TWM537717U - Optical semiconductor element covered with phosphor layer - Google Patents

Description

Optical semiconductor component coated with a phosphor layer

The present invention relates to an optical semiconductor element coated with a phosphor layer and a method of manufacturing the same, and more particularly to an optical semiconductor element coated with a phosphor layer and a method for fabricating the same.

In the prior art, an optical semiconductor element having a thin semiconductor element exposed on the lower surface and a phosphor layer covering the upper surface and the side surface of the optical semiconductor element has been proposed (for example, refer to Japanese Laid-Open Patent Publication No. 2012-39013 ).

However, the industry requires excellent luminous intensity for an optical semiconductor element coated with a phosphor layer. However, the optical semiconductor element coated with the phosphor layer described in Japanese Laid-Open Patent Publication No. 2012-39013 has a problem that the above-described luminous intensity cannot be satisfied.

The object of the present invention is to provide an optical semiconductor element coated with a phosphor layer having excellent luminous intensity and a method of manufacturing the same.

The present invention [1] includes an optical semiconductor element coated with a phosphor layer, wherein the optical semiconductor element coated with the phosphor layer includes an optical semiconductor element, a phosphor layer covering the optical semiconductor element, and at least a layer covering the phosphor layer Part of the transparent layer.

Since the optical semiconductor element coated with the phosphor layer has a transparent layer covering at least a part of the phosphor layer, the light-emitting intensity can be improved.

The present invention [2] includes the optical semiconductor element coated with the phosphor layer as described in [1], wherein the optical semiconductor element has a component side contact surface which can be in contact with the substrate, and a relative The element side contact surface may face the component side opposite surface disposed at a distance x from the side, and the element side connecting surface connected to the element side contact possible surface and the element side opposite surface, the fluorescent light The body layer has a first opposite surface on the phosphor side that is opposed to the element side opposite surface y at a distance y from the side, and an orthogonal to the one side in the one direction with respect to the element side connecting surface The second opposite surface of the phosphor side disposed opposite to each other with the distance α in the orthogonal direction, the transparent layer having a distance z from the first opposing surface on the side of the phosphor a transparent side connecting surface disposed on the transparent side and a transparent side connecting surface that is disposed at an interval in the orthogonal direction with respect to the element side connecting surface when being projected on the transparent side opposing surface and projected in the one side upward, and

The optical semiconductor element coated with the phosphor layer covers all of the following (1) to (4).

(1) The value (y/x) obtained by dividing the distance y by the distance x is 1 or more and 5 or less.

(2) The sum (y+z) of the distance y and the distance z is 0.25 mm or more and 2 mm or less.

(3) The sum (α + β) of the distance α and the distance β between the second opposing surface on the phosphor side and the transparent side connecting surface is 50 μm or more and 2000 μm or less. The distance β is 0 or more.

(4) The value (y/α) obtained by dividing the distance y by the distance α is 1 or more and 2.5 or less.

Since the optical semiconductor element coated with the phosphor layer satisfies all of the above (1) to (4), it is possible to further improve the light emission intensity, to have excellent color uniformity, and to suppress color unevenness.

The optical semiconductor element coated with the phosphor layer according to [1] or [2], wherein the phosphor layer contains a phosphor and a first transparent composition, and the first transparent composition The refractive index RIp is 1.45 or more and 1.60 or less.

In the optical semiconductor element coated with the phosphor layer, since the refractive index RIp of the first transparent composition is 1.45 or more and 1.60 or less, the light-emitting intensity can be improved.

The optical semiconductor element coated with the phosphor layer according to any one of [1] to [3] wherein the phosphor layer contains a phosphor and a first transparent composition, and the transparent layer contains In the second transparent composition, the value (RIp-RIt) obtained by subtracting the refractive index RIt of the second transparent composition from the refractive index RIp of the first transparent composition is -0.70 or more and 0.20 or less.

In the optical semiconductor element coated with the phosphor layer, the value (RIp-RIt) obtained by subtracting the refractive index RIt of the second transparent composition from the refractive index RIp of the first transparent composition is -0.70 or more and 0.20 or less. Increase the luminous intensity.

The present invention [5] includes the optical semiconductor element coated with the phosphor layer according to [4], wherein the RIp-the above RIt is 0.05 or more.

In the optical semiconductor element coated with the phosphor layer, since the RIp-RIt is 0.05 or more, the light emission intensity can be further improved.

The optical semiconductor element coated with the phosphor layer according to the above [2], wherein the second opposite surface of the phosphor side and the transparent side connecting surface are formed in the same plane in the one direction.

The phosphor-side second opposing surface and the transparent-side connecting surface of the phosphor layer and the transparent layer in the optical semiconductor element coated with the phosphor layer can be formed by a simple method.

The present invention [7] includes the optical semiconductor element coated with the phosphor layer as described in [2] or [6], wherein the distance α exceeds 50 μm.

Since the optical semiconductor element coated with the phosphor layer has a distance α exceeding 50 μm, color uniformity can be improved.

The present invention [8] includes a method of manufacturing an optical semiconductor element coated with a phosphor layer, the method for manufacturing the above-described optical semiconductor element coated with a phosphor layer, and comprising: forming the phosphor layer on the transparent layer The step of producing a coated sheet on the surface of the layer and the step of arranging the coated sheet so that the phosphor layer is coated with a plurality of optical semiconductor elements.

According to the method for producing an optical semiconductor element coated with a phosphor layer, the coated wafer can be used to easily produce an optical semiconductor element coated with a phosphor layer having excellent light-emitting intensity.

The production method of the optical semiconductor element coated with the phosphor layer according to [8], further comprising: cutting the coating so that the optical semiconductor element coated with the phosphor layer is singulated The steps of the sheet.

According to the method of manufacturing an optical semiconductor element coated with a phosphor layer, an optical semiconductor element coated with a phosphor layer having a desired size can be easily manufactured.

The present invention [10] includes a method of manufacturing an optical semiconductor device coated with a phosphor layer, which is a method for manufacturing an optical semiconductor device coated with a phosphor layer according to any one of [1] to [7] And a phosphor layer preparation step of preparing a flake-shaped phosphor layer; a phosphor layer disposing step of disposing the sheet-like phosphor layer so as to cover the photo-semiconductor element; and a transparent layer disposing step The transparent layer is disposed to cover at least a portion of the phosphor layer after the phosphor layer disposing step.

The method for producing an optical semiconductor device coated with a phosphor layer includes a phosphor layer preparation step of preparing a sheet-shaped phosphor layer, and a phosphor layer layer disposing step of disposing the sheet-like phosphor layer so as to cover the photo-semiconductor element. Therefore, it is possible to easily produce an optical semiconductor element coated with a phosphor layer having excellent light-emitting intensity by using a sheet-like phosphor layer.

The production method of the optical semiconductor element coated with the phosphor layer according to the above [10], wherein the sheet-like layer is disposed in the phosphor layer layer arranging step of embedding a plurality of the optical semiconductor elements a phosphor layer; and the method further includes a singulation/removal step of affixing the phosphor layer to a plurality of the optical semiconductor elements after the phosphor layer arranging step and before the transparent layer arranging step The wafer is removed, and the phosphor layer located at a long distance from the optical semiconductor element is removed.

According to the method of manufacturing an optical semiconductor element coated with a phosphor layer, it is singulated/ In the removing step, after the phosphor layer layer arranging step and before the transparent layer arranging step, the phosphor layer is diced corresponding to the plurality of optical semiconductor elements, and the phosphor layer located at a long distance from the optical semiconductor element is removed. Therefore, an optical semiconductor element coated with a phosphor layer having a desired size can be manufactured in a small number of steps.

The present invention [12] includes the method of manufacturing a photo-semiconductor element coated with a phosphor layer as described in [11], wherein the photo-semiconductor element has an element side contactable surface that can be in contact with the substrate, and is in contact with the element side The element-side opposing surface disposed opposite to the side by a distance x and the element-side connecting surface coupled to the element-side contact possible surface and the element-side opposing surface, in the phosphor layer arranging step, The sheet-shaped phosphor layer is disposed so as to cover the element-side connecting surface of the plurality of optical semiconductor elements, and the phosphor layer covering the element-side connecting surface remains in the singulation/removal step.

According to the method for producing an optical semiconductor element coated with the phosphor layer, the phosphor layer on the surface of the coated element side is left in the singulation/removal step, so that the coating of the phosphor layer having the desired size can be easily produced. An optical semiconductor component having a phosphor layer.

The method of manufacturing a photo-semiconductor element coated with a phosphor layer according to any one of [10] to [12], further comprising a transparent layer preparation step of preparing a sheet-like transparent layer, In the transparent layer preparation step, the sheet-like transparent layer is disposed so as to cover at least a part of the phosphor layer.

1‧‧‧Silver body sealed LED

2‧‧‧LED

3‧‧‧Fluorescent layer

4‧‧‧Transparent layer

5‧‧‧Seal sheet

6‧‧‧ peeling sheet

7‧‧‧Support board

8‧‧‧ Sealed LED assembly

9‧‧‧ Wafer cutting saw

11‧‧‧1st barrier

12‧‧‧2nd barrier

13‧‧‧1st opening

14‧‧‧2nd opening

15‧‧‧Fluorescent sealing sheet

17‧‧‧2nd support board

18‧‧‧Transparent sheet

19‧‧‧2nd peeling sheet

21‧‧‧ Lower surface

22‧‧‧ upper surface

23‧‧‧ side

24‧‧‧ recess

30‧‧‧ Housing Department

31‧‧‧ upper surface

32‧‧‧ lower surface

33‧‧‧ side

34‧‧‧ inside

35‧‧‧ side

36‧‧‧Flange

37‧‧‧ outer perimeter

38‧‧‧ inner circumference

39‧‧‧ upper surface

41‧‧‧ lower surface

42‧‧‧ upper surface

43‧‧‧ side

45‧‧‧ side

50‧‧‧Substrate

60‧‧‧LED device

Distance from x‧‧‧

Y‧‧‧ distance

Z‧‧‧distance

‧‧‧‧ distance

‧‧‧‧ distance

γ‧‧‧LED length in the left and right direction

Fig. 1 is a cross-sectional view showing a phosphor layer-sealed LED (the side surface of the transparent layer and the side surface of the phosphor layer being formed in the same plane) as the first embodiment of the optical layer semiconductor element coated with the phosphor layer.

2A to 2F are process diagrams showing a method of manufacturing a phosphor layer-sealed LED shown in Fig. 1 and a method of manufacturing an LED device using a phosphor layer-sealed LED. Figure 2A shows the steps of preparing a sealing sheet, 2B shows a step of preparing a plurality of LEDs, FIG. 2C shows a step of sealing a plurality of LEDs by a sealing sheet, FIG. 2D shows a step of monolithizing the phosphor layer sealed LED, and FIG. 2E shows a step of obtaining a phosphor layer sealed LED. Step 2F shows the step of mounting the phosphor layer sealed LED to the substrate.

3A to 3E are process diagrams showing a modification of the method of manufacturing the phosphor layer-sealed LED and the method of manufacturing the LED device shown in FIGS. 2A to 2F, and FIG. 3A shows a step of preparing the LED and the first barrier rib. 3B shows a step of arranging the first barrier ribs, FIG. 3C shows a step of forming the phosphor layer in the first barrier ribs, FIG. 3D shows a step of pulling the first barrier ribs, and then a second barrier rib is prepared, and FIG. 3E shows a step of arranging the second barrier ribs. step.

4F to FIG. 4I are diagrams showing a modification of the method for manufacturing the phosphor layer-sealed LED and the method for manufacturing the LED device shown in FIG. 2A to FIG. 2E, and FIG. 4F shows the transparent layer formed thereon. FIG. 4G shows a step of cutting the phosphor layer and the interface between the transparent layer and the second barrier, FIG. 4H shows a step of obtaining a phosphor layer sealed LED, and FIG. 4I shows a phosphor layer. The step of mounting the sealed LED to the substrate.

Fig. 5 is a cross-sectional view showing a variation of the phosphor layer-sealed LED shown in Fig. 1 (the lower surface of the phosphor layer is located on the upper side of the lower surface of the LED).

Fig. 6 is a cross-sectional view showing a phosphor layer-sealed LED (a side surface of a transparent layer formed on the outer side with respect to a side surface of a phosphor layer) of a second embodiment of the present invention, which is coated with a phosphor layer.

7A to 7F are process diagrams showing a method of manufacturing a phosphor layer-sealed LED shown in Fig. 6 and a method of manufacturing an LED device using a phosphor layer-sealed LED. Fig. 7A shows a step of preparing a plurality of LEDs and a fluorescent sealing sheet, Fig. 7B shows a step of sealing a plurality of LEDs by a phosphor layer, and Fig. 7C shows a step of peeling the peeling sheet from the phosphor layer, and Fig. 7D shows a single step. The step of forming a phosphor layer sealed LED, FIG. 7E shows the step of peeling off the phosphor layer sealed LED from the support sheet, and FIG. 7F shows the step of obtaining the phosphor layer sealed LED.

8G to FIG. 8L are steps subsequent to FIG. 7F, showing a method of manufacturing the phosphor layer sealed LED shown in FIG. 6, and a method of manufacturing the LED device using the phosphor layer sealed LED, and FIG. 8G shows a plurality of steps. The phosphor layer sealed LED is further disposed on the second support plate and the transparent sheet is prepared. FIG. 8H shows the step of sealing the LEDs sealed by the plurality of phosphor layers by the transparent layer, and FIG. 8I shows the second peeling sheet. The step of peeling off the material from the transparent layer, FIG. 8J shows the step of monolithizing the LED sealed by the phosphor layer, FIG. 8K shows the step of obtaining the LED sealed by the phosphor layer, and FIG. 8L shows the step of mounting the LED sealed by the phosphor layer to the substrate. step.

Fig. 9 is a view showing a variation of the phosphor layer sealed LED shown in Fig. 6 (the exposed surface of the lower surface of the phosphor layer and the lower surface of the transparent layer exposed from the LED, and the exposed surface has an upper side than the lower surface of the LED A cross-sectional view of the part of the aspect.

10A to 10E are flowcharts showing a variation of the method of obtaining the phosphor layer-sealed LED shown in Fig. 7. Fig. 10A shows a step of preparing a plurality of LEDs and a fluorescent sealing sheet, and Fig. 10B shows a step of preparing a plurality of LEDs and a fluorescent sealing sheet. Step of sealing a plurality of LEDs by a body layer, FIG. 10C shows a step of peeling off the release sheet from the phosphor layer, and FIG. 10D shows a step of monolithizing the LED to be sealed by a phosphor layer. Figure 10E shows the steps of obtaining a phosphor layer sealed LED.

Fig. 11 is a cross-sectional view showing a phosphor layer-sealed LED (a state in which a transparent layer has a flange portion) of a third embodiment of the optical semiconductor element coated with the phosphor layer of the present invention.

12A to 12D are process diagrams showing a method of manufacturing a phosphor layer-sealed LED shown in Fig. 11 and a method of manufacturing an LED device using a phosphor layer-sealed LED, and Fig. 12A shows preparation of a plurality of LEDs and fluorescent light. Step of sealing the sheet, Fig. 12B shows a step of sealing a plurality of LEDs by a phosphor layer, Fig. 12C shows a step of forming a concave portion in the phosphor layer, and Fig. 12D shows a step of preparing a transparent sheet.

13E to FIG. 13I are steps subsequent to FIG. 12D, showing a method of manufacturing the phosphor layer sealed LED shown in FIG. 11, and a method of manufacturing the LED device using the phosphor layer sealed LED, and FIG. 13E shows that it is transparent. The layer is disposed on the upper surface of the phosphor layer, and then the second release sheet is peeled off from the transparent layer. FIG. 13F shows the step of monolithizing the LED sealed by the phosphor layer, and FIG. 13G shows the LED for obtaining the phosphor layer seal. Step, FIG. 13H shows a step of transferring the phosphor layer-sealed LED to the transfer sheet, and FIG. 13I shows a step of mounting the phosphor layer-sealed LED to the substrate.

14A to 14D are process diagrams showing a modification of the method of manufacturing the phosphor layer-sealed LED shown in Fig. 11 and a method of manufacturing the LED device using the phosphor layer-sealed LED, and Fig. 14A shows that a plurality of LEDs are prepared. In the step of sealing the sheet with the fluorescent material, FIG. 14B shows a step of sealing a plurality of LEDs by a phosphor layer, FIG. 14C shows a step of peeling off the release sheet from the phosphor layer, and FIG. 14D shows a step of preparing a transparent sheet.

15E to 15H are subsequent to FIG. 14D, showing the phosphor layer seal shown in FIG. FIG. 15E shows a transparent layer disposed on the upper surface of the phosphor layer, and then the second release sheet is transparent from the surface of the method for manufacturing the LED and the method for manufacturing the LED device using the phosphor layer sealed LED. The step of layer peeling, FIG. 15F shows the step of monolithizing the LED sealed by the phosphor layer, FIG. 15G shows the step of obtaining the LED sealed by the phosphor layer, and FIG. 15H shows the step of mounting the LED sealed by the phosphor layer to the substrate.

Fig. 16 is a cross-sectional view showing the phosphor layer-sealed LED of Comparative Example 1 (in the absence of a transparent layer).

Fig. 17 is a cross-sectional view showing the phosphor layer-sealed LED of Comparative Example 2 (in the form of a flange portion formed of a phosphor layer but without a transparent layer).

The optical semiconductor element coated with the phosphor layer of the present invention includes an optical semiconductor element, a phosphor layer covering the photo-semiconductor element, and a transparent layer covering at least a part of the phosphor layer.

Hereinafter, an optical semiconductor element coated with a phosphor layer and a method of manufacturing the same according to the first embodiment to the third embodiment will be described with reference to FIGS. 1 to 15H.

<First embodiment>

In Fig. 1, the upper and lower sides of the paper are in the vertical direction (the first direction and the thickness direction), and the upper side of the paper is the upper side (the first direction side and the thickness direction side), and the lower side of the paper surface is the lower side (the first direction and the other side, The other side of the thickness direction). The left-right direction of the paper surface is the left-right direction (the second direction orthogonal to the first direction), the left side of the paper surface is the left side (the second direction side), and the right side of the paper surface is the right side (the other side in the second direction). The paper thickness direction is the front-back direction (the third direction orthogonal to the first direction and the second direction), the front side of the paper surface is the front side (the third direction side), and the back side of the paper surface is the rear side (the other side in the third direction).

[Glow-emitting layer sealed LED]

As shown in FIG. 1 , the phosphor layer sealed LED 1 as an example of an optical semiconductor element coated with a phosphor layer includes LED 2 as an example of an optical semiconductor element, and a phosphor layer 3 covering the upper surface and the side surface of the LED 2 and a coating. A transparent layer 4 on the upper surface of the phosphor layer 3.

[Description of each component]

LED2 is an optical semiconductor component that converts electrical energy into light energy. The optical semiconductor element does not include a rectifier such as a transistor different from the optical semiconductor element. For example, the LED 2 has a thickness (the maximum length in the vertical direction) that is shorter than the surface length (specifically, the length in the left-right direction and the length in the front-rear direction), and is generally rectangular in cross section and substantially rectangular in plan view. The LED 2 has a lower surface 21, an upper surface 22, and a side surface 23.

The lower surface 21 of the LED 2 is an example of a possible side contact of the element side in contact with the substrate 50. A portion of the lower surface 21 of the LED 2 is formed of a bump (not shown) and is electrically connected to a terminal (not shown in FIG. 2) provided on the upper surface of the substrate 50. The lower surface 21 of the LED 2 is the lowermost portion of the LED 1 sealed by the phosphor layer.

