JP2013195076A - Magnetic detector and manufacturing method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a magnetic detector capable of being arranged stably and parallel to a mounting substrate, and also to provide a manufacturing method of the same.SOLUTION: A magnetic detector 1 includes a magnetic sensor for detecting a direction of an external magnetic field, and a plurality of electrode pads on a mounting surface. An isolation layer 7 is formed on the mounting surface 12. A plurality of apertures 8 are formed in the isolation layer 7. A plurality of electrode pads 9 are formed in the plurality of apertures 8. A plurality of circumferential apertures 8a are a part of the apertures 8 and are located in at least a circumferential portion 12a of the mounting surface 12. In the circumferential apertures 8a, open parts 13 reaching from the circumferential apertures 8a to respective side faces 1a-1d of the magnetic detector are formed.

Description

  The present invention relates to a structure of a mounting surface of a magnetic detection device including a magnetic sensor for detecting the direction of an external magnetic field.

  As a magnetic sensor for detecting the direction of the external magnetic field, for example, there is a geomagnetic sensor for detecting the direction of geomagnetism.

  A magnetic detection device having a geomagnetic sensor is packaged with the geomagnetic sensor on a substrate. The back surface of the substrate corresponds to a mounting surface with the mounting substrate, and a resist layer 22 applied to the back surface of the substrate is formed on the mounting surface 30 as shown in FIG. 8A (back surface view of a conventional magnetic detection device). A plurality of openings 23 are formed in the resist layer 22. The electrode pads 31 are exposed in the openings 23, respectively. As shown in FIG. 8A, by arranging the plurality of electrode pads 31 on the mounting surface 30, it is possible to increase the density of board mounting.

  The side surface 24 of the magnetic detection device shown in FIG. 8A corresponds to a cut surface during the manufacturing process. That is, in order to manufacture a plurality of magnetic detection devices at the same time, using a substrate (large substrate) larger than the substrate constituting each magnetic detection device, after mounting and molding a plurality of magnetic sensors on the large substrate, A large substrate is cut for each magnetic detection device. The cut surface at that time corresponds to the side surface 24 of each magnetic detection device.

JP 2001-7246 A JP 2002-1000071 A JP 2008-277661 A JP 2006-295156 A

  However, when the large substrate is cut for each magnetic detection device, if the cutting position D deviates from a predetermined position as shown in FIG. 8A, FIG. As shown in the partial enlarged rear view), at least a part of the peripheral opening (denoted by reference numeral 23a in FIGS. 8A and 8B) located in the peripheral portion of the mounting surface 30 and the side surface of the magnetic detection device The space | interval between 24 becomes narrow, or the communication part (defect part) 25 which leads to the side surface 24 will be formed in the surrounding opening part 23a. In addition, the side surface 24 shown in FIG.8 (b) is a side surface at the time of cut | disconnecting in the cutting position D shown to Fig.8 (a).

  If the side surface 24 is formed at the cutting position D as shown in FIG. 8B, the minimum width between the side surface 24 and the position closest to the side surface 24 of the peripheral opening 23a becomes very small. Since the area of the resist layer 22 in the vicinity of the minimum width (indicated by reference numeral 22a in FIG. 8B) is very small, there is a problem that resist peeling is likely to occur.

  When the resist layer 22 is peeled off, a peeling portion of the resist layer 22 is sandwiched between the mounting surface 30 of the magnetic detection device 26 and the mounting substrate 27 as shown in FIG. 8C (front view of the magnetic detection device). Therefore, it is easy to mount the magnetic detection device 26 in an inclined state with respect to the mounting substrate 27. In addition, the code | symbol 29 shown to FIG.8 (c) (d) is a solder layer.

  Further, when a communication portion (defect portion) 25 that leads to the side surface 24 is formed in the peripheral opening 23a, as shown in FIG. 8D (a front view of the magnetic detection device), the electrode pad 31 and the mounting substrate The solder paste 28 for joining the conductive connecting portions 27 easily flows out of the side surface 24 from the communication portion 25. At this time, in the peripheral opening 23a located on the right side of the figure shown in FIG. 8A, the solder paste 28 tends to flow outward from the side surface 24 via the communication part 25, but the left side of the figure shown in FIG. 8A. In the peripheral opening 23 a located at, the communication portion 25 is not formed, and the solder paste 28 does not easily flow to the outside of the side surface 24. Therefore, the conductivity between the electrode pad 31 and the mounting substrate 27 in the peripheral opening 23a where the solder paste 28 easily flows, and between the electrode pad 31 and the mounting substrate 27 in the peripheral opening 23a where the solder paste 28 does not flow. An interval (spacing) in the height direction changes between the connecting portions. Therefore, as shown in FIG. 8D, the magnetic detection device 26 is easily mounted in a state of being inclined with respect to the mounting substrate 27. In FIG. 8D, the solder paste 28 that has flowed outward and the solder layer 29 that joins between the magnetic detection device 26 and the mounting substrate 27 are shown separately.

