CN206003825U - It is covered with the optical semiconductor of luminescent coating - Google Patents

Abstract

This utility model provides a kind of luminous intensity the excellent optical semiconductor being covered with luminescent coating.The conventional optical semiconductor presence being covered with luminescent coating can not meet the such problem of described luminous intensity.The optical semiconductor being covered with luminescent coating of the present utility model is it is characterised in that possess：Optical semiconductor, the luminescent coating covering described optical semiconductor and at least one of clear layer covering described luminescent coating, described clear layer is formed by the transparent resin composition containing filler.Because the optical semiconductor that this is covered with luminescent coating possesses at least one of clear layer covering luminescent coating, therefore, it is possible to improve luminous intensity.

Description

It is covered with the optical semiconductor of luminescent coating

The application be Application No. 201521063247.4, the applying date be on December 17th, 2015, application artificial day east electricity Work Co., Ltd., the divisional application of the invention entitled optical semiconductor being covered with luminescent coating.

Technical field

This utility model is related to be covered with the optical semiconductor of luminescent coating.

Background technology

In the past, a kind of optical semiconductor being covered with luminescent coating was proposed, this is covered with the optical semiconductor of luminescent coating The optical semiconductor that exposes including lower surface and for covering the upper surface of optical semiconductor and the luminescent coating (example of side As with reference to Japanese Unexamined Patent Publication 2012-39013 publication).

Utility model content

It is, however, required that the optical semiconductor being covered with luminescent coating has excellent luminous intensity.But, Japanese Unexamined Patent Publication It is such that the optical semiconductor presence being covered with luminescent coating described in No. 2012-39013 can not meet described luminous intensity Problem.

The purpose of this utility model is, provides the photosemiconductor unit being covered with luminescent coating that a kind of luminous intensity is excellent Part.

The technical solution of the utility model (1) provides a kind of optical semiconductor being covered with luminescent coating, wherein, possesses： Optical semiconductor, cover described optical semiconductor luminescent coating and cover described luminescent coating at least one of Clear layer, described clear layer is formed by the transparent resin composition containing filler.

The technical solution of the utility model (2) is the photosemiconductor being covered with luminescent coating according to technical scheme (1) Element, wherein, described filler be from inorganic particle and organic granular select at least any one.

The technical solution of the utility model (3) is the photosemiconductor being covered with luminescent coating according to technical scheme (1) Element, wherein, the refractive index of described filler is more than 1.40 and less than 1.60.

The technical solution of the utility model (4) is the photosemiconductor being covered with luminescent coating according to technical scheme (2) Element, wherein, described inorganic particle be from by silicon dioxide, Talcum, aluminium oxide, boron oxide, calcium oxide, zinc oxide, strontium oxide, Select in the group that magnesium oxide, zirconium oxide, Barium monoxide, stibium oxide, aluminium nitride, silicon nitride and glass particle are constituted is at least arbitrary Person.

The technical solution of the utility model (5) is the photosemiconductor being covered with luminescent coating according to technical scheme (2) Element, wherein, described organic granular is from by acrylic resin granule, phenylethylene resin series granule, acrylicstyrene system Resin particle, silicon-type resin particle, polycarbonate-based resin granule, benzocarbamidine amine system resin particle, polyolefin-based resins Select in the group that granule, polyester based resin granule, polyamide series resin granule, polyimides system resins granule are constituted at least appoints One.

Because the optical semiconductor that this is covered with luminescent coating possesses at least one of clear layer covering luminescent coating, Therefore, it is possible to improve luminous intensity.

Brief description

Fig. 1 is denoted as the glimmering of the 1st embodiment of the optical semiconductor being covered with luminescent coating of the present utility model The sectional view of the LED (being the form that the side of clear layer and the side of luminescent coating are formed as a face) of body of light layer sealing.

Fig. 2A～Fig. 2 F is to represent the manufacture method of the LED being sealed by luminescent coating shown in Fig. 1 and using by fluorophor The process chart of the manufacture method of the LED matrix of LED of layer sealing, wherein,

Fig. 2A represents the operation preparing diaphragm seal,

Fig. 2 B represents the operation preparing multiple LED,

Fig. 2 C represents the operation sealing multiple LED using diaphragm seal,

Fig. 2 D represents that monolithic turns to the operation of the LED being sealed by luminescent coating,

Fig. 2 E represents the operation obtaining the LED being sealed by luminescent coating,

Fig. 2 F represents the operation that the LED being sealed by luminescent coating is installed on substrate.

Fig. 3 A～Fig. 3 D is to represent that the manufacture method of the LED being sealed by luminescent coating shown in Fig. 2A～Fig. 2 F and LED fill The process chart of the variation of the manufacture method put, wherein,

Fig. 3 A represents the operation preparing LED and the 1st weir,

Fig. 3 B represents the operation on configuration the 1st weir,

Fig. 3 C represents the operation making luminescent coating be formed in the 1st weir,

Fig. 3 D represents the operation lifting the 1st weir and being then ready for the 2nd weir,

Fig. 3 E represents the operation on configuration the 2nd weir.

Fig. 4 A～Fig. 4 D is to represent that then Fig. 3 E goes on to say the LED being sealed by luminescent coating shown in Fig. 2A～Fig. 2 E The process chart of the variation of the manufacture method of manufacture method and LED matrix, wherein,

Fig. 4 A represents the operation making clear layer be formed in the 2nd weir,

Fig. 4 B represents luminescent coating, clear layer along the interface between both luminescent coating and clear layer and the 2nd weir And the 2nd weir cut-out operation,

Fig. 4 C represents the operation obtaining the LED being sealed by luminescent coating,

Fig. 4 D represents the operation that the LED being sealed by luminescent coating is installed on substrate.

Fig. 5 represent the LED being sealed by luminescent coating shown in Fig. 1 variation (be luminescent coating lower surface be located at than The form of the upper position of the lower surface of LED) sectional view.

Fig. 6 is denoted as the glimmering of the 2nd embodiment of the optical semiconductor being covered with luminescent coating of the present utility model The section view of the LED side of clear layer (be formed at the form of the side position in the outer part than luminescent coating) of body of light layer sealing Figure.

Fig. 7 A～Fig. 7 F is to represent the manufacture method of the LED being sealed by luminescent coating shown in Fig. 6 and using by fluorophor The process chart of the manufacture method of the LED matrix of LED of layer sealing, wherein,

Fig. 7 A represents the operation preparing multiple LED and fluorescence diaphragm seal,

Fig. 7 B represents the operation sealing multiple LED using luminescent coating,

Fig. 7 C represents the operation peeling stripping film autofluorescence body layer,

Fig. 7 D represents that monolithic turns to the operation of the LED being sealed by luminescent coating,

Fig. 7 E represents the operation peeling off the LED being sealed by luminescent coating self-supporting plate,

Fig. 7 F represents the operation obtaining the LED being sealed by luminescent coating.

Fig. 8 A～Fig. 8 F is to represent that then Fig. 7 F goes on to say the manufacturer of the LED being sealed by luminescent coating shown in Fig. 6 Method and the process chart using the manufacture method of the LED matrix of LED being sealed by luminescent coating, wherein,

Fig. 8 A represents and multiple LED being sealed by luminescent coating is reconfigured in the 2nd support plate and prepares the operation of slide,

Fig. 8 B represents the operation sealing multiple LED being sealed by luminescent coating using clear layer,

Fig. 8 C represents the operation peeling the 2nd stripping film self-induced transparency layer,

Fig. 8 D represents that monolithic turns to the operation of the LED being sealed by luminescent coating,

Fig. 8 E represents the operation obtaining the LED being sealed by luminescent coating,

Fig. 8 F represents the operation that the LED being sealed by luminescent coating is installed on substrate.

Fig. 9 represents that the variation of the LED being sealed by luminescent coating shown in Fig. 6 (is the lower surface of luminescent coating and transparent The lower surface of layer is respectively provided with from the exposure of LED exposure and exposure has positioned at the position more upper than the lower surface of LED Partial form) sectional view.

Figure 10 A～Figure 10 E is the variation representing the method for obtaining the LED being sealed by luminescent coating shown in Fig. 7 Process chart, wherein,

Figure 10 A represents the operation preparing multiple LED and fluorescence diaphragm seal,

Figure 10 B represents the operation sealing multiple LED using luminescent coating,

Figure 10 C represents the operation peeling stripping film autofluorescence body layer,

Figure 10 D represents that monolithic turns to the operation of the LED being sealed by luminescent coating,

Figure 10 E represents the operation obtaining the LED being sealed by luminescent coating.

Figure 11 is denoted as the glimmering of the 3rd embodiment of the optical semiconductor being covered with luminescent coating of the present utility model The sectional view of the LED (being the form that clear layer has flange part) of body of light layer sealing.

Figure 12 A～Figure 12 D is to represent the manufacture method of the LED being sealed by luminescent coating shown in Figure 11 and use fluorophor The process chart of the manufacture method of LED matrix of layer sealing LE, wherein,

Figure 12 A represents the operation preparing multiple LED and fluorescence diaphragm seal,

Figure 12 B represents the operation sealing multiple LED using luminescent coating,

Figure 12 C represents the operation forming recess in luminescent coating,

Figure 12 D represents the operation preparing slide.

Figure 13 A～Figure 13 E is to represent that then Figure 12 D goes on to say the system of the LED being sealed by luminescent coating shown in Figure 11 Make method and the process chart using the manufacture method of the LED matrix of LED being sealed by luminescent coating, wherein,

Figure 13 A represents and clear layer is configured at the upper surface of luminescent coating and then peels the 2nd stripping film self-induced transparency layer Operation,

Figure 13 B represents that monolithic turns to the operation of the LED being sealed by luminescent coating,

Figure 13 C represents the LED operation that acquisition is sealed by luminescent coating,

Figure 13 D represents the operation being transferred to the LED being sealed by luminescent coating on transfer sheet,

Figure 13 E represents the operation that the LED being sealed by luminescent coating is installed on substrate.

Figure 14 A～Figure 14 D is to represent the manufacture method of the LED being sealed by luminescent coating shown in Figure 11 and using by fluorescence The process chart of the variation of the manufacture method of the LED matrix of LED of body layer sealing, wherein,

Figure 14 A represents the operation preparing multiple LED and fluorescence diaphragm seal,

Figure 14 B represents the operation sealing multiple LED using luminescent coating,

Figure 14 C represents the operation peeling stripping film autofluorescence body layer,

Figure 14 D represents the operation preparing slide.

Figure 15 A～Figure 15 D is to represent that then Figure 14 D goes on to say the system of the LED being sealed by luminescent coating shown in Figure 11 Make method and the process chart using the variation of the manufacture method of the LED matrix of LED being sealed by luminescent coating, wherein,

Figure 15 A represents and clear layer is configured at the upper surface of luminescent coating and then peels the 2nd stripping film self-induced transparency layer Operation,

Figure 15 B represents that monolithic turns to the operation of the LED being sealed by luminescent coating,

Figure 15 C represents the operation obtaining the LED being sealed by luminescent coating,

Figure 15 D represents the operation that the LED being sealed by luminescent coating is installed on substrate.

Figure 16 represents the sectional view of the LED (being the form not having clear layer) being sealed by luminescent coating of comparative example 1.

Figure 17 represent comparative example 2 sealed by luminescent coating LED (be luminescent coating be formed with flange part, without The form of clear layer) sectional view.

Specific embodiment

The optical semiconductor being covered with luminescent coating of the present utility model possesses：Optical semiconductor, covering photosemiconductor The luminescent coating of element and at least one of clear layer covering luminescent coating.

Hereinafter, using the 1st embodiment～the 3rd embodiment, of the present utility model covering simultaneously is described with reference to Fig. 1～Figure 15 D There are the optical semiconductor of luminescent coating and an example of its manufacture method.

1st embodiment

In FIG, paper above-below direction is above-below direction (the 1st direction, i.e. thickness direction), is upside the (the 1st on the upside of paper The side of the side in direction, i.e. thickness direction), it is that (opposite side in the 1st direction, i.e. thickness direction is another for downside on the downside of paper Side).Paper left and right directions is left and right directions (2nd direction orthogonal with the 1st direction), is left side (the one of the 2nd direction on the left of paper Side), it is right side (opposite side in the 2nd direction) on the right side of paper.Thickness of paper direction is that fore-and-aft direction is (orthogonal with the 1st direction and the 2nd direction The 3rd direction), paper nearby side be front side (side in the 3rd direction), paper depth side be rear side (opposite side in the 3rd direction).

The LED being sealed by luminescent coating

As shown in figure 1, being sealed by luminescent coating of example as the optical semiconductor being covered with luminescent coating LED1 includes：LED2, it is an example of optical semiconductor；Luminescent coating 3, it covers the upper surface of LED2 and side； With clear layer 4, it covers the upper surface of luminescent coating 3.

The explanation of each component

LED2 is the optical semiconductor that can convert electrical energy into luminous energy.Optical semiconductor is not included in technical field The commutators such as the transistor different from optical semiconductor.LED2 is formed as such as thickness (greatest length on above-below direction) ratio The short section view rectangular shape of face direction length (specifically, left and right directions length and fore-and-aft direction length) and vertical view are substantially Rectangular shape.LED2 has lower surface 21, upper surface 22 and side 23.

The lower surface 21 of LED2 is the example that the component side that can contact with substrate 50 can contact face.Under LED2 The part on surface 21 is formed by projection (not shown) and the terminal (not illustrating in fig. 2) with the upper surface located at substrate 50 Electrical connection.The lower surface 21 of LED2 is the lowest surface of the LED1 being sealed by luminescent coating.

The upper surface 22 of LED2 is lower surface 21 with respect to LED2 in upside (being an example of side) x separated by a distance One example of the component side opposite face of ground relative configuration.Additionally, the upper surface 22 of described LED2 upside and lower surface 21 every That opens is identical with the thickness x of LED2 apart from x.

The side 23 of LED2, that is front surface, rear surface, left surface and right surface are and lower surface 21 and upper table One example of the component side link surface that face 22 is connected.

The upper surface 22 of LED2 and side 23 are formed by luminescent layer (not shown).

As LED2, the blue led (light-emitting diode) for example sending blue light can be included.

Luminescent coating 3 is the wavelength conversion layer that a part for the blue light sending from LED2 is converted to sodium yellow.Fluorescence Body layer 3 is formed as including the shape of LED2 when overlooking.Luminescent coating 3 is made with covering the upper surface 22 of LED2 and side 23 The mode that the lower surface 21 of LED2 exposes configures.That is, being formed with for accommodating in the central authorities of the bottom of luminescent coating 3 The receiving portion 30 of LED2.Receiving portion 30 be the lower surface 32 of autofluorescence body layer 3 towards the recessed recess in upside, it is with LED2's The corresponding mode of outer shape is formed.That is, the section view that luminescent coating 3 is formed as being formed with receiving portion 30 is substantially rectangular Shape and vertical view rectangular shape.Luminescent coating 3 has lower surface 32, upper surface 31, side 33 and is formed at receiving portion Inner surface 34 in 30.

The lower surface 32 of luminescent coating 3 is the lowest surface of luminescent coating 3 and is the fluorescence that can be contacted with substrate 50 Side can contact face.

The upper surface 31 of luminescent coating 3 is that the upper surface 22 with respect to LED2 separates upside (being an example of side) Apart from the example of fluorescence side the 1st opposite face that is oppositely disposed of y ground.In addition, the upper surface 31 of luminescent coating 3 is still relatively The face being oppositely disposed separated by a distance in upside in the upper surface 22 of LED2 y.Additionally, in luminescent coating 3, upper surface 31 is upper The lower surface 32 (that is, the upper surface 22 of LED2) of side and luminescent coating 3 separate apart from y be in luminescent coating 3 with LED2 The thickness y of the part of upside relative configuration.

The side 33 of luminescent coating 3 is that is, front surface, rear surface, left surface and right surface are with respect to LED2 Fluorescence side the 2nd phase that is oppositely disposed with separating distance alpha outside face direction (being an example of orthogonal direction) of side 23 One example on opposite.In addition, the side 33 of luminescent coating 3 is formed as the exposure exposing in side.Additionally, luminescent coating 3 The distance alpha that separates in the side 23 in outside and LED2 of side 33 be the outside being oppositely disposed in LED2 in luminescent coating 3 The partly left and right directions length of (sidepiece 35) and fore-and-aft direction length (minimum length) α.

The inner surface 34 of the receiving portion 30 of luminescent coating 3 is contacted with the upper surface 22 of LED2 and side 23.

Luminescent coating 3 is formed by such as phosphor resin compositionss.

It (is as the 1st transparent composition that phosphor resin compositionss contain fluorophor and transparent resin composition 1st transparent resin composition of example).

As fluorophor, can include for example can convert blue light into sodium yellow yellow fluorophor, can be by indigo plant Coloured light is converted into red-emitting phosphors of red light etc..

As yellow fluorophor, such as (Ba, Sr, Ca) can be included₂SiO₄:Eu、(Sr,Ba)₂SiO₄:Eu (barium orthosilicate ) (BOS) silicate phosphor, the such as Y such as₃Al₅O₁₂:Ce (YAG (yttrium-aluminium-garnet):Ce)、Tb₃Al₃O₁₂:Ce(TAG (terbium aluminium garnet):) etc. Ce there is carbuncle type fluorophor, such as Ca- α-SiAlON etc. of carbuncle type crystal structure Nitrogen oxides fluorophor etc..

As red-emitting phosphors, such as CaAlSiN can be included₃:Eu、CaSiN₂:Nitride phosphors such as Eu etc..

As the shape of fluorophor, for example spherical, tabular, needle-like etc. can be included.From the viewpoint of mobility, preferably arrange Enumerate spherical.

For example, 0.1 μm of meansigma methodss (fluorophor be spherical in the case of be mean diameter) of the greatest length of fluorophor with On, preferably more than 1 μm, and be, for example, less than 200 μm, preferably less than 100 μm.

The proportion of fluorophor is for example more than 2.0, and is, for example, less than 9.0.

Fluorophor can be used singly or in combination.

With respect to 100 mass parts transparent resin compositions, the compounding ratio of fluorophor is, for example, more than 0.1 mass parts, excellent Elect more than 0.5 mass parts as, and be, for example, below 80 mass parts, below also preferably 50 mass parts.In addition, with respect to fluorescence Body resin combination, the compounding ratio of fluorophor is, for example, more than 0.1 mass %, more than preferably 0.5 mass %, and for example Below 90 mass %, below preferably 80 mass %.

As transparent resin composition, for example use saturating can be included as the encapsulant for sealing LED2 The resin combination of bright property.Specifically, as transparent resin composition, such as compositions of thermosetting resin, heat can be included Thermoplastic resin composition, preferably includes compositions of thermosetting resin.

As compositions of thermosetting resin, such as two benches reaction hardening resin composition, a stage can be included anti- Answer hardening resin composition.