The upper surface 22 of the LED 2 is an example of an element-side opposite surface that is disposed opposite to the upper surface (one of the sides) of the LED 2 by a distance x. Furthermore, the distance x between the upper surface 22 of the LED 2 and the upper surface 21 is equal to the thickness x of the LED 2.

The side faces 23 of the LEDs 2, that is, the front, rear, left, and right sides are examples of the element-side connecting faces that are coupled to the lower surface 21 and the upper surface 22.

The upper surface 22 and the side surface 23 of the LED 2 are formed of a light-emitting layer (not shown).

As the LED 2, for example, a blue LED (light emitting diode element) that emits blue light can be cited.

The phosphor layer 3 converts a portion of the blue light emitted from the LED 2 into a wavelength conversion layer of yellow light. The phosphor layer 3 is formed into a shape including the LED 2 in plan view. The phosphor layer 3 is disposed so as to cover the upper surface 22 and the side surface 23 of the LED 2 and expose the lower surface 21 of the LED 2. That is, the reception of the LED 2 is formed in the center of the lower portion of the phosphor layer 3. The volume 30. The accommodating portion 30 is a recess recessed from the lower surface 32 of the phosphor layer 3 toward the upper side, and is formed in a shape corresponding to the outer shape of the LED 2. In other words, the phosphor layer 3 is formed in a substantially rectangular shape in a cross-sectional view in which the accommodating portion 30 is formed, and a substantially rectangular shape in plan view. The phosphor layer 3 has a lower surface 32, an upper surface 31, side surfaces 33, and an inner surface 34 formed in the housing portion 30.

The lower surface 32 of the phosphor layer 3 is the lowermost portion of the phosphor layer 3, and is a side surface of the phosphor that can be in contact with the substrate 50.

The upper surface 31 of the phosphor layer 3 is an example of the first opposing surface on the phosphor side that is disposed opposite to the upper surface (one of the sides) of the LED 2 at a distance y. Further, the upper surface 31 of the phosphor layer 3 is also disposed opposite to the upper surface of the LED 2 by a distance y from the upper side. Further, in the phosphor layer 3, the upper surface 31 is spaced apart from the lower surface 32 of the phosphor layer 3 (i.e., the upper surface 22 of the LED 2) by a distance y from the upper side of the phosphor layer 3 opposite to the LED 2 The thickness y of the part.

The front side, the rear side, the left side, and the right side of the phosphor layer 3 are the second pair of the phosphor side disposed opposite to each other with respect to the side surface 23 of the LED 2 in the plane direction (one of the orthogonal directions). An example of the face. Further, the side surface 33 of the phosphor layer 3 is formed as an exposed surface that is exposed to the outside. Further, the side surface 33 of the phosphor layer 3 is spaced apart from the side surface 23 of the LED 2 by the distance α in the left-right direction and the front-rear direction of the portion (side portion 35) of the phosphor layer 3 which is disposed on the outer side of the LED 2 (opposite side 35). Length (minimum length) α.

The inner surface 34 of the accommodating portion 30 of the phosphor layer 3 is in contact with the upper surface 22 and the side surface 23 of the LED 2.

The phosphor layer 3 is formed, for example, of a phosphor resin composition.

The phosphor resin composition contains a phosphor and a transparent resin composition (the first transparent resin composition as an example of the first transparent composition).

Examples of the phosphor include a yellow phosphor that converts blue light into yellow light, a red phosphor that converts blue light into red light, and the like.

Examples of the yellow phosphor include silicate phosphors such as (Ba, Sr, Ca) ₂ SiO ₄ ; Eu, (Sr, Ba) ₂ SiO ₄ : Eu (barium strontium ruthenate (BOS)), For example, Y ₃ Al ₅ O ₁₂ :Ce (YAG (yt. aluminum. garnet): Ce), Tb ₃ Al ₃ O ₁₂ :Ce (TAG (鋱.aluminum. garnet): Ce), etc. have garnet crystal A garnet-type phosphor of a structure, for example, an oxynitride phosphor such as Ca-α-SiAlON.

Examples of the red phosphor include a nitride phosphor such as CaAlSiN ₃ :Eu or CaSiN ₂ :Eu.

Examples of the shape of the phosphor include a spherical shape, a plate shape, and a needle shape. From the viewpoint of fluidity, it is preferred to enumerate a spherical shape.

The average value of the maximum length of the phosphor (the average particle diameter in the case of a spherical shape) is, for example, 0.1 μm or more, preferably 1 μm or more, and is, for example, 200 μm or less, preferably 100 μm or less.

The specific gravity of the phosphor is, for example, more than 2.0, and is, for example, 9.0 or less.

The phosphors can be used alone or in combination.

The blending ratio of the phosphor is, for example, 0.1 part by mass or more, preferably 0.5 part by mass or more, for example, 80 parts by mass or less, preferably 50 parts by mass or less, based on 100 parts by mass of the transparent resin composition. In addition, the blending ratio of the phosphor is, for example, 0.1% by mass or more, preferably 0.5% by mass or more, for example, 90% by mass or less, and preferably 80% by mass or less based on the amount of the phosphor resin composition.

The transparent resin composition is, for example, a transparent resin composition used as a sealing material for sealing the LEDs 2. Specifically, examples of the transparent resin composition include a thermosetting resin composition and a thermoplastic resin composition, and a thermosetting resin composition is preferred.

The thermosetting resin composition may, for example, be a two-stage reaction curable resin composition or a single-stage reaction curable resin composition.

The second-stage reaction-curable resin composition has two reaction mechanisms, and in the first-stage reaction, B-stage (semi-hardening) can be performed from the A-stage state, and then in the second-stage reaction, C-stage (completely hardened) from the B-stage state. In other words, the two-stage reaction curable resin composition is a thermosetting resin composition which can be in a B-stage state by moderate heating conditions. However, the two-stage reaction curable resin composition may also be in a C-stage state from the A-stage state by heating with high strength without maintaining the B-stage state. Further, the B-stage state thermosetting resin composition is in a state between a liquid A-stage state and a fully-hardened C-stage state, and is slightly hardened and gelled, and the compression elastic modulus is smaller than the C stage. The semi-solid or solid state of the elastic modulus of the state.

The single-stage reaction curable resin composition has one reaction mechanism, and in the first-stage reaction, C-stage (completely hardening) can be performed from the A-stage state. In addition, the single-stage reaction curable resin composition contains a thermosetting resin composition which can be stopped in the middle of the reaction in the first stage and becomes a B-stage state from the A-stage state, and thereafter Further heating causes the first stage reaction to restart and C stage (completely hardening) from the B stage state. In other words, the thermosetting resin composition is a thermosetting resin composition which can be in a B-stage state. On the other hand, the single-stage reaction curable resin composition contains a thermosetting resin composition which cannot be controlled to be stopped in the middle of the first-stage reaction, that is, cannot be in the B-stage state, but is in the A-stage state. Perform C-stage (completely hardening) at a time.

Examples of the transparent resin composition include a polyoxyxylene resin, an epoxy resin, a urethane resin, a polyimide resin, a phenol resin, a urea resin, a melamine resin, and an unsaturated polyester resin. As a transparent resin composition, a polyoxyl resin and an epoxy resin are preferable.

The above transparent resin composition may be the same kind or plural kinds.

Examples of the polyoxymethylene resin include an addition reaction-curable polydecane resin composition and a condensation-addition reaction-curable polyoxymethylene resin combination from the viewpoint of transparency, durability, heat resistance, and light resistance. A polyoxyxylene resin composition. The polyoxyxylene resins may be used singly or in combination.

The addition reaction-curable polydecane resin composition is a single-stage reaction curable resin composition, and includes, for example, an alkenyl group-containing polyoxyalkylene oxide, a hydrofluorenyl group-containing polyoxyalkylene oxide, and a rhodium hydrogenation catalyst.

The alkenyl group-containing polyoxyalkylene contains two or more alkenyl groups and/or cycloalkenyl groups in the molecule. The alkenyl group-containing polyoxyalkylene is specifically represented by the following average composition formula (1).

Average composition formula (1): R ¹ _a R ² _b SiO _(4-ab)/2

(wherein R ¹ represents an alkenyl group having 2 to 10 carbon atoms and/or a cycloalkenyl group having 3 to 10 carbon atoms. R ² represents an unsubstituted or substituted hydrocarbon group having 1 to 10 carbon atoms (wherein Except for alkenyl and cycloalkenyl). a is 0.05 or more and 0.50 or less, and b is 0.80 or more and 1.80 or less.

In the formula (1), examples of the alkenyl group represented by R ¹ include a carbon such as a vinyl group, an allyl group, a propenyl group, a butenyl group, a pentenyl group, a hexenyl group, a heptenyl group or an octenyl group. A few 2 to 10 alkenyl groups. Examples of the cycloalkenyl group represented by R ¹ include a cyclohexenyl group and a lower ^ratio . A cycloalkenyl group having 3 to 10 carbon atoms such as an alkenyl group.

R ^{1 is} preferably an alkenyl group, more preferably an alkenyl group having 2 to 4 carbon atoms, and still more preferably a vinyl group.

The alkenyl group represented by R ¹ may be the same kind or plural kinds.

The monovalent hydrocarbon group represented by R ² is an unsubstituted or substituted hydrocarbon group having 1 to 10 carbon atoms in addition to an alkenyl group and a cycloalkenyl group.

The unsubstituted monovalent hydrocarbon group may, for example, be a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a second butyl group, a third butyl group, a pentyl group, a hexyl group or a pentyl group. a carbon number of 1 to 10, such as a cyclopropyl group, a cyclobutyl group, a cyclopentyl group or a cyclohexyl group, such as a cyclopropyl group, a cyclobutyl group, a cyclopentyl group or a cyclohexyl group, such as a cyclopropyl group, a hexyl group, an octyl group, a 2-ethylhexyl group, a decyl group or a fluorenyl group The cycloalkyl group is an aryl group having 6 to 10 carbon atoms such as a phenyl group, a tolyl group or a naphthyl group, and an aralkyl group having 7 to 8 carbon atoms such as a benzyl group or a benzylethyl group. The alkyl group having 1 to 3 carbon atoms and the aryl group having 6 to 10 carbon atoms are preferred, and a methyl group and/or a phenyl group are more preferred.

On the other hand, the substituted monovalent hydrocarbon group may be one obtained by substituting a hydrogen atom in the above unsubstituted monovalent hydrocarbon group with a substituent.

The substituent may, for example, be a halogen atom such as a chlorine atom, for example, a glycidyl ether group.

Specific examples of the substituted monovalent hydrocarbon group include 3-chloropropyl group and glycidoxypropyl group.

The monovalent hydrocarbon group may be unsubstituted or substituted, and is preferably unsubstituted.

The monovalent hydrocarbon group represented by R ² is the same or plural. It is preferably a methyl group and/or a phenyl group, and more preferably a combination of a methyl group and a phenyl group.

a is preferably 0.10 or more and 0.40 or less.

b is preferably 1.5 or more and 1.75 or less.

The weight average molecular weight of the alkenyl group-containing polyoxyalkylene is, for example, 100 or more, preferably 500 or more, and for example, 10,000 or less, preferably 5,000 or less. The weight average molecular weight of the alkenyl group-containing polyoxyalkylene is a standard polystyrene-based conversion value determined by gel permeation chromatography.

The alkenyl group-containing polyoxyalkylene is prepared by a suitable method, and a commercially available product can also be used.

Further, the alkenyl group-containing polyoxane is the same kind or plural kinds.

The polyoxyalkylene group containing a hydroquinone group contains, for example, two or more hydrofluorenyl groups (SiH groups) in the molecule. The polyoxyalkylene group containing a hydroquinone group is specifically represented by the following average composition formula (2).

Average composition formula (2): H _c R ³ _d SiO _(4-cd)/2

(wherein R ³ represents an unsubstituted or substituted hydrocarbon group having 1 to 10 carbon atoms (excluding an alkenyl group and/or a cycloalkenyl group). c is 0.30 or more and 1.0 or less, and d is 0.90 or more. And 2.0 or less)

In the formula (2), the unsubstituted or substituted hydrocarbon group having 1 to 10 carbon atoms represented by R ³ may be exemplified by the unsubstituted or substituted carbon number represented by R ^{2 of} the formula (1). The hydrocarbon groups of 1 to 10 are the same. Preferably, the unsubstituted hydrocarbon group having 1 to 10 carbon atoms is used, and more preferably an alkyl group having 1 to 10 carbon atoms or an aryl group having 6 to 10 carbon atoms, more preferably a methyl group and/or Or phenyl.

c is preferably 0.5 or less.

d is preferably 1.3 or more and 1.7 or less.

The polyalkylene oxide-containing polyoxyalkylene has a weight average molecular weight of, for example, 100 or more, preferably 500 or more, and further, for example, 10,000 or less, preferably 5,000 or less. The weight average molecular weight of the polyalkylene oxide-containing polyoxyalkylene is a standard polystyrene-based conversion value determined by gel permeation chromatography.

The polyoxyalkylene group containing a hydroquinone group can be produced by a suitable method, and a commercially available product can also be used.

Further, the polyoxyalkylene group containing a hydroquinone group is the same kind or plural kinds.

The above average composition formula (1) and at least one of R ² and R ³ in the average composition formula (2) preferably contain a phenyl group, and more preferably both of the hydrocarbon groups of R ² and R ³ contain a phenyl group. In the case where at least one of R ² and R ³ contains a phenyl group, the addition reaction-curable polydecane resin composition is a phenyl-based polyoxymethylene resin composition. The phenyl polyoxyethylene resin composition is a single-stage reaction curable resin composition which can be in a B-stage state. The refractive index of the phenyl polyoxyethylene resin composition is, for example, 1.45 or more, and further 1.50 or more.

On the other hand, when the hydrocarbon of both of R ² and R ³ is a methyl group, the addition reaction-curable polydecane resin composition is a methyl-based polyoxymethylene resin composition. The methyl polyoxy resin composition is a single-stage reaction curable resin composition which cannot be in a B-stage state. The refractive index of the methyl polyoxy resin composition is, for example, 1.50 or less, and further 1.45 or less.

Among the addition reaction-curable polydecane resin compositions, a methyl-based polyoxymethylene resin composition is preferred from the viewpoint of obtaining an excellent gas permeability.

a compounding ratio of a polyoxyalkylene group containing a hydroquinone group such that the number of moles of the alkenyl group and the cycloalkenyl group of the alkenyl group-containing polyoxyalkylene is compared with the hydroquinone group of the polyoxyalkylene group containing a hydroquinone group The ratio of the molar number (the number of moles of the alkenyl group and the cycloalkenyl group / the number of moles of the hydroquinone group) is, for example, 1/30 or more, preferably 1/3 or more, and is, for example, 30/1 or less. Preferably, it is adjusted to be 3/1 or less.

The hydrogenation catalyst of hydrazine is a hydrogenation reaction (hydrogenation addition) of an alkenyl group and/or a cycloalkenyl group of an alkenyl group-containing polyoxyalkylene with a hydroquinone group of a polyoxyalkylene group containing a hydroquinone group. The substance (addition catalyst) having a high speed is not particularly limited, and examples thereof include a metal catalyst. Examples of the metal catalyst include platinum catalysts such as platinum black, platinum chloride, chloroplatinic acid, platinum-olefin complex, platinum-carbonyl complex, and platinum-acetonitrile acetate, for example, palladium catalyst. , for example, a catalyst.

The ratio of the hydrogenation catalyst to the hydrogenation catalyst is based on the amount of the metal of the metal catalyst (specifically, the metal atom), based on the mass ratio of the alkenyl group-containing polyoxane and the hydroquinone-containing polyoxyalkylene. For example, it is 1.0 ppm or more, and is, for example, 10000 ppm or less, preferably 1000 ppm or less, more preferably 500 ppm or less.

The addition reaction hardening type polyoxyxylene resin composition is prepared by blending an alkenyl group-containing polyoxyalkylene oxide, a hydrofluorenyl group-containing polyoxyalkylene oxide, and a hydrazine hydrogenation catalyst in the above ratio.

The addition reaction hardening type polyoxyxylene resin composition is prepared into an A-stage (liquid) state by using an alkenyl group-containing polyoxyalkylene oxide, a hydroquinone-containing polyoxyalkylene oxide, and a hydrazine hydrogenation catalyst. .

As described above, the phenyl-based polyoxyxene resin composition generates an alkenyl group and/or a cycloalkenyl group of an alkenyl group-containing polyoxyalkylene and a polyoxyalkylene group containing a hydroquinone group by heating under a desired condition. The hydroquinone alkylation reaction of the hydroquinone is carried out, after which the hydrogenation addition reaction of the hydrazine is temporarily stopped. Thereby, it is possible to change from the A-stage state to the B-stage (semi-hardened) state. Thereafter, the above hydrogenation addition reaction is restarted by further heating under the desired conditions to terminate the reaction. Thereby, it is possible to change from the B-stage state to the C-stage (completely hardened) state.

Further, when the phenyl-based polyoxyxene resin composition is in the B-stage (semi-hardened) state, it is solid. Further, the phenyl-based polyoxyxene resin composition in the B-stage state can have both thermoplasticity and thermosetting properties. That is, the B-stage phenyl-based polyoxyxene resin composition is temporarily plasticized by heating, and then completely cured.

On the other hand, in the methyl polyoxyphthalocene resin composition, a hydrogenation addition reaction of an alkenyl group and/or a cycloalkenyl group with a hydroquinone group is generated, and the reaction is accelerated without stopping the reaction, thereby completing the reaction. Thereby, it is possible to change from the A-stage state to the C-stage (completely hardened) state. A commercially available product can be used as the methyl polyoxy resin composition. For example, the ELASTOSIL series (manufactured by Wacker Asahikasei Silicone Co., Ltd., specifically, a methyl polyoxyl resin composition such as ELASTOSIL LR7665), the KER series (manufactured by Shin-Etsu Silicones Co., Ltd.), and the like can be mentioned.

The condensing-addition-reaction-hardening type of the polyoxymethylene resin composition is a two-stage reaction-curable resin, and, for example, JP-A-2010-265436, JP-A-2013-187227, and the like are mentioned. In the first to eighth condensation-addition reaction-curing type polyoxyxylene resin compositions, for example, Japanese Patent Laid-Open Publication No. 2013-091705, Japanese Patent Laid-Open No. 2013-001815, and Japanese Patent Laid-Open No. 2013-001814 A polyfluorene oxide resin composition containing a cage-type sesquioxaxane described in Japanese Laid-Open Patent Publication No. 2012-102167, and the like. Further, the condensation-addition reaction-curable polydecane resin composition is solid and has both thermoplasticity and thermosetting properties.

Examples of the epoxy resin include bisphenol type epoxy resins (for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, hydrogenated bisphenol A type epoxy resin, Dimer acid-modified bisphenol epoxy resin, etc., novolak-type epoxy resin (for example, phenolic novolak type epoxy resin, cresol novolak type epoxy resin, biphenyl type epoxy resin, etc.), naphthalene An aromatic type such as an epoxy resin, a fluorene type epoxy resin (for example, a bisaryl fluorene type epoxy resin), or a triphenylmethane type epoxy resin (for example, a trishydroxyphenylmethane type epoxy resin) Epoxy resin, such as trisepoxypropyl isocyanurate (triglycidyl isocyanurate), nitrogen-containing epoxy resin such as carbendazole epoxy resin, such as aliphatic epoxy resin, such as grease A ring-type epoxy resin (for example, a bicyclic ring type epoxy resin such as a dicyclopentadiene type epoxy resin), for example, a glycidyl ether type epoxy resin, for example, a glycidylamine type epoxy resin. Further, examples of the epoxy resin include dicarboxylic acid such as phthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid, methyltetrahydrophthalic acid, ceric acid, and methyl acid. Diglycidyl acid and the like. Further, examples of the epoxy resin include a hydrogenated trimellitic acid having an alicyclic structure in which an aromatic ring is hydrogenated, a glycidyl ester such as nuclear hydrogenated pyromellitic acid, and the like.