  As shown in FIGS. 8C and 8D, when the magnetic detection device 26 is mounted in an inclined state with respect to the mounting substrate 27, the geomagnetic sensor built in the magnetic detection device 26 can detect the geomagnetism. The azimuth could not be detected with high accuracy, resulting in a decrease in detection accuracy and variations in detection accuracy.

  In each of the above-mentioned patent documents, in any configuration in which a resist layer having an opening for exposing an electrode pad on the mounting surface is provided, when the cutting position deviates from a predetermined position, resist peeling or solder paste The structure of the mounting surface for reducing the outflow of the battery is not disclosed.

  Accordingly, the present invention is to solve the above-described conventional problems, and in particular, to provide a magnetic detection device capable of stably installing the magnetic detection device in parallel to the mounting substrate and a method for manufacturing the same. Objective.

The present invention includes a magnetic sensor for detecting the direction of an external magnetic field and having a plurality of electrode pads on a mounting surface.
An insulating layer is formed on the mounting surface, a plurality of openings are formed in the insulating layer, and the plurality of electrode pads are formed in the plurality of openings,
Among the plurality of openings, at least a peripheral opening located at a peripheral portion of the mounting surface is formed with an open portion that extends from the peripheral opening to a side surface of the magnetic detection device. It is. As a result, the position closest to the side surface of the peripheral opening and the minimum width dimension between the side surfaces can be made wider than before, and the area of the insulating layer near the minimum width can be made larger than before. Accordingly, it is possible to suppress problems such as peeling or chipping of the insulating layer from the mounting surface. Further, when the magnetic detection device is mounted on the mounting substrate, excess solder paste can flow out from the peripheral opening toward the opening. As described above, the magnetic detection device can be mounted in parallel on the mounting substrate, the direction of the external magnetic field can be detected with high accuracy by the magnetic sensor, and variation in accuracy can be reduced.

  In the present invention, the insulating layer is preferably a resist layer. In the present invention, resist peeling can be effectively suppressed.

In the present invention, the substrate, the magnetic sensor and the integrated circuit disposed on the surface opposite to the mounting surface of the substrate, and a cover member that covers the magnetic sensor and the integrated circuit,
The plurality of electrode pads are electrically connected to each wiring layer provided on the substrate,
It is preferable that a side surface of the magnetic detection device is constituted by a side surface of the substrate and a side surface of the cover member.

In the present invention, it is preferable that the plurality of openings and the plurality of electrode pads are each formed in a substantially circular shape. Each opening and each electrode pad can be easily formed, and the minimum width dimension between each peripheral opening and the side surface can be expanded as compared with the conventional case to effectively increase the area of the insulating layer near the minimum width. And peeling of the insulating layer can be effectively suppressed.
In the present invention, the magnetic sensor is preferably a geomagnetic sensor.

The present invention also includes a magnetic sensor for detecting the direction of an external magnetic field, and a method for manufacturing a magnetic detection device having a plurality of electrode pads on a mounting surface.
A plurality of openings for forming the plurality of electrode pads are formed at positions of the mounting surfaces, respectively, with respect to an insulating layer formed on the back surface integrating the mounting surfaces constituting the plurality of magnetic detection devices. At this time, among the plurality of openings formed on each mounting surface, an opening that reaches from the opening to the position of the cutting portion is formed at least in the peripheral opening located at the periphery of each mounting surface. Process,
Forming the electrode pad in each of the plurality of openings,
Cutting the back surface for each magnetic detection device;
It is characterized by having. Thereby, when cutting for each magnetic detection device, even if the cutting position is slightly deviated from the cutting portion, between the side surface of each magnetic detection device that is the cutting surface and the position closest to the side surface of each peripheral opening The minimum width dimension can be increased as compared with the conventional case, and the area of the insulating layer near the minimum width can be increased as compared with the conventional case. Accordingly, it is possible to suppress problems such as peeling or chipping of the insulating layer from the mounting surface. Further, when the magnetic detection device is mounted on the mounting substrate, it is possible to allow excess solder paste to flow out from each peripheral opening portion to the open portion substantially uniformly. As described above, the magnetic detection device can be mounted in parallel on the mounting substrate, the direction of the external magnetic field can be detected with high accuracy by the magnetic sensor, and variation in accuracy can be reduced.

