CN103308870A - Magnetic detection device and manufacturing method thereof - Google Patents
Magnetic detection device and manufacturing method thereof Download PDFInfo
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- CN103308870A CN103308870A CN201310038476XA CN201310038476A CN103308870A CN 103308870 A CN103308870 A CN 103308870A CN 201310038476X A CN201310038476X A CN 201310038476XA CN 201310038476 A CN201310038476 A CN 201310038476A CN 103308870 A CN103308870 A CN 103308870A
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- detection device
- magnetic detection
- peristome
- installed surface
- magnetic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Abstract
The object of the utility model is to provide a magnetic detection device and a manufacturing method thereof, wherein the magnetic detection device can be stably arranged parallely to an installation substrate. The magnetic detection device (1) is provided with a magnetic sensor used for detecting the direction of the external field and a plurality of electrode pads disposed on the installation surface. The magnetic detection device (1) is characterized in that an insulation layer (7) is disposed on the installation surface (12), and is provided with a plurality of openings (8); the plurality of pads are disposed in the plurality of openings (8); and opened parts (13), which are disposed in a plurality of peripheral opening parts (8a) of a peripheral part (12a) of the installation surface (12) in the plurality of the openings (8), and are communicated with side surfaces of the magnetic detection device from the peripheral opening parts (8a).
Description
Technical field
The present invention relates to possess the structure for detection of the especially installed surface of the magnetic detection device of the Magnetic Sensor of the direction of external magnetic field.
Background technology
For example there is the geomagnetic sensor for detection of the orientation of earth magnetism in Magnetic Sensor as for detection of the direction of external magnetic field.
Magnetic detection device with geomagnetic sensor is the device that possesses described geomagnetic sensor and packedization at substrate.The back side of described substrate is equivalent to the installed surface installed with installation base plate, shown in Fig. 8 (a), (rear view of existing magnetic detection device), be provided with the resist layer 22 on the back side that is coated in substrate at installed surface 30, be formed with a plurality of peristomes 23 at described resist layer 22.And electrode pad 31 exposes respectively each peristome 23 is interior.Shown in Fig. 8 (a), by a plurality of electrode pads 31 are arranged on the installed surface 30, can realize the densification that substrate is installed.
The side 24 of the magnetic detection device shown in Fig. 8 (a) is equivalent to the section in the manufacturing process.That is, in order to make simultaneously a plurality of magnetic detection devices, and use than the large substrate (large substrates) of substrate that consists of each magnetic detection device, large substrates carry a plurality of Magnetic Sensors etc. and molded after, large substrates is cut off by each magnetic detection device.The section of this moment is equivalent to the side 24 of each magnetic detection device.
[formerly technical literature]
[patent documentation]
[patent documentation 1] TOHKEMY 2001-7246 communique
[patent documentation 2] TOHKEMY 2002-100711 communique
[patent documentation 3] TOHKEMY 2008-277661 communique
[patent documentation 4] TOHKEMY 2006-295156 communique
[summary of invention]
[problem that invention will solve]
Yet, when large substrates is cut off by each magnetic detection device, if such off-position D is from the position deviation of regulation shown in Fig. 8 (a), then shown in Fig. 8 (b), (the local amplification rearview of existing magnetic detection device), be arranged in installed surface 30 periphery at least a portion around interval between the side 24 of peristome (Fig. 8 (a), (b) label symbol 23a) and magnetic detection device narrow down, perhaps peristome 23a formation is communicated to the interconnecting part (shortcoming section) 25 of side 24 around.Need to prove, the side 24 shown in Fig. 8 (b) is the sides when the off-position D shown in Fig. 8 (a) cuts off.
Shown in Fig. 8 (b), when when off-position D forms side 24, peristome 23a's becomes very little near the position of side 24 and the minimum widith between the side 24 on every side, consequently, near the area of the resist layer 22 (label symbol 22a in Fig. 8 (b)) the described minimum widith becomes very little, therefore has the problem that resist peels off that easily produces.
When resist layer 22 peels off, shown in Fig. 8 (c) (front view of magnetic detection device), between the installed surface 30 of magnetic detection device 26 and installation base plate 27, sandwich the stripping portion of resist layer 22, thereby magnetic detection device 26 is installed with the states that tilt sideling easily with respect to installation base plate 27.Need to prove, the symbol 29 shown in Fig. 8 (c), (d) is solder layer.