The epoxy resins may be used singly or in combination.

The epoxy resin may be in any form of a liquid, a semi-solid or a solid. The epoxy equivalent of the epoxy resin is, for example, 90 to 1000. When the epoxy resin is in the form of a solid, the softening point is, for example, 50 to 160 ° C from the viewpoint of ease of handling.

Epoxy resins are usually used in combination with a hardener. Examples of the curing agent include an acid anhydride-based curing agent and a meta-cyanuric acid derivative-based curing agent.

Examples of the acid anhydride-based curing agent include phthalic anhydride, maleic anhydride, trimellitic anhydride, pyromellitic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, and A. A phthalic anhydride, an acid anhydride, glutaric anhydride, methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride or the like. The acid anhydride-based curing agent may be used alone or in combination of two or more.

Examples of the isocyanuric acid derivative-based curing agent include 1,3,5-tris(1-carboxymethyl) isocyanurate and 1,3,5-tris(2-carboxyl). Ester), 1,3,5-tris(3-carboxypropyl) isocyanurate, 1,3-bis(2-carboxyethyl) isocyanurate, and the like. The isocyanuric acid derivative-based curing agent may be used singly or in combination of two or more.

The hardener may be used singly or in combination of two or more.

The ratio of the epoxy resin to the hardener is, for example, relative to the epoxy in the epoxy resin. The amount of the base is 1 equivalent, and the active group (anhydride group or carboxyl group) which can react with the epoxy group is set to be 0.5 to 1.5 equivalents, preferably 0.7 to 1.2 equivalents.

Further, the transparent resin composition may further contain a filler.

Examples of the filler include particles such as inorganic particles and organic particles.

Examples of the inorganic particles include cerium oxide (SiO ₂ ), talc (Mg ₃ (Si ₄ O ₁₀ ) (HO) ₂ ), alumina (Al ₂ O ₃ ), and boron oxide (B ₂ O ₃ ). Oxides such as calcium oxide (CaO), zinc oxide (ZnO), strontium oxide (SrO), magnesium oxide (MgO), zirconium oxide (ZrO ₂ ), barium oxide (BaO), and barium oxide (Sb ₂ O ₃ ), for example Inorganic particles (inorganic matter) such as nitrides such as aluminum nitride (AlN) or tantalum nitride (Si ₃ N ₄ ). Further, examples of the inorganic particles include composite inorganic particles prepared from the above-exemplified inorganic materials, and composite inorganic oxide particles (specifically, glass particles or the like) prepared from an oxide are preferable.

The composite inorganic oxide particles contain, for example, cerium oxide, or cerium oxide and boron oxide as main components, and further contain aluminum oxide, calcium oxide, zinc oxide, cerium oxide, magnesium oxide, zirconium oxide, cerium oxide, cerium oxide. Etc. as an auxiliary component. The content ratio of the main component in the composite inorganic oxide particles is, for example, more than 40% by mass, preferably 50% by mass or more, and further, for example, 90% by mass or less, preferably 80% by mass or less, based on the composite inorganic oxide particles. . The content ratio of the subcomponent is the remainder of the content ratio of the above main component.

The composite oxide particles may be blended with the above-mentioned main component and subcomponent, heated, and melted, and the melts thereof may be rapidly cooled, and then pulverized by, for example, a ball mill or the like, and then subjected to appropriate surface processing as needed ( Specifically, it is obtained by spheroidization or the like.

The inorganic particles may be used singly or in combination.

Examples of the organic material of the organic particles include an acrylic resin, a styrene resin, an acrylic-styrene resin, a polyoxyn resin, a polycarbonate resin, a benzoguanamine resin, a polyolefin resin, and a poly An ester resin, a polyamine resin, a polyimide resin, or the like. These may be used alone or in combination.

Among such organic materials, from the viewpoint of light diffusibility and availability, a polyfluorene-based resin is preferred.

The organic particles may be used singly or in combination.

The fillers may be used singly or in combination.

The refractive index of the filler is, for example, 1.40 or more, and is, for example, 1.600 or less.

The shape of the filler is not particularly limited, and examples thereof include a spherical shape, a plate shape, and a needle shape. From the viewpoint of fluidity, it is preferred to enumerate a spherical shape.

The average particle diameter of the filler is, for example, 3 μm or more, preferably 5 μm or more, and for example, 70 μm or less, preferably 50 μm or less.

The content ratio of the filler is, for example, 1% by mass or more, preferably 3% by mass or more, and for example, 80% by mass or less, preferably 75% by mass or less, based on the amount of the transparent resin composition.

The refractive index RIp of the transparent resin composition (an example of the first transparent composition) is, for example, 1.40 or more, preferably 1.45 or more, preferably 1.50 or more, and further preferably 1.63 or less, preferably 1.60 or less, more preferably 1.57 or less. When the refractive index RIp of the transparent resin composition is at least the above lower limit, the luminous intensity of the LED 1 sealed by the phosphor layer can be improved.

The refractive index RIp of the transparent resin composition was calculated by an Abbe refractometer. In the case where the transparent resin composition contains a thermosetting resin, it is calculated as the refractive index in the cured state (completely cured state). Further, the refractive index of the transparent resin composition before curing is substantially the same as the refractive index of the cured transparent resin composition.

Further, a decane coupling agent, an anti-aging agent, a modifier, a surfactant, a dye, a pigment (excluding the above filler), a discoloration preventive agent, and an ultraviolet absorber may be added to the phosphor resin composition as needed. And other known additives.

As shown in FIG. 1, the transparent layer 4 is the uppermost layer of the LED 1 sealed by the phosphor layer. Specifically, the transparent layer 4 is disposed so as to cover the entire surface of the first opposing surface 31 on the phosphor side of the phosphor layer 3 . The planar shape of the transparent layer 4 is formed to be the first pair with the phosphor side of the phosphor layer 3. The shape of the face 31 is the same. That is, the transparent layer 4 is formed in a substantially rectangular shape in cross section and a substantially rectangular shape in plan view. The transparent layer 4 has a lower surface 41, an upper surface 42, and a side surface 43.

The lower surface 41 of the transparent layer 4 is a transparent side contact surface that is in contact with the first opposite surface 31 on the phosphor side.

The upper surface 42 of the transparent layer 4 is an example of a transparent side opposing surface which is disposed opposite to the upper side (one of the sides) of the phosphor layer 3 by a distance z. The upper surface 42 of the transparent layer 4 is the uppermost surface of the LED 1 sealed by the phosphor layer. The distance d between the upper surface 42 of the transparent layer 4 and the upper surface 31 of the phosphor layer 3 is the same as the thickness z of the transparent layer 4.

The side surface 43 of the transparent layer 4 is joined to the lower surface 41 and the upper surface 42 of the transparent layer 4. The side surface 43 of the transparent layer 4 is an example of a transparent side connecting surface which is disposed at an interval α outside the surface direction (an example of the orthogonal direction) with respect to the side surface 23 of the LED 2 when projected in the vertical direction (in one direction). The side surface 43 of the transparent layer 4 is formed in the same plane as the side surface 33 of the phosphor layer 3 in the vertical direction.

The transparent layer 4 is formed, for example, from a second transparent composition such as a transparent resin composition or an inorganic material.

The transparent resin composition (the transparent resin composition contained in the phosphor resin composition) is exemplified as the transparent resin composition. The blending ratio of each component and the like contained in the transparent resin composition and the blending ratio of each component contained in the transparent resin composition (the transparent resin composition contained in the phosphor resin composition) and the like .

Examples of the inorganic material include glass and the like. The glass is not particularly limited, and examples thereof include alkali-free glass, soda glass, quartz glass, borosilicate glass, lead glass, and fluoride glass. Further, examples of the glass include heat-resistant glass, and specifically, those sold under the trade names of Tempax Glass, vycor glass, and Pyrex glass. As the glass, an alkali-free glass or a soda glass is preferable.

The refractive index RIt of the second transparent composition is such that the first transparent resin composition (phosphor) The value (RIp-RIt) obtained by subtracting the refractive index RIt of the second transparent composition from the refractive index RIp of the transparent resin composition contained in the layer 3 is, for example, -1.0 or more, preferably -0.7 or more, more preferably It is 0 or more, more preferably 0.05 or more, and particularly preferably 0.10 or more, and is set to be 0.20 or less, for example. When RIp-RIt is at least the above lower limit, more excellent luminescence intensity can be obtained. When RIp-RIt is less than or equal to the above upper limit, reflection of light at the interface between the transparent layer 4 and the phosphor layer 3 can be suppressed.

The transparent layer 4 can also be formed, for example, by a plurality of layers.

[size]

The size of the LED 2, the phosphor layer 3, and the transparent layer 4 can be appropriately set depending on the use and purpose.

The distance x (thickness x of the LED 2) is, for example, 10 μm or more, preferably 50 μm or more, and is, for example, 1000 μm or less, or preferably 500 μm or less.

The length γ in the left-right direction of the LED 2 and the length in the front-rear direction (not shown in FIG. 1) are the minimum length in the surface direction of the LED 2, and are, for example, 0.1 μm or more, preferably 0.2 μm or more, and further, for example, 5000 μm or less, preferably Below 2000μm.

The distance y (the thickness y of the portion of the phosphor layer 3 that is disposed opposite to the upper side of the LED 2) is, for example, 50 μm or more, and preferably 150 μm or more. Further, the distance y is, for example, 1000 μm or less, preferably 500 μm or less, more preferably less than 350 μm, still more preferably 300 μm or less, still more preferably 200 μm or less, further 150 μm or less, and further 100 μm or less. When the distance y is lower than the upper limit, the gas permeability of the phosphor layer 3 can be increased, and when the LED device 60 is provided with the phosphor layer-sealed LED 1, it is possible to suppress the generation of black focus in the phosphor layer 3 and improve the phosphor layer-sealed LED1. Reliability, in turn, can increase the reliability of the LED device 60.

The distance z (thickness z of the transparent layer 4) is, for example, 100 μm or more, and preferably 200 μm or more. Further, the distance z is, for example, 1000 μm or less, preferably 500 μm or less, more preferably less than 400 μm, still more preferably 300 μm or less, still more preferably 200 μm or less, and most preferably 100 μm or less. If the distance z is lower than the above upper limit, the gas permeability of the transparent layer 4 can be increased. When the LED device 60 is provided with the LED 1 sealed by the phosphor layer, it is possible to suppress the generation of black coke in the transparent layer 4, improve the reliability of the LED 1 sealed by the phosphor layer, and further improve the reliability of the LED device 60.

Further, it is preferable that the LED 2, the phosphor layer 3, and the transparent layer 4 satisfy all of the following (1) to (4).

(1) The value (y/x) obtained by dividing the distance y by the distance x is, for example, 1 or more, preferably 1.25 or more, and further, for example, 5 or less, preferably less than 5, more preferably 4 or less, and further It is preferably 3 or less. When y/x is at least the above lower limit, excellent color uniformity can be obtained. When y/x is less than or equal to the above upper limit, color unevenness can be suppressed.

(2) The sum of the distance y and the distance z (y+z) is, for example, 0.20 mm or more, preferably 0.25 mm or more, more preferably 0.5 mm or more, and further, for example, 2 mm or less, preferably 1.5 mm or less. When y+z is at least the above lower limit, excellent luminescence intensity can be obtained. If y+z is equal to or less than the above upper limit, the material cost can be suppressed.

(3) The distance α (the minimum length α of the side portion 35 of the phosphor layer 3) is, for example, 50 μm or more, preferably more than 50 μm, more preferably 100 μm or more, and further, for example, 2000 μm or less, preferably 1,000 μm or less. When the distance α is equal to or higher than the above lower limit, it is possible to prevent a decrease in color uniformity or to suppress color unevenness.

(4) The value (y/α) obtained by dividing the distance y by the distance α is, for example, 1 or more, preferably 1.2 or more, and further, for example, 2.5 or less, preferably 2.0 or less. When y/α is equal to or less than the above upper limit, color unevenness can be suppressed.

[Manufacturing method of LED for phosphor layer sealing]

Next, a method of manufacturing the phosphor layer-sealed LED shown in FIG. 1 and a method of manufacturing an LED device using the phosphor layer-sealed LED will be described with reference to FIGS. 2A to 2F.

The method for producing the phosphor layer-sealed LED 1 includes the steps of producing a sealing sheet 5 as an example of a cover sheet having the transparent layer 4 and the phosphor layer 3 (see FIG. 2A) so that the phosphor layer 3 is coated. Step of arranging sealing sheet 5 in a plurality of LEDs (Refer to FIG. 2C) and the step of cutting the sealing sheet 5 so that the LED layer 1 in which the phosphor layer is sealed is singulated (see FIG. 2D). The step of producing the sealing sheet 5 (refer to FIG. 2A) includes the steps of preparing the transparent layer 4 and forming the phosphor layer 3 on the surface of the transparent layer 4.

As shown in FIG. 2A, in the step of preparing the transparent layer 4, in the case where the transparent layer 4 is formed of the transparent resin composition, the release sheet 6 shown by an imaginary line is first prepared.

The release sheet 2 is detachable in order to protect the transparent layer 4 during the period before the LED 2 is sealed by the transparent layer 4 (the transparent layer 4 is cured in the case where the transparent layer 4 is formed of the thermosetting resin composition). It is bonded to the back surface of the transparent layer 4 (the lower surface in Fig. 1A). In other words, the release sheet 6 is a flexible film which is laminated on the back surface of the transparent layer 4 so as to cover the back surface of the transparent layer 4 when the sealing sheet 5 is shipped, transported, and stored, and is sealed immediately. The sheet 5 is peeled off from the back surface of the transparent layer 4 in a form that can be bent into a substantially U shape. That is, the release sheet 6 contains only the flexible film. Further, the bonding surface of the release sheet 6, that is, the contact surface with the transparent layer 4 may be subjected to a release treatment such as fluorine treatment as needed.

The release sheet 6 may, for example, be a polymer film such as a polyethylene film or a polyester film (PET or the like), for example, a ceramic sheet such as a metal foil. Preferred are polymer films. Moreover, the shape of the release sheet 2 is not particularly limited, and for example, it is formed in a substantially rectangular shape (including a short strip shape or a long strip shape) in plan view. The thickness of the release sheet 6 is, for example, 1 μm or more, preferably 10 μm or more, and is, for example, 2000 μm or less, preferably 1,000 μm or less.

Then, in the case where the transparent layer 4 is formed of the transparent resin composition, the varnish of the transparent resin composition is applied to the surface of the release sheet 6. When the transparent resin composition is applied to the surface of the release sheet 6, for example, a coating device such as a dispenser, an applicator, or a slit die coater can be used.

The coating film of the transparent resin composition is formed by coating the transparent resin composition on the release sheet 6.

Thereafter, the coating film is completely cured (C-staged). The heating temperature is 80 ° C or higher, preferably 100 ° C or higher, and further 200 ° C or lower, preferably 150 ° C. under. Further, the heating time is, for example, 10 minutes or longer, preferably 30 minutes or longer, and for example, 5 hours or shorter.

Thereby, the A-stage transparent resin composition in the coating film is completely cured (C-staged).

In the case where the transparent resin composition contains the addition reaction-curable polydecane resin composition, the hydrogenation reaction of the alkenyl group and/or the cycloalkenyl group with the hydroquinone group is carried out to the middle, and the reaction is temporarily stopped.

On the other hand, when the transparent resin composition contains a condensation reaction-addition reaction hardening type polyoxyxylene resin, the condensation reaction is completed.

Thereby, the transparent layer 4 is formed from the B-stage transparent resin composition.

On the other hand, when the transparent layer 4 is formed of an inorganic substance, specifically, an inorganic substance previously formed into a plate shape is prepared. It is preferable to prepare a glass plate without using the release sheet 6 (the imaginary line of Fig. 2A).

Thereby, the transparent layer 4 is formed from an inorganic substance.

Then, as shown in FIG. 2A, a phosphor layer 3 is formed on the surface of the transparent layer 4.

In the case where the phosphor layer 3 is formed of the phosphor resin composition, the phosphor resin composition is applied onto the surface of the transparent layer 4 by using the above coating apparatus. Thereby, a coating film of the phosphor resin composition is formed.

Then, when the phosphor resin composition contains a thermosetting resin composition which can be in a B-stage state, the coating film is B-staged. The heating conditions are the same as the above range. Thereby, the coating film is B-staged.

When the phosphor resin composition contains an addition reaction-curable polydecane resin composition, the hydrogenation reaction of the alkenyl group and/or the cycloalkenyl group with the hydroquinone group is carried out to the middle, and the reaction is temporarily stopped.

On the other hand, when the phosphor resin composition contains a condensation reaction-addition reaction hardening type polyoxyxylene resin, the condensation reaction is completed.

Thereby, the phosphor layer 3 is formed of the phosphor resin composition.

Then, the plate-shaped phosphor layer 3 is disposed on the upper surface of the transparent layer 4.

Thereby, as shown in FIG. 2A, the sealing sheet 5 provided with the transparent layer 4 and the phosphor layer 3 is obtained. Preferably, the sealing sheet 5 comprises a transparent layer 4 and a phosphor layer 3.

The sealing sheet 5 has a flat plate shape, specifically, has a specific thickness, and extends in the left-right direction and the front-rear direction and has a flat front surface and a flat back surface. Further, the sealing sheet 5 is a component of the LED device 60, that is, a component for forming the LED device 60, and is not the LED device 60 (see FIG. 2F below), and does not include the LED 2 and the substrate 50 on which the LED 2 is mounted. Separate parts are individually distributed and are industrially available devices.

Further, when the transparent layer 4 is formed of a transparent resin composition, the sealing sheet 5 is provided with the release sheet 6, the transparent layer 4, and the phosphor layer 3. It is preferable that the sealing sheet 5 includes the release sheet 6, the transparent layer 4, and the phosphor layer 3.

In addition, as shown in FIG. 2B, a plurality of LEDs 2 are prepared. Specifically, a plurality of LEDs 2 are disposed on the upper surface of the support board 7.

The support plate 7 is sealed by coating a plurality of LEDs 2 on the phosphor layer 3 to obtain a sealed LED assembly 8 (see FIG. 2C below), and the sealed LED assembly 8 is cut to obtain a phosphor layer-sealed LED 1 and then The phosphor layer-sealed LED 1 is peeled off, and during this period, the support plate 7 is detachably attached to the exposed surface of the LED 2 of the phosphor layer-sealed LED 1 in order to protect the LED 2 of the phosphor layer-sealed LED 1 (Fig. 1 lower surface 21). In other words, the support plate 7 is a peeling plate that supports the LED 2 during shipment, transport, and storage of the LED 1 sealed by the phosphor layer, and is laminated on the lower surface 21 of the LED 2 so as to cover the lower surface 21 of the LED 2, that is, the substrate is to be Before the LED 2 is mounted, the phosphor layer sealed LED 1 can be peeled off as shown by the imaginary line of FIG. 2D. That is, the support plate 7 includes only the peeling plate.

The support plate 7 is formed of the same material as the above-mentioned release sheet 6. Further, the support sheet 7 may be formed by the heat-peelable sheet which can easily peel off the sealed LED assembly 8 by heating. Further, a pressure-sensitive adhesive layer can be disposed on the surface of the support sheet 7.

The thickness of the support plate 7 is, for example, 10 μm or more, preferably 50 μm or more, and is, for example, 1000 μm or less, preferably 100 μm or less.

Further, a plurality of LEDs 2 are disposed on the surface (upper surface) of the support plate 7. Specifically, a plurality of LEDs 2 are arranged side by side at intervals in the left-right direction and the front-rear direction. Further, a plurality of LEDs 2 are disposed on the surface (upper surface) of the support plate 7 such that the lower surface 21 of the LED 2 (including a bump (not shown) contacts the surface (upper surface) of the support plate 7.

