CN103308870B - Magnetic detection device and manufacture method thereof - Google Patents
Magnetic detection device and manufacture method thereof Download PDFInfo
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- CN103308870B CN103308870B CN201310038476.XA CN201310038476A CN103308870B CN 103308870 B CN103308870 B CN 103308870B CN 201310038476 A CN201310038476 A CN 201310038476A CN 103308870 B CN103308870 B CN 103308870B
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- detection device
- magnetic detection
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- magnetic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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Abstract
The object of the present invention is to provide a kind of magnetic detection device and the manufacture method thereof that especially magnetic detection device can be stablized abreast setting relative to installation base plate.A kind of magnetic detection device (1), it possesses the Magnetic Sensor in the direction for detecting external magnetic field, and there is multiple electrode pad on installed surface, the feature of this magnetic detection device (1) is, installed surface (12) is formed insulation course (7), insulation course (7) is formed multiple peristome (8), multiple electrode pad (9) is formed in multiple peristome (8), in multiple peristome (8), on the multiple circumferential openings portions (8a) of periphery (12a) being positioned at installed surface (12), at least form the opening portion (13) of the side (1a ~ 1d) being communicated to magnetic detection device from circumferential openings portion (8a) respectively.
Description
Technical field
The present invention relates to the structure of the especially installed surface of the magnetic detection device of the Magnetic Sensor in the direction possessed for detecting external magnetic field.
Background technology
As the Magnetic Sensor in the direction for detecting external magnetic field, such as, there is the geomagnetic sensor in the orientation for detecting earth magnetism.
The magnetic detection device with geomagnetic sensor is the device possessing described geomagnetic sensor and packedization on substrate.The back side of described substrate is equivalent to the installed surface carrying out with installation base plate installing, as shown in Fig. 8 (a), (rear view of existing magnetic detection device), be provided with coating resist layer 22 on the back of the substrate at installed surface 30, described resist layer 22 is formed with multiple peristome 23.Further, electrode pad 31 exposes respectively in each peristome 23.As shown in Fig. 8 (a), by being arranged on installed surface 30 by multiple electrode pad 31, the densification that substrate is installed can be realized.
The side 24 of the magnetic detection device shown in Fig. 8 (a) is equivalent to the section in manufacturing process.That is, in order to manufacture multiple magnetic detection device simultaneously, and use than forming the large substrate (large substrates) of the substrate of each magnetic detection device, large substrates carries multiple Magnetic Sensors etc. and molded after, large substrates is cut off by each magnetic detection device.Section is now equivalent to the side 24 of each magnetic detection device.
[at first technical literature]
[patent documentation]
[patent documentation 1] Japanese Unexamined Patent Publication 2001-7246 publication
[patent documentation 2] Japanese Unexamined Patent Publication 2002-100711 publication
[patent documentation 3] Japanese Unexamined Patent Publication 2008-277661 publication
[patent documentation 4] Japanese Unexamined Patent Publication 2006-295156 publication
[summary of invention]
[inventing the problem that will solve]
But, when large substrates is cut off by each magnetic detection device, if off-position D departs from from the position of regulation as shown in Fig. 8 (a), then as shown in Fig. 8 (b), (the partial enlargement rear view of existing magnetic detection device), be arranged in the narrower intervals between the circumferential openings portion (Fig. 8 (a), (b) label symbol 23a) at least partially of the periphery of installed surface 30 and the side 24 of magnetic detection device, or peristome 23a forms the interconnecting part (shortcoming portion) 25 being communicated to side 24 around.It should be noted that, the side 24 shown in Fig. 8 (b) is the sides when the off-position D shown in Fig. 8 (a) cuts off.
As shown in Fig. 8 (b), when forming side 24 at off-position D, minimum widith between the position closest to side 24 of circumferential openings portion 23a and side 24 becomes very little, consequently, the area of the resist layer 22 (in Fig. 8 (b) label symbol 22a) near described minimum widith becomes very little, therefore there is the problem easily producing resist and peel off.
When resist layer 22 peels off, as shown in Fig. 8 (c) (front view of magnetic detection device), between the installed surface 30 and installation base plate 27 of magnetic detection device 26, sandwich the stripping portion of resist layer 22, thus magnetic detection device 26 is easy relative to installation base plate 27 installs with the state tilted sideling.It should be noted that, the symbol 29 shown in Fig. 8 (c), (d) is solder layer.
