TWI491333B - Film package structure - Google Patents
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- TWI491333B TWI491333B TW103114052A TW103114052A TWI491333B TW I491333 B TWI491333 B TW I491333B TW 103114052 A TW103114052 A TW 103114052A TW 103114052 A TW103114052 A TW 103114052A TW I491333 B TWI491333 B TW I491333B
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Description
本發明是有關於一種封裝結構，且特別是有關於一種薄膜封裝結構。The present invention relates to a package structure, and more particularly to a film package structure.
隨著電子技術的高度發展，電子產品不斷推陳出新，就現況而論，資訊、通訊以及消費性電子等產品，亦即所謂的3C產品已成為電子產業中成長最為快速的項目之一。其中，印刷電路板(Printed Circuit Board)即可做為這些3C產品內部的多個電子零組件之間的連結關係的媒介，從而將各個電子零組件所對應的功能加以整合。以可撓性電路板(Flexible Printed Circuit Board)為例，其適於撓曲且相當輕薄之，並可適應於這些3C產品內部的配置空間而調整出各式的型態，而被廣泛地應用於這些3C產品之中。With the rapid development of electronic technology, electronic products continue to evolve. As far as the current situation is concerned, products such as information, communication and consumer electronics, the so-called 3C products, have become one of the fastest growing projects in the electronics industry. Among them, the Printed Circuit Board can be used as a medium for the connection between multiple electronic components within these 3C products, thereby integrating the functions corresponding to the various electronic components. Taking the Flexible Printed Circuit Board as an example, it is suitable for flexing and is relatively thin and light, and can be adapted to the configuration space inside these 3C products to adjust various types, and is widely used. Among these 3C products.
然而，因應應用需求，可撓性電路板的基材越趨薄化，對於設置在可撓性電路板上的元件而言，例如連接器(Connector)、主動元件或被動元件等等，薄化的電路板較無法提 供足夠的機械強度，為使前述之元件設置於可撓性電路板上時或元件於後續的對外連接或其他應用時，可撓性電路板不會產生變形或損壞，通常會在對應元件的位置貼附加強片於可撓性電路板的其中一表面，以增強元件區的結構強度。而加強片在可撓性基板的貼附位置有其精度需求，一般而言，現行加強片的貼附並未設置相應的圖面定義，只能於貼附加強片後以工具顯微鏡量測精度是否符合規範，而無法於貼附時即以目檢快速判斷，故造成整體製造時間延長，且若檢查出加強片位置超出精度規範，還需重工矯正，極為耗時耗工。However, the substrate of the flexible circuit board is thinner in response to application requirements, and thinner for components disposed on the flexible circuit board, such as connectors, active components, or passive components. Board is less able to mention For sufficient mechanical strength, the flexible circuit board will not be deformed or damaged in order to provide the aforementioned components on the flexible circuit board or the components in subsequent external connections or other applications, usually in the corresponding components. The position is attached to one of the surfaces of the flexible circuit board to enhance the structural strength of the component area. The reinforcing sheet has its precision requirement in the attachment position of the flexible substrate. Generally speaking, the attachment of the current reinforcing sheet does not have a corresponding drawing definition, and can only be measured by the tool microscope after attaching the strong sheet. Whether it meets the specifications and cannot be quickly judged by visual inspection when it is attached, the overall manufacturing time is prolonged, and if the position of the reinforcing sheet exceeds the accuracy specification, it needs to be reworked, which is extremely time consuming and labor-intensive.
本發明提供一種薄膜封裝結構，可透過目視或顯微鏡快速地檢測出加強片貼附於可撓性基板後的貼附精度是否符合規格。The invention provides a thin film encapsulation structure, which can quickly detect whether the adhesion precision of the reinforcing sheet after being attached to the flexible substrate conforms to the specification by visual observation or a microscope.
