TW202010703A - Flexible circuit tape - Google Patents

Flexible circuit tape Download PDF

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Publication number
TW202010703A
TW202010703A TW107130913A TW107130913A TW202010703A TW 202010703 A TW202010703 A TW 202010703A TW 107130913 A TW107130913 A TW 107130913A TW 107130913 A TW107130913 A TW 107130913A TW 202010703 A TW202010703 A TW 202010703A
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Taiwan
Prior art keywords
layer
circuit board
flexible
area
flexible circuit
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TW107130913A
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Chinese (zh)
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TWI660901B (en
Inventor
陳文勇
吳沁玥
董育陞
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頎邦科技股份有限公司
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Priority to TW107130913A priority Critical patent/TWI660901B/en
Priority to CN201811169016.XA priority patent/CN110876228A/en
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Publication of TWI660901B publication Critical patent/TWI660901B/en
Publication of TW202010703A publication Critical patent/TW202010703A/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)

Abstract

A flexible circuit board is provided to prevent a flexible carrier from sticking to itself. There are a disposal area and a removal area defined on a top surface of the flexible carrier, a wire layer and a spatial structure are respectively disposed on the disposal area and the removal area of the top surface. A solder mask covers the flexible carrier and the wire layer and exposes the spatial structure. The spatial structure is used to separate the stacked flexible carrier to prevent the flexible carrier from sticking to itself during or after rolling.

Description

撓性電路板捲帶Flexible circuit board reel

本發明是關於一種撓性電路板捲帶，其用以防止該撓性電路板捲帶在捲收過程中或捲收後，該撓性電路板捲帶的一撓性載板產生相互黏附的情形。The invention relates to a flexible circuit board reel, which is used to prevent a flexible carrier board of the flexible circuit board reel from adhering to each other during or after winding of the flexible circuit board reel situation.

習知的一種撓性電路板捲帶會以一捲輪(reel)捲收，以利進行下一個製程(如進行結合複數個晶片製程及切割製程)，然由於該撓性電路板捲帶在捲收過程或捲收後，該撓性電路板捲帶的一撓性載板上會因該撓性電路板捲帶被捲收，而造成上下堆疊的該撓性載板相互黏附，導致該撓性電路板捲帶不易被捲收或捲收歪斜的情形，進而使得該撓性電路板捲帶相互磨損或造成該撓性電路板捲帶彎折。A conventional flexible circuit board reel will be wound by a reel to facilitate the next process (such as combining multiple wafer processes and cutting processes), but because the flexible circuit board is reeled in After the winding process or winding, a flexible carrier board of the flexible circuit board reel will be retracted due to the flexible circuit board reel, which causes the flexible carrier boards stacked on top of each other to adhere to each other, resulting in the The situation that the flexible circuit board reel is not easy to be wound or slanted, which further causes the flexible circuit board reel to wear each other or cause the flexible circuit board reel to bend.

本發明的一種撓性電路板捲帶，其主要目的用以避免該撓性電路板捲帶被捲收時，該撓性電路板捲帶的一撓性載板發生相互黏附的情形。The flexible circuit board reel of the present invention has the main purpose of preventing the flexible carrier board of the flexible circuit board reel from adhering to each other when the flexible circuit board reel is retracted.

本發明的一種撓性電路板捲帶包含一撓性載板、一線路層、一立體結構層及一防焊層，該撓性載板為一能被捲收的帶狀載板，該撓性載板具有一上表面，該上表面具有一線路設置區及至少一待移除區，該線路層設置於該上表面的該線路設置區，該線路層具有至少一導接端，該立體結構層設置於該上表面的該待移除區，該防焊層覆蓋該撓性載板及該線路層，該防焊層具有至少一開口，該開口顯露出該導接端，且該防焊層顯露出該立體結構層，當該撓性載板被捲收時，該立體結構層用以間隔上下堆疊的該撓性載板。A flexible circuit board reel of the present invention includes a flexible carrier board, a circuit layer, a three-dimensional structure layer and a solder mask layer. The flexible carrier board is a strip-shaped carrier board that can be rolled up. The sexual carrier has an upper surface, the upper surface has a circuit setting area and at least one area to be removed, the circuit layer is disposed on the circuit setting area on the upper surface, the circuit layer has at least one lead terminal, the three-dimensional The structural layer is disposed on the area to be removed on the upper surface, the solder mask layer covers the flexible carrier board and the circuit layer, the solder mask layer has at least one opening, the opening exposes the lead terminal, and the The solder layer exposes the three-dimensional structure layer. When the flexible carrier board is rolled up, the three-dimensional structure layer is used to space the flexible carrier boards stacked up and down.

