JP2019176007A - Circuit board and method for manufacturing the same - Google Patents

Abstract

To allow for facilitating determination of acceptability of a positional deviation between a circuit board and an electronic component mounted on the circuit board in a short time, and to improve throughput of a determination process.SOLUTION: A circuit board 2 on which a component 23 is mounted comprises a mounting structure including a first land 17 and a second land 18 for mounting the component 23, and a recognition mark 10a arranged in the same layer as the mounting structure. The recognition mark 10a includes a first portion 11, and a second portion 12 arranged separated from the first portion 11 at a first interval S1 along a first direction x and having a first width W1 in the first direction x. A method for manufacturing the circuit board 2 comprises a preparing step of preparing a substrate, and a mounting structure forming step of forming a mounting structure including the first land 17 and the second land 18 for mounting the component 23 on the substrate. The mounting structure forming step also includes a mark forming step of simultaneously forming at least a partial structure of the mounting structure and the recognition mark 10a.SELECTED DRAWING: Figure 9

Description

  The present invention relates to a circuit board constituting an electronic circuit module and a manufacturing method thereof, and more particularly to a circuit board on which electronic components are mounted by a surface mounting technique and a manufacturing method thereof.

  As a technique for configuring an electronic circuit module having a predetermined function, a technique of integrating various electronic components on a single circuit board using a surface mounting technique is widely adopted. In these electronic circuit modules, connectors for connecting to other circuit boards are mounted. Such a connector is provided with at least a dozen connection terminals, and the pitch of these connection terminals is being reduced in order to improve the mounting density.

  As a method for surface-mounting the connector on a circuit board, there is a technique of connecting each of dozens of connection terminals arranged at a narrow pitch to each land formed on the circuit board by a solder reflow technique. In the case of surface mounting by this technology, it is necessary to place each connecting terminal within the predetermined range of each land to which they are to be connected and to determine whether the positional deviation is good or bad. is there.

  As described above, in order to place the components in the same position, it is necessary to detect the mutual relationship between the position of the electronic component to be mounted and the substrate. For example, in the cited document 1, each of the electronic component and the substrate is detected. A technique is disclosed in which markers are formed and the amount of positional deviation is calculated by measuring the distance between the markers.

  In addition, the outer shape of the connector is increased, and as described above, the positions of the connection terminals and the lands are aligned and not only electrically connected correctly, but the entire outer shape of the connector is determined in advance on the surface of the circuit board. It is required to be installed so as to be within the specified area to prevent interference with other parts installed in the vicinity. In this case, in addition to the alignment between the connection terminal and the land, a method is required in which the entire connector is positioned so as to fit within a predetermined region of the circuit board including the deviation of the external dimensions of the connector.

JP-A-9-246291

  However, in the technique disclosed in the cited document 1, it is necessary to detect the positions of the marker of the electronic component and the marker of the circuit board, and calculate the information of the positional deviation from the difference between the position information. In order to detect the position of each marker, for example, it is necessary to optically scan the marker to recognize its shape, and as a result, the measurement time becomes long and the pass / fail judgment throughput of the measuring device is low. Become. This lowers the production volume during production and causes an increase in production cost.

According to the circuit board of the first aspect of the present invention, there is provided a circuit board for mounting a component, the circuit board being mounted on the same layer as the mounting structure for mounting the component and the mounting structure. A recognition mark, the recognition mark is disposed at a first interval along the first direction from the first portion, and the first mark has a first width in the first direction. A second portion having.

  According to a second aspect of the present invention, in the first aspect, each of the first part and the second part is a quadrangle having sides parallel to a second direction orthogonal to the first direction. Become.

  According to a third aspect of the present invention, in the second aspect, the recognition mark includes a third portion that is spaced apart from the second portion, and a second direction from the third portion. And a fourth portion having a second width in the second direction, the third portion and the fourth portion both having a first width. It consists of a quadrangle that includes sides parallel to the direction.

  According to the fourth aspect of the present invention, in the third aspect, the first portion and the third portion are arranged so as to overlap at the same position.

  According to a fifth aspect of the present invention, in the third aspect or the fourth aspect, the second portion is a rectangle extending in the second direction with the first width, and the fourth portion. Is a rectangle extending in the first direction with a second width, and one part of the second part and one part of the fourth part overlap to form an L-shape.

  According to a sixth aspect of the present invention, in any one of the first to fifth aspects, the mounting structure has the uppermost wiring layer, and the recognition mark is the uppermost wiring layer. It is formed.

  According to a seventh aspect of the present invention, in the sixth aspect, the uppermost wiring layer includes a land connected to the connection terminal of the component.

  According to an eighth aspect of the present invention, in any one of the first to fifth aspects, the mounting structure includes a via hole, and the recognition mark includes the via hole.

  According to the circuit board manufacturing method of the ninth aspect of the present invention, there is provided a circuit board manufacturing method for mounting a component, comprising the steps of preparing a substrate and a mounting structure for mounting the component on the substrate. A mounting structure forming step, wherein the mounting structure forming step includes a mark forming step of simultaneously forming a part of the mounting structure and a recognition mark, wherein the recognition mark includes a first portion, And a second part having a first width in the first direction and spaced apart from the part at a first interval along the first direction. The amount of positional deviation between is detected.

  According to a tenth aspect of the present invention, in the ninth aspect, the structure of a part of the mounting structure is an uppermost wiring layer, and the mark forming step is performed on the substrate for the uppermost wiring layer. A conductive layer forming step of forming a layer; and a patterning step of patterning the conductive layer to simultaneously form the uppermost wiring layer and the recognition mark.

  According to the circuit board and the manufacturing method thereof of the present invention, whether each of the first part and the second part of the recognition mark of the circuit board is exposed or covered with a component to be mounted. It is possible to easily determine whether or not the installation position of the component is within a predetermined range only by inspection by visual recognition or image recognition. Since the inspection time for visual recognition or image recognition is extremely short, the throughput of the inspection apparatus is high. As a result, the production amount can be improved, and the effect of realizing a reduction in manufacturing cost can be achieved.

The top view of the recognition mark of the 1st Embodiment of this invention. The top view which shows operation | movement of the recognition mark of the 1st Embodiment of this invention. The top view which shows operation | movement of the recognition mark of the 1st Embodiment of this invention. The top view which shows operation | movement of the recognition mark of the 1st Embodiment of this invention. The top view which shows operation | movement of the recognition mark of the 1st Embodiment of this invention. The top view which shows operation | movement of the recognition mark of the 1st Embodiment of this invention. The top view of the recognition mark of the modification 1 of the 1st Embodiment of this invention. The top view which shows operation | movement of the recognition mark of the modification 1 of the 1st Embodiment of this invention. The top view of the recognition mark of the modification 2 of the 1st Embodiment of this invention. The top view which shows operation | movement of the recognition mark of the modification 2 of the 1st Embodiment of this invention. The top view of the electronic circuit module using the circuit board which mounts the recognition mark of the modification 2 of the 1st Embodiment of this invention. The top view of the circuit board which mounts the recognition mark of the modification 2 of the 1st Embodiment of this invention. The arrangement | positioning drawing of the recognition mark and mounting structure of the modification 2 of the 1st Embodiment of this invention. The top view of the circuit board carrying the recognition mark of the 2nd Embodiment of this invention.

  Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is a plan view of a recognition mark 10a according to the first embodiment of the present invention. The recognition mark 10a includes a first portion 11 made of, for example, a square, and a second portion 12 made of, for example, a rectangle. The first portion 11 and the second portion 12 are separated from each other by the first interval S1 along the first direction x. The second portion has a width W1 in the first direction.

  In addition, the shape of the 1st part 11 and the 2nd part 12 is not limited to a square and a rectangle, respectively, Arbitrary shapes may be sufficient. However, the distance S1 as the shortest distance between the first portion 11 and the second portion 12 and W1 as the maximum width of the second portion 12 can be defined, and the distance S1 and the maximum width W1 in a predetermined direction. Must be arranged in a straight line.