本發明的薄膜封裝結構，包括可撓性基板、圖案化線路層、加強片以及多個對位標記。可撓性基板具有第一表面、相對第一表面的第二表面、位於第一表面的元件區以及位於第二表面的加強片貼附區。圖案化線路層配置於可撓性基板的第一表面上，且具有多個端子位於元件區內。加強片配置於第二表面之加強片貼附區上，其中加強片對應於元件區配置，且加強片具有預定的貼附精度公差為X。這些對位標記位於可撓性基板上，其中加強片貼附區之各邊對應至少一個對位標記，每一個對位標記垂 直對應的加強片貼附區之各邊的方向上具有一長度為L，且長度L小於或等於貼附精度公差X。The thin film encapsulation structure of the present invention comprises a flexible substrate, a patterned wiring layer, a reinforcing sheet and a plurality of alignment marks. The flexible substrate has a first surface, a second surface opposite the first surface, an element region on the first surface, and a stiffener attachment region on the second surface. The patterned circuit layer is disposed on the first surface of the flexible substrate and has a plurality of terminals located in the element region. The reinforcing sheet is disposed on the reinforcing sheet attaching area of the second surface, wherein the reinforcing sheet corresponds to the component area configuration, and the reinforcing sheet has a predetermined attaching precision tolerance of X. The alignment marks are located on the flexible substrate, wherein each side of the reinforcing sheet attachment area corresponds to at least one alignment mark, and each of the alignment marks is vertical The length of each side of the directly corresponding reinforcing sheet attachment area has a length L, and the length L is less than or equal to the attachment precision tolerance X.
在本發明的一實施例中，上述的加強片貼附區之各邊對齊前述至少一個對位標記的中心線，並使前述至少一個對位標記呈鏡像對稱。In an embodiment of the invention, each side of the reinforcing sheet attachment area is aligned with a center line of the at least one alignment mark, and the at least one alignment mark is mirror-symmetrical.
在本發明的一實施例中，上述的各個對位標記的相對兩邊線與對應的加強片貼附區的各邊相互平行。各個對位標記的兩邊線之其中一者位於加強片貼附區之內，且各個對位標記的兩邊線之另一者位於加強片貼附區之外。In an embodiment of the invention, the opposite sides of the respective alignment marks are parallel to the sides of the corresponding reinforcing sheet attachment area. One of the two sides of each of the alignment marks is located within the reinforcing sheet attachment area, and the other of the two side lines of each of the alignment marks is located outside the reinforcing sheet attachment area.
在本發明的一實施例中，上述的各個對位標記的兩邊線之任一者至對應的各個中心線的距離為D，且D小於或等於1/2X。In an embodiment of the invention, the distance between any one of the two sides of each of the alignment marks to the corresponding center line is D, and D is less than or equal to 1/2X.
在本發明的一實施例中，上述的對位標記之形狀包括矩形、ㄇ字型、H型或∥型。In an embodiment of the invention, the shape of the alignment mark includes a rectangle, a U-shape, an H-shape or a ∥-type.
在本發明的一實施例中，上述的貼附精度公差X小於或等於100微米。In an embodiment of the invention, the attachment accuracy tolerance X described above is less than or equal to 100 microns.
在本發明的一實施例中，上述的對位標記的材質包括絕緣膠材。In an embodiment of the invention, the material of the alignment mark includes an insulating rubber material.
在本發明的一實施例中，上述的可撓性基板具有防焊層。防焊層局部覆蓋圖案化線路層，並暴露出元件區。In an embodiment of the invention, the flexible substrate has a solder resist layer. The solder mask partially covers the patterned wiring layer and exposes the component regions.
在本發明的一實施例中，上述的圖案化線路層更包括多個對位圖案。各個對位圖案具有鏤空區域，且這些鏤空區域暴露出部分防焊層以構成這些對位標記。In an embodiment of the invention, the patterned circuit layer further includes a plurality of alignment patterns. Each of the alignment patterns has a hollowed out area, and these hollowed out areas expose a portion of the solder mask to form the alignment marks.
在本發明的一實施例中，上述的加強片的材質包括金屬、FR-4環氧樹脂玻璃纖維、FR-5環氧樹脂玻璃纖維、聚對苯二甲酸乙二酯或聚醯亞胺。In an embodiment of the invention, the material of the reinforcing sheet comprises metal, FR-4 epoxy glass fiber, FR-5 epoxy glass fiber, polyethylene terephthalate or polyimine.
