JP2007048867A - Ceramic package for electronic component and manufacturing method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a ceramic package for an electronic component, capable of improving an accuracy on a positioning such as the loading of an electronic component element by a picture recognizer, even if there are laminating displacement and printing displacement in the baking of the ceramic package, and to provide a manufacturing method for the ceramic package for the electronic component and the manufacturing method for the electronic component. <P>SOLUTION: In the ceramic package 1 for the electronic component, ceramic sheets 10, 11 and 12 are laminated and a recess 13 is formed for loading the electronic component element. In the ceramic package 1, stepped sections are formed to the parts of the ceramic sheet 11 with the loaded electronic part element. In the ceramic package 1, electrode patterns 20a, 20c, 20d and 20f as recognizing patterns are formed extended over approximately orthogonal ridges 25a, 25c, 25d, 25f, 26a, 26c, 26d and 26f connected from parts of the ceramic sheet 11 to the stepped sections. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a ceramic package for an electronic component used for an electronic component, a method for manufacturing the ceramic package for an electronic component, and a method for manufacturing the electronic component.

Conventionally, a ceramic package in which ceramic sheets are laminated has been widely used as an electronic component package for accommodating an electronic component element. This ceramic package for electronic components (hereinafter referred to as ceramic package) accommodates various electronic component elements such as semiconductor elements, piezoelectric vibrating pieces, gyro elements, surface acoustic wave elements, solid-state imaging elements, and is used as electronic parts Has been.
The manufacture of such electronic components has been automated by the apparatus, and the mounting of the electronic component element in the ceramic package is positioned by image processing by the image recognition apparatus.

For example, when an electronic component element is mounted on a ceramic package, as shown in Patent Document 1, the image recognition device recognizes two sides of the outermost layer of the ceramic package, performs image processing, and forms a recess in the ceramic package. The electronic component element is positioned.
As another method, an image recognition device recognizes an electrode or a recognition pattern printed on a ceramic sheet, performs image processing, and positions an electronic component element in a concave portion of the ceramic package.

JP 2003-197801 A

For ceramic packages, die cutting of ceramic green sheets, drilling as necessary, embedding conductors in through holes, and printing of electrode patterns to obtain a plurality of ceramic green sheets of a predetermined shape and laminating them It is manufactured by firing at high temperature.
Since the ceramic package is laminated and bonded through the firing process as described above, the positional deviation of the lamination and the positional deviation of the electrode pattern are generated. For example, the misalignment between the stacks is 50 to 100 μm after firing. Further, in the case of screen printing, the printing accuracy of the electrode pattern is about 10 to 20 μm after printing, but the printing deviation is 50 to 100 μm after firing.

For this reason, when the image recognition apparatus recognizes two sides in the outermost shape of the uppermost layer of the ceramic package, the image recognition surface is laminated on the surface on which the electronic component element is mounted, and therefore includes misalignment due to firing. However, there is a problem that the mounting position accuracy of the electronic component element is lowered.
In addition, when the image recognition device recognizes an electrode or recognition pattern printed on a ceramic sheet that is the same surface as the mounting surface of the electronic component element, it becomes a reference including printing misalignment due to firing, and the mounting position of the electronic component element There is a problem that accuracy decreases.
Particularly in recent years, electronic components have been downsized, and it is necessary to improve the mounting position accuracy of electronic component elements. With respect to the positioning based on these misalignment and printing misalignment, interference occurs in the ceramic package, and the displacement is not negligible.

  The present invention has been made to solve the above-mentioned problems, and its purpose is to provide positioning accuracy such as mounting of electronic component elements by an image recognition device even when there is a stacking shift or printing shift in firing a ceramic package. An object of the present invention is to provide a ceramic package for electronic components, a method for manufacturing a ceramic package for electronic components, and a method for manufacturing an electronic component.

