TWI741956B - Roll-up circuit board - Google Patents

Abstract

A roll-up circuit board includes a flexible substrate, a patterned metal layer and at least one stiffener. The patterned metal layer has a first pattern and a second pattern, and a gap not smaller than 50 µm exists between the first and second patterns. The stiffener is located between the first and second patterns for enhancing bending strength of the flexible substrate under and between the first and second patterns. Consequently, the first and second patterns are protected from damage, caused by the flexible substrate, while the circuit board is rolled up and are available for optical sensing.

Description

Roll-up circuit board

The invention relates to a retractable circuit substrate, in particular to a retractable circuit substrate provided with at least one reinforcing member between two pattern portions of a patterned metal layer.

In the process of manufacturing a circuit board, in order to check whether a plurality of circuits or a solder mask on a carrier board is abnormal, a pair of marks is usually set on the carrier board for an optical sensor to be aligned and performed. Follow-up testing.

Since the carrier board is flexible, when the circuit substrate is rolled up, the carrier board will touch the alignment mark, which causes the optical sensing element to be unable to distinguish the alignment mark, thereby making the circuit The substrate was judged to be defective.

The main purpose of the present invention is to provide a reinforcing member between a first pattern portion and a second pattern portion of a patterned metal layer, and the height of the reinforcing member is not lower than the height of the first pattern portion and the second pattern portion. Height, the reinforcing member is used to increase the flexural strength of the flexible carrier located below the reinforcing member, so as to avoid the exposed surfaces of the first pattern portion and the second pattern portion when the retractable circuit substrate is rolled up It is crushed and cannot be inspected by an optical sensor.

A roll-up circuit substrate of the present invention includes a flexible carrier, a patterned metal layer and at least one reinforcing member. The flexible carrier has a first surface and a second surface. The patterned metal layer is disposed on the On the first surface, the patterned metal layer includes at least a first pattern portion and a second pattern portion, the first pattern portion includes a first base portion and a first conductive portion, and the first conductive portion is disposed on the On the first base portion, the first base portion and the first connecting portion are made of different materials, the first pattern portion is selected from one of a pair of markings or a connecting line, and the first pattern portion has a first pattern portion. A height, the second pattern portion includes a second base and a second guiding portion, the second guiding portion is disposed on the second base, the second base and the second guiding portion are made of different materials, The second pattern portion is selected from another alignment mark, the second pattern portion has a second height, and there is a first gap between the first pattern portion and the second pattern portion, and the first gap is not less than 50 Micrometers, the reinforcing member is disposed on the first surface, and the reinforcing member is located between the first pattern portion and the second pattern portion, the reinforcing member has a third height, and the third height is not lower than the first Height and the second height.

In the present invention, the flexural strength of the flexible carrier is increased by the reinforcing member, and the third height of the reinforcing member is not lower than the first height of the first pattern part and the first height of the second pattern part. Two heights can prevent the exposed surfaces of the first pattern portion and the second pattern portion from being crushed and unable to be inspected by the optical sensor when the flexible carrier is rolled up.

Please refer to Figures 1 and 2A, which is an embodiment of the present invention. Please refer to Figure 2B, which is another embodiment of the present invention. A retractable circuit substrate can be reeled (not shown) Rolling, the roll-up circuit substrate includes a flexible carrier 100, a patterned metal layer 200, and at least one reinforcing member 300. The flexible carrier 100 has a first surface 110 and a second surface 120. The patterned The metal layer 200 is disposed on the first surface 110. The patterned metal layer 200 includes at least a first pattern portion 210 and a second pattern portion 220. The first pattern portion 210 is selected from a pair of markings or a conductive connection One of the lines, the second pattern portion 220 is selected from another alignment mark.

Please refer to Figures 2A and 2B. In this embodiment, the patterned metal layer 200 is formed from a metal plate (not shown) through a patterning process (such as an etching process) and a bonding layer process (such as electroplating, coating). In this embodiment, the bonding layer is a tin layer, but the present invention does not limit the method or material of the patterned metal layer 200 in this way.