基於上述，本發明的薄膜封裝結構在可撓性基板的特定區域(即加強片貼附區)上配置加強片，以加強可撓性基板位於前述區域之結構強度，而為了使加強片貼附時能精確地對位設置於加強片貼附區內而不超出預定的貼附精度範圍，可撓性基板上另設置多個對位標記置。具體而言，當加強片貼附於加強片貼附區時，加強片的預定的貼附精度為X，且加強片貼附區之各邊對應至少一個對位標記，每一個對位標記垂直對應的加強片貼附區之各邊的方向上的長度為L，且長度L小於或等於加強片的預定貼附精度公差X。如此為之，可藉由各個對位標記界定出加強片貼附時的可偏移範圍(即貼附精度公差X)或藉由其相對兩邊線分別界定出規格上下限(即±1/2X)，不僅可降低製程上的對位誤差，亦可透過目視或顯微鏡快速地檢測出加強片貼附於可撓性基板後的貼附精度是否超出規格。Based on the above, the thin film encapsulation structure of the present invention is provided with a reinforcing sheet on a specific region of the flexible substrate (ie, the reinforcing sheet attaching region) to reinforce the structural strength of the flexible substrate in the aforementioned region, and to attach the reinforcing sheet. The alignment can be accurately placed in the reinforcing sheet attachment area without exceeding a predetermined range of attachment precision, and a plurality of alignment marks are additionally disposed on the flexible substrate. Specifically, when the reinforcing sheet is attached to the reinforcing sheet attaching area, the predetermined attaching accuracy of the reinforcing sheet is X, and each side of the reinforcing sheet attaching area corresponds to at least one alignment mark, and each of the alignment marks is vertical. The length in the direction of each side of the corresponding reinforcing sheet attachment area is L, and the length L is less than or equal to the predetermined attachment precision tolerance X of the reinforcing sheet. In this way, the offset range of the reinforcing sheet attachment (ie, the attachment precision tolerance X) can be defined by each alignment mark or the upper and lower limits of the specification can be respectively defined by the opposite sides (ie, ±1/2X). ), not only can the alignment error on the process be reduced, but also the accuracy of attaching the reinforcing sheet to the flexible substrate can be quickly detected by visual or microscope.
為讓本發明的上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。The above described features and advantages of the invention will be apparent from the following description.
10‧‧‧元件10‧‧‧ components
100、100A‧‧‧薄膜封裝結構100,100A‧‧‧film package structure
110‧‧‧可撓性基板110‧‧‧Flexible substrate
111‧‧‧第一表面111‧‧‧ first surface
112‧‧‧第二表面112‧‧‧ second surface
113‧‧‧元件區113‧‧‧Component area
114‧‧‧加強片貼附區114‧‧‧Strengthen patch attachment area
114s‧‧‧邊114s‧‧‧ side
115‧‧‧防焊層115‧‧‧ solder mask
120、120a‧‧‧圖案化線路層120, 120a‧‧‧ patterned circuit layer
121‧‧‧端子121‧‧‧terminal
122‧‧‧線路122‧‧‧ lines
123‧‧‧對位圖案123‧‧‧ alignment pattern
130‧‧‧加強片130‧‧‧Strengthen
140、140a‧‧‧對位標記140, 140a‧‧‧ alignment mark
141‧‧‧邊線141‧‧‧Edge
D‧‧‧距離D‧‧‧Distance
L‧‧‧長度L‧‧‧ length
X‧‧‧貼附精度公差X‧‧‧ attached precision tolerance
圖1是本發明一實施例的薄膜封裝結構的示意圖。1 is a schematic view of a thin film package structure according to an embodiment of the present invention.
圖2是圖1的薄膜封裝結構沿A-A剖線的局部剖視圖。2 is a partial cross-sectional view of the thin film package structure of FIG. 1 taken along line A-A.
圖3是本發明另一實施例的薄膜封裝結構的示意圖。3 is a schematic view of a thin film package structure according to another embodiment of the present invention.
圖4是圖3的薄膜封裝結構沿B-B剖線的局部剖視圖。4 is a partial cross-sectional view of the thin film package structure of FIG. 3 taken along line B-B.