In addition, when peristome 23a around is formed with the interconnecting part (shortcoming section) 25 that is communicated to side 24, shown in Fig. 8 (d) (front view of magnetic detection device), be used for the solder cream 28 that engages between the conductive connection part with electrode pad 31 and installation base plate 27 easily from interconnecting part 25 foreign side's outflow of 24 to the side.At this moment, at the peristome 23a on every side that is arranged in the diagram right side shown in Fig. 8 (a), solder cream 28 easily via interconnecting part 25 to the side 24 foreign side flow, but shown in Fig. 8 (a) being arranged in diagram left side around peristome 23a, do not form interconnecting part 25 and solder cream 28 is difficult to the side 24 foreign side and flows.Therefore, solder cream 28 hold runny around between the conductive connection part of electrode pad 31 and installation base plate 27 in the peristome 23a and between the conductive connection part of the electrode pad 31 in the solder cream 28 immobilising peristome 23a on every side and installation base plate 27, change to the interval (spacing) of short transverse.Therefore, shown in Fig. 8 (d), magnetic detection device 26 is easily installed with the state that tilts sideling with respect to installation base plate 27.Need to prove, in Fig. 8 (d), the solder cream 28 that will flow out to foreign side and solder layer 29 difference expressions, this solder layer 29 engages between magnetic detection device 26 and the installation base plate 27.
Shown in Fig. 8 (c), (d), when magnetic detection device 26 is installed with the state that tilts sideling with respect to installation base plate 27, can't detect well the orientation of earth magnetism by the geomagnetic sensor precision that is built in the magnetic detection device 26, thereby the reduction or the accuracy of detection that produce accuracy of detection are uneven.
In each above-mentioned patent documentation, be provided with the structure that possesses for the resist layer of the peristome that electrode pad is exposed to installed surface, all unexposed when off-position during from the position deviation of regulation, peel off or the structure of the installed surface of the outflow of solder cream for reducing resist.
Summary of the invention
Therefore, the present invention is with solving above-mentioned existing problem, and its purpose is to provide a kind of magnetic detection device that especially can make to stablize abreast magnetic detection device and the manufacture method thereof of setting with respect to installation base plate.
[being used for solving the means of problem]
The invention provides a kind of magnetic detection device, it possesses the Magnetic Sensor for detection of the direction of external magnetic field, and has a plurality of electrode pads at installed surface, and described magnetic detection device is characterised in that,
Be formed with insulation course at described installed surface, be formed with a plurality of peristomes at described insulation course, described a plurality of electrode pads are formed in described a plurality of peristome,
In described a plurality of peristomes, peristome is formed with the opening portion around the periphery that is positioned at installed surface at least, and this opening portion is communicated to the side of described magnetic detection device from described peristome on every side.Thus, can make widening than in the past near position and the minimum width dimension between the side of side of peristome on every side, and near the Area Ratio of the insulation course the minimum widith was increased in the past.Therefore, can peel off or the unfavorable condition such as shortcoming from installed surface than more suppress insulation course in the past.And, when being installed to magnetic detection device on the installation base plate, remaining solder cream is flowed out towards the opening portion from peristome on every side.By more than, magnetic detection device can be installed on the installation base plate abreast, can detect accurately by Magnetic Sensor the direction of external magnetic field, and can reduce the precision inequality.
In the present invention, preferred described insulation course is resist layer.In the present invention, can effectively suppress resist peels off.
In addition, the described Magnetic Sensor that in the present invention, preferred described magnetic detection device has substrate, configure at the face with described installed surface opposition side of described substrate and the cover member of integrated circuit, the described Magnetic Sensor of covering and described integrated circuit,
Described a plurality of electrode pad is electrically connected with each wiring layer that arranges at described substrate,
The side of described magnetic detection device is made of the side of described substrate and the side of described cover member.
In addition, in the present invention, preferred described a plurality of peristomes and described a plurality of electrode pad form with the circular shape respectively.Can form simply each peristome and each electrode pad, and the minimum width dimension around can making respectively between peristome and the side was widened than in the past, thereby can effectively increase near the area of the insulation course the described minimum widith, can effectively suppress peeling off of insulation course.
In addition, in the present invention, preferred described Magnetic Sensor is geomagnetic sensor.