當本發明的該撓性電路板捲帶被捲收時，該撓性載板會形成螺旋狀上下堆疊，由於該撓性載板的該上表面的該待移除區設置有該立體結構層，藉由該立體結構層間隔該撓性電路板捲帶被捲收時上下堆疊的該撓性載板，使得上下堆疊的該撓性載板不會相互黏附，以避免該撓性電路板捲帶發生不易被捲收、捲收歪斜、磨損及的彎折情形。When the flexible circuit board reel of the present invention is wound up, the flexible carrier board is formed into a spiral shape and stacked up and down, because the area to be removed on the upper surface of the flexible carrier board is provided with the three-dimensional structure layer , By the three-dimensional structure layer separating the flexible carrier boards stacked up and down when the flexible circuit board roll is wound, so that the flexible carrier boards stacked up and down will not adhere to each other, to avoid the flexible circuit board roll The belt is not easily retracted, skewing, worn or bent.

請參閱第1及2圖，本發明的一種撓性電路板捲帶100，其包含有複數個撓性電路板單元100a，在進行結合複數個晶片製程及切割單離各該撓性電路板單元100a製程前，會以一捲輪(reel)200捲收，以利儲存或進行下一個製程(如烘烤、結合晶片及切割等製程)，本發明的目的在於在捲收該撓性電路板捲帶100時，避免該撓性電路板捲帶100的一撓性載板110相互黏附，而導致該撓性電路板捲帶100發生不易被捲收、捲收歪斜、磨損及彎折的情形。Please refer to FIG. 1 and FIG. 2, a flexible circuit board tape 100 of the present invention includes a plurality of flexible circuit board units 100a, which are combined with a plurality of wafer manufacturing processes and singulating each flexible circuit board unit Before the 100a process, it will be reeled with a reel 200 to facilitate storage or the next process (such as baking, wafer bonding, and dicing processes). The purpose of the present invention is to rewind the flexible circuit board When reeling the tape 100, a flexible carrier 110 of the flexible circuit board reel 100 is prevented from adhering to each other, which may cause the flexible circuit board reel 100 to be difficult to be wound, skewing, worn and bent. .

請參閱第2及3圖，該撓性電路板捲帶100包含一撓性載板110、一線路層120、一立體結構層130及一防焊層140，該撓性載板110為一能被捲收的帶狀載板，該撓性載板110材料選自於聚醯亞胺(Polyimide,PI)或聚醯亞胺酸鹽(Polyamic acid,PAA)，但不以此為限，該撓性載板110具有一上表面111及一下表面112，該上表面111具有一線路設置區111a及至少一待移除區111b，該待移除區111b具有一第二面積，在本實施例中，該待移除區111b具有一長度X2，該長度X2不小於8mm，該待移除區111b具有一寬度Y2，該寬度Y2不小於3mm。Please refer to FIG. 2 and FIG. 3, the flexible circuit board tape 100 includes a flexible carrier 110, a circuit layer 120, a three-dimensional structure layer 130 and a solder mask 140, the flexible carrier 110 is a The rolled strip carrier board, the flexible carrier board 110 material is selected from polyimide (Polyimide, PI) or polyimide (Polyamic acid, PAA), but not limited to this, the The flexible carrier 110 has an upper surface 111 and a lower surface 112, the upper surface 111 has a line setting area 111a and at least one area to be removed 111b, the area to be removed 111b has a second area, in this embodiment In this case, the area to be removed 111b has a length X2, the length X2 is not less than 8mm, and the area to be removed 111b has a width Y2, and the width Y2 is not less than 3mm.

請參閱第2及3圖，該線路層120設置於該上表面111的該線路設置區111a，該線路層120包含複數個線路120a，該線路層120具有至少一導接端121，該導接端121用以電性連接一晶片或其他電子元件。Please refer to FIGS. 2 and 3, the circuit layer 120 is disposed on the circuit setting area 111a of the upper surface 111, the circuit layer 120 includes a plurality of circuits 120a, the circuit layer 120 has at least one lead terminal 121, the lead The terminal 121 is used to electrically connect a chip or other electronic components.