Please refer to Figures 1, 2A and 2B. The first pattern portion 210 includes a first base 211 and a first conductive portion 212. The first conductive portion 212 is disposed on the first base 211, and the first The base 211 and the first connecting portion 212 are made of different materials. The second pattern portion 220 includes a second base 221 and a second connecting portion 222. The second connecting portion 222 is disposed on the second base 221 The second base 221 and the second connecting portion 222 are made of different materials. In this embodiment, the first base 211 and the second base 221 are made by an etching process, and the first base 211 and the The material of the second base 221 is copper, the first connecting portion 212 and the second connecting portion 222 are made by an electroplating process, and the material of the first connecting portion 212 and the second connecting portion 222 is Tin, the first pattern portion 210 has a first height H1, the second pattern portion 220 has a second height H2, please refer to Figures 2A, 2B and 3, the first pattern portion 210 and the second pattern portion There is a first gap G1 between 220, and the first gap G1 is not less than 50 microns.

Please refer to Figures 1, 2A and 2B. The reinforcing member 300 is disposed on the first surface 110, and the reinforcing member 300 is located between the first pattern portion 210 and the second pattern portion 220. Please refer to FIG. 2A. Two reinforcing members 300 are provided between the first pattern portion 210 and the second pattern portion 220, or, referring to Figure 2B, one is provided between the first pattern portion 210 and the second pattern portion 220 The reinforcing member 300, but the present invention does not limit the number of the reinforcing member 300. The reinforcing member 300 is used to increase the flexural strength of the flexible carrier 100 located under the reinforcing member 300, so as to avoid winding the retractable type. When the circuit board is used, the exposed surfaces of the first pattern portion 210 and the second pattern portion 220 are crushed and cannot be inspected by the optical sensor.

Please refer to Figures 1 and 2A. Preferably, when the first gap G1 is not less than 70 microns, the retractable circuit substrate includes two reinforcing members 300, each of which is adjacent to the first pattern portion 210 and The second pattern portion 220.

Please refer to FIGS. 2A and 3, along a direction of a virtual longitudinal axis Y, there is a second gap G2 between the reinforcing member 300 adjacent to the first pattern portion 210 and the first pattern portion 210, and the second The gap G2 is not greater than 35 microns. Preferably, along the other direction of the virtual longitudinal axis Y, there is a third gap G3 between the reinforcing member 300 adjacent to the second pattern portion 220 and the second pattern portion 220 , The third gap G3 is not greater than 35 microns.

Please refer to Figures 1 and 2A, the reinforcing member 300 has a third height H3, and the third height H3 is not lower than the first height H1 and the second height H2, and the reinforcing member 300 can avoid the winding up In the case of a type circuit substrate, the exposed surfaces of the first pattern portion 210 and the second pattern portion 220 are crushed and cannot be inspected by an optical sensor.

Please refer to Figures 1, 2A and 2B. In this embodiment, the reinforcing member 300 is formed by the metal plate through the patterning process and the bonding layer process. The reinforcing member 300 includes a third base 310 and a receiving layer. The pressure portion 320 is located on the third base 310. The third base 310 and the pressure portion 320 are made of different materials. In this embodiment, the material of the third base 310 is copper. The material of the pressing portion 320 is tin. However, in different embodiments, the reinforcing member 300 may be made of a non-metallic material, or the reinforcing member 300 may be made of a single material, that is, the third base 310 and the The pressure receiving part 320 is integrated.

For the implementation of the patterned metal layer 200 and the reinforcing member 300 of the present invention, please refer to FIGS. 3-9.

Please refer to FIG. 3, which is a first embodiment of the patterned metal layer 200 and the reinforcing member 300. In this embodiment, the first pattern portion 210 is an alignment mark, and the second pattern The portion 220 is another alignment mark. The first pattern portion 210 and the second pattern portion 220 have substantially the same appearance. The first pattern portion 210 and the second pattern portion 220 are symmetrically disposed on the reinforcing member 300. Two sides, but the present invention is not limited to this. The virtual longitudinal axis Y passes through the first pattern portion 210, the reinforcing member 300, and the second pattern portion 220. The first pattern portion 210 has a first boundary 210a And a second boundary 210b, the second pattern portion 220 has a third boundary 220a and a fourth boundary 220b, the reinforcing member 300 has a fifth boundary 300a and a sixth boundary 300b along the vertical axis In the Y direction, a first width D1 between the first boundary 210a to the second boundary 210b is not greater than a third width D3 of the fifth boundary 300a to the sixth boundary 300b, and the third boundary 220a to the A second width D2 between the fourth borders 220b is not greater than the third width D3.

