CN111225499A - Local mixed-voltage circuit board structure and manufacturing method thereof - Google Patents
Local mixed-voltage circuit board structure and manufacturing method thereof Download PDFInfo
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- CN111225499A CN111225499A CN201811428299.5A CN201811428299A CN111225499A CN 111225499 A CN111225499 A CN 111225499A CN 201811428299 A CN201811428299 A CN 201811428299A CN 111225499 A CN111225499 A CN 111225499A
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- groove
- board
- opening
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- circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/048—Second PCB mounted on first PCB by inserting in window or holes of the first PCB
Abstract
A local mixed-voltage circuit board structure, comprising: the PCB motherboard comprises a plurality of circuit substrates, a groove for accommodating the PCB daughter board is formed in the PCB motherboard, and the width of the groove is gradually reduced from the opening to the bottom surface of the groove. In addition, the invention also provides a manufacturing method of the local mixed-compression circuit board structure. Therefore, the embedding efficiency of the printed circuit board daughter board is improved, and meanwhile, the embedding precision is guaranteed due to the fact that the size of the bottom surface of the groove is matched with that of the bottom surface of the daughter board.
Description
Technical Field
The present disclosure relates to circuit board structures and methods for fabricating the same, and particularly to a local mixed-voltage circuit board structure and a method for fabricating the same.
Background
In the conventional PCB design process, if high frequency signals need to be transmitted, high frequency materials are usually selected. For example, high frequency materials may be used for various layers of the circuit board, for local layers, or for local areas. The products using high frequency materials are expensive, and the industry usually adopts the production method of embedding high frequency materials in local areas. The local area embedding of the high frequency material typically includes direct embedding and pinning.
When the direct embedding mode is adopted, the size of the daughter board is required to be smaller than the size of the opening of the mother board. The alignment precision can be ensured by the fact that the size of the opening of the mother board is 25 micrometers larger than that of the single side of the daughter board, but embedding operation is very difficult (even cannot be achieved), and efficiency is low. When the size of the opening of the mother board is 100 micrometers larger than the single side of the daughter board, the problem of embedding operation efficiency can be effectively improved, but the dislocation risk exists; when the pin is used for positioning, corresponding positioning holes need to be formed in waste material areas of the mother board and the daughter boards. Along with the meticulous short and small design of PCB, the design of this kind of locating hole can only sacrifice the typesetting utilization ratio and just can realize, and this makes manufacturing cost promote, if when designing different products moreover, the locating hole position is inconsistent, leads to the pressfitting to use different steel sheet tools, and production efficiency is low and with high costs like this.
Disclosure of Invention
Accordingly, there is a need for a local mixed-voltage circuit board structure and a method for fabricating the same.
A local mixed-voltage circuit board structure, comprising:
the printed circuit board motherboard comprises a plurality of circuit substrates and a glue layer connected between two adjacent circuit substrates.
The printed circuit board motherboard is provided with a groove, the groove extends inwards along one of the circuit substrate directions on the outermost layer, so that an opening is formed on the circuit substrate, the groove is also provided with a groove bottom surface opposite to the opening and an inner wall connected between the groove bottom surface and the opening.
The width of the groove along the direction parallel to the motherboard of the printed circuit board is gradually reduced from the opening to the bottom surface of the groove.
The printed circuit board daughter board is accommodated in the groove and comprises a daughter board bottom surface and a daughter board side surface surrounding the daughter board bottom surface.
The width of the opening is larger than that of the bottom surface of the daughter board, and the width of the bottom surface of the groove is 1-100 micrometers larger than that of the bottom surface of the daughter board. The bottom surface of the daughter board is in contact with the bottom surface of the groove, a gap is arranged between the inner wall and the side surface of the daughter board, and the part communicated with the gap is filled with the glue layer, so that the printed circuit board daughter board is fixed on the printed circuit board mother board.
Further, the bottom surface of the groove is sealed by one of the adhesive layers, so that the bottom surface of the daughter board is fixed to the bottom surface of the groove through the adhesive layer.
Further, the inner wall is a plane, and the width of the groove decreases linearly along the direction from the opening to the bottom surface of the groove.
