TWM518392U - 膠線結構 - Google Patents

膠線結構 Download PDF

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Publication number
TWM518392U
TWM518392U TW104218296U TW104218296U TWM518392U TW M518392 U TWM518392 U TW M518392U TW 104218296 U TW104218296 U TW 104218296U TW 104218296 U TW104218296 U TW 104218296U TW M518392 U TWM518392 U TW M518392U
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Taiwan
Prior art keywords
thermoplastic elastomer
conductive wire
fabric
line structure
adhesive tape
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TW104218296U
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English (en)
Inventor
Yu-Hsun Kang
Shu-Fen Liao
Jaang-Jiun Hou
Hao-Chen Wang
Reng-Sho Chen
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Kings Metal Fiber Technologies
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Application filed by Kings Metal Fiber Technologies filed Critical Kings Metal Fiber Technologies
Priority to TW104218296U priority Critical patent/TWM518392U/zh
Priority to CN201510873707.8A priority patent/CN106710705A/zh
Priority to JP2015006496U priority patent/JP3203420U/ja
Priority to DE202015107112.4U priority patent/DE202015107112U1/de
Priority to US14/987,252 priority patent/US20170135416A1/en
Priority to EP16150972.4A priority patent/EP3168333A1/en
Publication of TWM518392U publication Critical patent/TWM518392U/zh

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/28Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances natural or synthetic rubbers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00Insulated conductors or cables characterised by their form
    • H01B7/40Insulated conductors or cables characterised by their form with arrangements for facilitating mounting or securing
    • AHUMAN NECESSITIES
    • A41WEARING APPAREL
    • A41DOUTERWEAR; PROTECTIVE GARMENTS; ACCESSORIES
    • A41D1/00Garments
    • A41D1/002Garments adapted to accommodate electronic equipment
    • A41D1/005Garments adapted to accommodate electronic equipment with embedded cable or connector
    • AHUMAN NECESSITIES
    • A41WEARING APPAREL
