JP2007005343A - Package for electronic device and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a package for electronic devices for preventing the characteristics and reliability of the electronic device from deteriorating due to wiring for plating exposed to the side of a multilayer board, and to provide the package for electronic devices. <P>SOLUTION: In the manufacturing method of the package for electronic devices, the wiring 33 for plating for connecting a plurality of wiring paths is formed in the package for electronic devices, electricity is carried from the wiring 34 for plating on the side in the multilayer board 16 to form a plated metal layer on the surface of a terminal by an electrolytic plating method. Then, a breaking-off part 17 including the wiring 33 for plating for connecting a plurality of wiring paths in the package for electronic devices is broken off, thus separating the plurality of wiring paths. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an electronic device package that accommodates an electronic element such as a semiconductor element, a piezoelectric vibrating piece, and a surface acoustic wave element, and an electronic device package.

In a substrate on which an electronic element such as a semiconductor element is mounted, a plated metal layer such as gold is provided on the exposed terminal surface and wiring surface to improve the connection strength of the terminals and wirings and the bonding wires.
As a method for forming the plated metal layer, an electrolytic plating (electroplating) method and an electroless plating method can be used. However, it is difficult to selectively plate terminals and wiring by the electroless plating method. Since an environmentally hazardous substance such as lead is taken into the metal layer, an electrolytic plating method is generally used.

  When using the electrolytic plating method, if the wiring paths including the wiring and the terminals are independent from each other, plating cannot be applied to them at the same time. Therefore, the plating wiring is arranged and connected to each other. In this way, a plated metal layer is formed (see Patent Document 1).

Similarly, in an electronic device package formed by stacking substrates, a similar method is used when forming a plated metal layer on the surfaces of wiring and terminals.
5A and 5B are explanatory views for explaining the arrangement of plating wirings in a conventional electronic device package. FIG. 5A is a schematic plan view, FIG. 5B is a schematic cross-sectional view, and FIG. It is a D side view model side view of figure (a).

  In the electronic device package 100, wiring necessary for the multilayer substrate 116 such as ceramic is disposed, and the terminals 121 to 128 are exposed on the surface. It is necessary to form a plated metal layer on the surfaces of the terminals 121 to 128. For example, formation of a plated metal layer in the terminals 121, 122, 127, and 128 will be described. The terminal 122 and the terminal 127 are connected by the inter-terminal wiring 131 in the multilayer substrate 116. In addition, a plating wiring 134 is connected to the inter-terminal wiring 131, and the plating wiring 134 is drawn out to the side surface of the multilayer substrate 116. Similarly, the terminal 121 and the terminal 128 are connected by the inter-terminal wiring 132 in the multilayer substrate 116. In addition, a plating wiring 135 is connected to the inter-terminal wiring 132, and the plating wiring 135 is drawn out to the side surface of the multilayer substrate 116.

  In this way, the plating wirings 134 and 135 are exposed on the side surfaces of the multilayer substrate 116, and by conducting from the plating wirings 134 and 135, terminals 121, 122, 131, A plated metal layer is formed on the surface 132.

  For example, as shown in FIG. 6, the electronic device package 100 formed in this way is connected to the pads of the semiconductor element 141 and the terminals 121 to 126 by bonding wires 142, and further to the piezoelectric vibrating piece 143. The terminals 127 and 128 are fixed with the conductive adhesive 144, and the inside of the package is hermetically sealed with the lid 145 from the seam ring 115 fixed on the laminated substrate 116, whereby an electronic device is obtained.

Japanese Patent Laid-Open No. 7-122838

However, in the structure of the electronic device package described above, since the recent package size has been reduced in size and thickness, and there are a large number of plating wirings drawn out of the package, the plating wiring exposed on the side surface of the laminated substrate The distance between them is getting smaller. For this reason, after mounting an electronic element on a package, current leakage may occur between plating wirings in a special environment such as high temperature and high humidity.
In particular, if such current leakage occurs between terminals that are important in terms of characteristics, it may cause fluctuations and deterioration of the characteristics of the electronic device, and if the characteristics are excessively fluctuated or deteriorated, it may lead to a decrease in reliability. is expected.

  SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and an object of the present invention is for an electronic device that prevents fluctuation / degradation of characteristics and deterioration of reliability in the electronic device due to the plating wiring exposed on the side surface of the laminated substrate. A package manufacturing method and an electronic device package are provided.