In addition, the invention provides a kind of manufacture method of magnetic detection device, described magnetic detection device possesses the Magnetic Sensor for detection of the direction of external magnetic field, and has a plurality of electrode pads at installed surface, the manufacture method of described magnetic detection device is characterised in that, comprising:
Insulation course is formed on and will consists of on the integrated back side of each installed surface of a plurality of described magnetic detection devices, on the position of described each installed surface, be formed for respectively forming a plurality of peristomes of described a plurality of electrode pads with respect to this insulation course, at this moment, in described a plurality of peristomes that each installed surface forms, peristome forms the operation of opening portion that arrives the position of cutting portion from described peristome around the periphery that is positioned at each installed surface at least;
Form respectively the operation of described electrode pad at described a plurality of peristomes;
By the operation of each magnetic detection device with the cut-out of the described back side.
Thus, when cutting off by each magnetic detection device, even off-position departs from slightly from cutting portion, also can make as the side of each magnetic detection device of section and the widening than in the past near the minimum width dimension between the position of side of peristome around each, thereby near the Area Ratio of the insulation course of minimum widith was increased in the past.Therefore, can peel off or the unfavorable condition such as shortcoming from installed surface than more suppress insulation course in the past.In addition, when being installed to magnetic detection device on the installation base plate, remaining solder cream peristome around each is roughly flowed out equably to the opening portion.By more than, magnetic detection device can be installed on the installation base plate abreast, can detect accurately the direction of external magnetic field by Magnetic Sensor, and can reduce the precision inequality.
In addition, compared with the past in the present invention, can widen the allowed band of off-position, therefore, can make manufacturing process's facilitation.
In the present invention, preferably will be formed on across linking integratedly between the peristome around on adjacent described each installed surface of described cutting portion each by described opening portion.Thus, can form simply the opening portion, and even off-position departs from slightly, the peristome both sides also can suitably arrange the opening portion that is communicated to side (section that is equivalent to off-position) around each that forms at each adjacent installed surface.
In addition, the described Magnetic Sensor that in the present invention, preferred described magnetic detection device has substrate, configure at the face with described installed surface opposition side of described substrate and the cover member of integrated circuit, the described Magnetic Sensor of covering and described integrated circuit,
Described substrate is the large substrates with the integrated size of a plurality of described magnetic detection devices, at the described Magnetic Sensor of position configuration and the described integrated circuit of each magnetic detection device of described large substrates,
By each magnetic detection device described large substrates is cut off.
By said method, can make a plurality of encapsulation simply magnetic detection device.
[invention effect]
According to the present invention, can make widening than in the past near position and the minimum width dimension between the side of side of peristome on every side, thereby near the Area Ratio of the insulation course the minimum widith was increased in the past.Therefore, can peel off or the unfavorable condition such as shortcoming from installed surface than more suppress insulation course in the past.And, when being installed to magnetic detection device on the installation base plate, remaining solder cream is flowed out towards the opening portion from peristome on every side.By more than, magnetic detection device can be installed on the installation base plate abreast, can detect accurately by Magnetic Sensor the direction of external magnetic field, and can reduce the precision inequality.
Description of drawings
Fig. 1 (a) is the front view of the magnetic detection device in the present embodiment, Fig. 1 (b) is the rear view of the installed surface of the magnetic detection device shown in the presentation graphs 1 (a), and Fig. 1 (c) is the local amplification rearview that the part amplification of the installed surface shown in Fig. 1 (b) is illustrated.
Fig. 2 (a) be with the insulation course at the installed surface of present embodiment form around peristome and opening portion amplify and the local amplification rearview that illustrates, in particular for the figure of the effect of comparing to illustrate present embodiment with the existing mode that does not have like that an opening portion, Fig. 2 (b) be another embodiment of expression around the partial rear view of shape of peristome.
Fig. 3 is the magnetic detection device in the expression present embodiment and the part amplification longitudinal section that magnetic detection device is installed in the state on the installation base plate.
Fig. 4 is the block diagram of the magnetic detection device in the present embodiment.
Fig. 5 is a process chart (figure of expression installed surface) of the manufacturing process of the magnetic detection device in the expression present embodiment.
Fig. 6 is a process chart (figure of expression installed surface) of the subsequent processing of expression operation shown in Figure 5.
Fig. 7 is the manufacturing procedure picture (figure of expression installed surface) of the magnetic detection device of another embodiment of expression.
Fig. 8 (a) is the rear view of the installed surface of the existing magnetic detection device of expression, Fig. 8 (b) is the local amplification rearview that the part amplification of the installed surface shown in Fig. 8 (a) is illustrated, and Fig. 8 (c), (d) are the front views be used to the problem points that existing magnetic detection device is described.
