CN112739066A - PCB and manufacturing method thereof - Google Patents
PCB and manufacturing method thereof Download PDFInfo
- Publication number
- CN112739066A CN112739066A CN202011456215.6A CN202011456215A CN112739066A CN 112739066 A CN112739066 A CN 112739066A CN 202011456215 A CN202011456215 A CN 202011456215A CN 112739066 A CN112739066 A CN 112739066A
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- board
- daughter board
- pcb
- hole
- via hole
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The embodiment of the invention provides a PCB and a manufacturing method thereof, wherein drilling operation is carried out at least one set position of a groove for placing a daughter board on a mainboard, a first through hole is determined, drilling operation is carried out at the position of the daughter board corresponding to the first through hole, a second through hole is determined, a filling medium is coated at the position of the groove of the mainboard, and conductive adhesive is coated at the position of the first through hole, wherein the filling medium is an insulating material, the mainboard and the daughter board are pressed.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a PCB and a manufacturing method thereof.
Background
With the development of the technology, in the technical field of Circuit Board manufacturing, more and more electronic devices are integrated on a Printed Circuit Board (PCB), and the requirement on the manufacturing process of the PCB is higher and higher. However, the operation of drilling the laminated PCB is very difficult, the technical requirement is high, and the drilling success rate is low.
Disclosure of Invention
The embodiment of the invention provides a PCB and a manufacturing method thereof, which are used for solving the problems of difficult operation, high technical requirement and low drilling success rate in the conventional drilling technology for drilling the laminated PCB.
The embodiment of the invention provides a method for manufacturing a Printed Circuit Board (PCB), which comprises the following steps:
drilling at least one set position of a groove for placing a daughter board on a mainboard to determine a first via hole, and drilling at a position of the daughter board corresponding to the first via hole to determine a second via hole;
coating a filling medium at the groove of the mainboard, and coating a conductive adhesive at the position of the first via hole, wherein the filling medium is an insulating material;
and pressing the main board and the daughter board.
Further, the coating of the conductive paste at the position of the first via hole includes:
and drilling holes at the positions, corresponding to the first via holes, of the filling medium, and coating conductive adhesive.
Furthermore, the main board is made of a high-speed material, and the sub-boards are made of a Polytetrafluoroethylene (PTFE) material.
Further, the filling medium is a prepreg PP filling medium.
The embodiment of the invention also provides a PCB manufactured by the manufacturing method based on any one of the methods, and the PCB comprises: mainboard and daughter board, wherein: a groove corresponding to the size of the daughter board is formed in the main board, and a first through hole is formed in at least one set position of the groove;
the daughter board is pressed in the groove of the mainboard through a filling medium, and a second through hole is arranged at the position of the daughter board corresponding to each first through hole, wherein the filling medium is an insulating material;
and the pressing part of the first via hole and the second via hole is coated with conductive adhesive.
Further, the sub-board further includes: a set number of ground lines;
the ground wires with the set number are positioned on one surface, pressed by the daughter board and the mainboard, of the daughter board.
Further, the set number of ground wires are coated with copper.
Furthermore, ink is coated on the other areas except the ground wire on the surface where the daughter board and the main board are pressed.
Further, the second via hole is plugged by resin.
Further, the daughter board has at least two positioning holes.
In the embodiment of the invention, the daughter board and the mainboard are independently drilled and are interconnected by using the conductive adhesive, so that the difficulty in drilling operation after lamination is avoided, and the drilling success rate is improved.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.
Fig. 1 is a schematic flow chart of a method for manufacturing a PCB according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a PCB apparatus according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a motherboard and daughter board interconnection technique according to an embodiment of the present invention;
fig. 4 is a schematic flow chart of conductive paste printing according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in further detail with reference to the accompanying drawings, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In order to improve the drilling success rate of the PCB formed by lamination, the embodiment of the invention provides the PCB and the manufacturing method thereof.