    • A41BSHIRTS; UNDERWEAR; BABY LINEN; HANDKERCHIEFS
    • A41B9/00Undergarments
    • AHUMAN NECESSITIES
    • A41WEARING APPAREL
    • A41DOUTERWEAR; PROTECTIVE GARMENTS; ACCESSORIES
    • A41D1/00Garments
    • A41D1/04Vests, jerseys, sweaters or the like
    • AHUMAN NECESSITIES
    • A41WEARING APPAREL
    • A41DOUTERWEAR; PROTECTIVE GARMENTS; ACCESSORIES
    • A41D1/00Garments
    • A41D1/06Trousers
    • AHUMAN NECESSITIES
    • A41WEARING APPAREL
    • A41DOUTERWEAR; PROTECTIVE GARMENTS; ACCESSORIES
    • A41D1/00Garments
    • A41D1/18Blouses
    • AHUMAN NECESSITIES
    • A41WEARING APPAREL
    • A41DOUTERWEAR; PROTECTIVE GARMENTS; ACCESSORIES
    • A41D19/00Gloves
    • A41D19/0024Gloves with accessories
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/32Layered products comprising a layer of synthetic resin comprising polyolefins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • DTEXTILES; PAPER
    • D01NATURAL OR MAN-MADE THREADS OR FIBRES; SPINNING
    • D01FCHEMICAL FEATURES IN THE MANUFACTURE OF ARTIFICIAL FILAMENTS, THREADS, FIBRES, BRISTLES OR RIBBONS; APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OF CARBON FILAMENTS
    • D01F1/00General methods for the manufacture of artificial filaments or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/302Polyurethanes or polythiourethanes; Polyurea or polythiourea
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/441Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/442Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from aromatic vinyl compounds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/038Textiles
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2437/00Clothing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0386Paper sheets
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0104Properties and characteristics in general
    • H05K2201/0129Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0104Properties and characteristics in general
    • H05K2201/0133Elastomeric or compliant polymer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0183Dielectric layers