In addition, when peristome 23a is formed with the interconnecting part (shortcoming portion) 25 being communicated to side 24 around, as shown in Fig. 8 (d) (front view of magnetic detection device), easily flow out from interconnecting part 25 to the foreign side of side 24 for the solder cream 28 will engaged between electrode pad 31 and the conductive connection part of installation base plate 27.Now, the circumferential openings portion 23a being arranged in diagram right side shown in Fig. 8 (a), the foreign side of solder cream 28 easily via interconnecting part 25 to side 24 flows, but the circumferential openings portion 23a being arranged in diagram left side shown in Fig. 8 (a), does not form interconnecting part 25 and solder cream 28 is difficult to flow to the foreign side of side 24.Therefore, hold between electrode pad 31 between electrode pad 31 in runny circumferential openings portion 23a and the conductive connection part of installation base plate 27 and in solder cream 28 immobilising circumferential openings portion 23a and the conductive connection part of installation base plate 27 at solder cream 28, the interval (spacing) to short transverse changes.Therefore, as shown in Fig. 8 (d), magnetic detection device 26 is easy relative to installation base plate 27 to be installed with the state tilted sideling.It should be noted that, in Fig. 8 (d), the solder cream 28 and the solder layer 29 that flow out outward are distinguished expression, and this solder layer 29 engages between magnetic detection device 26 with installation base plate 27.
As shown in Fig. 8 (c), (d), when magnetic detection device 26 is installed with the state tilted sideling relative to installation base plate 27, the orientation of earth magnetism cannot be detected by the geomagnetic sensor precision be built in magnetic detection device 26 well, thus produce reduction or the accuracy of detection inequality of accuracy of detection.
In above-mentioned each patent documentation, be provided with in the structure possessed for the resist layer of the peristome making electrode pad expose to installed surface, all unexposed when off-position departs from from the position of regulation, peel off for reducing resist or the structure of installed surface of outflow of solder cream.
Summary of the invention
Therefore, the present invention solves above-mentioned existing problem, and its object is to provides a kind of magnetic detection device that especially can make to stablize magnetic detection device and the manufacture method thereof of setting abreast relative to installation base plate.
[for solving the means of problem]
The invention provides a kind of magnetic detection device, it possesses the Magnetic Sensor in the direction for detecting external magnetic field, and on installed surface, have multiple electrode pad, and the feature of described magnetic detection device is,
Described installed surface is formed with insulation course, described insulation course is formed with multiple peristome, described multiple electrode pad is formed in described multiple peristome,
In described multiple peristome, at least in the circumferential openings portion of periphery being positioned at installed surface, be formed with opening portion, this opening portion is communicated to the side of described magnetic detection device from described circumferential openings portion.Thereby, it is possible to make the minimum width dimension between the position closest to side in circumferential openings portion and side widen than ever, and the area ratio of the insulation course near minimum widith can be made to increase in the past.Therefore, it is possible to more suppress insulation course to peel off or the unfavorable condition such as shortcoming from installed surface than ever.Further, when being installed on installation base plate by magnetic detection device, remaining solder cream can be made to flow out from circumferential openings portion towards opening portion.By more than, magnetic detection device can be arranged on installation base plate abreast, the direction of external magnetic field can be detected by Magnetic Sensor accurately, and precision inequality can be reduced.
In the present invention, preferred described insulation course is resist layer.In the present invention, can resist be effectively suppressed to peel off.
In addition, in the present invention, preferred described magnetic detection device have substrate, described substrate with the cover component of the described Magnetic Sensor that configures on the face of described installed surface opposition side and integrated circuit, the described Magnetic Sensor of covering and described integrated circuit,
Described multiple electrode pad is electrically connected with each wiring layer arranged on the substrate,
The side of described magnetic detection device is made up of the side of described substrate and the side of described cover component.
In addition, in the present invention, preferred described multiple peristome and described multiple electrode pad are formed with circular shape respectively.Each peristome and each electrode pad can be formed simply, and the minimum width dimension between each circumferential openings portion and side can be made to widen than ever, thus effectively can increase the area of the insulation course near described minimum widith, can effectively suppress peeling off of insulation course.
In addition, in the present invention, preferred described Magnetic Sensor is geomagnetic sensor.
In addition, the invention provides a kind of manufacture method of magnetic detection device, described magnetic detection device possesses the Magnetic Sensor in the direction for detecting external magnetic field, and on installed surface, have multiple electrode pad, the feature of the manufacture method of described magnetic detection device is, comprising:
Insulation course is formed on the back side of each installed surface integration by forming multiple described magnetic detection device, on the position of described each installed surface, the multiple peristomes for the formation of described multiple electrode pad are formed respectively relative to this insulation course, now, each installed surface in the described multiple peristome formed, at least form the operation of the opening portion arriving the position of cutting portion from described peristome in the circumferential openings portion of periphery being positioned at each installed surface;
The operation of described electrode pad is formed respectively at described multiple peristome;
By the operation that the described back side cuts off by each magnetic detection device.