[symbol description]
The A cutting portion
The B off-position
1 magnetic detection device
1a～1e (magnetic detection device) side
2 substrates
2a (substrate) surface
2b (substrate) back side
3 Magnetic Sensors
4 integrated circuit
5 cover members
6,7 insulation courses
8 peristomes
Peristome around the 8a
The inboard peristome of 8b
9 electrode pads
10,11 wiring layers
12 installed surfaces
The 12a periphery
13,14 opening portions
15 installation base plates
16 conductive connection parts
19 solder layers
20 solder creams
20a (solder cream) surplus
21 large substrates
Embodiment
Fig. 1 (a) is the front view of the magnetic detection device in the present embodiment, Fig. 1 (b) is the rear view of the installed surface of the magnetic detection device shown in the presentation graphs 1 (a), and Fig. 1 (c) is the local amplification rearview that the part amplification of the installed surface shown in Fig. 1 (b) is illustrated.In addition, Fig. 2 (a) be with the insulation course at the installed surface of present embodiment form around peristome and opening portion amplify and the local amplification rearview that illustrates, in particular for the figure of the effect of comparing to illustrate present embodiment with the existing mode that does not have like that an opening portion.In addition, Fig. 2 (b) is the partial rear view of the shape of peristome on every side of another embodiment of expression.In addition, Fig. 3 is the magnetic detection device in the expression present embodiment and the part amplification longitudinal section that magnetic detection device is installed in the state on the installation base plate.In addition, Fig. 4 is the block diagram of the magnetic detection device in the present embodiment.
The magnetic detection device that possesses Magnetic Sensor 1 in the present embodiment is such as the geomagnetic sensor (geomagnetic sensor) that constitutes on the Portable devices such as being equipped on portable phone.
X-direction shown in each figure and Y direction are illustrated in the both direction of quadrature in the surface level, and Z-direction represents the direction with respect to described surface level quadrature.
Such as Fig. 1, shown in Figure 3, magnetic detection device 1 has: substrate 2; Magnetic Sensor 3 and the integrated circuit 4 (ASIC) of lift-launch on the 2a of the surface of substrate 2 (upper surface); Cover the cover member 5 on the surface of Magnetic Sensor 3 and integrated circuit 4; Wiring layer 6 in the back side of substrate 2 (lower surface) 2b setting; The insulation course 7 that forms on the 2b overleaf; Peristome 8 in insulation course 7 formation; The electrode pad 9 that exposes and be electrically connected with described wiring layer 6 from described peristome 8.
Shown in the solid line of Fig. 3, Magnetic Sensor 3 can be arranged on substrate 2 surfaces, and perhaps shown in the dotted line of Fig. 3, Magnetic Sensor 3 can overlap with integrated circuit 4.
Surperficial 2a at substrate 2 is formed with wiring layer 10, and the connection end 10a of the front end of each wiring layer 10 is electrically connected via electrically conducting adhesive with the electrode part 4a of integrated circuit 4.
As shown in Figure 4, be electrically connected between Magnetic Sensor 3 and the integrated circuit 4, controlled by integrated circuit 4 by the detection signal that Magnetic Sensor 3 obtains.
In the present embodiment, the structure of Magnetic Sensor 3 does not limit.For example, can use magneto-resistance effect element (GMR element, TMR element etc.) or Hall element in the Magnetic Sensor 3.
As shown in Figure 3, be provided with the inside wiring layer 11 that is communicated to back side 2b from surperficial 2a at substrate 2, via inner wiring layer 11 integrated circuit 4 and electrode pad 9 be electrically connected (also with reference to Fig. 4).
As shown in Figure 3, be formed with insulation course 7 at the back side of substrate 2 2a.Insulation course 7 for example is resist layer.Such as Fig. 1 (b), shown in Figure 3, be formed with a plurality of peristomes 8 at insulation course 7.And a plurality of electrode pads 9 are arranged in each peristome 8 singly.
Shown in Fig. 1 (b), each peristome 8 and each electrode pad 9 form with the circular shape.Need to prove, in the peristome 8, for peristome 8a on every side, link continuously with the opening portion like that as described later, therefore the profile of peristome 8a is not round-shaped strictly speaking on every side, but circular-arc.Be roughly round-shaped be because, beyond circle, can also be the shape of slightly being out of shape from circle because of foozle etc., and comprise the such circular-arc mode of periphery of peristome 8a on every side.
Each electrode pad 9 is the plane electrode pad (LGA that expose at the installed surface 12 of installing with installation base plate; Landgrid array), overlook down (observation of Z direction) and form the circular shape.The peripheral part of each electrode pad 9 is positioned at the periphery position in the inner part than each peristome 8, thereby the area of each peristome 8 of the Area Ratio of each electrode pad 9 forms littlely.