    • H05K2201/0195Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09218Conductive traces
    • H05K2201/09263Meander
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0191Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/282Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability

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  • Engineering & Computer Science (AREA)
  • Textile Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • Knitting Of Fabric (AREA)
  • Professional, Industrial, Or Sporting Protective Garments (AREA)
  • Woven Fabrics (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Description

膠線結構
本創作係有關於一種膠線結構,尤指一種透過一熱塑性彈性體及至少一導電線之組合設計,並藉由該熱塑性彈性體具有冷卻後完成固化膠合之特性,讓具有包覆導電線之熱塑性彈性體能因冷卻後即固化膠合於織物或基層上,而適用於不銹鋼導電線、碳纖維導電線、濺鍍纖維(Sputtered Fiber)導電線等或各式之導電線者。
現今的織物在穿戴下開始強調需有具有舒適、透氣、涼爽等效果,因此近年來各個科技廠商積極投入研發以進行改良各種纖維及編織方式,使織物能達到上述的效果。
而最近科技廠商開始發展所謂的智慧衣,也就是配備電子化裝置因而具有智慧化功能的衣物,且具有可重複水洗的能力,以及心電、體溫、呼吸、動作、跌倒等生理量測功能,並能透過即時無線傳輸及提供穩定的生理訊號警訊監視與記錄服務。且從早期需將軟板內嵌在衣服中的做法改良成於纖維中加入導電纖維,藉以控制電流電壓及傳導量測訊號等。
然而,在目前的科技技術上,於纖維中加入導電纖維且編織成織物後,經過水洗或多次揉搓容易將導電纖維弄斷而造成短路或接觸不良,使得在控制電流電壓及傳導量測訊號的效能上大大折扣。且在後 續的導電纖維維修上是一件非常麻煩的事,所以假如發生短路或接觸不良時該織物只能被丟棄無法重覆使用。
因此,本創作人有鑑於上述缺失,期能提出一種具有重覆撕貼及方便後續成衣加工之效能的膠線結構,令使用者可輕易操作組裝,乃潛心研思、設計組製,以提供使用者便利性,為本創作人所欲研創之創作動機者。
本創作之主要目的,在提供一種膠線結構,係包括有一熱塑性彈性體及至少一導電線之組合設計,該熱塑性彈性體係具有剛性鏈段和柔性鏈段,而該至少一導電線係包覆於該熱塑性彈性體內,以使該導電線能藉由該熱塑性彈性體來熱熔黏合,且透過該熱塑性彈性體具有在室溫下為固體,而經由加熱到一定溫度後即熔融成液體狀態,並待其冷卻後則完成固化膠合之特性,讓具有包覆導電線之熱塑性彈性體能因冷卻後即固化膠合並黏接於織物或基層上,進而增加整體之實用性者。
本創作之另一目的,在提供一種膠線結構,藉由該熱塑性彈性體係採用為苯乙烯系熱塑性彈性體(TPS)、聚氨酯類熱塑性彈性體(TPU)、熱塑性琉化彈性體(TPV)、聚烯烴系熱塑性彈性體(TPO)、聚酯類熱塑性彈性體(TPEE)或乙烯-醋酸乙烯酯共聚合物熱塑性彈性體(EVA)等其中任一種為主成份,並加上增黏劑、增塑劑、抗氧化劑、阻燃劑及填料等添加物,再經熔融混合而成的固體狀黏合劑,而該熔融溫度介於65度C至180度C之間,於使用時只要透過加熱便可讓該 熱塑性彈性體熔融,待冷卻後即固化膠合並黏接於各種基材或織物上,進而增加整體之使用黏著性者。
本創作之次一目的,在提供一種膠線結構,藉由該熱塑性彈性體係熱熔黏合於一織物上,而該織物係為衣服、褲子、手套、內衣、背心、胸衣、平口衣等其中任一種,其中該熱塑性彈性體熱熔黏合於該織物時係將該導電線呈直線型態或將該導電線彎折呈S字型態或Z字型態,可以增加其延展性,讓該導電線不易被拉斷,使該具有包覆導電線之熱塑性彈性體能直接熱熔黏合於織物上,讓該導電線能配合該織物之形體來形成迴路或電路,便於具有進行訊號傳遞或電力傳遞之效能,進而增加整體之使用性者。