Thus, when cutting off by each magnetic detection device, even if off-position departs from slightly from cutting portion, also can make as the side of each magnetic detection device of section and each circumferential openings portion closest to side position between minimum width dimension widen than ever, thus the area ratio of the insulation course near minimum widith can be made to increase in the past.Therefore, it is possible to more suppress insulation course to peel off or the unfavorable condition such as shortcoming from installed surface than ever.In addition, when being installed on installation base plate by magnetic detection device, remaining solder cream can be made to flow out to opening portion roughly equably from each circumferential openings portion.By more than, magnetic detection device can be arranged on installation base plate abreast, the direction of external magnetic field can be detected by Magnetic Sensor accurately, and precision inequality can be reduced.
In addition, in the present invention, compared with the past, the allowed band of off-position can be widened, therefore, it is possible to make manufacturing process's facilitation.
In the present invention, link between each circumferential openings portion be formed on described each installed surface that described cutting portion is adjacent integratedly preferably by described opening portion.Thereby, it is possible to form opening portion simply, and even if off-position departs from slightly, each circumferential openings portion both sides that adjacent each installed surface is formed also suitably can arrange the opening portion being communicated to side (being equivalent to the section of off-position).
In addition, in the present invention, preferred described magnetic detection device have substrate, described substrate with the cover component of the described Magnetic Sensor that configures on the face of described installed surface opposition side and integrated circuit, the described Magnetic Sensor of covering and described integrated circuit,
Described substrate is by the large substrates of the size of multiple described magnetic detection device integration, configures described Magnetic Sensor and described integrated circuit in the position of each magnetic detection device of described large substrates,
By each magnetic detection device, described large substrates is cut off.
By said method, the magnetic detection device of multiple encapsulation can be manufactured simply.
[invention effect]
According to the present invention, the minimum width dimension between the position closest to side in circumferential openings portion and side can be made to widen than ever, thus the area ratio of the insulation course near minimum widith can be made in the past to increase.Therefore, it is possible to more suppress insulation course to peel off or the unfavorable condition such as shortcoming from installed surface than ever.Further, when being installed on installation base plate by magnetic detection device, remaining solder cream can be made to flow out from circumferential openings portion towards opening portion.By more than, magnetic detection device can be arranged on installation base plate abreast, the direction of external magnetic field can be detected by Magnetic Sensor accurately, and precision inequality can be reduced.
Accompanying drawing explanation
Fig. 1 (a) is the front view of the magnetic detection device in present embodiment, Fig. 1 (b) is the rear view of the installed surface representing the magnetic detection device shown in Fig. 1 (a), and Fig. 1 (c) is a partial enlargement rear view part for the installed surface shown in Fig. 1 (b) being amplified and illustrate.
Fig. 2 (a) is the partial enlargement rear view that the circumferential openings portion formed on the insulation course of the installed surface of present embodiment and opening portion are amplified and illustrated, in particular for not having with existing the figure that the effect of present embodiment is described compared with the mode of opening portion like that, Fig. 2 (b) is the partial rear view of the shape in the circumferential openings portion representing another embodiment.
Fig. 3 is the partial enlargement longitudinal section representing magnetic detection device in present embodiment and magnetic detection device is arranged on the state on installation base plate.
Fig. 4 is the block diagram of the magnetic detection device in present embodiment.
Fig. 5 is a process chart (representing the figure of installed surface) of the manufacturing process of the magnetic detection device represented in present embodiment.
Fig. 6 is a process chart (representing the figure of installed surface) of the subsequent processing representing the operation shown in Fig. 5.
Fig. 7 is the manufacturing procedure picture (representing the figure of installed surface) of the magnetic detection device representing another embodiment.
Fig. 8 (a) is the rear view of the installed surface representing existing magnetic detection device, Fig. 8 (b) is a partial enlargement rear view part for the installed surface shown in Fig. 8 (a) being amplified and illustrate, Fig. 8 (c), (d) are the front views of the problem points for illustration of existing magnetic detection device.
[symbol description]
A cutting portion
B off-position
1 magnetic detection device
1a ~ 1e (magnetic detection device) side
2 substrates
2a (substrate) surface
2b (substrate) back side
3 Magnetic Sensors
4 integrated circuit
5 cover components
6,7 insulation courses
8 peristomes
8a circumferential openings portion
Peristome inside 8b
9 electrode pads
10,11 wiring layers
12 installed surfaces
12a periphery
13,14 opening portions
15 installation base plates
16 conductive connection parts
19 solder layers
20 solder creams
20a (solder cream) surplus
21 large substrates
Embodiment
Fig. 1 (a) is the front view of the magnetic detection device in present embodiment, Fig. 1 (b) is the rear view of the installed surface representing the magnetic detection device shown in Fig. 1 (a), and Fig. 1 (c) is a partial enlargement rear view part for the installed surface shown in Fig. 1 (b) being amplified and illustrate.In addition, Fig. 2 (a) is the partial enlargement rear view circumferential openings portion formed on the insulation course of the installed surface of present embodiment and opening portion being amplified and illustrate, in particular for not having with existing the figure that the effect of present embodiment is described compared with the mode of opening portion like that.In addition, Fig. 2 (b) is the partial rear view of the shape in the circumferential openings portion representing another embodiment.In addition, Fig. 3 is the partial enlargement longitudinal section representing magnetic detection device in present embodiment and magnetic detection device is arranged on the state on installation base plate.In addition, Fig. 4 is the block diagram of the magnetic detection device in present embodiment.
