CN105007680A - Thin film packaging structure - Google Patents
Thin film packaging structure Download PDFInfo
- Publication number
- CN105007680A CN105007680A CN201410319957.2A CN201410319957A CN105007680A CN 105007680 A CN105007680 A CN 105007680A CN 201410319957 A CN201410319957 A CN 201410319957A CN 105007680 A CN105007680 A CN 105007680A
- Authority
- CN
- China
- Prior art keywords
- reinforced sheet
- alignment mark
- thin
- packing structure
- film packing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010409 thin film Substances 0.000 title claims description 29
- 238000004806 packaging method and process Methods 0.000 title abstract 2
- 238000012856 packing Methods 0.000 claims description 28
- 239000000463 material Substances 0.000 claims description 14
- 238000003466 welding Methods 0.000 claims description 12
- 239000011800 void material Substances 0.000 claims description 8
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 239000011152 fibreglass Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 6
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 6
- 239000004642 Polyimide Substances 0.000 claims description 5
- -1 polyethylene terephthalate Polymers 0.000 claims description 5
- 229920001721 polyimide Polymers 0.000 claims description 5
- 239000004568 cement Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 230000003014 reinforcing effect Effects 0.000 abstract 6
- 239000000758 substrate Substances 0.000 abstract 3
- 238000010586 diagram Methods 0.000 description 5
- 230000000007 visual effect Effects 0.000 description 5
- 230000012447 hatching Effects 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004695 Polyether sulfone Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- OIFBSDVPJOWBCH-UHFFFAOYSA-N Diethyl carbonate Chemical compound CCOC(=O)OCC OIFBSDVPJOWBCH-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000012994 photoredox catalyst Substances 0.000 description 1
- 229920003208 poly(ethylene sulfide) Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Wire Bonding (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The invention provides a film packaging structure which comprises a flexible substrate, a patterned circuit layer, a reinforcing sheet and a plurality of alignment marks. The flexible substrate is provided with a first surface, a second surface, an element area positioned on the first surface and a reinforcing sheet attaching area positioned on the second surface. The patterned circuit layer is configured on the first surface and is provided with a plurality of terminals positioned in the element area. The reinforcing sheet is arranged on the reinforcing sheet attaching area and is arranged corresponding to the element area, and the predetermined attaching precision tolerance is X. The alignment marks are positioned on the flexible substrate, wherein each side of the reinforcing sheet attaching area corresponds to at least one alignment mark, and each alignment mark has a length L in a direction vertical to each side of the corresponding reinforcing sheet attaching area, and the length L is less than or equal to the attaching precision tolerance X.
Description
Technical field
The invention relates to a kind of encapsulating structure, and relate to a kind of thin-film packing structure especially.
Background technology
Along with the high development of electronic technology, electronic product is constantly weeded out the old and bring forth the new, with regard to present situation, and the products such as information, communication and consumer electronics, that is so-called 3C Product has become in electronic industry one of project the most fast of growing up.Wherein, the function corresponding to each electronic components as the medium of the connection relationship between multiple electronic components of these 3C Product inside, thus can be integrated by printed circuit board (PCB) (Printed Circuit Board).For flexible circuit board (Flexible Printed Circuit Board), its be suitable for flexure and quite frivolous, and the configuration space of these 3C Product inside can be adapted to and adjust various kenel, and be widely used among these 3C Products.
But, in response to application demand, the base material of flexible circuit board gets over thinning, for the element be arranged on flexible circuit board, such as connector (Connector), active element or passive component etc., the circuit board of thinning is compared with providing enough mechanical strengths, when being arranged on flexible circuit board for making aforesaid element or element in follow-up external connection or other application time, flexible circuit board can not produce distortion or damage, usual meeting attaches reinforced sheet in a wherein surface of flexible circuit board in the position of counter element, to strengthen the structural strength of element region.And reinforced sheet has its accuracy requirement at the sticking position of flexible base plate, generally speaking, the attaching of existing reinforced sheet does not arrange the definition of corresponding drawing, whether specification can only be met with tool microscope accuracy in measurement after attaching reinforced sheet, and cannot judge fast with visual inspection in time attaching, therefore cause overall manufacturing time to extend, and if check out that reinforced sheet position exceeds accuracy specifications, heavy industry is also needed to correct, work consuming very consuming time.
Summary of the invention
The invention provides a kind of thin-film packing structure, whether up to specificationly detect that reinforced sheet is attached at the attaching precision after flexible base plate rapidly by visual or microscope.
Thin-film packing structure of the present invention, comprises flexible base plate, patterned line layer, reinforced sheet and multiple alignment mark.Flexible base plate have first surface, relatively first surface second surface, be positioned at the element region of first surface and be positioned at the reinforced sheet adhesion zone of second surface.Patterned line layer is configured on the first surface of flexible base plate, and has multiple terminal and be positioned at element region.Reinforced sheet is configured on the reinforced sheet adhesion zone of second surface, and wherein reinforced sheet corresponds to element region configuration, and reinforced sheet has predetermined attaching accuracy tolerance is X.These alignment marks are positioned on flexible base plate, wherein each limit of reinforced sheet adhesion zone at least one alignment mark corresponding, it is L that the direction on each limit of the vertical corresponding reinforced sheet adhesion zone of each alignment mark has length, and length L is less than or equal to attaching accuracy tolerance X.
In one embodiment of this invention, the center line of each limit alignment at least one alignment mark aforementioned of above-mentioned reinforced sheet adhesion zone, and make at least one alignment mark aforementioned be specular.
In one embodiment of this invention, relative two sidelines of each above-mentioned alignment mark are parallel to each other with each limit of corresponding reinforced sheet adhesion zone.The wherein one in two sidelines of each alignment mark is positioned within reinforced sheet adhesion zone, and the another one in two sidelines of each alignment mark is positioned at outside reinforced sheet adhesion zone.
In one embodiment of this invention, any one distance to each corresponding center line in two sidelines of each above-mentioned alignment mark is D, and D is less than or equal to 1/2X.
In one embodiment of this invention, the shape of above-mentioned alignment mark comprises rectangle, ㄇ font, H type or ‖ type.
In one embodiment of this invention, above-mentioned attaching accuracy tolerance X is less than or equal to 100 microns.
In one embodiment of this invention, the material of above-mentioned alignment mark comprises insulating cement material.
In one embodiment of this invention, above-mentioned flexible base plate has welding resisting layer.Welding resisting layer local complexity patterned line layer, and expose element region.
In one embodiment of this invention, above-mentioned patterned line layer more comprises multiple to bit patterns.Each has void region to bit patterns, and these void region expose part welding resisting layer to form these alignment marks.
In one embodiment of this invention, the material of above-mentioned reinforced sheet comprises metal, FR-4 epoxy resin fiberglass, FR-5 epoxy resin fiberglass, polyethylene terephthalate or polyimides.
Based on above-mentioned, thin-film packing structure of the present invention configures reinforced sheet on the specific region (i.e. reinforced sheet adhesion zone) of flexible base plate, to strengthen the structural strength that flexible base plate is positioned at aforementioned areas, and in order to accurately contraposition be arranged in reinforced sheet adhesion zone and not exceed predetermined attaching accuracy rating when making reinforced sheet attach, flexible base plate is separately arranged multiple alignment mark and put.Specifically, when reinforced sheet is attached at reinforced sheet adhesion zone, the predetermined attaching precision of reinforced sheet is X, and each limit of reinforced sheet adhesion zone at least one alignment mark corresponding, length on the direction on each limit of the vertical corresponding reinforced sheet adhesion zone of each alignment mark is L, and length L is less than or equal to the predetermined attaching accuracy tolerance X of reinforced sheet.So for it, can by each alignment mark define when reinforced sheet attaches can deviation range (attach accuracy tolerance X) or define specification bound (± 1/2X) respectively by its relative two sidelines, not only can reduce technologic bit errors, also detect that reinforced sheet is attached at the attaching precision after flexible base plate and whether exceeds specification rapidly by visual or microscope.
For above-mentioned feature and advantage of the present invention can be become apparent, special embodiment below, and coordinate appended accompanying drawing to be described in detail below.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the thin-film packing structure of one embodiment of the invention.