The total distance P between the plurality of LEDs P, that is, the interval between the LEDs 2 and the LEDs 2 and the adjacent LEDs 2 is, for example, 0.3 mm or more, preferably 0.5 mm or more, and further, for example, 5 mm or less, preferably 3 mm or less. . Further, the interval between the plurality of LEDs 2 is, for example, 0.1 mm or more, preferably 0.3 mm or more, and for example, 3 mm or less, preferably 2 mm or less.

Thereafter, as shown by the arrow of FIG. 2B and FIG. 2C, a plurality of LEDs 2 are sealed by the sealing sheet 5.

For example, the sealing sheet 5 is crimped to the support plate 7 supporting a plurality of LEDs 2. It is preferable to thermocompression (hot press) the sealing sheet 5 to the support plate 7 supporting a plurality of LEDs 2.

Specifically, first, the sealing sheet 5, the plurality of LEDs 2, and the supporting plate 7 are placed on a flat plate press or the like including a heat source. Although not shown, the flat press has a lower mold and an upper mold disposed opposite to the upper side. Specifically, the release sheet 6 is placed on the upper surface of the lower mold so that the plurality of LEDs 2 face upward. Moreover, the sealing sheet 5 shown in FIG. 2A is turned upside down so that the phosphor layer 3 faces downward, and the peeling sheet 6 is disposed on the lower surface of the upper mold even if the phosphor layer 3 and the LED 2 face each other.

Further, the sealing sheet 5 and the plurality of LEDs 2 and the supporting plate 7 are hot-pressed by a flat press.

Regarding the temperature of the flat press, when the phosphor layer 3 and/or the transparent layer 4 contains a thermoplastic and thermosetting phenyl-based polyoxyxene resin composition, the temperature is a phenyl polyoxyl resin combination. Phenyl polycondensation is carried out once at the temperature of the thermoplasticization temperature of the substance or above. From the viewpoint of thermoplasticization and thermal curing of the oxygen resin composition, it is preferably a heat curing temperature or higher, and specifically, for example, 60 ° C or higher, preferably 80 ° C or higher, and, for example, 150 ° C or lower. Preferably, it is 120 ° C or less.

The pressing pressure is, for example, 0.1 MPa or more, preferably 1 MPa or more, and further, for example, 10 MPa or less, preferably 5 MPa or less.

The pressing time is, for example, 1 minute or longer, preferably 5 minutes or longer, and for example, 60 minutes or shorter, preferably 20 minutes or shorter.

In the case where the phosphor layer 3 contains a thermoplastic or thermosetting phenyl-based polyoxyxene resin composition, the phosphor layer 3 is plasticized by the above-described hot pressing. Next, a plurality of LEDs 2 are embedded by the phosphor layer 3 after plasticization. Specifically, as shown in FIG. 1, the upper surface 22 and the side surface 23 of the LED 2 are covered by the phosphor layer 3.

Further, when the transparent layer 4 contains a thermoplastic or thermosetting phenyl-based polyoxyxene resin composition, the transparent layer 4 is plasticized by the above-described hot pressing to adhere to the phosphor layer 3.

Thereby, as shown in FIG. 2C, a plurality of LEDs 2 are sealed by the phosphor layer 3 of the sealing sheet 5.

Then, when the phosphor layer 3 and/or the transparent layer 4 contains the two-stage reaction-curable resin composition in the B-staged state, it is C-staged.

In the case where the second-stage reaction curable resin composition contains a phenyl-based polyfluorene-oxygen resin composition, in the reaction (C-stage reaction) of the phenyl-based polyoxyxylene resin composition, the alkenyl group-containing polyoxyl The hydrogenation addition reaction of an alkenyl group and/or a cycloalkenyl group with a hydroxanyl group of a polyoxyalkylene group containing a hydroquinone group is further promoted. Thereafter, the alkenyl group and/or the cycloalkenyl group or the hydrofluorenyl group of the polyoxyalkylene group containing a hydroquinone group disappears, and the hydrogenation addition reaction of the hydrazine is completed, thereby obtaining a C-stage phenyl-based polyfluorene-oxygen resin. A product of the composition, that is, a cured product. That is, the phenyl-based polyoxyxene resin composition exhibits curability (specifically, thermosetting property) by the end of the hydrogenation addition reaction.

The above product is represented by the following average composition formula (3).

Average composition formula (3): R ⁵ _e SiO _(4-e)/2

(wherein R ⁵ represents an unsubstituted or substituted hydrocarbon group having 1 to 10 carbon atoms (excluding an alkenyl group and a cycloalkenyl group) having an unsubstituted or substituted phenyl group; e is 0.5 or more and 2.0 or less)

The unsubstituted or substituted hydrocarbon group having 1 to 10 carbon atoms represented by R ⁵ may be an unsubstituted or substituted carbon number of 1 to 10 represented by R ^{2 of} the formula (1). The monovalent hydrocarbon group and the unsubstituted or substituted hydrocarbon group having 1 to 10 carbon atoms represented by R ^{3 of} the formula (2) are the same. The unsubstituted monovalent hydrocarbon group is preferred, and the alkyl group having 1 to 10 carbon atoms and the aryl group having 6 to 10 carbon atoms are more preferred, and a phenyl group and a methyl group are preferably used in combination.

e is preferably 0.7 or more and 1.0 or less.

Further, the content ratio of the phenyl group in R ⁵ of the average composition formula (3) of the product is, for example, 30 mol% or more, preferably 35 mol% or more, and further, for example, 55 mol% or less, preferably It is 50% or less.

The content ratio of the phenyl group in R ⁵ of the average composition formula (3) of the product is directly bonded to the monovalent hydrocarbon group of the fluorene atom (in the average composition formula (3), represented by R ⁵ ) Phenyl concentration.

The content ratio of the phenyl group in R ⁵ of the average composition formula (3) of the product was calculated by ¹ H-NMR and ²⁹ Si-NMR. The detailed calculation method of the content ratio of the phenyl group in R ⁵ is calculated, for example, by ¹ H-NMR and ²⁹ Si-NMR based on the description of WO2011/125463 and the like.

Then, as shown by the arrow in FIG. 2C, the release sheet 6 is peeled off from the transparent layer 4.

Thereby, the sealed LED assembly 8 including the plurality of LEDs 2, the phosphor layer 3, and the transparent layer 4 is obtained in a state supported by the support plate 7.

Thereafter, as shown by the single-dot chain line of FIG. 2D, the sealed LED assembly 8 is cut so that a plurality of LEDs 2 are singulated. Specifically, the phosphor layer 3 and the transparent layer 4 corresponding to the respective LEDs 2 are cut in the front-rear direction and the left-right direction. Thereby, the state supported by the support board 7 The LED 1 having the LED layer 2, the phosphor layer 3 embedded and coated with the LED 2, and the phosphor layer sealed on the transparent layer 4 on the upper surface of the phosphor layer 3 is obtained.

Then, as shown by the arrow and the imaginary line of FIG. 2D, the LED1 sealed with a plurality of phosphor layers is peeled off from the support plate 7.

Thereby, as shown in FIG. 2E, the LED 1 having the LED layer 2, the phosphor layer 3 in which the LED 2 is buried and covered, and the phosphor layer sealed on the transparent layer 4 on the upper surface of the phosphor layer 3 is obtained.

The phosphor layer-sealed LED 1 does not include the support plate 7 (see FIG. 2C) and the substrate 50 (see FIG. 2F below), and preferably includes the LED 2, the phosphor layer 3, and the transparent layer 4. That is, the phosphor layer-sealed LED 1 is not the LED device 60 (FIG. 2F) described below, that is, the substrate 50 included in the LED device 60 is not included. In other words, the phosphor layer-sealed LED 1 is configured not to be electrically connected to a terminal (not shown) provided in the substrate 50 of the LED device 60. Further, the phosphor layer-sealed LED1 is one of the components of the LED device 60, that is, a component for manufacturing the LED device 60, and is circulated as a separate component, and is an industrially usable device.

Thereafter, a plurality of phosphor layer-sealed LEDs 1 are screened according to the emission wavelength or the luminous efficiency.

Then, as shown in FIG. 2F, the phosphor layer-sealed LED 1 is mounted to the substrate 50.

Specifically, first, a substrate 50 having a terminal (not shown) provided on the upper surface is prepared.

The substrate 50 has a substantially rectangular flat plate shape extending in the front-rear direction and the left-right direction, and is, for example, an insulating substrate. Further, the substrate 50 includes terminals (not shown) disposed on the upper surface.

Thereafter, as shown in FIG. 2F, the phosphor layer-sealed LED 1 is mounted to the substrate 50.

Specifically, the bumps (not shown) of the LEDs 2 in the LED 1 sealed by the phosphor layer are brought into contact with the terminals (not shown) of the substrate 50 to electrically connect the electrodes. That is, the LED 2 of the LED 1 sealed with the phosphor layer is flip-chip mounted on the substrate 50. Further, the lower surface 32 of the phosphor layer 3 is brought into contact with the substrate 50.

Thereby, the LED 1 having the substrate 50 and the phosphor layer mounted on the substrate 50 is obtained. LED device 60. Preferably, the LED device 60 includes an LED 1 in which the substrate 50 and the phosphor layer are sealed. That is, the LED device 60 does not include the release sheet 6 and/or the support plate 7, and preferably includes the substrate 50, the LED 2, the phosphor layer 3, and the transparent layer 4.

[Effects of the first embodiment]

Further, as shown in FIG. 1, the phosphor layer-sealed LED 1 includes the transparent layer 4 which covers the upper surface 31 of the phosphor layer 3, so that the luminous intensity can be improved. Specifically, the interface between the transparent resin composition (transparent layer 4) and the air can be separated (away from) the substrate 50 or the LED 2 (the interface between the LED 2 and the phosphor layer 3) as a light absorber. Therefore, light that is emitted from the LED 2 toward the upper side and wavelength-converted by the phosphor layer 3 and light that has not been wavelength-converted by the phosphor layer 3 and transmitted through the phosphor layer 3 occurs even at the interface between the transparent resin composition (transparent layer 4) and the air. Since the reflection is not easily returned to the substrate 50 or the LED 2 (light absorber), the luminous intensity of the LED 1 sealed by the phosphor layer can be improved.

Further, since the phosphor layer-sealed LED 1 satisfies all of (1) to (4) of the above x, y, z, and α, the luminescence intensity can be further improved and excellent color uniformity can be obtained, and color suppression can be suppressed. Uneven.

Further, in the LED 1 in which the phosphor layer is sealed, when the refractive index RIp of the first transparent composition (the transparent resin composition contained in the phosphor layer 3) is 1.45 or more and 1.60 or less, the phosphor layer can be sealed. The luminous intensity of LED1 is improved.

Further, in the LED 1 in which the phosphor layer is sealed, the second transparent composition (the transparent layer 4 is included in the refractive index RIp from the first transparent composition (the transparent resin composition contained in the phosphor layer 3)) When the refractive index RIt of the transparent resin composition (refractive index RIp-refractive index RIt) is -0.70 or more and 0.20 or less, the luminous intensity of the LED 1 sealed by the phosphor layer can be improved.

Further, in the LED 1 in which the phosphor layer is sealed, when the RIp-RIt is 0.05 or more, the luminous intensity of the LED 1 sealed by the phosphor layer can be further improved.

Moreover, in the LED 1 sealed by the phosphor layer, if the distance α exceeds 50 μm, Color uniformity is improved.

According to the method for producing the LED 1 in which the phosphor layer is sealed, the phosphor layer-sealed LED 1 can be easily manufactured by using the sealing sheet 5.

According to the method for producing the phosphor layer sealed LED 1, it is possible to easily produce the phosphor layer sealed LED 1 having a desired size (y, z, α, etc.).

[variation]

In the modification, members and steps that are the same as those in the first embodiment are denoted by the same reference numerals, and the detailed description thereof will be omitted.

In the first embodiment, the LED 2, the phosphor layer 3, and the transparent layer 4 are each formed in a substantially rectangular shape in plan view, but the shape thereof is not particularly limited. Although not shown, the LED 2, the phosphor layer 3, and the transparent layer 4 may be formed, for example, in a substantially circular shape in plan view and a substantially polygonal shape in plan view (excluding a substantially rectangular shape).

Further, in the first embodiment, as shown in FIG. 1, the transparent layer 4 is formed in a substantially rectangular shape in cross section, and although not shown, it may be formed, for example, in a cross-sectional dome shape (or a convex lens shape) in which the upper surface is curved. . In this case, the distance z is the distance from the upper surface 31 of the phosphor layer 3 to the uppermost surface of the transparent layer 4.

Further, the transparent layer 4 may be formed into a substantially conical shape in which the flat cross section is gradually reduced toward the upper side, and specifically, a polygonal shape such as a quadrangular pyramid or a triangular pyramid.

Further, in the first embodiment, as shown in FIG. 1, the lower surface 32 of the periphery of the accommodating portion 30 of the phosphor layer 3 is configured to be in contact with the phosphor side contacting the substrate 50. However, as shown, for example, in FIG. 5, the lower surface 32 can be constructed in a form that is spaced apart from the substrate 50 to ensure a possible surface.

As shown in FIG. 5, the peripheral lower surface 32 of the accommodating portion 30 of the phosphor layer 3 is exposed from the LED 2 and is located on the upper side portion of the lower surface 21 of the LED 2. Specifically, the lower surface 32 of the phosphor layer 3 is located between the lower surface 21 and the upper surface 22 of the LED 2 when projected in the plane direction. That is, when the lower surface 32 of the phosphor layer 3 is projected in the front-rear direction and the left-right direction, It is disposed at the position included in the side 23 of the LED 2.

Thereby, the lower surface 32 of the phosphor layer 3 is exposed to the lower end portion of the side surface 23 of the LED 2.

Further, in the first embodiment, the phosphor layer 3 and the transparent layer 4 are sequentially C-staged, that is, the phosphor layer 3 is C-staged, and then the transparent layer 4 is C-staged, for example, The phosphor layer 3 and the transparent layer 4 in the B-stage state are simultaneously C-staged.

Moreover, in the above-described first embodiment, as shown in FIGS. 2A to 2E, the sealing sheet 5 is formed on the release sheet 6, and then the LED 2 is sealed by the sealing sheet 5.

However, as shown in FIGS. 3A to 4H, the varnish of the phosphor resin composition and the transparent resin composition are sequentially dropped (perfused) on the support sheet 7 without forming the sealing sheet 5 on the release sheet 6. The varnish is such that the phosphor layer 3 and the transparent layer 4 can be formed in order.

In this method, as shown in Fig. 3C, the varnish of the phosphor resin composition is dropped (perfused) onto the support plate 7.

When the varnish of the phosphor resin composition is dropped onto the support plate 7, first, as shown in FIG. 3A, one LED 2 is placed on the upper surface of the support plate 7. Thereby, one LED 2 supported by the support board 7 is prepared.

Further, as shown in FIG. 3A, the first barrier rib 11 is prepared.

The first barrier rib 11 is formed in a substantially rectangular shape in plan view. Further, a first opening portion 13 that penetrates the first barrier rib 11 in the vertical direction is formed in a central portion of the first barrier rib 11 . The first opening portion 13 is formed in a substantially rectangular shape in plan view corresponding to the outer shape of the phosphor layer 3 .

Examples of the material of the first barrier rib 11 include a resin, a resin impregnated glass cloth, and a metal. These may be used alone or in combination. Preferably, the resin is listed.

Examples of the resin include a thermosetting resin and a thermoplastic resin. A thermosetting resin is preferred. The thermosetting resin is preferably a single-stage reaction curable resin which cannot be in a B-stage state. As such a single-stage reaction-curable resin, a single-stage reaction-curable methyl-based polyoxyxene resin composition is mentioned. As the single-stage reaction-curable methyl polyoxy resin composition, for example, ELASTOSIL series (Wacker Asahikasei Silicone) can be used. The company manufactures, specifically, a methyl type polyoxyl resin composition such as ELASTOSIL LR7665, and a commercial item such as KER series (manufactured by Shin-Etsu Silicones Co., Ltd.).

Further, the resin may be prepared in the form of a resin composition containing a filler.

The thickness of the first barrier rib 11 is, for example, 100 μm or more, preferably 200 μm or more, more preferably 400 μm or more, and for example, 1500 μm or less.

Then, as shown in FIG. 3B, the first barrier rib 11 is disposed on the upper surface of the support plate 7 so as to surround the LED 2.

When the first barrier rib 11 is disposed on the upper surface of the support plate 7 so as to surround the LED 2, first, when the material of the first barrier rib 11 is a resin, a varnish containing a resin is prepared, and then the varnish is applied to the varnish. The surface of the peeled sheet shown. Thereafter, when the material contains a thermosetting resin, the varnish is heated to be hardened. Thereafter, the cured product profile is processed into the above pattern.

Then, as shown by the arrow in FIG. 3A and FIG. 3B, the first barrier rib 11 is placed on the upper surface of the support plate 7 so that the LED 2 is inserted into the first opening 13 of the first barrier rib 11 .

Alternatively, as shown in FIG. 3B, the varnish may be directly applied to the periphery of the LED 2 in the above-described pattern, and the first barrier rib 11 may be directly formed on the upper surface of the support plate 7.

Thereby, the first barrier rib 11 is disposed on the upper surface of the support plate 7 so as to surround the LED 2 .

Then, as shown in FIG. 3C, the varnish of the phosphor resin composition is dropped into the first opening 13 of the first barrier rib 11 of the support plate 7. Specifically, the varnish is dropped into the first opening portion 13 such that the liquid surface of the varnish and the upper surface of the first barrier rib 11 are flush with each other.

Then, when the phosphor resin composition contains a thermosetting resin composition which can be in a B-stage state, the phosphor resin composition is B-staged.

Thereby, the phosphor layer 3 covering the upper surface 22 and the side surface 23 of the LED 2 is formed in the first opening 13 of the first barrier rib 11.

Then, as shown by the arrow in FIG. 3C, the first barrier rib 11 is peeled off from the support plate 7. at this time, The side surface of the first opening portion 13 of the first barrier rib 11 is peeled off from the side surface 33 of the phosphor layer 3.

Then, as shown in FIG. 3D and FIG. 3E, the second barrier rib 12 is placed on the upper surface of the support plate 7.

The second barrier rib 12 is configured in the same manner as the first barrier rib 11 except for the thickness. The thickness of the second barrier rib 12 is formed thicker than the thickness of the first barrier rib 11 , specifically, the phosphor layer 3 can be embedded and the thickness of the transparent layer 4 can be formed. The thickness of the second barrier rib 12 is, for example, 0.1 μm or more, preferably 0.2 μm or more, and is, for example, 2 μm or less, preferably 1 μm or less.

As shown in FIG. 3D, in the second barrier rib 12, a second opening portion 14 having the same shape as that of the phosphor layer 3 is formed in a plan view.

As shown in FIG. 3E, the second barrier rib 12 is placed on the upper surface of the support plate 7 so that the phosphor layer 3 is inserted into the second opening portion 14 on the support plate 7. Thereby, the phosphor layer 3 is fitted into the second opening portion 14.

Thereafter, as shown in FIG. 4F, the varnish of the transparent resin composition is dropped (perfused) into the second opening portion 14 on the upper surface of the phosphor layer 3. Specifically, the varnish is dropped into the second opening portion 14 such that the liquid surface of the varnish and the upper surface of the second barrier rib 12 are flush with each other.

Then, when the transparent resin composition contains a thermosetting resin composition which can be in a B-stage state, the transparent resin composition is thermally cured (specifically, C-staged). Thereby, the transparent layer 4 is formed on the upper surface of the phosphor layer 3.