In Fig. 3, the thickness of each electrode pad 9 is identical with the thickness of insulation course 7, but as long as and can suitably install between the installation base plate, then gauge is not limited especially.
Shown in Fig. 1 (b), in a plurality of peristomes 8 that insulation course 7 forms, a plurality of peristome 8a on every side are positioned at the periphery 12a of installed surface 12.At this, periphery 12a represents near the X1 side 1a of the magnetic detection device 1 in the installed surface 12, near the 1b of X2 side, near the 1c of Y1 side and near the 1d of Y2 side.Need to prove, be not rectangular shape in the shape of installed surface 12, but in the situation of other polygonal shape, refer near each limit, in addition, in the situation that installed surface has curved surface, refer near the side of curved surface.Perhaps, shown in Fig. 1 (b), near the central authorities of installed surface 12, be provided with peristome (being called inboard peristome 8b), but also the peristome 8 that is positioned at than inboard peristome 8b position in the outer part can be defined as peristome 8a on every side.
Shown in Fig. 1 (b), on every side peristome 8a with near the X1 side 1a that surrounds installed surface 12, near the 1b of X2 side, near the 1c of Y1 side and near the mode the 1d of Y2 side form, change but the configuration of the conductive connection part 16 that the configuration of peristome 8a or inboard peristome 8b on every side, number and surface at installation base plate 15 form is corresponding.
Shown in Fig. 1 (b), be formed with respectively the opening portion 13 that is communicated to arbitrary side 1a～1d at a plurality of peristome 8a on every side.At this, each opening portion 13 forms towards the near side of peristome 8a around each.Peristome 8a is arranged on the bight of X2-Y2 side around shown in Fig. 1 (c) in installed surface 12, and peristome 8a is provided with the opening portion 13 that is communicated to X2 side 1b and the opening portion 13 that is communicated to Y2 side 1d around.Need to prove, the number of opening portion 13 is provided with more than one with respect to peristome 8a around each.
Each opening portion 13 is to form with the integrated groove shape of peristome 8a around poroid each.The depth dimensions of each opening portion 13 is identical with the depth dimensions of peristome 8a around each.Each peristome 8 and each opening portion 13 connect insulation course 6 along film thickness direction, the part of wiring layer 6 is exposed from each peristome 8.
Shown in Fig. 1 (c), the width dimensions t1 of each opening portion 13 forms littlely than greatest width dimension (diameter) t2 of peristome 8a around each.In addition, in Fig. 1 (b), (c), each opening portion 13 forms fixed width, but also can form in the mode of wide variety.
If insulation course 7 is resist, then each opening portion 13 can be used photoetching technique and be formed with peristome 8a around each, in addition, in the situation that insulation course 7 is not resist, can uses photoetching technique and etching technique and form with peristome 8a around each.
Need to prove, although on inboard peristome 8b, do not form the opening portion that is communicated with the side, but shown in the dotted line of Fig. 1 (b), has the space that can form opening portion 14, even and solder cream 14 outflows in the opening portion, as long as do not become out of use state via causing short circuit between the solder cream that flows out and the installation base plate 15, then just can the opening portion 14 that be communicated to the side be set at inboard peristome 8b.
As shown in Figure 3, be formed with wiring layer 17 on the surface of installation base plate 15, be provided with conductive connection part 16 in the end of wiring layer 17.In addition, covered by the insulation courses such as resist 18 on the wiring layer 17 beyond the conductive connection part 16.
And as shown in Figure 3, each electrode pad 9 of magnetic detection device 1 and each conductive connection part 16 of installation base plate 15 are electrically connected via solder layer 19.
Such as Fig. 1 (a), shown in Figure 3, the surface of Magnetic Sensor 3 and integrated circuit 4 covers magnetic detection device 1 packedization by cover member 5.For example, cover member 5 is the encapsulation molded resin.
In the present embodiment, the side 1a～1d of magnetic detection device 1 is made of each side of substrate 2 and cover member 5.
In the magnetic detection device 1 of present embodiment, the insulation course 7 that arranges at installed surface 12 is provided with a plurality of peristomes 8, and electrode pad 9 exposes in each peristome 8.In a plurality of peristomes 8, peristomes 8 are communicated with the opening portion 13 that is communicated to side 1a～1d near on the distance around the periphery 12a that is positioned at installed surface 12 a plurality of.
The position of X2 side 1b shown in Fig. 2 (a) is roughly consistent with the position of the cutting portion A shown in the manufacture method described later, on every side peristome 8a from the side 1b to the inside (X1 side) leave minor increment L1.