Two benches reaction hardening resin composition has two reaction mechanisms, and it can be from A in the reaction in the 1st stage Stage condition is realized B-stage (semi-solid preparation), is then realized C-stage (completely from B-stage state in the reaction in the 2nd stage Solidification).That is, it is can to become B-stage by the heating condition of appropriateness that two benches react hardening resin composition The compositions of thermosetting resin of state.But, under violent heat effect, two benches reaction hardening resin composition also can Enough disposably become C-stage state from A stage condition, and do not maintain B-stage state.Additionally, B-stage state is thermosetting tree State between the C-stage state in the A stage condition of liquid with after being fully cured for the oil/fat composition, for solidification and gelation slightly Carry out and the modulus of elasticity in comperssion semi-solid state less than the modulus of elasticity in comperssion of C-stage state or solid state.

One elementary reaction hardening resin composition has a reaction mechanism, and it can be from A in the reaction in the 1st stage Stage condition realizes C-stage (being fully cured).Additionally, an elementary reaction hardening resin composition includes heat as following Thermosetting resin compositionss：The reaction making this compositions of thermosetting resin in the midway of the reaction in the 1st stage stops, this thermosetting tree Oil/fat composition can become B-stage state from A stage condition, started again at for the 1st stage by further heating afterwards Reaction, this compositions of thermosetting resin can realize C-stage (being fully cured) from B-stage state.That is, this thermosetting Property resin combination is the compositions of thermosetting resin that can become B-stage state.On the other hand, an elementary reaction curable tree Oil/fat composition includes compositions of thermosetting resin as following：Can not be so that this compositions of thermosetting resin be anti-in a stage The mode that the midway answered stops this compositions of thermosetting resin is controlled that is to say, that this compositions of thermosetting resin not B-stage state can be become, but disposably realize C-stage (being fully cured) from A stage condition.

As transparent resin composition, such as organic siliconresin, epoxy resin, polyurethane resin, polyamides can be included sub- Polyimide resin, phenolic resin, Lauxite, melamine resin, unsaturated polyester resin etc..As transparent resin composition, preferably arrange Enumerate organic siliconresin, epoxy resin.

Described transparent resin composition can be same or multiple.

As organic siliconresin, from the viewpoint of the transparency, durability, thermostability, light resistance, can include and for example add Become the organic siliconresins such as reaction-curable organosilicon resin composition, condensation additive reaction curing type silicone resin combination Compositionss.Organic siliconresin can either be used alone it is also possible to be applied in combination.

Additive reaction curing type silicone resin combination is an elementary reaction hardening resin composition, and it contains for example Polysiloxanes containing thiazolinyl, containing hydrogenated silicyl polysiloxanes and hydrosilylation catalysts.

Polysiloxanes containing thiazolinyl contain plural alkenyl and/or cycloalkenyl group in intramolecular.Polysiloxanes containing thiazolinyl To represent in particular by following average composition formulas (1).

Average composition formula (1)：

R¹ _aR² _bSiO_(4-a-b)/2

(in formula, R¹Represent the alkenyl of carbon number 2～10 and/or the cycloalkenyl group of carbon number 3～10.R²Represent non-substituted or replace The monovalent hydrocarbon of carbon number 1～10 (wherein, do not include alkenyl and cycloalkenyl group.).A be 0.05～0.50, b be 0.80～ 1.80.)

In formula (1), as R¹Shown alkenyl, can include for example vinyl, pi-allyl, acrylic, cyclobutenyl, The alkenyl of the carbon numbers such as pentenyl, hexenyl, heptenyl, octenyl 2～10.As R¹Shown cycloalkenyl group, can include for example The cycloalkenyl group of the carbon numbers such as cyclohexenyl group, norbornene 3～10.

As R¹, preferably include alkenyl, more preferably include the alkenyl of carbon number 2～4, further preferably include Vinyl.

R¹Shown alkenyl can be same or multiple.

R²Shown monovalent hydrocarbon is non-substituted beyond alkenyl and cycloalkenyl group or replace the one of carbon number 1～10 Valency alkyl.

As non-substituted monovalent hydrocarbon, can include：For example methyl, ethyl, propyl group, isopropyl, butyl, isobutyl group, The alkyl of the carbon numbers 1～10 such as sec-butyl, the tert-butyl group, amyl group, hexyl, heptyl, octyl group, 2- ethylhexyl, nonyl, decyl；For example The cycloalkyl of the carbon numbers such as cyclopropyl, cyclobutyl, cyclopenta, cyclohexyl 3～6；The such as carbon number such as phenyl, tolyl, naphthyl 6～10 Aryl；The aralkyl of the such as carbon number 7～8 such as benzyl, benzyl ethyl.Preferably include alkyl, the carbon number 6～10 of carbon number 1～3 Aryl, more preferably include methyl and/or phenyl.

On the other hand, as replace monovalent hydrocarbon, can include with substituent group to replace aforementioned non-substituted monovalence The monovalent hydrocarbon of the hydrogen atom in alkyl.

As substituent group, the halogen atoms such as such as chlorine atom, such as glycidyl ether etc. can be included.

As the monovalent hydrocarbon replacing, specifically, 3- chloropropyl, glycidoxypropyl group etc. can be included.

Monovalent hydrocarbon can for non-substituted and replace any one of, preferably non-substituted.

R²Shown monovalent hydrocarbon can be same or multiple.Preferably include methyl and/or phenyl, more preferably combine Using methyl and phenyl.

A is preferably 0.10～0.40.

B is preferably 1.5～1.75.

Weight average molecular weight containing thiazolinyl polysiloxanes for example, more than 100, preferably more than 500, and be, for example, 10000 Hereinafter, preferably less than 5000.Weight average molecular weight containing thiazolinyl polysiloxanes is the standard being measured by gel permeation chromatography The scaled value of polystyrene.

Polysiloxanes containing thiazolinyl can be prepared using suitable method, alternatively, it is also possible to use commercially available product.

In addition, polysiloxanes containing thiazolinyl can be same or multiple.

Containing hydrogenated silicyl polysiloxanes for example contain plural hydrosilyl (SiH yl) in intramolecular. Specifically, containing hydrogenated silicyl polysiloxanes to be represented by following average composition formulas (2).

Average composition formula (2)：

H_cR³ _dSiO_(4-c-d)/2

(in formula, R³Represent that the monovalent hydrocarbon of carbon number 1～10 that is non-substituted or replacing (wherein, does not include alkenyl And/or cycloalkenyl group.).C is 0.30～1.0, d is 0.90～2.0.)

In formula (2), as R³The monovalent hydrocarbon of the shown carbon number 1～10 of non-substituted or replacement, can illustrate and formula (1) R²The monovalent hydrocarbon identical monovalent hydrocarbon of the shown carbon number 1～10 of non-substituted or replacement.Preferably include non-substituted The monovalent hydrocarbon of carbon number 1～10, more preferably includes alkyl, the aryl of carbon number 6～10 of carbon number 1～10, further preferably arranges Enumerate methyl and/or phenyl.

C is preferably less than 0.5.

D is preferably 1.3～1.7.

The weight average molecular weight of containing hydrogenated silicyl polysiloxanes for example, more than 100, preferably more than 500, and example As for less than 10000, preferably less than 5000.The weight average molecular weight of containing hydrogenated silicyl polysiloxanes is by gel infiltration The scaled value of the polystyrene standard of chromatography determination.

Containing hydrogenated silicyl polysiloxanes can be prepared by suitable method, alternatively, it is also possible to use commercially available product.

In addition, containing hydrogenated silicyl polysiloxanes can be same or multiple.

In above-mentioned average composition formula (1) and average composition formula (2), R²And R³In at least alkyl of any one preferably contain There is phenyl, it is further preferred that R²And R³The alkyl of both all contains phenyl.Wherein, in R²And R³In at least hydrocarbon of any one In the case that base contains phenyl, additive reaction curing type silicone resin combination is phenyl system organosilicon resin composition.Should Phenyl system organosilicon resin composition is the elementary reaction hardening resin composition that can form B-stage state.Phenyl system The refractive index of organosilicon resin composition for example, more than 1.45, preferably more than 1.50.

On the other hand, in R²And R³In the case that the hydrocarbon of both is methyl, additive reaction curing type silicone resin group Compound is methyl system organosilicon resin composition.Methyl system organosilicon resin composition is the single order that can not form B-stage state Duan Fanying hardening resin composition.The refractive index of methyl system organosilicon resin composition for example, less than 1.50, preferably 1.45 it is following.

In additive reaction curing type silicone resin combination, from the viewpoint of obtaining excellent gas permeation rate, Preferably include methyl system organosilicon resin composition.

Alkene so that in polysiloxanes containing thiazolinyl is adjusted to the compounding ratio of containing hydrogenated silicyl polysiloxanes The ratio of the molal quantity with respect to the hydrosilyl in containing hydrogenated silicyl polysiloxanes for the molal quantity of base and cycloalkenyl group (molal quantity of the molal quantity/hydrosilyl of alkenyl and cycloalkenyl group) for example, more than 1/30, preferably more than 1/3, and And for example, less than 30/1, preferably less than 3/1.

As long as hydrosilylation catalysts are alkenyl and/or cycloalkenyl group and the containing hydrogenated first that can improve in polysiloxanes containing thiazolinyl (addition is catalyzed the material of the response speed of silicon hydrogenation (Si-H addition reaction) of the hydrosilyl in silane based polysiloxane Agent), just there is no particular limitation as to it, can include such as metallic catalyst.As metallic catalyst, such as platinum can be included Black, platinum chloride, chloroplatinic acid, platinum-alkene complex, platinum-carbonyl complex, platinum-acetoacetate (acetyl acetate) etc. Platinum catalyst, such as palladium catalyst, such as rhodium catalyst etc..

With regard to the compounding ratio of hydrosilylation catalysts, according to amount of metal (the specifically metal raw of metallic catalyst Son) the quality criteria meter that is defined is, for example, 1.0ppm with respect to polysiloxanes containing thiazolinyl and containing hydrogenated silicyl polysiloxanes More than, and be, for example, below 10000ppm, preferably below 1000ppm, more preferably below 500ppm.

Additive reaction curing type silicone resin combination is by being compounded polysiloxanes containing thiazolinyl, hydrogeneous with aforementioned proportion Change silicyl polysiloxanes and hydrosilylation catalysts and prepare.

Described additive reaction curing type silicone resin combination passes through to be compounded polysiloxanes containing thiazolinyl, containing hydrogenated monosilane Based polysiloxane and hydrosilylation catalysts and the state that is prepared into the A stage (liquid) uses.

As described above, in phenyl system organosilicon resin composition, making silicon poly- containing thiazolinyl by the heating of desired conditions There is Si-H addition reaction with the hydrosilyl in containing hydrogenated silicyl polysiloxanes in the alkenyl in oxygen alkane and/or cycloalkenyl group Reaction, afterwards, makes hydrosilylation temporarily cease.Thereby, it is possible to be changed into B-stage (semi-solid preparation) state from A stage condition.It Afterwards, by it is further desired that the heating of condition, making above-mentioned hydrosilylation start again at, terminate.Thereby, it is possible to from B-stage State is changed into C-stage (being fully cured) state.

It should be noted that phenyl system organosilicon resin composition is solid, shaped when being in B-stage (semi-solid preparation) state. And, the phenyl system organosilicon resin composition of this B-stage state can have thermoplasticity and thermosetting concurrently.That is, B-stage Phenyl system organosilicon resin composition can by heating and temporarily plastify, be then fully cured.

On the other hand, in above-mentioned methyl system organosilicon resin composition, alkenyl and/or cycloalkenyl group and hydrogenation first silicon are made There is hydrosilylation in alkyl, and promote hydrosilylation in the case of so that hydrosilylation is stopped, and ties afterwards Bundle.Thereby, it is possible to be changed into C-stage (being fully cured) state from A stage condition.As methyl system organosilicon resin composition, can To use commercially available product.As commercially available product, such as ELASTOSIL series (Asahi Chemical Industry's Brunswick silicon (Japanese can be included：Asahi Chemical Industry ワ ッ カ シ リ U Application) company's manufacture), the specifically methyl such as ELASTOSIL LR7665 system organosilicon resin composition), KER series (SHIN-ETSU HANTOTAI's silicon (Japanese：SHIN-ETSU HANTOTAI's シ リ U Application) company's manufacture) etc..

Condensation additive reaction curing type silicone resin combination reacts curable resin for two benches, specifically, Can include the such as record such as Japanese Unexamined Patent Publication 2010-265436 publication, Japanese Unexamined Patent Publication 2013-187227 publication the 1st～ 8th condensation additive reaction curing type silicone resin combination, such as Japanese Unexamined Patent Publication 2013-091705 publication, Japan are special Open 2013-001815 publication, Japanese Unexamined Patent Publication 2013-001814 publication, Japanese Unexamined Patent Publication 2013-001813 publication, Japan Organosilicon resin compositions containing cage modle eight polysilsesquioxane of record such as JP 2012-102167 publication etc..Need Bright, condensation additive reaction curing type silicone resin combination is solid, shaped, and it has thermoplasticity and thermosetting concurrently.

As epoxy resin, such as bisphenol-type epoxy resin (such as bisphenol A type epoxy resin, bisphenol-f type ring can be included Oxygen tree fat, bisphenol-s epoxy resin, bisphenol-A epoxy resin, dimer acid modified bisphenol-type epoxy resin etc.), phenolic aldehyde clear Paint shaped epoxy resin (such as phenol novolak type epoxy resin, cresol novolak type epoxy resin, biphenyl type epoxy resin Deng), naphthalene type epoxy resin, fluorenes type epoxy resin (such as biaryl fluorenes type epoxy resin etc.), triphenylmethane type epoxy resin Fragrant family epoxy resin, such as three epoxypropyl isocyanuric acid esters such as (such as trihydroxy benzene methylmethane type epoxy resin etc.) The epoxy resin containing azo-cycle such as (triglycidyl isocyanurate), hydantoin epoxy resin, such as fatty family epoxy resin, Such as alicyclic epoxy resin (ring-like epoxy resin of such as dicyclopentadiene-type epoxy resin etc. two etc.), such as glycidyl ether Type epoxy resin, such as glycidyl amine type epoxy resin etc..In addition, as epoxy resin, for example adjacent benzene two also can be included Formic acid, tetrahydrophthalic acid, hexahydrophthalic acid, methyl tetrahydrophthalic acid, nadic acid, methyl nadic acid etc. 2-glycidyl ester of dicarboxylic acids etc..And then, as epoxy resin, also can include and there is the ester ring type that aromatic rings are hydrogenated The core hydrogenated trimellitic of structure, core hydrogenate ethylene oxidic ester of PMA etc. etc..

Epoxy resin can be used alone or is applied in combination.

Epoxy resin can be the arbitrary form in liquid, semisolid and solid-state.The average epoxy equivalent of epoxy resin For example, 90～1000.In the case that epoxy resin is for solid-state, from the viewpoint of the convenience processing, for example softening point is 50 DEG C～160 DEG C.

Epoxy resin is generally applied in combination with firming agent.As firming agent, such as anhydride system firming agent, isocyanide can be included Urea acid derivative system firming agent etc..

As anhydride system firming agent, such as phthalic anhydride, maleic anhydride, trimellitic anhydride, equal benzene four can be included Anhydride, hexahydrophthalic anhydride, tetrabydrophthalic anhydride, methylnadic anhydride, carbic anhydride, glutaric anhydride, first Base hexahydrophthalic anhydride, methyl tetrahydrophthalic anhydride etc..Anhydride system firming agent can be used alone or two or more It is applied in combination.

As isocyanuric acid derivative system firming agent, can include such as 1,3,5- tri- (1- carboxymethyl) isocyanuric acid ester, 1,3,5- tri- (2- carboxyethyl) isocyanuric acid ester, 1,3,5- tri- (3- carboxylic propyl group) isocyanuric acid ester, 1,3- double (2- carboxyethyl) are different Cyanurate etc..Isocyanuric acid derivative system firming agent may be used singly or in combination of two or more.

Firming agent may be used singly or in combination of two or more.

For example as follows the compounding ratio between epoxy resin and firming agent is set：With respect to epoxy resin In epoxy radicals 1 equivalent, allowing to the active group (anhydride group or carboxyl) that reacts with the epoxy radicals in firming agent is 0.5 Equivalent～1.5 equivalent, preferably 0.7 equivalent～1.2 equivalent.

In addition, transparent resin composition can also contain filler further.

As filler, the granules such as inorganic particle, organic granular can be included.

As inorganic particle, such as silicon dioxide (SiO can be included₂), Talcum (Mg₃(Si₄O₁₀)(HO)₂), aluminium oxide (Al₂O₃), boron oxide (B₂O₃), calcium oxide (CaO), zinc oxide (ZnO), strontium oxide (SrO), magnesium oxide (MgO), zirconium oxide (ZrO₂), Barium monoxide (BaO), stibium oxide (Sb₂O₃) etc. oxide, such as aluminium nitride (AlN), silicon nitride (Si₃N₄) etc. nitride Deng particles of inorganic material (inorganic matters).In addition, as inorganic particle, can include for example by prepared by foregoing illustrative inorganic matters answering Close particles of inorganic material, preferably include composite inorganic oxide particle (the specifically glass particle prepared by oxide Deng).

In composite inorganic oxide particle, contain such as silicon dioxide or silicon dioxide and oxidation as main constituent Boron, in addition, contain aluminium oxide, calcium oxide, zinc oxide, strontium oxide, magnesium oxide, zirconium oxide, Barium monoxide, oxidation as accessory ingredient Antimony etc..With regard to the main constituent content ratio in composite inorganic oxide particle, for example big with respect to composite inorganic oxide particle More than 40 mass %, preferably 50 mass %, and it is, for example, below 90 mass %, below preferably 80 mass %.Secondary one-tenth The content ratio divided is the remainder of the content ratio of above-mentioned main constituent.

Composite oxide particle is obtained in the following manner：Be compounded above-mentioned main constituent and accessory ingredient, heated and It is allowed to melt, then their fused mass is quickly cooled down, afterwards, pulverized using such as ball mill etc., afterwards, according to need Carry out suitable Surface Machining (specifically spheronisation etc.), be thus obtained.

Inorganic particle can be used alone or is applied in combination.

As the organic material of organic granular, can include for example acrylic resin, phenylethylene resin series, acrylic acid- Phenylethylene resin series, silicon-type resin, polycarbonate-based resin, benzocarbamidine amine system resin, polyolefin-based resins, Polyester tree Fat, polyamide series resin, polyimides system resins etc..These resins can be used alone or are applied in combination.

Among such organic material, from light diffusing, acquired from the viewpoint of, preferably include silicon-type tree Fat.

Organic granular can be used alone or is applied in combination.

Filler can be used alone or is applied in combination.

The refractive index of filler for example, more than 1.40, and be, for example, less than 1.600.

The shape of filler is not particularly limited, and can include for example spherical, tabular, needle-like etc..From the viewpoint of mobility, Preferably include spherical.

For example, more than 3 μm of the mean diameter of filler, preferably more than 5 μm, and it is, for example, less than 70 μm, preferably 50 Below μm.