  Further, in the present invention, the allowable range of the cutting position can be expanded as compared with the conventional case, and thus the manufacturing process can be facilitated.

  In the present invention, it is preferable that the peripheral openings formed on the mounting surfaces adjacent to each other with the cutting part interposed therebetween are integrally connected by the open part. As a result, an open part can be easily formed, and even if the cutting position is slightly shifted, both side openings (corresponding to the cutting surface at the cutting position) are appropriately formed on both peripheral openings formed on each adjacent mounting surface. An open portion can be provided.

In the present invention, the substrate, the magnetic sensor and the integrated circuit disposed on the surface opposite to the mounting surface of the substrate, and a cover member that covers the magnetic sensor and the integrated circuit,
The substrate is a large substrate having a size in which a plurality of the magnetic detection devices are integrated, and the magnetic sensor and the integrated circuit are arranged at positions of the magnetic detection devices on the large substrate,
The large substrate is preferably cut for each magnetic detection device.
As described above, a plurality of packaged magnetic detection devices can be easily manufactured.

  According to the present invention, the position closest to the side surface of each peripheral opening and the minimum width dimension between the side surfaces can be increased as compared with the conventional case, and the area of the insulating layer near the minimum width can be increased as compared with the conventional case. Accordingly, it is possible to suppress problems such as peeling or chipping of the insulating layer from the mounting surface. Further, when the magnetic detection device is mounted on the mounting substrate, excess solder paste can be allowed to flow out substantially uniformly from each peripheral opening toward each open portion. As described above, the magnetic detection device can be mounted in parallel on the mounting substrate, the direction of the external magnetic field can be detected with high accuracy by the magnetic sensor, and variation in accuracy can be reduced.

FIG. 1A is a front view of the magnetic detection device according to the present embodiment, and FIG. 1B is a rear view showing the mounting surface of the magnetic detection device shown in FIG. c) is a partially enlarged back view showing an enlarged part of the mounting surface shown in FIG. FIG. 2A is a partially enlarged back view showing an enlarged peripheral opening and an open portion formed in the insulating layer on the mounting surface of this embodiment, and in particular, there is no open portion as in the prior art. It is a figure for demonstrating the effect of this embodiment compared with a form, FIG.2 (b) is a partial back view which shows the shape of the surrounding opening part of another embodiment. FIG. 3 is a partially enlarged longitudinal sectional view showing the magnetic detection device and the magnetic detection device according to the present embodiment mounted on a mounting substrate. FIG. 4 is a block diagram of the magnetic detection device according to the present embodiment. FIG. 5 is a process diagram (a diagram illustrating a mounting surface) illustrating a manufacturing process of the magnetic detection device according to the present embodiment. FIG. 6 is a process diagram (a diagram illustrating a mounting surface) illustrating a process subsequent to the process illustrated in FIG. 5. FIG. 7 is a manufacturing process diagram (a diagram showing a mounting surface) of a magnetic detection device showing another embodiment. FIG. 8A is a rear view showing a mounting surface of a conventional magnetic detection device, and FIG. 8B is a partially enlarged rear view showing a part of the mounting surface shown in FIG. FIGS. 8C and 8D are front views for explaining problems of the conventional magnetic detection device.

  FIG. 1A is a front view of the magnetic detection device according to the present embodiment, and FIG. 1B is a rear view showing the mounting surface of the magnetic detection device shown in FIG. c) is a partially enlarged back view showing an enlarged part of the mounting surface shown in FIG. FIG. 2 (a) is a partially enlarged rear view showing an enlarged peripheral opening and an opening formed in the insulating layer on the mounting surface of the present embodiment. It is a figure for demonstrating the effect of this embodiment compared with the form which has no. Moreover, FIG.2 (b) is a partial back surface figure which shows the shape of the surrounding opening part of another embodiment. FIG. 3 is a partially enlarged longitudinal sectional view showing a state in which the magnetic detection device and the magnetic detection device according to the present embodiment are mounted on a mounting substrate. FIG. 4 is a block diagram of the magnetic detection device in the present embodiment.

