TWI818284B - Heat dissipation device - Google Patents

Abstract

The present invention provides a heat dissipation device, comprising: a vapor chamber unit including a bottom portion and two side portions located on the opposite side of the bottom portion; a base provided on the bottom portion of the vapor chamber unit between the two side portions; and a plurality of locking elements provided at the corners of the base respectively; wherein the two side portions for providing a deformation resistance after the locking elements providing on the base.

Description

Cooling device

The invention relates to the field of heat dissipation, and in particular to a heat dissipation device.

In response to modern needs, computers and various electronic devices are developing rapidly and their performance is constantly improving. However, in the process, heat dissipation problems caused by high-performance hardware also arise. Generally speaking, computers and various electronic devices usually use heat dissipation components to dissipate heat. For example, thermal paste or heat sinks are attached to the electronic components to be dissipated to absorb the heat and dissipate it. However, the effectiveness of this heat dissipation method is limited, so other heat dissipation components that can promote heat conduction have been developed.

When existing heat dissipation components are used in a heat source, they often must be fixed and installed through fasteners. However, during the locking process of the fasteners on the corners of the heat dissipation component, as the performance of new generation chips increases, the number of pins continues to increase. As the pressure increases, the pressure required for the chip becomes higher and higher, causing the overall heat dissipation component to become more and more deformed and bent. This not only prevents the components of the heat dissipation element from being accurately assembled, but also affects the original heat dissipation performance of the heat dissipation element.

Therefore, how to provide a heat dissipation device that can solve the above problems is one of the issues that the industry needs to overcome urgently.

The main purpose of the present invention is to provide a heat dissipation device, which includes: a vapor chamber unit, including a bottom and two side parts located on opposite sides of the bottom; a base located on the bottom of the vapor chamber unit, And is located between the two side parts; and a plurality of fasteners are respectively provided at the corners of the base; wherein, the two side parts are used to provide the anti-deformation force of the plurality of fasteners after they are pressed against the base.

As in the aforementioned heat dissipation device, the bottom and the two side parts are integrally formed.

As in the aforementioned heat dissipation device, the two side parts are welded to opposite sides of the bottom.

As in the aforementioned heat dissipation device, cavities communicating with each other are formed in the bottom and the two sides.

As in the aforementioned heat dissipation device, the two side portions are perpendicular to the bottom, so that the vapor chamber unit presents a U shape.

As in the aforementioned heat dissipation device, the two side portions are respectively located on the connection line between the plurality of fasteners located on the same side of the base.

As in the aforementioned heat dissipation device, it further includes a heat dissipation fin set, which is disposed on the base and contacts the bottom through the opening of the base, and is located between the two sides.

As in the aforementioned heat dissipation device, the heat dissipation fin set includes a first fin set and two second fin sets located on opposite sides of the first fin set, and the base includes two seats and The two beam parts are disposed between the two seat parts and together with the two seat parts form the opening.

As in the aforementioned heat dissipation device, the first fin set is in contact with the bottom through the opening and is partially provided on the two base parts, and the two second fin sets are respectively provided on the two beam parts and are respectively in contact with the two sides.

As in the aforementioned heat dissipation device, the fin arrangement direction of the first fin group is different from the fin arrangement direction of the two second fin groups.

As mentioned above, the heat dissipation device further includes a metal block unit for placing the bottom of the vapor chamber unit on it.

As in the aforementioned heat dissipation device, the metal block unit is made of copper.

As in the aforementioned heat dissipation device, the material of the vapor chamber unit is stainless steel, aluminum or copper.

1: Cooling device

10:Vapor chamber unit

101: Bottom

102,102’: Side

103: Chamber

104:On the board

105: Lower board

11: base

111:Zabu

112,112’: Liang Department

113:Open your mouth

121,122,123,124:Locks

13: Cooling fin set

131:First fin group

132,132’: Second fin group

14:Metal block unit

F: force

F’: reaction force

T: Tension

FIG. 1 is an exploded schematic diagram of an embodiment of the heat dissipation device of the present invention.

FIG. 2 is an overall schematic diagram of an embodiment of the heat dissipation device of the present invention.

FIG. 3 is an exploded schematic diagram of another embodiment of the heat dissipation device of the present invention.

FIG. 4 is a schematic diagram of another embodiment of the vapor chamber unit in the heat dissipation device of the present invention.