  In order to solve the above problems, a method of manufacturing an electronic device package according to the present invention includes a laminated substrate in which a plurality of substrates are laminated, a terminal that is connected to an electronic element and has a plated metal layer on the surface, and the terminal Inter-terminal wirings that are connected to each other, and plating wirings that are arranged so as to be connected to the inter-terminal wirings or the terminals from the side surface of the laminated substrate in order to form a plated metal layer on the exposed surface of the terminals. A method for manufacturing an electronic device package, comprising: forming a plating wiring for connecting a plurality of wiring paths in the electronic device package, and supplying electricity from the plating wiring on a side surface of the laminated substrate. Forming a plated metal layer on the surface of the terminal by an electrolytic plating method, and then including the plating wiring connected to a plurality of wiring paths in the electronic device package And separating said plurality of wiring paths by removing a portion of the.

According to this method of manufacturing a package for an electronic device, conventionally, it has been necessary to connect one plating wiring for one wiring path and pull it out from the side surface of the laminated substrate. After forming the plated metal layer on the terminals, each wiring path can be separated by removing a part of the substrate including the plating wiring, and the plating wiring drawn from the side surface of the laminated substrate is reduced. be able to.
This makes it possible to design the distance between the plating wirings so that current leakage is unlikely to occur, and the characteristics variation / deterioration and reliability in the electronic device due to the plating wiring exposed on the side of the laminated substrate It is possible to obtain a method for manufacturing an electronic device package that prevents the deterioration.

  In the electronic device package manufacturing method of the present invention, it is preferable that a groove is formed in a part of the laminated substrate to be removed, and a part of the laminated substrate is folded along the groove.

  In this way, since the groove is formed in the part of the substrate to be removed, the substrate can be easily folded. And since the wiring for plating is formed in the board | substrate, a some wiring path | route can be isolate | separated.

  In addition, the method for manufacturing an electronic device package according to the present invention includes a laminated substrate in which a plurality of substrates are laminated, a terminal that is connected to an electronic element and has a plated metal layer on the surface, and a terminal that is connected to the terminal. An electronic device comprising: an inter-wiring; and a plating wiring arranged so as to be connected to the inter-terminal wiring or the terminal from a side surface of the laminated substrate in order to form a plated metal layer on the exposed surface of the terminal A method for manufacturing a package for a semiconductor device comprising: forming a wiring for plating that connects a plurality of wiring paths in the package for an electronic device; and energizing electricity from the plating wiring on a side surface of the laminated substrate. Forming a plated metal layer by electrolytic plating, and then removing a part of the plating wiring connecting the plurality of wiring paths in the electronic device package. And separating the road.

According to this method of manufacturing a package for an electronic device, conventionally, it has been necessary to connect one plating wiring for one wiring path and pull it out from the side surface of the laminated substrate. After forming the plating metal layer on the terminal, the wiring paths can be separated by removing a part of the plating wiring, and the plating wiring drawn from the side surface of the laminated substrate can be reduced. .
This makes it possible to design the distance between the plating wirings so that current leakage is unlikely to occur, and the characteristics variation / deterioration and reliability in the electronic device due to the plating wiring exposed on the side of the laminated substrate It is possible to obtain a method for manufacturing an electronic device package that prevents the deterioration.

  In the method for manufacturing an electronic device package according to the present invention, it is desirable that a part of the plating wiring is cut by irradiating a laser beam.

  Thus, if the plating wiring is cut by irradiating the plating wiring with the laser beam, the respective wiring paths can be easily separated.

  The electronic device package of the present invention is manufactured by the above-described electronic device package manufacturing method.

  This electronic device package can be formed with less plating wiring exposed on the side surface of the multilayer substrate, and the distance between the plating wirings can be arranged at a distance at which current leakage is unlikely to occur. And the package for electronic devices which prevents the fluctuation | variation / deterioration of the characteristic in an electronic device resulting from the wiring for plating exposed to the laminated substrate side surface and a reliability fall can be obtained.

