The reinforcing member 300 includes a third base portion 310 and a receiving The pressing portion 320, the pressing portion 320 is located on the third base 310, the third base 310 and the pressing portion 320 are made of different materials, in this embodiment, the material of the third base 310 is copper, the receiving The material of the pressing portion 320 is tin. However, in different embodiments, the reinforcing member 300 may be made of a non-metallic material, or the reinforcing member 300 may be made of a single material, that is, the third base portion 310 and the The pressure receiving portion 320 is integrated.

For the implementation of the patterned metal layer 200 and the reinforcing member 300 of the present invention, please refer to FIGS. 3 to 9 .

Please refer to FIG. 3, which is a first embodiment of the patterned metal layer 200 and the reinforcing member 300. In this embodiment, the first pattern portion 210 is a pair of alignment marks, and the second pattern The part 220 is another alignment mark, the appearance of the first pattern part 210 and the second pattern part 220 are substantially the same, and the first pattern part 210 and the second pattern part 220 are symmetrically arranged on the reinforcing member 300 Two sides, but the present invention is not limited thereto, the virtual longitudinal axis Y passes through the first pattern portion 210 , the reinforcing member 300 and the second pattern portion 220 , and the first pattern portion 210 has a first boundary 210 a and a second border 210b, the second pattern portion 220 has a third border 220a and a fourth border 220b, the reinforcing member 300 has a fifth border 300a and a sixth border 300b, along the vertical axis of the virtual In the Y direction, a first width D1 between the first border 210a and the second border 210b is not greater than a third width D3 between the fifth border 300a and the sixth border 300b, and the third border 220a and the A second width D2 between the fourth borders 220b is not greater than the third width D3.

Referring to FIG. 3 , a first imaginary straight line Y1 extends along the first boundary 210 a of the first pattern portion 210 , and the first imaginary straight line Y1 passes through the reinforcing member 300 and the third portion of the second pattern portion 220 The boundary 220a, and a first end 300c of the reinforcing member 300 protrudes from the first virtual straight line Y1, and preferably, a second virtual straight line Y2 extends along the second boundary 210b, the second virtual straight line Y2 Passing through the reinforcing member 300 and the fourth boundary 220b of the second pattern portion 220, a second end portion 300d of the reinforcing member 300 protrudes out of the second virtual straight line Y2.

Please refer to FIG. 4 , which is a second embodiment of the patterned metal layer 200 and the reinforcing member 300 . The difference from the first embodiment is that the first virtual straight line Y1 passes through the portion of the reinforcing member 300 . The fifth boundary 300a and the third boundary 220a of the second pattern portion 220, the second virtual straight line Y2 passes through the sixth boundary 300b of the reinforcing member 300 and the fourth boundary 220b of the second pattern portion 220, namely The third width D3 of the reinforcing member 300 is substantially equal to the first width D1 of the first pattern portion 210 and the second width D2 of the second pattern portion 220 . Similarly, the reinforcing member 300 can increase The flexural strength of the flexible carrier 100 under the reinforcing member 300 can prevent the exposed surfaces of the first pattern portion 210 and the second pattern portion 220 from being crushed and unable to pass through when the reelable circuit substrate is rolled up The optical sensor inspects.

Please refer to FIG. 5 , which is a third embodiment of the patterned metal layer 200 and the reinforcing member 300 . The difference from the first embodiment is that the second pattern portion 220 is a circular mark. Perpendicular to the virtual longitudinal axis Y direction, the second width D2 between the third boundary 220a to the fourth boundary 220b of the second pattern portion 220 is not smaller than the first boundary 210a to the first boundary 210a of the first pattern portion 210 The first width D1 between the second boundaries, in this embodiment, the second width D2 is greater than the first width D1, preferably, the second width D2 of the second pattern portion 220 is substantially equal to the The third width D3 of the reinforcement member 300 .

Please refer to FIG. 6 , which is a fourth embodiment of the patterned metal layer 200 and the reinforcing member 300 . The difference from the third embodiment is that the first pattern portion 210 is a rectangular mark.

Please refer to FIG. 7, which is a fifth embodiment of the patterned metal layer 200 and the reinforcing member 300. The difference from the first embodiment is that the first pattern portion 210 is a square mark, and the The first width D1 of the first pattern portion 210 is greater than the second width D2 of the second pattern portion 220, and the first virtual straight line Y1 extending along the first boundary 210a of the first pattern portion 210 passes through the reinforcement The first end portion 300c of the reinforcing member 300 protrudes out of the first virtual straight line Y1.

Please refer to FIG. 8 , which is a sixth embodiment of the patterned metal layer 200 and the reinforcing member 300 . The difference between the patterned metal layer 200 and the reinforcing member 300 is that the first virtual straight line Y1 passes through the Fifth boundary 300a.