Further, the width of the bottom surface of the groove is 50 μm larger than that of the bottom surface of the sub-board, and the distances between the opposite sides of the bottom surface of the sub-board and the inner wall are the same.
Furthermore, the groove and each circuit substrate are respectively provided with a groove part at the corresponding position, the width of the groove part is linearly reduced along the direction from the opening to the bottom surface of the groove, and the ratio t between the average width of the groove part close to the opening and the average width of the groove part far away from the opening in two adjacent groove parts satisfies the following relation;
wherein t and L1 satisfy the following relationship:
1<t<(L1+100μm)/L1
further, the t satisfies the following relationship:
t＝(L1+50μm)/L1
further, the inner wall of the groove is a stepped surface, thereby dividing the groove into a plurality of groove portions, the width of which is gradually reduced by 1 μm to 100 μm in a direction from the opening to the bottom surface of the groove.
Further, the width of the groove portion decreases by 50 μm in order from the opening to the groove bottom surface.
A manufacturing method of a local mixed-compression circuit board structure comprises the following steps:
the method comprises the steps of providing a printed circuit board mother board and a printed circuit board daughter board, wherein the printed circuit board mother board comprises a plurality of circuit substrates and a glue layer connected between every two adjacent circuit substrates, and the printed circuit board daughter board comprises a daughter board bottom surface and a daughter board side surface surrounding the daughter board bottom surface.
And arranging a groove on the motherboard of the printed circuit board, wherein the groove extends inwards along the direction of one circuit substrate on the outermost layer, so that an opening is formed on the circuit substrate. The width of opening is greater than the width of daughter board bottom surface, the recess still have with the opening relative set up a recess bottom surface and connect in the recess bottom surface and the inner wall between the opening, the width of recess bottom surface than the width of daughter board bottom surface is 0 ~ 100 mu m big, just the recess along being on a parallel with the width of the direction of printed circuit board mother board from the opening to the direction of recess bottom surface reduces gradually.
And arranging the printed circuit board daughter board in the groove through the opening, so that the bottom surface of the daughter board is in contact with the bottom surface of the groove, and a gap is formed between the inner wall and the side surface of the daughter board, thereby obtaining an intermediate body.
And pressing the intermediate body, so that part of the adhesive layer communicated with the gap flows to be filled in the gap, thereby obtaining the local mixed-compression circuit board structure.
Further, the grooves are formed by means of mechanical drilling.
According to the local mixed-compression circuit board structure and the manufacturing method thereof, the groove for accommodating the printed circuit board daughter board is formed in the printed circuit board mother board, the width of the groove is gradually reduced from the opening to the bottom surface of the groove, namely, the opening at the upper end is large, and the bottom surface of the groove is small, so that the embedding efficiency of the printed circuit board daughter board is improved, and meanwhile, the embedding precision is guaranteed due to the fact that the size of the bottom surface of the groove is matched with that of the bottom surface of the daughter board.
Drawings
Fig. 1 is a schematic perspective view of a local mixed-voltage circuit board structure according to an embodiment of the present invention.
Fig. 2 is a schematic cross-sectional view of the structure of the partial pressure-mixing circuit board shown in fig. 1 along II-II.
Fig. 3 is a schematic cross-sectional view of a local mixed-voltage circuit board structure according to another embodiment of the invention.
Fig. 4 is a flowchart of a method for manufacturing a local mixed-compression circuit board structure according to an embodiment of the present invention.
Description of the main elements
| Local mixed-voltage |
100 |
| Mother board of printed |
10 |
| |
11 |
| |
11a |
| Insulating layer | |
| Glue layer | |
| 12 | |
| |
13 |
| Opening of the |
13b |
| Bottom surface of the |
13a |
| |
13c、13c’ |
| |
130 |
| Printed circuit |
20 |
| Bottom surface of |
21 |
| |
22 |
| |
30 |
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Some embodiments of the invention are described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.
Referring to fig. 1 to 4, a local mixed-compression circuit board structure 100 according to a preferred embodiment of the present invention includes a printed circuit board motherboard 10, where the printed circuit board motherboard 10 includes a plurality of circuit substrates 11, and the circuit substrates 11 are bonded by an adhesive layer 12.