Embodiments of the present invention will be described below with reference to the drawings.
(First embodiment)

1A and 1B are explanatory views for explaining a method for manufacturing an electronic device package according to the first embodiment. FIG. 1A is a schematic plan view, FIG. 1B is a schematic cross-sectional view, and FIG. It is a B side view typical side view of the figure (a).
First, in order to form the laminated substrate 16, substrates 11 to 14 made of an electrically insulating material are prepared. These substrates 11 to 14 are formed by punching an unfired ceramic sheet into a predetermined shape, forming a predetermined pattern of wiring and terminals on the surface of each substrate, and forming wiring also in the through-hole portion. And after laminating | stacking the substrates 11-14, it bakes at high temperature and the laminated substrate 16 is obtained.

  The materials of the substrates 11 to 14 include electrical insulating materials such as alumina sintered bodies, aluminum nitride sintered bodies, mullite sintered bodies, silicon carbide sintered bodies, and glass / ceramic sintered bodies. Used. For the wiring, a metal paste made of a refractory metal powder such as tungsten, molybdenum or manganese is formed in a predetermined pattern on the substrate by a screen printing method.

Here, the structure of the multilayer substrate 16 will be described in detail.
The laminated substrate 16 uses the substrate 11 as a base substrate, and the substrate 12 is laminated thereon. On the substrate 12, frame-shaped substrates 13 and 14 punched out are stacked, and a recess is formed in the stacked substrate 16. Further, the substrate 14 is formed with a folding portion 17 that protrudes into the concave portion of the laminated substrate 16, and a wedge-shaped groove 18 is provided at the boundary between the substrate 14 and the folding portion.
Terminals 21 to 26 are disposed on the surface of the substrate 12, and through-hole wirings are formed below the terminals 21 to 26 and connected to wirings formed on the surface of the substrate 11. Terminals 27 and 28 are disposed on the surface of the substrate 14.

Next, the connection state of the wirings related to the terminals 21, 22, 27, and 28 will be described.
The terminal 27 and the terminal 22 are connected by an inter-terminal wiring 31 including a through-hole electrode that penetrates the substrates 12, 13, and 14 and a wiring formed on the substrate 11.
Further, the terminal 28 and the terminal 21 are connected by an inter-terminal wiring 32 constituted by a through-hole wiring penetrating the substrates 12, 13, and 14 and a wiring formed on the substrate 11.

The terminal 27 and the terminal 28 pass through the through hole wiring between the substrate 14 and the substrate 13 connected to the terminal 27 via the folding part 17 and pass through between the substrate 14 and the substrate 13 connected to the terminal 28. They are connected by plating wiring 33 that leads to hole wiring.
Further, a plating wiring 34 is formed to be drawn out to the side surface of the multilayer substrate 16 from a through-hole wiring between the substrate 12 and the substrate 13 connected to the terminal 27.
In this way, by connecting the two wiring paths with the plating wiring 33, the number of the plating wirings 34 drawn from the side surface of the multilayer substrate 16 becomes one.

Next, after fixing the annular seam ring 15 on the substrate 14, the plating wiring 34 led out to the side surface of the multilayer substrate 16 is energized, so that a plated metal layer such as gold is attached to the terminals 21, by electrolytic plating. It is formed on the surfaces of 22, 27 and 28.
Although not shown, the plating wirings connected to the terminals 23 to 26 are drawn out to the side surfaces of the multilayer substrate 16, and the surfaces of the terminals 23 to 26 are plated by energizing the plating wirings. A metal layer is formed.
After that, as shown in FIG. 2, the folding part 17 is broken to form the electronic device package 1.

In this embodiment, a groove is provided in the substrate as a method for removing a part of the substrate, and the substrate is folded. However, as another method, the substrate may be cut using a cutter or the like.
Further, due to the structure of hermetically sealing the inside of the package, for example, when sealing with a cap-shaped lid provided with a flange portion, it is not necessary to provide the seam ring 15.