Yet, when off-position B the scope internal ratio cutting portion A of its mobile width to the X1 lateral deviation from the time, peristome 8a around the side 1e that forms by off-position B is more approaching than original side 1b.At this, side 1e shown in Figure 3 is arranged on not the position (circumference that is illustrated by the broken lines and side 1e join) that joins with the circumference of peristome 8a on every side in the mode (conventional example shown in Fig. 8 (a), (b)) that forms the opening portion 13 that is communicated with peristome 8a on every side.
The regional C that is represented by the oblique line of Fig. 2 (a) refers to when conventional example not being formed with like that the structure that is communicated to the opening portion 13 of peristome 8a on every side and embodiment and being formed with like that the Structure Comparison that is communicated to the opening portion 13 of peristome 8a on every side, do not exist in the present embodiment but the zone of the insulation course 7 that exists in the structure of conventional example.
In the regional C of the insulation course 7 that is represented by oblique line, peristome 8a's is very the narrowest near position and the minimum width dimension between the 1e of side of side 1e on every side, becomes zero in Fig. 2 (a), and regional C becomes tapered shape and area becomes very little.Therefore, in regional C, easily produce the unfavorable condition that insulation course 7 peels off or is short of.
Relative therewith, in the present embodiment, formation is communicated to the opening portion 13 of side 1b, 1e from peristome 8a on every side, even thus off-position B to the X1 lateral deviation from and form side 1e, by side wall portion 13a, the 13b of opening portion 13 are set, make also on every side that the minimum width dimension between the peristome 8a and side 1e becomes L2, thereby minimum width dimension L2 is increased than conventional example.Therefore, in the present embodiment, can make near the Area Ratio conventional example of the insulation course 7 of minimum widith form greatly.Therefore, even the direction of off-position B peristome 8a around approach is (to greatest extent shown in Fig. 2 (a), until the position that joins with the circumference that is illustrated by the broken lines of peristome 8a on every side) departs from, in the present embodiment, side wall portion 13a, the 13b of opening portion 13 also can be residual, thereby can reduce the unfavorable condition that insulation course 7 peels off or is short of.
In addition, in the present embodiment, shown in Fig. 1 (b), by at whole peristome 8a on every side the opening portion 13 that is communicated to arbitrary side 1a～1d being set, thus, shown in Fig. 1 (c), the surplus 20a of the solder cream 20 that uses in the engaging of installation base plate 15 and conductive connection part 16 is by the 13 interior guiding to the opening portion in peristome 8a on every side.For example in the present embodiment, carry out soldering by reflux type, and can make the surplus 20a of molten solder cream 20 from each peristome 8a 13 outflow to the opening portion on every side this moment.And, because opening portion 13 is communicated to the side, therefore at the many positions of the coating amount of solder cream, surplus 20a suitably can be directed to the foreign side of side via opening portion 13.Therefore, the amount of the solder cream in the bonding part between each electrode pad 9 and each conductive connection part 16 can be adjusted to all roughly equal in which bonding part.
By more than, shown in Fig. 1 (a), the magnetic detection device 1 surperficial 15a with installation base plate 15 can be installed abreast, can detect accurately by Magnetic Sensor 3 orientation of earth magnetism, and compared with the pastly can reduce the precision inequality.
In the present embodiment, preferred insulation course 7 is resist layer.Insulation course 7 can be formed with desired thickness, and can be simply on insulation course 7 and suitably form a plurality of peristomes 8 and a plurality of opening portion 13 that shape and size by regulation consist of.And, in the present embodiment, even if make insulation course 7 be resist layer, even and if as explanation among Fig. 2 (a) off-position B from the position deviation of original cutting portion A, can make also that the minimum width dimension L2 between the peristome 8a and side 1e is larger than in the past on every side, therefore, can make in the present embodiment near the Area Ratio conventional example of the insulation course 7 (resist layer) of minimum widith form greatly.Therefore, can effectively suppress resist peels off.