本創作之次二目的,在提供一種膠線結構,藉由該熱塑性彈性體係熱熔黏合於一基層上,而該基層係為紙體、布體、膜體、片體或彈性體等其中任一種,再藉由該基層透過縫合方式、超音波方式、熱熔合方式或黏接劑等結合方式來結合於一織物上,且該織物係為衣服、褲子、手套、內衣、背心、胸衣、平口衣等其中任一種,使該具有包覆導電線之熱塑性彈性體能透過不同的基層之設計,讓該基層能結合於不同材質的織物上,方便在該織物上形成迴路或電路,並藉由該基層來形成多一層保護該導電線,避免該導電線因外力影響而造成短路或斷路之現線,進而增加整體之保護性者。
本創作之再一目的,在提供一種膠線結構,藉由該熱塑性彈性體係熱熔黏合於一基層上,而該基層係為膠帶,且該膠帶係具有一黏性面,而該具有包覆導電線之熱塑性彈性體係熱熔黏合於該膠帶具有黏性面上,再透過該膠帶之黏性面來進行貼合,或者是該膠帶係不具黏性面,而該具有包覆導電線之熱塑性彈性體係先熱熔黏合於該膠帶不 具黏性面上,再塗佈一層黏膠於具有包覆導電線之熱塑性彈性體的膠帶不具黏性面上,使具有包覆導電線之熱塑性彈性體的膠帶能藉由塗佈之黏膠來進行貼合,讓本創作可以透過以膠帶方式來將具有包覆導電線之熱塑性彈性體貼合於各種織物上,而具有重覆撕貼及調整以方便後續成衣加工之效能,進而增加整體之便利性者。
為達上述之目的,本創作之膠線結構,係包括有一熱塑性彈性體及至少一導電線,該熱塑性彈性體係具有剛性鏈段和柔性鏈段;以及該至少一導電線係包覆於該熱塑性彈性體內,以使該導電線能藉由該熱塑性彈性體來熱熔黏合者。
本創作之上述及其他目的與優點,不難從下述所選用實施例之詳細說明與附圖中,獲得深入了解。
當然,本創作在某些另件上,或另件之安排上容許有所不同,但所選用之實施例,則於本說明書中,予以詳細說明,並於附圖中展示其構造。
10‧‧‧熱塑性彈性體
20‧‧‧導電線
30‧‧‧織物
40‧‧‧基層
401‧‧‧黏性面
50‧‧‧黏膠
第1圖係為本創作主要實施方式之立體外觀示意圖。
第2圖係為本創作第一種應用實施方式之具有包覆導電線之熱塑性彈性體熱熔黏合於織物外觀示意圖。
第3圖係為本創作第二種應用實施方式之具有包覆導電線之熱塑性彈性體熱熔黏合於基層外觀示意圖。
第4圖係為本創作第二種應用實施方式之具有包覆導電線之熱塑性彈性體熱熔黏合於基層A-A剖面示意圖。
第5圖係為本創作第二種應用實施方式之具有包覆導電線之熱塑性彈性體的基層結合於織物外觀示意圖。
第6圖係為本創作第二種應用實施方式之具有包覆複數條導電線之熱塑性彈性體熱熔黏合於基層外觀示意圖。
第7圖係為本創作第三種實施方式之具有包覆導電線之熱塑性彈性體熱熔黏合於具有黏性面的膠帶立體外觀示意圖。
第8圖係為本創作第四種實施方式之具有包覆導電線之熱塑性彈性體熱熔黏合於不具黏性面的膠帶立體外觀示意圖。
請參閱第1~8圖,係為本創作實施例之示意圖,而本創作之膠線結構最佳實施方式係運用黏合於該織物30上,使該織物30上具有迴路或電路,以具有進行訊號傳遞或電力傳遞之效能。
而本創作膠線結構的主要實施方式係包括有一熱塑性彈性體10及至少一導電線20(如第1圖所示),而該熱塑性彈性體10係具有剛性鏈段(又稱硬段)和柔性鏈段(又稱軟段),前者主要影響產物的彈性、低溫性能以及硬度、撕裂強度、模量等,後者則由於分子鏈間的氫鍵和易於形成晶區而產生輕度化學交聯和物理交聯。它們在受熱或溶解時被破壞,聚合物產生塑性流動,但冷卻後卻又恢復原狀。
而該熱塑性彈性體(Thermoplastic Elastomer-TPE)10亦稱熱塑性橡膠(Thermoplastic Rubber-TPR)是一種兼具橡膠和熱塑性塑膠特性之材料。而該熱塑性彈性體10係採用苯乙烯系熱塑性彈性體(Thermoplastic Styrene Elastomer-TPS)、聚氨酯類熱塑性彈性體(Thermoplastic Polyurethane-TPU)、熱塑性琉化彈性體(Thermoplastic elastomer-TPV)、聚烯烴系熱塑性彈性體(Thermoplastic polyolefin-TPO)、聚酯類熱塑性彈性體(Thermoplastic elastomer either ester-TPEE)或乙烯-醋酸乙烯酯共聚合物熱塑性彈性體(Thermoplastic elastomer-baged on Ethylene Vinyl Acetate-TP-EVA)等其中任一種為主成份,並加上增黏劑、增塑劑、抗氧化劑、阻燃劑及填料等添加物,再經熔融混合而成的固體狀黏合劑。
且該上述之苯乙烯系熱塑性彈性體(Thermoplastic Styrene Elastomer-TPS)係分別為苯乙烯-丁二烯-苯乙烯嵌段共聚物(Styrene Butadiene Styrene-SBS)、苯乙烯-異戊二烯-苯乙烯嵌段共聚物(Styrene Isoprene Styrene-SIS)、苯乙烯-乙烯-丁烯-苯乙烯嵌段共聚物(Styrene Ethylene Butylene Styrene-SEBS)、苯乙烯-乙烯-丙烯-苯乙烯嵌段共聚物(Styrene Ethylene Propylene Styrene-SEPS)等其中任一種,另該聚氨酯類熱塑性彈性體(Thermoplastic Polyurethane-TPU)之剛性鏈段係由聚氨酯(Polyurethane-PUR)所組成,且柔性鏈段係為聚醚或聚酯所組成,而聚烯烴系熱塑性彈性體(Thermoplastic polyolefin-TPO)之剛性鏈段係為聚乙烯、聚丙烯或聚丁烯所組成,且柔性鏈段為橡膠所組成。而上述之熱塑性彈性體10其熔融溫度係介於65度C至180度C之間,於使用時只要透過加熱便可讓該熱塑性彈性體10來熔融,並待冷卻後即固化膠合。