The magnetic detection device 1 possessing Magnetic Sensor in present embodiment is such as configured to the geomagnetic sensor (geomagnetic sensor) be equipped on the Portable devices such as portable phone.
X-direction shown in each figure and Y direction represent both direction orthogonal in surface level, and Z-direction represents the direction orthogonal relative to described surface level.
As shown in Figure 1, Figure 3, magnetic detection device 1 has: substrate 2; Be mounted in the Magnetic Sensor 3 on surface (upper surface) 2a of substrate 2 and integrated circuit 4 (ASIC); Cover the cover component 5 on the surface of Magnetic Sensor 3 and integrated circuit 4; At the wiring layer 6 of the upper setting of the back side (lower surface) 2b of substrate 2; The insulation course 7 overleaf 2b formed; The peristome 8 that insulation course 7 is formed; Expose from described peristome 8 and the electrode pad 9 be electrically connected with described wiring layer 6.
As shown in the solid line of Fig. 3, Magnetic Sensor 3 can be arranged on substrate 2 on the surface, or as is shown in phantom in fig. 3, Magnetic Sensor 3 can overlap with integrated circuit 4.
The surperficial 2a of substrate 2 is formed with wiring layer 10, and the connecting end portion 10a of the front end of each wiring layer 10 is electrically connected via electrically conducting adhesive with the electrode section 4a of integrated circuit 4.
As shown in Figure 4, be electrically connected between Magnetic Sensor 3 with integrated circuit 4, the detection signal obtained by Magnetic Sensor 3 is controlled by integrated circuit 4.
Magnetic Sensor 3 is such as geomagnetic sensor as described above, and as shown in Figure 4, geomagnetic sensor possesses X-axis sensor 3a, Y-axis sensor 3b and Z axis sensor 3c.Like this, by using the Magnetic Sensor 3 that can carry out three shaft detection, thus the orientation of earth magnetism can be detected.
In the present embodiment, the structure of Magnetic Sensor 3 does not limit.Such as, magneto-resistance effect element (GMR element, TMR element etc.) or Hall element can be used in Magnetic Sensor 3.
As shown in Figure 3, be provided with the inside wiring layer 11 being communicated to back side 2b from surperficial 2a on a substrate 2, integrated circuit 4 and electrode pad 9 be electrically connected (also with reference to Fig. 4) via inner wiring layer 11.
As shown in Figure 3, insulation course 7 is formed with at the back side 2a of substrate 2.Insulation course 7 is such as resist layer.As shown in Fig. 1 (b), Fig. 3, insulation course 7 is formed with multiple peristome 8.Further, multiple electrode pad 9 is arranged in each peristome 8 singly.
As shown in Fig. 1 (b), each peristome 8 and each electrode pad 9 are formed with circular shape.It should be noted that, in peristome 8, for circumferential openings portion 8a, link continuously as will be described later with opening portion, therefore the profile of circumferential openings portion 8a is not round-shaped strictly speaking, but arc-shaped.Be roughly round-shaped be due to, beyond circle, can also for the shape of being slightly out of shape from circle because of foozle etc., and the mode of the such arc-shaped in the periphery comprising circumferential openings portion 8a.
Each electrode pad 9 is the plane electrode pad (LGA exposed at the installed surface 12 carrying out installing with installation base plate; Landgrid array), overlook down (Z-direction observation) and be formed as circular shape.The peripheral part of each electrode pad 9 is positioned at the position in the inner part, periphery than each peristome 8, thus the area of each peristome of the area ratio of each electrode pad 98 is formed little.
In figure 3, the thickness of each electrode pad 9 is identical with the thickness of insulation course 7, as long as but and can suitably install between installation base plate, then gauge is not particularly limited.
As shown in Fig. 1 (b), in multiple peristomes 8 that insulation course 7 is formed, multiple circumferential openings portion 8a are positioned at the periphery 12a of installed surface 12.At this, near the X1 side 1a that periphery 12a represents the magnetic detection device 1 in installed surface 12, near the 1b of X2 side, near the 1c of Y1 side and near the 1d of Y2 side.It should be noted that, be not rectangular shape in the shape of installed surface 12, but when other polygonal shape, refer near each limit, in addition, when installed surface has curved surface, refer near the side of curved surface.Or, as shown in Fig. 1 (b), near the central authorities of installed surface 12, be provided with peristome (being called inner side peristome 8b), but also the peristome 8 be positioned at than peristome 8b position in the outer part, inner side can be defined as circumferential openings portion 8a.