As described above, according to the method for manufacturing the electronic device package 1, conventionally, it has been necessary to connect one plating wiring to one wiring path and pull it out from the side surface of the laminated substrate. By connecting these wiring paths with the plating wiring 33, it is possible to reduce the plating wiring drawn out from the side surface of the multilayer substrate 16. Then, after forming the plated metal layer on the terminals, the wiring paths can be separated by breaking the folding portion 17 where the plating wiring 33 is formed.
This makes it possible to design the distance between the plating wirings so that current leakage is less likely to occur, and the characteristics variation / deterioration and reliability in the electronic device due to the plating wiring exposed on the side surface of the multilayer substrate 16 The manufacturing method of the package 1 for electronic devices which prevents a property fall can be obtained.
(Second Embodiment)

3A and 3B are explanatory views for explaining a method for manufacturing an electronic device package according to the second embodiment. FIG. 3A is a schematic plan view, FIG. 3B is a schematic cross-sectional view, and FIG. It is a C side view schematic side view of the figure (a).
First, in order to form the laminated substrate 56, the substrates 51 to 54 made of an electrically insulating material are prepared. These substrates 51 to 54 are formed by punching an unfired ceramic sheet into a predetermined shape, forming a predetermined pattern of wiring and terminals on the surface of each substrate, and forming a wiring also in the through hole portion. And after laminating | stacking the board | substrates 51-54, it bakes at high temperature and the laminated substrate 56 is obtained.

Here, the structure of the multilayer substrate 56 will be described in detail.
The laminated substrate 56 uses the substrate 51 as a base substrate, and the substrate 52 is laminated thereon. On the substrate 52, frame-shaped substrates 53 and 54 punched out are stacked, and a recess is formed in the stacked substrate 56.
Terminals 61 to 66 are disposed on the surface of the substrate 52, and through-hole wirings are formed below the terminals 61 to 66 and connected to wirings formed on the surface of the substrate 51. Terminals 67 and 68 are disposed on the surface of the substrate 54.

Next, a connection state of wirings related to the terminals 61, 62, 67, and 68 will be described.
The terminal 67 and the terminal 62 are connected by a terminal-to-terminal wiring 71 composed of a through-hole electrode that penetrates the substrates 52, 53, and 54 and a wiring formed on the substrate 51.
Further, the terminal 68 and the terminal 61 are connected by an inter-terminal wiring 72 constituted by a through-hole wiring penetrating the substrates 52, 53 and 54 and a wiring formed on the substrate 51.

The terminals 67 and 68 are connected to each other by a plating wiring 73 on the substrate 54.
Further, a plating wiring 74 is formed to be drawn out to the side surface of the multilayer substrate 56 from the through-hole wiring between the substrate 52 and the substrate 53 connected to the terminal 67.
In this way, by connecting the two wiring paths with the plating wiring 73, the number of the plating wiring 74 drawn out from the side surface of the multilayer substrate 56 becomes one.

Next, after fixing the annular seam ring 55 on the substrate 54, the plating wiring 74 led out to the side surface of the laminated substrate 56 is energized, so that a plated metal layer such as gold is attached to the terminals 61, 61 by electrolytic plating. It forms on the surface of 62,67,68.
Although not shown, the plating wirings connected to the terminals 63 to 66 are drawn out to the side surfaces of the multilayer substrate 56, and the surfaces of the terminals 63 to 66 are plated by energizing the plating wiring. A metal layer is formed.
After that, as shown in FIG. 4, the plating wiring 73 connecting the terminal 67 and the terminal 68 is irradiated with laser light to cut the wiring, whereby the electronic device package 2 is obtained.

  In this embodiment, the plating wiring is cut by irradiating the laser beam. However, as another method, the plating wiring is formed by providing a groove from the plating wiring to the substrate using a cutter or the like. It may be cut.

As described above, according to the method for manufacturing the electronic device package 2, conventionally, it has been necessary to connect one plating wiring to one wiring path and pull it out from the side surface of the laminated substrate. By connecting these wiring paths with the plating wiring 73, it is possible to reduce the plating wiring drawn from the side surface of the laminated substrate. Then, after the plating metal layer is formed on the terminal, the plating wiring 33 can be removed and cut by irradiating with a laser beam, and the respective wiring paths can be separated.
This makes it possible to design the distance between the plating wirings so that current leakage is unlikely to occur, and the characteristics variation / deterioration and reliability in the electronic device due to the plating wiring exposed on the side of the laminated substrate It is possible to obtain a method of manufacturing the electronic device package 2 that prevents the decrease.

  In the above-described embodiment, a single electronic device package has been described as an explanation of the manufacturing method for the electronic device package. However, a plurality of electronic device packages are arranged on the mother board in the same process as described above. It is preferable to manufacture and finally separate each package by cutting or the like. In this way, a method for manufacturing an electronic device package with improved productivity can be obtained.

