TWM644551U - Circuit board having heat-dissipating structure - Google Patents

Abstract

A circuit board with heat dissipation structure comprises a main board and at least one heat dissipation metal block fixed on the main board. The motherboard includes at least one electronic component that generates heat. The heat dissipation metal block is connected or contacted with the at least one electronic component, so as to dissipate heat from the at least one electronic component. Thereby, the heat dissipation efficiency of the circuit board can be improved.

Description

Circuit board with heat dissipation structure

The invention relates to a heat dissipation technology of a circuit element, in particular to a circuit board with a heat dissipation structure.

With the advancement of technology, electronic components (such as but not limited to integrated circuit chips) disposed on circuit boards need to have more powerful functions and higher performance. Powerful and efficient electronic components generate high heat during operation, so it is important to be able to effectively dissipate heat from these electronic components.

One way to dissipate heat is to stick a thermally conductive insulating sheet on the electronic components, but the thermal conductivity of the thermally conductive insulating sheet is not good, so that the heat energy generated by the electronic components cannot be effectively released.

Another way of heat dissipation is as shown in FIG. 1 , a heat dissipation copper bar 12 is arranged near the electronic component 11 of the circuit board 1 , and the heat convection of the air is used to dissipate heat to the electronic component 11 . However, the heat dissipation copper bars 12 are far away from the electronic components 11, so the heat dissipation effect is still limited.

Therefore, the main purpose of this invention is to provide a circuit board with a heat dissipation structure, thereby overcoming the problem of poor heat dissipation of the circuit board in the prior art.

To achieve the above purpose, a circuit board with a heat dissipation structure provided by an embodiment of the present invention includes: a main board, including at least one electronic component that generates heat; and at least one heat dissipation metal block, fixed on the main board and connected or contacted The at least one electronic component is used for dissipating heat from the at least one electronic component.

Optionally, the heat dissipation metal block includes a first surface, a second surface connected to the first surface, and a groove recessed from the first surface and the second surface, and the first surface and the second surface The surfaces face different directions, and a part of the electronic component enters the groove and connects or contacts at least a part of the inner surface of the groove.

Optionally, the heat dissipation metal block includes a first surface, a second surface connected to the first surface, and a groove recessed from the first surface and the second surface, and the first surface and the second surface The surface faces different directions, and the electronic component is provided with a heat dissipation metal part, and the heat dissipation metal part is accommodated in the groove and connected to or contacts at least a part of the inner surface of the groove.

Optionally, the heat dissipation metal part is independent from each signal pin of the electronic component.

Optionally, the number of the at least one heat dissipation metal block is singular, the number of the at least one electronic component is plural, and the heat dissipation metal block connects or contacts each of the electronic components.

Optionally, the quantity of the at least one heat dissipation metal block is plural, the quantity of the at least one electronic component is plural, and the heat dissipation metal blocks are respectively connected or contacted with the electronic components.

Optionally, the electronic component is an integrated circuit chip.

Optionally, the main board is a copper substrate or an aluminum substrate.

Optionally, the circuit board is suitable for being installed in a box body or a base body and dissipates heat through a heat dissipation bottom plate of the box body or the base body, and the heat dissipation metal block further includes a third surface connected to the first surface , the first surface and the third surface face different directions, and the third surface faces the heat dissipation bottom plate.

Optionally, the third surface of the heat dissipation metal block is close to, connected to or in contact with the heat dissipation bottom plate.

With the above-mentioned heat dissipation metal blocks that can be connected or contacted with electronic components, the heat dissipation effect of the circuit board provided by the invention can be greatly improved.

1: circuit board

11: Electronic components

12: Heat dissipation copper strip

2: circuit board

21: Motherboard

22: heat dissipation metal block

221: first surface

222: second surface

223: The third surface

224: Groove

225: The first groove surface

226: Second groove surface

23: Electronic components

231: signal pin

232: Heat dissipation metal parts

24,25: Solder

3: heat dissipation bottom plate

After studying the detailed description in conjunction with the following drawings, other aspects of the invention and its advantages will be found: FIG. 1 is a top view of a circuit board in the prior art; FIG. 2 is a schematic diagram of a heat dissipation metal block according to an embodiment of the invention ; FIG. 3 is a schematic diagram of a circuit board with the heat dissipation metal block of FIG. 2 according to an embodiment of the present creation; FIG. 4 is a side view of the circuit board of FIG. 3 ; schematic diagram.

Please refer to FIG. 2 to FIG. 4 , the circuit board 2 provided by an embodiment of the invention has a heat dissipation structure to improve the heat dissipation effect. The circuit board 2 includes, for example but not limited to, a main board 21 and a heat dissipation metal block 22 .

The motherboard 21 includes a plurality of electronic components 23 that generate heat. The type of the motherboard 21 is, for example but not limited to, a copper substrate or an aluminum substrate. The type of electronic component 23 is, for example but not limited to, an integrated circuit chip.

The heat dissipation metal block 22 can be fixed on the main board 21 through the solder 24 and can contact or connect a part of the electronic component 23 to dissipate heat to the electronic component 23 . For example, the heat dissipation metal block 22 includes a first surface 221, a second surface 222 connected to the first surface 221, a third surface 223 connected to the first surface 221, and a recess formed by the first surface 221 and the second surface 222. into one groove 224 . The first surface 221 and the second surface 222 face different directions, and the first surface 221 and the third surface 223 also face different directions. Specifically, the first surface 221 is for example but not limited to facing the electronic component 23 , the second surface 222 is for example but not limited to facing the motherboard 21 , and the third surface 223 is for example but not limited to facing the second surface 222 .