As shown in Fig. 1 (b), circumferential openings portion 8a is formed in the mode near the X1 side 1a surrounding installed surface 12, near the 1b of X2 side, near the 1c of Y1 side and near the 1d of Y2 side, but the configuration of circumferential openings portion 8a or inner side peristome 8b, number is corresponding with the configuration of the conductive connection part 16 formed on the surface of installation base plate 15 and change.
As shown in Fig. 1 (b), be formed with at multiple circumferential openings portion 8a the opening portion 13 being communicated to arbitrary side 1a ~ 1d respectively.At this, each opening portion 13 is formed towards the side near apart from each circumferential openings portion 8a.Circumferential openings portion 8a shown in Fig. 1 (c) is arranged on the bight of X2-Y2 side in installed surface 12, and peristome 8a is provided with the opening portion 13 being communicated to X2 side 1b and the opening portion 13 being communicated to Y2 side 1d around.It should be noted that, the number of opening portion 13 is provided with more than one relative to each circumferential openings portion 8a.
Each opening portion 13 is formed with the groove shape that each circumferential openings portion 8a with poroid is integrated.The depth dimensions of each opening portion 13 is identical with the depth dimensions of each circumferential openings portion 8a.Each peristome 8 and each opening portion 13 are by through along film thickness direction for insulation course 6, and a part for wiring layer 6 is exposed from each peristome 8.
As shown in Fig. 1 (c), the width dimensions t1 of each opening portion 13 is formed little than greatest width dimension (diameter) t2 of each circumferential openings portion 8a.In addition, in Fig. 1 (b), (c), each opening portion 13 is formed as fixed width, but also can be formed in the mode of wide variety.
If insulation course 7 is resist, then each opening portion 13 can use photoetching technique and be formed together with each circumferential openings portion 8a, in addition, when insulation course 7 is not resist, photoetching technique and etching technique can be used and formed together with each circumferential openings portion 8a.
It should be noted that, although do not form the opening portion be communicated with side on the peristome 8b of inner side, but as shown in the dotted line of Fig. 1 (b), there is the space that can form opening portion 14, even and if solder cream flows out in opening portion 14, as long as do not become non-serviceable state via causing short circuit between the solder cream flowed out and installation base plate 15, then just can the opening portion 14 being communicated to side be set on the peristome 8b of inner side.
As shown in Figure 3, be formed with wiring layer 17 on the surface of installation base plate 15, be provided with conductive connection part 16 in the end of wiring layer 17.In addition, the wiring layer 17 beyond conductive connection part 16 is covered by the insulation courses such as resist 18.
Further, as shown in Figure 3, each electrode pad 9 of magnetic detection device 1 and each conductive connection part 16 of installation base plate 15 are electrically connected via solder layer 19.
As shown in Fig. 1 (a), Fig. 3, the surface of Magnetic Sensor 3 and integrated circuit 4 is covered by cover component 5, magnetic detection device 1 packedization.Such as, cover component 5 is encapsulation molded resin.
In the present embodiment, the side 1a ~ 1d of magnetic detection device 1 is made up of each side of substrate 2 and cover component 5.
In the magnetic detection device 1 of present embodiment, the insulation course 7 that installed surface 12 is arranged is provided with multiple peristome 8, and electrode pad 9 exposes in each peristome 8.In multiple peristome 8, the multiple circumferential openings portions 8 of periphery 12a being positioned at installed surface 12 are communicated with the opening portion 13 being communicated to side 1a ~ 1d near in distance.
The position of the X2 side 1b shown in Fig. 2 (a) is roughly consistent with the position of the cutting portion A shown in manufacture method described later, circumferential openings portion 8a from the side 1b to the inside (X1 side) leave minor increment L1.
But, when off-position B its mobile width scope internal ratio cutting portion A to X1 lateral deviation from time, the side 1e formed by off-position B than original side 1b closer to circumferential openings portion 8a.At this, the side 1e shown in Fig. 2 (a) is arranged on the position (circumference be illustrated by the broken lines connects with side 1e) connected with the circumference of circumferential openings portion 8a do not formed in the mode (conventional example shown in Fig. 8 (a), (b)) of the opening portion 13 be communicated with circumferential openings portion 8a.
The region C represented by the oblique line of Fig. 2 (a) refers to when the structure and embodiment that conventional example are not formed with like that the opening portion 13 being communicated to circumferential openings portion 8a are formed with the Structure Comparison of the opening portion 13 being communicated to circumferential openings portion 8a like that, does not exist in the present embodiment but the region of the insulation course 7 existed in the structure of conventional example.