When the transparent resin composition is C-staged, when the phosphor resin composition of the phosphor layer 3 is in the B-staged state of the two-stage reaction curable resin composition, it is C-staged.

Thereafter, as shown in FIG. 4G, the phosphor layer 3 and the interface between the transparent layer 4 and the second barrier rib 12 are cut.

Thereby, the LED 1 having the phosphor layer sealing of one LED 2, the phosphor layer 3, and the transparent layer 4 is obtained in a state supported by the support plate 7.

Then, as shown by the arrow of FIG. 4G, the imaginary line, and FIG. 4H, the LED1 sealed with the phosphor layer is peeled off from the support plate 7.

Thereafter, the phosphor layer sealed LED 1 is screened according to the emission wavelength or the luminous efficiency.

Thereafter, as shown in FIG. 4I, the phosphor layer-sealed LED 1 is mounted to the substrate 50.

Further, according to the method of FIGS. 4A to 4I, since it is not necessary to temporarily manufacture the sealing sheet 5 on the release sheet 6 as in the first embodiment (see FIG. 2A), the varnish and transparent resin of the phosphor resin composition can be used. The varnish of the composition is used to form the phosphor layer 3 and the transparent layer 4 in a simple manner.

<Second embodiment>

In the second embodiment, members and steps that are the same as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

[Glow-emitting layer sealed LED]

In the first embodiment, the side surface 33 of the phosphor layer 3 is exposed as shown in Fig. 1 . However, in the second embodiment, as shown in FIG. 6, the side surface 33 of the phosphor layer 3 is covered with the transparent layer 4.

That is, the transparent layer 4 covers the upper surface 31 and the side surface 33 of the phosphor layer 3. Further, the transparent layer 4 is formed into a shape including the phosphor layer 3 in plan view. The transparent layer 4 has side portions 45 that cover the side faces 33 of the phosphor layer 3. Further, the lower surface 41 of the side portion 45 of the transparent layer 4 is a transparent side contact surface which can be in contact with the substrate 50 (imaginary line).

Further, since the transparent layer 4 has the side portion 45, the side surface 43 (transparent side connecting surface) of the transparent layer 4 is disposed opposite to the outside of the side surface 33 of the phosphor layer 3 with a distance β therebetween.

The distance β between the side surface 43 of the transparent layer 4 and the side surface 33 of the phosphor layer 3 is the length in the left-right direction and the length in the front-rear direction (minimum length) of the side portion 45 of the transparent layer 4.

The distance β can be appropriately selected from the range exceeding 0.

In the second embodiment, it is preferable to satisfy the following (3)' instead of the first embodiment (1). (3) in ~(4).

(3) The sum of the distance α and the distance β (α + β) is, for example, 50 μm or more, preferably more than 50 μm, more preferably 100 μm or more, and further, for example, 2000 μm or less, preferably 1,000 μm or less. When α+β is at least the above lower limit, it is possible to prevent color uniformity from being lowered or to suppress color unevenness. When α+β is at most the above upper limit, wasteful use of the material can be suppressed.

Further, in the first embodiment, β is 0. Therefore, in the present creation, β is preferably 0 or more.

[Manufacturing method of LED for phosphor layer sealing]

Next, a method of manufacturing the phosphor layer-sealed LED shown in FIG. 6 and a method of manufacturing an LED device using the phosphor layer-sealed LED will be described with reference to FIGS. 7A to 8L.

The method for producing the phosphor layer sealed LED 1 includes the step of producing the fluorescent sealing sheet 15 having the phosphor layer 3 (an example of a phosphor layer preparing step, see FIG. 7A) so that the phosphor layer 3 is coated with plural numbers. The step of arranging the fluorescent sealing sheet 15 in the form of LEDs 2 (an example of the phosphor layer arranging step, see FIG. 7B) and the step of removing the phosphor layer 3 located at a long distance with respect to the LED 2 (the singulation/removal step) For example, referring to FIG. 7D), a step of manufacturing the transparent sheet 18 having the transparent layer 4 (an example of a transparent layer preparation step, see FIG. 8G), and a step of rearranging the phosphor layer-sealed LED 1 on the second support sheet 17 ( 8G) and the step of disposing the transparent sheet 18 on the phosphor layer 3 (an example of a transparent layer disposing step, FIG. 8H).

In this method, first, as shown in FIG. 7A, a plurality of LEDs are prepared.

Further, a fluorescent sealing sheet 15 having the phosphor layer 3 is prepared.

When the fluorescent sealing sheet 15 is prepared, first, as shown in FIG. 7A, the release sheet 6 is prepared.

Then, the phosphor layer 3 is formed in a sheet shape on the lower surface of the release sheet 6. The method of forming the phosphor layer 3 is the same as the method of forming the phosphor layer 3 in the first embodiment.

Thereby, the fluorescent sealing sheet 15 which has the peeling sheet 6 and the phosphor layer 3 formed in the lower surface of the peeling sheet 6 is prepared. Further, the fluorescent sealing sheet 15 does not have the transparent layer 4 described below (see FIG. 8G). Preferably, the fluorescent sealing sheet 15 comprises a release sheet 6 and a phosphor layer 3.

Then, as shown in FIG. 7B, a plurality of LEDs 2 are sealed by the phosphor layer 3. That is, the fluorescent sealing sheet 15 is crimped to the support plate 7 supporting the LED 2. Thereby, a plurality of LEDs 2 are embedded in the lower surface 32 of the fluorescent sealing sheet 15, and are formed in a shape corresponding to the surfaces of the plurality of LEDs 2. On the other hand, the upper surface 31 of the phosphor layer 3 of the fluorescent sealing sheet 15 is formed into a flat shape. Furthermore, the phosphor layer 3 covers the side surface 23 and the upper surface 22 of the LED 2.

Thereafter, in this method, as shown in FIG. 7C, the release sheet 6 is peeled off from the phosphor layer 3.

Then, in this method, as shown in FIG. 7D, the phosphor layer 3 located at a long distance with respect to the LED 2 is removed.

Specifically, the phosphor layer 3 located at a long distance with respect to the LED 2 is cut by a disk-shaped wafer dicing saw (cutting blade) 9 having a specific width (wall thickness). Thereby, the length α of the side portion 35 is adjusted to a desired size in the phosphor layer 3. That is, the phosphor layer 3 is subjected to outer shape processing so as to have a specific size.

At the same time, the phosphor layer sealed LED1 is singulated. In other words, the fluorescent sealing sheet 15 is cut so that the LED 1 in which the phosphor layer is sealed is singulated. At this time, the phosphor layer 3 covering the side surface 23 of the LED 2 remains.

Then, as shown in FIG. 7E, thereafter, the LED 1 sealed by the singulated phosphor layer is peeled off from the support plate 7.

Thereby, the LED 1 having the phosphor layer sealed with the LED 2 and the phosphor layer 3 having a specific size is obtained. In the second embodiment, the LED 1 sealed with the phosphor layer shown by the imaginary line of FIG. 7E and the solid line of FIG. 7F does not have the transparent layer 4. That is, the phosphor layer sealed LED 1 preferably includes the LED 2 and the phosphor layer 3.

In this method, as shown in FIG. 8G, the LEDs 1 in which a plurality of phosphor layers are sealed are arranged in the second support plate 17 at intervals in the front-rear direction and the left-right direction. That is, the phosphor layer sealed LED 1 is further disposed on the second support plate 17.

The second support plate 17 has the same configuration as the above-described support plate 7.

Further, as shown in FIG. 8G, a transparent sheet 18 having a transparent layer 4 is prepared.

When the transparent sheet 18 is prepared, first, as shown in FIG. 8G, the transparent layer 4 is formed in a sheet shape on the lower surface of the second release sheet 19. The second release sheet 19 has the same configuration as the release sheet 6 described above. The method of forming the transparent layer 4 is the same as the method of forming the phosphor layer 3 in the first embodiment. The second transparent composition preferably contains a filler.

Thereby, the transparent sheet 18 which has the 2nd peeling sheet 19 and the transparent layer 4 formed in the lower surface of the 2nd peeling sheet 19 is prepared.

Furthermore, the transparent sheet 18 does not have the above-described phosphor layer 3. It is preferable that the transparent sheet 18 includes the second release sheet 19 and the transparent layer 4.

Then, in this method, as shown in FIG. 8H, a plurality of phosphor layers 3 covering a plurality of LEDs 2 are covered by the transparent layer 4.

Specifically, the second release sheet 19 is pressure-bonded to the second support plate 17 of the LED 1 that supports the phosphor layer sealing.

Further, in the case where the transparent resin composition contains a phenyl-based polyoxyxene resin composition in a B-stage (semi-hardened) state, thermocompression bonding is performed. Thereby, the B-stage phenyl-based polyoxyxene resin composition is temporarily plasticized by heating, whereby the transparent resin composition is filled between the plurality of phosphor layers 3. Thereafter, the transparent resin composition is completely cured.

Then, as shown in FIG. 8I, the second release sheet 19 is peeled off from the transparent layer 4.

Thereby, as shown in FIG. 8I, the sealed LED assembly 8 in which a plurality of LEDs 2 are sealed is obtained in a state of being supported by the second support plate 17 by laminating the phosphor layer 3 of the transparent layer 4.

Then, as shown in FIG. 8J, the sealed LED assembly 8 is cut so that a plurality of LEDs 2 are singulated.

Then, as shown by the arrow of FIG. 8J and FIG. 8K, the LED1 sealed with a plurality of phosphor layers is peeled off from the support plate 7, and the phosphor layer-sealed LED 1 is obtained.

Thereafter, as shown in FIG. 8L, the phosphor layer-sealed LED 1 is mounted on the substrate 50 to obtain the LED device 60. Specifically, the lower surface 41 of the side portion 45 of the transparent layer 4 is brought into contact with the substrate 50 as in the imaginary line of FIG.

[Effects of the second embodiment]

Further, in the LED 1 in which the phosphor layer is sealed, as shown in FIG. 6, the transparent layer 4 has the side portion 45 covering the side surface 33 of the phosphor layer 3, so that the transparent resin composition can be obtained in the same manner as in the first embodiment. The transparent layer 4) is away from (away from) the interface of the air as the substrate 50 of the light absorber or the LED 2 (the interface between the LED 2 and the phosphor layer 3). Therefore, light that is emitted from the LED 2 toward the upper side and wavelength-converted by the phosphor layer 3 and light that has not been wavelength-converted by the phosphor layer 3 and transmitted through the phosphor layer 3 occurs even at the interface between the transparent resin composition (transparent layer 4) and the air. Since the reflection is not easily returned to the substrate 50 or the LED 2 (light absorber), the luminous intensity of the LED 1 sealed by the phosphor layer can be improved.

On the other hand, in the second embodiment, as shown in FIG. 8G, the LED 1 in which the phosphor layer of the phosphor layer 3 is sealed is disposed on the other support table different from the support plate 7, that is, 2 Support plate 17, and then, as shown in Fig. 8H, the phosphor layer 3 is covered by the transparent layer 4.

On the other hand, in the method of the first embodiment, as described above, unlike the second embodiment, it is not necessary to reposition the LEDs 2 on which the phosphor layer 3 is disposed on the second support plate 17. Therefore, the phosphor layer-sealed LED 1 is manufactured by a simple method.

Further, the phosphor layer 3 and the transparent layer 4 in the phosphor-sealed LED 1 can be formed into the side surface 33 and the side surface 43, respectively, by a simple method such as cutting.

As shown in FIG. 7A, the method for manufacturing the phosphor layer-sealed LED 1 includes a phosphor layer preparation step of preparing a fluorescent sealing sheet 15 having a sheet-like phosphor layer 3, and a sheet-like shape in which the LED 2 is covered. Since the phosphor layer 3 of the phosphor layer 3 is disposed, the phosphor layer 3 having excellent luminous intensity can be easily produced by using the flake phosphor layer 3.

Further, according to the method of manufacturing the phosphor layer sealed LED 1, as shown in FIG. 7D, in the singulation/removal step, after the phosphor layer arranging step and before the transparent layer arranging step, the phosphor layer 3 corresponds to When a plurality of LEDs 2 are singulated, the phosphor layer 3 located at a long distance with respect to the LED 2 is removed, so that the LED 1 having the desired size of the phosphor layer seal can be manufactured in a small number of steps.

Further, according to the method for manufacturing the phosphor layer sealed by the phosphor layer, as shown in FIG. 7D, in the singulation/removal step, the phosphor layer 3 covering the side surface 23 of the LED 2 remains, so that it can be easily manufactured. The phosphor layer of the phosphor layer 3 of the size is sealed by the LED1.

Further, according to the method for producing the LED 1 in which the phosphor layer is sealed, since the sheet-like transparent layer 4 is used as shown in FIG. 8G, the phosphor layer-sealed LED 1 excellent in luminous intensity can be easily produced.

[variation]

In the second embodiment, as shown in Fig. 6, the lower surface 32 of the periphery of the accommodating portion 30 of the phosphor layer 3 and the lower surface 41 of the side portion 45 of the transparent layer 4 are respectively attached to the substrate 50. The light body side contact possible surface and the transparent side contact possible surface form. However, as shown in FIG. 9, for example, the peripheral lower surface 32 of the accommodating portion 30 of the phosphor layer 3 and the lower surface 41 of the side portion 45 of the transparent layer 4 may be spaced apart from each other by the substrate 50. Make sure that the form of the face is made up.

As shown in FIG. 9, the peripheral lower surface 32 of the accommodating portion 30 of the phosphor layer 3 and the lower surface 41 of the side portion 45 of the transparent layer 4 are located on the upper side portion of the lower surface 21 of the LED 2. Specifically, the lower surface 32 of the surrounding portion of the accommodating portion 30 of the phosphor layer 3 and the lower surface 41 of the side portion 45 of the transparent layer 4 are located on the lower surface 21 and the upper surface 22 of the LED 2 when projected in the plane direction. between. In other words, when the lower surface 32 of the accommodating portion 30 of the phosphor layer 3 and the lower surface 41 of the side portion 45 of the transparent layer 4 are projected in the front-rear direction and the left-right direction, they are disposed at the side of the side surface 23 of the LED 2. .

Further, in the second embodiment, as shown in Fig. 7B, the fluorescent sealing sheet 15 is fluorescent. The upper surface 31 of the bulk layer 3 is formed in a flat shape. However, as shown in FIG. 10B, for example, the upper surface 31 of the phosphor layer 3 may be formed to have a concavo-convex shape corresponding to the surface of the plurality of LEDs 2.

Such a modification includes the steps of producing a fluorescent sealing sheet 15 having the phosphor layer 3 (an example of a phosphor layer preparing step, see FIG. 10A), and arranging the phosphor layer 3 with a plurality of LEDs 2 The step of the fluorescent sealing sheet 15 (an example of the phosphor layer arranging step, see FIG. 10B) and the step of removing the phosphor layer 3 located at a long distance from the LED 2 (an example of the removing step, see FIG. 10D) The step of transparent sheet 18 of transparent layer 4 (an example of transparent layer preparation step, see FIG. 8G), the step of rearranging LED 1 in which phosphor layer is sealed on second support plate 17 (see FIG. 8G), and the transparent sheet The step of disposing the material 18 on the phosphor layer 3 (Fig. 8H).

In this method, first, as shown in FIG. 10A, a plurality of LEDs are prepared.

Further, a fluorescent sealing sheet 15 having the phosphor layer 3 is prepared. When the fluorescent sealing sheet 15 is prepared, first, as shown in FIG. 10A, the release sheet 6 is prepared.

Then, the phosphor layer 3 is formed on the lower surface of the release sheet 6. Thereby, the fluorescent sealing sheet 15 which has the peeling sheet 6 and the phosphor layer 3 formed in the lower surface of the peeling sheet 6 is prepared.

Then, as shown in FIG. 10B, a plurality of LEDs 2 are sealed by the phosphor layer 3. That is, the fluorescent sealing sheet 15 is crimped to the support plate 7 supporting the LED 2. At this time, the fluorescent sealing sheet 15 is crimped to the LED 2 and the support plate 7 by being disposed on the upper side of the release sheet 6 and including a press having a concave upper mold and a flat lower mold corresponding to the plurality of LEDs 2. . The phosphor layer 3 has a plurality of convex portions corresponding to the plurality of LEDs 2 by the above pressing. The release sheet 6 is coated on the surface of the phosphor layer 3 (the side surface including the surface of the protrusion).

Thereafter, in this method, as shown in FIG. 10C, the release sheet 6 is peeled off from the phosphor layer 3.

Then, in this method, as shown in Fig. 10D, the phosphor layer 3 is cut, and then, as shown in Fig. 10E, the LED 1 sealed into a phosphor layer is singulated. Thereafter, it will be singulated The phosphor layer sealed LED 1 is peeled off from the support plate 7.

That is, as shown in FIG. 10D, the phosphor layer 3 is subjected to outer shape processing so as to have a specific size. Thereby, the phosphor layer 3 located at a long distance with respect to the LED 2 is removed.

Thereby, as shown in FIG. 10E, the LED 1 having the phosphor layer sealed with the LED 2 and the phosphor layer 3 having a specific size is obtained. In the second embodiment, the LED 1 sealed with the phosphor layer shown by the imaginary line of Fig. 10D and the solid line of Fig. 10E does not have the transparent layer 4. That is, the phosphor layer sealed LED 1 preferably includes the LED 2 and the phosphor layer 3.

Thereafter, the transparent layer 4 is laminated on the phosphor layer 3 in the same manner as in the second embodiment (Fig. 8G to Fig. 8L).

Specifically, as shown in FIG. 8G, first, the LEDs 1 sealed with a plurality of phosphor layers are arranged side by side in the front-rear direction and the left-right direction at intervals on the second support plate 17. Further, as shown in FIG. 8G, a transparent sheet 18 having a transparent layer 4 is prepared.

Then, as shown in FIG. 8H, a plurality of phosphor layers 3 covering a plurality of LEDs 2 are covered by the transparent layer 4. Specifically, the transparent layer 4 is pressure-bonded to the phosphor layer 3 and the second support plate 17 by a flat press equipped with a lower mold and a lower mold.

Then, as shown in FIG. 8I, the second release sheet 19 is peeled off from the transparent layer 4. Then, as shown in FIG. 8J, the sealed LED assembly 8 is cut so that a plurality of LEDs 2 are singulated. Then, as shown by the arrow of FIG. 8J and FIG. 8K, the LED1 sealed with a plurality of phosphor layers is peeled off from the support plate 7, and the phosphor layer-sealed LED 1 is obtained. Thereafter, as shown in FIG. 8L, the phosphor layer-sealed LED 1 is mounted on the substrate 50 to obtain the LED device 60.

Further, in the second embodiment, as shown in Fig. 8G, first, the transparent sheet 18 having the transparent layer 4 is prepared, and then the plurality of phosphor layers 3 covering the plurality of LEDs 2 are covered by the sheet-like transparent layer 4. However, for example, as shown in FIG. 8I, the transparent resin composition (varnish, powder, tablet, etc. prepared therefrom) is directly coated on the second layer by, for example, pouring, transfer molding, compression molding, or the like. The sheet 17 is formed into a transparent layer 4 on the support sheet 17.

<Third embodiment>

In the third embodiment, members and steps that are the same as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

[Glow-emitting layer sealed LED]

As shown in FIG. 11, the phosphor layer 3 has a flange portion 36 at its peripheral end portion.

The flange portion 36 is a protruding portion that protrudes outward in the surface direction from a portion of the side surface 23 covering the LED 2. The upper surface of the flange portion 36 of the phosphor layer 3 is located at a position where the portion of the phosphor layer 3 from the upper surface 22 of the coated LED 2 is further lowered to the lower side, and therefore, the upper surface of the flange portion 36 and the upper surface of the above portion There is a step difference between 31. The outer peripheral surface 37 of the flange portion 36 is exposed to the outside from the side surface 43 of the transparent layer 4. The outer peripheral surface 37 of the flange portion 36 and the side surface 43 of the transparent layer 4 are formed in the same plane in the vertical direction.