另該至少一導電線20乃是採用不銹鋼、碳纖維、濺鍍纖維(Sputtered Fiber)等其中任一種材質或其它類似具有導電效能之材質來製成,以使導電線20具有傳導之效能。且該至少一導電線20係包覆於該熱塑性彈性體10內,以使該導電線20能藉由該熱塑性彈性體10來熱熔黏合,且透過該熱塑性彈性體10具有在室溫下為固 體,而經由加熱到一定溫度後即熔融成液體狀態,並待其冷卻後則完成固化膠合之特性,讓具有包覆導電線20之熱塑性彈性體10能因冷卻後即形成固化膠合。
而本創作膠線結構的第一種應用實施方式係包括有一熱塑性彈性體10及至少一導電線20,且該至少一導電線20係包覆於該熱塑性彈性體10內,並藉由該熱塑性彈性體10來直接熱熔黏合於一織物30(如第2圖所示)上的任何地方或縫線處,而該織物30係為衣服、褲子、手套、內衣、背心、胸衣、平口衣等其中任一種或是經由編織裁縫而成其它樣式之織物30,且該上述的織物30係具有彈性材質或非彈性材質。
另該熱塑性彈性體10熱熔黏合於該織物30時係能將該導電線20呈直線型態,或將該導電線20彎折呈S字型態或Z字型態,使該包覆於該熱塑性彈性體10內的導電線20能直接熱熔黏合於織物30上,讓該導電線20能配合該織物30之形體來形成迴路或電路,便於具有進行訊號傳遞或電力傳遞之效能。
而本創作膠線結構的第二種應用實施方式係包括有一熱塑性彈性體10及至少一導電線20,且該至少一導電線20係包覆於該熱塑性彈性體10內,而該熱塑性彈性體10係熱熔黏合於一基層40上(如第3圖及第4圖所示),且該基層40係為紙體、布體、膜體、片體或彈性體等其中任一種,另該紙體可為一般紙張、厚紙板、瓦楞紙等由紙槳所產生各種紙(圖未示),另該布體乃為透過各種纖維來編織而成的布料(圖未示),另該膜體可為具塑料材質之軟性膜或具碳材質之軟性膜等或是其它具軟性材質之膜體(圖未示),另該片體乃為具塑料材質之硬性片、具金屬材質之硬性片、具碳材質之硬性片 等或是其它具硬性材質之片體(圖未示),另該彈性體乃是具有各種具有彈性纖維所編織而成的布料或鬆緊帶(圖未示)。
再者,上述所列之基層40係能進一步結合於該織物30上(如第5圖所示),其結合方式係採用縫合方式、超音波方式、熱熔合方式或黏接劑方式等其中任一種(本實施方式係採用縫合方式來呈現),且該上述所列之基層40係能結合於該織物30的任何地方或縫線處,而該織物30係為衣服、褲子、手套、內衣、背心、胸衣、平口衣等其中任一種或是經由編織裁縫而成其它樣式之織物30,且該上述的織物30係具有彈性材質或非彈性材質。使具有包覆導電線20之熱塑性彈性體10能透過不同的基層40之設計,讓該基層40能結合於不同材質的織物30上,方便在該織物30上形成迴路或電路,並藉由該基層40來形成多一層保護該導電線20,避免該導電線20因外力影響而造成短路或斷路之現象。
另該熱塑性彈性體10熱熔黏合於該基層40時係能將該導電線20呈直線型態,或將該導電線20彎折呈S字型態(如第3圖及第6圖所示)或Z字型態,可以增加其延展性,讓該導電線20不易被拉斷,使該具有包覆導電線20之熱塑性彈性體10能直接熱熔黏合於基層40上,讓該導電線20能配合該基層40之形體來形成迴路或電路,便於具有進行訊號傳遞或電力傳遞之效能。
而本創作膠線結構的第三種應用實施方式係包括有一熱塑性彈性體10及至少一導電線20,且該至少一導電線20係包覆於該熱塑性彈性體10內,而該熱塑性彈性體10係熱熔黏合於一基層40上,且該基層40係為膠帶,其中該膠帶係具有一黏性面401(如第7圖及第5圖所示),而該具有包覆導電線20之熱塑性彈性體1 0係熱熔黏合於該膠帶具有黏性面401上,使具有包覆導電線20之熱塑性彈性體10能與膠帶形成固化膠合,再透過本身的膠帶之黏性面401來進行貼合於織物30上,而該具有包覆導電線20之熱塑性彈性體10貼合於織物30上時係能貼合於織物30的縫線處或裁剪處,一方面可以用來遮蔽縫線處或裁剪處,另一方面則可以增加織物30的美觀樣式。
而本創作膠線結構的第四種應用實施方式係包括有一熱塑性彈性體10及至少一導電線20,且該至少一導電線20係包覆於該熱塑性彈性體10內,而該熱塑性彈性體10係熱熔黏合於一基層40上,且該基層40係為膠帶,其中該膠帶係不具黏性面(如第8圖及第5圖所示),而該具有包覆導電線20之熱塑性彈性體10係先熱熔黏合於該膠帶不具黏性面上,使具有包覆導電線20之熱塑性彈性體10能與膠帶形成固化膠合,再塗佈一層黏膠50於具有包覆導電線20之熱塑性彈性體10的膠帶不具黏性面上,讓具有包覆導電線20之熱塑性彈性體10之膠帶能藉由塗佈之黏膠50來進行貼合於織物30上,讓本創作可以透過以膠帶方式來將具有包覆導電線20之熱塑性彈性體10貼合於各種織物30上,而具有重覆撕貼及調整以方便後續成衣加工之效能,進而增加整體之便利性者。