  In order to solve the above problems, a ceramic package for an electronic component according to the present invention is a ceramic package for an electronic component in which a plurality of ceramic sheets are laminated and a recess for mounting an electronic component element is formed. A step portion is provided on a part of a surface on which the component element is mounted, and a recognition pattern is formed from a part of the surface on which the electronic component element is mounted to a substantially orthogonal ridge connected to the step portion. And

According to the ceramic package having this configuration, the recognition pattern is formed on the same surface as the mounting surface of the electronic component element, and this recognition pattern includes the outer shape or recognition of the other surface stacked on the mounting surface of the electronic component element. There is no possibility of including errors in misalignment when the pattern is used as a reference.
In addition, since the recognition pattern is formed from a part of the surface on which the electronic component element is mounted to the substantially orthogonal ridge connected to the stepped portion, the substantially orthogonal ridge includes an error in printing misalignment when forming the recognition pattern. There is nothing.
That is, since the position accuracy of the substantially orthogonal ridge is determined by the position accuracy of forming the step portion, the accuracy is good. The recognition in the image recognition device uses the recognition pattern and the contrast between the colors outside of the recognition pattern. By forming the recognition pattern over the substantially orthogonal ridges, a highly accurate recognition pattern with ridge position accuracy can be obtained. Obtainable.

  In the ceramic package for electronic parts according to the present invention, it is preferable that the stepped portion and the recognition pattern are arranged at least at two diagonal positions.

  According to this configuration, since the recognition pattern for performing image processing by the image processing apparatus is arranged at the diagonal position, it is possible to recognize not only in the two orthogonal directions but also in the in-plane rotation direction, The accuracy of mounting positioning can be improved.

  In the ceramic package for electronic parts according to the present invention, the recognition pattern is preferably an electrode pattern.

  According to this configuration, the recognition pattern for performing image processing by the image processing apparatus can be shared with the electrode pattern, and a space for forming the recognition pattern is not required, which can contribute to downsizing of the ceramic package.

  The method for producing a ceramic package for electronic parts according to the present invention includes a step of die cutting each ceramic green sheet, a step of screen printing an electrode pattern on each die cut ceramic green sheet, and a step of laminating each ceramic green sheet And firing the laminated ceramic green sheets, and a method of manufacturing a ceramic package for electronic components, wherein in the step of screen printing the electrode pattern, the step portions are formed by laminating the ceramic green sheets. An electrode pattern is screen-printed by using a mask having a printing pattern larger than a portion on which an electrode is printed, from a part of one plane to be formed to a substantially orthogonal edge connected to the step portion.

  According to this method of manufacturing a ceramic package, printing is larger than a portion where an electrode is printed from a part of one plane forming a stepped portion by laminating each ceramic green sheet to a substantially orthogonal ridge connected to the stepped portion. By performing screen printing of the electrode pattern using a mask having a pattern, the electrode pattern can be formed up to a substantially orthogonal ridge connected to the stepped portion even if there is a printing misalignment.

  An electronic component manufacturing method according to the present invention is a method for manufacturing an electronic component in which an electronic component element is accommodated in a recess of an electronic component ceramic package, and the electronic component element is mounted in the recess of the electronic component ceramic package. A stepped portion is provided on a part of the surface, and a recognition pattern is formed from a part of the surface on which the electronic component element is mounted to a substantially orthogonal ridge connected to the stepped portion, and for the electronic component of the electronic component element Positioning to be mounted in the ceramic package is determined based on image processing for the recognition pattern, and an electronic component element is mounted.

  According to this method of manufacturing an electronic component, the recognition pattern in the ceramic package is the same surface as the mounting surface of the electronic component element, and the recognition pattern has a ridge that leads from the mounting surface to the stepped portion. The recognition pattern does not include stacking misalignment and printing misalignment with respect to the mounting position of the electronic component element. For this reason, if recognition is performed by the image recognition apparatus using this recognition pattern, the electronic component element can be accurately mounted at a predetermined position of the ceramic package.

  An electronic component manufacturing method of the present invention is an electronic component manufacturing method for storing an electronic component element in an electronic component ceramic package, wherein a surface of the concave portion of the electronic component ceramic package on which the electronic component element is mounted. A stepped portion is provided in part, and a recognition pattern is formed from a part of a surface on which the electronic component element is mounted to a substantially perpendicular ridge connected to the stepped portion, and the electronic component element is formed into the ceramic package for the electronic component. The position of application of the adhesive to be fixed inside is determined based on image processing for the recognition pattern, and the adhesive is applied.