Example 1:
fig. 1 is a schematic flow chart of a method for manufacturing a PCB according to an embodiment of the present invention, where the process includes:
s101: and drilling at least one set position of the main board groove to determine a first via hole, and drilling at a position of the daughter board corresponding to the first via hole to determine a second via hole.
The embodiment of the invention is applied to the PCB formed by pressing the main board and the sub-board, in particular to the PCB of which the main board is made of high-speed material and the sub-board is made of Polytetrafluoroethylene (PTFE).
In the embodiment of the invention, the groove of the main board is used for placing the daughter board, so that the main board and the daughter board are pressed together, and drilling operation is carried out at least at one set position of the groove of the main board to obtain at least one corresponding first through hole. And the daughter board can be pressfitting to the recess department of mainboard, but only the pressfitting, mainboard and daughter board can not be conducted, consequently need be with the help of the via hole, realize that the circuit of mainboard and daughter board switches on. After drilling at least one set position of the groove of the main board, drilling operation is also carried out at the position of the sub-board corresponding to the first via hole, and a second via hole is determined.
S102: and coating a filling medium at the groove of the main board, and coating a conductive adhesive at the position of the first via hole, wherein the filling medium is an insulating material.
In the embodiment of the invention, when the main board and the daughter board are pressed, the main board and the daughter board are required to be pressed through the filling medium, the filling medium is positioned at the pressing part of the main board and the daughter board, the main board and the daughter board are prevented from being directly contacted, and meanwhile, the filling medium has good insulating property.
Specifically, in the embodiment of the present invention, a hole is drilled in at least one set position of a groove of a motherboard, after a first via hole is determined, a filling medium is coated in the groove of the motherboard, and after the filling medium is coated, a conductive adhesive is coated in the position of the first via hole.
S103: and pressing the main board and the daughter board.
In the embodiment of the invention, the processed main board and the processed daughter board are pressed together to obtain the manufactured PCB.
According to the embodiment of the invention, the daughter board and the mainboard are independently drilled, and the interconnection is realized by using the conductive adhesive, so that the difficulty in drilling after lamination is avoided, and the drilling success rate is improved.
Example 2:
in order to improve the drilling success rate of the PCB formed by lamination, on the basis of the above embodiment, in an embodiment of the present invention, the coating of the conductive paste at the position of the first via hole includes:
and drilling holes at the positions, corresponding to the first via holes, of the filling medium, and coating conductive adhesive.
In the embodiment of the present invention, after the filling medium is coated at the groove of the motherboard, since the filling medium is also coated above the first via of the groove during coating, the filling medium on the first via needs to be removed. Namely, the position of the filling medium corresponding to the first via hole is drilled, wherein the drilling of the corresponding position of the first via hole can be realized by adopting a laser drilling technology.
In order to realize the circuit conduction of the main board and the daughter board, in the embodiment of the present invention, after the filling medium is drilled, the first via hole is coated with a conductive adhesive, so as to realize the circuit conduction of the main board and the daughter board.
In order to improve the drilling success rate of the PCB formed by pressing, on the basis of the above embodiments, in the embodiment of the present invention, the main board is made of a high-speed material, and the sub-board is made of Polytetrafluoroethylene (PTFE).
In the embodiment of the invention, because the difference between the material characteristics of the PTFE and the high-speed material is large, such as large thermal expansion coefficient, low hardness of the PTFE, soft material and poor adhesion of copper foil, the failure rate is extremely high when the PCB is drilled after the main board and the sub-board are pressed together. At the moment, the main board and the daughter boards can be drilled respectively, and then the main board and the daughter boards are pressed together, so that the success rate of PCB drilling is improved.
In order to improve the drilling success rate of the PCB formed by lamination, on the basis of the above embodiments, in the embodiment of the present invention, the filling medium is a prepreg (PP) filling medium.
In the embodiment of the present invention, in order to avoid direct contact between the motherboard and the daughter board, before the motherboard and the daughter board are pressed, a filling medium needs to be coated at the groove of the motherboard to achieve an insulating effect. In the embodiment of the present invention, the filling medium is a PP filling medium.
Example 3:
fig. 2 is a schematic diagram of an apparatus of a PCB according to an embodiment of the present invention, where the PCB includes: main board 101 and sub board 102:
the main board is provided with a groove corresponding to the size of the daughter board, and at least one set position of the groove is provided with a first through hole;
the daughter board is pressed in the groove of the mainboard through a filling medium, and a second through hole is arranged at the position of the daughter board corresponding to each first through hole, wherein the filling medium is an insulating material;
and the pressing part of the first via hole and the second via hole is coated with conductive adhesive.
In the embodiment of the invention, the PCB comprises a main board and a sub-board, wherein the main board and the sub-board are pressed together, a groove corresponding to the size of the sub-board is formed in the main board, the groove is slightly larger than the sub-board, and the sub-board is pressed in the groove. For example, the motherboard may have a notch with a length and width that is 20 mils larger than the daughter card.
In the embodiment of the present invention, at least one set position of the groove of the motherboard has a via hole, and in order to distinguish the via hole at the set position of the groove of the motherboard from the via hole on the daughter board, in the embodiment of the present invention, the via hole at the set position of the groove of the motherboard is referred to as a first via hole.
In the embodiment of the invention, the daughter board is pressed in the groove of the mainboard through the filling medium, and the second through hole is arranged at the position of the daughter board corresponding to the first through hole of the mainboard. Meanwhile, the conductive adhesive is coated at the stitching part of the first via hole and the second via hole. The pressfitting department of the first via hole of this mainboard and the second via hole of this daughter board links to each other through conducting resin promptly to realize switching on between this PCB board mainboard and the daughter board.
The size (Drill To Meta) of the second through hole of the daughter board during drilling can be not less than 12mil, the line width of a lead inside the daughter board is not less than 8mil, the line distance is not less than 10mil, and the size of the second through hole after the daughter board is processed is 0.30mm-0.50 mm.
In the embodiment of the invention, the main board and the daughter board are respectively drilled, and then the drilled main board and the drilled daughter board are pressed together, so that the PCB is manufactured.
In the PCB formed by pressing the main board and the sub-board, the sub-board is pressed in a to-be-pressed area of the main board through a filling medium, a first through hole is arranged at a set position of the to-be-pressed area of the main board, a second through hole is arranged at a position of the sub-board corresponding to the first through hole, and a conductive adhesive is coated at the pressing position of the first through hole and the second through hole.
Example 4:
in order to improve the drilling success rate of the PCB formed by laminating the high-speed material and the polytetrafluoroethylene PTFE, on the basis of the above embodiment, in the embodiment of the present invention, the sub-board 102 further includes: a set number of ground lines;
the ground wires with the set number are positioned on one surface, pressed by the daughter board and the mainboard, of the daughter board.
When the PCB is manufactured, the interference can be controlled by a method of designing a ground wire, and if the grounding and shielding technologies can be combined, most of the interference problems can be effectively solved.
In the embodiment of the present invention, the daughter board further includes a set number of ground lines, wherein the set number of ground lines are located on a surface where the daughter board and the motherboard are pressed together.
In order to improve the drilling success rate of the PCB formed by laminating the high-speed material and the polytetrafluoroethylene PTFE, on the basis of the above embodiments, in the embodiment of the present invention, copper is coated on the ground wires in the set number.
In order to improve the drilling success rate of the PCB formed by laminating the high-speed material and the polytetrafluoroethylene PTFE, on the basis of the above embodiments, in the embodiment of the present invention, ink is coated on the surface of the sub-board 102 laminated with the main board 101, except for the ground line.
In the embodiment of the invention, one surface of the main board and the sub board is pressed, and other areas except the ground wire are coated with printing ink to realize the insulation between the main board and the sub board, so that the main board and the sub board are conducted only through the first through hole and the second through hole.