With regard to the content ratio of filler, with respect to transparent resin composition, more than for example, 1 mass %, preferably 3 matter Amount more than %, and be, for example, below 80 mass %, below preferably 75 mass %.

Refractive index RIp of transparent resin composition (example of the 1st transparent composition) for example, more than 1.40, preferably For more than 1.45, more preferably more than 1.50, and be, for example, less than 1.63, preferably less than 1.60, more preferably 1.57 with Under.If refractive index RIp of transparent resin composition is more than above-mentioned lower limit, can improve the LED1's being sealed by luminescent coating Luminous intensity.

Refractive index RIp of transparent resin composition can be calculated by Abbe refractometer.It should be noted that in transparent tree In the case that oil/fat composition contains thermosetting resin, calculated in the form of the refractive index of solid state (being fully cured state).This Outward, the refractive index of the transparent resin composition before solidification with solidification after transparent resin composition refractive index substantially the same.

Additionally, as needed, silane coupler can be added in the proper ratio in phosphor resin compositionss, prevent always Agent, modifying agent, surfactant, dyestuff, pigment (not including above-mentioned filler), anti-blushing agent, UV absorbent etc. are known Additive.

As shown in figure 1, clear layer 4 is the superiors of the LED1 being sealed by luminescent coating.Specifically, clear layer 4 is to cover The mode of the entire surface of fluorescence side the 1st opposite face 31 of lid luminescent coating 3 configures.The plan view shape of clear layer 4 be formed as with The shape of fluorescence side the 1st opposite face 31 of luminescent coating 3 is identical.That is, clear layer 4 is formed as the substantially rectangular shape of section view Shape and vertical view rectangular shape.Clear layer 4 has lower surface 41, upper surface 42 and side 43.

The lower surface 41 of clear layer 4 is the transparent side contact surface contacting with fluorescence side the 1st opposite face 31.

The upper surface 42 of clear layer 4 be with respect to luminescent coating 3 upper surface 31 upside (being an example of side) An example of the transparent side opposite face of z ground relative configuration separated by a distance.The upper surface 42 of clear layer 4 is to be sealed by luminescent coating LED1 the top.The upper surface 42 of clear layer 4 with respect to luminescent coating 3 upper surface 31 upside separate apart from z with The thickness z of clear layer 4 is identical.

The side 43 of clear layer 4 is connected with the lower surface 41 of clear layer 4 and upper surface 42 respectively.The side of clear layer 4 43 be above-below direction (being an example in a direction) is upper project when, the side 23 with respect to LED2 (be orthogonal in face direction One example in direction) outside interval α ground configuration transparent side link surface an example.Side 43 He of clear layer 4 The side 33 of luminescent coating 3 is formed as a face in the vertical direction.

Clear layer 4 is formed by such as transparent resin composition, inorganic matters etc. the 2nd transparent composition.

As transparent resin composition, for example described transparent resin composition can be included (in phosphor resin compositionss In the transparent resin composition that contains).The each composition containing in transparent resin composition and the compounding ratio of each composition are in With each composition containing in transparent resin composition (transparent resin composition containing in phosphor resin compositionss) and The scope that the compounding ratio of each composition repeats.

As inorganic matters, glass etc. can be included.As glass, it is not particularly limited, and can include such as alkali-free glass Glass, soda-lime glass, quartz glass, pyrex, lead glass, fluoride glass etc..In addition, as glass, also can include resistance to Hot glass, specifically, as trade name, can include tempax glass on the market, vycor glass, pyrex glass Deng.As glass, preferably include alkali-free glass, soda-lime glass.

Refractive index RIt of the 2nd transparent composition is set so that the 1st transparent resin composition is (in luminescent coating 3 In the transparent resin composition that contains) refractive index RIp deduct the 2nd transparent composition refractive index RIt value (RIp-RIt) example As for more than -1.0, preferably more than -0.7, more preferably more than 0, more preferably more than 0.05, especially preferably 0.10 More than, and be, for example, less than 0.20.If RIp-RIt is more than described lower limit, it is obtained in that more excellent luminous intensity.If RIp-RIt is below the described upper limit, then can suppress the reflection of interface between clear layer 4 and luminescent coating 3 for the light.

Clear layer 4 can also be formed by such as multilamellar.

Size

Suitably set the size of LED2, luminescent coating 3 and this several person of clear layer 4 according to purposes and purpose.

Apart from x (for example, more than 10 μm of the thickness x) of LED2, preferably more than 50 μm, and be, for example, less than 1000 μm, It is preferably less than 500 μm.

Left and right directions length γ of LED2 and fore-and-aft direction length (not illustrating in FIG) are on the face direction of LED2 Minimum length, for example, more than 0.1 μm, preferably more than 0.2 μm, and be, for example, less than 5000 μm, preferably 2000 μm with Under.

Apart from y (for example, more than 50 μm of the thickness y) of the part of the upside being oppositely disposed in LED2 in luminescent coating 3, It is preferably more than 150 μm.In addition, being, for example, less than 1000 μm apart from y, preferably less than 500 μm, more preferably less than 350 μm, More preferably less than 300 μm, especially preferably less than 200 μm, more specifically preferably less than 150 μm, especially excellent further Elect less than 100 μm as.If being less than the described upper limit apart from y, the gas permeation rate of luminescent coating 3 can be improved, in LED matrix 60 In when being provided with the LED1 being sealed by luminescent coating, Fluorophotometry body layer 3 can produce and burn black (Japanese：こ げ) such that it is able to Improve the reliability of the LED1 being sealed by luminescent coating, and then the reliability of LED matrix 60 can be improved.

Apart from z, (the thickness z) of clear layer 4 is, for example, more than 100 μm, preferably more than 200 μm.In addition, apart from z being, for example, Less than 1000 μm, preferably less than 500 μm, more preferably less than 400 μm, more preferably less than 300 μm, especially preferably Less than 200 μm, most preferably less than 100 μm.If being less than the described upper limit apart from z, the gas permeation of clear layer 4 can be improved Rate, when being provided with, in LED matrix 60, the LED1 being sealed by luminescent coating, can suppress clear layer 4 generation burning black such that it is able to carry The reliability of the LED1 that height is sealed by luminescent coating, and then the reliability of LED matrix 60 can be improved.

In addition, LED2, luminescent coating 3 and clear layer 4 preferably meet the full terms of following (1)～(4).

(1) apart from y divided by the value (y/x) apart from x for example, more than 1, preferably more than 1.25, and be, for example, less than 5, Preferably smaller than 5, more preferably less than 4, more preferably less than 3.If y/x is more than described lower limit, it is obtained in that excellent Color homogeneity.If y/x is below the described upper limit, irregular colour can be suppressed even.

(2) apart from y with apart from z's with (y+z) for example, more than 0.20mm, preferably more than 0.25mm, more preferably More than 0.5mm, and be, for example, below 2mm, preferably below 1.5mm.If y+z is more than described lower limit, it is obtained in that excellent Different luminous intensity.If y+z is below the described upper limit, material cost can be suppressed.

(3) for example, more than 50 μm of distance alpha (minimum length α of the sidepiece 35 of luminescent coating 3), preferably greater than 50 μm, more It is preferably more than 100 μm, and be, for example, less than 2000 μm, preferably less than 1000 μm.If distance alpha is more than described lower limit, The reduction or the suppression irregular colour that are then prevented from color homogeneity are even.

(4) apart from y divided by distance alpha value (y/ α) for example, more than 1, preferably more than 1.2, and be, for example, 2.5 with Under, preferably less than 2.0.If y/ α is below the described upper limit, irregular colour can be suppressed even.

The manufacture method of the LED being sealed by luminescent coating

Next, illustrating to manufacture method and the use of the LED being sealed by luminescent coating shown in Fig. 1 with reference to Fig. 2A～Fig. 2 F The method that the LED being sealed by luminescent coating to manufacture LED matrix.

The manufacture method of the LED1 being sealed by luminescent coating includes：Manufacture as including covering of clear layer 4 and luminescent coating 3 The operation (with reference to Fig. 2A) of the diaphragm seal 5 of one example of cover plate；Diaphragm seal 5 is covered the side of multiple LED2 with luminescent coating 3 The operation (reference picture 2C) that formula is configured；Cut in the way of monolithic turns to the LED1 being sealed by luminescent coating with by diaphragm seal 5 Disconnected operation (reference picture 2D).In the operation (with reference to Fig. 2A) manufacturing diaphragm seal 5, include preparation clear layer 4 operation and The surface of clear layer 4 forms the operation of luminescent coating 3.

As shown in Figure 2 A, in the operation preparing clear layer 4, in the situation being formed clear layer 4 by transparent resin composition Under, first, prepare the stripping film 6 shown in imaginary line.

Stripping film 6 is bonded in the way of can peeling off the back side (lower surface in Fig. 1) of clear layer 4, to protect Bright layer 4, until using clear layer 4 sealing LED 2 (in the case that clear layer 4 is formed by compositions of thermosetting resin, until making Clear layer 4 solidifies).That is, stripping film 6 is flexible thin film as following：This flexible thin film is dispatched from the factory diaphragm seal 5 It is laminated in the back side of clear layer 4 in the way of covering the back side of clear layer 4 during conveying keeping, when diaphragm seal 5 will be used, This flexible thin film can be peeled with the back side being a substantially U-shaped bending self-induced transparency layer 4.That is, stripping film 6 is only by flexible thin film's Constitute.In addition, as needed, to the adhesive surface of stripping film 6, that is the contact surface being contacted with clear layer 4 of stripping film 6 is entered The lift-off processing such as row fluorine process.

As stripping film 6, the thin polymer films such as such as polyethylene film, mylar (PET etc.) can be included, for example make pottery Ceramics, such as metal forming etc..Preferably include thin polymer film.In addition, the shape of stripping film 6 is not particularly limited, for example, shell Be formed as overlooking rectangular shape (including rectangular strip, lengthwise shape) etc. from piece 6.For example, 1 μm of the thickness of stripping film 6 with On, preferably more than 10 μm, and be, for example, less than 2000 μm, preferably less than 1000 μm.

Then, in the case that clear layer 4 is formed by transparent resin composition, by the varnish coating of transparent resin composition On the surface of stripping film 6.In order to be coated in transparent resin composition on the surface of stripping film 6, can use and for example distribute Device, applicator, slit mould coating machine (Japanese：ス リ ッ ト ダ イ U タ) etc. applying device.

By being coated in transparent resin composition on stripping film 6, thus forming the film of transparent resin composition.

Afterwards, film is made to be fully cured (C-stage).As heating condition, heating-up temperature is more than 80 DEG C, preferably More than 100 DEG C, and it is less than 200 DEG C, preferably less than 150 DEG C.In addition, for example, more than 10 minutes heat time heating time, preferably For more than 30 minutes, and it is, for example, less than 5 hours.

Thus, the transparent resin composition making the A stage in film is fully cured (C-stage).

In the case that transparent resin composition contains additive reaction curing type silicone resin combination, make alkenyl And/or the silicon hydrogen between cycloalkenyl group and hydrosilyl reacts and carries out partway, making the reaction of silicon hydrogen temporarily cease afterwards.

On the other hand, the situation of condensation reaction additive reaction curing type silicone resin is contained in transparent resin composition Under, so that condensation reaction is terminated.

Thus, clear layer 4 is formed by the transparent resin composition of B-stage.

On the other hand, in the case that clear layer 4 is formed by inorganic matters, specifically, prepare to be pre-formed into tabular Inorganic matters.Preferably, stripping film 6 (with reference to the imaginary line of Fig. 2A) is not used to prepare glass plate.

Thus, form clear layer 4 by inorganic matters.

Then, as shown in Figure 2 A, form luminescent coating 3 on the surface of clear layer 4.

In the case that luminescent coating 3 is formed by phosphor resin compositionss, using described applying device in clear layer 4 Phosphor resin compositionss are applied on surface.Thus, form the film of phosphor resin compositionss.

Afterwards, the situation of the compositions of thermosetting resin that can become B-stage state is contained in phosphor resin compositionss Under, make film realize B-stage.Heating condition is identical with described scope.Thus, make film B implementation phase.

In the case that phosphor resin compositionss contain additive reaction curing type silicone resin combination, make alkenyl And/or the silicon hydrogen between cycloalkenyl group and hydrosilyl reacts and carries out partway, making the reaction of silicon hydrogen temporarily cease afterwards.

On the other hand, the feelings of condensation reaction additive reaction curing type silicone resin are contained in phosphor resin compositionss Under condition, condensation reaction is made to terminate.

Thus, form luminescent coating 3 by phosphor resin compositionss.

Then, the luminescent coating 3 of tabular is configured on the upper surface of clear layer 4.

Thus, as shown in Figure 2 A, obtain the diaphragm seal 5 including clear layer 4 and luminescent coating 3.Preferably, diaphragm seal 5 It is made up of clear layer 4 and luminescent coating 3.

This diaphragm seal 5 has writing board shape, and specifically, this diaphragm seal 5 has the thickness of regulation, and has along right and left To surface that extend with fore-and-aft direction, flat and the flat back side.In addition, diaphragm seal 5 is not LED matrix 60 (aftermentioned, reference Fig. 2 F) but a part of LED matrix 60, be part for making LED matrix 60, diaphragm seal 5 do not include LED2 and The substrate 50 of LED2 is installed, it is as part individually circulation, the device that can industrially use.

Additionally, in the case that clear layer 4 is formed by transparent resin composition, diaphragm seal 5 includes stripping film 6, clear layer 4th, luminescent coating 3.Preferably, diaphragm seal 5 is made up of stripping film 6, clear layer 4 and luminescent coating 3.

As shown in Figure 2 B, multiple LED2 are separately prepared.Specifically, multiple LED2 are configured the upper surface in support plate 7 On.

Support plate 7 is bonded in exposure (Fig. 1 of the LED2 in the LED1 being sealed by luminescent coating in the way of can peeling off In lower surface 21) on, to protect the LED2 of LED1 being sealed by luminescent coating, until obtaining the LED1 being sealed by luminescent coating Peel off the LED1 being sealed by luminescent coating afterwards, the LED1 that this is sealed by luminescent coating obtains in the following way, i.e. using glimmering Body of light layer 3 covers the multiple LED2 on support plate 7 and seals the plurality of LED2, thus obtain sealing LED aggregation 8 (aftermentioned, Reference picture 2C), sealing LED aggregation 8 is cut off and obtains the LED1 being sealed by luminescent coating.That is, support plate 7 be as Lower such peel plate：This peel plate the LED1 being sealed by luminescent coating dispatch from the factory conveying keeping when with support LED2 and The mode covering the lower surface 21 of LED2 is laminated in the lower surface 21 of LED2, when just LED2 is installed on substrate 50 shortly, can As shown in the imaginary line of Fig. 2 D, the LED1 being sealed by luminescent coating is peeled.That is, support plate 7 is only by peel plate structure Become.

Support plate 7 is formed by with described stripping film 6 identical material.Alternatively, it is also possible to by sealing LED aggregation can be made The 8 hot stripping films being easily peeled off under heat effect to form support plate 7.Further, it is possible to configuration is pressed on the surface of support plate 7 Quick bond layer.

For example, more than 10 μm of the thickness of support plate 7, preferably more than 50 μm, and be, for example, less than 1000 μm, preferably For less than 100 μm.

And, multiple LED2 are configured on the surface (upper surface) of support plate 7.Specifically, by multiple LED2 with On left and right directions and fore-and-aft direction, the mode of interval is arranged.In addition, so that the lower surface 21 of LED2 (includes not shown Projection) multiple LED2 configure the surface (upper table in support plate 7 by the mode that contacts with the surface (upper surface) of support plate 7 Face) on.

Total between interval between spacing P of multiple LED2, the i.e. LED2 LED2 adjacent with this LED2 It is, for example, more than 0.3mm, preferably more than 0.5mm with P, and be, for example, below 5mm, preferably below 3mm.In addition, it is multiple The interval of LED2 is, for example, more than 0.1mm, preferably more than 0.3mm, and is, for example, below 3mm, preferably below 2mm.

Afterwards, as shown in the arrow of Fig. 2 B and Fig. 2 C, multiple LED2 are sealed using diaphragm seal 5.

For example, diaphragm seal 5 is crimped with respect to the support plate 7 supporting multiple LED2.Preferably, by diaphragm seal 5 It is thermally compressed (heat pressurization) with respect to the support plate 7 supporting multiple LED2.

Specifically, first, diaphragm seal 5 and multiple LED2, support plate 7 are arranged at the flat board pressue device with thermal source Deng.The upper mould that flat board pressue device includes lower mould and is oppositely disposed the upside in this lower mould, does not illustrate to this.Specifically, To make multiple LED2 that stripping film 6 to be configured in the way of upward the upper surface of lower mould.In addition, in the diaphragm seal 5 making shown in Fig. 2A After spinning upside down, with make luminescent coating 3 mode directed downwardly, i.e. in the way of making luminescent coating 3 relative with LED2 by stripping film 6 It is configured at the lower surface of mould.

Then, using flat board pressue device, diaphragm seal 5 and multiple LED2, support plate 7 are carried out with heat pressurization.

Contain in luminescent coating 3 and/or clear layer 4 and there is thermoplasticity and heat cured phenyl system organosilicon resin composition In the case of, temperature in flat board pressue device be the thermoplastic temperature of phenyl system organosilicon resin composition or thermoplastic temperature with On, from the viewpoint of the disposable thermoplastic implementing phenyl system organosilicon resin composition and heat cure, in flat board pressue device Temperature be preferably more than heat curing temperature or heat curing temperature, specifically, for example, more than 60 DEG C, preferably 80 DEG C with On, and be, for example, less than 150 DEG C, preferably less than 120 DEG C.

Moulding pressure is, for example, more than 0.1MPa, preferably more than 1MPa, and is, for example, below 10MPa, preferably Below 5MPa.

For example, more than 1 minute pressing time, preferably more than 5 minutes, and be, for example, less than 60 minutes, preferably 20 Below minute.

In the case that luminescent coating 3 contains and has thermoplasticity and heat cured phenyl system organosilicon resin composition, profit Luminescent coating 3 is made to plastify with described heat pressurization.Then, multiple LED2 are buried using the luminescent coating 3 after plasticizing.Concrete and Speech, as shown in figure 1, cover upper surface 22 and the side 23 of LED2 using luminescent coating 3.

In addition, in the case that clear layer 4 contains and has thermoplasticity and heat cured phenyl system organosilicon resin composition, Clear layer 4 is made to plastify using described heat pressurization, so that clear layer 4 is closely attached on luminescent coating 3.

Thus, as shown in Figure 2 C, multiple LED2 are sealed using the luminescent coating 3 of diaphragm seal 5.

Afterwards, in the reaction curable resin combination of the two benches containing B-stage state of luminescent coating 3 and/or clear layer 4 In the case of thing, this two benches is made to react hardening resin composition C-stage.