In the region C of the insulation course 7 represented by oblique line, minimum width dimension between the position closest to side 1e of circumferential openings portion 8a and side 1e is very narrow, in Fig. 2 (a), become zero, region C becomes tapered shape and area becomes very little.Therefore, in the C of region, easily produce the unfavorable condition that insulation course 7 peels off or is short of.
On the other hand, in the present embodiment, form the opening portion 13 being communicated to side 1b, 1e from circumferential openings portion 8a, even if thus off-position B to X1 lateral deviation from and be formed as side 1e, by arranging sidewall portion 13a, 13b of opening portion 13, also make the minimum width dimension between circumferential openings portion 8a and side 1e become L2, thus minimum width dimension L2 can be made to increase than conventional example.Therefore, in the present embodiment, the area ratio conventional example of the insulation course 7 near minimum widith can be made to be formed greatly.Therefore, even if off-position B to the direction close to circumferential openings portion 8a (to greatest extent as shown in Fig. 2 (a), until the position connected with the circumference be illustrated by the broken lines of circumferential openings portion 8a) depart from, in the present embodiment, sidewall portion 13a, 13b of opening portion 13 also can remain, thus can reduce the unfavorable condition that insulation course 7 peels off or be short of.
In addition, in the present embodiment, as shown in Fig. 1 (b), by arranging the opening portion 13 being communicated to arbitrary side 1a ~ 1d at whole circumferential openings portion 8a, thus, as shown in Fig. 1 (c), the surplus 20a of the solder cream 20 used in the joint of installation base plate 15 and conductive connection part 16 is guided in opening portion 13 by from circumferential openings portion 8a.Such as in the present embodiment, carry out soldering by reflux type, and now, the surplus 20a of molten solder cream 20 can be made to flow out to opening portion 13 from each circumferential openings portion 8a.Further, because opening portion 13 is communicated to side, therefore at the position that the coating amount of solder cream is many, surplus 20a suitably can be directed to the foreign side of side via opening portion 13.Therefore, it is possible to the amount of the solder cream in the bonding part between each electrode pad 9 and each conductive connection part 16 is adjusted to all roughly equal in which bonding part.
By more than, as shown in Fig. 1 (a), the magnetic detection device 1 surperficial 15a with installation base plate 15 can be installed abreast, the orientation of earth magnetism can be detected by Magnetic Sensor 3 accurately, and compared with the pastly can reduce precision inequality.
In the present embodiment, preferred insulation course 7 is resist layer.Insulation course 7 can be formed with desired thickness, and simply and suitably can form the multiple peristomes 8 and multiple opening portion 13 that are made up of the shape specified and size on insulation course 7.And, in the present embodiment, even if make insulation course 7 for resist layer, even and if off-position B departs from from the position of original cutting portion A as illustrated in Fig. 2 (a), also the minimum width dimension L2 between circumferential openings portion 8a and side 1e can be made large than ever, therefore, the area ratio conventional example of the insulation course 7 (resist layer) near minimum widith can be made in the present embodiment to be formed greatly.Therefore, it is possible to effectively suppress resist to peel off.
In addition, in the present embodiment, preferred each peristome 8 and each electrode pad 9 are formed with circular shape.As shown in Fig. 2 (a), by the periphery of circumferential openings portion 8a is formed as circular shape (arc-shaped), the minimum width dimension L2 between circumferential openings portion 8a and side 1e more effectively can be increased than ever.Such as, each circumferential openings portion 8a may not be circular shape (arc-shaped), and as shown in Fig. 2 (b), at least also can be formed by or curved dip plane linearly relative to the side 1a ~ 1d of magnetic detection device close to the periphery wall 8a1 of the side 1a ~ 1d of magnetic detection device in the periphery wall 8a1 of each circumferential openings portion 8a.Circumferential openings portion 8a shown in Fig. 2 (b) is rhombus, and periphery wall 8a1,8a1 close to side 1b, 1d in the periphery wall of the circumferential openings portion 8a of rhombus tilt relative to side 1b, 1d.Further, opening portion 13 is formed into side 1b, 1d (dotted line shown in Fig. 2 (b) represents that peristome 8a does not form the mode of the conventional example of opening portion 13 around) from circumferential openings portion 8a.But, circumferential openings portion 8a is formed as the round-shaped ratio shown in Fig. 1 (b), (c), Fig. 2 (a) to be formed as the shape shown in Fig. 2 (b) and more can to form circumferential openings portion 8a simply, therefore more applicable.
Then, the manufacture method of the magnetic detection device 1 of present embodiment is described.
First, in the present embodiment, multiple Magnetic Sensor 3 and multiple integrated circuit 4 are installed in the surface of the large substrates of the size of each substrate 2 integration by forming multiple magnetic detection device 1.Each Magnetic Sensor 3 and each integrated circuit 4 are arranged on the position of each magnetic detection device 1 respectively.