The upper surface 39 of the flange portion 36 is in contact with the lower surface 41 of the side portion 45 of the transparent layer 4.

[Manufacturing Method of LED for Phosphor Layer Sealing and Manufacturing Method of LED Device]

Next, a method of manufacturing the phosphor layer-sealed LED shown in FIG. 11 and a method of manufacturing an LED device using the phosphor layer-sealed LED will be described with reference to FIGS. 12A to 13I.

The method for manufacturing the phosphor layer-sealed LED 1 includes the steps of: manufacturing a fluorescent sealing sheet 15 (see FIG. 12A), and disposing the fluorescent sealing sheet 15 such that the phosphor layer 3 is coated with a plurality of LEDs 2. (Refer to FIG. 12B), a step of forming the concave portion 24 in the phosphor layer 3 between the adjacent LEDs 2 (see FIG. 12C), a step of manufacturing the transparent sheet 18 having the transparent layer 4 (see FIG. 12D), and a phosphor layer The step of arranging the transparent sheet 18 on the third side (see FIG. 13E) and the step of cutting the phosphor layer 3 and the transparent layer 4 located at a long distance from the LED 2 to singulate the LED layer sealed by the phosphor layer (see FIG. 13F).

As shown by the arrow in Fig. 12B, after the fluorescent sealing sheet 15 is placed on the support sheet 7, the release sheet 6 is peeled off.

The surface on the upper surface of the phosphor layer 3 has a flat surface.

As shown in FIG. 12C, when the concave portion 24 is formed on the phosphor layer 3, it will be located relative to the LED 2 The distant phosphor layer 3 is removed.

Specifically, the upper end portion of the phosphor layer 3 located at a long distance with respect to the LED 2 is half-cut by the wafer dicing saw 9.

The flange portion 36 is formed in the phosphor layer 3 by forming the concave portion 24.

Thereafter, as shown in FIG. 13E, the transparent layer 4 of the transparent sheet 18 is placed on the phosphor layer 3. The transparent layer 4 preferably contains a transparent resin composition containing a methyl polyoxyethylene resin composition from the viewpoint of obtaining an excellent gas permeability.

Then, as shown in FIG. 13F, the phosphor layer 3 and the transparent layer 4 which are located at a long distance with respect to the LED 2 are cut.

Thereby, as shown in FIG. 13G, a plurality of phosphor layer-sealed LEDs 1 are obtained in a state supported by the second support plate 7.

Thereafter, as shown in FIG. 13H, a plurality of phosphor layer-sealed LEDs 1 are transferred to the transfer sheet 25.

Thereafter, as shown in FIG. 13I, the phosphor layer-sealed LED 1 is retransferred from the transfer sheet 25 to the substrate 50, and the phosphor layer-sealed LED 1 is mounted to the substrate 50. Thereby, the LED device 60 is obtained.

[Effects of the third embodiment]

In the LED 1 in which the phosphor layer is sealed, as shown in FIG. 11, the inner peripheral surface 38 of the accommodating portion 30 covers the side surface 23 of the LED 2, and the outer peripheral surface 37 of the flange portion 36 of the phosphor layer 3 is exposed to the outside. Therefore, the light emitted from the LED 2 toward the outside is sufficiently wavelength-converted by the flange portion 36 of the phosphor layer 3, and the light emitted upward from the LED 2 is wavelength-converted by the phosphor layer 3 and the wavelength is not converted. The light converted through the phosphor layer 3 can be appropriately mixed in the transparent layer 4. As a result, the light-emitting property (inhibition of color unevenness) of the LED 1 sealed by the phosphor layer is excellent.

Moreover, the methyl-based polyoxyxene resin composition contained in the transparent layer 4 has a pressure-sensitive adhesive force (adhesion) higher than that of the phenyl-based polyoxymethylene resin composition. Therefore, FIG. 7A to FIG. 2 of the second embodiment In the method shown in FIG. 8H, if a plurality of LEDs 2 exposing the upper surface of the second support plate 17 are covered by the transparent layer 4, the transparent layer 4 is pressed with a relatively high pressure. The force (adhesion) pressure is then applied (adhered) to the upper surface of the second support plate 17. Therefore, there is a case where the transfer sheet 25 cannot be smoothly transferred (see FIGS. 13G and 13H) (that is, the transparent layer 4 does not peel off from the upper surface of the second support plate 17).

However, in the method shown in FIGS. 12A to 13I of the third embodiment, the transparent layer does not contact (pressure-sensitive) the upper surface of the support plate 7, so that the transparent layer 4 can be prevented from being pressed (adhered) to the support plate. 7.

Further, this method does not need to include the step of rearranging the phosphor layer-sealed LED 1 on the second support plate 17 as shown in FIG. 8G as in the second embodiment. Therefore, the number of manufacturing steps can be reduced, thereby reducing the manufacturing cost.

[variation]

A variation of the method of manufacturing the phosphor layer sealed LED 1 does not include the step of removing the phosphor layer 3 located at a long distance from the LED 2 as shown in FIG. 7D, and the LED 1 sealing the phosphor layer shown in FIG. 8G. The procedure of the support plate 17 is the same as the manufacturing method of the second embodiment.

In addition, this modification does not include the step of forming the concave portion 24 in the third embodiment (see FIG. 12C), and is the same as the manufacturing method of the third embodiment.

That is, in this method, first, as shown in FIG. 14A, a plurality of LEDs 2 are prepared on the support board 7. Further, a fluorescent sealing sheet 15 having the release sheet 6 and the phosphor layer 3 is prepared.

Then, as shown in FIG. 14B, a plurality of LEDs 2 are sealed by the phosphor layer 3 of the fluorescent sealing sheet 15. Specifically, the phosphor layer 3 is pressure-bonded to the plurality of LEDs 2 and the support sheets 7 by a flat plate press having a lower mold and a lower mold.

Thereby, the concave portion 24 is formed in the phosphor layer 3. Therefore, the flange portion 36 is formed in the phosphor layer 3.

Then, as shown in FIG. 14C, the release sheet 6 is peeled off from the phosphor layer 3.

Next, as shown in FIG. 14D, a transparent sheet 18 having the transparent layer 4 and the second release sheet 19 is prepared.

Then, as shown in FIG. 15E, the transparent layer 4 of the transparent sheet 18 is placed on the upper surface of the phosphor layer 3, and then the second release sheet 19 is peeled off from the transparent layer 4. Thereby, the sealed LED assembly 8 is obtained.

Thereafter, as shown in FIG. 15F, the sealed LED assembly 8 is cut and singulated into a phosphor layer-sealed LED 1.

Thereby, as shown in FIG. 15G, the phosphor layer-sealed LED 1 is obtained.

Thereafter, after the phosphor layer-sealed LED 1 is screened, as shown in FIG. 15H, the LED layer 1 sealed with the selected phosphor layer is mounted on the substrate 50 to obtain an LED device 60.

Further, in this modification, the same operational effects as those of the third embodiment described above are exhibited.

Further, the method shown in FIGS. 14A to 15G does not need to include the phosphor layer 3 which is located at a long distance with respect to the LED 2 as shown in FIG. 7D, as compared with the method of manufacturing the phosphor layer sealed by the phosphor layer in the second embodiment. The step and the step of rearranging the phosphor layer sealed LED 1 on the second support plate 17 shown in FIG. 8G. Therefore, the number of manufacturing steps can be reduced, thereby reducing the manufacturing cost.

[Examples]

The specific values such as the blending ratio (content ratio), the physical property value, and the parameter used in the following descriptions may be replaced by the blending ratio (content ratio), physical property value, and parameters described in the above-mentioned "embodiment". The upper limit (defined as "below", "not reached") or lower (defined as "above", "exceeded").

<Synthesis of alkenyl group-containing polyoxyalkylene oxide and hydroxanyl group-containing polyoxyalkylene oxide>

Synthesis Example 1

Four-necked flask equipped with a blender, reflux cooling tube, input port and thermometer In the middle, 93.2 g of 1,3-divinyl-1,1,3,3-tetramethyldioxane, 140 g of water, 0.38 g of trifluoromethanesulfonic acid and 500 g of toluene were mixed and mixed while stirring. A mixture of 729.2 g of methylphenyldimethoxydecane and 330.5 g of phenyltrimethoxydecane was added dropwise over 1 hour, followed by heating under reflux for 1 hour. Thereafter, the mixture was cooled, the lower layer (aqueous layer) was separated and removed, and the upper layer (toluene solution) was washed with water three times. To the toluene solution after washing with water, 0.40 g of potassium hydroxide was added, and the water was removed from the water separation tube while refluxing. After the removal of water was completed, the mixture was further refluxed for 5 hours to be cooled. Thereafter, 0.6 g of acetic acid was added for neutralization, and then filtered to obtain a toluene solution, and the obtained toluene solution was washed with water three times. Thereafter, concentration under reduced pressure was carried out, whereby a liquid alkenyl group-containing polyoxane A was obtained. The average unit formula and average composition formula of the alkenyl group-containing polyoxosiloxane A are as follows.

Average unit formula: ((CH ₂ =CH)(CH ₃ ) ₂ SiO _1/2 ) _0.15 (CH ₃ C ₆ H ₅ SiO _2/2 ) _0.60 (C ₆ H ₅ SiO _3/2 ) _0.25

Average composition: (CH ₂ =CH) _0.15 (CH ₃ ) _0.90 (C ₆ H ₅ ) _0.85 SiO _1.05

That is, the alkenyl group-containing polyoxyalkylene A is represented by the above average composition formula (1) in which R ¹ is a vinyl group, R ² is a methyl group and a phenyl group, and a=0.15 and b=1.75.

Further, the weight average molecular weight in terms of polystyrene of the alkenyl group-containing polyoxosiloxane A was measured by gel permeation chromatography, and it was 2,300.

Synthesis Example 2

In a four-necked flask equipped with a stirrer, a reflux cooling tube, an input port, and a thermometer, 93.2 g of 1,3-divinyl-1,1,3,3-tetramethyldioxane, 140 g of water, and three were charged. 0.38 g of fluoromethanesulfonic acid and 500 g of toluene were mixed, and a mixture of 173.4 g of diphenyldimethoxydecane and 300.6 g of phenyltrimethoxydecane was added dropwise thereto over 1 hour while stirring, and the mixture was heated and refluxed. 1 hour. Thereafter, the mixture was cooled, the lower layer (aqueous layer) was separated and removed, and the upper layer (toluene solution) was washed with water three times. To the toluene solution after washing with water, 0.40 g of potassium hydroxide was added, and the water was removed from the water separation tube while refluxing. After the removal of water, While refluxing for 5 hours, it was allowed to cool. After 0.6 g of acetic acid was added for neutralization, filtration was carried out to obtain a toluene solution, and the obtained toluene solution was washed with water three times. Thereafter, concentration under reduced pressure was carried out, whereby a liquid alkenyl group-containing polyoxetane B was obtained. The average unit formula and average composition formula of the alkenyl group-containing polyoxetane B are as follows.

Average unit: (CH ₂ =CH(CH ₃ ) ₂ SiO _1/2 ) _0.31 ((C ₆ H ₅ ) ₂ SiO _2/2 ) _0.22 (C ₆ H ₅ SiO _3/2 ) _0.47

Average composition: (CH ₂ =CH) _0.31 (CH ₃ ) _0.62 (C ₆ H ₅ ) _0.91 SiO _1.08

That is, the alkenyl group-containing polyoxyalkylene B is represented by the above average composition formula (1) in which R ¹ is a vinyl group, R ² is a methyl group and a phenyl group, and a=0.31 and b=1.53.

Further, the weight average molecular weight in terms of polystyrene of the alkenyl group-containing polyoxyalkylene B was measured by gel permeation chromatography and found to be 1,000.

Synthesis Example 3

Into a four-necked flask equipped with a stirrer, a reflux cooling tube, an inlet, and a thermometer, 325.9 g of diphenyldimethoxydecane, 564.9 g of phenyltrimethoxydecane, and 2.36 g of trifluoromethanesulfonic acid were placed and carried out. 134.3 g of 1,1,3,3-tetramethyldioxane was mixed, and 432 g of acetic acid was added dropwise thereto over 30 minutes while stirring. After completion of the dropwise addition, the mixture was heated to 50 ° C while stirring, and allowed to react for 3 hours. After cooling to room temperature, toluene and water were added, and the mixture was thoroughly mixed, and then allowed to stand, and the lower layer (aqueous layer) was separated and removed. Thereafter, the upper layer (toluene solution) was washed with water three times, and then concentrated under reduced pressure to obtain a polyoxyalkylene group C (crosslinking agent C) containing a hydroquinone group.

The average unit formula and average composition formula of the polyoxyalkylene C containing a hydroquinone group are as follows.

Average unit: (H(CH ₃ ) ₂ SiO _1/2 ) _0.33 ((C ₆ H ₅ ) ₂ SiO _2/2 ) _0.22 (C ₆ H ₅ PhSiO _3/2 ) _0.45

Average composition: H _0.33 (CH ₃ ) _0.66 (C ₆ H ₅ ) _0.89 SiO _1.06

That is, the polyoxyalkylene group C containing a hydroquinone group is represented by the above average composition formula (2) in which R ³ is a methyl group and a phenyl group and c=0.33 and d=1.55.

Further, the polystyrene-equivalent weight average molecular weight of the hydroxyl group-containing polyoxyalkylene C was measured by gel permeation chromatography and found to be 1,000.

<Other raw materials>

The materials other than the alkenyl group-containing polyoxyalkylene oxide and the hydroquinone-containing polyoxyalkylene oxide will be described in detail below.

LR7665:

Trade name, methyl polyoxy resin composition, refractive index 1.41, manufactured by Wacker Asahikasei Silicone

Inorganic filler A:

Refractive index 1.55, composition and composition ratio (% by mass): inorganic filler of SiO ₂ /Al ₂ O ₃ /CaO/MgO=60/20/15/5, and average particle diameter: 15 μm (adjusted average particle by classification) path)

TOSPEARL TS2000B:

Polysiloxane resin particles, average particle size 6.0 μm, manufactured by Japan Momentive Performance Materials

<Preparation of polyoxyl resin composition>

Preparation Example 1

20 g of an alkenyl group-containing polyoxosiloxane A (Synthesis Example 1), an alkenyl group-containing polyoxyalkylene B (Comparative Example 2) 25 g, and a hydrofluorenyl group-containing polyoxyalkylene C (Synthesis Example 3, cross-linking) 25 g of the agent C) and 5 mg of the platinum carbonyl complex were mixed to prepare a polyoxyxylene resin composition A.

Preparation Example 2

The composition for a polyoxynoxy resin of Example 1 described in Japanese Laid-Open Patent Publication No. 2010-265436 is prepared as a polyoxyxylene resin composition B (condensation-addition reaction hardening type polyoxyxyl resin composition).

<Manufacture of LEDs for phosphor layer sealing>

Example 1

The inorganic filler A was mixed with the polyoxyxene resin composition A in an amount of 50% by mass relative to the total amount thereof, and the transparent resin composition X was prepared in the form of a varnish. The refractive index RIt of the transparent resin composition X was 1.56.

YAG468 (fluorescent body, manufactured by Genji Specialty Chemicals Co., Ltd.) was blended so as to be 20% by mass based on the total amount of the transparent resin composition X, and these were mixed to prepare a phosphor resin composition.

Then, the transparent resin composition X was applied to the surface of the release sheet (PTE sheet, trade name "SS4C", manufactured by Nippa Co., Ltd.) having a thickness of 50 μm so as to have a thickness of 650 μm after heating by an applicator. The B-stage transparent layer was produced by heating at 90 ° C for 20 minutes.

Then, the phosphor resin composition was applied to the surface (upper surface) of the transparent layer by heating to a thickness of 350 μm by an applicator, and then heated at 80 ° C for 11 minutes to prepare a B-stage firefly. Light body layer.

Thereby, a sealing sheet including a release sheet, a transparent layer, and a phosphor layer was produced (see FIG. 2A).

Thereafter, a double-sided tape (pressure-sensitive adhesive layer) was attached to a stainless steel plate, and a plurality of LEDs (EDI-FA4545A, size: 1.14 mm × 1.14 mm × 150 μm, manufactured by Epistar Co., Ltd.) were placed thereon at a pitch of 1.44 mm. (Refer to Figure 2B). Thereafter, the sealing sheet was thermocompression-bonded to a plurality of LEDs for 10 minutes using a vacuum plate press heated to 90 ° C (refer to FIG. 2C). Specifically, the sealing sheet is thermocompression bonded to a plurality of LEDs in such a manner that the phosphor layer contacts the LED and the double-sided tape around it. The phosphor layer and the transparent layer are temporarily plasticized by the thermocompression bonding. Thereby, a plurality of LEDs are sealed by sealing the sheet.

Thereafter, the curing treatment was carried out at 150 ° C for 2 hours. Thereby, the phosphor layer and the transparent layer are C-staged. Thereafter, the sealing sheet is singulated by cutting, thereby An LED having a phosphor layer sealed with one LED, a phosphor layer, and a transparent layer was produced on a stainless steel plate (see FIG. 2C).

Then, the release sheet was peeled off from the transparent layer (refer to the imaginary line of FIG. 2C). Then, the sealed LED assembly is cut so that a plurality of LEDs are singulated (see FIG. 2D).

Thereafter, the LED sealed by the phosphor layer is peeled off from the double-sided tape (see the arrow of FIG. 2D and FIG. 2E).

Thereby, a phosphor layer sealed LED is obtained (refer to FIG. 2E).

Example 2

The inorganic filler A was mixed with the polyoxyxene resin composition A in an amount of 50% by mass relative to the total amount thereof, and the transparent resin composition X was prepared in the form of a varnish. The refractive index RIt of the transparent resin composition X was 1.56.

In addition, YAG468 (fluorescent body, manufactured by Genji Specialty Chemicals Co., Ltd.) was blended so as to be 12% by mass based on the total amount of the transparent resin composition X, and these were mixed to prepare a phosphor resin combination. Things.

Then, the transparent resin composition X was applied to the surface of the release sheet (PTE sheet, trade name "SS4C", manufactured by Nippa Co., Ltd.) having a thickness of 50 μm so as to have a thickness of 500 μm after heating by an applicator. The B-stage transparent layer was produced by heating at 90 ° C for 20 minutes.

The phosphor resin composition was applied thereon by using an applicator so as to have a thickness of 500 μm after heating, and then heated at 80 ° C for 11 minutes to prepare a B-stage phosphor layer.

Thereby, a sealing sheet including a release sheet, a transparent layer, and a phosphor layer was produced (see FIG. 2A).

Thereafter, a double-sided tape (pressure-sensitive adhesive layer) was attached to a stainless steel plate, and a plurality of LEDs (EDI-FA4545A, size: 1.14 mm × 1.14 mm × 150 μm, manufactured by Epistar Co., Ltd.) were placed thereon at a pitch of 1.64 mm. (Refer to Figure 2B). Thereafter, use heating to 90 ° C The vacuum flat plate press machine heat-presses the sealing sheet for a plurality of LEDs for 10 minutes (refer to FIG. 2C). Specifically, the sealing sheet is thermocompression bonded to a plurality of LEDs in such a manner that the phosphor layer contacts the LED and the double-sided tape around it. The phosphor layer and the transparent layer are temporarily plasticized by the thermocompression bonding. Thereby, a plurality of LEDs are sealed by sealing the sheet.

Thereafter, the curing treatment was carried out at 150 ° C for 2 hours. Thereby, the phosphor layer and the transparent layer are C-staged. Thereafter, the sealing sheet was diced by cutting, and an LED having a phosphor layer sealed with one LED, a phosphor layer, and a transparent layer was produced on a stainless steel plate (see FIG. 2C).