Fig. 2 is the partial sectional view of thin-film packing structure along A-A hatching line of Fig. 1.
Fig. 3 is the schematic diagram of the thin-film packing structure of another embodiment of the present invention.
Fig. 4 is the partial sectional view of thin-film packing structure along B-B hatching line of Fig. 3.
[description of reference numerals]
10: element
100,100A: thin-film packing structure
110: flexible base plate
111: first surface
112: second surface
113: element region
114: reinforced sheet adhesion zone
114s: limit
115: welding resisting layer
120,120a: patterned line layer
121: terminal
122: circuit
123: to bit patterns
130: reinforced sheet
140,140a: alignment mark
141: sideline
D: distance
L: length
X: attach accuracy tolerance
Embodiment
Fig. 1 is the schematic diagram of the thin-film packing structure of one embodiment of the invention.Fig. 2 is the partial sectional view of thin-film packing structure along A-A hatching line of Fig. 1, wherein reinforced sheet 130 and reinforced sheet adhesion zone 114 overlap, and though patterned line layer 120 and element 10 are positioned at first surface 111, represent for asking clear and illustrate, therefore being illustrated in Fig. 1 with solid line.Please refer to Fig. 1 and Fig. 2, in the present embodiment, thin-film packing structure 100 comprises flexible base plate 110, patterned line layer 120, reinforced sheet 130 and multiple alignment mark 140.
Flexible base plate 110 have first surface 111, relatively first surface 111 second surface 112, be positioned at the element region 113 of first surface 111 and be positioned at the reinforced sheet adhesion zone 114 of second surface 112, typically, the material of flexible base plate 110 can comprise polyethylene terephthalate (polyethyleneterephthalate, PET), polyimides (Polyimide, PI), polyethers (polyethersulfone, PES), carbonic ether (polycarbonate, PC) or other flexible materials be applicable to.Patterned line layer 120 is configured on the first surface 111 of flexible base plate 110, and has multiple terminal 121 and be positioned at element region 113.For example, these terminals 121 can be the line terminals of similar golden finger, can joint element 10 such as connector (connector), active element or passive component etc. further.On the other hand, patterned line layer 120 also has many circuits 122, each terminal 121 that each connection is corresponding, and wherein these terminals 121 can comprise copper, nickel, gold or silver-colored with the material of these circuits 122, or other conductive metallic materials.
Reinforced sheet 130 is configured on the reinforced sheet adhesion zone 114 of second surface 112, wherein reinforced sheet 130 corresponds to element region 113 and configures, so as to avoid in the technique that element 10 and flexible base plate 110 are engaged or element 10 in follow-up external be connected or other are applied time cause the element region 113 of flexible base plate 110 be out of shape or damage.Typically, the material of reinforced sheet 130 can comprise metal, FR-4 epoxy resin fiberglass, FR-5 epoxy resin fiberglass, polyethylene terephthalate or polyimides etc., and it is X that the reinforced sheet 130 being attached at reinforced sheet adhesion zone 114 has predetermined attaching accuracy tolerance, the scope that specification bound ± 1/2X defines when that is reinforced sheet 130 is attached at reinforced sheet adhesion zone 114, can not be exceeded.On the other hand, these alignment marks 140 are positioned on flexible base plate 110, are be arranged at second surface 112 as illustrating with these alignment marks 140 at this, wherein each limit 114s of reinforced sheet adhesion zone 114 at least one alignment mark 140 corresponding.The material of alignment mark 140 is such as insulating cement material, and that is, the contraposition that alignment mark 140 not only can be used as reinforced sheet 130 is used, and reinforced sheet 130 is also more firmly attached on flexible base plate 110 by alignment mark 140.In the embodiment do not illustrated, these alignment marks 140 also can be arranged at first surface 111, and the present invention is not limited this.