The circuit substrate 11 forms the basis of the motherboard 10 of the printed circuit board, and comprises two circuit layers 11a and an insulating layer 11b between the two circuit layers 11a, wherein the circuit layers 11a are made of copper, and the different circuit layers 11a are electrically connected through a conductive part (not shown); wherein the paste layer 12 serves as an adhesive material and an interlayer insulating material between the plurality of wiring layers 11a of the printed circuit board motherboard 10.
The insulating layer 11b of the circuit substrate 11 may be made of a common substrate material such as epoxy resin and phenolic resin, or a high-frequency substrate material such as polytetrafluoroethylene resin, and in this embodiment, epoxy resin is selected.
The material of the adhesive layer 12 is a viscous resin, and more specifically, the resin may be at least one selected from polypropylene, epoxy resin, polyurethane, phenolic resin, urea resin, melamine-formaldehyde resin, polyimide, and the like.
Preferably, the pcb motherboard 10 in this embodiment includes six circuit boards 11 and five adhesive layers 12, and in other embodiments, the number of the circuit boards 11 and the number of the adhesive layers 12 may be changed according to actual requirements.
Referring to fig. 2-3, the motherboard 10 of the pcb is provided with a groove 13, the groove 13 extends inward along one of the outermost circuit substrates 11, so as to form an opening 13b on the circuit substrate 11, and the groove 13 further has a groove bottom 13a opposite to the opening 13 b. The groove bottom surface 13a and the opening 13b are parallel to the extending direction of the printed circuit board motherboard 10. The groove 13 is used for accommodating a printed circuit board daughter board 20, and the printed circuit board daughter board 20 is square and has a daughter board bottom surface 21 and a daughter board side surface 22 perpendicular to the daughter board bottom surface 21. Wherein the daughter board bottom surface 21 is in contact with the groove bottom surface 13 a.
Further, the size of the opening 13b is larger than the size of the daughter board bottom surface 21, thereby facilitating the accommodation of the printed circuit board daughter board 20 in the recess 13. The shape of the opening 13b may be similar to the shape of the daughter board bottom surface 21. The depth of the recess 13 may be substantially the same as the height of the printed circuit board daughter board 20. Preferably, the depth of the groove 13 is substantially equal to the total thickness of the three circuit boards 11 and the two glue layers 12, so that the groove bottom surface 13a is closed by the other glue layer 12, and the daughter board bottom surface 21 is fixed to the groove bottom surface 13a by the glue layer 12.
Specifically, as shown in fig. 2, the groove 13 has a substantially trapezoidal cross section, i.e., the width of the groove bottom surface 13a is smaller than the width of the opening 13 b. Wherein the width of the groove bottom surface 13a is L1, and the depth of the groove 13 is H1. Wherein the groove 13 is further provided with an inner wall 13c connected between the groove bottom surface 13a and the opening 13 b. The inner wall 13c is a plane, that is, the width of the groove 13 in a direction parallel to the printed circuit board motherboard 10 decreases linearly in a direction from the opening 13b to the groove bottom surface 13 a.
Further, the width of the daughter board bottom surface 21 is L2, and the height of the printed circuit board daughter board 20 is H2. Wherein the difference between the width of the groove bottom surface 13a and the width of the daughter board bottom surface 21 is S.
H1, H2, L1, L2 and S satisfy the following relationships:
H1＝H2；
L1＝L2+S,0μm≤S≤100μm。
preferably, the difference between the width of the groove bottom surface 13a and the width of the daughter board bottom surface 21 is 50 μm, and the distances between the opposite sides of the daughter board bottom surface 21 and the inner wall 13c are the same.
Further, the groove 13 is formed with a groove portion 130 at a position corresponding to each circuit substrate 11, as shown in fig. 2, the groove 13 includes three groove portions 130. Each groove portion 130 is also generally trapezoidal in cross-section. The width of the groove portion 130 is linearly decreased in a direction from the opening 13b to the groove bottom surface 13a, that is, the groove portion 130 positioned at the outermost side is the largest in width, and the groove portion 130 positioned at the innermost side is the smallest in width. Of each adjacent two groove portions 130, a ratio t between an average width of the groove portion 130 close to the opening 13b and an average width of the groove portion 130 far from the opening 13b satisfies the following relationship:
1<t<(L1+100μm)/L1。
preferably, t ═ (L1+50 μm)/L1.