  A magnetic detection device 1 including a magnetic sensor in the present embodiment is configured as a geomagnetic detection device (geomagnetic sensor) mounted on a portable device such as a mobile phone.

  The X-axis direction and the Y-axis direction shown in each figure indicate two directions orthogonal to each other in the horizontal plane, and the Z-axis direction indicates a direction orthogonal to the horizontal plane.

  As shown in FIGS. 1 and 3, the magnetic detection device 1 includes a substrate 2, a magnetic sensor 3 mounted on a surface (upper surface) 2 a of the substrate 2, an integrated circuit 4 (ASIC), a magnetic sensor 3, and an integrated circuit. A cover member 5 covering the surface of the circuit 4, a wiring layer 6 provided on the back surface (lower surface) 2b of the substrate 2, an insulating layer 7 formed on the back surface 2b, and an opening 8 formed in the insulating layer 7. And an electrode pad 9 exposed from the opening 8 and electrically connected to the wiring layer 6.

  As shown by the solid line in FIG. 3, the magnetic sensor 3 may be provided on the surface of the substrate 2, or may be provided so as to overlap the integrated circuit 4 as shown by the dotted line in FIG. 3.

  A wiring layer 10 is formed on the surface 2a of the substrate 2, and the connection end 10a at the tip of each wiring layer 10 and the electrode part 4a of the integrated circuit 4 are electrically connected via a conductive adhesive.

  As shown in FIG. 4, the magnetic sensor 3 and the integrated circuit 4 are electrically connected, and the detection signal obtained by the magnetic sensor 3 is controlled by the integrated circuit 4.

  As described above, the magnetic sensor 3 is, for example, a geomagnetic sensor, and the geomagnetic sensor includes an X-axis sensor 3a, a Y-axis sensor 3b, and a Z-axis sensor 3c as shown in FIG. Thus, it is possible to detect the azimuth of geomagnetism by using the magnetic sensor 3 capable of detecting three axes.

  In the present embodiment, the configuration of the magnetic sensor 3 is not limited. For example, the magnetic sensor 3 can be a magnetoresistive element (GMR element, TMR element, etc.) or a Hall element.

  As shown in FIG. 3, the substrate 2 is provided with an internal wiring layer 11 leading from the front surface 2 a to the back surface 2 b, and the integrated circuit 4 and the electrode pad 9 are electrically connected via the internal wiring layer 11. (See also FIG. 4).

  As shown in FIG. 3, an insulating layer 7 is formed on the back surface 2 a of the substrate 2. The insulating layer 7 is a resist layer, for example. As shown in FIGS. 1B and 3, a plurality of openings 8 are formed in the insulating layer 7. A plurality of electrode pads 9 are provided in each opening 8 one by one.

  As shown in FIG. 1B, each opening 8 and each electrode pad 9 are formed in a substantially circular shape. In addition, since the opening part is connecting continuously about the surrounding opening part 8a among the opening parts 8 so that it may mention later, the outline of the surrounding opening part 8a is not circular shape but circular arc shape. The reason for having a substantially circular shape is that it may be a shape slightly deformed from a circle due to manufacturing errors or the like in addition to a circle, and also includes an arcuate shape such as the outer periphery of the peripheral opening 8a.

  Each electrode pad 9 is a planar electrode pad (LGA; Land grid array) exposed on the mounting surface 12 with the mounting substrate, and has a substantially circular shape in plan view (viewed in the Z direction). The outer peripheral part of each electrode pad 9 is located inside the outer periphery of each opening 8, and the area of each electrode pad 9 is formed smaller than each opening 8.

  In FIG. 3, the thickness of each electrode pad 9 is equal to the thickness of the insulating layer 7, but the thickness dimension is not particularly limited as long as it can be appropriately mounted with the mounting substrate. .

  As shown in FIG. 1B, among the plurality of openings 8 formed in the insulating layer 7, the plurality of peripheral openings 8 a are located in the peripheral part 12 a of the mounting surface 12. Here, the surrounding portion 12a indicates the vicinity of the X1 side surface 1a, the vicinity of the X2 side surface 1b, the vicinity of the Y1 side surface 1c, and the vicinity of the Y2 side surface 1d of the magnetic detection device 1 in the mounting surface 12. In addition, when the shape of the mounting surface 12 is not rectangular but is another polygonal shape, it indicates the vicinity of each side, and when the mounting surface has a curved surface, the vicinity of the side surface along the curved surface is indicated. Point to. Alternatively, as shown in FIG. 1B, an opening (referred to as an inner opening 8b) is provided in the vicinity of the center of the mounting surface 12, but the opening 8 positioned outside the inner opening 8b is surrounded by It can also be defined as the opening 8a.

