TWM528296U - 閂鎖機構及具有該閂鎖機構的晶圓盒 - Google Patents

閂鎖機構及具有該閂鎖機構的晶圓盒 Download PDF

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Publication number
TWM528296U
TWM528296U TW105206245U TW105206245U TWM528296U TW M528296 U TWM528296 U TW M528296U TW 105206245 U TW105206245 U TW 105206245U TW 105206245 U TW105206245 U TW 105206245U TW M528296 U TWM528296 U TW M528296U
Authority
TW
Taiwan
Prior art keywords
door body
plate portion
top support
latching mechanism
latch
Prior art date
Application number
TW105206245U
Other languages
English (en)
Chinese (zh)
Inventor
Chih-Mao Chiang
Ming-Long Chiu
Original Assignee
Chung King Entpr Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chung King Entpr Co Ltd filed Critical Chung King Entpr Co Ltd
Priority to TW105206245U priority Critical patent/TWM528296U/zh
Publication of TWM528296U publication Critical patent/TWM528296U/zh
Priority to KR2020170001124U priority patent/KR20170003851U/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67373—Closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
TW105206245U 2016-05-02 2016-05-02 閂鎖機構及具有該閂鎖機構的晶圓盒 TWM528296U (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW105206245U TWM528296U (zh) 2016-05-02 2016-05-02 閂鎖機構及具有該閂鎖機構的晶圓盒
KR2020170001124U KR20170003851U (ko) 2016-05-02 2017-03-09 래치기구 및 이를 구비한 웨이퍼 카세트

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW105206245U TWM528296U (zh) 2016-05-02 2016-05-02 閂鎖機構及具有該閂鎖機構的晶圓盒

Publications (1)

Publication Number Publication Date
TWM528296U true TWM528296U (zh) 2016-09-11

Family

ID=57443916

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105206245U TWM528296U (zh) 2016-05-02 2016-05-02 閂鎖機構及具有該閂鎖機構的晶圓盒

Country Status (2)

Country Link
KR (1) KR20170003851U (ko)
TW (1) TWM528296U (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116646286A (zh) * 2023-05-04 2023-08-25 北京鑫跃微半导体技术有限公司 晶圆盒闩锁机构及晶圆盒
TWI834526B (zh) * 2023-03-17 2024-03-01 中勤實業股份有限公司 容器門板及具有該容器門板之基板容器

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108767935B (zh) * 2018-07-31 2024-02-06 深圳市宝尔爱迪科技有限公司 一种锁扣结构及具有该锁扣结构的一种座充
CN110148254B (zh) * 2019-06-13 2024-03-01 杭州源骏创新设计有限公司 一种自动售卖机
CN114078727A (zh) * 2020-08-11 2022-02-22 武汉锐晶激光芯片技术有限公司 一种取放晶圆片的引导结构
CN114679865B (zh) 2021-08-09 2024-05-14 神基投资控股股份有限公司 电子装置及其组装方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4508463B2 (ja) * 2001-04-20 2010-07-21 信越ポリマー株式会社 容器の蓋体用手動開閉治具
TW534165U (en) * 2002-09-04 2003-05-21 Ind Tech Res Inst Latch locking mechanism used in doors of wafer boxes
TWI239931B (en) * 2003-05-19 2005-09-21 Miraial Co Ltd Lid unit for thin plate supporting container and thin plate supporting container
JP4851445B2 (ja) * 2005-05-31 2012-01-11 三甲株式会社 薄板搬送容器の開閉構造
JP4647417B2 (ja) * 2005-07-08 2011-03-09 信越ポリマー株式会社 基板収納容器の蓋体開閉方法
JP2009109006A (ja) * 2007-10-10 2009-05-21 Tokyo Electron Ltd ゲートバルブ及びそれを用いた基板処理装置
KR101049716B1 (ko) * 2008-12-02 2011-07-19 (주)상아프론테크 덮개를 개폐하는 래치장치
KR101115851B1 (ko) * 2011-05-31 2012-02-28 (주)상아프론테크 웨이퍼 캐리어용 도어록 장치
JP5715898B2 (ja) * 2011-07-06 2015-05-13 ミライアル株式会社 基板収納容器
TWI473752B (zh) * 2011-12-13 2015-02-21 Gudeng Prec Ind Co Ltd 大型前開式晶圓盒之門閂結構

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI834526B (zh) * 2023-03-17 2024-03-01 中勤實業股份有限公司 容器門板及具有該容器門板之基板容器
CN116646286A (zh) * 2023-05-04 2023-08-25 北京鑫跃微半导体技术有限公司 晶圆盒闩锁机构及晶圆盒
CN116646286B (zh) * 2023-05-04 2024-01-30 北京鑫跃微半导体技术有限公司 晶圆盒闩锁机构及晶圆盒

Also Published As

Publication number Publication date
KR20170003851U (ko) 2017-11-10

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Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees