CN109406859B - Current detection plate and drive controller - Google Patents
Current detection plate and drive controller Download PDFInfo
- Publication number
- CN109406859B CN109406859B CN201811451290.6A CN201811451290A CN109406859B CN 109406859 B CN109406859 B CN 109406859B CN 201811451290 A CN201811451290 A CN 201811451290A CN 109406859 B CN109406859 B CN 109406859B
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- current
- trace
- substrate
- signal
- current detection
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- 238000001514 detection method Methods 0.000 title claims abstract description 80
- 239000000758 substrate Substances 0.000 claims abstract description 54
- 239000011810 insulating material Substances 0.000 claims abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 6
- 238000005070 sampling Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
- G01R19/0092—Arrangements for measuring currents or voltages or for indicating presence or sign thereof measuring current only
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
- G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
- G01R15/20—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Instrument Details And Bridges, And Automatic Balancing Devices (AREA)
Abstract
The embodiment of the invention provides a current detection plate and a driving controller, wherein the current detection plate comprises a substrate made of insulating materials and at least one group of current detection units arranged on the substrate, and the current detection units comprise current sensors welded on the upper surface of the substrate, first current traces and signal traces printed on different layers of the substrate; the pins of the current sensor are welded to the signal trace, the distances among the current sensor, the plane of the signal trace and the plane of the first current trace are larger than a first preset safety distance, and the current sensor is located in the range of a magnetic field generated by current flowing through the first current trace. According to the embodiment of the invention, the circuit to be detected is introduced into the first current trace, and the current detection is carried out through the current sensor fixed with the position of the first current trace, so that the consistency of the current detection can be ensured.
Description
Technical Field
The embodiment of the invention relates to the field of power electronic equipment, in particular to a current detection plate and a driving controller.
Background
For the current detection scheme of the current trace on the printed circuit board (Printed Circuit Board, PCB), there are mainly two kinds: the first is to connect sampling resistors in series in a current flowing branch, and the current magnitude is obtained by detecting the voltage drop on the sampling resistors; the second converts the current into a voltage value that can be easily recognized by detecting using a hall element, an anisotropic magnetoresistive (Anisotropic Magneto resistance, AMR) element, a giant magnetoresistive (Giant Magneto resistance, GMR) element, a tunneling magnetoresistive (Tunnel Magneto Resistance, TMR) element, or the like.
For the first current detection scheme adopting the sampling resistor, the sampling resistor needs to be welded on the printed circuit board, and the current range which can be detected is limited due to the heating of the sampling resistor, so that the current detection scheme can only be applied to the current detection of a low-power device.
In the second scheme for detecting the current of the current trace on the printed circuit board, a detection device (such as a hall element, an anisotropic magneto-resistance element, a giant magneto-resistance element, a tunnel magneto-resistance element and the like) is required to be welded on the printed circuit board, a current wire to be detected is located below the detection device, and a magnetic field generated by the current in the current wire to be detected is converted into a corresponding voltage value through the detection device. The magnetic field intensity generated by the current in the current wire to be detected directly influences the voltage precision, and the magnetic field intensity generated by the current is strongly related to the current magnitude, the line width of the current wire on the printed circuit board and the distance from the detection device to the current wire.
In practical application, due to the welding process of the detection device, the distance between the detection device and the current wire deviates from the theoretical design, the thickness of the printed circuit board deviates from the theoretical design, and the thickness of the printed circuit board is inconsistent, which leads to larger detection accuracy error. Therefore, precision errors exist for different printed circuit board wiring designs and different batches of printed circuit boards, and consistency of current detection is difficult to ensure.
Disclosure of Invention
The embodiment of the invention aims to provide a current detection plate and a driving controller, which are used for solving the problems that the sampling resistance mode can only be applied to current detection of a low-power device, and the detection accuracy error is large and the consistency of current detection is difficult to ensure due to the welding mode of the detection device.