In addition, in the present embodiment, preferably each peristome 8 and each electrode pad 9 form with the circular shape.Shown in Fig. 2 (a), the periphery of peristome 8a forms circular shape (circular-arc) by inciting somebody to action on every side, can be more in the past than the minimum width dimension L2 between peristome 8a around more effectively increasing and the side 1e.For example, peristome 8a also can not be circular shape (circular-arc) around each, and shown in Fig. 2 (b), around each among the periphery wall 8a1 of peristome 8a at least also can be by forming with respect to the linearly or curved dip plane of the side 1a～1d of magnetic detection device near the periphery wall 8a1 of the side 1a～1d of magnetic detection device.Peristome 8a is rhombus around shown in Fig. 2 (b), and periphery wall 8a1,8a1 near side 1b, 1d around the rhombus in the periphery wall of peristome 8a tilt with respect to side 1b, 1d.And opening portion 13 is formed into side 1b, 1d (dotted line shown in Fig. 2 (b) is illustrated in the mode that peristome 8a does not on every side form the conventional example of opening portion 13) from peristome 8a on every side.But, will around peristome 8a form the round-shaped ratio shown in Fig. 1 (b), (c), Fig. 2 (a) and form the shape shown in Fig. 2 (b) and more can form simply peristome 8a on every side, therefore more suitable.
Then, the manufacture method of the magnetic detection device 1 of present embodiment described.
At first, in the present embodiment, on the surface of the large substrates of each substrate 2 integrated size that will consist of a plurality of magnetic detection devices 1 a plurality of Magnetic Sensors 3 and a plurality of integrated circuit 4 are installed.Each Magnetic Sensor 3 and each integrated circuit 4 are installed in respectively the position of each magnetic detection device 1.
And, cover member 5 shown in Figure 3 is formed on the surface of each Magnetic Sensor 3 and each integrated circuit 4.Cover member 5 is integrated and form between each magnetic detection device 1.Cover member 5 is molded resin, the cover member 5 that can be shaped and be made of molded resin on the surface of a plurality of Magnetic Sensors 3 and a plurality of integrated circuit 4.
As shown in Figure 5, be formed with the insulation course 7 that is for example consisted of by resist layer at the back side of large substrates 21 21b, use photoetching technique and form a plurality of peristomes 8 at described insulation course 7.Dotted line shown in Figure 5 represents cutting portion A, is made of each installed surface 12 of each magnetic detection device 1 each zone of cutting portion A differentiation.
As shown in Figure 5, in a plurality of peristomes 8 that each installed surface 12 forms, on a plurality of peristome 8a on every side of the periphery that is positioned at each installed surface 12, the opening portion 13 that arrives the position of cutting portion A forms simultaneously with peristome 8a around each.Peristome 8a and opening portion 13 are the holes (hole) that form at insulation course 7 around each.Wiring layer 6 shown in Figure 3 peristome 8a around each exposes.
As shown in Figure 5, will be formed on across cutting portion A by opening portion 13 and respectively linking integratedly between the peristome 8a on every side on each adjacent installed surface 12.For example shown in Figure 7, if cutting portion A has the width of certain degree, and will form in the mode in the width that enters into cutting portion A with the end 13c of continuous each opening portion 13 of peristome 8a around each, then also can be as shown in Figure 5 by opening portion 13 will across cutting portion A adjacent around integratedly link between the peristome 8a.If from cutting portion A shown in Figure 7 large substrates 21 is cut off, then can form the opening portion 13 of the side that is communicated to each magnetic detection device 1 around each on the peristome 8a each installed surface 12 forms.But, if the degree of off-position for slightly departing from from cutting portion A, then no problem, if but off-position B becomes large from departing from of cutting portion A as shown in Figure 7, each of then arranging on the diagram right side of Fig. 7 on every side peristome 8a forms the side that is not communicated to magnetic detection device 1 and the opening portion 13 that stops halfway.Therefore, as shown in Figure 5, can widen allowed band that off-position depart from each situation about linking integratedly by opening portion 13 between the 8a of opening portion that forms across each adjacent installed surface 12 of cutting portion A on every side, therefore preferred.
Then, as shown in Figure 6, in peristome 8a around each, form electrode pad 9.In addition, if having the inboard peristome 8b shown in Fig. 1 (b), then in inboard peristome 8b, also form electrode pad 9.As mentioned above, because the part of wiring layer 6 exposes in each peristome 8, so electrode pad 9 is overlapping and be formed on the wiring layer 6.In addition, the material of electrode pad 9 is not particularly limited, but for example can be by forming by the conductive layer that applies Ag paste or Cu paste and their heat curings are obtained.
In addition, in Fig. 5, Fig. 6, each peristome 8 and each electrode pad 9 are formed the circular shape, but shape is not limited.Yet, form the circular shape preferred.