Figure 5 is a schematic diagram of the application of the heat dissipation device of the present invention.

Figure 6 is an exploded schematic diagram of the vapor chamber unit in Figure 1.

The following describes the implementation of the present invention through specific embodiments, and those familiar with the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification, and can also use other different specific embodiments. carry out or apply.

Please refer to FIGS. 1 and 2 at the same time. The heat dissipation device 1 of the present invention includes a vapor chamber unit 10 , a base 11 and a plurality of fasteners 121 , 122 , 123 , and 124 . The vapor chamber unit 10 has a bottom 101 and two side portions 102, 102' located on opposite sides of the bottom 101. In this embodiment, the bottom 101 and the two side portions 102 and 102' of the vapor chamber unit 10 are integrally formed. For example, the two sides of the originally flat vapor chamber can be bent to form the two side portions 102 and 102. ', the unbent part forms the bottom 101, and the two side parts 102 and 102' are perpendicular to the bottom 101, so that the entire vapor chamber unit 10 can present a U shape, and after bending, the bottom 101 and the two side parts 102 , 102' is still formed with interconnected chambers 103 (as shown in Figure 6, the vapor chamber unit 10 can be It consists of an upper plate 104 and a lower plate 105. The lower plate 105 has a groove to serve as a chamber 103 after joining the upper plate 104), and the chamber 103 can be provided with a capillary structure and filled with working liquid to make the vapor chamber unit 10Have high thermal conductivity.

The base 11 is provided on the bottom 101 of the vapor chamber unit 10 and is located between the two sides 102 and 102'. Specifically, the base 11 may include two seat portions 111 and two beam portions 112 and 112'. The two ends of each of the two beam portions 112 and 112' are respectively provided on the two ends of the two seat portions 111, so that the two beams can The two seat portions 112 and 112' are located between the two seat portions 111, and the two seat portions 111 and the two beam portions 112 and 112' together form an opening 113. In this embodiment, the base 11 is mainly located on and in contact with the bottom 101 of the vapor chamber unit 10 through the two beam portions 112 and 112', and the two seat portions 111 are located on the bottom 101 of the vapor chamber unit 10. The front and rear ends are not in contact with the top surface of the bottom 101 toward the second beam portion 112, 112', but the invention is not limited thereto. After the base 11 is placed on the vapor chamber unit 10, the side surfaces of the two beam portions 112 and 112' will contact the two side portions 102 and 102' of the vapor chamber unit 10.

A plurality of fasteners 121, 122, 123, and 124 are respectively provided at the corners of the base 11. Specifically, the fasteners 121, 122, 123, and 124 are mainly provided at the two ends of each seat portion 111, and the beam portion 112 is located on the connection line between the fasteners 121 and 122. Similarly, the beam portion 112' is also located on the connecting line between the fasteners 123 and 124. In this way, the side portion 102 adjacent to the beam portion 112 will also be located on the connection line of the fasteners 121 and 122 on the same side of the base 11, and the side portion 102' adjacent to the beam portion 112' can also be located on the connection line of the fasteners 121 and 122 on the same side of the base 11. On the connection line between the fasteners 123 and 124 on the other side of the base 11 .

As shown in FIG. 5 , when the heat dissipation device 1 of the present invention is used, the action force F and the reaction force F′ generated by pressing the fasteners 121 and 122 on the base 11 can be provided by the side portion 102 as a tensile force T as a resistance force. The deformation force is used to offset the deformation and bending phenomenon that may occur in the heat dissipation device 1, so as to avoid the problem that the components in the heat dissipation device cannot be precisely assembled and affect the original heat dissipation performance.

In this embodiment, the heat dissipation device 1 of the present invention may further include a heat dissipation fin set 13. The heat dissipation fin set 13 may be disposed on the base 11 and contact the bottom 101 through the opening 113, and the entire heat dissipation fin set 13 is located on the two sides 102, between 102'. Specifically, the heat dissipation fin set 13 includes a first fin set 131 and two second fin sets 132, 132' disposed on opposite sides of the first fin set 131. The first fin set 131 contacts the bottom 101 through the opening 113, and the parts of the first fin set 131 that are not in contact with the bottom 101 are respectively provided on the two seats 111, so that the first fin set 131 is located on the two beams. between parts 112 and 112'. In addition, the two second fin groups 132 and 132' are provided on the two beam parts 112 and 112' and are in contact with the two side parts 102 and 102' respectively.