  Further, it is preferable that the recognition mark 10a can be easily detected by visual recognition or image recognition. For this purpose, each of the first portion 11 and the second portion 12 is desirably a quadrangle having sides parallel to the second direction y.

  FIG. 2 shows the arrangement of the recognition mark 10a and the outer shape 20 of the component 23 to be aligned using the recognition mark 10a. The end of the outer shape 20 of the parts 23 to be mated defines a first width W1 of the second portion 12 and defines a first spacing S1 between the first portion 11 and the second portion 12. When the position is coincident with the end of the second portion 12, it can be defined as a reference point where the amount of positional deviation is zero.

  In the state shown in FIG. 2, when the inspection is performed paying attention to whether or not the first portion 11 and the second portion 12 can be detected, the first portion 11 is not detected and only the second portion 12 is detected. Will be.

  FIG. 3A shows a state in which the position of the outer shape 20 of the component 23 is displaced by dW along the first direction x from the reference point toward the first portion 11. In this figure, the entire second portion 12 is exposed, and the first portion 11 is covered with the outer shape 20 of the component 23 and cannot be seen at all.

  As in the case of FIG. 2, when the inspection is performed paying attention to whether or not the first part 11 and the second part 12 can be detected, the first part 11 is not detected and only the second part 12 is detected. Thus, the detection result of FIG. 3A is the same as the detection result of FIG.

  FIG. 3B shows a state in which the position of the outer shape 20 of the component 23 is greatly displaced in the direction of the first portion 11 than the state of FIG. 3A. In this state, since the positional deviation amount dW is larger than the first interval S1, a part of the first portion 11 is exposed.

  As in the case of FIG. 3A, when inspection is performed paying attention to whether or not the first portion 11 and the second portion 12 can be detected, a part of the first portion 11 and the second portion are detected.

  This detection result is clearly different from the detection results in FIGS. 2 and 3A in that a part of the first portion 11 can be detected. The first portion 11 can be detected from the arrangement of the first portion 11 shown in FIG. 3B when the condition of positional deviation amount dW> first interval S1 is satisfied. Therefore, it can be determined that the positional deviation amount dW has exceeded the first interval S1 based on the result that the first portion 11 (at least a part thereof) has been detected.

  Therefore, if the first portion 11 and the second portion 12 of the recognition mark 10a are arranged so that the upper limit value of the allowable positional deviation amount is the first interval S1, the positional deviation amount is within the allowable range. Whether or not the first part 11 (at least a part thereof) is detected as to whether it is a non-defective product (in the state of FIG. 3A) or a defective product that has exceeded the allowable range (the state of FIG. 3B). It can be judged with.

  As described above, the determination of the non-defective product / defective product by this procedure can be uniquely determined by whether or not the first portion 11 and the second portion 12 have been detected (visually recognized), and thus the measurement is completed in a short time. And the determination can be easily performed.

  FIG. 4A shows a state where the position of the outer shape 20 of the component 23 is displaced by dW along the first direction x from the reference point in the direction opposite to the first portion 11. In this figure, although a part of the second portion 12 is covered by the outer shape 20 of the component 23, the exposed portion can be detected. On the other hand, the first portion 11 is covered with the outer shape 20 of the component 23 and cannot be seen at all.

  In the state of FIG. 4A, if inspection is performed by paying attention to whether or not the first portion 11 and the second portion 12 can be detected, the first portion 11 is not detected and a part of the second portion can be detected. . This detection result is the same as the detection result of FIG. 2 in that only the second portion 12 is detected.

  FIG. 4B shows a state in which the position of the outer shape 20 of the component 23 is greatly displaced in the direction opposite to the first portion 11 from the state of FIG. 4A. In this figure, since the positional deviation amount dW is larger than the first width W1, the entire second portion 12 is covered with the outer shape 20 of the component 23 and cannot be detected. Therefore, it can be determined that the positional deviation amount dW has exceeded the first width W1 with the result that the second portion 12 cannot be detected at the position where the second portion 12 is disposed.