Example 5:
in order to improve the drilling success rate of the PCB formed by laminating the high-speed material and the polytetrafluoroethylene PTFE, on the basis of the above embodiments, in the embodiment of the present invention, the sub-board 102 is made of the polytetrafluoroethylene material, and the main board 101 is made of the high-speed material.
Meanwhile, in the embodiment of the invention, the daughter board is made of a polytetrafluoroethylene material, and the main board is made of a high-speed material.
Example 6:
in order to improve the drilling success rate of the PCB formed by laminating the high-speed material and the polytetrafluoroethylene PTFE, on the basis of the above embodiments, in the embodiment of the present invention, the second via hole is plugged with a resin.
In the embodiment of the invention, the second via hole of the daughter board adopts a resin plug hole, wherein the resin plug hole is formed by copper plating of the hole wall of the second via hole, then filling the hole wall with epoxy resin, and finally copper plating of the surface of the resin, and the second via hole after the resin plug hole can be conducted, but the surface has no dent.
Example 7:
in order to improve the drilling success rate of the PCB formed by laminating the high-speed material and the polytetrafluoroethylene PTFE, on the basis of the above embodiments, in the embodiment of the present invention, the daughter board has at least two positioning holes.
In the embodiment of the invention, the positioning hole has two main functions, namely, the PCB is used as a screw fixing hole when a finished product is assembled, and the positioning hole plays a role in positioning in a production flow and a test flow so as to facilitate production and test. In the embodiment of the invention, the daughter board is provided with at least two positioning holes.
Fig. 3 is a schematic diagram of a main board and a daughter board interconnection technology provided in an embodiment of the present invention, and as shown in fig. 3, in a conventional conduction scheme, a main board and a daughter board are directly pressed together and then drilled, whereas in an embodiment of the present invention, a daughter board and a main board are respectively drilled and then the main board and the daughter board are pressed together, wherein a conductive adhesive is coated between a first via hole of the main board and a second via hole of the daughter board.
Fig. 4 is a schematic flow chart of conductive paste printing according to an embodiment of the present invention, and as shown in fig. 4, a main board and a sub board are manufactured separately, where the main board includes drilling a set position of a groove of the main board, coating a filling medium at the groove of the main board, drilling a corresponding position of the sub board and a first via hole, and then performing laser drilling on the filling medium coated on the main board, where the position where the conductive paste is drilled is a position of the first via hole of the main board, where the aperture of the laser drilling is 12-15mil, and meanwhile, an 8 × 18mil hole plate is used as a lap joint plate of the conductive paste, the conductive paste is printed at the drill hole of the filling medium, and the main board and the sub board are pressed together.
As will be appreciated by one skilled in the art, embodiments of the present application may be provided as a method, system, or computer program product. Accordingly, the present application may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present application may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
The present application is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems), and computer program products according to the application. It will be understood that each flow and/or block of the flow diagrams and/or block diagrams, and combinations of flows and/or blocks in the flow diagrams and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.
Claims (10)
1. A method for manufacturing a Printed Circuit Board (PCB), the method comprising:
drilling at least one set position of a groove for placing a daughter board on a mainboard to determine a first via hole, and drilling at a position of the daughter board corresponding to the first via hole to determine a second via hole;
coating a filling medium at the groove of the mainboard, and coating a conductive adhesive at the position of the first via hole, wherein the filling medium is an insulating material;
and pressing the main board and the daughter board.
2. The method of claim 1, wherein the applying a conductive paste at the location of the first via comprises:
and drilling holes at the positions, corresponding to the first via holes, of the filling medium, and coating conductive adhesive.
3. The method of claim 1, wherein the master plate is a high speed material and the slave plates are a Polytetrafluoroethylene (PTFE) material.