圖1是本發明一實施例的薄膜封裝結構的示意圖。圖2是圖1的薄膜封裝結構沿A-A剖線的局部剖視圖，其中加強片130與加強片貼附區114相重疊，而圖案化線路層120與元件10雖位於第一表面111，但為求清楚表示與說明，故以實線繪示於圖1。請參考圖1與圖2，在本實施例中，薄膜封裝結構100包括可撓性基板110、圖案化線路層120、加強片130以及多個對位標記140。1 is a schematic view of a thin film package structure according to an embodiment of the present invention. 2 is a partial cross-sectional view of the thin film encapsulation structure of FIG. 1 taken along line AA, wherein the reinforcing sheet 130 overlaps the reinforcing sheet attaching region 114, and the patterned wiring layer 120 and the component 10 are located on the first surface 111, but Clearly indicated and illustrated, it is shown in Figure 1 in solid lines. Referring to FIG. 1 and FIG. 2 , in the embodiment, the thin film encapsulation structure 100 includes a flexible substrate 110 , a patterned circuit layer 120 , a reinforcing sheet 130 , and a plurality of alignment marks 140 .
可撓性基板110具有第一表面111、相對第一表面111的第二表面112、位於第一表面111的元件區113以及位於第二表面112的加強片貼附區114，通常而言，可撓性基板110的材質可包括聚乙烯對苯二甲酸酯(polyethylene terephthalate,PET)、聚醯亞胺(Polyimide,PI)、聚醚(polyethersulfone,PES)、碳酸脂(polycarbonate,PC)或其他適合的可撓性材料。圖案化線路層120配置於可撓性基板110的第一表面111上，且具有多個端子121位於元件區113內。舉例而言，這些端子121可以是類似金手指的線路端子，可進一步接合元件10例如連接器(connector)、主動元件或被動元件等。另一方面，圖案化線路層120還具有多條線路122，各個線路連接對應的各個端子121，其中這些端子121與 這些線路122的材質可包括銅、鎳、金或銀，或者是其他導電金屬材料。The flexible substrate 110 has a first surface 111, a second surface 112 opposite the first surface 111, an element region 113 at the first surface 111, and a stiffener attachment region 114 at the second surface 112, generally, The material of the flexible substrate 110 may include polyethylene terephthalate (PET), polyimide (PI), polyethersulfone (PES), polycarbonate (PC) or other materials. Suitable flexible material. The patterned wiring layer 120 is disposed on the first surface 111 of the flexible substrate 110 and has a plurality of terminals 121 located in the element region 113. For example, the terminals 121 can be gold finger-like line terminals that can further engage the component 10 such as a connector, an active component, or a passive component. On the other hand, the patterned circuit layer 120 further has a plurality of lines 122, each of which is connected to a corresponding terminal 121, wherein the terminals 121 and The material of these lines 122 may include copper, nickel, gold or silver, or other conductive metal materials.
