TWM517839U - Heat dissipation plate - Google Patents

Description

Radiating plate

The present invention relates to a heat sink, and more particularly to a heat sink having a double heat sink.

As the technology in the electronics field continues to evolve, the performance of the electronic chips produced continues to increase. However, in general, the performance of an electronic chip is increased, and the amount of heat generated is increased. This heat is constantly accumulated on the electronic wafer and causes the temperature of the electronic chip itself to rise. If the temperature of the electronic chip is not effectively lowered, the electronic chip will be destroyed or even burned. Therefore, the problem that the electronics industry generally faces today is not the improvement of performance, but how to effectively eliminate the heat generated by the electronic chip.

In general, the most common method of heat dissipation is to thermally contact the heat sink with the electronic chip on the circuit board, so that the heat on the electronic chip can be transmitted to the heat sink through heat conduction, thereby improving heat dissipation efficiency. However, the heat dissipation performance of the existing heat dissipation plate is still insufficient, so that the heat generated by the electronic chip cannot be effectively discharged. Therefore, how to improve the heat dissipation performance of the heat sink to effectively reduce the operating temperature of the electronic chip is one of the problems that the researcher should solve.

The present invention relates to a heat dissipation plate for improving the heat dissipation performance of the heat dissipation plate to effectively reduce the operating temperature of the electronic chip.

The heat dissipation plate disclosed in the present invention comprises a first heat dissipation layer and a second heat dissipation layer. The first heat dissipation layer has a thermal contact surface and a back surface opposite to each other. The second heat dissipation layer is disposed on the back surface of the first heat dissipation layer, and the heat dissipation coefficient of the second heat dissipation layer is greater than the heat conduction coefficient of the first heat dissipation layer.

According to the heat dissipation plate disclosed in the above embodiment, the heat dissipation coefficient of the second heat dissipation layer is greater than the heat conduction coefficient of the first heat dissipation layer, so as to increase the heat dissipation effect of the heat dissipation plate, thereby effectively reducing the operating temperature of the electronic chip. .

The above description of the present invention and the following description of the embodiments are intended to illustrate and explain the principles of the present invention and to provide a further explanation of the scope of the invention.

Please refer to Figure 1 to Figure 3. 1 is a perspective view of a heat dissipation plate according to a first embodiment of the present invention. Figure 2 is a schematic cross-sectional view of Figure 1. Figure 3 is a partial enlarged view of Figure 2.

The heat dissipation plate 10 of the embodiment has a two-layer structure and includes a first heat dissipation layer 100 and a second heat dissipation layer 200. The material of the first heat dissipation layer 100 is, for example, a metal having a high thermal conductivity such as copper, a copper alloy, aluminum, or an aluminum alloy. The first heat dissipation layer 100 has a pair opposite to each other Thermal contact surface 110 and a back surface 120. The thermal contact surface 110 of the first heat dissipation layer 100 is used to thermally contact an electronic wafer (not shown) to derive heat generated by the electronic wafer. The electronic wafer described above is, for example, a central processing unit or a display wafer.

In detail, the first heat dissipation layer 100 includes a plate portion 130 and two protrusions 140. The two protrusions 140 protrude from the plate body portion 130. The thermal contact surface 110 and the back surface 120 are respectively located at the protruding portion 140 and the plate portion 130 and are opposite to each other. In the present embodiment, the protruding portion 140 may be a convex hull structure formed by press working or a bump structure formed by cutting. Wherein, if the protruding portion 140 is a convex hull structure, the protruding portion 140 may be a stepped convex hull as shown in FIG. 3 or a non-stepped convex hull (not shown).

It should be noted that the number of the protrusions 140 is exemplified by two, but not limited thereto. In other embodiments, the number of the protrusions 140 may be adjusted to one or three according to the number of electronic wafers. More than one.