  As shown in FIG. 1B, the peripheral opening 8a is formed so as to surround the X1 side surface 1a, the X2 side surface 1b, the Y1 side surface 1c and the Y2 side surface 1d of the mounting surface 12. The arrangement and number of the openings 8 a and the inner openings 8 b are changed according to the arrangement of the conductive connection parts 16 formed on the surface of the mounting substrate 15.

  As shown in FIG.1 (b), the opening part 13 which leads to any one of the side surfaces 1a-1d is formed in the some surrounding opening part 8a, respectively. Here, each opening part 13 is formed toward the side surface near from each surrounding opening part 8a. The peripheral opening 8a shown in FIG. 1C is provided at the corner on the X2-Y2 side in the mounting surface 12, and the peripheral opening 8a has an open portion 13 leading to the X2 side surface 1b and the Y2 side surface. An open part 13 leading to 1d is provided. One or more open portions 13 are provided for each peripheral opening 8a.

  Each open portion 13 is formed in a groove shape integrated with each hole-shaped peripheral opening 8a. The depth dimension of each open part 13 and the depth dimension of each surrounding opening 8a are the same. Each opening 8 and each opening 13 penetrates the insulating layer 6 in the film thickness direction, and a part of the wiring layer 6 is exposed from each opening 8.

  As shown in FIG.1 (c), the width dimension t1 of each open part 13 is formed smaller than the maximum width dimension (diameter) t2 of each surrounding opening part 8a. In addition, each open portion 13 has a constant width in FIGS. 1B and 1C, but may be formed so that the width changes.

  If the insulating layer 7 is a resist, each open portion 13 can be formed together with each peripheral opening 8a using a photolithography technique. If the insulating layer 7 is not a resist, each opening section 13 can be formed using a photolithography technique and an etching technique. It can be formed with each peripheral opening 8a.

  In addition, although the opening part which leads to a side surface is not formed in the inner side opening part 8b, there exists a space which can form the opening part 14 as shown by the dotted line of FIG. Even if it flows, if the short circuit is caused between the mounting substrate 15 and the unusable state via the solder paste that has flowed out, the inner opening 8b can be provided with an opening 14 that leads to the side surface.

  As shown in FIG. 3, the wiring layer 17 is formed on the surface of the mounting substrate 15, and the conductive connection portion 16 is provided at the end of the wiring layer 17. The wiring layer 17 other than the conductive connection portion 16 is covered with an insulating layer 18 such as a resist.

  As shown in FIG. 3, each electrode pad 9 of the magnetic detection device 1 and each conductive connection portion 16 of the mounting substrate 15 are electrically connected via a solder layer 19.

  As shown in FIGS. 1A and 3, the surfaces of the magnetic sensor 3 and the integrated circuit 4 are covered with a cover member 5, and the magnetic detection device 1 is packaged. For example, the cover member 5 is a package molding resin.

  In the present embodiment, the side surfaces 1 a to 1 d of the magnetic detection device 1 are configured by the side surfaces of the substrate 2 and the cover member 5.

  In the magnetic detection device 1 of the present embodiment, a plurality of openings 8 are provided in the insulating layer 7 provided on the mounting surface 12, and the electrode pads 9 are exposed in the openings 8. Among the plurality of openings 8, the plurality of peripheral openings 8 positioned on the peripheral portion 12 a of the mounting surface 12 communicate with the open portions 13 that lead to the side surfaces 1 a to 1 d that are close in distance.

  The position of the X2 side surface 1b shown in FIG. 2A substantially coincides with the position of the cutting portion A shown in the manufacturing method described later, and the peripheral opening 8a is located inside (X1 side) by the minimum distance L1 from the side surface 1b. is seperated.

  However, when the cutting position B is shifted to the X1 side from the cutting portion A within the range of the fluctuation width, the side surface 1e formed by the cutting position B is closer to the peripheral opening 8a than the original side surface 1b. Here, the side surface 1e shown in FIG. 3 is in contact with the circumference of the peripheral opening 8a in the form in which the open portion 13 communicating with the peripheral opening 8a is not formed (conventional example shown in FIGS. 8A and 8B). It is provided at a position (the circumference indicated by the dotted line is in contact with the side surface 1e).