  Therefore, if the shape of the second portion 12 of the recognition mark 10a is designed so that the upper limit value of the allowable positional deviation amount is the first width W1, the positional deviation amount is a non-defective product within the allowable range ( 4A) or a defective product exceeding the allowable range (state of FIG. 4B) can be determined only by detecting whether or not the second portion 12 is detected. Can be executed.

  FIG. 5 is a plan view of Modification Example 1 in which a recognition mark 10b is juxtaposed in addition to the recognition mark 10a in the first embodiment of the present invention. The recognition mark 10b includes a third portion 13 made of, for example, a square, and a fourth portion 14 made of, for example, a rectangle. The third portion 13 and the fourth portion 14 are separated from each other by a second interval S2 along a second direction y orthogonal to the first direction x. The fourth portion has a width W2 in the second direction. Further, the third portion 13 is separated from the first portion 11.

  In addition, the shape of the 3rd part 13 and the 4th part 14 is not limited to a square and a rectangle, respectively, Arbitrary shapes may be sufficient. However, the distance S2 as the shortest distance between the third part 13 and the fourth part 14 and W2 as the maximum width of the fourth part 14 can be defined, and the distance S2 and the maximum width W2 in a predetermined direction. Must be arranged in a straight line.

  Further, it is preferable that the recognition mark 10b can be easily detected by visual recognition or image recognition. For this purpose, each of the third portion 13 and the fourth portion 14 is desirably a quadrangle having sides parallel to the first direction x.

  Furthermore, it is preferable that each of the recognition marks 10a and 10b can be visually recognized or recognized. This enables collective inspection of the recognition marks 10a and 10b. In particular, it is even better if the recognition mark 10b and the recognition mark 10a are arranged so as to be rotationally symmetrical by 90 degrees.

  FIG. 6 shows the respective arrangements of the recognition marks 10a and 10b and the outer shape 20 of the component 23 to be aligned using the recognition marks 10a and 10b. When the end in the first direction x of the outer shape 20 of the component 23 to be mated is in a position that coincides with the end of the second portion 12 that defines the first width W1 of the second portion 12, It can be defined as a reference point where the amount of displacement in the direction of 1 is zero. Similarly, when the end portion of the outer shape 20 of the component 23 in the second direction y is at a position coincident with the end portion of the fourth portion 14 that defines the second width W2 of the fourth portion 14. , The reference point can be defined as a reference point where the amount of displacement in the second direction is zero.

  Regarding the recognition marks 10a and 10b of the first modification, the positions in the first direction x and the second direction y are the same as those shown in FIGS. 3A, 3B, 4A, and 4B. Whether or not the deviation amount exceeds each of the first interval S1, the first width W1, the second interval S2, and the second width W2 can be easily detected by visual recognition or image recognition.

  As a design procedure of the recognition mark, first, the first portion 11 of the recognition mark 10a and the upper limit value of the allowable positional deviation amount in the first direction x are the first interval S1 and the first width W1. The shape of the second portion 12 is designed. In addition, the upper limit value of the allowable positional deviation amount in the second direction x becomes the second interval S2 and the second width W2, and the third portion 13 and the fourth portion 14 of the recognition mark 10b. Design the shape.

  Whether the recognition mark misregistration amount is a non-defective product within the allowable range or a defective product exceeding the allowable range is determined using the first portion 11 and the second portion 12 in the first direction x. By inspecting and inspecting the third portion 13 and the fourth portion 14 in the second direction y, the determination can be easily made in a short time.

  FIG. 7 shows a recognition mark 10c of Modification 2 of the first embodiment of the present invention. The recognition mark 10c includes a fifth portion 15 made of a square, and a sixth portion 16 made of an L-shape combining two rectangles.

  The fifth portion 15 is separated from the sixth portion 16 by the first interval S1 along the first direction x. The sixth portion has an x width W1 in the first direction. Further, the fifth portion 15 is separated from the sixth portion 16 at the second interval S2 along the second direction y. The sixth portion has a width W2 in the second direction y.

  One of the rectangles forming the L-shape of the sixth portion 16 is a rectangle extending in the second direction y with the first width W1 in the first direction x, The rectangle is a rectangle extending in the first direction x with the second width W2 in the second direction y.