Referring to FIG. 3, a first virtual straight line Y1 extends along the first boundary 210a of the first pattern portion 210, and the first virtual straight line Y1 passes through the reinforcing member 300 and the third pattern portion 220. A boundary 220a, and a first end 300c of the reinforcing member 300 protrudes from the first virtual straight line Y1. More preferably, a second virtual straight line Y2 extends along the second boundary 210b, and the second virtual straight line Y2 Passing through the fourth boundary 220b of the reinforcing member 300 and the second pattern portion 220, and a second end 300d of the reinforcing member 300 protrudes from the second virtual straight line Y2.

Please refer to FIG. 4, which is a second embodiment of the patterned metal layer 200 and the reinforcing member 300. The difference from the first embodiment is that the first virtual straight line Y1 passes through the reinforcing member 300. The fifth boundary 300a and the third boundary 220a of the second pattern portion 220, and the second virtual straight line Y2 passes through the sixth boundary 300b of the reinforcing member 300 and the fourth boundary 220b of the second pattern portion 220, namely The third width D3 of the reinforcing member 300 is substantially equal to the first width D1 of the first pattern portion 210 and the second width D2 of the second pattern portion 220. Similarly, the reinforcing member 300 can increase the position at the The flexural strength of the flexible carrier 100 under the reinforcing member 300 can prevent the exposed surfaces of the first pattern portion 210 and the second pattern portion 220 from being crushed and unable to pass when the roll-up circuit substrate is rolled up. Inspection of the optical sensor.

Please refer to FIG. 5, which is a third embodiment of the patterned metal layer 200 and the reinforcing member 300. The difference from the first embodiment is that the second pattern portion 220 is a circular mark along Perpendicular to the virtual longitudinal axis Y direction, the second width D2 between the third boundary 220a to the fourth boundary 220b of the second pattern portion 220 is not less than the first boundary 210a to the first pattern portion 210 The first width D1 between the second borders. In this embodiment, the second width D2 is greater than the first width D1. Preferably, the second width D2 of the second pattern portion 220 is substantially equal to the The third width D3 of the reinforcing member 300.

Please refer to FIG. 6, which is a fourth embodiment of the patterned metal layer 200 and the reinforcing member 300. The difference from the third embodiment is that the first pattern portion 210 is a rectangular mark.

Please refer to FIG. 7, which is a fifth embodiment of the patterned metal layer 200 and the reinforcing member 300. The difference from the first embodiment is that the first pattern portion 210 is a square mark, and the The first width D1 of the first pattern portion 210 is greater than the second width D2 of the second pattern portion 220, and the first virtual straight line Y1 extending along the first boundary 210a of the first pattern portion 210 passes through the reinforcement Member 300, and the first end 300c of the reinforcing member 300 protrudes from the first virtual straight line Y1.

Please refer to FIG. 8, which is a sixth embodiment of the patterned metal layer 200 and the reinforcing member 300. The difference from the fifth embodiment is that the first virtual straight line Y1 passes through the reinforcing member 300. The fifth boundary 300a.

Please refer to FIG. 9, which is a seventh embodiment of the patterned metal layer 200 and the reinforcing member 300. The difference from the first embodiment is that a virtual horizontal axis X passes through the first pattern portion 210, The reinforcing member 300 and the second pattern portion 220, the first pattern portion 210 has the first boundary 210a and the second boundary 210b, a third virtual straight line X1 extends along the first boundary 210a, and the third virtual A straight line X1 passes through the reinforcing member 300, and a first end 300c of the reinforcing member 300 protrudes from the third virtual straight line X1. Preferably, a fourth virtual straight line X2 extends along the second boundary 210b. The fourth virtual straight line X2 passes through the reinforcing member 300, and a second end 300d of the reinforcing member 300 protrudes from the fourth virtual straight line X2.

The present invention uses the reinforcing member 300 to increase the flexural strength of the flexible carrier 100 below the first pattern portion 210 to the second pattern portion 220, and the third height H3 of the reinforcing member 300 does not Lower than the first height H1 of the first pattern portion 210 and the second height H2 of the second pattern portion 220, the flexible carrier 100 can avoid the first pattern portion 210 and the second pattern portion 210 when the flexible carrier 100 is rolled up. The exposed surface of the pattern portion 220 is crushed and cannot be inspected by the optical sensor.