請參閱第2及3圖，該立體結構層130設置於該上表面111的該待移除區111b，在本實施例中，當對該撓性電路板捲帶100進行一切割步驟時，該立體結構層130及該待移除區111b是被移除，請參閱第4A至4C圖，該立體結構層130選自於各種幾何圖形的立體構造。Referring to FIGS. 2 and 3, the three-dimensional structural layer 130 is disposed on the area 111b to be removed of the upper surface 111. In this embodiment, when a cutting step is performed on the flexible circuit board tape 100, the The three-dimensional structure layer 130 and the to-be-removed area 111b are removed. Please refer to FIGS. 4A to 4C. The three-dimensional structure layer 130 is selected from the three-dimensional structure of various geometric figures.

請參閱第2及3圖，該立體結構層130具有一第一側壁131，在本實施例中，該立體結構層130不與該線路層120電性連接，該立體結構層130與該線路層120為相同材質，較佳地，該立體結構層130的一厚度與該線路層120的一厚度相同，且該線路層120及該立體結構層130經由蝕刻一金屬板所形成，該立體結構層130具有一底面132，該底面132朝向該撓性載板110的該上表面111，該底面的一長度X1不小於0.5mm，該底面132的一寬度Y1不小於0.5mm，且該底面132的一第一面積不小於0.5mm2 ，較佳地，該第一面積的計算公式為該第二面積乘以一係數，且該係數不小於0.012。Please refer to FIGS. 2 and 3, the three-dimensional structure layer 130 has a first side wall 131. In this embodiment, the three-dimensional structure layer 130 is not electrically connected to the circuit layer 120, and the three-dimensional structure layer 130 and the circuit layer 120 is the same material. Preferably, a thickness of the three-dimensional structure layer 130 is the same as a thickness of the circuit layer 120, and the circuit layer 120 and the three-dimensional structure layer 130 are formed by etching a metal plate. The three-dimensional structure layer 130 has a bottom surface 132 facing the upper surface 111 of the flexible carrier 110, a length X1 of the bottom surface is not less than 0.5mm, a width Y1 of the bottom surface 132 is not less than 0.5mm, and the bottom surface 132 A first area is not less than 0.5 mm 2. Preferably, the calculation formula of the first area is the second area multiplied by a coefficient, and the coefficient is not less than 0.012.

請參閱第2及3圖，該防焊層140覆蓋該撓性載板110及該線路層120，該防焊層140具有至少一開口141，該開口141顯露出該導接端121，且該防焊層140顯露出該立體結構層120，在本實施例中，該防焊層140具有一第二側壁142，較佳地，該立體結構層130的該第一側壁131與該防焊層140的該第二側壁142之間具有一間隙G。Please refer to FIGS. 2 and 3, the solder resist layer 140 covers the flexible carrier 110 and the circuit layer 120, the solder resist layer 140 has at least one opening 141, the opening 141 exposes the leading end 121, and the The solder resist layer 140 exposes the three-dimensional structure layer 120. In this embodiment, the solder resist layer 140 has a second side wall 142. Preferably, the first side wall 131 of the three-dimensional structure layer 130 and the solder resist layer There is a gap G between the second side walls 142 of 140.

請參閱第1、3及5圖，當該撓性載板110被捲收時，以該立體結構層130間隔上下堆疊的該撓性載板110，且由於該立體結構層130的該第一側壁131與該防焊層140的該第二側壁142之間具有該間隙G，使得被捲收成螺旋狀的該撓性載板110不會相互黏附，以避免該撓性電路板捲帶100被捲收時發生不易被捲收、捲收歪斜、磨損及的彎折情形。Please refer to FIGS. 1, 3 and 5, when the flexible carrier 110 is wound up, the flexible carrier 110 stacked up and down with the three-dimensional structure layer 130 spaced apart, and due to the first of the three-dimensional structure layer 130 The side wall 131 and the second side wall 142 of the solder mask 140 have the gap G, so that the flexible carrier 110 wound into a spiral shape will not adhere to each other, so as to avoid the flexible circuit board tape 100 from being caught During winding, it is difficult to be wound, skewed, worn and bent.

本發明之保護範圍當視後附之申請專利範圍所界定者為準，任何熟知此項技藝者，在不脫離本發明之精神和範圍內所作之任何變化與修改，均屬於本發明之保護範圍。The scope of protection of the present invention shall be subject to the scope defined in the attached patent application. Any changes and modifications made by those who are familiar with this skill without departing from the spirit and scope of the present invention shall fall within the scope of protection of the present invention. .