  FIG. 8 shows the arrangement of the recognition mark 10c and the end portion of the outer shape 20 of the component 23 to be aligned using the recognition mark 10c. The outer shape 20 of the parts 23 to be combined has an end portion in which a side extending in the first direction x and a side extending in the second direction y are substantially orthogonal.

  Here, the side extending in the first direction x of the end of the outer shape 20 of the component 23 to be matched is opposed to the fifth portion with the second interval S2 in the L-shape of the sixth portion 16. Match with edges. Then, the side extending in the second direction y is matched with the side facing the fifth part with the first interval S1 in the L-shape of the sixth part 16. The state arranged in this way can be defined as a reference point where the amount of positional deviation in each of the first direction and the second direction is zero.

  The fifth portion 15 of the modified example 2 is equivalent to the recognition marks 10a and 10b of the modified example 1 in which the first portion 11 and the third portion 13 are arranged so as to overlap each other at the same position. It is. The L-shaped sixth portion 16 includes a rectangle obtained by extending the second portion 12 of the recognition mark 10a along the second direction y with the first width W1, and a fourth portion of the recognition mark 10b. This is equivalent to a superposition of a rectangle obtained by extending the portion 14 along the first direction x with the second width W2.

  FIG. 9 is a plan view of an electronic circuit module using a circuit board on which the recognition mark of the modified example 2 of the first embodiment of the present invention is mounted. A component 23 (for example, a connector) is installed on the circuit board 2 by surface mounting, and an electronic component 30 is surface-mounted on lands 31 and 32 on the same surface. Four sets of recognition marks 10 c are arranged on the circuit board 2 so as to overlap the four corners of the component 23.

  In this arrangement, whether the fifth portion 15 of the recognition mark and the sixth portion 16 of the L shape arranged at the four corners of the component 23 are exposed is detected by visual recognition or image processing. As a result of this detection, whether or not each of the connection terminals 21 of the component 23 can be aligned so as to be connected to each of the first lands 17 of the predetermined substrate, and the four corners of the component 23 are the predetermined of the circuit board 2. It is possible to simultaneously and promptly perform both pass / fail judgments as to whether or not the positioning is performed so as to be within the range.

  FIG. 10 is a plan view of the circuit board 2 constituting the electronic circuit module 1 shown in FIG. On this circuit board 2, the recognition mark 10c of the modified example 2 of the first embodiment of the present invention is mounted. The circuit board 2 further includes a mounting structure for mounting the component 23. The mounting structure includes a first land 17 electrically connected to each of the connection terminals 21 of the component 23, and a fixed terminal of the component 23. 22 includes a second land 18 that is connected to 22 and increases the mounting strength of the component 23.

  This mounting structure may further include lands 31 and 32 for mounting the uppermost wiring layer 33 and other electronic components 30. Each of the recognition mark 10 c, the first land 17, the second land 18, and the lands 31 and 32 can be configured by the same layer as the uppermost wiring layer 33. When the mounting structure is a via hole, the recognition mark 10c may also be formed by a via hole.

  Next, a method for manufacturing the circuit board 2 shown in FIG. 10 will be described. This manufacturing method includes a preparation step of preparing a substrate. This substrate may be a multilayer wiring substrate in which a multilayer wiring layer is already formed.

  Subsequently, in the mounting structure forming step, a mounting structure including the first land 17 and the second land 18 is formed on the surface of the substrate. The recognition mark 10c is formed in the mark forming process, but the mark forming process is a part of the mounting structure forming process, and the recognition mark 10c and the mounting structure are preferably formed in the same layer in the same manufacturing process. .

  The recognition mark 10c, the first land 17 and the second land 18 are formed in the same layer in the same manufacturing process as that of the mounting structure including the first land 17 and the second land 18. The mutual positional relationship with the land 18 can be accurately formed as designed.

  Therefore, when the four corners of the circuit board 2 are aligned with the position of the recognition mark 10c, as a result, the connection terminal 21 and the fixed terminal 22 are also aligned with the first land 17 and the second land 18, respectively. Become.