  According to this method of manufacturing an electronic component, the recognition pattern in the ceramic package is the same surface as the mounting surface of the electronic component element, and the recognition pattern has a ridge that leads from the mounting surface to the stepped portion. The recognition pattern does not include stacking misalignment and printing misalignment with respect to the mounting position of the electronic component element or the like. From this, if it recognizes and positions with an image recognition apparatus using this recognition pattern, the adhesive agent for fixing an electronic component element etc. to the predetermined position of a ceramic package accurately can be apply | coated.

DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, embodiments of the invention will be described with reference to the drawings.
(First embodiment)

1A and 1B are explanatory views showing the structure of a ceramic package, in which FIG. 1A is a schematic plan view, FIG. 1B is a schematic cross-sectional view taken along the line AA in FIG. ) Is a schematic cross-sectional view taken along the line BB in FIG.
The ceramic package 1 is formed by laminating ceramic sheets 11 and 12 cut into a predetermined shape on a ceramic sheet 10 serving as a base. Thus, by laminating the die-cut ceramic sheets 11 and 12, the recess 13 is formed so that an electronic component element can be mounted inside.

One surface of the ceramic sheet 11 is a surface on which electronic component elements and the like are mounted. The central portion is stamped into a substantially rectangular shape, and electrode patterns 20a, 20b, 20c, 20d, 20e, and 20f are printed on the left and right sides in the figure. Yes.
Further, the ceramic sheet 10 is punched out so as to be substantially orthogonal to the ridge 25a of the portion where the electrode pattern 20a is formed, and a ridge 26a is formed. Similarly, the ceramic sheet 10 is die-cut to form the ridges 26c, 26d, and 26f so as to be substantially orthogonal to the ridges 25c, 25d, and 25f of the portions where the electrode patterns 20c, 20d, and 20f are formed. Each electrode pattern 20a, 20c, 20d, and 20f is printed so as to extend to these edges.

By stacking such a ceramic sheet 11 on the ceramic sheet 10, a stepped portion is formed from one surface of the ceramic sheet 11 to the ceramic sheet 10.
For example, as shown in FIG. 1B, a stepped portion is formed by the side wall 22 a continuing from the ridge 25 a of the ceramic sheet 11 and the flat surface 27 of the ceramic sheet 10. Further, a stepped portion is formed by the side wall 22 d continuing from the ridge 25 d of the ceramic sheet 11 and the flat surface 27 of the ceramic sheet 10. Similarly, as shown in FIG. 1C, a stepped portion is formed by the side wall 23 a continuing from the ridge 26 a of the ceramic sheet 11 and the flat surface 27 of the ceramic sheet 10. Further, a stepped portion is formed by the side wall 23 c continuing from the ridge 26 c of the ceramic sheet 11 and the flat surface 27 of the ceramic sheet 10.

Further, a frame-shaped ceramic sheet 12 that secures a space in the thickness direction when an electronic component element or the like is mounted in the ceramic package 1 is laminated on the ceramic sheet 11.
The ceramic sheets 10, 11, and 12 are made of an electrically insulating material such as an alumina sintered body, an aluminum nitride sintered body, a mullite sintered body, a silicon carbide sintered body, and a glass-ceramic sintered body. Is formed.
The electrode patterns 20a, 20b, 20c, 20d, 20e, and 20f are obtained by printing a metal paste containing a refractory metal powder such as tungsten, molybdenum, manganese, and baking at a high temperature.