  A region C indicated by hatching in FIG. 2A has a configuration in which the open portion 13 that communicates with the peripheral opening 8a is not formed as in the conventional example, and communicates with the peripheral opening 8a as in the embodiment. When compared with the configuration in which the open portion 13 is formed, it refers to the region of the insulating layer 7 that does not exist in the present embodiment but exists in the configuration of the conventional example.

  In the region C of the insulating layer 7 indicated by oblique lines, the minimum width dimension between the position closest to the side surface 1e of the peripheral opening 8a and the side surface 1e is very narrow, and is zero in FIG. The area C has a tapered shape and a very small area. For this reason, in the region C, there is a tendency that the insulating layer 7 is peeled off or chipped.

  On the other hand, in the present embodiment, by forming the opening 13 that communicates from the peripheral opening 8a to the side surfaces 1b and 1e, even if the cutting position B shifts to the X1 side and becomes the side 1e, the opening 13 By providing the side wall portions 13a and 13b, the minimum width dimension between the peripheral opening 8a and the side surface 1e is L2, and the minimum width dimension L2 can be made larger than that of the conventional example. Therefore, in this embodiment, the area of the insulating layer 7 near the minimum width can be formed larger than that of the conventional example. Therefore, even if the cutting position B is slightly shifted in the direction approaching the peripheral opening 8a (up to the position in contact with the circumference indicated by the dotted line of the peripheral opening 8a as shown in FIG. 2A). In this embodiment, the side wall portions 13a and 13b of the open portion 13 remain, and the problem that the insulating layer 7 is peeled off or chipped can be reduced.

  Further, in this embodiment, as shown in FIG. 1B, all the peripheral openings 8a are provided with the open portions 13 leading to any one of the side surfaces 1a to 1d. As shown in FIG. 1C, the surplus portion 20a of the solder paste 20 used for bonding is guided into the open portion 13 from the peripheral opening 8a. For example, in the present embodiment, soldering is performed by the reflow method. At this time, the excess 20a of the melted solder paste 20 can flow out from each peripheral opening 8a to the opening 13. Moreover, since the open part 13 leads to the side surface, the surplus portion 20a can be appropriately guided to the outside of the side surface through the open part 13 in a place where the amount of solder paste applied is large. Therefore, the amount of solder paste at the joint portion between each electrode pad 9 and each conductive connecting portion 16 can be adjusted to be substantially the same at any joint portion.

  1A, the magnetic detection device 1 can be mounted in parallel to the surface 15a of the mounting substrate 15, and the magnetic sensor 3 can detect the azimuth of the geomagnetism with high accuracy. Variation in accuracy can be reduced.

  In the present embodiment, the insulating layer 7 is preferably a resist layer. The insulating layer 7 can be formed with a desired thickness, and a plurality of openings 8 and a plurality of openings 13 having a predetermined shape and size can be easily and appropriately formed in the insulating layer 7. In this embodiment, even if the insulating layer 7 is a resist layer, even if the cutting position B is deviated from the original position of the cutting portion A as described with reference to FIG. The minimum width dimension L2 between them can be made larger than in the prior art. Therefore, in this embodiment, the area of the insulating layer 7 (resist layer) near the minimum width can be formed larger than in the conventional example. Therefore, resist peeling can be effectively suppressed.

  In the present embodiment, each opening 8 and each electrode pad 9 are preferably formed in a substantially circular shape. As shown in FIG. 2A, by making the outer periphery of the peripheral opening 8a into a substantially circular shape (arc shape), the minimum width dimension L2 between the peripheral opening 8a and the side surface 1e can be more effectively improved than before. Can be big. For example, even if each peripheral opening 8a is not substantially circular (arc), as shown in FIG. 2B, at least the side surface 1a of the magnetic detection device among the outer peripheral wall surface 8a1 of each peripheral opening 8a. The outer peripheral wall surface 8a1 close to ˜1d may be formed as a linear or curved inclined surface with respect to the side surfaces 1a to 1d of the magnetic detection device. The peripheral opening 8a shown in FIG. 2 (b) has a rhombus shape, and among the outer peripheral wall surfaces of the rhombic peripheral opening 8a, the outer peripheral wall surfaces 8a1, 8a1 near the side surfaces 1b, 1d are inclined with respect to the side surfaces 1b, 1d. Yes. And the open part 13 is formed from the surrounding opening part 8a to the side surfaces 1b and 1d (the dotted line shown in FIG.2 (b) shows the form of the prior art example in which the open part 13 is not formed in the surrounding opening part 8a). However, it is easier to form the peripheral opening 8a because the circular opening shown in FIGS. 1B, 1C, and 2A is easier than the shape shown in FIG. It is.