Then, the release sheet was peeled off from the transparent layer (refer to the imaginary line of FIG. 2C). Then, the sealed LED assembly is cut so that a plurality of LEDs are singulated (see FIG. 2D).

Thereafter, the LED sealed by the phosphor layer is peeled off from the double-sided tape (see the arrow of FIG. 2D and FIG. 2E).

Thereby, a phosphor layer sealed LED is obtained (refer to FIG. 2E).

Example 3

The inorganic filler A was mixed with the polyoxyxene resin composition A in an amount of 50% by mass relative to the total amount thereof, and the transparent resin composition X was prepared in the form of a varnish. The refractive index RIt of the transparent resin composition X was 1.56.

YAG468 (fluorescent body, manufactured by Genji Specialty Chemicals Co., Ltd.) was blended so as to be 10% by mass based on the total amount of the transparent resin composition X, and these were mixed to prepare a phosphor resin composition.

Then, the transparent resin composition X was applied to the surface of the release sheet (PTE sheet, trade name "SS4C", manufactured by Nippa Co., Ltd.) having a thickness of 50 μm so as to have a thickness of 400 μm after heating by an applicator. The B-stage transparent layer was produced by heating at 90 ° C for 20 minutes.

Then, the phosphor resin composition was applied to the surface (upper surface) of the transparent layer by a thickness of 600 μm after heating using an applicator, and then heated at 80 ° C for 11 minutes. This produces a B-stage phosphor layer.

Thereby, a sealing sheet including a release sheet, a transparent layer, and a phosphor layer was produced (see FIG. 2A).

Thereafter, a double-sided tape (pressure-sensitive adhesive layer) was attached to the stainless steel plate, and a plurality of LEDs (EDI-FA4545A, size: 1.14 mm × 1.14 mm × 150 μm, manufactured by Epistar) were placed thereon at a pitch of 1.84 mm. (Refer to Figure 2B). Thereafter, the sealing sheet was thermocompression-bonded to a plurality of LEDs for 10 minutes using a vacuum plate press heated to 90 ° C (refer to FIG. 2C). Specifically, the sealing sheet is thermocompression bonded to a plurality of LEDs in such a manner that the phosphor layer contacts the LED and the double-sided tape around it. The phosphor layer and the transparent layer are temporarily plasticized by the thermocompression bonding. Thereby, a plurality of LEDs are sealed by sealing the sheet.

Thereafter, the curing treatment was carried out at 150 ° C for 2 hours. Thereby, the phosphor layer and the transparent layer are C-staged. Thereafter, the sealing sheet was diced by cutting, and an LED having a phosphor layer sealed with one LED, a phosphor layer, and a transparent layer was produced on a stainless steel plate (see FIG. 2C).

Then, the release sheet was peeled off from the transparent layer (refer to the imaginary line of FIG. 2C). Then, the sealed LED assembly is cut so that a plurality of LEDs are singulated (see FIG. 2D).

Thereafter, the LED sealed by the phosphor layer is peeled off from the double-sided tape (see the arrow of FIG. 2D and FIG. 2E).

Thereby, a phosphor layer sealed LED is obtained (refer to FIG. 2E).

Example 4

The inorganic filler A was mixed with the polyoxyxene resin composition A in an amount of 50% by mass relative to the total amount thereof, and the transparent resin composition X was prepared in the form of a varnish. The refractive index RIt of the transparent resin composition X was 1.56.

YAG468 (fluorescent body, manufactured by Genji Specialty Chemicals Co., Ltd.) was blended so as to be 10% by mass based on the total amount of the transparent resin composition X, and these were mixed to prepare a phosphor resin composition.

Then, the transparent resin composition X was applied to the surface of the release sheet (PTE sheet, trade name "SS4C", manufactured by Nippa Co., Ltd.) having a thickness of 50 μm so that the thickness after heating became 900 μm by the applicator. The B-stage transparent layer was produced by heating at 90 ° C for 20 minutes.

Then, the phosphor resin composition was applied to the surface (upper surface) of the transparent layer by a thickness of 600 μm after heating by an applicator, and then heated at 80 ° C for 11 minutes to prepare a B-stage firefly. Light body layer.

Thereby, a sealing sheet including a release sheet, a transparent layer, and a phosphor layer was produced (see FIG. 2A).

Thereafter, a double-sided tape (pressure-sensitive adhesive layer) was attached to the stainless steel plate, and a plurality of LEDs (EDI-FA4545A, size: 1.14 mm × 1.14 mm × 150 μm, manufactured by Epistar) were placed thereon at a pitch of 1.84 mm. (Refer to Figure 2B). Thereafter, the sealing sheet was thermocompression-bonded to a plurality of LEDs for 10 minutes using a vacuum plate press heated to 90 ° C (refer to FIG. 2C). Specifically, the sealing sheet is thermocompression bonded to a plurality of LEDs in such a manner that the phosphor layer contacts the LED and the double-sided tape around it. The phosphor layer and the transparent layer are temporarily plasticized by the thermocompression bonding. Thereby, a plurality of LEDs are sealed by sealing the sheet.

Thereafter, the curing treatment was carried out at 150 ° C for 2 hours. Thereby, the phosphor layer and the transparent layer are C-staged. Thereafter, the sealing sheet was diced by cutting, and an LED having a phosphor layer sealed with one LED, a phosphor layer, and a transparent layer was produced on a stainless steel plate (see FIG. 2C).

Then, the release sheet was peeled off from the transparent layer (refer to the imaginary line of FIG. 2C). Then, the sealed LED assembly is cut so that a plurality of LEDs are singulated (see FIG. 2D).

Thereafter, the LED sealed by the phosphor layer is peeled off from the double-sided tape (see the arrow of FIG. 2D and FIG. 2E).

Thereby, a phosphor layer sealed LED is obtained (refer to FIG. 2E).

Example 5

The inorganic filler A was mixed with the polyoxyxene resin composition A in an amount of 50% by mass relative to the total amount thereof, and the transparent resin composition X was prepared in the form of a varnish. The refractive index RIt of the transparent resin composition X was 1.56.

In addition, YAG468 (fluorescent body, manufactured by Genji Specialty Chemicals Co., Ltd.) was blended so as to be 11% by mass based on the total amount of the transparent resin composition X, and these were mixed to prepare a phosphor resin combination. Things.

Then, the transparent resin composition X was applied to the surface of the release sheet (PTE sheet, trade name "SS4C", manufactured by Nippa Co., Ltd.) having a thickness of 50 μm so as to have a thickness of 500 μm after heating by an applicator. The B-stage transparent layer was produced by heating at 90 ° C for 20 minutes.

Then, the phosphor resin composition was applied to the surface (upper surface) of the transparent layer by a thickness of 500 μm after heating by an applicator, and then heated at 80 ° C for 11 minutes to prepare a B-stage firefly. Light body layer.

Thereby, a sealing sheet including a release sheet, a transparent layer, and a phosphor layer was produced (see FIG. 2A).

Thereafter, a double-sided tape (pressure-sensitive adhesive layer) was attached to the stainless steel plate, and a plurality of LEDs (EDI-FA4545A, size: 1.14 mm × 1.14 mm × 150 μm, manufactured by Epistar) were placed thereon at a pitch of 1.84 mm. (Refer to Figure 2B). Thereafter, the sealing sheet was thermocompression-bonded to a plurality of LEDs for 10 minutes using a vacuum plate press heated to 90 ° C (refer to FIG. 2C). Specifically, the sealing sheet is thermocompression bonded to a plurality of LEDs in such a manner that the phosphor layer contacts the LED and the double-sided tape around it. The phosphor layer and the transparent layer are temporarily plasticized by the thermocompression bonding. Thereby, a plurality of LEDs are sealed by sealing the sheet.

Thereafter, the curing treatment was carried out at 150 ° C for 2 hours. Thereby, the phosphor layer and the transparent layer are C-staged. Thereafter, the sealing sheet was diced by cutting, and an LED having a phosphor layer sealed with one LED, a phosphor layer, and a transparent layer was produced on a stainless steel plate (see FIG. 2C).

Then, the release sheet was peeled off from the transparent layer (refer to the imaginary line of FIG. 2C). Then, the sealed LED assembly is cut so that a plurality of LEDs are singulated (see FIG. 2D).

Thereafter, the LED sealed by the phosphor layer is peeled off from the double-sided tape (see the arrow of FIG. 2D and FIG. 2E).

Thereby, a phosphor layer sealed LED is obtained (refer to FIG. 2E).

Example 6

The inorganic filler A was mixed with the polyoxyxene resin composition A in an amount of 50% by mass relative to the total amount thereof, and the transparent resin composition X was prepared in the form of a varnish. The refractive index RIt of the transparent resin composition X was 1.56.

YAG468 (fluorescent body, manufactured by Genji Specialty Chemicals Co., Ltd.) was blended so as to be 13% by mass based on the total amount of the transparent resin composition X, and these were mixed to prepare a phosphor resin composition.

Then, the transparent resin composition X was applied to the surface of the release sheet (PTE sheet, trade name "SS4C", manufactured by Nippa Co., Ltd.) having a thickness of 50 μm so as to have a thickness of 500 μm after heating by an applicator. The B-stage transparent layer was produced by heating at 90 ° C for 20 minutes.

Then, the phosphor resin composition was applied to the surface (upper surface) of the transparent layer by a thickness of 500 μm after heating by an applicator, and then heated at 80 ° C for 11 minutes to prepare a B-stage firefly. Light body layer.

Thereby, a sealing sheet including a release sheet, a transparent layer, and a phosphor layer was produced (see FIG. 2A).

Thereafter, a double-sided tape (pressure-sensitive adhesive layer) was attached to a stainless steel plate, and a plurality of LEDs (EDI-FA4545A, size: 1.14 mm × 1.14 mm × 150 μm, manufactured by Epistar Co., Ltd.) were placed thereon at a pitch of 1.44 mm. (Refer to Figure 2B). Thereafter, the sealing sheet was thermocompression-bonded to a plurality of LEDs for 10 minutes using a vacuum plate press heated to 90 ° C (refer to FIG. 2C). Specifically, the phosphor layer is in contact with the LED and the surrounding double-sided tape. A plurality of LED thermocompression sealing sheets. The phosphor layer and the transparent layer are temporarily plasticized by the thermocompression bonding. Thereby, a plurality of LEDs are sealed by sealing the sheet.

Thereafter, the film was cured at 150 ° C for 2 hours (C-stage), and thereafter, the sealing sheet was diced by cutting to form one LED and a phosphor layer on a stainless steel plate. A phosphor layer sealed LED of a transparent layer (refer to FIG. 2C).

Then, the release sheet was peeled off from the transparent layer (refer to the imaginary line of FIG. 2C). Then, the sealed LED assembly is cut so that a plurality of LEDs are singulated (see FIG. 2D).

Thereafter, the LED sealed by the phosphor layer is peeled off from the double-sided tape (see the arrow of FIG. 2D and FIG. 2E).

Thereby, a phosphor layer sealed LED is obtained (refer to FIG. 2E).

Example 7

To the polyoxyxene resin composition B, TOSPEARL TS2000B was mixed in such a manner that it was 30% by mass relative to the total amount thereof, and the transparent resin composition Y was prepared in the form of a varnish.

In addition, YAG468 (fluorescent body, manufactured by Genji Specialty Chemicals Co., Ltd.) was blended so as to be 18% by mass based on the total amount of the transparent resin composition Y, and these were mixed to prepare a phosphor resin combination. Things.

Then, the phosphor resin composition was applied to a glass plate (refractive index RIt: 1.52) of 500 μm as a transparent layer by an applicator so as to have a thickness of 500 μm after heating, and then heated at 135 ° C. In minutes, a B-stage phosphor layer was prepared on a glass plate. Thereby, a sealing sheet provided with a glass plate and a phosphor layer was prepared (refer FIG. 2A).

Thereafter, a double-sided tape (pressure-sensitive adhesive layer) was attached to a stainless steel plate, and a plurality of LEDs (EDI-FA4545A, size: 1.14 mm × 1.14 mm × 150 μm, manufactured by Epistar Co., Ltd.) were placed thereon at a pitch of 1.64 mm. (Refer to Figure 2B). Thereafter, the sealing sheets were crimped over a plurality of LEDs for 10 minutes using a room temperature vacuum plate press. Specifically, the sealing sheet is crimped to a plurality of LEDs in such a manner that the phosphor layer contacts the LED and the double-sided tape around it. Thereby, a plurality of LEDs are sealed by sealing the sheet.

Thereafter, the phosphor layer was thermally cured (C-staged) by heating at 150 ° C for 2 hours, and thereafter, the sealing sheet was diced by cutting, thereby producing one LED and fluorescent light on the stainless steel plate. The LED layer of the body layer and the phosphor layer of the glass plate is sealed (refer to FIG. 2C).

Then, the sealed LED assembly is cut so that a plurality of LEDs are singulated (see FIG. 2D).

Thereafter, the LED sealed by the phosphor layer is peeled off from the double-sided tape (see the arrow of FIG. 2D and FIG. 2E).

Thereby, a phosphor layer sealed LED is obtained (refer to FIG. 2E).

Example 8

The inorganic filler A was mixed with the polyoxyxene resin composition A in an amount of 50% by mass relative to the total amount thereof, and the transparent resin composition X was prepared in the form of a varnish. The refractive index RIt of the transparent resin composition X was 1.56.

YAG468 (fluorescent body, manufactured by Genji Specialty Chemicals Co., Ltd.) was blended so as to be 12% by mass based on the total amount of the transparent resin composition X, and these were mixed to prepare a phosphor resin composition.

Then, the LR7665 was mixed with TOSPEARL TS2000B to obtain a varnish (refractive index: RIt: 1.41), and a release sheet having a thickness of 50 μm (PTE sheet, trade name) was obtained by an applicator. The surface of the SS4C", manufactured by Nippa Co., Ltd.) was applied to the varnish obtained by heating to a thickness of 500 μm, and then heated at 100 ° C for 10 minutes to prepare a C-stage transparent layer.

Then, the phosphor resin composition was applied to the surface (upper surface) of the transparent layer by a thickness of 500 μm after heating by an applicator, and then heated at 80 ° C for 11 minutes to prepare a B-stage firefly. Light body layer.

Thereby, a sealing sheet including a release sheet, a transparent layer, and a phosphor layer was produced (see FIG. 2A).

Thereafter, a double-sided tape (pressure-sensitive adhesive layer) is attached to the stainless steel plate, and A plurality of LEDs (EDI-FA4545A, size: 1.14 mm × 1.14 mm × 150 μm, manufactured by Epistar Co., Ltd.) were placed at a pitch of 1.64 mm (refer to Fig. 2B). Thereafter, the sealing sheet was thermocompression-bonded to a plurality of LEDs for 10 minutes using a vacuum plate press heated to 90 ° C (refer to FIG. 2C). Specifically, the sealing sheet is thermocompression bonded to a plurality of LEDs in such a manner that the phosphor layer contacts the LED and the double-sided tape around it. The phosphor layer is temporarily plasticized by the thermocompression bonding. Thereby, a plurality of LEDs are sealed by sealing the sheet.

Thereafter, the curing treatment was carried out at 150 ° C for 2 hours. Thereby, the phosphor layer is C-staged. Thereafter, the sealing sheet was diced by cutting, and an LED having a phosphor layer sealed with one LED, a phosphor layer, and a transparent layer was produced on a stainless steel plate (see FIG. 2C).

Then, the release sheet was peeled off from the transparent layer (refer to the imaginary line of FIG. 2C). Then, the sealed LED assembly is cut so that a plurality of LEDs are singulated (see FIG. 2D).

Thereafter, the LED sealed by the phosphor layer is peeled off from the double-sided tape (see the arrow of FIG. 2D and FIG. 2E).

Thereby, a phosphor layer sealed LED is obtained (refer to FIG. 2E).

Example 9

YAG468 (manufactured by Roots Specialty Chemical Co., Ltd.) was mixed with 100 parts by mass of the polyoxyxene resin composition A in an amount of 17% by mass based on the total amount, and a phosphor resin composition was prepared in the form of a varnish.

A double-sided tape was attached to a stainless steel plate, and one LED (EDI-FA4545A, size: 1.14 mm × 1.14 mm × 150 μm, manufactured by Epistar Co., Ltd.) was mounted (arranged) thereon (see FIG. 3A).

Further, the first barrier rib and the second barrier rib (see FIGS. 3A and 3D) are produced.

Namely, LR7665 (refractive index of 1.41) was applied at a thickness of 500 μm, and cured (thermosetting) at 100 ° C for 10 minutes, and then the cured sheet was processed into a frame size of 10 mm × 10 mm and an inner frame size (internal size) of 1.64 mm. ×1.64mm rectangular frame shape, making the first barrier (refer to Figure 3A). That is, the outer shape of the first barrier rib is 10 mm × 10 mm, and the inner dimension of the rectangular opening is 1.64 mm × 1.64 mm.

Then, the second barrier rib (see FIG. 3D) was produced in the same manner as the first barrier rib except that the thickness was changed to 1 mm.

Then, on the stainless steel plate, a first barrier is provided around the LED (see FIG. 3B). Then, the varnish of the phosphor resin composition was dropped into the first opening of the first barrier rib, and the amount of the varnish of the first barrier rib was adjusted to a thickness of 500 μm, and the phosphor resin composition was B-staged at 100 ° C for 10 minutes ( Refer to Figure 3C). Thereby, a phosphor layer in a B-stage state is obtained. Thereafter, the first barrier rib is removed (see the arrow of FIG. 3C).

Further, on the stainless steel plate, a second barrier is provided around the phosphor layer (see FIG. 3E). Thereafter, the polyoxyphthalocene resin composition A was dropped into the second opening of the second barrier rib, and the amount of the liquid was adjusted so that the total thickness became 1 mm. Then, the polyoxyphthalocene resin composition A was thermally cured (C-staged) at 150 ° C for 2 hours to obtain a transparent layer in a C-stage state (see FIG. 4F ). Then, cutting is performed along the boundary (interface) between the phosphor layer and the transparent layer (see FIG. 4G) to prepare a phosphor layer-sealed LED (see FIG. 4H).

Example 10

The phosphor resin composition was prepared in the form of a varnish by mixing YAG468 (manufactured by Roots Specialty Chemical Co., Ltd.) in an amount of 18% by mass based on the total amount of the polyoxyxyl resin composition A.

A double-sided tape was attached to a stainless steel plate, and one LED (EDI-FA4545A, size: 1.41 mm × 1.41 mm × 150 μm, manufactured by Epistar Co., Ltd.) was mounted (arranged) thereon (see FIG. 3A).

Further, the first barrier rib and the second barrier rib (see FIGS. 3A and 3D) are produced.

That is, LR7665 (refractive index of 1.41) was applied at a thickness of 500 μm, and curing (thermosetting) was performed at 100 ° C for 10 minutes, and then the cured sheet was processed into a frame size of 10 mm × 10 mm and an inner frame size (internal size). 1.64mm × 1.64mm rectangular frame shape, thus making the first 1 barrier (see Figure 3A). That is, the outer shape of the first barrier rib is 10 mm × 10 mm, and the inner dimension of the rectangular opening is 1.64 mm × 1.64 mm.

Then, the second barrier rib (see FIG. 3D) was produced in the same manner as the first barrier rib except that the thickness was changed to 1 mm.

Then, on the stainless steel plate, a first barrier is provided around the LED (see FIG. 3B). Then, the varnish of the phosphor resin composition was dropped into the first opening of the first barrier rib to adjust the amount so that the liquid thickness became 500 μm, and the phosphor resin composition was B-staged at 100 ° C for 10 minutes. (Refer to Figure 3C). Thereby, a phosphor layer in a B-stage state is obtained. Thereafter, the first barrier rib is removed (see the arrow of FIG. 3C).