4. The method of claim 1, wherein the fill media is a prepreg PP fill media.
5. A PCB manufactured based on the manufacturing method of any one of claims 1 to 4, wherein the PCB comprises: mainboard and daughter board, wherein: a groove corresponding to the size of the daughter board is formed in the main board, and a first through hole is formed in at least one set position of the groove;
the daughter board is pressed in the groove of the mainboard through a filling medium, and a second through hole is arranged at the position of the daughter board corresponding to each first through hole, wherein the filling medium is an insulating material;
and the pressing part of the first via hole and the second via hole is coated with conductive adhesive.
6. The PCB of claim 5, wherein the daughter board further comprises: a set number of ground lines;
the ground wires with the set number are positioned on one surface, pressed by the daughter board and the mainboard, of the daughter board.
7. The PCB of claim 6, wherein the set number of ground wires are coated with copper.
8. The PCB of claim 6, wherein the area of the sub-board bonded to the main board except for the ground lines is coated with ink.
9. The PCB of claim 5, wherein the second via is a resin plug hole.
10. The PCB of claim 5, wherein the daughter board presents at least two locating holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011456215.6A CN112739066A (en) | 2020-12-11 | 2020-12-11 | PCB and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011456215.6A CN112739066A (en) | 2020-12-11 | 2020-12-11 | PCB and manufacturing method thereof |
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| Publication Number | Publication Date |
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| CN112739066A true CN112739066A (en) | 2021-04-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011456215.6A Pending CN112739066A (en) | 2020-12-11 | 2020-12-11 | PCB and manufacturing method thereof |
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| CN (1) | CN112739066A (en) |
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| US20020020554A1 (en) * | 1998-02-16 | 2002-02-21 | Kazunori Sakamoto | Multi-layer circuit board and method of manufacturing the same |
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| CN104254212A (en) * | 2014-09-17 | 2014-12-31 | 广州杰赛科技股份有限公司 | Manufacturing method of circuit board |
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| CN108617097A (en) * | 2018-05-11 | 2018-10-02 | 华南理工大学 | The production method and printed circuit board of printed circuit board |
| CN109862721A (en) * | 2019-04-02 | 2019-06-07 | 东莞职业技术学院 | A kind of production method and the antenna integrated PCB of power amplifier of the antenna integrated PCB of power amplifier |
| CN111225499A (en) * | 2018-11-27 | 2020-06-02 | 庆鼎精密电子（淮安）有限公司 | Local mixed-voltage circuit board structure and manufacturing method thereof |
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2020
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020020554A1 (en) * | 1998-02-16 | 2002-02-21 | Kazunori Sakamoto | Multi-layer circuit board and method of manufacturing the same |
| CN101765343A (en) * | 2008-12-24 | 2010-06-30 | 华为技术有限公司 | Multi-layer printed circuit board and manufacturing method thereof |
| CN101848606A (en) * | 2010-04-21 | 2010-09-29 | 华为技术有限公司 | Method for manufacturing printed circuit board and printed circuit board |
| CN104254212A (en) * | 2014-09-17 | 2014-12-31 | 广州杰赛科技股份有限公司 | Manufacturing method of circuit board |
| CN106163135A (en) * | 2015-04-21 | 2016-11-23 | 深南电路股份有限公司 | A kind of partial hybrid board structure of circuit and processing method thereof |
| CN107155266A (en) * | 2017-06-20 | 2017-09-12 | 广州兴森快捷电路科技有限公司 | Z-direction interconnection line plate and preparation method thereof |
| CN108617097A (en) * | 2018-05-11 | 2018-10-02 | 华南理工大学 | The production method and printed circuit board of printed circuit board |
| CN111225499A (en) * | 2018-11-27 | 2020-06-02 | 庆鼎精密电子（淮安）有限公司 | Local mixed-voltage circuit board structure and manufacturing method thereof |
| CN109862721A (en) * | 2019-04-02 | 2019-06-07 | 东莞职业技术学院 | A kind of production method and the antenna integrated PCB of power amplifier of the antenna integrated PCB of power amplifier |
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Application publication date: 20210430 |