Further, the cover component 5 shown in Fig. 3 is formed on the surface of each Magnetic Sensor 3 and each integrated circuit 4.Cover component 5 between each magnetic detection device 1 integration and formed.Cover component 5 is molded resin, and the surface of multiple Magnetic Sensor 3 and multiple integrated circuit 4 can be shaped the cover component 5 be made up of molded resin.
As shown in Figure 5, be formed with the insulation course 7 be such as made up of resist layer at the back side 21b of large substrates 21, described insulation course 7 use photoetching technique and forms multiple peristome 8.Dotted line shown in Fig. 5 represents cutting portion A, and each region distinguished by cutting portion A forms each installed surface 12 of each magnetic detection device 1.
As shown in Figure 5, in multiple peristomes 8 that each installed surface 12 is formed, on the multiple circumferential openings portion 8a of periphery being positioned at each installed surface 12, the opening portion 13 arriving the position of cutting portion A is formed with each circumferential openings portion 8a simultaneously.Each circumferential openings portion 8a and opening portion 13 are the holes (hole) formed on insulation course 7.Wiring layer 6 shown in Fig. 3 exposes from each circumferential openings portion 8a.
As shown in Figure 5, linked between each circumferential openings portion 8a be formed on each installed surface 12 adjacent across cutting portion A integratedly by opening portion 13.Such as shown in Fig. 7, if cutting portion A has the width of certain degree, and the end 13c with each each opening portion 13 of circumferential openings portion 8a continuous print is formed in the mode entered in the width of cutting portion A, then also can be linked between the circumferential openings portion 8a that cutting portion A is adjacent integratedly by opening portion 13 as shown in Figure 5.If cut off by large substrates 21 from the cutting portion A shown in Fig. 7, then can form the opening portion 13 of the side being communicated to each magnetic detection device 1 on each circumferential openings portion 8a of each installed surface 12 formation.But, if off-position is the degree slightly departed from from cutting portion A, then no problem, if but as shown in Figure 7 off-position B become large from departing from of cutting portion A, then each circumferential openings portion 8a arranged on the right side of the diagram of Fig. 7 is formed the side not being communicated to magnetic detection device 1 and the opening portion 13 that stops in midway.Therefore, as shown in Figure 5, situation about being linked integratedly by opening portion 13 between each perimetered open portion 8a formed on each installed surface 12 that cutting portion A is adjacent can widen the allowed band that off-position departs from, therefore preferably.
Then, as shown in Figure 6, in each circumferential openings portion 8a, electrode pad 9 is formed.In addition, if having the inner side peristome 8b shown in Fig. 1 (b), then in the peristome 8b of inner side, electrode pad 9 is also formed.As mentioned above, because a part for wiring layer 6 is exposed in each peristome 8, therefore electrode pad 9 is overlapping and be formed on wiring layer 6.In addition, the material of electrode pad 9 is not particularly limited, but such as can be formed by by coating Ag paste or Cu paste and the conductive layer that makes their heat curings and obtain.
In addition, in Fig. 5, Fig. 6, each peristome 8 and each electrode pad 9 are formed as circular shape, but shape is not limited.But, be formed as circular shape preferred.
Then, along cutting portion A, large substrates 21 and cover component are undertaken cutting off (cutting) by each magnetic detection device 1.Now, as shown in Figure 6, even if off-position B departs from from original cutting portion A, the manufacture method of magnetic detection device according to the present embodiment, each circumferential openings portion 8a that the installed surface 12 of each magnetic detection device 1 is formed also can be formed the opening portion 13 of the side being communicated to magnetic detection device 1 respectively.Therefore, when being installed on installation base plate 15 by reflow soldering by each magnetic detection device 1, remaining solder cream can be made to flow out from each circumferential openings portion 8a to opening portion 13.
In addition, as illustrated in Fig. 2 (a), even if off-position B from original side 1b to X1 lateral deviation from and be formed as side 1e, by forming sidewall portion 13a, 13b of opening portion 13, also the minimum width dimension between circumferential openings portion 8a and side 1e can be formed as L2, thus minimum width dimension can be made larger than conventional example.Therefore, in the present embodiment, the area ratio conventional example of the insulation course 7 near minimum widith can be made to be formed greatly.Therefore, even if off-position B departs from slightly to the direction close to circumferential openings portion 8a, the unfavorable condition that insulation course 7 peels off or is short of can also be reduced.
By more than, the magnetic detection device 1 of present embodiment can be arranged on the surface of installation base plate 15 abreast.Further, in the present embodiment, the allowed band of off-position can be made to widen than ever, therefore, it is possible to make manufacturing process's facilitation.