In the case that two benches reaction hardening resin composition contains phenyl system organosilicon resin composition, in phenyl Be organosilicon resin composition reaction (C-stageization reaction) in, alkenyl in polysiloxanes containing thiazolinyl and/or cycloalkenyl group with The hydrosilylation between hydrosilyl in containing hydrogenated silicyl polysiloxanes is promoted further.Afterwards, chain Hydrosilyl in thiazolinyl and/or cycloalkenyl group or containing hydrogenated silicyl polysiloxanes disappears, and hydrosilylation is tied Bundle, is derived from the product of phenyl system organosilicon resin composition, the i.e. solidfied material of C-stage.That is, being added by silicon hydrogen Become the end of reaction, phenyl system organosilicon resin composition shows curable (specifically thermosetting).

Above-mentioned product is represented by following average composition formulas (3).

Average composition formula (3)：

R⁵ _eSiO_(4-e)/2

(in formula, R⁵Represent that the monovalent hydrocarbon containing carbon number 1～10 that is phenyl, non-substituted or replacing (wherein, does not include Alkenyl and cycloalkenyl group.).E is 0.5～2.0.)

As R⁵The monovalent hydrocarbon of the shown carbon number 1～10 of non-substituted or replacement, can exemplify the R with formula (1)²Shown Non-substituted or replace the monovalent hydrocarbon of carbon number 1～10 and formula (2) R³The carbon number 1～10 of shown non-substituted or replacement Monovalent hydrocarbon identical monovalent hydrocarbon.Preferably include non-substituted monovalent hydrocarbon, more preferably include the alkane of carbon number 1～10 Base, the aryl of carbon number 6～10, further preferably include being applied in combination of phenyl and methyl.

E is preferably 0.7～1.0.

And, the R of the average composition formula (3) of product⁵In phenyl content ratio be, for example, 30 moles of more than %, excellent Elect 35 moles of more than % as, and be, for example, 55 moles of below %, preferably 50 moles below %.

The R of the average composition formula (3) of product⁵In the content ratio of phenyl be silicon atom Direct Bonding with product Monovalent hydrocarbon (with R in average composition formula (3)⁵Represent) in phenyl concentration.

The R of the average composition formula (3) of product⁵In the content ratio of phenyl pass through¹H-NMR and²⁹Si-NMR calculates.R⁵ In the content ratio of phenyl detailed computational methods as follows：According to the record of such as WO2011/125463 etc., utilize¹H- NMR and²⁹Si-NMR is calculating.

Then, as shown in the arrow of Fig. 2 C, stripping film 6 self-induced transparency layer 4 is peeled.

Thus, obtain be supported by the state of plate 7 supporting, include multiple LED2, luminescent coating 3 and clear layer 4 Sealing LED aggregation 8.

Afterwards, as shown in the single dotted broken line of Fig. 2 D, sealing LED aggregation 8 is cut off and monolithic turns to multiple LED2.Specifically For, by the luminescent coating 3 corresponding with each LED2 and clear layer 4 along fore-and-aft direction and left and right directions cut-out.Thus, obtain Be supported by luminescent coating 3 in the state of plate 7 supporting, including 1 LED2, cover LED2 in the way of LED2 to be buried, with And it is configured at the LED1 being sealed by luminescent coating of the clear layer 4 of the upper surface of luminescent coating 3.

Then, such as Fig. 2 D arrow and and imaginary line shown in, multiple LED1 self-supporting plates 7 being sealed by luminescent coating are shelled From.

Thus, as shown in Figure 2 E, obtain includes 1 LED2, by bury LED2 in the way of cover LED2 luminescent coating 3, And it is configured at the LED1 being sealed by luminescent coating of the clear layer 4 of the upper surface of luminescent coating 3.

The LED1 being sealed by luminescent coating does not include support plate 7 (reference picture 2C) and substrate 50 (aftermentioned, reference picture 2F), excellent Choosing, the LED1 being sealed by luminescent coating is made up of LED2, luminescent coating 3, clear layer 4.That is, sealed by luminescent coating LED1 is not the LED matrix 60 (Fig. 2 F) of following explanation that is to say, that not including the substrate 50 located at LED matrix 60.? That is, the LED1 being sealed by luminescent coating is with electricity also (not shown) with the terminal of setting on the substrate 50 of LED matrix 60 The mode connecting is constituted.In addition, the LED1 being sealed by luminescent coating is a part of LED matrix 60, is for making LED The part of device 60, it is as part individually circulation, the device that can industrially use.

Afterwards, multiple LED1 being sealed by luminescent coating are picked out according to emission wavelength, luminous efficiency.

Then, as shown in Figure 2 F, the LED1 being sealed by luminescent coating is installed on substrate 50.

Specifically, first, prepare to be provided with the substrate 50 of terminal (not shown) in upper surface.

Substrate 50 constitutes the substantially rectangular tabular extending along the longitudinal direction with left and right directions, and it is, for example, insulated substrate. In addition, substrate 50 has the terminal (not shown) being disposed on surface.

Afterwards, as shown in Figure 2 F, the LED1 being sealed by luminescent coating is installed on substrate 50.

Specifically, make the terminal of the projection (not shown) of LED2 in the LED1 being sealed by luminescent coating and substrate 50 (not shown) contacts and so that both is electrically connected.That is, the LED2 upside-down installation method by the LED1 being sealed by luminescent coating In substrate 50.In addition, making the lower surface 32 of luminescent coating 3 contact with substrate 50.

Thus, obtain the LED matrix 60 including substrate 50 with the LED1 being sealed by luminescent coating being installed on substrate 50.Excellent Choosing, LED matrix 60 is made up of with the LED1 that sealed by luminescent coating substrate 50.That is, LED matrix 60 does not include shelling From piece 6 and/or support plate 7 it is preferred that LED matrix 60 is made up of substrate 50, LED2, luminescent coating 3, clear layer 4.

The action effect of the 1st embodiment

And, as shown in figure 1, because the LED1 that this is sealed by luminescent coating includes covering the upper surface 31 of luminescent coating 3 Clear layer 4, therefore, it is possible to improve luminous intensity.Specifically, can make transparent resin composition (clear layer 4) and air it Between interface away from (leaving) as the substrate 50 of absorber of light, LED2 (interface between LED2 and luminescent coating 3).Therefore, From LED2 towards upside light and by luminescent coating 3 wavelength convert after light and do not passed through by luminescent coating 3 wavelength convert Even if the light of luminescent coating 3 is in transparent resin composition (clear layer 4), and the interface and air between is not easy to return by reflection To substrate 50, LED2 (absorber of light) it is thus possible to improve the luminous intensity of the LED1 being sealed by luminescent coating.

Further, since this LED1 being sealed by luminescent coating meets the complete of (1)～(4) relevant with described x, y, z and α Portion's condition, therefore, it is possible to improve luminous intensity further, and this LED1 of being sealed by luminescent coating to have excellent color equal Even property and irregular colour can be suppressed even.

In addition, in the LED1 being sealed by luminescent coating at this, if (contain in luminescent coating 3 is saturating for the 1st transparent composition Ming tree oil/fat composition) refractive index RIp be 1.45～1.60, then can improve the luminous strong of the LED1 being sealed by luminescent coating Degree.

In addition, in the LED1 being sealed by luminescent coating at this, if (contain in luminescent coating 3 is saturating for the 1st transparent composition Ming tree oil/fat composition) refractive index RIp deduct the 2nd transparent composition (transparent resin composition containing in clear layer 4) The value (refractive index RIp- refractive index RIt) of refractive index RIt is -0.70～0.20, then can improve and be sealed by luminescent coating The luminous intensity of LED1.

In addition, in the LED1 being sealed by luminescent coating at this, if RIp-RIt is more than 0.05, can improve further The luminous intensity of the LED1 being sealed by luminescent coating.

In addition, in the LED1 being sealed by luminescent coating at this, if distance alpha, more than 50 μm, can improve color homogeneity.

The manufacture method of the LED1 being sealed by luminescent coating using this, simply can be manufactured glimmering using diaphragm seal 5 The LED1 of body of light layer sealing.

The manufacture method of the LED1 being sealed by luminescent coating using this, can simply manufacture with desired size (y, Z, α etc.) the LED1 being sealed by luminescent coating.

Variation

In variation, for described 1st embodiment identical component and operation, mark identical reference and Omit detail explanation.

In the 1st embodiment, LED2, luminescent coating 3, clear layer 4 is made to be respectively formed as overlooking rectangular shape, but Their shape is not particularly limited.Can also make LED2, luminescent coating 3, clear layer 4 be respectively formed as example overlooking substantially round Shape shape, the generally polygonal shape of vertical view (not including rectangular shape), do not illustrate to this.

And, in the 1st embodiment, as shown in figure 1, making clear layer 4 be formed as section view rectangular shape, but also may be used To be formed as the section domed shape (or convex lens shape) of such as upper surface bending, this is not illustrated.In this case, away from With a distance from till the upper surface 31 that z is autofluorescence body layer 3 plays the top of clear layer 4.

And, clear layer 4 can also be made to be formed towards upside and to go general conical shape that cross section diminishes, specifically shape Become many pyramid shape such as quadrangle cone shape, triangular pyramidal shape.

In addition, in the 1st embodiment, as shown in figure 1, lower surface 32 structure of the surrounding of receiving portion 30 of luminescent coating 3 Become the fluorescence side that can contact with substrate 50 and can contact face.But, for example, as shown in figure 5, lower surface 32 structure can be made Become can with substrate 50 interval can ensure that septal surface.

As shown in figure 5, the lower surface 32 of the surrounding of receiving portion 30 of luminescent coating 3 exposes from LED2 and is located at the ratio of LED2 The upper part of lower surface 21.Specifically, when projecting in the surface direction, the lower surface 32 of luminescent coating 3 is located at LED2's Between lower surface 21 and upper surface 22.That is, when projecting on fore-and-aft direction and left and right directions, the lower surface 32 of luminescent coating 3 is joined Put the position in the side 23 being comprised in LED2.

Thus, the lower surface 32 of luminescent coating 3 makes the bottom of the side 23 of LED2 expose.

And, in the 1st embodiment, make luminescent coating 3 and clear layer 4 realize C-stage that is to say, that making successively Luminescent coating 3 realizes C-stage, afterwards, makes clear layer 4 realize C-stage but it is also possible to be for example making the glimmering of B-stage state Body of light layer 3 and clear layer 4 realize C-stage simultaneously.

In addition, in described 1st embodiment, as shown in Fig. 2A～Fig. 2 E, making diaphragm seal 5 be formed on stripping film 6, it Afterwards, using diaphragm seal 5 come sealing LED 2.

But, as shown in Fig. 3 A～Fig. 4 C, Neng Goushi, diaphragm seal 5 is not formed on stripping film 6, support plate 7 it On drip the varnish of (pouring) phosphor resin compositionss and the varnish of transparent resin composition successively and sequentially form fluorophor Layer 3 and clear layer 4.

In the method, as shown in Figure 3 C, the varnish of (pouring) phosphor resin compositionss of dripping on support plate 7.

For the varnish of phosphor resin compositionss of dripping on support plate 7, first, as shown in Figure 3A, by 1 LED2 Configuration is in the upper surface of support plate 7.Thus, prepared to be supported by 1 LED2 of plate 7 supporting.

As shown in Figure 3A, separately prepare the 1st weir 11.

1st weir 11 is formed as overlooking rectangular shape.In addition, the central part on the 1st weir 11 is formed with along the vertical direction Run through the 1st peristome 13 on the 1st weir 11.The vertical view that 1st peristome 13 is formed as corresponding with the outer shape of luminescent coating 3 is big Cause rectangular shape.

As the material on the 1st weir 11, such as resin, the glass cloth being impregnated with resin, metal etc. can be included.These materials Can be used singly or in combination.Preferably include resin.

As resin, thermosetting resin, thermoplastic resin can be included.Preferably include thermosetting resin.Preferably, As heat reactive resin, the elementary reaction curable resin that can not become B-stage state can be included.As such single order Duan Fanying curable resin, can include the methyl system organosilicon resin composition of an elementary reaction curable.As a stage The methyl system organosilicon resin composition of reaction curable, can be using such as ELASTOSIL series (Brunswick silicon company of Asahi Chemical Industry Manufacture), specifically, the methyl such as ELASTOSIL LR7665 system organosilicon resin composition), KER series (SHIN-ETSU HANTOTAI's silicon company system Make) etc. commercially available product.

In addition it is also possible to prepare resin as the resin combination compounded with filler.

For example, more than 100 μm of the thickness on the 1st weir 11, preferably more than 200 μm, more preferably more than 400 μm, and example As for less than 1500 μm.

Then, as shown in Figure 3 B, the 1st weir 11 is configured in the way of surrounding LED2 on the upper surface of support plate 7.

In order to configure on the upper surface of support plate 7 the 1st weir 11 in the way of surrounding LED2, first, on the 1st weir 11 In the case that material is resin, prepares the varnish containing resin, then, varnish is coated in the surface of stripping film (not shown) On.Afterwards, in the case that material contains thermosetting resin, varnish is heated and so that it is solidified.Afterwards, beyond the region of objective existence will be solidified Shape is processed into described pattern.

Afterwards, as shown in the arrow of Fig. 3 A and Fig. 3 B, the side in the 1st peristome 13 on the 1st weir 11 is inserted into LED2 1st weir 11 is positioned on the upper surface of support plate 7 formula.

Or or, as shown in Figure 3 B, varnish is applied directly to around LED2 with described pattern, thus 1st weir 11 is directly formed on the upper surface of support plate 7.

Thus, the 1st weir 11 is configured in the way of surrounding LED2 on the upper surface of support plate 7.

Then, as shown in Figure 3 C, phosphor resin of dripping into the 1st peristome 13 on the 1st weir 11 on support plate 7 combines The varnish of thing.Specifically, drip varnish into the 1st peristome 13 and so that the liquid level of varnish and the upper surface on the 1st weir 11 is become One face.

Afterwards, the situation of the compositions of thermosetting resin that can become B-stage state is contained in phosphor resin compositionss Under, make phosphor resin compositionss realize B-stage.

Thus, formed in the 1st peristome 13 on the 1st weir 11 and cover the upper surface 22 of LED2 and the luminescent coating of side 23 3.

Then, as shown in the arrow of Fig. 3 C, the 1st weir 11 self-supporting plate 7 is peeled.Now, the 1st peristome on the 1st weir 11 13 side is peeled off by the side 33 of autofluorescence body layer 3.

Then, as shown in Fig. 3 D and Fig. 3 E, the 2nd weir 12 is configured on the upper surface of support plate 7.

Besides the thickness, the 2nd weir 12 is constituted in the same manner as described 1st weir 11.The thickness on the 2nd weir 12 forms and must be thicker than the 1st The thickness on weir 11, specifically, the thickness on the 2nd weir 12 is adjusted to and can embed luminescent coating 3 and can form clear layer 4 Thickness.For example, more than 0.1 μm of the thickness on the 2nd weir 12, preferably more than 0.2 μm, and be, for example, less than 2 μm, preferably 1 μm Below.

As shown in Figure 3 D, on the 2nd weir 12, it is formed with when overlooking and opens with the 2nd of the shape same shape of luminescent coating 3 Oral area 14.

As shown in FIGURE 3 E, on support plate 7, by the 2nd in the way of luminescent coating 3 is inserted in the 2nd peristome 14 Weir 12 is positioned on the upper surface of support plate 7.Thus, luminescent coating 3 is embedded in the 2nd peristome 14.

Afterwards, as shown in Figure 4 A, drip on the upper surface of the luminescent coating 3 in the 2nd peristome 14 (pouring) transparent tree The varnish of oil/fat composition.Specifically, drip varnish into the 2nd peristome 14 and make the liquid level of varnish and the upper table on the 2nd weir 12 Face becomes a face.

Afterwards, in the case that transparent resin composition contains and can become the compositions of thermosetting resin of B-stage state, Make transparent resin composition heat cure (specifically, C-stage).Thus, clear layer is formed on the upper surface of luminescent coating 3 4.

When transparent resin composition to be made realizes C-stage, if the phosphor resin compositionss of luminescent coating 3 are two ranks The B-stage state of Duan Fanying hardening resin composition, then make phosphor resin compositionss realize C-stage.

Afterwards, as shown in Figure 4 B, along interface and the 2nd weir 12 between of both luminescent coating 3 and clear layer 4 by fluorescence Body layer 3, clear layer 4 and the 2nd weir 12 cut off.

Thus, obtain quilt being supported by the state of plate 7 supports, including 1 LED2, luminescent coating 3 and clear layer 4 The LED1 of luminescent coating sealing.

Next, as shown in the arrow of Fig. 4 B, imaginary line and Fig. 4 C, by the LED1 being sealed by luminescent coating self-supporting plate 7 Peel off.

Afterwards, the LED1 being sealed by luminescent coating is selected according to emission wavelength, luminous efficiency.

Afterwards, as shown in Figure 4 D, the LED1 being sealed by luminescent coating is installed on substrate 50.

And, the method using Fig. 3 A～Fig. 4 D, due to need not as the 1st embodiment on stripping film 6 temporarily Manufacture diaphragm seal 5 (with reference to Fig. 2A), therefore, it is possible to by the varnish of phosphor resin compositionss and the varnish of transparent resin composition Simply sequentially form luminescent coating 3 and clear layer 4.

2nd embodiment

In the 2nd embodiment, for described 1st embodiment identical component and operation, mark identical accompanying drawing Labelling and omit detail explanation.

The LED being sealed by luminescent coating

In the 1st embodiment, as shown in figure 1, making the side 33 of luminescent coating 3 expose.But, in the 2nd embodiment In, as shown in fig. 6, the side 33 of luminescent coating 3 is covered by clear layer 4.

That is, clear layer 4 covers upper surface 31 and the side 33 of luminescent coating 3.In addition, clear layer 4 is formed as The shape of luminescent coating 3 is comprised during vertical view.Clear layer 4 has the sidepiece 45 of the side 33 covering luminescent coating 3.In addition, it is transparent The lower surface 41 of the sidepiece 45 of layer 4 is that the transparent side that can contact with substrate 50 (imaginary line) can contact face.

And, because clear layer 4 has sidepiece 45, the therefore side 43 (transparent side link surface) of clear layer 4 and fluorophor The side 33 of layer 3 is arranged opposite at the outside of the side 33 of luminescent coating 3 separated by a distance β.

The distance beta that the side 43 of clear layer 4 is separated with the side 33 of luminescent coating 3 is the left and right of the sidepiece 45 of clear layer 4 Direction length and fore-and-aft direction length (minimum length).

Suitable chosen distance β in the range of more than 0.

(3) in the 2nd embodiment it is preferred that in (1)～(4) of replacement the 1st embodiment, and meet following (3)’.

(3) ' distance alpha and distance beta and (alpha+beta) be, for example, more than 50 μm, preferably greater than 50 μm, more preferably 100 μm with On, and be, for example, less than 2000 μm, preferably less than 1000 μm.If alpha+beta is more than described lower limit, it is prevented from color equal The reduction of even property or irregular colour can be suppressed even.If alpha+beta is below the described upper limit, meaningless the making of material can be suppressed With.