According to the ceramic package 1 having the above configuration, the electrode patterns 20a, 20c, 20d, and 20f as the recognition patterns are formed on the same surface as the mounting surface of the electronic component element, so that the outer shape or the recognition pattern on the other surface is used as a reference. There is no possibility of including an error of stacking deviation in the case of using.
In addition, since the electrode pattern is formed from a part of the surface on which the electronic component element is mounted to the substantially orthogonal ridge connected to the stepped portion, the substantially orthogonal ridge includes an error in printing misalignment when forming the electrode pattern. There is nothing.
In other words, in the ceramic package 1, the position accuracy of the substantially orthogonal ridge is determined by the position accuracy of forming the stepped portion, so that the accuracy is good, and the recognition in the image recognition apparatus uses the recognition pattern and the contrast of the color outside thereof. Thus, the electrode patterns 20a, 20c, 20d, and 20f can be obtained as accurate recognition patterns having the position accuracy of the edges by forming the electrode patterns over the substantially orthogonal edges.

  And electrode pattern 20a, 20c, 20d, 20f can be utilized as a recognition pattern by an image recognition apparatus. Specifically, when one electrode pattern is used as a recognition pattern, for example, the substantially orthogonal ridges 25a and 26a connected to the stepped portion in the electrode pattern 20a or their intersections are recognized, and image processing is performed on each other. The mounting position of the electronic component element or the like in the orthogonal direction can be determined.

Moreover, two electrode patterns located diagonally can be used as a recognition pattern. For example, by using the electrode patterns 20a and 20f and recognizing the edges 25a, 26a, 25f, and 26f or their intersections, and performing image processing, recognition in directions orthogonal to each other and in-plane rotational directions becomes possible. In addition, the mounting position of the electronic component element can be determined.
Thus, by using the electrode pattern in the present embodiment, it is possible to improve the accuracy of mounting positioning of electronic component elements and the like. Furthermore, by using an electrode pattern as a recognition pattern for performing image processing by the image processing apparatus, a space for forming the recognition pattern is not required, which can contribute to downsizing of the ceramic package.

It should be noted that the recognition pattern is formed on the ceramic package in at least one place, preferably two in the diagonal position, if the recognition is made only in the orthogonal direction. In the case of recognizing the recognition pattern at the diagonal position, it is preferable to form at least two places, preferably four places.
In this way, it becomes possible to flow without determining the direction of the package in the manufacturing process, and the productivity of the electronic component can be improved.
(Second Embodiment)

Next, a method for manufacturing the ceramic package for electronic parts 1 will be described.
The production of the ceramic package 1 for electronic parts includes a step of die cutting a ceramic green sheet, a step of drilling and embedding a conductor in a through hole as required, a step of screen printing an electrode pattern, and a predetermined shape. A step of laminating a plurality of ceramic green sheets and a step of firing at a high temperature.
Here, the process of screen printing the electrode pattern according to the present invention will be described in detail.

FIG. 2 shows a ceramic sheet (ceramic green sheet) 11 before firing, and is an explanatory diagram for explaining an electrode pattern to be screen-printed on the ceramic sheet 11.
The central portion of the ceramic sheet 11 is die-cut into a substantially rectangular shape, and is further die-cut in a direction substantially perpendicular to each of the ridges 25a, 25c, 25d, and 25f to form ridges 26a, 26c, 26d, and 26f. In the drawing, the portion surrounded by the two-dot chain line indicates the print patterns 30a, 30b, 30c, 30d, 30e, and 30f for printing the electrode pattern by screen printing.

For example, the printing pattern 30a is formed so as to protrude from the substantially orthogonal ridges 25a and 26a of the ceramic sheet 11, and is a printing pattern larger than the portion where the electrode pattern is formed. Similarly, the print patterns 30c, 30d, and 30f are formed so as to protrude from the respective edges, and are larger than the portions where the electrode patterns are formed.
The electrode pattern is screen-printed using a mask having such print patterns 30a, 30b, 30c, 30d, 30e, 30f. By doing in this way, the electrode pattern which extends an electrode pattern to each edge can be printed.