加強片130配置於第二表面112之加強片貼附區114上，其中加強片130對應於元件區113配置，藉以避免在將元件10與可撓性基板110接合的製程中或元件10於後續的對外連接或其他應用時造成可撓性基板110的元件區113變形或損壞。通常而言，加強片130的材質可包括金屬、FR-4環氧樹脂玻璃纖維、FR-5環氧樹脂玻璃纖維、聚對苯二甲酸乙二酯或聚醯亞胺等，並且貼附於加強片貼附區114的加強片130具有預定的貼附精度公差為X，也就是說加強片130貼附於加強片貼附區114時不可超出規格上下限±1/2X所界定的範圍。另一方面，這些對位標記140位於可撓性基板110上，在此是以這些對位標記140設置於第二表面112做為舉例說明，其中加強片貼附區114之各邊114s對應至少一個對位標記140。對位標記140的材質例如是絕緣膠材，也就是說，對位標記140不僅可作為加強片130的對位所用，加強片130亦可透過對位標記140更穩固地貼附於可撓性基板110上。在未繪示的實施例中，這些對位標記140亦可設置於第一表面111，本發明對此不加以限制。The reinforcing sheet 130 is disposed on the reinforcing sheet attaching area 114 of the second surface 112, wherein the reinforcing sheet 130 is disposed corresponding to the element region 113, so as to avoid the process of joining the component 10 and the flexible substrate 110 or the component 10 in the subsequent process. The outer region or other application causes deformation or damage to the component region 113 of the flexible substrate 110. Generally, the material of the reinforcing sheet 130 may include metal, FR-4 epoxy glass fiber, FR-5 epoxy glass fiber, polyethylene terephthalate or polyimine, and the like. The reinforcing sheet 130 of the reinforcing sheet attaching area 114 has a predetermined attaching precision tolerance X, that is, the reinforcing sheet 130 is attached to the reinforcing sheet attaching area 114 so as not to exceed the range defined by the upper and lower limits of the specification ± 1/2X. On the other hand, the alignment marks 140 are located on the flexible substrate 110, and the alignment marks 140 are disposed on the second surface 112 as an example, wherein the sides 114s of the reinforcing sheet attachment area 114 correspond to at least A registration mark 140. The material of the alignment mark 140 is, for example, an insulating rubber material, that is, the alignment mark 140 can be used not only as the alignment of the reinforcing sheet 130, but also the reinforcing sheet 130 can be more firmly attached to the flexible portion through the alignment mark 140. On the substrate 110. In the embodiment, the alignment mark 140 can also be disposed on the first surface 111, which is not limited in the present invention.
在本實施例中，每一個對位標記140垂直其對應的加強片貼附區114之各邊114s的方向上具有一長度為L，其中長度L小於或等於貼附精度公差X，且貼附精度公差X例如小於或等於100微米(μm)。具體而言，加強片貼附區114之各邊114s對齊 前述至少一個對位標記140的中心線，並使前述至少一個對位標記140呈鏡像對稱。另一方面，各個對位標記140的相對兩邊線141與對應的加強片貼附區114的各邊114s相互平行，各個對位標記140的兩邊線141之其中一者位於加強片貼附區114之內，且各個對位標記140的兩邊線141之另一者位於加強片貼附區114之外，其中各個對位標記140的兩邊線141之任一者至對應的各個中心線的距離為D，且D小於或等於1/2X(亦即貼附精度公差X的一半)。換言之，當D等於1/2X時，各個對位標記140的兩邊線141即分別界定出規格上下限(即±1/2X)。因此，加強片130透過各個對位標記140的輔助，即可精準地貼附於可撓性基板110上的加強片貼附區114，降低製程上的對位誤差，並且可透過目視或顯微鏡快速地檢測出加強片130貼附於可撓性基板110後的貼附精度是否超出規格。具體而言，如果加強片130貼附時往一方向偏移而超出預定的貼附精度公差，則對應加強片貼附區114的一邊114s的對位標記140將會被加強片130完全遮蔽，而對應相對之另一邊114s的對位標記140則不被加強片130所覆蓋而完全顯露出。舉例而言，這些對位標記140之形狀可包括矩形、ㄇ字型、H型或∥型。此外，可撓性基板110具有防焊層115，其中防焊層115局部覆蓋圖案化線路層120，並暴露出元件區113，亦即端子121與元件10並未被防焊層115所覆蓋。In the present embodiment, each of the alignment marks 140 has a length L in the direction perpendicular to each side 114s of the corresponding reinforcing sheet attachment area 114, wherein the length L is less than or equal to the attachment precision tolerance X, and is attached. The precision tolerance X is, for example, less than or equal to 100 micrometers (μm). Specifically, the sides 114s of the reinforcing sheet attachment area 114 are aligned. The center line of the at least one alignment mark 140 is such that the at least one alignment mark 140 is mirror-symmetrical. On the other hand, the opposite side lines 141 of the respective alignment marks 140 are parallel to the respective sides 114s of the corresponding reinforcing sheet attaching areas 114, and one of the two side lines 141 of the respective alignment marks 140 