Next, the manufacturing method of the magnetic detection apparatus 1 of this embodiment is demonstrated.
First, in this embodiment, a plurality of magnetic sensors 3 and a plurality of integrated circuits 4 are mounted on the surface of a large substrate having a size in which the substrates 2 constituting the plurality of magnetic detection devices 1 are integrated. Each magnetic sensor 3 and each integrated circuit 4 are mounted at the position of each magnetic detection device 1.

  Further, the cover member 5 shown in FIG. 3 is formed on the surface of each magnetic sensor 3 and each integrated circuit 4. The cover member 5 is integrally formed across the magnetic detection devices 1. The cover member 5 is a mold resin, and the cover member 5 made of the mold resin can be formed on the surfaces of the plurality of magnetic sensors 3 and the plurality of integrated circuits 4.

  As shown in FIG. 5, an insulating layer 7 made of, for example, a resist layer is formed on the back surface 21b of the large substrate 21, and a plurality of openings 8 are formed in the insulating layer 7 using a photolithography technique. A dotted line shown in FIG. 5 indicates the cutting part A, and each region divided by the cutting part A constitutes each mounting surface 12 of each magnetic detection device 1.

  As shown in FIG. 5, among the plurality of openings 8 formed on each mounting surface 12, the opening 13 that reaches the position of the cutting portion A reaches the plurality of peripheral openings 8 a located on the periphery of each mounting surface 12. Are formed simultaneously with each peripheral opening 8a. Each peripheral opening 8a and the opening 13 are holes (holes) formed in the insulating layer 7. The wiring layer 6 shown in FIG. 3 is exposed from each peripheral opening 8a.

  As shown in FIG. 5, the surrounding openings 8 a formed on the respective mounting surfaces 12 adjacent to each other with the cutting part A interposed therebetween are integrally connected by the opening part 13. For example, as shown in FIG. 7, the cutting part A has a certain width, and is formed so that the end part 13c of each open part 13 continuous to each peripheral opening part 8a enters the width of the cutting part A. Then, as shown in FIG. 5, it is not always necessary to integrally connect the adjacent opening portions 8 a via the cutting portion A with the opening portion 13. When the large substrate 21 is cut from the cutting portion A shown in FIG. 7, the open portions 13 leading to the side surfaces of the magnetic detection devices 1 can be formed in the peripheral openings 8 a formed on the mounting surfaces 12. . However, there is no problem if the cutting position is slightly deviated from the cutting part A. However, when the deviation of the cutting position B from the cutting part A increases as shown in FIG. In the peripheral opening 8a, an open portion 13 that does not reach the side surface of the magnetic detection device 1 and becomes a dead end is formed. Therefore, as shown in FIG. 5, the peripheral opening portions 8 a formed on the respective mounting surfaces 12 adjacent to each other via the cutting portions A are integrally connected by the opening portions 13 to widen the allowable range of cutting position deviation. This is preferable.

  Subsequently, as shown in FIG. 6, electrode pads 9 are formed in the respective peripheral openings 8a. If the inner opening 8b shown in FIG. 1B is provided, the electrode pad 9 is also formed in the inner opening 8b. As described above, since a part of the wiring layer 6 is exposed in each opening 8, the electrode pad 9 is formed so as to overlap the wiring layer 6. The material of the electrode pad 9 is not particularly limited. For example, the electrode pad 9 can be formed by a conductive layer coated with Ag paste or Cu paste and thermally cured.

  5 and 6, each opening 8 and each electrode pad 9 are formed in a substantially circular shape, but the shape is not limited. However, a substantially circular shape is preferred.

  Next, the large substrate 21 and the cover member are cut (diced) for each magnetic detection device 1 along the cutting portion A. At this time, even if the cutting position B is deviated from the original cutting portion A as shown in FIG. 6, according to the manufacturing method of the magnetic detection device of this embodiment, it is formed on the mounting surface 12 of each magnetic detection device 1. Each of the surrounding openings 8a can be formed with an open portion 13 that leads to the side surface of the magnetic detection device 1. Therefore, when each magnetic detection device 1 is mounted on the mounting substrate 15 by reflow soldering, excess solder paste can be allowed to flow out from each peripheral opening 8a to the opening 13.