In the present embodiment, it is L that the direction of each limit 114s of the reinforced sheet adhesion zone 114 of each alignment mark 140 its correspondence vertical has length, wherein length L is less than or equal to attaching accuracy tolerance X, and attaching accuracy tolerance X is such as less than or equal to 100 microns (μm).Specifically, the center line of each limit 114s alignment at least one alignment mark 140 aforementioned of reinforced sheet adhesion zone 114, and make at least one alignment mark 140 aforementioned in specular.On the other hand, relative two sidelines 141 of each alignment mark 140 are parallel to each other with each limit 114s of corresponding reinforced sheet adhesion zone 114, the wherein one in two sidelines 141 of each alignment mark 140 is positioned within reinforced sheet adhesion zone 114, and the another one in two sidelines 141 of each alignment mark 140 is positioned at outside reinforced sheet adhesion zone 114, wherein any one distance to each corresponding center line in two sidelines 141 of each alignment mark 140 is D, and D is less than or equal to 1/2X (that is attaching the half of accuracy tolerance X).In other words, when D equals 1/2X, namely two sidelines 141 of each alignment mark 140 define specification bound (namely ± 1/2X) respectively.Therefore, reinforced sheet 130 assisting by each alignment mark 140, the reinforced sheet adhesion zone 114 on flexible base plate 110 can be attached at accurately, reduce technologic bit errors, and by visual or microscope detect rapidly reinforced sheet 130 be attached at flexible base plate 110 after attaching precision whether exceed specification.Specifically, if exceed predetermined attaching accuracy tolerance toward a direction skew when reinforced sheet 130 attaches, then corresponding reinforced sheet adhesion zone 114 wherein on one side the alignment mark 140 of 114s will be reinforced sheet 130 and cover completely, the alignment mark 140 of corresponding relative another side 114s be not then reinforced sheet 130 cover and manifest completely.For example, the shape of these alignment marks 140 can comprise rectangle, ㄇ font, H type or ‖ type.In addition, flexible base plate 110 has welding resisting layer 115, wherein welding resisting layer 115 local complexity patterned line layer 120, and exposes element region 113, that is terminal 121 with element 10 not cover by welding resisting layer 115.
Fig. 3 is the schematic diagram of the thin-film packing structure of another embodiment of the present invention.Fig. 4 is the partial sectional view of thin-film packing structure along B-B hatching line of Fig. 3.Please refer to Fig. 3 and 4, in the present embodiment, thin-film packing structure 100A and thin-film packing structure 100 different be in, patterned line layer 120a more comprises multiple to bit patterns 123, wherein each has void region respectively to bit patterns 123, and these void region expose part welding resisting layer 115 to form these alignment marks 140a.That is, these alignment marks 140a is not formed on second surface 112 with insulating cement material, but void region is formed on patterned line layer 120a, and utilize the color of welding resisting layer 115 of the translucent characteristic of flexible base plate 110 and coverage diagram patterning line layer 120a, make the welding resisting layer 115 being positioned at void region form visual pattern on the second surface 112 of flexible base plate 110.Specifically, the alignment mode of reinforced sheet 130 and alignment mark 140a, alignment mark 140a with attach the relative scale of accuracy tolerance X and attach other conditions such as accuracy tolerance X and limit, can refer to the explanation of above-described embodiment, do not repeat in this.
In sum, thin-film packing structure of the present invention configures reinforced sheet on the specific region (i.e. reinforced sheet adhesion zone) of flexible base plate, to strengthen the structural strength that flexible base plate is positioned at aforementioned areas, and in order to accurately contraposition be arranged in reinforced sheet adhesion zone and not exceed predetermined attaching accuracy rating when making reinforced sheet attach, flexible base plate separately arranges multiple alignment mark.Specifically, when reinforced sheet is attached at reinforced sheet adhesion zone, the predetermined attaching precision of reinforced sheet is X, and each limit of reinforced sheet adhesion zone at least one alignment mark corresponding, length on the direction on each limit of the vertical corresponding reinforced sheet adhesion zone of each alignment mark is L, and length L is less than or equal to the predetermined attaching accuracy tolerance X of reinforced sheet.So for it, can by each alignment mark define when reinforced sheet attaches can deviation range (attach accuracy tolerance X) or define specification bound (± 1/2X) respectively by its relative two sidelines, not only can reduce technologic bit errors, also detect that reinforced sheet is attached at the attaching precision after flexible base plate and whether exceeds specification rapidly by visual or microscope.