100:撓性電路板捲帶110:撓性載板111:上表面111a:線路設置區111b:待移除區112:下表面120:線路層120a:線路121:導接端130:立體結構層131:第一側壁132:底面140:防焊層141:開口142:第二側壁200:捲輪X1:長度Y1:寬度X2:長度Y2:寬度G:間隙100: Flexible circuit board reel 110: Flexible carrier 111: Upper surface 111a: Line setting area 111b: Area to be removed 112: Lower surface 120: Circuit layer 120a: Line 121: Leading end 130: Three-dimensional structure layer 131: first side wall 132: bottom surface 140: solder mask 141: opening 142: second side wall 200: reel X1: length Y1: width X2: length Y2: width G: gap

第1圖：本發明的撓性電路板捲帶捲收於捲輪的示意圖。 第2圖：本發明的撓性電路板捲帶的局部上視圖。 第3圖：本發明的撓性電路板捲帶的剖視圖。 第4A至4C圖：本發明的立體結構層的示意圖。 第5圖：本發明的撓性電路板捲帶被捲收後的局部剖視圖。Fig. 1: Schematic diagram of the flexible circuit board tape of the present invention wound up on a reel. Fig. 2: Partial top view of the flexible circuit board reel of the present invention. Figure 3: Cross-sectional view of the flexible circuit board reel of the present invention. 4A to 4C: schematic diagrams of the three-dimensional structure layer of the present invention. Fig. 5: A partial cross-sectional view of the flexible circuit board tape of the present invention after being wound up.

100:撓性電路板捲帶 100: flexible circuit board reel

110:撓性載板 110: Flexible carrier board

111a:線路設置區 111a: Line setting area

111b:待移除區 111b: Area to be removed

120:線路層 120: line layer

120a:線路 120a: line

121:導接端 121: Leading end

130:立體結構層 130: Three-dimensional structure layer

140:防焊層 140: solder mask

141:開口 141: opening

X1:長度 X1: Length

Y1:寬度 Y1: width

X2:長度 X2: Length

Y2:寬度 Y2: width

Claims (10)

一種撓性電路板捲帶，包含： 一撓性載板，為一能被捲收的帶狀載板，該撓性載板具有一上表面，該上表面具有一線路設置區及至少一待移除區； 一線路層，設置於該上表面的該線路設置區，該線路層具有至少一導接端； 一立體結構層，設置於該上表面的該待移除區；以及 一防焊層，覆蓋該撓性載板及該線路層，該防焊層具有至少一開口，該開口顯露出該導接端，且該防焊層顯露出該立體結構層，當該撓性載板被捲收時，該立體結構層用以間隔上下堆疊的該撓性載板。A flexible circuit board reel includes: a flexible carrier board, which is a strip-shaped carrier board that can be rolled up, the flexible carrier board has an upper surface, the upper surface has a circuit setting area and at least one waiting area A removal layer; a circuit layer disposed on the upper surface of the circuit installation region, the circuit layer having at least one lead terminal; a three-dimensional structure layer disposed on the upper surface of the region to be removed; and a solder mask Layer, covering the flexible carrier board and the circuit layer, the solder mask layer has at least one opening, the opening exposes the lead terminal, and the solder mask layer exposes the three-dimensional structure layer, when the flexible carrier board is During winding, the three-dimensional structural layer is used to space the flexible carrier boards stacked up and down. 如申請專利範圍第1項所述之撓性電路板捲帶，其中該立體結構層不與該線路層電性連接。The flexible circuit board reel as described in item 1 of the patent scope, wherein the three-dimensional structure layer is not electrically connected to the circuit layer. 如申請專利範圍第1項所述之撓性電路板捲帶，其中該立體結構層具有一第一側壁，該防焊層具有一第二側壁，該第一側壁與該第二側壁之間具有一間隙。The flexible circuit board reel as described in item 1 of the patent application scope, wherein the three-dimensional structure layer has a first side wall, the solder mask layer has a second side wall, and there is a space between the first side wall and the second side wall A gap. 如申請專利範圍第1項所述之撓性電路板捲帶，其中該立體結構層與該線路層為相同材質。The flexible circuit board reel as described in item 1 of the patent scope, wherein the three-dimensional structure layer and the circuit layer are made of the same material. 如申請專利範圍第1項所述之撓性電路板捲帶，其中該立體結構層的一厚度與該線路層的一厚度相同。The flexible circuit board reel as described in item 1 of the patent application scope, wherein a thickness of the three-dimensional structure layer is the same as a thickness of the circuit layer. 如申請專利範圍第1項所述之撓性電路板捲帶，其中該線路層及該立體結構層經由蝕刻一金屬板所形成。The flexible circuit board reel as described in item 1 of the patent application scope, wherein the circuit layer and the three-dimensional structure layer are formed by etching a metal plate. 如申請專利範圍第1項所述之撓性電路板捲帶，其中該待移除區的一長度不小於8mm，該待移除區的一寬度不小於3mm。The flexible circuit board reel as described in item 1 of the patent application scope, wherein a length of the area to be removed is not less than 8 mm, and a width of the area to be removed is not less than 3 mm. 如申請專利範圍第1或7項所述之撓性電路板捲帶，其中設置於該撓性載板的該上表面的該立體結構層具有一底面，該底面朝向該撓性載板的該上表面，該底面的一長度不小於0.5mm，該底面的一寬度不小於0.5mm，且該底面的一第一面積不小於0.5mm2 。The flexible circuit board reel as described in item 1 or 7 of the patent application scope, wherein the three-dimensional structural layer disposed on the upper surface of the flexible carrier board has a bottom surface, the bottom surface facing the flexible carrier board On the upper surface, a length of the bottom surface is not less than 0.5 mm, a width of the bottom surface is not less than 0.5 mm, and a first area of the bottom surface is not less than 0.5 mm 2 . 如申請專利範圍第1項所述之撓性電路板捲帶，其中設置於該撓性載板的該上表面的該立體結構層具有一底面，該底面具有一第一面積，該待移除區具有一第二面積，該第一面積的計算公式為該第二面積乘以一係數，該係數不小於0.012。The flexible circuit board reel as described in item 1 of the patent application scope, wherein the three-dimensional structural layer disposed on the upper surface of the flexible carrier board has a bottom surface, the bottom mask has a first area, and the to-be-removed The area has a second area, and the calculation formula of the first area is the second area multiplied by a coefficient, which is not less than 0.012. 如申請專利範圍第1項所述之撓性電路板捲帶，其中當對該撓性電路板捲帶進行一切割步驟時，該立體結構層及該待移除區被移除。The flexible circuit board reel as described in item 1 of the patent application scope, wherein when the flexible circuit board reel is subjected to a cutting step, the three-dimensional structural layer and the area to be removed are removed.
TW107130913A 2018-09-04 2018-09-04 Flexible circuit tape TWI660901B (en)