It should be noted that, in the present embodiment, circumferential openings portion 8a is multiple, even if but be one.Also than ever there is effect.
Magnetic detection device 1 in present embodiment also can be appointed beyond geomagnetic sensor.But, be applied to the magnetic detection device that 3-axis acceleration sensor or speed pickup etc. need the direction of correctly learning external magnetic field.
Claims (11)
1. a magnetic detection device, it possesses the Magnetic Sensor in the direction for detecting external magnetic field, and on installed surface, have multiple electrode pad, and the feature of described magnetic detection device is,
Described installed surface is formed with insulation course, described insulation course is formed with multiple peristome, described multiple electrode pad is formed in described multiple peristome,
In described multiple peristome, at least in the circumferential openings portion of periphery being positioned at installed surface, be formed with opening portion, this opening portion is communicated to the side of described magnetic detection device from described circumferential openings portion,
The depth dimensions of described opening portion is identical with the depth dimensions in described circumferential openings portion.
2. magnetic detection device according to claim 1, wherein,
Described insulation course is resist layer.
3. magnetic detection device according to claim 1 and 2, wherein,
Described magnetic detection device have substrate, described substrate with the cover component of the described Magnetic Sensor that configures on the face of described installed surface opposition side and integrated circuit, the described Magnetic Sensor of covering and described integrated circuit,
Described multiple electrode pad is electrically connected with each wiring layer arranged on the substrate,
The side of described magnetic detection device is made up of the side of described substrate and the side of described cover component.
4. magnetic detection device according to claim 1 and 2, wherein,
Described multiple peristome and described multiple electrode pad are formed with circular shape respectively.
5. magnetic detection device according to claim 1 and 2, wherein,
Described Magnetic Sensor is geomagnetic sensor.
6. magnetic detection device according to claim 1 and 2, wherein,
Minor increment L1 leaves to the inside from described side in described circumferential openings portion.
7. magnetic detection device according to claim 1 and 2, wherein,
The sidewall portion (13a, 13b) of described opening portion is set from described circumferential openings portion to described side.
8. magnetic detection device according to claim 1 and 2, wherein,
Described opening portion is communicated with apart from upper near side.
9. a manufacture method for magnetic detection device, described magnetic detection device possesses the Magnetic Sensor in the direction for detecting external magnetic field, and on installed surface, have multiple electrode pad, and the feature of the manufacture method of described magnetic detection device is, comprising:
Insulation course is formed on the back side of each installed surface integration by forming multiple described magnetic detection device, on the position of described each installed surface, the multiple peristomes for the formation of described multiple electrode pad are formed respectively relative to this insulation course, now, in described multiple peristome that each installed surface is formed, at least in the circumferential openings portion of periphery being positioned at each installed surface, Formation Depth size is identical with the depth dimensions in described circumferential openings portion and arrive the operation of the opening portion of the position of cutting portion from described peristome;
The operation of described electrode pad is formed respectively at described multiple peristome;
By the operation that the described back side cuts off by each magnetic detection device.
10. the manufacture method of magnetic detection device according to claim 9, wherein,
Linked between each circumferential openings portion be formed on described each installed surface that described cutting portion is adjacent integratedly by described opening portion.
The manufacture method of 11. magnetic detection devices according to claim 9 or 10, wherein,
Described magnetic detection device have substrate, described substrate with the cover component of the described Magnetic Sensor that configures on the face of described installed surface opposition side and integrated circuit, the described Magnetic Sensor of covering and described integrated circuit,
Described substrate is by the large substrates of the size of multiple described magnetic detection device integration, and the position of each magnetic detection device of described large substrates configures described Magnetic Sensor and described integrated circuit,
By each magnetic detection device, described large substrates is cut off.
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| JP2012059277A JP5912701B2 (en) | 2012-03-15 | 2012-03-15 | Method for manufacturing magnetic detection device |
| JP2012-059277 | 2012-03-15 |
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| WO2015099088A1 (en) * | 2013-12-27 | 2015-07-02 | 日立金属株式会社 | Magnetic sensor, magnetic encoder using same, lens barrel, camera and method for manufacturing magnetic sensor |
| CN104793152B (en) * | 2014-01-16 | 2019-02-15 | 北京嘉岳同乐极电子有限公司 | A kind of highly sensitive chip sensor |
| CN106104290B (en) * | 2014-01-29 | 2019-06-04 | 北京嘉岳同乐极电子有限公司 | High-sensitiivty magnetic sensor and preparation method thereof |
| US10145909B2 (en) * | 2014-11-17 | 2018-12-04 | Seiko Epson Corporation | Magnetism measuring device, gas cell, manufacturing method of magnetism measuring device, and manufacturing method of gas cell |
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| JP2013195076A (en) | 2013-09-30 |
| CN103308870A (en) | 2013-09-18 |
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