The material of the second heat dissipation layer 200 is, for example, graphite or graphene, and the heat dissipation coefficient of the second heat dissipation layer 200 is greater than the heat conduction coefficient of the first heat dissipation layer 100. The second heat dissipation layer 200 is stacked on the back surface 120 of the first heat dissipation layer 100.

The thickness of the second heat dissipation layer 200 is smaller than the thickness of the first heat dissipation layer 100. In this embodiment, the thickness ratio of the second heat dissipation layer 200 to the first heat dissipation layer 100 is less than 1/10. In addition, the second heat dissipation layer 200 may be stacked on the back surface 120 of the first heat dissipation layer 100 through a coating process or a sputtering process.

For example, the protrusion 140 of the first heat dissipation layer 100 is stamped and the second heat dissipation layer 200 is a coating process stacked on the back surface 120 of the first heat dissipation layer 100. In practice, the second heat dissipation layer may be used first. 200 is applied to the first heat dissipation layer before stamping, and the protrusion 140 of the first heat dissipation layer 100 is punched out. The protrusion 140 of the first heat dissipation layer 100 may be stamped first, and then the second heat dissipation layer 200 may be coated. The first heat dissipation layer 100 is disposed after stamping.

The heat dissipation plate 10 of the present embodiment and the conventional heat dissipation plate without the second heat dissipation layer 200 are actually tested. The test conditions are that the heat source generates heat of 20 watts (W), the ambient temperature is 25 degrees Celsius, and the heat sink size is 70 x 70 mm. (mm). The test result is that the temperature of the heat source with the heat sink of the conventional second heat dissipation layer 200 is as high as 118 degrees Celsius, and the temperature of the heat source with the heat sink 10 of the present embodiment is effectively reduced to 98 degrees Celsius. It can be seen from the test that the heat dissipation plate 10 of the embodiment can increase the heat dissipation effect by 15 to 20% compared with the conventional heat dissipation plate.

According to the heat dissipation plate disclosed in the above embodiment, the heat dissipation coefficient of the second heat dissipation layer is greater than the heat conduction coefficient of the first heat dissipation layer, so as to increase the heat dissipation effect of the heat dissipation plate, thereby effectively reducing the operating temperature of the electronic chip. .

Although the embodiments of the present invention are disclosed as described above, it is not intended to limit the present invention, and those skilled in the art can, without departing from the spirit and scope of the present invention, the shapes, structures, and features described in the scope of the present application. And the spirit of the invention is subject to change. Therefore, the scope of patent protection of the present invention is subject to the definition of the scope of the patent application attached to this specification.

10‧‧‧heating plate
100‧‧‧First heat sink
110‧‧‧Hot contact surface
120‧‧‧Back
130‧‧‧ Board Department
140‧‧‧protrusion
200‧‧‧second heat sink

1 is a perspective view of a heat dissipation plate according to a first embodiment of the present invention.

Figure 2 is a schematic cross-sectional view of Figure 1.

Figure 3 is a partial enlarged view of Figure 2.

100‧‧‧First heat sink

110‧‧‧Hot contact surface

120‧‧‧Back

130‧‧‧ Board Department

140‧‧‧protrusion

200‧‧‧second heat sink

Claims (4)

A heat dissipation plate comprising: a first heat dissipation layer having a thermal contact surface opposite to a back surface; and a back surface; and a second heat dissipation layer stacked on the back surface of the first heat dissipation layer, and the second heat dissipation layer The heat transfer coefficient is greater than the heat transfer coefficient of the first heat dissipation layer. The heat dissipation plate of claim 1, wherein the first heat dissipation layer comprises a plate body portion and at least one protrusion portion, the protrusion portion protrudes from the plate body portion, and the heat contact surface and the back surface are respectively located The projections and the body portion are opposite each other. The heat dissipation plate of claim 1, wherein the first heat dissipation layer is made of metal. The heat dissipation plate of claim 1, wherein the thickness of the second heat dissipation layer is smaller than the thickness of the first heat dissipation layer.