Then, along cutting portion A large substrates 21 and cover member are cut off (cutting) by each magnetic detection device 1.At this moment, as shown in Figure 6, even off-position B departs from from original cutting portion A, according to the manufacture method of the magnetic detection device of present embodiment, also can form respectively the opening portion 13 of the side that is communicated to magnetic detection device 1 around each on the peristome 8a the installed surface 12 of each magnetic detection device 1 forms.Therefore, when being installed to each magnetic detection device 1 on the installation base plate 15 by reflow soldering, can make remaining solder cream from each peristome 8a 13 outflow to the opening portion on every side.
In addition, as explanation among Fig. 2 (a), even off-position B from original side 1b to the X1 lateral deviation from and form side 1e, by forming side wall portion 13a, the 13b of opening portion 13, also can with around minimum width dimension between peristome 8a and the side 1e form L2, thereby can make minimum width dimension larger than conventional example.Therefore, in the present embodiment, can make near the Area Ratio conventional example of the insulation course 7 of minimum widith form greatly.Therefore, the direction of peristome 8a departs from slightly even off-position B is to approaching on every side, also can reduce the unfavorable condition that insulation course 7 peels off or is short of.
By more than, the magnetic detection device 1 of present embodiment can be installed on the surface of installation base plate 15 abreast.And, in the present embodiment, the allowed band of off-position was widened than in the past, therefore can make manufacturing process's facilitation.
Need to prove, in the present embodiment, peristome 8a is a plurality of on every side, even but be one.Also has effect than in the past.
Claims (8)
1. magnetic detection device, it possesses the Magnetic Sensor for detection of the direction of external magnetic field, and has a plurality of electrode pads at installed surface, and described magnetic detection device is characterised in that,
Be formed with insulation course at described installed surface, be formed with a plurality of peristomes at described insulation course, described a plurality of electrode pads are formed in described a plurality of peristome,
In described a plurality of peristomes, peristome is formed with the opening portion around the periphery that is positioned at installed surface at least, and this opening portion is communicated to the side of described magnetic detection device from described peristome on every side.
2. magnetic detection device according to claim 1, wherein,
Described insulation course is resist layer.
3. magnetic detection device according to claim 1, wherein,
The described Magnetic Sensor that described magnetic detection device has substrate, configure at the face with described installed surface opposition side of described substrate and the cover member of integrated circuit, the described Magnetic Sensor of covering and described integrated circuit,
Described a plurality of electrode pad is electrically connected with each wiring layer on being arranged on described substrate,
The side of described magnetic detection device is made of the side of described substrate and the side of described cover member.
4. magnetic detection device according to claim 1, wherein,
Described a plurality of peristome and described a plurality of electrode pad form with the circular shape respectively.
5. magnetic detection device according to claim 1, wherein,
Described Magnetic Sensor is geomagnetic sensor.
6. the manufacture method of a magnetic detection device, described magnetic detection device possesses the Magnetic Sensor for detection of the direction of external magnetic field, and has a plurality of electrode pads at installed surface, and the manufacture method of described magnetic detection device is characterised in that, comprising:
Insulation course is formed on and will consists of on the integrated back side of each installed surface of a plurality of described magnetic detection devices, on the position of described each installed surface, be formed for respectively forming a plurality of peristomes of described a plurality of electrode pads with respect to this insulation course, at this moment, in described a plurality of peristomes that each installed surface forms, peristome forms the operation of opening portion that arrives the position of cutting portion from described peristome around the periphery that is positioned at each installed surface at least;
Form respectively the operation of described electrode pad at described a plurality of peristomes;
By the operation of each magnetic detection device with the cut-out of the described back side.
7. the manufacture method of magnetic detection device according to claim 6, wherein,
To be formed on across linking integratedly between the peristome around on adjacent described each installed surface of described cutting portion each by described opening portion.
8. the manufacture method of magnetic detection device according to claim 6, wherein,
The described Magnetic Sensor that described magnetic detection device has substrate, configure at the face with described installed surface opposition side of described substrate and the cover member of integrated circuit, the described Magnetic Sensor of covering and described integrated circuit,
Described substrate is the large substrates with the integrated size of a plurality of described magnetic detection devices, at the position of each magnetic detection device of the described large substrates described Magnetic Sensor of configuration and described integrated circuit,
By each magnetic detection device described large substrates is cut off.
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| JP2012-059277 | 2012-03-15 | ||
| JP2012059277A JP5912701B2 (en) | 2012-03-15 | 2012-03-15 | Method for manufacturing magnetic detection device |
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| CN103308870B (en) | 2015-10-21 |
| JP5912701B2 (en) | 2016-04-27 |
| JP2013195076A (en) | 2013-09-30 |
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