The scope of protection of the present invention shall be determined by the scope of the attached patent application. Anyone who is familiar with the art and makes any changes and modifications without departing from the spirit and scope of the present invention shall fall within the scope of protection of the present invention. .

100: Flexible carrier

110: first surface

120: second surface

200: patterned metal layer

210: The first pattern part

210a: the first boundary

210b: second boundary

211: first base

212: first lead

220: The second pattern part

220a: third boundary

220b: Fourth boundary

221: second base

222: The second lead part

300: reinforcement

300a: Fifth boundary

300b: sixth boundary

300c: first end

300d: second end

310: third base

320: pressure part

D1 first width

D2: second width

D3: third width

G1: first gap

G2: second gap

G3: third gap

H1: first height

H2: second height

H3: third height

Y: virtual longitudinal axis

Y1: The first virtual straight line

Y2: second virtual straight line

X: Virtual horizontal axis

X1: The third virtual straight line

X2: Fourth virtual straight line

Figure 1: The top view of the retractable circuit board of the present invention. Fig. 2A: A partial cross-sectional view of the retractable circuit board of the present invention. Fig. 2B: Another partial cross-sectional view of the retractable circuit board of the present invention. Figures 3-9: Top views of different implementations of the patterned metal layer of the roll-up circuit substrate and the reinforcing member of the present invention.

100: Flexible carrier

110: first surface

200: patterned metal layer

210: The first pattern part

220: The second pattern part

300: reinforcement

Y: virtual longitudinal axis

X: Virtual horizontal axis

Claims (9)

A roll-up type circuit substrate includes: a flexible carrier having a first surface and a second surface; a patterned metal layer disposed on the first surface, and the patterned metal layer at least includes: a first pattern Portion, including a first base and a first connecting portion, the first connecting portion is disposed on the first base, the first base and the first connecting portion are made of different materials, the first pattern portion is selected From one of an alignment mark or a conductive line, the first pattern portion has a first height, a virtual longitudinal axis passes through the first pattern portion, and the first pattern portion has a first border and a A second boundary; and a second pattern portion, including a second base and a second guiding portion, the second guiding portion is disposed on the second base, the second base and the second guiding portion are Different materials, the second pattern portion is selected from another alignment mark, the second pattern portion has a second height, a first gap is formed between the first pattern portion and the second pattern portion, and the first gap Not less than 50 microns, the virtual longitudinal axis passes through the second pattern portion; and at least one reinforcing member is disposed on the first surface, and the reinforcing member is located between the first pattern portion and the second pattern portion, the reinforcing member The member has a third height, the third height is not lower than the first height and the second height, the virtual longitudinal axis passes through the reinforcing member, and the reinforcing member has a fifth boundary and a sixth boundary along the The first boundary extends a first virtual straight line, and the first virtual straight line passes through the fifth boundary of the reinforcing member. For example, the retractable circuit substrate of claim 1, wherein the reinforcement includes a third base and a pressure-receiving portion, the pressure-receiving portion is located on the third base, and the third base and the pressure-receiving portion are made of different materials. For example, the roll-up circuit substrate of claim 1, wherein the second pattern portion has a third border and a fourth border, the third border to the fourth border has a second width, and the fifth border to There is a third width between the sixth borders, and the second width is not greater than the third width. For example, the retractable circuit substrate of claim 1, wherein the second pattern portion has a third boundary and a fourth boundary, and the first virtual straight line passes through the third boundary of the second pattern portion. For example, the retractable circuit substrate of claim 3, wherein the first virtual straight line passes through the third boundary of the second pattern portion. For example, the retractable circuit substrate of claim 4 or 5, wherein a second virtual straight line extends along the second boundary, and the second virtual straight line passes through the fourth boundary of the second pattern portion. For example, the retractable circuit substrate of claim 4 or 5, wherein a second virtual straight line extends along the second boundary, and the second virtual straight line passes through the sixth boundary of the reinforcing member. For example, the roll-up circuit substrate of claim 4 or 5, wherein a second virtual straight line extends along the second boundary, and the second virtual straight line passes through the fourth boundary of the second pattern portion and the fourth boundary of the reinforcing member Six boundaries. For example, the roll-up type circuit substrate of claim 1, wherein the first pattern portion has a first width from the first boundary to the second boundary, and the second pattern portion has a third boundary and a fourth boundary There is a second width between the third boundary and the fourth boundary, and the second width is not less than the first width.

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