另上述於本創作膠線結構的第一種應用實施方式、第二種應用實施方式、第三種應用實施方式、第四種應用實施方式時其所述之織物上係設有訊號傳輸接點(圖未示),而該訊號傳輸接點係與至少一偵測模組(圖未示)相連接,其中該訊號傳輸接點係與至少一偵測模組之間乃是透過本創作之具有包覆導電線之熱塑性彈性體來進行連接以傳遞訊號或傳遞電力,且該所稱之偵測模組乃由複數非導電纖維紗線 及複數導電纖維紗線織造而成,或者是該電極片係由整片都是複數導電纖維紗線所織造而成,讓整片的電極片均具有導電效果,使能透過上述之偵測模組來偵測生理訊號或身體傾斜角度之變化再傳輸至該訊號傳輸接點,另該訊號傳輸接點能組設一訊號傳輸器(圖未示),且該訊號傳輸器內係設有無線傳輸模組,以能將生理訊號或身體傾斜角度之變化無線傳輸至電子設備上(如智慧型手機、智慧型平板電腦、筆記型電腦、桌上型電腦、醫療設備等)或雲端上,便於了解其偵測的結果,使能提前進行預防醫療。
由以上詳細說明,可使熟知本項技藝者明瞭本創作的確可達成前述目的,實已符合專利法之規定,爰提出專利申請。
惟以上所述者,僅為本創作之較佳實施例而已,當不能以此限定本創作實施之範圍;故,凡依本創作申請專利範圍及創作說明書內容所作之簡單的等效變化與修飾,皆應仍屬本創作專利涵蓋之範圍內。
10‧‧‧熱塑性彈性體
20‧‧‧導電線

Claims (14)

  1. 一種膠線結構,係包括:一熱塑性彈性體,該熱塑性彈性體係具有剛性鏈段和柔性鏈段;以及至少一導電線,該至少一導電線係包覆於該熱塑性彈性體內,以使該導電線能藉由該熱塑性彈性體來熱熔黏合者。
  2. 如申請專利範圍第1項所述之膠線結構,其中該熱塑性彈性體係進一步為苯乙烯系熱塑性彈性體、聚氨酯類熱塑性彈性體、熱塑性琉化彈性體、聚烯烴系熱塑性彈性體、聚酯類熱塑性彈性體或乙烯-醋酸乙烯酯共聚合物熱塑性彈性體等其中任一種,且該上述之熱塑性彈性體係進一步含有增黏劑、增塑劑、抗氧化劑、阻燃劑及填料等添加物者。
  3. 如申請專利範圍第2項所述之膠線結構,其中該苯乙烯系熱塑性彈性體係進一步分別為苯乙烯-丁二烯-苯乙烯嵌段共聚物、苯乙烯-異戊二烯-苯乙烯嵌段共聚物、苯乙烯-乙烯-丁烯-苯乙烯嵌段共聚物、苯乙烯-乙烯-丙烯-苯乙烯嵌段共聚物等其中任一種者。
  4. 如申請專利範圍第2項所述之膠線結構,其中該聚氨酯類熱塑性彈性體之剛性鏈段係進一步由聚氨酯所組成,且柔性鏈段係進一步為聚醚或聚酯所組成,而聚烯烴系熱塑性彈性體之剛性鏈段係進一步為聚乙烯、聚丙烯或聚丁烯所組成,且柔性鏈段為橡膠所組成者。
  5. 如申請專利範圍第1項所述之膠線結構,其中該熱塑性彈性體係進一步熱熔黏合於一織物上,而該織物係為衣服、褲子、手套、內衣、背心、胸衣、平口衣等其中任一種,且該織物係具有彈性材質或非彈性材質者。
  6. 如申請專利範圍第5項所述之膠線結構,其中該熱塑性彈性體熱熔黏合於該織物時係進一步能將該導電線呈直線型態者。
  7. 如申請專利範圍第5項所述之膠線結構,其中該熱塑性彈性體熱熔黏合於該織物時係進一步能將該導電線彎折呈S字型態或Z字型態者。
  8. 如申請專利範圍第1項所述之膠線結構,其中該熱塑性彈性體係進一步熱熔黏合於一基層上者。
  9. 如申請專利範圍第8項所述之膠線結構,其中該基層係進一步為紙體、布體、膜體、片體或彈性體等其中任一種者。
  10. 如申請專利範圍第9項所述之膠線結構,其中該基層係進一步結合於一織物上,而該織物係為衣服、褲子、手套、內衣、背心、胸衣、平口衣等其中任一種,且該織物係具有彈性材質或非彈性材質,另該結合方式係進一步採用縫合方式、超音波方式、熱熔合方式或黏接劑方式等其中任一種者。
  11. 如申請專利範圍第8項所述之膠線結構,其中該基層係進一步為膠帶,且該膠帶係具有一黏性面,而該具有包覆導電線之熱塑性彈性體係熱熔黏合於該膠帶具有黏性面上,再透過該膠帶之黏性面來進行貼合者。
  12. 如申請專利範圍第8項所述之膠線結構,其中該基層係進一步為膠帶,且該膠帶係不具黏性面,而該具有包覆導電線之熱塑性彈性體係先熱熔黏合於該膠帶不具黏性面上,再塗佈一層黏膠於具有包覆導電線之熱塑性彈性體的膠帶不具黏性面上,使具有包覆導電線之熱塑性彈性體的膠帶能藉由塗佈之黏膠來進行貼合者。
  13. 如申請專利範圍第8項所述之膠線結構,其中該熱塑性彈性體熱熔黏合於該基層時係進一步能將該導電線呈直線型態者。
  14. 如申請專利範圍第8項所述之膠線結構,其中該熱塑性彈性體熱熔黏合於該基層時係進一步能將該導電線彎折呈S字型態或Z字型態者。
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