Additionally, in the 1st embodiment, β is 0.Therefore, in this utility model, β is preferably more than 0.

The manufacture method of the LED being sealed by luminescent coating

Next, reference picture 7A～Fig. 8 F explanation manufactures the method for the LED being sealed by luminescent coating shown in Fig. 6 and use The method that the LED being sealed by luminescent coating to manufacture LED matrix.

The manufacture method of the LED1 being sealed by luminescent coating includes：Manufacture the fluorescence diaphragm seal 15 including luminescent coating 3 Operation (example of luminescent coating preparatory process, reference picture 7A), fluorescence diaphragm seal 15 is covered with luminescent coating 3 multiple Operation (example of luminescent coating arrangement step, reference picture 7B) that the mode of LED2 is configured, remove in luminescent coating 3 The operation (example of singualtion/removing step, reference picture 7D) of the part away from LED2, manufacture include clear layer 4 The operation (example of clear layer preparatory process, reference picture 8A) of slide 18, the LED1 being sealed by luminescent coating is joined again The operation (reference picture 8A) that is placed in the 2nd support plate 17, the operation configuring on luminescent coating 3 by slide 18 (join by clear layer Put an example of operation, reference picture 8B).

In the method, first, as shown in Figure 7 A, multiple LED are prepared.

Separately prepare to include the fluorescence diaphragm seal 15 of luminescent coating 3.

In order to prepare fluorescence diaphragm seal 15, first, as shown in Figure 7 A, prepare stripping film 6.

Then, the lower surface in stripping film 6 forms luminescent coating 3 with lamellar.The forming method of luminescent coating 3 is real with the 1st The forming method applying luminescent coating 3 in mode is identical.

Thus, the fluorescence diaphragm seal having prepared inclusion stripping film 6 and being formed at the luminescent coating 3 of lower surface of stripping film 6 15.

Additionally, fluorescence diaphragm seal 15 does not have the clear layer 4 (reference picture 8A) being discussed below.Preferably, fluorescence sealing Piece 15 is made up of stripping film 6 and luminescent coating 3.

Then, as shown in Figure 7 B, multiple LED2 are sealed using luminescent coating 3.That is, by fluorescence diaphragm seal 15 phase Support plate 7 for supporting LED2 crimps.Thus, the lower surface 32 in fluorescence diaphragm seal 15 is made to bury multiple LED2 shape Become the shape corresponding with the surface of multiple LED2.On the other hand, upper surface 31 shape of the luminescent coating 3 in fluorescence diaphragm seal 15 Become flat condition.Additionally, luminescent coating 3 covers side 23 and the upper surface 22 of LED2.

Afterwards, in the method, as seen in figure 7 c, stripping film 6 autofluorescence body layer 3 is peeled.

Then, in the method, as illustrated in fig. 7d, remove the part away from LED2 in luminescent coating 3.

Specifically, using 9 pairs of luminescent coatings 3 of discoid cast-cutting saw (cutting blade) with Rack (wall thickness) In the part away from LED2 cut.Thus, in luminescent coating 3, the length alpha of sidepiece 35 is reconciled as desired size. That is, luminescent coating 3 is carried out by sharp processing and makes luminescent coating 3 become the size of regulation.

Meanwhile, make the LED1 singualtion being sealed by luminescent coating.That is, by fluorescence diaphragm seal 15 so that by fluorophor The mode of the LED1 singualtion of layer sealing is cut off.Now, retain the part of the side 2 of covering LED2 of luminescent coating 3.

Then, as seen in figure 7e, afterwards, the LED1 being sealed by luminescent coating after singualtion self-supporting plate 7 is peeled.

Thus, obtain the LED1 being sealed by luminescent coating including LED2 with the luminescent coating 3 of size with regulation.? In 2nd embodiment, such as the imaginary line of Fig. 7 E and the shown in solid LED1 being sealed by luminescent coating of Fig. 7 F do not include Bright layer 4.That is, this LED1 being sealed by luminescent coating is preferably made up of LED2 and luminescent coating 3.

In the method, then, as shown in Figure 8 A, by multiple LED1 being sealed by luminescent coating with left and right directions and front In rear direction, the mode at separated from each other interval is arranged in the 2nd support plate 17.That is, with respect to the 2nd support plate 17 again Configure the LED1 being sealed by luminescent coating.

2nd support plate 17 has and described support plate 7 identical structure.

As shown in Figure 8 A, separately prepare to include the slide 18 of clear layer 4.

In order to prepare slide 18, first, as shown in Figure 8 A, the lower surface in the 2nd stripping film 19 formed with lamellar transparent Layer 4.2nd stripping film 19 has and described stripping film 6 identical structure.In the forming method of clear layer 4 and the 1st embodiment The forming method of luminescent coating 3 is identical.2nd transparent composition preferably comprises filler.

Thus, prepare inclusion the 2nd stripping film 19 and be formed at the transparent of the clear layer 4 of lower surface of the 2nd stripping film 19 Piece 18.

Additionally, slide 18 does not have described luminescent coating 3.Preferably, slide 18 is by the 2nd stripping film 19 and transparent Layer 4 composition.

Then, in the method, as shown in Figure 8 B, multiple luminescent coatings 3, the plurality of fluorescence are covered using clear layer 4 Body layer 3 covers multiple LED2.

Specifically, the 2nd support plate 17 of the LED1 the 2nd stripping film 19 being sealed by luminescent coating with respect to supporting is carried out Crimping.

Additionally, contain the phenyl system organosilicon resin composition of B-stage (semi-solid preparation) state in transparent resin composition In the case of, it is thermally compressed.Thus, the phenyl system organosilicon resin composition making B-stage temporarily plastifies in the presence of heating, Thus transparent resin composition is filled between multiple luminescent coatings 3.Afterwards, transparent resin composition is made to be fully cured.

Then, as shown in Figure 8 C, the 2nd stripping film 19 self-induced transparency layer 4 is peeled.

Thus, as shown in Figure 8 C, obtain and be supported in the state of the 2nd support plate 17, sealing LED aggregation 8, this sealing LED aggregation 8 is to be sealed with multiple LED2 using the luminescent coating 3 being laminated with clear layer 4.

Then, as in fig. 8d, in the way of monolithic turns to multiple LED2, sealing LED aggregation 8 is cut off.

Then, as shown in the arrow of Fig. 8 D and Fig. 8 E, multiple LED1 self-supporting plates 7 being sealed by luminescent coating are peeled, Thus obtaining the LED1 being sealed by luminescent coating.

Afterwards, as shown in Figure 8 F, the LED1 being sealed by luminescent coating is installed on substrate 50, thus obtaining LED matrix 60. Specifically, as the imaginary line with reference to Fig. 6, the lower surface 41 of the sidepiece 45 of clear layer 4 is made to contact with substrate 50.

The action effect of the 2nd embodiment

And, in the LED1 that this is sealed by luminescent coating, as shown in fig. 6, because clear layer 4 has to luminescent coating 3 The sidepiece 45 that covered of side 33, therefore, in a same manner as in the first embodiment, transparent resin composition (clear layer can be made 4) interface and air between away from (leaving) as the substrate 50 of absorber of light, the LED2 (boundary between LED2 and luminescent coating 3 Face).Therefore, from LED2 towards upside light and by luminescent coating 3 wavelength convert after light and do not turned by luminescent coating 3 wavelength Pass through the light of luminescent coating 3 interface and air between is reflected in transparent resin composition (clear layer 4) even if changing It is difficult to return to substrate 50, LED2 (absorber of light) it is thus possible to improve the luminous intensity of the LED1 being sealed by luminescent coating.

On the other hand, in the 2nd embodiment, as shown in Figure 8 A, afterwards, by be configured with luminescent coating 3 by fluorescence The LED1 of body layer sealing is reconfigured in the supporting station different from support plate 7, i.e. the 2nd support plate 17, then, as shown in Figure 8 B, profit Cover luminescent coating 3 with clear layer 4.

On the other hand, in the method for the 1st embodiment, as described above, different from the 2nd embodiment it is not necessary to will configure The LED2 having luminescent coating 3 is reconfigured in the 2nd support plate 17.Therefore, it is possible to be manufactured by luminescent coating using simple method The LED1 of sealing.

In addition, can by luminescent coating 3 in the LED1 being sealed by luminescent coating for the simple method such as cut-out and thoroughly Side 33 and side 43 are formed respectively on bright layer 4.

As shown in Figure 7 A, the manufacture method of the LED1 being sealed by luminescent coating due to this includes the fluorescence preparing to include lamellar The luminescent coating preparatory process of the fluorescence diaphragm seal 15 of the body layer 3 and luminescent coating 3 of lamellar is carried out in the way of covering LED2 The luminescent coating arrangement step of configuration is excellent therefore, it is possible to simply to manufacture luminous intensity using the luminescent coating 3 of lamellar The LED1 being sealed by luminescent coating.

In addition, the manufacture method of the LED1 being sealed by luminescent coating using this, as illustrated in fig. 7d, in singualtion/removal work In sequence, after luminescent coating arrangement step, before clear layer arrangement step, luminescent coating 3 is being entered corresponding to multiple LED2 While row singualtion, remove the part away from LED2 in luminescent coating 3, therefore, it is possible to manufacture using less man-hour There is the LED1 being sealed by luminescent coating of desired size.

And, the manufacture method of the LED1 being sealed by luminescent coating using this, as illustrated in fig. 7d, in singualtion/removal work In sequence, make the partly remaining of the side 23 of covering LED2 of luminescent coating 3, can simply manufacture glimmering including desired size The LED1 being sealed by luminescent coating of body of light layer 3.

In addition, the manufacture method of the LED1 being sealed by luminescent coating using this, as shown in Figure 8 A, due to saturating using lamellar Bright layer 4, the LED1 that by luminescent coating sealed excellent therefore, it is possible to simply manufacture luminous intensity.

Variation

In the 2nd embodiment, as shown in fig. 6, making the lower surface 32 of the surrounding of receiving portion 30 of luminescent coating 3 and transparent The fluorescence side that the lower surface 41 of the sidepiece 45 of layer 4 is respectively structured as can contacting with substrate 50 can contact face and transparent side can Contact surface.But, for example, as shown in figure 9, lower surface 32 and the clear layer 4 of the surrounding of receiving portion 30 of luminescent coating 3 can be made Sidepiece 45 this two surfaces of lower surface 41 be configured to substrate 50 interval can ensure that septal surface.

As shown in figure 9, the following table of the sidepiece 45 of the lower surface 32 of the surrounding of receiving portion 30 of luminescent coating 3 and clear layer 4 Face 41 is positioned at the upper part of the ratio lower surface 21 of LED2.Specifically, when projecting in the surface direction, the appearance of luminescent coating 3 The lower surface 41 of sidepiece 45 of the lower surface 32 of surrounding in portion 30 and clear layer 4 received is located at lower surface 21 and the upper surface 22 of LED2 Between.That is, when fore-and-aft direction and left and right directions projecting, the lower surface 32 of the surrounding of receiving portion 30 of luminescent coating 3 and thoroughly The lower surface 41 of the sidepiece 45 of bright layer 4 configures the position in the side 23 being comprised in LED2.

In addition, in the 2nd embodiment, as shown in Figure 7 B, making the upper surface 31 of the luminescent coating 3 in fluorescence diaphragm seal 15 Be formed as flat condition but it is also possible to be for example, as shown in Figure 10 B, so that the upper surface 31 of luminescent coating 3 is formed as and multiple LED2 The corresponding concaveconvex shape in surface.

Such variation possesses operation (the luminescent coating beam worker manufacturing the fluorescence diaphragm seal 15 including luminescent coating 3 One example of sequence, reference picture 10A), fluorescence diaphragm seal 15 is configured in the way of luminescent coating 3 covers multiple LED2 The part away from LED2 in operation (example of luminescent coating arrangement step, reference picture 10B), removal luminescent coating 3 Operation (example of removing step, reference picture 10D), manufacture include operation (the clear layer preparation of the slide 18 of clear layer 4 One example of operation, reference picture 8A), the LED1 being sealed by luminescent coating is reconfigured in the operation (reference of the 2nd support plate 17 Fig. 8 A) and slide 18 is configured the operation (reference picture 8B) on luminescent coating 3.

In the method, first, as shown in Figure 10 A, multiple LED are prepared.

Separately prepare to include the fluorescence diaphragm seal 15 of luminescent coating 3.When preparing fluorescence diaphragm seal 15, first, such as Figure 10 A Shown, prepare stripping film 6.

Then, the lower surface in stripping film 6 forms luminescent coating 3.Thus, prepare inclusion stripping film 6 and be formed at stripping Fluorescence diaphragm seal 15 from the luminescent coating 3 of the lower surface of piece 6.

Then, as shown in Figure 10 B, multiple LED2 are sealed using luminescent coating 3.That is, by fluorescence diaphragm seal 15 Support plate 7 with respect to supporting LED2 is crimped.Now, using pressue device, fluorescence diaphragm seal 15 with respect to LED2 and is propped up Board 7 is crimped, and this pressue device includes：Upper mould, it is configured at the upside of stripping film 6 and has corresponding with multiple LED2 Recess；Lower mould, it is tabular.Luminescent coating 3 is made to have using described pressue device corresponding with multiple LED2 multiple Protuberance.Stripping film 6 covers on the surface (side on the surface comprising teat) of luminescent coating 3.

Afterwards, in the method, as illustrated in figure 10 c, stripping film 6 autofluorescence body layer 3 is peeled.

Then, in the method, as shown in Figure 10 D, luminescent coating 3 is cut off, then, as shown in figure 10e, monolithic turns to The LED1 being sealed by luminescent coating.Afterwards, the LED1 being sealed by luminescent coating after singualtion self-supporting plate 7 is peeled.

That is, as shown in Figure 10 D, luminescent coating 3 is carried out by sharp processing and becomes the size of regulation.By This, remove the part away from LED2 in luminescent coating 3.

Thus, as shown in figure 10e, obtain and include LED2 with the luminescent coating 3 of size with regulation by luminescent coating The LED1 of sealing.In the 2nd embodiment, the shown in solid of the imaginary line of Figure 10 D and Figure 10 is sealed by luminescent coating LED1 does not include clear layer 4.That is, this LED1 being sealed by luminescent coating is preferably made up of LED2 and luminescent coating 3.

Afterwards, in the same manner as the 2nd embodiment (reference picture 8A～Fig. 8 F), clear layer 4 is laminated in luminescent coating 3.

Specifically, as shown in Figure 8 A, first, by multiple LED1 being sealed by luminescent coating in fore-and-aft direction and right and left It is arranged in the 2nd support plate 17 to separated from each other compartment of terrain.As shown in Figure 8 A, separately prepare to include the slide of clear layer 4 18.

Then, as shown in Figure 8 B, multiple luminescent coatings 3 are covered using clear layer 4, the plurality of luminescent coating 3 covers many Individual LED2.Specifically, using including the flat board pressue device of lower mould and lower mould by clear layer 4 with respect to luminescent coating 3 and the 2nd Support plate 17 is crimped.

Then, as shown in Figure 8 C, the 2nd stripping film 19 self-induced transparency layer 4 is peeled.Then, as in fig. 8d, so that multiple Sealing LED aggregation 8 is cut off by the mode of LED2 singualtion.Then, as shown in the arrow of Fig. 8 D and Fig. 8 E, by multiple by fluorescence The LED1 self-supporting plate 7 of body layer sealing peels, thus obtaining the LED1 being sealed by luminescent coating.Afterwards, as shown in Figure 8 F, will be by The LED1 of luminescent coating sealing is installed on substrate 50, thus obtaining LED matrix 60.

In addition, in the 2nd embodiment, as shown in Figure 8 A, first, preparing to include the slide 18 of clear layer 4, afterwards, Cover multiple luminescent coatings 3 using the clear layer 4 of lamellar, the plurality of luminescent coating 3 covers multiple LED2 but it is also possible to be example As, as reference picture 8C, can be by for example watering, transmitting shaping, compression molding etc. by transparent resin composition (by transparent The varnish of resin combination preparation, powder, tabletting etc.) directly on the 2nd support plate 17 by clear layer 4 to cover the side of LED2 Formula is configured to lamellar.

3rd embodiment

In the 3rd embodiment, for described 1st embodiment identical component and operation, mark identical accompanying drawing Labelling and omit detail explanation.

The LED being sealed by luminescent coating

As shown in figure 11, luminescent coating 3 has flange part 36 in its peripheral end portion.

Flange part 36 is side 23 part of the covering LED2 of autofluorescence body layer 3 to face direction protuberance protruding outside. The upper surface of the flange part 36 of luminescent coating 3 is located at the part of the upper surface 22 than the covering LED2 in luminescent coating 3 to downside Decline one layer of position, therefore, between the upper surface and the upper surface 31 of described part of flange part 36, be formed with step.Flange The side 43 of the outer peripheral face 37 self-induced transparency layer 4 in portion 36 exposes laterally.The outer peripheral face 37 of flange part 36 and the side 43 of clear layer 4 Be formed as a face in the vertical direction.

The upper surface 39 of flange part 36 is contacted with the lower surface 41 of the sidepiece 45 of clear layer 4.

The manufacture method of the LED being sealed by luminescent coating and the manufacture method of LED matrix

Next, reference picture 12A～Figure 13 E explanation manufacture the method for the LED being sealed by luminescent coating shown in Figure 11 and The method manufacturing LED matrix using the LED being sealed by luminescent coating.

The manufacture method of this LED1 being sealed by luminescent coating includes manufacturing the operation (reference picture of fluorescence diaphragm seal 15 12A), the operation (reference picture 12B) that fluorescence diaphragm seal 15 configured in the way of luminescent coating 3 covers multiple LED2, The partly upper operation (reference picture 12C) forming recess 24 between adjacent LED2 of luminescent coating 3, manufacture include transparent The operation (reference picture 12D) of slide 18 of layer 4, slide 18 is configured operation (reference picture on luminescent coating 3 Make will in luminescent coating 3 and clear layer 4 LED1 that by luminescent coating sealed mono- 13A) and away from the partial cut of LED2 The operation (reference picture 13B) of piece.

As shown in the arrow of Figure 12 B, after fluorescence diaphragm seal 15 is configured with respect to support plate 7, stripping film 6 is shelled From.

The upper surface of luminescent coating 3 has flat surface.

As indicated in fig. 12 c, in order to recess 24 is formed on luminescent coating 3, remove the portion away from LED2 in luminescent coating 3 Point.

Specifically, using cast-cutting saw 9, hemisect is carried out to the upper end of the part away from LED2 in luminescent coating 3.

By forming recess 24, flange part 36 is formed on luminescent coating 3.

Afterwards, as shown in FIG. 13A, the clear layer 4 of slide 18 is configured on luminescent coating 3.Excellent from obtaining From the viewpoint of gas permeation rate, clear layer 4 is preferably made up of transparent resin composition, and this transparent resin composition is by methyl system Organosilicon resin composition is constituted.