According to this method of manufacturing a ceramic package, a printing pattern larger than a portion for printing an electrode from a part of one plane forming a stepped portion by laminating ceramic sheets to a substantially orthogonal ridge connected to the stepped portion. The electrode pattern is screen-printed using a mask having From this, even if there is a printing misalignment, the electrode pattern can be formed up to a substantially orthogonal ridge connected to the step portion.
This electrode pattern can be used as a recognition pattern for an image recognition device, and the mounting position of an electronic component element or the like can be accurately determined by recognizing a substantially orthogonal edge connected to the stepped portion or its intersection and performing image processing. It can be positioned well.
(Third embodiment)

Next, an electronic component manufacturing method using the electronic component package will be described. In this embodiment, a gyro sensor is taken as an example, and a positioning method for mounting a gyro element assembly including a gyro element on a ceramic package will be described.
FIG. 3 is an explanatory view showing a position where a conductive adhesive is applied to a ceramic package in relation to a method for manufacturing an electronic component. FIG. 4 is an explanatory view for explaining a state in which a gyro element is mounted on a ceramic package following application of a conductive adhesive. FIG. 4 (a) is a schematic plan view, and FIG. 4 (b) is a diagram of FIG. 4 (a). It is a schematic sectional drawing in alignment with CC disconnection.

In FIG. 3, electrode patterns 20a and 20f formed on the ceramic sheet 11 which is the mounting surface of the gyro element of the ceramic package 1 are used as recognition patterns by the image recognition apparatus. The electrode patterns 20a and 20f are arranged at diagonal positions.
In the image recognition apparatus, the substantially orthogonal ridges 25a and 26a of the electrode pattern 20a and the substantially orthogonal ridges 25f and 26f of the electrode pattern 20f are recognized and image-processed, and a position where a conductive adhesive such as an Ag paste is applied is determined. To do. The conductive adhesive 35 is sequentially applied to predetermined positions of the electrode patterns 20a, 20b, 20c, 20d, 20e, and 20f obtained by image processing as the dispenser moves.

Thereafter, in FIG. 4, the electrode patterns 20a and 20f are similarly recognized by the image recognition apparatus, and the substantially orthogonal ridges 25a and 26a of the electrode pattern 20a and the substantially orthogonal ridges 25f and 26f of the electrode pattern 20f are recognized and image processing is performed. The position where the gyro element assembly 44 is mounted is determined. The gyro element assembly 44 is mounted by positioning the gyro element assembly 44 by holding the gyro element assembly 44 in the chuck and moving the chuck to a predetermined position obtained by image processing, and mounting the gyro element assembly 44 in the ceramic package 1. In the ceramic package 1 of the present embodiment, the seam ring 45 is brazed in advance.
Then, after the conductive adhesive 35 is dried, the inside of the ceramic package 1 is kept in a vacuum atmosphere by the lid 46 and sealed to complete the gyro sensor.

  Here, the gyro element assembly 44 includes a TAB tape in which a copper foil 42 is adhered to a polyimide tape 41, and electrodes of the gyro element 40 are connected and fixed to leads 43 formed by etching the copper foil 42. The TAB tape has wirings connected to the leads 43, and connection terminals are provided at positions corresponding to the electrode patterns 20a, 20b, 20c, 20d, 20e, and 20f of the ceramic package 1 (not shown). ) Then, the electrode patterns 20a, 20b, 20c, 20d, 20e, 20f and the gyro element 40 are connected by connecting each connection terminal and the electrode patterns 20a, 20b, 20c, 20d, 20e, 20f via the conductive adhesive 35. Electrical connection is made.

According to the method of manufacturing the gyro sensor as the electronic component, the electrode patterns (recognition patterns) 20a, 20c, 20d, and 20f in the ceramic package 1 are the same as the mounting surface of the gyro element assembly 44. Since the electrode patterns 20a, 20c, 20d, and 20f have ridges that lead from the mounting surface to the stepped portion, the recognition pattern does not include stacking misalignment and printing misalignment errors with respect to the mounting position of the gyro element assembly 44. ing. Therefore, when the electrode patterns 20a, 20c, 20d, and 20f are used for recognition and positioning by the image recognition device, conductive bonding for accurately fixing the gyro element assembly 44 to a predetermined position of the ceramic package 1 is performed. Agent 35 can be applied.
Similarly, if the electrode pattern 20a, 20c, 20d, 20f is used for recognition and positioning by the image recognition device, the gyro element assembly 44 can be accurately mounted at a predetermined position of the ceramic package 1.