is located in the reinforcing sheet attaching area 114. The other one of the two side lines 141 of each of the alignment marks 140 is located outside the reinforcing sheet attaching area 114, wherein the distance between any one of the two side lines 141 of each of the alignment marks 140 to the corresponding center line is D, and D is less than or equal to 1/2X (that is, half of the attached precision tolerance X). In other words, when D is equal to 1/2X, the two side lines 141 of the respective alignment marks 140 respectively define the upper and lower limits of the specification (i.e., ± 1/2X). Therefore, the reinforcing sheet 130 can be accurately attached to the reinforcing sheet attaching area 114 on the flexible substrate 110 through the assistance of the respective alignment marks 140, thereby reducing the alignment error on the process and being fast through the visual or microscope. It is detected whether the attaching accuracy of the reinforcing sheet 130 attached to the flexible substrate 110 exceeds the specification. Specifically, if the reinforcing sheet 130 is offset in one direction and exceeds a predetermined attaching precision tolerance, the alignment mark 140 corresponding to one side 114s of the reinforcing sheet attaching area 114 will be completely shielded by the reinforcing sheet 130. The alignment mark 140 corresponding to the opposite side 114s is not completely covered by the reinforcing sheet 130 and is completely exposed. For example, the shape of these alignment marks 140 may include a rectangle, a U-shape, an H-shape, or a U-shape. In addition, the flexible substrate 110 has a solder resist layer 115 in which the solder resist layer 115 partially covers the patterned wiring layer 120 and exposes the element region 113, that is, the terminal 121 and the element 10 are not covered by the solder resist layer 115.
圖3是本發明另一實施例的薄膜封裝結構的示意圖。圖4是圖3的薄膜封裝結構沿B-B剖線的局部剖視圖。請參考圖3與 4，在本實施例中，薄膜封裝結構100A與薄膜封裝結構100的不同處在於，圖案化線路層120a更包括多個對位圖案123，其中各個對位圖案123分別具有鏤空區域，且這些鏤空區域暴露出部分防焊層115以構成這些對位標記140a。也就是說，這些對位標記140a並非以絕緣膠材形成於第二表面112上，而是在圖案化線路層120a上形成鏤空區域，以及利用可撓性基板110半透明的特性和覆蓋圖案化線路層120a的防焊層115的色彩，使得位於鏤空區域的防焊層115在可撓性基板110的第二表面112上形成可視的圖案。具體而言，加強片130與對位標記140a的對位方式、對位標記140a與貼附精度公差X的相對比例以及貼附精度公差X等其他條件限制，可參照上述實施例之說明，於此不贅述。3 is a schematic view of a thin film package structure according to another embodiment of the present invention. 4 is a partial cross-sectional view of the thin film package structure of FIG. 3 taken along line B-B. Please refer to Figure 3 with 4. In this embodiment, the thin film encapsulation structure 100A is different from the thin film encapsulation structure 100 in that the patterned circuit layer 120a further includes a plurality of alignment patterns 123, wherein each of the alignment patterns 123 has a hollowed out region, and these hollowed out regions A portion of the solder mask 115 is exposed to form the alignment marks 140a. That is, the alignment marks 140a are not formed on the second surface 112 with an insulating paste, but form a hollowed-out region on the patterned wiring layer 120a, and are characterized by the translucent nature and coverage of the flexible substrate 110. The color of the solder resist layer 115 of the wiring layer 120a is such that the solder resist layer 115 located in the cutout region forms a visible pattern on the second surface 112 of the flexible substrate 110. Specifically, the alignment method of the reinforcing sheet 130 and the alignment mark 140a, the relative ratio of the alignment mark 140a to the attachment precision tolerance X, and other conditions such as the attachment precision tolerance X can be referred to the description of the above embodiment. This will not go into details.