A gap 30 is formed between the daughter board side surface 22 and the inner wall 13c, and a portion of the adhesive layer 12 communicating with the gap 30 flows to fill the gap 30.
Further, the substrate material of the printed circuit board daughter board 20 is a high frequency substrate material, such as teflon resin.
In another preferred embodiment of the present invention, as shown in fig. 3, the inner wall 13 c' of the groove 13 is a stepped surface, i.e., the cross section of each groove portion 130 is substantially square. The width of the groove portion 130 is gradually reduced in a direction from the opening 13b to the groove bottom surface 13a, that is, the groove portion 130 located at the outermost side has the largest width, and the groove portion 130 located at the innermost side has the smallest width. In the present embodiment, the width of the groove portion 130 close to the opening 13b is reduced by 1 μm to 100 μm from the width of the groove portion 130 far from the opening 13b, of every adjacent two groove portions 130. Preferably, the width of the groove portion 130 near the opening 13b is reduced by 50 μm from the width of the groove portion 130 far from the opening 13 b.
Referring to fig. 4, a method for manufacturing a local mixed-compression circuit board structure 100 includes the following steps:
s1, providing a printed circuit board mother board 10 and a printed circuit board daughter board 20, wherein the printed circuit board mother board 10 comprises a plurality of circuit substrates 11, two adjacent circuit substrates 11 are bonded through an adhesive layer 12, and the adhesive layer 12 can be in a semi-curing state;
s2, forming a groove 13 on the motherboard 10 of the printed circuit board, wherein the groove 13 extends inwards along one of the circuit substrates 11 at the outermost layer, so as to form an opening 13b on the circuit substrate 11, the groove 13 is also provided with a groove bottom surface 13a opposite to the opening 13b, and the size of the opening 13b is larger than that of the daughter board bottom surface 21;
s3, placing the pcb daughter board 20 into the recess 13 through the opening 13b, so that a gap 30 is formed between the daughter board side surface 22 and the inner wall 13c, thereby obtaining an intermediate body (not shown);
and S4, pressing the intermediate body to enable the part of the adhesive layer 12 communicated with the gap 30 to flow and fill in the gap 30, thereby obtaining the local mixed-compression circuit board structure 100.
Specifically, the printed circuit board mother board 10 and the printed circuit board daughter board 20 in step S1 are manufactured through steps including cutting, copper reduction, coating/baking, exposure, etching, line width measurement, punching, optical inspection, browning, and the like.
In step S2, the grooves 13 are formed by mechanical punching. The depth of the groove 13 may be substantially the same as the height of the pcb sub-board 20, and preferably, the depth of the groove 13 is substantially equal to the total thickness of three circuit boards 11 and two glue layers 12, so that the groove bottom surface 13a is closed by another glue layer 12.
The invention provides a local mixed-compression circuit board structure and a manufacturing method thereof.A groove for accommodating a printed circuit board daughter board is formed on a printed circuit board mother board, and the width of the groove is gradually reduced from the opening to the bottom surface of the groove, namely, the opening at the upper end is large and the bottom surface of the groove is small, so that the embedding efficiency of the printed circuit board daughter board is improved, and meanwhile, the size of the opening at the lower end is matched with that of the daughter board, so that the embedding precision is ensured.
Although the present invention has been described with reference to the above preferred embodiments, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. A kind of local mixed-compression circuit board structure, characterized by that, including:
the printed circuit board motherboard comprises a plurality of circuit substrates and a glue layer connected between two adjacent circuit substrates, the printed circuit board motherboard is provided with a groove, the groove extends inwards along one of the outermost circuit substrates, so that an opening is formed on the circuit substrate, the groove is also provided with a groove bottom surface opposite to the opening and an inner wall connected between the groove bottom surface and the opening, and the width of the groove along the direction parallel to the printed circuit board motherboard is gradually reduced from the opening to the groove bottom surface; and
the printed circuit board daughter board is accommodated in the groove and comprises a daughter board bottom surface and a daughter board side surface surrounding the daughter board bottom surface, the width of the opening is larger than that of the daughter board bottom surface, the width of the groove bottom surface is 0-100 mu m larger than that of the daughter board bottom surface, the daughter board bottom surface is in contact with the groove bottom surface, a gap is arranged between the inner wall and the daughter board side surface, and part of the adhesive layer communicated with the gap is filled in the gap, so that the printed circuit board daughter board is fixed on the printed circuit board mother board.
2. The structure of claim 1, wherein the bottom surface of the cavity is sealed by one of the adhesive layers, such that the bottom surface of the daughter board is fixed to the bottom surface of the cavity by the adhesive layer.
3. The structure of claim 1, wherein the inner wall is a plane, and the width of the groove decreases linearly along a direction from the opening to the bottom surface of the groove.
4. The structure of claim 3, wherein the width of the bottom surface of the groove is 50 μm larger than the width of the bottom surface of the sub-board, and the distance between the two opposite sides of the bottom surface of the sub-board and the inner wall is the same.
5. The structure of claim 3, wherein the groove and each of the circuit boards are formed with a groove portion, the width of the groove portion decreases linearly along a direction from the opening to the bottom surface of the groove, and a ratio t between an average width of the groove portion near the opening and an average width of the groove portion far from the opening in two adjacent groove portions satisfies the following relationship:
1< t < (L1+100 μm)/L1; wherein L1 is the width of the groove bottom surface.
6. The structure of claim 5, wherein the ratio t satisfies the following relationship:
t＝(L1+50μm)/L1。
7. the structure of claim 1, wherein the inner wall of the groove is a stepped surface, a groove portion is formed at a position of the groove corresponding to each circuit substrate, and the width of the groove portion near the opening is gradually reduced by 1 μm to 100 μm from the width of the groove portion far from the opening in every two adjacent groove portions.
8. The structure of claim 7, wherein the width of the groove portion decreases by 50 μm in sequence from the opening to the bottom surface of the groove.
9. A manufacturing method of a local mixed-compression circuit board structure is characterized by comprising the following steps:
providing a printed circuit board mother board and a circuit board daughter board, wherein the printed circuit board mother board comprises a plurality of circuit substrates and a glue layer connected between two adjacent circuit substrates, and the printed circuit board daughter board comprises a daughter board bottom surface and a daughter board side surface surrounding the daughter board bottom surface;
forming a groove on the mother board of the printed circuit board, wherein the groove extends inwards along the direction of one circuit substrate on the outermost layer, so that an opening is formed on the circuit substrate, the width of the opening is greater than that of the bottom surface of the daughter board, the groove is also provided with a groove bottom surface opposite to the opening and an inner wall connected between the groove bottom surface and the opening, the width of the groove bottom surface is 0-100 mu m greater than that of the daughter board bottom surface, and the width of the groove along the direction parallel to the mother board of the printed circuit board is gradually reduced from the opening to the groove bottom surface;
placing the printed circuit board daughter board in the groove through the opening, so that the bottom surface of the daughter board is in contact with the bottom surface of the groove, and a gap is formed between the inner wall and the side surface of the daughter board, thereby obtaining an intermediate body; and
and pressing the intermediate body, so that part of the adhesive layer communicated with the gap flows to be filled in the gap, thereby obtaining the local mixed-compression circuit board structure.
10. The method of claim 9, wherein the grooves are formed by mechanical drilling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811428299.5A CN111225499A (en) | 2018-11-27 | 2018-11-27 | Local mixed-voltage circuit board structure and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811428299.5A CN111225499A (en) | 2018-11-27 | 2018-11-27 | Local mixed-voltage circuit board structure and manufacturing method thereof |
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| CN111225499A true CN111225499A (en) | 2020-06-02 |
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|---|---|---|---|
| CN201811428299.5A Pending CN111225499A (en) | 2018-11-27 | 2018-11-27 | Local mixed-voltage circuit board structure and manufacturing method thereof |
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Cited By (1)
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| CN112739066A (en) * | 2020-12-11 | 2021-04-30 | 锐捷网络股份有限公司 | PCB and manufacturing method thereof |
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Application publication date: 20200602 |