  The ceramic package for electronic components according to the present invention mounts various electronic component elements such as a semiconductor element, a piezoelectric vibrating piece, a surface acoustic wave element, and a solid-state imaging element with high accuracy at a predetermined position in addition to the gyro element. Available to:

It is explanatory drawing which shows the structure of the ceramic package for electronic components, (a) is a schematic plan view, (b) is a schematic sectional drawing in alignment with the AA disconnection of the figure (a), (c) is the figure (a) ) Is a schematic cross-sectional view along the BB disconnection. Explanatory drawing explaining the electrode pattern printed on a ceramic sheet. Explanatory drawing which shows the position which apply | coats an adhesive agent to the ceramic package for electronic components. It is explanatory drawing explaining the state which mounted the gyro element in the ceramic package for electronic components, (a) is a schematic plan view, (b) is a schematic sectional drawing in alignment with CC disconnection of the figure (a).

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Ceramic package for electronic components 10, 11, 12 ... Ceramic sheet, 13 ... Recessed part of ceramic package for electronic components, 20a, 20c, 20d, 20f ... Electrode pattern as recognition pattern, 20b, 20e ... Electrode pattern, 22a , 22d ... sidewalls, 23a, 23c ... sidewalls, 25a, 25c, 25d, 25f ... ridges, 26a, 26c, 26d, 26f ... ridges, 27 ... flat surfaces of ceramic sheets, 30a, 30b, 30c, 30d, 30e, 30f ... Print pattern, 35 ... conductive adhesive, 40 ... gyro element, 41 ... polyimide tape, 42 ... copper foil, 43 ... lead, 44 ... gyro element assembly, 45 ... seam ring, 46 ... lid.

Claims (6)

A ceramic package for an electronic component in which a plurality of ceramic sheets are laminated and a recess for mounting an electronic component element is formed,
A stepped portion is provided on a part of the surface on which the electronic component element is mounted, and a recognition pattern is formed from a part of the surface on which the electronic component element is mounted to a substantially orthogonal ridge connected to the stepped portion. A ceramic package for electronic parts. In the ceramic package for electronic components according to claim 1,
The ceramic package for electronic parts, wherein the stepped portion and the recognition pattern are arranged at least at two diagonal positions. In the ceramic package for electronic components according to claim 1 or 2,
A ceramic package for electronic parts, wherein the recognition pattern is an electrode pattern. A process of die cutting each ceramic green sheet;
Screen printing an electrode pattern on each of the die-cut ceramic green sheets;
Laminating each ceramic green sheet;
A step of firing the laminated ceramic green sheets;
A method of manufacturing a ceramic package for electronic components comprising:
In the step of screen-printing the electrode pattern, the ceramic green sheets are laminated to form a stepped portion, and from a part of one plane to a substantially orthogonal ridge connected to the stepped portion, it is larger than the portion where the electrode is printed. A method for producing a ceramic package for electronic parts, comprising: screen printing an electrode pattern using a mask having a printed pattern. An electronic component manufacturing method for storing an electronic component element in a recess of a ceramic package for an electronic component,
A step portion is provided in a part of the surface on which the electronic component element is mounted in the concave portion of the ceramic package for the electronic component, and from a part of the surface on which the electronic component element is mounted to a substantially orthogonal ridge connected to the step portion. Forming a recognition pattern,
A method of manufacturing an electronic component, comprising: positioning an electronic component element to be mounted in the ceramic package for an electronic component based on image processing with respect to the recognition pattern, and mounting the electronic component element. An electronic component manufacturing method for storing an electronic component element in a ceramic package for an electronic component,
A step portion is provided in a part of the surface on which the electronic component element is mounted in the concave portion of the ceramic package for the electronic component, and from a part of the surface on which the electronic component element is mounted to a substantially orthogonal ridge connected to the step portion. Forming a recognition pattern,
A method of manufacturing an electronic component, comprising: determining an application position of an adhesive for fixing the electronic component element in the ceramic package for the electronic component based on an image process for the recognition pattern, and applying the adhesive. .

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