Further, on the stainless steel plate, a second barrier is provided around the phosphor layer (see FIG. 3E). Thereafter, LR7665 (refractive index: 1.41) was dropped into the second opening of the second barrier rib, and the amount of liquid was adjusted so that the total thickness became 1 mm. Then, the polyoxyxylene resin composition A was thermally cured (C-staged) at 150 ° C for 2 hours to obtain a transparent layer in a C-stage state (see FIG. 4F ). Then, cutting is performed along the boundary (interface) of the uniform transparent layer of the phosphor layer (see FIG. 4G), and a phosphor layer sealed LED is prepared (see FIG. 4H).

Example 11

The inorganic filler A was mixed with the polyoxyxene resin composition A in an amount of 50% by mass relative to the total amount thereof, and the transparent resin composition X was prepared in the form of a varnish. The refractive index of the transparent resin composition X was 1.56.

YAG468 (fluorescent body, manufactured by Genji Specialty Chemicals Co., Ltd.) was blended so as to be 50% by mass based on the total amount of the transparent resin composition X, and these were mixed to prepare a phosphor resin composition.

Then, the transparent resin composition X was applied to the surface of the release sheet (PTE sheet, trade name "SS4C", manufactured by Nippa Co., Ltd.) having a thickness of 50 μm so as to have a thickness of 800 μm after heating by an applicator. The B-stage transparent layer was produced by heating at 90 ° C for 20 minutes.

Then, the phosphor resin composition was applied to the surface (upper surface) of the transparent layer by a thickness of 200 μm after heating by an applicator, and then heated at 80 ° C for 11 minutes to prepare a B-stage firefly. Light body layer.

Thereby, a sealing sheet including a release sheet, a transparent layer, and a phosphor layer was produced (see FIG. 2A).

Thereafter, a double-sided tape (pressure-sensitive adhesive layer) was attached to the stainless steel plate, and a plurality of LEDs (EDI-FA4545A, size: 1.14 mm × 1.14 mm × 150 μm, manufactured by Epistar Co., Ltd.) were placed thereon at a pitch of 1.24 mm. Refer to Figure 2B). Thereafter, the sealing sheet was thermocompression-bonded to a plurality of LEDs for 10 minutes using a vacuum plate press heated to 90 ° C (refer to FIG. 2C). Specifically, the sealing sheet is thermocompression bonded to a plurality of LEDs in such a manner that the phosphor layer contacts the LED and the double-sided tape around it. The phosphor layer and the transparent layer are temporarily plasticized by the thermocompression bonding. Thereby, a plurality of LEDs are sealed by sealing the sheet.

Thereafter, the curing treatment was carried out at 150 ° C for 2 hours. Thereby, the phosphor layer and the transparent layer are C-staged. Thereafter, the sealing sheet was diced by cutting, and an LED having a phosphor layer sealed with one LED, a phosphor layer, and a transparent layer was produced on a stainless steel plate (see FIG. 2C).

Then, the release sheet was peeled off from the transparent layer (refer to the imaginary line of FIG. 2C). Then, the sealed LED assembly is cut so that a plurality of LEDs are singulated (see FIG. 2D).

Thereafter, the LED sealed by the phosphor layer is peeled off from the double-sided tape (see the arrow of FIG. 2D and FIG. 2E).

Thereby, a phosphor layer sealed LED is obtained (refer to FIG. 2E).

Example 12

The inorganic filler A was mixed with the polyoxyxene resin composition A in an amount of 50% by mass relative to the total amount thereof, and the transparent resin composition X was prepared in the form of a varnish. The refractive index of the transparent resin composition X was 1.56.

The transparent resin composition X is formulated in such a manner as to be 30% by mass relative to the total amount thereof. YAG468 (fluorescent body, manufactured by Root Element Specialty Chemical Co., Ltd.), and these were mixed, thereby preparing a phosphor resin composition.

Then, the transparent resin composition X was applied to the surface of the release sheet (PTE sheet, trade name "SS4C", manufactured by Nippa Co., Ltd.) having a thickness of 50 μm so as to have a thickness of 50 μm after heating by an applicator. The B-stage transparent layer was produced by heating at 90 ° C for 20 minutes.

Then, the phosphor resin composition was applied to the surface (upper surface) of the transparent layer by a thickness of 300 μm after heating by an applicator, and then heated at 80 ° C for 11 minutes to prepare a B-stage firefly. Light body layer.

Thereby, a sealing sheet including a release sheet, a transparent layer, and a phosphor layer was produced (see FIG. 2A).

Thereafter, a double-sided tape (pressure-sensitive adhesive layer) was attached to a stainless steel plate, and a plurality of LEDs (EDI-FA4545A, size: 1.14 mm × 1.14 mm × 150 μm, manufactured by Epistar Co., Ltd.) were placed thereon at a pitch of 1.34 mm. (Refer to Figure 2B). Thereafter, the sealing sheet was thermocompression-bonded to a plurality of LEDs for 10 minutes using a vacuum plate press heated to 90 ° C (refer to FIG. 2C). Specifically, the sealing sheet is thermocompression bonded to a plurality of LEDs in such a manner that the phosphor layer contacts the LED and the double-sided tape around it. The phosphor layer and the transparent layer are temporarily plasticized by the thermocompression bonding. Thereby, a plurality of LEDs are sealed by sealing the sheet.

Thereafter, the curing treatment was carried out at 150 ° C for 2 hours. Thereby, the phosphor layer and the transparent layer are C-staged. Thereafter, the sealing sheet was diced by cutting, and an LED having a phosphor layer sealed with one LED, a phosphor layer, and a transparent layer was produced on a stainless steel plate (see FIG. 2C).

Then, the release sheet was peeled off from the transparent layer (refer to the imaginary line of FIG. 2C). Then, the sealed LED assembly is cut so that a plurality of LEDs are singulated (see FIG. 2D).

Thereafter, the LED sealed by the phosphor layer is peeled off from the double-sided tape (see the arrow of FIG. 2D and FIG. 2E).

Thereby, a phosphor layer sealed LED is obtained (refer to FIG. 2E).

Example 13

The inorganic filler A was mixed with the polyoxyxene resin composition A in an amount of 50% by mass relative to the total amount thereof, and the transparent resin composition X was prepared in the form of a varnish. The refractive index of the transparent resin composition X was 1.56.

YAG468 (fluorescent body, manufactured by Root Element Specialty Chemical Co., Ltd.) was blended in an amount of 8 parts by mass based on the total amount of the transparent resin composition X, and these were mixed to prepare a phosphor resin composition.

Then, the transparent resin composition X was applied to the surface of the release sheet (PTE sheet, trade name "SS4C", manufactured by Nippa Co., Ltd.) having a thickness of 50 μm so as to have a thickness of 100 μm after heating by an applicator. The B-stage transparent layer was produced by heating at 90 ° C for 20 minutes.

Then, the phosphor resin composition was applied to the surface (upper surface) of the transparent layer by the applicator so that the thickness after heating became 900 μm, and then heated at 80 ° C for 11 minutes to prepare a B-stage firefly. Light body layer.

Thereby, a sealing sheet including a release sheet, a transparent layer, and a phosphor layer was produced (see FIG. 2A).

Thereafter, a double-sided tape (pressure-sensitive adhesive layer) was attached to a stainless steel plate, and a plurality of LEDs (EDI-FA4545A, size: 1.14 mm × 1.14 mm × 150 μm, manufactured by Epistar Co., Ltd.) were placed thereon at a pitch of 1.64 mm. (Refer to Figure 2B). Thereafter, the sealing sheet was thermocompression-bonded to a plurality of LEDs for 10 minutes using a vacuum plate press heated to 90 ° C (refer to FIG. 2C). Specifically, the sealing sheet is thermocompression bonded to a plurality of LEDs in such a manner that the phosphor layer contacts the LED and the double-sided tape around it. The phosphor layer and the transparent layer are temporarily plasticized by the thermocompression bonding. Thereby, a plurality of LEDs are sealed by sealing the sheet.

Thereafter, the curing treatment was carried out at 150 ° C for 2 hours. Thereby, the phosphor layer and the transparent layer are C-staged. Thereafter, the sealing sheet is singulated by cutting, thereby An LED having a phosphor layer sealed with one LED, a phosphor layer, and a transparent layer was produced on a stainless steel plate (see FIG. 2C).

Then, the release sheet was peeled off from the transparent layer (refer to the imaginary line of FIG. 2C). Then, the sealed LED assembly is cut so that a plurality of LEDs are singulated (see FIG. 2D).

Thereafter, the LED sealed by the phosphor layer is peeled off from the double-sided tape (see the arrow of FIG. 2D and FIG. 2E).

Thereby, a phosphor layer sealed LED is obtained (refer to FIG. 2E).

Example 14

The inorganic filler A was mixed with the polyoxyxene resin composition A in an amount of 50% by mass relative to the total amount thereof, and the transparent resin composition X was prepared in the form of a varnish. The refractive index of the transparent resin composition X was 1.56.

YAG468 (fluorescent body, manufactured by Genji Specialty Chemicals Co., Ltd.) was blended so as to be 28% by mass based on the total amount of the transparent resin composition X, and these were mixed to prepare a phosphor resin composition.

Then, the surface of the release sheet (PTE sheet, trade name "SS4C", manufactured by Nippa Co., Ltd.) having a thickness of 50 μm was coated with a phosphor resin composition so as to have a thickness of 150 μm after heating, using an applicator. Thereafter, the film was heated at 90 ° C for 20 minutes to prepare a B-stage phosphor layer. Thereby, a fluorescent sealing sheet including a release sheet and a phosphor layer was produced (the phosphor layer preparation step, see FIG. 7A).

Thereafter, a double-sided tape (pressure-sensitive adhesive layer) was attached to a stainless steel plate, and a plurality of LEDs (EDI-FA4545A, size: 1.14 mm × 1.14 mm × 150 μm, manufactured by Epistar Co., Ltd.) were placed thereon at a pitch of 1.54 mm. . Thereafter, the sealing sheets were thermocompression-bonded to a plurality of fluorescent LEDs for 10 minutes using a vacuum plate press heated to 90 °C. Specifically, a plurality of LED fluorescent thermocompression sealing sheets are applied to the plurality of LED fluorescent thermocompression sealing sheets (the phosphor layer disposing step, see FIG. 7B) by using a vacuum flat pressing machine so that the phosphor layer contacts the LED and the double-sided tape around it. The upper surface of the phosphor layer is formed into a flat shape.

Thereafter, the release sheet was peeled off from the phosphor layer (see FIG. 7C).

Then, the phosphor layer which is located at a long distance with respect to the LED is removed, and at the same time, the LED sealed by the phosphor layer is singulated (the singulation/removal step, see FIG. 7D). That is, the transparent sheet was cut by a saw cutting blade having a wall thickness of 200 μm.

Thereby, a phosphor layer sealed LED is obtained (refer to FIG. 7F).

Thereafter, the LEDs in which a plurality of phosphor layers are sealed are arranged in the second support plate at intervals in the front-rear direction and the left-right direction (see FIG. 8G).

In addition, the surface of the second release sheet (PTE sheet, trade name "SS4C", manufactured by Nippa Co., Ltd.) having a thickness of 50 μm was coated with a transparent resin composition X so as to have a thickness of 850 μm after heating. Thereafter, the film was heated at 90 ° C for 20 minutes to prepare a B-stage transparent layer. Thereby, a transparent sheet including the second release sheet and the transparent layer was produced (the transparent layer preparation step, see FIG. 8G).

Then, a plurality of phosphor layers covering a plurality of LEDs are covered by a transparent layer of a transparent sheet (transparent layer disposing step, see FIG. 8H).

Then, the second release sheet was peeled off from the transparent layer (see FIG. 8I for reference). Then, the sealed LED assembly is cut so that a plurality of LEDs are singulated (see FIG. 8J).

Thereafter, the LED sealed with the phosphor layer is peeled off from the double-sided tape (refer to the arrow of FIG. 8J).

Thereby, a phosphor layer sealed LED is obtained (refer to FIG. 8K).

Comparative example 1

A phosphor sheet-sealed LED (see FIG. 16) was obtained in the same manner as in Example 8 except that the coated sheet in which the transparent layer was not formed was formed by coating the LED with the transparent layer of the coated sheet.

Comparative example 2

A cover sheet in which a transparent layer was not formed was produced, and the LED was coated with a transparent layer of the coated sheet, and treated in the same manner as in Example 14 to obtain a phosphor layer seal. LED (refer to Figure 17).

<evaluation>

[light intensity]

The LEDs sealed with the phosphor layers of the respective examples and the comparative examples were mounted on a substrate to fabricate an LED device (see the imaginary line of FIG. 1 , the imaginary line of FIGS. 2F and 16 , and the imaginary line of FIG. 17 ). Then, in the total beam measuring device, the LED device was turned on with a current of 300 mA, and the luminous intensity was obtained.

The obtained luminescence intensity was evaluated based on the following criteria.

A: The luminous intensity is 135 lm or more

B: The luminous intensity is 128 lm or more and less than 135 lm.

C: The luminous intensity is 118 lm or more and less than 128 lm.

D: The luminous intensity is 110 lm or more and less than 118 lm.

E: The luminous intensity is less than 110lm

[Color uniformity]

Each of the LEDs (n=10) of the phosphor layer sealed in each of the examples and the comparative examples was mounted on a substrate to manufacture an LED device (see the imaginary line of FIG. 1 , the imaginary line of FIG. 2F and FIG. 16 , and FIG. 17 ). Imaginary line). Then, the CIE y of the optical characteristics was measured, and the deviation of the LEDs sealed by the ten phosphor layers was determined. Further, the case where the difference between the maximum value and the minimum value was 0.03 or less was evaluated as ○, and the case where the difference between the maximum value and the minimum value was 0.03 was evaluated as ×.

[light distribution (color unevenness)]

The LEDs sealed with the phosphor layers of the respective examples and the comparative examples were mounted on a substrate to fabricate an LED device (see the imaginary line of FIG. 1 , the imaginary line of FIGS. 2F and 16 , and the imaginary line of FIG. 17 ). Then, the chromaticity of the -85° to 85° direction was measured in units of 5° using a light distribution measuring device (GP-7 manufactured by Otsuka Electronics Co., Ltd.). Find the chromaticity deviation in each direction. Further, the case where the difference between the maximum value and the minimum value was 0.02 or less was evaluated as ○, and the case where the difference between 0.02 and 0.02 was exceeded was evaluated as ×.

[reliability (black focus)]

The LEDs sealed with the phosphor layers of the respective examples and the comparative examples were mounted on a substrate to fabricate an LED device (see the imaginary line of FIG. 1 , the imaginary line of FIGS. 2F and 16 , and the imaginary line of FIG. 17 ). Then, in the total beam measuring device, the LED device was lit for 1,000 hours with a current of 1 A, and the phosphor layer and the transparent layer were visually observed, and the reliability of the phosphor layer-sealed LED and the LED device was evaluated based on the following criteria. .

○: Black coke was not observed in the phosphor layer or the transparent layer.

△: Black coke was slightly observed in the phosphor layer or the transparent layer.

×: Black coke was observed in the phosphor layer or the transparent layer.

[Measurement of the content ratio of phenyl groups in the hydrocarbon group (R ⁵ ) of the product obtained by the reaction of the polyoxyxylene resin composition A]

The product obtained by the reaction of the polyoxyxylene resin composition A (that is, the polyoxyxyl resin composition A containing no filler) was directly bonded to the hydrazine by ¹ H-NMR and ²⁹ Si-NMR. The content ratio of phenyl groups (% by mole) in the hydrocarbon group of the atom (R ^{5 of the} average composition formula (3)).

Specifically, the A-stage polyoxynoxy resin composition A was reacted (completely cured, C-staged) at 100 ° C for 1 hour without adding a filler to obtain a product.

Then, ¹ H-NMR and ²⁹ Si-NMR of the obtained product were measured to calculate the ratio (mol%) of the phenyl group directly bonded to the hydrocarbon group (R ⁵ ) of the ruthenium atom.

The result was 48%.

The composition and formulation of each layer in each of the examples and the comparative examples are shown in Table 1.

Table 2 shows the evaluation of the dimensions of the respective layers in each of the examples and the comparative examples and the LEDs sealed by the phosphor layers.

In addition, the above description is provided as an exemplified embodiment of the present invention, but it is merely illustrative and not to be construed as limiting. Variations of the present invention as defined by those skilled in the art are encompassed by the scope of the following claims.

1‧‧‧Silver body sealed LED

2‧‧‧LED

3‧‧‧Fluorescent layer

4‧‧‧Transparent layer

21‧‧‧ Lower surface

22‧‧‧ upper surface

23‧‧‧ side

30‧‧‧ Housing Department

31‧‧‧ upper surface

32‧‧‧ lower surface

33‧‧‧ side

34‧‧‧ inside

35‧‧‧ side

41‧‧‧ lower surface

42‧‧‧ upper surface

43‧‧‧ side

50‧‧‧Substrate

Distance from x‧‧‧

Y‧‧‧ distance

Z‧‧‧distance

‧‧‧‧ distance

γ‧‧‧LED length in the left and right direction

Claims (7)

An optical semiconductor device coated with a phosphor layer, comprising: an optical semiconductor element; a phosphor layer covering the optical semiconductor element; and a transparent layer covering at least a part of the phosphor layer. An optical semiconductor component coated with a phosphor layer, wherein the optical semiconductor component has: an element side contact possible surface that can be in contact with the substrate, and a contact distance of one side with respect to the element side may be separated by a distance x a component side opposite surface disposed to the element side and an element side connecting surface connected to the element side contact possible surface and the element side opposing surface, wherein the phosphor layer has a surface opposite to the element side opposite side The phosphor-side first facing surface disposed opposite to the opening y and the phosphor side disposed opposite to the element-side connecting surface at a distance α from the orthogonal direction orthogonal to the one direction In the second opposing surface, the transparent layer has a transparent side opposing surface that is disposed opposite to the first side of the phosphor side on the one side by a distance z, and is connected to the transparent side The transparent side connecting surface which is disposed at intervals in the orthogonal direction with respect to the element side connecting surface when the one side is projected upward, and the optical semiconductor element covered with the phosphor layer satisfies the following (1) to (1) 4) All: (1) The value (y/x) obtained by dividing the above distance y by the above distance x is 1 or more and 5 (2) the sum (y+z) of the distance y and the distance z is 0.25 mm or more and 2 mm or less, and (3) the distance α and the second opposite surface of the phosphor side and the transparent side joint surface The sum of the distances β (α + β) is 50 μm or more and 2000 μm or less, wherein the distance β is 0 or more, and (4) the value (y/α) obtained by dividing the distance y by the distance α is 1 or more. 2.5 or less. An optical semiconductor element coated with a phosphor layer according to claim 1, wherein the phosphor layer contains a phosphor and a first transparent composition, and the refractive index RIp of the first transparent composition is 1.45 or more and 1.60 or less. An optical semiconductor element coated with a phosphor layer of claim 1, wherein the phosphor layer contains a phosphor and a first transparent composition, and the transparent layer contains a second transparent composition, and the first transparent composition The value (RIp-RIt) obtained by subtracting the refractive index RIt of the second transparent composition from the refractive index RIp is -0.70 or more and 0.20 or less. An optical semiconductor element coated with a phosphor layer according to claim 4, wherein said RIp - said RIt is 0.05 or more. An optical semiconductor element coated with a phosphor layer according to claim 2, wherein the second opposite surface of the phosphor side and the transparent side connecting surface are formed in the same plane in the one direction. An optical semiconductor element coated with a phosphor layer as claimed in claim 2, wherein said distance α exceeds 50 μm.