A portion of the electronic component 23 enters the groove 224 and contacts or connects at least a portion of the inner surface of the groove 224 . In this embodiment, in addition to one or more signal pins 231, the electronic component 23 also has a heat dissipation metal piece 232 independent of each signal pin 231. The signal pins 231 and the heat dissipation metal piece 232 are for example but not limited to Fixed on the motherboard 21 through the solder 24, the heat dissipation metal part 232 is for example but not limited to at least a part of the inner surface of the groove 224 connected through the solder 25 (such as but not limited to the first groove surface 225 and the second groove surface 226 of the groove 224 ). The first groove surface 225 and the second groove surface 226 are connected and have different orientations. Therefore, the heat dissipation metal part 232 can be accommodated in the groove 224 . However, the invention is not limited to this embodiment. In other embodiments, the heat dissipation metal piece 232 can be omitted for the electronic component 23 and the heat dissipation metal block 22 can be contacted by other parts of the electronic component 23 except the signal pin 231; or, the heat dissipation metal block 22 can omit the groove 224, The electronic component 23 can also omit the heat dissipation metal piece 232 , and instead, the first surface 221 of the heat dissipation metal block 22 contacts other parts of the electronic component 23 except the signal pin 231 . The first groove surface 225 is for example but not limited to facing the motherboard 21 , and the second groove surface 226 is for example but not limited to facing the electronic component 23 .

In this creation, the number of heat dissipation metal blocks 22 can be changed to more than two.

In this invention, the number of electronic components 23 can also be changed to only one.

In this embodiment, one heat dissipation metal block 22 can correspond to a plurality of electronic components 23, and the heat dissipation metal block 22 takes away each electronic component by connecting or contacting each electronic component 23. The thermal energy generated by part 23. However, the invention is not limited to this embodiment. In other embodiments, one heat dissipation metal block 22 corresponds to only one electronic component 23 , and the heat dissipation metal block 22 removes heat energy generated by the electronic component 23 by connecting or contacting the corresponding electronic component 23 .

In addition, please refer to FIG. 5 , the circuit board 2 of the present invention is also suitable to be installed in a box or a base (not shown) and dissipate heat through a heat dissipation bottom plate 3 of the box or base. The third surface 223 of the heat dissipation metal block 22 on the motherboard 21 is facing the heat dissipation bottom plate 3 and contacts the heat dissipation bottom plate 3 . However, the invention is not limited to this embodiment. In other embodiments, the third surface 223 of the heat dissipation metal block 22 can be changed to be close to the heat dissipation base plate 3 without touching it, or to be connected to the heat dissipation base plate 3 through other elements (such as but not limited to thermally conductive insulating sheets).

Although the invention is disclosed above with the aforementioned embodiments, these embodiments are not intended to limit the invention. Without departing from the spirit and scope of this creation, all changes, modifications, and combinations of implementation forms are within the scope of patent protection of this creation. For the scope of protection defined by this creation, please refer to the attached scope of patent application.

2: circuit board

21: Motherboard

22: heat dissipation metal block

221: first surface

222: second surface

223: The third surface

224: Groove

225: The first groove surface

226: Second groove surface

23: Electronic components

232: Heat dissipation metal parts

24,25: Solder

Claims (10)

A circuit board with a heat dissipation structure, comprising: a main board, including at least one electronic component that generates heat; and at least one heat dissipation metal block, fixed on the main board and connected to or in contact with the at least one electronic component, for controlling the at least one electronic component Components dissipate heat. The circuit board with heat dissipation structure according to claim 1, wherein the heat dissipation metal block includes a first surface, a second surface connected to the first surface, and a recessed surface from the first surface and the second surface The groove, the first surface and the second surface face in different directions, a part of the electronic component enters the groove and connects or contacts at least a part of the inner surface of the groove. The circuit board with heat dissipation structure according to claim 1, wherein the heat dissipation metal block includes a first surface, a second surface connected to the first surface, and a recessed surface from the first surface and the second surface In the groove, the first surface and the second surface face in different directions, and the electronic component is provided with a heat dissipation metal part, and the heat dissipation metal part is accommodated in the groove and connected to at least a part of the inner surface of the groove. The circuit board with heat dissipation structure according to claim 3, wherein the heat dissipation metal part is independent from each signal pin of the electronic component. According to the circuit board with heat dissipation structure described in claim 1, the number of the at least one heat dissipation metal block is singular, the number of the at least one electronic component is plural, and the heat dissipation metal block connects or contacts each of the electronic components. According to the circuit board with heat dissipation structure described in claim 1, the number of the at least one heat dissipation metal block is plural, the number of the at least one electronic component is plural, and the scattered Hot metal blocks connect or contact the electronic components respectively. The circuit board with a heat dissipation structure according to claim 1, wherein the electronic component is an integrated circuit chip. According to the circuit board with heat dissipation structure described in Claim 1, wherein the main board is a copper substrate or an aluminum substrate. According to the circuit board with heat dissipation structure described in claim 2 or 3, wherein the circuit board is suitable for being installed in a box body or a seat body and dissipates heat through a heat dissipation bottom plate of the box body or the seat body, and the heat dissipation metal The block further includes a third surface connected to the first surface, the first surface and the third surface face different directions, and the third surface faces the heat dissipation bottom plate. The circuit board with heat dissipation structure according to claim 9, wherein the third surface of the heat dissipation metal block is close to, connected to or in contact with the heat dissipation bottom plate.

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