The technical scheme of the embodiment of the invention for solving the technical problems is that the current detection board comprises a substrate made of insulating materials and at least one group of current detection units arranged on the substrate, wherein the current detection units comprise current sensors welded on the upper surface of the substrate, first current traces and signal traces printed on different layers of the substrate; the pins of the current sensor are welded to the signal trace, the distances among the current sensor, the plane of the signal trace and the plane of the first current trace are larger than a first preset safety distance, and the current sensor is located in the range of a magnetic field generated by current flowing through the first current trace.
Preferably, the internal magnetic field detection direction of the current sensor is parallel to the direction of the magnetic field generated by the current flowing through the first current trace.
Preferably, the first current trace passes through the current sensor in the orthographic projection region of the substrate.
Preferably, the first current trace is printed on the lower surface of the substrate, the signal trace is printed on the upper surface of the substrate, and the thickness of the substrate is greater than the first preset safety distance.
Preferably, the first current trace is printed on an intermediate layer of the substrate, the signal trace is printed on an upper surface of the substrate, and a distance between the intermediate layer of the substrate and the upper surface of the substrate is greater than the first preset safety distance.
Preferably, the first current trace and the signal trace are each composed of copper sheet.
Preferably, when a plurality of groups of current detection units are arranged on the substrate, the distance between the first current traces in each current detection unit is larger than the second preset safety distance.
Preferably, both ends of the first current trace are respectively exposed to the lower surface of the substrate, and respectively form soldering points; the signal trace extends to an edge of the substrate and an end of the signal trace has a signal pin.
The embodiment of the invention also provides a driving controller, which comprises a main circuit board with a current loop to be detected and the current detection board; the current loop to be detected comprises two second current traces which are disconnected with each other; the current detection board is used for connecting the first current trace into the current loop to be detected in a mode that each end of the first current trace is welded to one second current trace.
Preferably, the main circuit board has thereon a detection signal processing circuit to which the signal trace of the current detection board is soldered.
According to the current detection board and the driving controller, the circuit to be detected is introduced into the first current trace, and the current detection is carried out through the current sensor fixed with the position of the first current trace, so that the current detection board and the driving controller can be applied to current detection of high-power devices, and the current detection precision and the consistency of the current detection can be ensured. In addition, the current detection board of the embodiment of the invention can be applied to different printed circuit boards, and can carry out batch detection parameter correction on the current detection board, and correction is not needed when the current detection board is applied to a main circuit board, so that the detection efficiency is improved.
Drawings
FIG. 1 is a schematic diagram of a current detecting plate according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of a current sensing plate according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a current detecting board according to another embodiment of the present invention;
FIG. 4 is a schematic diagram of a main circuit board and a current detecting board in a driving controller according to an embodiment of the present invention;
fig. 5 is a schematic cross-sectional view of a main circuit board and a current detecting board in a driving controller according to an embodiment of the invention.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
1-2 Are schematic illustrations of a current sensing board provided in accordance with an embodiment of the present invention that is solderable to a printed circuit board (Printed Circuit Board, PCB) and senses current on a current trace on the printed circuit board that is made of copper plating on the printed circuit board. The current detecting board of the present embodiment includes a substrate 11 and a set of current detecting units disposed on the substrate 11, wherein the substrate 11 is made of an insulating material (such as epoxy resin, etc.), and the current detecting units include a current sensor 12, a first current trace 13, and a signal trace 14.
The current sensor 12 is soldered on the upper surface of the substrate 11, and the current sensor 12 can convert the magnetic field at the position of the current sensor into a voltage signal for output. Specifically, the current sensor 12 may employ one of the following elements: hall elements, anisotropic magnetoresistive elements, giant magnetoresistive elements, tunnel magnetoresistive elements, etc.
The first current trace 13 and the signal trace 14 are printed on different layers of the substrate 11. The first current trace 13 and the signal trace 14 may be specifically formed of copper sheets printed on the substrate 11, and the cross-sectional area of the first current trace 13 is related to the magnitude of the current to be detected, and if the current to be detected is larger, the first current trace 13 with a larger cross-sectional area may be used.
The pins 121 of the current sensor 12 are soldered to the signal traces 14, and the distances between the current sensor 12, the signal traces 14 and the plane of the first current trace 13 are all larger than a first predetermined safety distance, which can enable the insulation and safety requirements between the current sensor 12, the signal traces 14 and the first current trace 13 to be met. The current sensor 12 is located within the magnetic field generated by the current flowing through the first current trace 13, that is, the current sensor 12 can convert the magnetic field generated by the current flowing through the first current trace 13 into a voltage and output the voltage through the signal trace 14.
In the above-mentioned current detecting board, the magnetic field generated by the current flowing through the first current trace 13 is converted into a voltage by the current sensor 12 and outputted via the signal trace 14, and since the position between the current sensor 12 and the first current trace 13 is fixed, when the current detecting board is soldered to a printed circuit board, the current detecting accuracy is not affected by the production process of the printed circuit board, and the consistency of the current detection can be ensured. Moreover, the current detection board can be applied to different printed circuit boards, and can carry out batch detection parameter correction on the current detection board, so that correction is not needed when the current detection board is applied to a main circuit board, and the detection efficiency is improved.
According to the right hand rule, when there is a current in the first current trace 13, a magnetic field is generated at the current sensor 12 location. In another embodiment of the present invention, for optimal current detection, the internal magnetic field detection direction of the current sensor 12 (shown by the dashed arrow in fig. 1) may be parallel to the direction of the magnetic field generated by the current flowing through the first current trace 13.
In particular, to further improve the detection accuracy, the first current trace 13 may be passed through the current sensor 12 in the orthographic projection area of the substrate 11, i.e. the first current trace 13 is located directly under the current sensor 12.
In order to facilitate the soldering of the current detection board to a printed circuit board to be subjected to current detection, two ends of the first current trace 13 are respectively exposed to the lower surface of the substrate 11, and soldering points (for example, soldering points may be soldering pins, etc.) are respectively formed; accordingly, the signal trace 14 extends to the edge of the substrate 11, and the end of the signal trace 14 has a signal pin 15. When in use, the lower surface of the base plate 11 can be stuck to the upper surface of a printed circuit board to be subjected to current detection, two welding points are welded to corresponding circuits of the printed circuit board, and the signal pins 15 are welded to a signal circuit of the printed circuit board, so that the operation is simple.
In another embodiment of the present invention, for manufacturing, the first current trace 13 may be printed on the lower surface of the substrate 11, and the signal trace 14 may be printed on the upper surface of the substrate 11, and the thickness of the substrate 11 is greater than the first predetermined safety distance, so that the safety distances among the current sensor 12, the signal trace 14 and the first current trace 13 are satisfied. Of course, in practical applications, the first current trace 13 or the signal trace 14 may be printed on the intermediate layer of the substrate 11, for example, the first current trace 13 is printed on the intermediate layer of the substrate 11, the signal trace 14 is printed on the upper surface of the substrate 11, and the distance between the intermediate layer and the upper surface of the substrate 11 is greater than the first preset safety distance, but the cost is relatively high and the process is complex.
For industrial application, multiple current detection is generally required, so multiple current detection units may be disposed on the substrate 11, so as to implement multiple current detection. Fig. 3 is a schematic structural diagram of a current detecting board according to another embodiment of the present invention. The current detection board comprises a plurality of groups of current detection units respectively arranged on a substrate 11, and each group of current detection units comprises a current sensor 12 welded on the upper surface of the substrate 11, a first current trace 13 and a signal trace 14 printed on different layers of the substrate 11. Each current sensor 12 is soldered to a corresponding signal trace 14 and each current sensor 12 is located within the magnetic field created by the current flowing through one of the first current traces 13. With the structure, a plurality of currents on the printed circuit board can be detected.
In order to ensure safety, the spacing between the first current traces 13 needs to be greater than the second predetermined safety distance, so as to meet the safety requirement between the first current traces 13.
Fig. 4-5 are schematic structural diagrams of a driving controller according to an embodiment of the present invention, where the driving controller may be a frequency converter, a servo driver, etc. and the output current needs to be sampled to realize closed-loop control. The drive controller of the present embodiment includes the main circuit board 21 having the current loop to be detected (the main circuit board is a printed circuit board, and at least a part of the current loop to be detected thereon is constituted by copper sheets printed on the main circuit board) and the current detection board as described above.