In addition, the electronic device package manufactured using the method for manufacturing an electronic device package described in the first and second embodiments is formed with less plating wiring exposed on the side surface of the multilayer substrate. The distance between the plating wirings is such that current leakage is unlikely to occur, and it is possible to prevent fluctuation and deterioration of characteristics and deterioration of reliability in the electronic device due to the plating wiring exposed on the side surface of the multilayer substrate. it can.
Furthermore, with respect to terminals that affect the characteristics of the electronic device due to the external environment, the plating wiring connected to the terminals can be prevented from being exposed on the side of the package, and the electronic device package manufactured in this way is used. Thus, an electronic device having stable characteristics can be obtained.

  In addition, although implementation by a ceramic substrate was demonstrated as embodiment of this invention, this invention can be implemented also about the package for electronic devices using a glass substrate, a resin substrate, etc.

It is explanatory drawing explaining 1st Embodiment which concerns on this invention, (a) is a schematic plan view, (b) is a schematic cross section, (c) is a schematic side view seen from the arrow B of the same figure (a). The schematic plan view of the package for electronic devices completed in 1st Embodiment. It is explanatory drawing explaining 2nd Embodiment which concerns on this invention, (a) is a schematic plan view, (b) is a schematic cross section, (c) is a schematic side view seen from the arrow C of the same figure (a). The schematic plan view of the package for electronic devices completed in 2nd Embodiment. It is explanatory drawing explaining arrangement | positioning of the wiring for plating in the conventional package for electronic devices, (a) is a schematic top view, (b) is a schematic cross section, (c) is a schematic diagram of D arrow of the same figure (a). Side view. FIG. 10 is a schematic cross-sectional view illustrating an example of a conventional electronic device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,2 ... Electronic device package, 16 ... Laminated substrate, 17 ... Folding part, 18 ... Groove, 21, 22, 23, 24, 25, 26, 27, 28 ... Terminal, 31, 32 ... Inter-terminal wiring, 33, 34 ... wiring for plating, 56 ... laminated substrate, 61, 62, 63, 64, 65, 66, 67, 68 ... terminals, 71, 72 ... wiring between terminals, 73, 74 ... wiring for plating.

Claims (5)

A laminated substrate in which a plurality of substrates are laminated;
Terminals that are connected to electronic elements and have a plated metal layer on the surface;
Inter-terminal wiring for connection with the terminals;
Manufacturing of an electronic device package comprising: a wiring for plating arranged to connect to the inter-terminal wiring or the terminal from a side surface of the laminated substrate in order to form a plated metal layer on the exposed surface of the terminal A method,
Forming a wiring for plating connecting a plurality of wiring paths in the electronic device package;
By energizing electricity from the plating wiring on the side surface of the multilayer substrate, a plated metal layer is formed on the surface of the terminal by electrolytic plating,
Thereafter, the plurality of wiring paths are separated by removing a part of the laminated substrate including the plating wiring connected to the plurality of wiring paths in the electronic device package. Manufacturing method. In the manufacturing method of the package for electronic devices of Claim 1,
A method of manufacturing a package for an electronic device, comprising: forming a groove in a part of the laminated substrate to be removed, and breaking off a part of the laminated substrate along the groove. A laminated substrate in which a plurality of substrates are laminated;
Terminals that are connected to electronic elements and have a plated metal layer on the surface;
Inter-terminal wiring for connection with the terminals;
Manufacturing of an electronic device package comprising: a wiring for plating arranged to connect to the inter-terminal wiring or the terminal from a side surface of the laminated substrate in order to form a plated metal layer on the exposed surface of the terminal A method,
Forming a wiring for plating connecting a plurality of wiring paths in the electronic device package;
By energizing electricity from the plating wiring on the side surface of the multilayer substrate, a plated metal layer is formed on the surface of the terminal by electrolytic plating,
Thereafter, the plurality of wiring paths are separated by removing a part of the plating wiring that connects the plurality of wiring paths in the electronic device package. In the manufacturing method of the package for electronic devices of Claim 3,
A method of manufacturing a package for an electronic device, wherein a part of the plating wiring is cut by irradiating a laser beam. An electronic device package manufactured by the method for manufacturing an electronic device package according to claim 1.

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