Please refer to FIG. 9 , which is a seventh embodiment of the patterned metal layer 200 and the reinforcing member 300 . The difference from the first embodiment is that a virtual transverse axis X passes through the first pattern portion 210 , The reinforcing member 300 and the second pattern portion 220, the first pattern portion 210 has the first boundary 210a and the second boundary 210b, a third virtual straight line X1 extends along the first boundary 210a, the third virtual The straight line X1 passes through the reinforcing member 300, and a first end portion 300c of the reinforcing member 300 protrudes from the third virtual straight line X1. Preferably, a fourth virtual straight line X2 extends along the second boundary 210b. The The fourth virtual straight line X2 passes through the reinforcing member 300, and a second end portion 300d of the reinforcing member 300 protrudes from the fourth virtual straight line X2.

The present invention increases the flexural strength of the flexible carrier 100 between the first pattern portion 210 and the second pattern portion 220 by the reinforcing member 300 , and the third height H3 of the reinforcing member 300 does not Lower than the first height H1 of the first pattern portion 210 and the second height H2 of the second pattern portion 220, so that the first pattern portion 210 and the second pattern portion 210 can be avoided when the flexible carrier 100 is rolled up. The exposed surface of the pattern portion 220 is crushed and cannot be inspected by the optical sensor.

The protection scope of the present invention shall be determined by the scope of the appended patent application. Any changes and modifications made by anyone who is familiar with the art without departing from the spirit and scope of the present invention shall belong to the protection scope of the present invention. .

100: Flexible Carrier 110: First surface 120: Second surface 200: Patterned metal layer 210: The first pattern department 210a: First Frontier 210b: Second Frontier 211: First base 212: The first lead part 220: The second pattern part 220a: Third Frontier 220b: Fourth Frontier 221: Second base 222: The second lead part 300: Reinforcement 300a: Fifth Frontier 300b: Sixth Boundary 300c: First end 300d: Second end 310: Third base 320: Pressurized part D1: first width D2: Second width D3: The third width G1: first gap G2: Second Gap G3: Third Gap H1: first height H2: second height H3: the third height Y: virtual longitudinal axis Y1: The first virtual straight line Y2: Second virtual straight line X: virtual horizontal axis X1: The third virtual straight line X2: Fourth virtual straight line

Fig. 1 is a top view of the roll-up circuit board of the present invention. Fig. 2A is a partial cross-sectional view of the roll-up circuit board of the present invention. Fig. 2B: Another partial cross-sectional view of the roll-up circuit board of the present invention. FIGS. 3 to 9 are top views of the patterned metal layer of the roll-up circuit substrate and different implementations of the reinforcing member of the present invention.

100: Flexible Carrier

110: First surface

200: Patterned metal layer

210: The first pattern department

220: The second pattern part

300: Reinforcement

Y: virtual longitudinal axis

X: virtual horizontal axis

Claims (3)

A roll-up circuit substrate, comprising: a flexible carrier having a first surface and a second surface; a patterned metal layer disposed on the first surface, the patterned metal layer at least comprising: a first pattern part, including a first base part and a first guide part, the first guide part is arranged on the first base part, the first base part and the first guide part are made of different materials, the first pattern part is selected From one of a pair of alignment marks or a conductive line, the first pattern portion has a first height, a virtual longitudinal axis passes through the first pattern portion, and the first pattern portion has a first boundary and a a second border extending along the second border with a second virtual straight line; and a second pattern portion including a second base portion and a second conducting portion, the second conducting portion being disposed on the second base , the second base portion and the second conductive portion are made of different materials, the second pattern portion is selected from another alignment mark, the second pattern portion has a second height, the first pattern portion and the second There is a first gap between the pattern parts, the first gap is not less than 50 microns, the virtual longitudinal axis passes through the second pattern part, the second pattern part has a third boundary and a fourth boundary, the first virtual straight line Passing through the third boundary of the second pattern portion, the second virtual straight line passes through the fourth boundary of the second pattern portion, and there is a second width between the third boundary and the fourth boundary; and at least one reinforcement a piece, disposed on the first surface, and the reinforcing piece is located between the first pattern part and the second pattern part, the reinforcing piece has a third height, the third height is not lower than the first height and the At the second height, the virtual longitudinal axis passes through the reinforcing piece, along the virtual longitudinal axis direction, the first boundary extends a first virtual straight line, the first virtual straight line passes through the reinforcing piece, and the second virtual straight line passes through the reinforcing piece and a first end of the reinforcement protrudes from the first virtual straight line, a second end of the reinforcement protrudes from the second virtual straight line, and the reinforcement has a fifth boundary and a first Six boundaries, the fifth boundary to the There is a third width between the six borders, and the second width is not greater than the third width. The retractable circuit substrate of claim 1, wherein the reinforcing member comprises a third base portion and a pressure-receiving portion, the pressure-receiving portion is located on the third base portion, and the third base portion and the pressure-receiving portion are made of different materials. The roll-up circuit substrate of claim 1, wherein a first width is formed between the first boundary and the second boundary of the first pattern portion, and a second width is formed between the third boundary and the fourth boundary width, the second width is not less than the first width.

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