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Application Number Priority Date Filing Date Title
TW107130913A TWI660901B (en) 2018-09-04 2018-09-04 Flexible circuit tape
CN201811169016.XA CN110876228A (en) 2018-09-04 2018-10-08 Flexible circuit board tape

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TW107130913A TWI660901B (en) 2018-09-04 2018-09-04 Flexible circuit tape

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TWI660901B TWI660901B (en) 2019-06-01
TW202010703A true TW202010703A (en) 2020-03-16

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TWI737257B (en) * 2020-04-13 2021-08-21 頎邦科技股份有限公司 Roll-up circuit board
TWI738504B (en) * 2020-09-11 2021-09-01 頎邦科技股份有限公司 Circuit board tape and joining method thereof
TWI741956B (en) * 2020-04-13 2021-10-01 頎邦科技股份有限公司 Roll-up circuit board
TWI744197B (en) * 2020-04-13 2021-10-21 頎邦科技股份有限公司 Roll-up circuit board
TWI763334B (en) * 2020-04-13 2022-05-01 頎邦科技股份有限公司 Roll-up circuit board
TWI763333B (en) * 2020-04-13 2022-05-01 頎邦科技股份有限公司 Roll-up circuit board

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Publication number Priority date Publication date Assignee Title
TWI737257B (en) * 2020-04-13 2021-08-21 頎邦科技股份有限公司 Roll-up circuit board
TWI741956B (en) * 2020-04-13 2021-10-01 頎邦科技股份有限公司 Roll-up circuit board
TWI744197B (en) * 2020-04-13 2021-10-21 頎邦科技股份有限公司 Roll-up circuit board
TWI763334B (en) * 2020-04-13 2022-05-01 頎邦科技股份有限公司 Roll-up circuit board
TWI763333B (en) * 2020-04-13 2022-05-01 頎邦科技股份有限公司 Roll-up circuit board
TWI738504B (en) * 2020-09-11 2021-09-01 頎邦科技股份有限公司 Circuit board tape and joining method thereof
US11602047B2 (en) 2020-09-11 2023-03-07 Chipbond Technology Corporation Circuit board tape and joining method thereof

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TWI660901B (en) 2019-06-01

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