  The mounting structure described above may include lands 31 and 32 and an uppermost wiring layer 33 for mounting other electronic components. In this case, in addition to the recognition mark 10c, the first land 17 and the second land 18, the lands 31, 32 and the uppermost wiring layer 33 can be formed in the same layer in the same manufacturing process.

  Further, the mark forming step may include a conductive layer forming step of forming a conductive layer for the uppermost wiring layer 33 on the substrate. Further, the conductive layer is patterned to form the mounting structure including the lands 31 and 32 and the uppermost wiring layer 33, the first land 17 and the second land 18, and the recognition mark 10c at the same time. And a process.

  FIG. 13 is a plan view of a circuit board on which a recognition mark according to the second embodiment of the present invention is mounted. In the present embodiment, the recognition mark 10a for detecting the displacement in the first direction x and the recognition mark 10b for detecting the displacement in the second direction y are arranged at different positions.

  One recognition mark 10a is arranged on each of two sides of the outer shape of the component 23 facing each other in the first direction, and the recognition mark 10b is two facing each other in the second direction of the outer shape of the component 23. One on each side.

DESCRIPTION OF SYMBOLS 1 Electronic circuit module 2 Circuit board 10a, 10b, 10c Recognition mark 11 1st part 12 2nd part 13 3rd part 14 4th part 15 5th part 16 6th part 17 1st land 18 Second land 20 External shape 21 Connection terminal 22 Fixed terminal 23 Component 30 Electronic component 31, 32 Land 33 Top layer wiring layer dW Position shift amount S1 First interval S2 Second interval W1 First width W2 Second width x first direction y second direction

FIG. 12 is a plan view of a circuit board on which a recognition mark according to the second embodiment of the present invention is mounted. In the present embodiment, the recognition mark 10a for detecting the displacement in the first direction x and the recognition mark 10b for detecting the displacement in the second direction y are arranged at different positions.

Claims (10)

A circuit board for mounting components,
The circuit board includes a mounting structure for mounting the component, and a recognition mark disposed on the same layer as the mounting structure,
The recognition mark is disposed at a first interval along the first direction from the first part and spaced apart from the first part at a first interval and has a first width in the first direction. Including, and
Circuit board. Each of the first portion and the second portion is a quadrangle having sides parallel to a second direction orthogonal to the first direction.
The circuit board according to claim 1. The recognition mark is disposed at a second interval along the second direction from the third portion, the third portion being spaced apart from the second portion, and the second portion, And a fourth portion having a second width in the direction of 2,
Each of the third portion and the fourth portion is a quadrangle including sides parallel to the first direction.
The circuit board according to claim 2. The first part and the third part are arranged to overlap at the same position,
The circuit board according to claim 3. The second portion is a rectangle extending in the second direction with the first width;
The fourth portion is a rectangle extending in the first direction with the second width;
A part of the second part and a part of the fourth part overlap to form an L shape,
The circuit board according to claim 3 or 4.   The circuit board according to claim 1, wherein the mounting structure includes an uppermost wiring layer, and the recognition mark is formed of the uppermost wiring layer. The uppermost wiring layer includes a land connected to the connection terminal of the component.
The circuit board according to claim 6.   The circuit board according to claim 1, wherein the mounting structure includes a via hole, and the recognition mark includes the via hole. A circuit board manufacturing method for mounting a component,
Preparing a substrate;
A mounting structure forming step for forming a mounting structure for mounting the component on the substrate;
The mounting structure forming step includes a mark forming step of simultaneously forming a part of the mounting structure and a recognition mark,
The recognition mark is disposed at a first interval along the first direction from the first part and spaced apart from the first part at a first interval and has a first width in the first direction. And detecting a positional deviation amount between a part of the mounting structure and the component.
A method of manufacturing a circuit board. A part of the mounting structure is an uppermost wiring layer,
The mark forming step includes forming a conductive layer for the uppermost wiring layer on the substrate, patterning the conductive layer, and simultaneously forming the uppermost wiring layer and the recognition mark. A patterning step,
A method for manufacturing a circuit board according to claim 9.

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