Then, as shown in Figure 13 B, by the partial cut away from LED2 in luminescent coating 3 and clear layer 4.

Thus, as shown in fig. 13 c, obtain in the state of being supported by the 2nd support plate 17 multiple is sealed by luminescent coating LED1.

Afterwards, as illustrated in figure 13d, multiple LED1 being sealed by luminescent coating are transferred on transfer sheet 25.

Afterwards, as shown in figure 13e, the LED1 being sealed by luminescent coating is transferred on substrate 50 from transfer sheet 25 again, and The LED1 being sealed by luminescent coating is installed on substrate 50.Thus, obtain LED matrix 60.

The action effect of the 3rd embodiment

In the LED1 that this is sealed by luminescent coating, as shown in figure 11, the inner peripheral surface 38 of receiving portion 30 covers the side of LED2 The outer peripheral face 37 of the flange part 36 of face 23 and luminescent coating 3 exposes in side.Therefore, for sending from LED2 towards side Light, by the flange part 36 fully wavelength convert of luminescent coating 3, and for the light sending upward from LED2, can by by The light of luminescent coating 3 wavelength convert and light that is not wavelength-converted and passing through luminescent coating 3 moderately mix in clear layer 4 Close.As a result, the luminous intensity distribution (suppression irregular colour is even) of the LED1 making to be sealed by luminescent coating is excellent.

In addition, the pressure-sensitive adhesive power (bonding force) of the methyl system organosilicon resin composition containing in clear layer 4 is higher than The pressure-sensitive adhesive power (bonding force) of phenyl system organosilicon resin composition.Therefore, shown in Fig. 7 A～Fig. 8 E of the 2nd embodiment Method in, if in the operation of Fig. 8 B utilize described clear layer 4 by the 2nd support plate 17 upper surface expose multiple LED2 Cover, then can by clear layer 4 with higher pressure-sensitive adhesive power (bonding force) pressure-sensitive adhesive (bonding) in the upper table of the 2nd support plate 17 Face.Therefore, afterwards, exist can not be transferred to well on transfer sheet 25 (reference picture 13C and Figure 13 D) situation (that is, The situation that clear layer 4 is not peeled off from the upper surface of the 2nd support plate 17).

But, in Figure 12 A～method shown in Figure 13 E of the 3rd embodiment, it is not in contact with due to clear layer 4 (pressure-sensitive viscous Connect) in the upper surface of support plate 7, therefore, it is possible to prevent clear layer 4 pressure-sensitive adhesive (bonding) in support plate 7.

And, the method need not include LED1 shown in Fig. 8 A, will being sealed by luminescent coating as the 2nd embodiment It is reconfigured in the operation of the 2nd support plate 17.Therefore, it is possible to reduce manufacturing man-hours such that it is able to reduce manufacturing cost.

Variation

In the variation of the manufacture method of the LED1 being sealed by luminescent coating, except not including shown in Fig. 7 D, removal Shown in the operation of the part away from LED2 in luminescent coating 3 and Fig. 8 A, by the LED1 being sealed by luminescent coating be reconfigured in Beyond the operation of the 2nd support plate 17, identical with the manufacture method of the 2nd embodiment.

In addition, this variation is in addition to the operation (reference picture 12C) not including the recess 24 forming the 3rd embodiment, Identical with the manufacture method of the 3rd embodiment.

I.e., in the method, first, as shown in Figure 14 A, multiple LED2 are prepared on support plate 7.Meanwhile, accurate The standby fluorescence diaphragm seal 15 including stripping film 6 and luminescent coating 3.

Then, as shown in Figure 14B, multiple LED2 are sealed using the luminescent coating 3 of fluorescence diaphragm seal 15.Specifically, Using the flat board pressue device including lower mould and lower mould, luminescent coating 3 is crimped with respect to multiple LED2 and support plate 7.

Thus, recess 24 is formed on luminescent coating 3.Therefore, luminescent coating 3 is made to be formed with flange part 36.

Then, as shown in Figure 14 C, stripping film 6 autofluorescence body layer 3 is peeled.

Then, as shown in fig. 14d, prepared to include the slide 18 of clear layer 4 and the 2nd stripping film 19.

Then, as shown in fig. 15, the clear layer 4 of slide 18 is configured at the upper surface of luminescent coating 3, then, by 2 stripping film 19 self-induced transparency layer 4 peels.Thus, obtain sealing LED aggregation 8.

Afterwards, as shown in fig. 15b, sealing LED aggregation 8 is cut off and so that its monolithic is turned to and sealed by luminescent coating LED1.

Thus, as shown in figure 15 c, obtain the LED1 being sealed by luminescent coating.

Afterwards, after the LED1 being sealed by luminescent coating is selected, as shown in figure 15d, will be singled out is glimmering The LED1 of body of light layer sealing is installed on substrate 50, thus obtaining LED matrix 60.

And, in this variation, can play and described 3rd embodiment identical action effect.

In addition, in the method shown in Figure 14 A～Figure 15 C, with the LED1 being sealed by luminescent coating in the 2nd embodiment Manufacture method compare it is not necessary to include shown in Fig. 7 D, remove luminescent coating 3 in the operation of the part away from LED2 and Fig. 8 A Shown, the LED1 being sealed by luminescent coating is reconfigured in the operation of the 2nd support plate 17.Therefore, it is possible to reduce manufacturing man-hours, So as to reduce manufacturing cost.

Embodiment

Compounding ratio (content ratio), physical property values, parameter etc. used in following record are specifically Numerical value belongs to instead of described in described " specific embodiment ", compounding ratio (content ratio) corresponding thereto, physics Property value, parameter etc. described in higher limit (with " below ", " less than " formal definition numerical value) or lower limit (with " more than ", " super Cross " formal definition numerical value).

Polysiloxanes containing thiazolinyl and the synthesis of containing hydrogenated silicyl polysiloxanes

Synthesis example 1

By 1,3- divinyl -1,1,3,3- tetramethyl disiloxane 93.2g, water 140g, trifluoromethanesulfonic acid 0.38g and Toluene 500g puts in the four-hole boiling flask being equipped with blender, condensing reflux pipe, input port and thermometer and is mixed, Stir while mixed through 1 hour Deca aminomethyl phenyl dimethoxysilane 729.2g and phenyltrimethoxysila,e 330.5g In compound four-hole boiling flask, afterwards, carried out 1 hour being heated to reflux.Afterwards, cooled down and lower floor's (water layer) separated and removes, Upper strata (toluene solution) has been carried out with 3 washings.Add potassium hydroxide 0.40g to the toluene solution after washing, and by water Remove while being flowed back from water separating pipe.After the removal completing water, flow back further 5 hours, then carried out cold But.Afterwards, put into acetic acid 0.6g to be neutralized, afterwards, 3 washings have been carried out to toluene solution obtained from filtering.Afterwards, lead to Cross concentrating under reduced pressure and obtain the liquid A of polysiloxanes containing thiazolinyl.The averaged unit formula of the A of polysiloxanes containing thiazolinyl and average group An accepted way of doing sth is as follows.

Averaged unit formula：

((CH₂=CH) (CH₃)₂SiO_1/2)_0.15(CH₃C₆H₅SiO_2/2)_0.60(C₆H₅SiO_3/2)_0.25

Average composition formula：

(CH₂=CH)_0.15(CH₃)_0.90(C₆H₅)_0.85SiO_1.05

That is, the A of polysiloxanes containing thiazolinyl is shown as R¹For vinyl, R²For methyl and phenyl, a=0.15, b= 1.75 above-mentioned average composition formula (1).

In addition, being carried out to the polystyrene conversion weight average molecular weight of the A of polysiloxanes containing thiazolinyl by gel permeation chromatography Measure, result this weight average molecular weight is 2300.

Synthesis example 2

By 1,3- divinyl -1,1,3,3- tetramethyl disiloxane 93.2g, water 140g, trifluoromethanesulfonic acid 0.38g and Toluene 500g puts in the four-hole boiling flask being equipped with blender, condensing reflux pipe, input port and thermometer and is mixed, Stir the mixing while through 1 hour Deca dimethoxydiphenylsilane 173.4g and phenyltrimethoxysila,e 300.6g Thing, after end of dripping, has carried out 1 hour being heated to reflux.Afterwards, cooled down to separate lower floor's (water layer) and removed, to upper strata (toluene solution) has carried out 3 washings.Add potassium hydroxide 0.40g to the toluene solution after washing, water is separated from water Pipe removes while being flowed back.After the removal completing water, flow back further 5 hours, then cooled down.Put into Acetic acid 0.6g is neutralized, and afterwards, filtration has been obtained with toluene solution and has carried out 3 washings.Afterwards, by concentrating under reduced pressure Obtain the liquid B of polysiloxanes containing thiazolinyl.The averaged unit formula of the B of polysiloxanes containing thiazolinyl and average composition formula are as follows.

Averaged unit formula：

(CH₂=CH (CH₃)₂SiO_1/2)_0.31((C₆H₅)₂SiO_2/2)_0.22(C₆H₅SiO_3/2)_0.47

Average composition formula：

(CH₂=CH)_0.31(CH₃)_0.62(C₆H₅)_0.91SiO_1.08

That is, the B of polysiloxanes containing thiazolinyl is shown as R¹For vinyl, R²For methyl and phenyl, a=0.31, b= 1.53 above-mentioned average composition formula (1).

In addition, being carried out to the polystyrene conversion weight average molecular weight of the B of polysiloxanes containing thiazolinyl by gel permeation chromatography Measure, result this weight average molecular weight is 1000.

Synthesis example 3

By dimethoxydiphenylsilane 325.9g, phenyltrimethoxysila,e 564.9g and trifluoromethanesulfonic acid 2.36g Put in the four-hole boiling flask be equipped with blender, condensing reflux pipe, input port and thermometer and mixed, add 1,1, 3,3- tetramethyl disiloxane 134.3g, stir through 30 minutes Deca acetic acid 432g.After completion of dropwise addition, right Mixture is stirred being allowed to react 3 hours while being warming up to 50 DEG C.After cooling to room temperature, toluene and water are added, well Ground is mixed and is stood, and then separates lower floor's (water layer) and removes.Afterwards, 3 water have been carried out to upper strata (toluene solution) Wash, afterwards, obtained containing hydrogenated silicyl polysiloxanes C (cross-linking agent C) by concentrating under reduced pressure.

The averaged unit formula of containing hydrogenated silane based polysiloxane C and average composition formula are as follows.

Averaged unit formula：

(H(CH₃)₂SiO_1/2)_0.33((C₆H₅)₂SiO_2/2)_0.22(C₆H₅PhSiO_3/2)_0.45

Average composition formula：

H_0.33(CH₃)_0.66(C₆H₅)_0.89SiO_1.06

That is, containing hydrogenated silicyl polysiloxanes C is shown as R³For methyl and phenyl, c=0.33, d=1.55 Above-mentioned average composition formula (2).

In addition, being divided to the polystyrene conversion weight average of containing hydrogenated silicyl polysiloxanes C using gel permeation chromatography Son amount is determined, and this weight average molecular weight of result is 1000.

Other raw materials

Below, the raw material in detail beyond narration polysiloxanes containing thiazolinyl and containing hydrogenated silicyl polysiloxanes.

LR7665：It is trade name and is methyl system organosilicon resin composition, refractive index is 1.41, Asahi Chemical Industry's Brunswick silicon Company manufactures

Inorganic filler A：It is that refractive index is 1.55 and composition and composition ratio (quality %) are SiO₂/Al₂O₃/CaO/ The inorganic filler of MgO=60/20/15/5, mean diameter (have adjusted mean diameter using classification for 15 μm.)

Tospear TS2000B：It is silicon-type resin particle, and mean diameter is 6.0 μm, and Japan steps figure performance materials (Japanese：モ メ Application テ ィ Block パ Off ォ マ Application ス マ テ リ ア Le ズ ジ ャ パ Application) company's manufacture

The preparation of organosilicon resin composition

Preparation example 1

Thiazolinyl polysiloxanes A (synthesis example 1) 20g, the B of polysiloxanes containing thiazolinyl (synthesis example 2) 25g, containing hydrogenated first silicon will be contained Alkyl polysiloxane C (synthesis example 3, cross-linking agent C) 25g and platinum carbonyl complex 5mg mixes and is prepared for organic siliconresin group Compound A.

Preparation example 2

As organosilicon resin composition B (condensation additive reaction curing type silicone resin combination), prepare day The composition for silicone resin of the embodiment 1 described in this JP 2010-265436 publication.

Manufacture the LED being sealed by luminescent coating

Embodiment 1

It is mixed with inorganic filler A so that inorganic filler A is with respect to organic siliconresin group in organosilicon resin composition A The total amount of compound A and inorganic filler A reaches 50 mass %, is prepared for transparent resin composition X as varnish.Transparent resin group Refractive index RIt of compound X is 1.56.

Be mixed with YAG468 (fluorophor, Gen Yuan special chemical company manufacture) in transparent resin composition X so that The total amount with respect to transparent resin composition X and YAG468 for the YAG468 reaches 20 mass %, and they are mixed, and thus makes For phosphor resin compositionss.

Afterwards, using applicator, transparent resin composition X is coated in the way of the thickness after its heating reaches 650 μm Stripping film (PTE piece, trade name " SS4C ", the new plumage (Japanese that 50 μm of thickness：ニ ッ パ) company manufacture) surface on, afterwards with 90 DEG C carry out heating in 20 minutes, have thus made the clear layer of B-stage.

Then, using applicator, phosphor resin compositionss are applied in the way of the thickness after its heating reaches 350 μm On the surface (upper surface) of clear layer, carry out heating in 11 minutes with 80 DEG C afterwards, thus made the luminescent coating of B-stage.

Thus, made the diaphragm seal (with reference to Fig. 2A) being made up of stripping film, clear layer, luminescent coating.

Afterwards, paste two-sided band (pressure-sensitive adhesive layer) on corrosion resistant plate, and on this two-sided band, with 1.44mm Spacing be configured with multiple LED (EDI-FA4545A, size：1.14mm × 1.14mm × 150 μm, wafer photoelectricity (Japanese：エピ ス タ) company's manufacture) (reference picture 2B).Afterwards, using the evacuated flat panel pressue device being heated to 90 DEG C by diaphragm seal relatively 10 minutes thermo-compression bonding (reference picture 2C) are carried out in multiple LED.Specifically, so that the week of luminescent coating and LED and this LED Diaphragm seal is thermally compressed by the mode that the two-sided band enclosing contacts with respect to multiple LED.Fluorophor is made by this thermo-compression bonding Layer and clear layer temporarily plastify.Thus, multiple LED are sealed using diaphragm seal.

Afterwards, the solidify afterwards of two hours have been carried out with 150 DEG C.Thus, luminescent coating and clear layer is made to achieve C-stage Change.Afterwards, diaphragm seal is cut off and make its singualtion, thus having manufactured inclusion 1 LED, luminescent coating on corrosion resistant plate And the LED (reference picture 2C) being sealed by luminescent coating of clear layer.

Then, stripping film self-induced transparency layer is peeled (imaginary line of reference picture 2C).Then, so that multiple LED singualtion Sealing LED aggregation is cut off (reference picture 2D) by mode.

Afterwards, the LED being sealed by luminescent coating is peeled (arrow of reference picture 2D and Fig. 2 E) from two-sided band.

Thus, obtain the LED (reference picture 2E) being sealed by luminescent coating.

Embodiment 2

It is mixed with inorganic filler A so that inorganic filler A is with respect to organic siliconresin group in organosilicon resin composition A The total amount of compound A and inorganic filler A reaches 50 mass %, is prepared for transparent resin composition X as varnish.Transparent resin group Refractive index RIt of compound X is 1.56.

In addition, being mixed with YAG468 (fluorophor, Gen Yuan special chemical company manufacture) in transparent resin composition X, make Obtain the total amount with respect to transparent resin composition X and YAG468 for the YAG468 and reach 12 mass %, and they are mixed, thus It is prepared for phosphor resin compositionss.

Afterwards, using applicator, transparent resin composition X is coated in the way of the thickness after its heating reaches 500 μm On the surface of stripping film (PTE piece, trade name " SS4C ", Xin Yu company manufacture) that 50 μm of thickness, carry out 20 points with 90 DEG C afterwards Clock heats, and has thus made the clear layer of B-stage.

Using applicator, phosphor resin compositionss are coated in B rank in the way of the thickness after its heating reaches 500 μm On the clear layer of section, carry out heating in 11 minutes with 80 DEG C afterwards, thus made the luminescent coating of B-stage.

Thus, made the diaphragm seal (with reference to Fig. 2A) being made up of stripping film, clear layer and luminescent coating.

Afterwards, paste two-sided band (pressure-sensitive adhesive layer) on corrosion resistant plate, and on this two-sided band, with 1.64mm Spacing be configured with multiple LED (EDI-FA4545A, size：1.14mm × 1.14mm × 150 μm, wafer photoelectricity company manufacture) (reference picture 2B).Afterwards, using the evacuated flat panel pressue device being heated to 90 DEG C, diaphragm seal has been carried out 10 with respect to multiple LED Minute thermo-compression bonding (reference picture 2C).Specifically, so that luminescent coating is contacted with the two-sided band of the surrounding of LED and this LED Mode diaphragm seal is thermally compressed with respect to multiple LED.Luminescent coating and clear layer is made temporarily to mould by this thermo-compression bonding Change.Thus, multiple LED are sealed using diaphragm seal.

Afterwards, the solidify afterwards of two hours have been carried out with 150 DEG C.Thus, luminescent coating and clear layer is made to achieve C-stage Change.Afterwards, diaphragm seal is cut off and make its singualtion, thus having manufactured inclusion 1 LED, luminescent coating on corrosion resistant plate And the LED (reference picture 2C) being sealed by luminescent coating of clear layer.

Then, stripping film self-induced transparency layer is peeled (imaginary line of reference picture 2C).Then, so that multiple LED singualtion Sealing LED aggregation is cut off (reference picture 2D) by mode.

Afterwards, the LED being sealed by luminescent coating is peeled (arrow of reference picture 2D and Fig. 2 E) from two-sided band.

Thus, obtain the LED (reference picture 2E) being sealed by luminescent coating.

Embodiment 3

It is mixed with inorganic filler A so that inorganic filler A is with respect to organic siliconresin group in organosilicon resin composition A The total amount of compound A and inorganic filler A reaches 50 mass %, is prepared for transparent resin composition X as varnish.Transparent resin group Refractive index RIt of compound X is 1.56.

Be compounded with YAG468 (fluorophor, Gen Yuan special chemical company manufacture) in transparent resin composition X so that The total amount with respect to transparent resin composition X and YAG468 for the YAG468 reaches 10 mass %, and they are mixed, and thus makes For phosphor resin compositionss.