  Further, as described in FIG. 2A, even when the cutting position B is shifted to the X1 side and is changed from the original side surface 1b to the side surface 1e, the side wall portions 13a and 13b of the opening portion 13 are formed. The minimum width dimension between the peripheral opening 8a and the side surface 1e can be set to L2, and the minimum width dimension can be made larger than the conventional example. Therefore, in this embodiment, the area of the insulating layer 7 near the minimum width can be formed larger than that of the conventional example. Therefore, even if the cutting position B slightly shifts in the direction approaching the peripheral opening 8a, it is possible to reduce the problem that the insulating layer 7 is peeled off or chipped.

  As described above, the magnetic detection device 1 of the present embodiment can be mounted in parallel to the surface of the mounting substrate 15. Moreover, in this embodiment, the tolerance | permissible_range of a cutting position can be expanded conventionally, Therefore A manufacturing process can be simplified.

  In the present embodiment, there are a plurality of peripheral openings 8a. However, even a single peripheral opening 8a is more effective than the conventional one.

  The magnetic detection apparatus 1 in this embodiment can be used other than a geomagnetic sensor. However, it is applied to a magnetic detection device that needs to know the direction of the external magnetic field accurately, such as a three-axis acceleration sensor or a speed sensor.

A cutting part B cutting position 1 magnetic detectors 1a to 1e side surface 2 (substrate) front surface 2b (substrate) back surface 3 magnetic sensor 4 integrated circuit 5 cover member 6, 7 insulating layer 8 opening Part 8a Peripheral opening 8b Inner opening 9 Electrode pads 10, 11 Wiring layer 12 Mounting surface 12a Peripheral parts 13, 14 Opening part 15 Mounting substrate 16 Conductive connection part 19 Solder layer 20 Solder paste 20a Surplus part 21 (of solder paste) 21 Large board

Claims (8)

In a magnetic detection device comprising a magnetic sensor for detecting the direction of an external magnetic field and having a plurality of electrode pads on the mounting surface,
An insulating layer is formed on the mounting surface, a plurality of openings are formed in the insulating layer, and the plurality of electrode pads are formed in the plurality of openings,
Among the plurality of openings, an opening that extends from the peripheral opening to the side surface of the magnetic detection device is formed at least in the peripheral opening located at the peripheral part of the mounting surface. Detection device.   The magnetic detection device according to claim 1, wherein the insulating layer is a resist layer. A substrate, the magnetic sensor and the integrated circuit disposed on a surface opposite to the mounting surface of the substrate, and a cover member that covers the magnetic sensor and the integrated circuit,
The plurality of electrode pads are electrically connected to each wiring layer provided on the substrate,
The magnetic detection device according to claim 1, wherein a side surface of the magnetic detection device is configured by a side surface of the substrate and a side surface of the cover member.   4. The magnetic detection device according to claim 1, wherein the plurality of openings and the plurality of electrode pads are each formed in a substantially circular shape. 5.   The magnetic detection apparatus according to claim 1, wherein the magnetic sensor is a geomagnetic sensor. In a method for manufacturing a magnetic detection device comprising a magnetic sensor for detecting the direction of an external magnetic field and having a plurality of electrode pads on a mounting surface,
A plurality of openings for forming the plurality of electrode pads are formed at positions of the mounting surfaces, respectively, with respect to an insulating layer formed on the back surface integrating the mounting surfaces constituting the plurality of magnetic detection devices. At this time, among the plurality of openings formed on each mounting surface, an opening that reaches from the opening to the position of the cutting portion is formed at least in the peripheral opening located at the periphery of each mounting surface. Process,
Forming the electrode pad in each of the plurality of openings,
Cutting the back surface for each magnetic detection device;
The manufacturing method of the magnetic detection apparatus characterized by having.   The manufacturing method of the magnetic detection apparatus of Claim 6 which connects between each surrounding opening part formed in each said mounting surface adjacent on both sides of the said cutting part by the said open part. A substrate, the magnetic sensor and the integrated circuit disposed on a surface opposite to the mounting surface of the substrate, and a cover member that covers the magnetic sensor and the integrated circuit,
The substrate is a large substrate having a size in which a plurality of the magnetic detection devices are integrated, and the magnetic sensor and the integrated circuit are arranged at positions of the magnetic detection devices on the large substrate,
The manufacturing method of the magnetic detection apparatus of Claim 6 or 7 which cut | disconnects the said large board | substrate for every magnetic detection apparatus.

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