綜上所述，本發明的薄膜封裝結構在可撓性基板的特定區域(即加強片貼附區)上配置加強片，以加強可撓性基板位於前述區域之結構強度，而為了使加強片貼附時能精確地對位設置於加強片貼附區內而不超出預定的貼附精度範圍，可撓性基板上另設置多個對位標記。具體而言，當加強片貼附於加強片貼附區時，加強片的預定的貼附精度為X，且加強片貼附區之各邊對應至少一個對位標記，每一個對位標記垂直對應的加強片貼附區之各邊的方向上的長度為L，且長度L小於或等於加強片的預定貼附精度公差X。如此為之，可藉由各個對位標記界定出加強片貼附時的可偏移範圍(即貼附精度公差X)或藉由其相對兩邊線分別界定出規格上下限(即±1/2X)，不僅可降低製程上的對位誤差， 亦可透過目視或顯微鏡快速地檢測出加強片貼附於可撓性基板後的貼附精度是否超出規格。In summary, the thin film encapsulation structure of the present invention is provided with a reinforcing sheet on a specific region of the flexible substrate (ie, the reinforcing sheet attaching region) to strengthen the structural strength of the flexible substrate in the aforementioned region, and in order to make the reinforcing sheet When attached, the alignment can be accurately placed in the reinforcing sheet attachment area without exceeding a predetermined range of attachment precision, and a plurality of alignment marks are additionally disposed on the flexible substrate. Specifically, when the reinforcing sheet is attached to the reinforcing sheet attaching area, the predetermined attaching accuracy of the reinforcing sheet is X, and each side of the reinforcing sheet attaching area corresponds to at least one alignment mark, and each of the alignment marks is vertical. The length in the direction of each side of the corresponding reinforcing sheet attachment area is L, and the length L is less than or equal to the predetermined attachment precision tolerance X of the reinforcing sheet. In this way, the offset range of the reinforcing sheet attachment (ie, the attachment precision tolerance X) can be defined by each alignment mark or the upper and lower limits of the specification can be respectively defined by the opposite sides (ie, ±1/2X). ), not only can reduce the alignment error on the process, It is also possible to quickly detect whether the attaching precision of the reinforcing sheet attached to the flexible substrate exceeds the specification by visual observation or a microscope.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明的精神和範圍內，當可作些許的更動與潤飾，故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.
10‧‧‧元件10‧‧‧ components
100‧‧‧薄膜封裝結構100‧‧‧film package structure
110‧‧‧可撓性基板110‧‧‧Flexible substrate
112‧‧‧第二表面112‧‧‧ second surface
113‧‧‧元件區113‧‧‧Component area
114‧‧‧加強片貼附區114‧‧‧Strengthen patch attachment area
114s‧‧‧邊114s‧‧‧ side
120‧‧‧圖案化線路層120‧‧‧ patterned circuit layer
121‧‧‧端子121‧‧‧terminal
122‧‧‧線路122‧‧‧ lines
130‧‧‧加強片130‧‧‧Strengthen
140‧‧‧對位標記140‧‧‧ alignment mark
141‧‧‧邊線141‧‧‧Edge
D‧‧‧距離D‧‧‧Distance
L‧‧‧長度L‧‧‧ length
X‧‧‧貼附精度公差X‧‧‧ attached precision tolerance
Claims (10)
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| TW103114052A TWI491333B (en) | 2014-04-17 | 2014-04-17 | Film package structure |
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| CN201114993Y (en) * | 2007-10-22 | 2008-09-10 | 比亚迪股份有限公司 | A flexible printed circuit board pasted with compensation enhancement board |
| CN202222074U (en) * | 2011-08-19 | 2012-05-16 | 东莞光阳兴业电子配件有限公司 | Reinforcing paster |
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| CN101296562A (en) * | 2007-04-24 | 2008-10-29 | 亚洲电材股份有限公司 | Copper foil substrates and method for making flexible printed circuit board of the same |
| JP2011199056A (en) * | 2010-03-19 | 2011-10-06 | Hitachi High-Technologies Corp | Assembling device for fpd module |
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| CN102802358B (en) * | 2012-08-16 | 2015-06-24 | 东莞森玛仕格里菲电路有限公司 | Method for bonding circuit board reinforcing patches |
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| CN201114993Y (en) * | 2007-10-22 | 2008-09-10 | 比亚迪股份有限公司 | A flexible printed circuit board pasted with compensation enhancement board |
| CN202222074U (en) * | 2011-08-19 | 2012-05-16 | 东莞光阳兴业电子配件有限公司 | Reinforcing paster |
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