Afterwards, using applicator, transparent resin composition X is coated in the way of the thickness after its heating reaches 400 μm On the surface of stripping film (PTE piece, trade name " SS4C ", Xin Yu company manufacture) that 50 μm of thickness, carry out 20 points with 90 DEG C afterwards Clock heats, and has thus made the clear layer of B-stage.

Then, using applicator, phosphor resin compositionss are applied in the way of the thickness after its heating reaches 600 μm On the surface (upper surface) of clear layer, carry out heating in 11 minutes with 80 DEG C afterwards, thus made the luminescent coating of B-stage.

Thus, made the diaphragm seal (with reference to Fig. 2A) being made up of stripping film, clear layer, luminescent coating.

Afterwards, paste two-sided band (pressure-sensitive adhesive layer) on corrosion resistant plate, and on this two-sided band, with 1.84mm Spacing be configured with multiple LED (EDI-FA4545A, size：1.14mm × 1.14mm × 150 μm, wafer photoelectricity company manufacture) (reference picture 2B).Afterwards, using the evacuated flat panel pressue device being heated to 90 DEG C, diaphragm seal has been carried out 10 with respect to multiple LED Minute thermo-compression bonding (reference picture 2C).Specifically, so that luminescent coating is contacted with the two-sided band of the surrounding of LED and this LED Mode diaphragm seal is thermally compressed with respect to multiple LED.Luminescent coating and clear layer is made temporarily to mould by this thermo-compression bonding Change.Thus, multiple LED are sealed using diaphragm seal.

Afterwards, the solidify afterwards of two hours have been carried out with 150 DEG C.Thus, luminescent coating and clear layer is made to achieve C-stage Change.Afterwards, diaphragm seal is cut off and make its singualtion, thus having manufactured inclusion 1 LED, luminescent coating on corrosion resistant plate And the LED (reference picture 2C) being sealed by luminescent coating of clear layer.

Then, stripping film self-induced transparency layer is peeled (imaginary line of reference picture 2C).Then, so that multiple LED singualtion Sealing LED aggregation is cut off (reference picture 2D) by mode.

Afterwards, the LED being sealed by luminescent coating is peeled (arrow of reference picture 2D and Fig. 2 E) from two-sided band.

Thus, obtain the LED (reference picture 2E) being sealed by luminescent coating.

Embodiment 4

It is mixed with inorganic filler A so that inorganic filler A is with respect to organic siliconresin group in organosilicon resin composition A The total amount of compound A and inorganic filler A reaches 50 mass %, is prepared for transparent resin composition X as varnish.Transparent resin group Refractive index RIt of compound X is 1.56.

Be compounded with YAG468 (fluorophor, Gen Yuan special chemical company manufacture) in transparent resin composition X so that The total amount with respect to transparent resin composition X and YAG468 for the YAG468 reaches 10 mass %, and they are mixed, and thus makes For phosphor resin compositionss.

Afterwards, using applicator, transparent resin composition X is coated in the way of the thickness after its heating reaches 900 μm On the surface of stripping film (PTE piece, trade name " SS4C ", Xin Yu company manufacture) that 50 μm of thickness, carry out 20 points with 90 DEG C afterwards Clock heats, and has thus made the clear layer of B-stage.

Then, using applicator, phosphor resin compositionss are applied in the way of the thickness after its heating reaches 600 μm On the surface (upper surface) of clear layer, carry out heating in 11 minutes with 80 DEG C afterwards, thus made the luminescent coating of B-stage.

Thus, made the diaphragm seal (with reference to Fig. 2A) being made up of stripping film, clear layer, luminescent coating.

Afterwards, paste two-sided band (pressure-sensitive adhesive layer) on corrosion resistant plate, and on this two-sided band, with 1.84mm Spacing be configured with multiple LED (EDI-FA4545A, size：1.14mm × 1.14mm × 150 μm, wafer photoelectricity company manufacture) (reference picture 2B).Afterwards, using the evacuated flat panel pressue device being heated to 90 DEG C, diaphragm seal has been carried out 10 with respect to multiple LED Minute thermo-compression bonding (reference picture 2C).Specifically, so that luminescent coating is contacted with the two-sided band of the surrounding of LED and this LED Mode diaphragm seal is thermally compressed with respect to multiple LED.Luminescent coating and clear layer is made temporarily to mould by this thermo-compression bonding Change.Thus, multiple LED are sealed using diaphragm seal.

Afterwards, the solidify afterwards of two hours have been carried out with 150 DEG C.Thus, luminescent coating and clear layer is made to achieve C-stage Change.Afterwards, diaphragm seal is cut off and make its singualtion, thus having manufactured inclusion 1 LED, luminescent coating on corrosion resistant plate And the LED (reference picture 2C) being sealed by luminescent coating of clear layer.

Then, stripping film self-induced transparency layer is peeled (imaginary line of reference picture 2C).Then, so that multiple LED singualtion Sealing LED aggregation is cut off (reference picture 2D) by mode.

Afterwards, the LED being sealed by luminescent coating is peeled (arrow of reference picture 2D and Fig. 2 E) from two-sided band.

Thus, obtain the LED (reference picture 2E) being sealed by luminescent coating.

Embodiment 5

It is mixed with inorganic filler A so that inorganic filler A is with respect to organic siliconresin group in organosilicon resin composition A The total amount of compound A and inorganic filler A reaches 50 mass %, is prepared for transparent resin composition X as varnish.Transparent resin group Refractive index RIt of compound X is 1.56.

In addition, being compounded with YAG468 (fluorophor, Gen Yuan special chemical company manufacture) in transparent resin composition X, make Obtain the total amount with respect to transparent resin composition X and YAG468 for the YAG468 and reach 11 mass %, and they are mixed, thus It is prepared for phosphor resin compositionss.

Afterwards, using applicator, transparent resin composition X is coated in the way of the thickness after its heating reaches 500 μm On the surface of stripping film (PTE piece, trade name " SS4C ", Xin Yu company manufacture) that 50 μm of thickness, carry out 20 points with 90 DEG C afterwards Clock heats, and has thus made the clear layer of B-stage.

Then, using applicator, phosphor resin compositionss are applied in the way of the thickness after its heating reaches 500 μm On the surface (upper surface) of clear layer, carry out heating in 11 minutes with 80 DEG C afterwards, thus made the luminescent coating of B-stage.

Thus, made the diaphragm seal (with reference to Fig. 2A) being made up of stripping film, clear layer, luminescent coating.

Afterwards, paste two-sided band (pressure-sensitive adhesive layer) on corrosion resistant plate, and on this two-sided band, with 1.84mm Spacing be configured with multiple LED (EDI-FA4545A, size：1.14mm × 1.14mm × 150 μm, wafer photoelectricity company manufacture) (reference picture 2B).Afterwards, using the evacuated flat panel pressue device being heated to 90 DEG C, diaphragm seal has been carried out 10 with respect to multiple LED Minute thermo-compression bonding (reference picture 2C).Specifically, so that luminescent coating is contacted with the two-sided band of the surrounding of LED and this LED Mode diaphragm seal is thermally compressed with respect to multiple LED.Luminescent coating and clear layer is made temporarily to mould by this thermo-compression bonding Change.Thus, multiple LED are sealed using diaphragm seal.

Afterwards, the solidify afterwards of two hours have been carried out with 150 DEG C.Thus, luminescent coating and clear layer is made to achieve C-stage Change.Afterwards, diaphragm seal is cut off and make its singualtion, thus having manufactured inclusion 1 LED, luminescent coating on corrosion resistant plate And the LED (reference picture 2C) being sealed by luminescent coating of clear layer.

Then, stripping film self-induced transparency layer is peeled (imaginary line of reference picture 2C).Then, so that multiple LED singualtion Sealing LED aggregation is cut off (reference picture 2D) by mode.

Afterwards, the LED being sealed by luminescent coating is peeled (arrow of reference picture 2D and Fig. 2 E) from two-sided band.

Thus, obtain the LED (reference picture 2E) being sealed by luminescent coating.

Embodiment 6

It is mixed with inorganic filler A so that inorganic filler A is with respect to organic siliconresin group in organosilicon resin composition A The total amount of compound A and inorganic filler A reaches 50 mass %, is prepared for transparent resin composition X as varnish.Transparent resin group Refractive index RIt of compound X is 1.56.

Be compounded with YAG468 (fluorophor, Gen Yuan special chemical company manufacture) in transparent resin composition X so that The total amount with respect to transparent resin composition X and YAG468 for the YAG468 reaches 13 mass %, and they are mixed, and thus makes For phosphor resin compositionss.

Afterwards, using applicator, transparent resin composition X is coated in the way of the thickness after its heating reaches 500 μm On the surface of stripping film (PTE piece, trade name " SS4C ", Xin Yu company manufacture) that 50 μm of thickness, carry out 20 points with 90 DEG C afterwards Clock heats, and has thus made the clear layer of B-stage.

Then, using applicator, phosphor resin compositionss are applied in the way of the thickness after its heating reaches 500 μm On the surface (upper surface) of clear layer, carry out heating in 11 minutes with 80 DEG C afterwards, thus made the luminescent coating of B-stage.

Thus, made the diaphragm seal (with reference to Fig. 2A) being made up of stripping film, clear layer and luminescent coating.

Afterwards, paste two-sided band (pressure-sensitive adhesive layer) on corrosion resistant plate, and on this two-sided band, with 1.44mm Spacing be configured with multiple LED (EDI-FA4545A, size：1.14mm × 1.14mm × 150 μm, wafer photoelectricity company manufacture) (reference picture 2B).Afterwards, using the evacuated flat panel pressue device being heated to 90 DEG C, diaphragm seal has been carried out 10 with respect to multiple LED Minute thermo-compression bonding (reference picture 2C).Specifically, so that luminescent coating is contacted with the two-sided band of the surrounding of LED and this LED Mode diaphragm seal is thermally compressed with respect to multiple LED.Luminescent coating and clear layer is made temporarily to mould by this thermo-compression bonding Change.Thus, multiple LED are sealed using diaphragm seal.

Afterwards, carried out the solidify afterwards (C-stage) of two hours with 150 DEG C, afterwards, diaphragm seal cut-out has been made its monolithic Change, thus having manufactured the LED being sealed by luminescent coating including 1 LED, luminescent coating and clear layer on corrosion resistant plate (reference picture 2C).

Then, stripping film self-induced transparency layer is peeled (imaginary line of reference picture 2C).Then, so that multiple LED singualtion Sealing LED aggregation is cut off (reference picture 2D) by mode.

Afterwards, the LED being sealed by luminescent coating is peeled (arrow of reference picture 2D and Fig. 2 E) from two-sided band.

Thus, obtain the LED (reference picture 2E) being sealed by luminescent coating.

Embodiment 7

It is mixed with TospearTS2000B in organosilicon resin composition B so that TospearTS2000B is with respect to having The total amount of machine silicon resin composition B and TospearTS2000B reaches 30 mass %, is prepared for transparent resin group as varnish Compound Y.

In addition, being compounded with YAG468 (fluorophor, Gen Yuan special chemical company manufacture) in transparent resin composition X, make Obtain the total amount with respect to transparent resin composition X and YAG468 for the YAG468 and reach 18 mass %, and they are mixed, thus It is prepared for phosphor resin compositionss.

Then, using applicator, phosphor resin compositionss are applied in the way of the thickness after its heating reaches 500 μm At 500 μm, glass plate (refractive index RIt as clear layer：1.52), on, carry out heating in 15 minutes with 135 DEG C afterwards, by This is prepared for the luminescent coating of B-stage on glass plate.Thus, it is prepared for the diaphragm seal including glass plate and luminescent coating (with reference to Fig. 2A).

Afterwards, paste two-sided band (pressure-sensitive adhesive layer) on corrosion resistant plate, and on this two-sided band, with 1.64mm Spacing be configured with multiple LED (EDI-FA4545A, size：1.14mm × 1.14mm × 150 μm, wafer photoelectricity company manufacture) (reference picture 2B).Afterwards, using the evacuated flat panel pressue device of room temperature, diaphragm seal has been carried out 10 minutes heat with respect to multiple LED Crimping.Specifically, by diaphragm seal phase in the way of making luminescent coating contact with the two-sided band of the surrounding of LED and this LED Multiple LED are crimped.Thus, multiple LED are sealed using diaphragm seal.

Afterwards, make luminescent coating heat cure (C-stage) so that 150 DEG C have carried out two hours heating.Afterwards, by diaphragm seal Cut off and make its singualtion, thus manufactured on corrosion resistant plate including the glimmering of 1 LED, luminescent coating and glass plate The LED (reference picture 2C) of body of light layer sealing.

Then, in the way of making multiple LED singualtion, sealing LED aggregation is cut off (reference picture 2D).

Afterwards, the LED being sealed by luminescent coating is peeled (arrow of reference picture 2D and Fig. 2 E) from two-sided band.

Thus, obtain the LED (reference picture 2E) being sealed by luminescent coating.

Embodiment 8

It is mixed with inorganic filler A so that inorganic filler A is with respect to organic siliconresin group in organosilicon resin composition A The total amount of compound A and inorganic filler A reaches 50 mass %, is prepared for transparent resin composition X as varnish.Transparent resin group Refractive index RIt of compound X is 1.56.

Be compounded with YAG468 (fluorophor, Gen Yuan special chemical company manufacture) in transparent resin composition X so that The total amount with respect to transparent resin composition X and YAG468 for the YAG468 reaches 12 mass %, and they are mixed, and thus makes For phosphor resin compositionss.

Then, so that the total amount with respect to LR7665 and TospearTS2000B for the TospearTS2000B reaches 30 mass % Mode be mixed with TospearTS2000B to LR7665 and constitute varnish (refractive index RIt：1.41), should using applicator Varnish by its heating after thickness reach be coated in the way of in the of 500 μm 50 μm of thickness stripping film (PTE piece, trade name " SS4C ", Xin Yu company manufacture) surface on, afterwards with 100 DEG C carry out 10 minutes heating, thus made the clear layer of C-stage.

Then, using applicator, phosphor resin compositionss are applied in the way of the thickness after its heating reaches 500 μm On the surface (upper surface) of clear layer, carry out heating in 11 minutes with 80 DEG C afterwards, thus made the luminescent coating of B-stage.

Thus, made the diaphragm seal (with reference to Fig. 2A) being made up of stripping film, clear layer, luminescent coating.

Afterwards, paste two-sided band (pressure-sensitive adhesive layer) on corrosion resistant plate, and on this two-sided band, with 1.64mm Spacing be configured with multiple LED (EDI-FA4545A, size：1.14mm × 1.14mm × 150 μm, wafer photoelectricity company manufacture) (reference picture 2B).Afterwards, using the evacuated flat panel pressue device being heated to 90 DEG C, diaphragm seal has been carried out 10 with respect to multiple LED Minute thermo-compression bonding (reference picture 2C).Specifically, so that luminescent coating is contacted with the two-sided band of the surrounding of LED and this LED Mode diaphragm seal is thermally compressed with respect to multiple LED.Luminescent coating is made temporarily to plastify by this thermo-compression bonding.Thus, Seal multiple LED using diaphragm seal.

Afterwards, the solidify afterwards of two hours have been carried out with 150 DEG C.Thus, luminescent coating is made to achieve C-stage.Afterwards, will Diaphragm seal cuts off and makes its singualtion, thus having manufactured 1 LED of inclusion, luminescent coating and clear layer on corrosion resistant plate The LED (reference picture 2C) being sealed by luminescent coating.

Then, stripping film self-induced transparency layer is peeled (imaginary line of reference picture 2C).Then, so that multiple LED singualtion Sealing LED aggregation is cut off (reference picture 2D) by mode.

Afterwards, the LED being sealed by luminescent coating is peeled (arrow of reference picture 2D and Fig. 2 E) from two-sided band.

Thus, obtain the LED (reference picture 2E) being sealed by luminescent coating.

Embodiment 9

It is mixed with YAG468 (manufacture of Gen Yuan special chemical company) in the organosilicon resin composition A of 100 mass parts, make Obtain the total amount with respect to organosilicon resin composition A and YAG468 for the YAG468 and reach 17 mass %, be prepared for as varnish glimmering Body of light resin combination.

Paste two-sided band on corrosion resistant plate, and carrying (has configured) 1 LED (EDI- on this two-sided band FA4545A, size：1.14mm × 1.14mm × 150 μm, wafer photoelectricity company manufacture) (reference picture 3A).

The 1st weir and the 2nd weir (reference picture 3A and Fig. 3 D) are separately made.

That is, apply LR7665 (refractive index 1.41) and make the thickness of LR7665 reach 500 μm, carry out 10 minutes with 100 DEG C Solidification (heat cure), then, by cured sheets be processed into housing size 10mm × 10mm, inside casing size (inside dimension) 1.64mm × The rectangular frame shape of 1.64mm, thus made the 1st weir (reference picture 3A).That is, the overall dimensions on the 1st weir be 10mm × 10mm, the inside dimension of the peristome of rectangular shape is 1.64mm × 1.64mm.

Then, in addition to the thickness on the 2nd weir is changed to 1mm, the 2nd weir (reference picture will have been made in the same manner as the 1st weir 3D).

Then, it is provided with the 1st weir (reference picture 3B) around the LED on corrosion resistant plate.Then, by phosphor resin The varnish of compositionss drops in the 1st peristome on the 1st weir, liquid measure is adjusted and makes liquid thickness reach 500 μm, with 100 DEG C phosphor resin compositionss were made to achieve B-stage (reference picture 3C) by 10 minutes.Thus, obtain B-stage state Luminescent coating.Afterwards, eliminate the 1st weir (arrow of reference picture 3C).

Then, the 2nd weir is arranged on surrounding's (reference picture 3E) of the luminescent coating on corrosion resistant plate.Afterwards, will be organic Silicon resin composition A drops in the 2nd peristome on the 2nd weir, liquid measure is adjusted and makes total thickness reach 1mm.Then, Make organosilicon resin composition A heat cure (C-stage) with 150 DEG C by two hours, thus having obtained the transparent of C-stage state Layer (reference picture 4A).Then, cut (reference picture 4B) along the border (interface) between luminescent coating and clear layer and made For the LED being sealed by luminescent coating (reference picture 4C).

Embodiment 10

It is mixed with YAG468 (manufacture of Gen Yuan special chemical company) so that YAG468 phase in organosilicon resin composition A Total amount for organosilicon resin composition A and YAG468 reaches 18 mass %, is prepared for phosphor resin group as varnish Compound.

Paste two-sided band on corrosion resistant plate, and carrying (has configured) 1 LED (EDI- on this two-sided band FA4545A, size：1.14mm × 1.14mm × 150 μm, wafer photoelectricity company manufacture) (reference picture 3A).

The 1st weir and the 2nd weir (reference picture 3A and Fig. 3 D) are separately made.

That is, apply LR7665 (refractive index 1.41) and make the thickness of LR7665 reach 500 μm, to carry out 10 points at 100 DEG C Clock solidify (heat cure), then, by cured sheets be processed into housing size 10mm × 10mm, inside casing size (inside dimension) 1.64mm × The rectangular frame shape of 1.64mm, thus made the 1st weir (reference picture 3A).That is, the overall dimensions on the 1st weir be 10mm × 10mm, the inside dimension of the peristome of rectangular shape is 1.64mm × 1.64mm.