Although the present invention discloses as above with embodiment; so itself and be not used to limit the present invention; have in any art and usually know the knowledgeable; without departing from the spirit and scope of the present invention; when doing a little change and retouching, therefore protection scope of the present invention is when being as the criterion depending on those as defined in claim.
Claims (10)
1. a thin-film packing structure, is characterized in that, comprising:
Flexible base plate, the second surface with first surface, relatively this first surface, the element region being positioned at this first surface and be positioned at the reinforced sheet adhesion zone of this second surface;
Patterned line layer, is configured on this first surface of this flexible base plate, and has multiple terminal and be positioned at this element region;
Reinforced sheet, is configured on this reinforced sheet adhesion zone of this second surface, and wherein this reinforced sheet corresponds to the configuration of this element region, and this reinforced sheet has predetermined attaching accuracy tolerance is X; And
Multiple alignment mark, be positioned on this flexible base plate, the wherein corresponding at least one the plurality of alignment mark in each limit of this reinforced sheet adhesion zone, it is L that the direction on each limit of vertical this corresponding reinforced sheet adhesion zone of each the plurality of alignment mark has length, and this length L is less than or equal to this attaching accuracy tolerance X.
2. thin-film packing structure as claimed in claim 1, is characterized in that, the center line of at least one the plurality of alignment mark of each limit alignment of this reinforced sheet adhesion zone, and makes at least one the plurality of alignment mark be specular.
3. thin-film packing structure as claimed in claim 2, it is characterized in that, respectively relative two sidelines of this alignment mark are parallel to each other with each limit of this corresponding reinforced sheet adhesion zone, respectively the wherein one in this two sideline of this alignment mark is positioned within this reinforced sheet adhesion zone, and respectively the another one in this two sideline of this alignment mark is positioned at outside this reinforced sheet adhesion zone.
4. thin-film packing structure as claimed in claim 3, is characterized in that, respectively any one distance to corresponding respectively this center line in this two sideline of this alignment mark is D, and D is less than or equal to 1/2X.
5. thin-film packing structure as claimed in claim 1, it is characterized in that, the shape of the plurality of alignment mark comprises rectangle, ㄇ font, H type or ‖ type.
6. thin-film packing structure as claimed in claim 1, it is characterized in that, this attaching accuracy tolerance X is less than or equal to 100 microns.
7. thin-film packing structure as claimed in claim 1, it is characterized in that, the material of the plurality of alignment mark comprises insulating cement material.
8. thin-film packing structure as claimed in claim 1, it is characterized in that, this flexible base plate has welding resisting layer, this patterned line layer of local complexity, and exposes this element region.
9. thin-film packing structure as claimed in claim 8, it is characterized in that, this patterned line layer more comprises multiple to bit patterns, and respectively this has void region to bit patterns, and the plurality of void region exposes this welding resisting layer of part to form the plurality of alignment mark.
10. thin-film packing structure as claimed in claim 1, it is characterized in that, the material of this reinforced sheet comprises metal, FR-4 epoxy resin fiberglass, FR-5 epoxy resin fiberglass, polyethylene terephthalate or polyimides.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103114052A TWI491333B (en) | 2014-04-17 | 2014-04-17 | Film package structure |
| TW103114052 | 2014-04-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105007680A true CN105007680A (en) | 2015-10-28 |
Family
ID=54151542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410319957.2A Pending CN105007680A (en) | 2014-04-17 | 2014-07-07 | Thin film packaging structure |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN105007680A (en) |
| TW (1) | TWI491333B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113316305A (en) * | 2020-02-26 | 2021-08-27 | 颀邦科技股份有限公司 | Flexible circuit board |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI715492B (en) * | 2020-05-08 | 2021-01-01 | 頎邦科技股份有限公司 | Circuit board |
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| KR20210109445A (en) * | 2020-02-26 | 2021-09-06 | 칩본드 테크놀러지 코포레이션 | Flexible circuit board |
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Also Published As
| Publication number | Publication date |
|---|---|
| TWI491333B (en) | 2015-07-01 |
| TW201542059A (en) | 2015-11-01 |
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