The current loop to be detected on the main circuit board 21 comprises two second current traces 23 which are disconnected with each other, and the two second current traces 23 can be respectively formed by copper sheets printed on the main circuit board 21. The current sensing plate accesses the first current trace 13 into the current loop to be sensed in such a way that each end of the first current trace 13 is soldered to one of the second current traces 23. In this way, the current loop to be detected on the main circuit board 21 introduces the current to be detected to the first current trace 13 through one of the second current traces 23 and flows out through the other second current trace 23, as indicated by the arrow in fig. 5. The current sensor 12 on the current detection board outputs a corresponding voltage to the signal trace 14 by detecting a magnetic field generated by the current on the first current trace 13, thereby realizing detection signal output.
In particular, the main circuit board 21 may have thereon a detection signal processing circuit to which the signal trace 14 of the current detection board is soldered. In this way, the current detection board can transmit the current detection signal to the main circuit board 21, so that the main circuit board 21 can process the current detection signal to achieve corresponding control.
The present invention is not limited to the above-mentioned embodiments, and any changes or substitutions that can be easily understood by those skilled in the art within the technical scope of the present invention are intended to be included in the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.
Claims (10)
1. A current detection board is characterized by comprising a substrate made of insulating materials and at least one group of current detection units arranged on the substrate, wherein the current detection units comprise current sensors welded on the upper surface of the substrate, first current traces and signal traces printed on different layers of the substrate; the pins of the current sensor are welded to the signal trace, the distances among the current sensor, the plane of the signal trace and the plane of the first current trace are larger than a first preset safety distance, and the current sensor is positioned in the range of a magnetic field generated by current flowing through the first current trace; the current sensor is used for converting a magnetic field generated by a current flowing through the first current trace into a voltage and outputting the voltage through the signal trace.
2. The current sense plate of claim 1, wherein an internal magnetic field sense direction of the current sensor is parallel to a direction of a magnetic field generated by a current flowing through the first current trace.
3. The current sensing plate of claim 1, wherein the first current trace passes through the current sensor in a forward projected area of the substrate.
4. The current sensing plate of claim 1, wherein the first current trace is printed on a lower surface of the substrate and the signal trace is printed on an upper surface of the substrate, the thickness of the substrate being greater than the first predetermined safety distance.
5. The current sensing plate of claim 1, wherein the first current trace is printed on an intermediate layer of the substrate and the signal trace is printed on an upper surface of the substrate, a distance between the intermediate layer of the substrate and the upper surface of the substrate being greater than the first predetermined mounting distance.
6. The current sensing plate of claim 4 or 5, wherein the first current trace and the signal trace are each comprised of copper sheet.
7. The current sensing plate of claim 1, wherein when a plurality of sets of current sensing units are provided on the substrate, a spacing between first current traces within each current sensing unit is greater than a second predetermined safety distance.
8. The current detection board according to claim 1, wherein both end portions of the first current trace are exposed to a lower surface of the substrate, respectively, and form soldering points, respectively; the signal trace extends to an edge of the substrate and an end of the signal trace has a signal pin.
9. A drive controller comprising a main circuit board having a current loop to be detected and a current sensing board according to any one of claims 1-8; the current loop to be detected comprises two second current traces which are disconnected with each other; the current detection board is used for connecting the first current trace into the current loop to be detected in a mode that each end of the first current trace is welded to one second current trace.
10. The drive controller of claim 9, wherein the main circuit board has thereon a detection signal processing circuit to which signal traces of the current detection board are soldered.
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CN109406859B true CN109406859B (en) | 2024-04-30 |
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CN110221112A (en) * | 2019-06-04 | 2019-09-10 | 苏州汇川技术有限公司 | Circuit board and power electronic equipment |
CN112054706A (en) * | 2020-07-23 | 2020-12-08 | 华为技术有限公司 | Semiconductor power module, current detection method and manufacturing method thereof and automobile |
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