Then, in addition to the thickness on the 2nd weir is changed to 1mm, made the 2nd weir (reference picture in the same manner as the 1st weir 3D).

Then, it is provided with the 1st weir (reference picture 3B) around the LED on corrosion resistant plate.Then, by phosphor resin The varnish of compositionss drops in the 1st peristome on the 1st weir, liquid measure is adjusted and makes liquid thickness reach 500 μm, with 100 DEG C phosphor resin compositionss were made to achieve B-stage (reference picture 3C) by 10 minutes.Thus, obtain B-stage state Luminescent coating.Afterwards, eliminate the 1st weir (arrow of reference picture 3C).

Then, the 2nd weir is arranged on surrounding's (reference picture 3E) of the luminescent coating on corrosion resistant plate.Afterwards, will LR7665 (refractive index 1.41) drops in the 2nd peristome on the 2nd weir, liquid measure is adjusted and makes total thickness reach 1mm. Then, made organosilicon resin composition A heat cure (C-stage) with 150 DEG C by two hours, thus having obtained C-stage state Clear layer (reference picture 4A).Then, cut (reference picture along the border (interface) between luminescent coating and clear layer 4B) it is prepared for the LED (reference picture 4C) being sealed by luminescent coating.

Embodiment 11

It is mixed with inorganic filler A so that inorganic filler A is with respect to organic siliconresin group in organosilicon resin composition A The total amount of compound A and inorganic filler A reaches 50 mass %, is prepared for transparent resin composition X as varnish.Transparent resin group The refractive index of compound X is 1.56.

Be compounded with YAG468 (fluorophor, Gen Yuan special chemical company manufacture) in transparent resin composition X so that The total amount with respect to transparent resin composition X and YAG468 for the YAG468 reaches 50 mass %, and they are mixed, and thus makes For phosphor resin compositionss.

Afterwards, using applicator, transparent resin composition X is coated in the way of the thickness after its heating reaches 800 μm On the surface of stripping film (PTE piece, trade name " SS4C ", Xin Yu company manufacture) that 50 μm of thickness, carry out 20 points with 90 DEG C afterwards Clock heats, and has thus made the clear layer of B-stage.

Then, using applicator, phosphor resin compositionss are applied in the way of the thickness after its heating reaches 200 μm On the surface (upper surface) of clear layer, carry out heating in 11 minutes with 80 DEG C afterwards, thus made the luminescent coating of B-stage.

Thus, made the diaphragm seal (with reference to Fig. 2A) being made up of stripping film, clear layer, luminescent coating.

Afterwards, paste two-sided band (pressure-sensitive adhesive layer) on corrosion resistant plate, and on this two-sided band, with 1.24mm Spacing be configured with multiple LED (EDI-FA4545A, size：1.14mm × 1.14mm × 150 μm, wafer photoelectricity company manufacture) (reference picture 2B).Afterwards, using the evacuated flat panel pressue device being heated to 90 DEG C, diaphragm seal has been carried out 10 with respect to multiple LED Minute thermo-compression bonding (reference picture 2C).Specifically, so that luminescent coating is contacted with the two-sided band of the surrounding of LED and this LED Mode diaphragm seal is thermally compressed with respect to multiple LED.Luminescent coating and clear layer is made temporarily to mould by this thermo-compression bonding Change.Thus, multiple LED are sealed using diaphragm seal.

Afterwards, the solidify afterwards of two hours have been carried out with 150 DEG C.Thus, luminescent coating and clear layer is made to achieve C-stage Change.Afterwards, diaphragm seal is cut off and make its singualtion, thus having manufactured inclusion 1 LED, luminescent coating on corrosion resistant plate And the LED (reference picture 2C) being sealed by luminescent coating of clear layer.

Then, stripping film self-induced transparency layer is peeled (imaginary line of reference picture 2C).Then, so that multiple LED singualtion Sealing LED aggregation is cut off (reference picture 2D) by mode.

Afterwards, the LED being sealed by luminescent coating is peeled (arrow of reference picture 2D and Fig. 2 E) from two-sided band.

Thus, obtain the LED (reference picture 2E) being sealed by luminescent coating.

Embodiment 12

It is mixed with inorganic filler A so that inorganic filler A is with respect to organic siliconresin group in organosilicon resin composition A The total amount of compound A and inorganic filler A reaches 50 mass %, is prepared for transparent resin composition X as varnish.Transparent resin group The refractive index of compound X is 1.56.

Be compounded with YAG468 (fluorophor, Gen Yuan special chemical company manufacture) in transparent resin composition X so that The total amount with respect to transparent resin composition X and YAG468 for the YAG468 reaches 30 mass %, and they are mixed, and thus makes For phosphor resin compositionss.

Afterwards, using applicator, transparent resin composition X is coated in the way of the thickness after its heating reaches 50 μm On the surface of stripping film (PTE piece, trade name " SS4C ", Xin Yu company manufacture) that 50 μm of thickness, carry out 20 points with 90 DEG C afterwards Clock heats, and has thus made the clear layer of B-stage.

Then, using applicator, phosphor resin compositionss are applied in the way of the thickness after its heating reaches 300 μm On the surface (upper surface) of clear layer, carry out heating in 11 minutes with 80 DEG C afterwards, thus made the luminescent coating of B-stage.

Thus, made the diaphragm seal (with reference to Fig. 2A) being made up of stripping film, clear layer, luminescent coating.

Afterwards, paste two-sided band (pressure-sensitive adhesive layer) on corrosion resistant plate, and on this two-sided band, with 1.34mm Spacing be configured with multiple LED (EDI-FA4545A, size：1.14mm × 1.14mm × 150 μm, wafer photoelectricity company manufacture) (reference picture 2B).Afterwards, using the evacuated flat panel pressue device being heated to 90 DEG C, diaphragm seal has been carried out 10 with respect to multiple LED Minute thermo-compression bonding (reference picture 2C).Specifically, so that luminescent coating is contacted with the two-sided band of the surrounding of LED and this LED Mode diaphragm seal is thermally compressed with respect to multiple LED.Luminescent coating and clear layer is made temporarily to mould by this thermo-compression bonding Change.Thus, multiple LED are sealed using diaphragm seal.

Afterwards, the solidify afterwards of two hours have been carried out with 150 DEG C.Thus, luminescent coating and clear layer is made to achieve C-stage Change.Afterwards, diaphragm seal is cut off and make its singualtion, thus having manufactured inclusion 1 LED, luminescent coating on corrosion resistant plate And the LED (reference picture 2C) being sealed by luminescent coating of clear layer.

Then, stripping film self-induced transparency layer is peeled (imaginary line of reference picture 2C).Then, so that multiple LED singualtion Sealing LED aggregation is cut off (reference picture 2D) by mode.

Afterwards, the LED being sealed by luminescent coating is peeled (arrow of reference picture 2D and Fig. 2 E) from two-sided band.

Thus, obtain the LED (reference picture 2E) being sealed by luminescent coating.

Embodiment 13

It is mixed with inorganic filler A so that inorganic filler A is with respect to organic siliconresin group in organosilicon resin composition A The total amount of compound A and inorganic filler A reaches 50 mass %, is prepared for transparent resin composition X as varnish.Transparent resin group The refractive index of compound X is 1.56.

Be compounded with YAG468 (fluorophor, Gen Yuan special chemical company manufacture) in transparent resin composition X so that The total amount with respect to transparent resin composition X and YAG468 for the YAG468 reaches 8 mass parts, and they are mixed, and thus makes For phosphor resin compositionss.

Afterwards, using applicator, transparent resin composition X is coated in the way of the thickness after its heating reaches 100 μm On the surface of stripping film (PTE piece, trade name " SS4C ", Xin Yu company manufacture) that 50 μm of thickness, carry out 20 points with 90 DEG C afterwards Clock heats, and has thus made the clear layer of B-stage.

Then, using applicator, phosphor resin compositionss are applied in the way of the thickness after its heating reaches 900 μm On the surface (upper surface) of clear layer, carry out heating in 11 minutes with 80 DEG C afterwards, thus made the luminescent coating of B-stage.

Thus, made the diaphragm seal (with reference to Fig. 2A) being made up of stripping film, clear layer, luminescent coating.

Afterwards, paste two-sided band (pressure-sensitive adhesive layer) on corrosion resistant plate, and on this two-sided band, with 1.64mm Spacing be configured with multiple LED (EDI-FA4545A, size：1.14mm × 1.14mm × 150 μm, wafer photoelectricity company manufacture) (reference picture 2B).Afterwards, using the evacuated flat panel pressue device being heated to 90 DEG C, diaphragm seal has been carried out 10 with respect to multiple LED Minute thermo-compression bonding (reference picture 2C).Specifically, so that luminescent coating is contacted with the two-sided band of the surrounding of LED and this LED Mode diaphragm seal is thermally compressed with respect to multiple LED.Luminescent coating and clear layer is made temporarily to mould by this thermo-compression bonding Change.Thus, multiple LED are sealed using diaphragm seal.

Afterwards, the solidify afterwards of two hours have been carried out with 150 DEG C.Thus, luminescent coating and clear layer is made to achieve C-stage Change.Afterwards, diaphragm seal is cut off and make its singualtion, thus having manufactured inclusion 1 LED, luminescent coating on corrosion resistant plate And the LED (reference picture 2C) being sealed by luminescent coating of clear layer.

Then, stripping film self-induced transparency layer is peeled (imaginary line of reference picture 2C).Then, so that multiple LED singualtion Sealing LED aggregation is cut off (reference picture 2D) by mode.

Afterwards, the LED being sealed by luminescent coating is peeled (arrow of reference picture 2D and Fig. 2 E) from two-sided band.

Thus, obtain the LED (reference picture 2E) being sealed by luminescent coating.

Embodiment 14

It is mixed with inorganic filler A so that inorganic filler A is with respect to organic siliconresin group in organosilicon resin composition A The total amount of compound A and inorganic filler A reaches 50 mass %, is prepared for transparent resin composition X as varnish.Transparent resin group The refractive index of compound X is 1.56.

Be compounded with YAG468 (fluorophor, Gen Yuan special chemical company manufacture) in transparent resin composition X so that The total amount with respect to transparent resin composition X and YAG468 for the YAG468 reaches 28 mass %, and they are mixed, and thus makes For phosphor resin compositionss.

Afterwards, using applicator, phosphor resin compositionss are applied in the way of the thickness after its heating reaches 150 μm On the surface of 50 μm of stripping film (PTE piece, trade name " SS4C ", Xin Yu company manufacture) of thickness, carry out 20 with 90 DEG C afterwards Minute heating, has thus made the luminescent coating of B-stage.Thus, made the fluorescence being made up of stripping film and luminescent coating close Mounting (luminescent coating preparatory process, reference picture 7A).

Afterwards, paste two-sided band (pressure-sensitive adhesive layer) on corrosion resistant plate, and on this two-sided band, with 1.54mm Spacing be configured with multiple LED (EDI-FA4545A, size：1.14mm × 1.14mm × 150 μm, wafer photoelectricity company manufacture). Afterwards, using the evacuated flat panel pressue device being heated to 90 DEG C, fluorescence diaphragm seal has been carried out 10 minutes heat with respect to multiple LED Crimping.Specifically, using evacuated flat panel pressue device so that the two-sided band phase of luminescent coating and the surrounding of LED and this LED Fluorescence diaphragm seal is thermally compressed (luminescent coating arrangement step, reference picture 7B) with respect to multiple LED by the mode of contact.Make The upper surface of luminescent coating is formed as flat condition.

Afterwards, stripping film autofluorescence body layer is peeled (reference picture 7C).

Then, while part away from LED in removing luminescent coating, make the LED monolithic being sealed by luminescent coating Change (singualtion/removing step, reference picture 7D).That is, slide is cut off using the cast-cutting saw of 200 μm of wall thickness.

Thus, obtain the LED (reference picture 7F) being sealed by luminescent coating.

Afterwards, by multiple LED being sealed by luminescent coating, on fore-and-aft direction and left and right directions, separated from each other compartment of terrain is arranged Row are configured at the 2nd support plate (reference picture 8A).

In addition, transparent resin composition X is coated in the way of the thickness after its heating reaches 850 μm using applicator On the surface of the 2nd stripping film (PTE piece, trade name " SS4C ", Xin Yu company manufacture) of 50 μm of thickness, carry out 20 with 90 DEG C afterwards Minute heating, has thus made the clear layer of B-stage.Thus, it is prepared for the slide being made up of the 2nd stripping film and clear layer (clear layer preparatory process, reference picture 8A).

Then, multiple luminescent coatings (clear layer arrangement step, Fig. 8 B) are covered using the clear layer of slide, the plurality of Luminescent coating covers multiple LED.

Then, the 2nd stripping film self-induced transparency layer is peeled (reference picture 8C).Then, will in the way of making multiple LED singualtion Sealing LED aggregation cuts off (reference picture 8D).

Afterwards, the LED being sealed by luminescent coating is peeled (arrow of reference picture 8D) from two-sided band.

Thus, obtain the LED (reference picture 8E) being sealed by luminescent coating.

Comparative example 1

Make the emulsion sheet not forming clear layer, in addition to the clear layer using this emulsion sheet is to cover LED, with enforcement Example 8 is similarly processed and is obtained the LED (with reference to Figure 16) being sealed by luminescent coating.

Comparative example 2

Except making the emulsion sheet not forming clear layer, in addition to the clear layer using this emulsion sheet is to cover LED, with Embodiment 14 is similarly processed and is obtained the LED (with reference to Figure 17) being sealed by luminescent coating.

Evaluate

Luminous intensity

The LED being sealed by luminescent coating of each embodiment and each comparative example is installed on substrate and manufactures LED matrix (ginseng According to the imaginary line of Fig. 1, the imaginary line of Fig. 2 F, Figure 16, Figure 17 imaginary line).Then, with the electric current of 300mA, total light flux is surveyed Amount device is lighted, and has obtained luminous intensity.

The luminous intensity obtaining according to following benchmark evaluations.

A：Luminous intensity is more than 135lm

B：Luminous intensity is 128lm less than 135lm

C：Luminous intensity is 118lm less than 128lm

D：Luminous intensity is 110lm less than 118lm

E：Luminous intensity is less than 110lm

Color homogeneity

Prepare the LED being sealed by luminescent coating of each 10 (n=10) each embodiment and each comparative example, will be described glimmering The LED of body of light layer sealing is installed on substrate and has manufactured LED matrix (with reference to the imaginary line of Fig. 1, the imaginary line of Fig. 2 F, Figure 16, figure 17 imaginary line).Then, the CIE y of optical characteristics is measured, and obtained 10 LED's being sealed by luminescent coating Deviation.Then, the situation that the difference of maxima and minima is less than 0.03 is evaluated as zero, the difference of maxima and minima is surpassed Cross 0.03 situation be evaluated as 0.03 being evaluated as ×.

Luminous intensity distribution (irregular colour is even)

The LED being sealed by luminescent coating of each embodiment and each comparative example is installed on substrate and manufactures LED matrix (ginseng According to the imaginary line of Fig. 1, the imaginary line of Fig. 2 F, Figure 16, Figure 17 imaginary line).Then, using luminous intensity distribution measurement apparatus (big electronics Company manufactures GP-7), in units of 5 °, the colourity in -85 ° to this LED matrix～85 ° direction is measured.Obtain each side The deviation of colourity upwards.And, the situation that the difference of maxima and minima is less than 0.02 is evaluated as zero, by maximum with The situation more than 0.02 for the difference of minima is evaluated as ×.

Reliability (is burnt black)

The LED being sealed by luminescent coating of each embodiment and each comparative example is installed on substrate and manufactures LED matrix (ginseng According to the imaginary line of Fig. 1, the imaginary line of Fig. 2 F, Figure 16, Figure 17 imaginary line).Then, total light flux is measured by dress with the electric current of 1A Put and light 1000 hours, visually to observe luminescent coating and clear layer, and according to following benchmark to close by luminescent coating The reliability of the LED of envelope and LED matrix is evaluated.

○：Do not observe that burning is black in luminescent coating or clear layer.

△：Luminescent coating or clear layer observe slightly burn black.

×：Observe that burning is black in luminescent coating or clear layer.

Alkyl (R to the product being obtained by the reaction of organosilicon resin composition A⁵) in phenyl content ratio Measure

Using¹H-NMR and²⁹Si-NMR calculates by organosilicon resin composition A (that is, not containing filler Organosilicon resin composition A) reaction obtain product in and silicon atom Direct Bonding alkyl (average composition formula (3) R⁵) in phenyl content ratio (mole %).

Specifically, in the case of without filler, carry out 1 with 100 DEG C of organosilicon resin composition A making the A stage Hour reaction (be fully cured, C-stage), obtains product.

Then, to the product obtaining¹H-NMR and²⁹Si-NMR measures, and calculates and silicon atom Direct Bonding Alkyl (R⁵) in the ratio (mole %) shared by phenyl.

As a result, this ratio is 48%.

The structure of each layer in each embodiment and each comparative example and formula are shown in Table 1 below.

Table 1

The evaluation of the size of each layer in each embodiment and each comparative example and the LED being sealed by luminescent coating is represented in table In 2.

Table 2

In addition although providing described explanation as embodiment illustrated of the present utility model, but this is only to illustrate, Limited explanation should not done.Those skilled in the art variation clearly of the present utility model can be included in this utility model Claims in the range of.

Claims (5)

1. a kind of optical semiconductor being covered with luminescent coating it is characterised in that

Possess：Optical semiconductor,

Cover described optical semiconductor luminescent coating and

Cover at least one of clear layer of described luminescent coating,

Described clear layer is formed by the transparent resin composition containing filler.

2. the optical semiconductor being covered with luminescent coating according to claim 1 it is characterised in that

Described filler be from inorganic particle and organic granular select at least any one.

3. the optical semiconductor being covered with luminescent coating according to claim 1 is it is characterised in that the refraction of described filler Rate is more than 1.40 and less than 1.60.

4. the optical semiconductor being covered with luminescent coating according to claim 2 it is characterised in that

Described inorganic particle is from by silicon dioxide, Talcum, aluminium oxide, boron oxide, calcium oxide, zinc oxide, strontium oxide, oxidation Select in the group that magnesium, zirconium oxide, Barium monoxide, stibium oxide, aluminium nitride, silicon nitride and glass particle are constituted at least any one.

5. the optical semiconductor being covered with luminescent coating according to claim 2 it is characterised in that

Described organic granular is from by acrylic resin granule, phenylethylene resin series granule, acrylicstyrene system resin Grain, silicon-type resin particle, polycarbonate-based resin granule, benzocarbamidine amine system resin particle, polyolefin-based resins granule, poly- Ester system resin particle, polyamide series resin granule, polyimides system resins granule constitute group in select at least any one.