In this embodiment, the heat dissipation fin set 13 is used to dissipate heat from the working fluid in the vapor chamber unit 10. As the bottom 101 and sides 102, 102' of the vapor chamber unit 10 move in the installation direction, Differently, the fin arrangement directions of the first fin group 131 and the second fin group 132, 132' located relatively on the bottom 101 and the side portions 102, 102' are also different. For example, the fin arrangement direction of the first fin group 131 is perpendicular to the bottom 101, while the fin arrangement direction of the second fin group 132, 132' is parallel to the bottom 101 but perpendicular to the sides 102, 102', so that It is beneficial to the heat dissipation of the bottom 101 and the side parts 102 and 102' in different directions.

Please refer to FIG. 3 , which shows another embodiment of the heat dissipation device of the present invention. The difference between the embodiment of Figure 3 and the aforementioned embodiment of Figure 1 lies in the addition of a metal block unit 14. The metal block unit 14 is used for the bottom 101 of the vapor chamber unit 10 to be placed on it, so that the vapor chamber unit 10 The heat conduction between the heat source and the heat source can be smoother. In this embodiment, the material of the metal block unit 14 may be copper, but the invention is not limited thereto.

Please refer to FIG. 4 , which shows another embodiment of the vapor chamber unit 10 in the heat dissipation device of the present invention. Unlike the aforementioned vapor chamber unit 10 which is integrally formed and the bottom 101 and side portions 102 and 102' are formed by bending a flat vapor plate, the bottom 101 of the vapor chamber unit 10 of this embodiment is originally flat. shape, and the side parts 102 and 102' are components different from the bottom 101, and are provided on the opposite sides of the bottom 101 through welding, so that the entire vapor chamber unit 10 can also present a U shape. In addition, whether it is welded or bent Process, the bottom 101 and the two side parts 102, 102' still form a cavity that communicates with each other, and a capillary structure can be provided in the cavity and filled with working liquid, so that the vapor chamber unit 10 has high thermal conductivity.

In one embodiment, the material of the vapor chamber unit 10 can be stainless steel, aluminum or copper, but the invention is not limited thereto.

In one embodiment, the vapor chamber unit 10, the base 11 and the heat dissipation fin set 13 in the heat dissipation device 1 of Figure 1 can be assembled together through a welding process. Similarly, the vapor chamber unit 10, the base 11, the heat dissipation fin set 13 and the metal block unit 14 in the heat dissipation device 1 of Figure 3 can also be assembled together through a welding process. However, the present invention is not limited to the above process.

In summary, through the design of the vapor chamber unit in the heat dissipation device of the present invention with two sides, the force generated when the plurality of fasteners are pressed against the base can be reduced, and the force generated by the plurality of fasteners at the corners of the base can be reduced The acting force at the base and the reaction force at other places on the base are offset by the tensile force generated by the two sides as the anti-deformation force. Therefore, the possible deformation and bending phenomenon that may occur in the entire heat dissipation device can be overcome. , to avoid the problem that the components in the heat dissipation device cannot be precisely assembled and affect the original heat dissipation performance.

The above embodiments are only for illustrating the technical principles, characteristics and effects of the present invention, and are not intended to limit the scope of the present invention. Anyone familiar with this technology can implement the present invention without violating the spirit and scope of the present invention. Modifications and changes are made to the above embodiments. However, any equivalent modifications and changes accomplished by applying the teachings of the present invention should still be covered by the following patent application scope. The scope of protection of the rights of the present invention shall be as listed in the following patent application scope.

1: Cooling device

10:Vapor chamber unit

101: Bottom

102,102’: Side

11: base

111:Zabu

112,112’: Liang Department

113:Open your mouth

121,122,123,124:Locks

13: Cooling fin set

131:First fin group

132,132’: Second fin group

Claims (12)

A heat dissipation device, including: a vapor chamber unit, including a bottom and two side parts located on opposite sides of the bottom; a base, located on the bottom of the vapor chamber unit, and located between the two sides between; a plurality of fasteners are respectively provided at the corners of the base; and a heat dissipation fin set is provided on the base and contacts the bottom through the opening of the base, and is located between the two sides ; Among them, the two side parts are used to provide the anti-deformation force after the plurality of fasteners are pressed against the base. The heat dissipation device according to claim 1, wherein the bottom and the two side parts are integrally formed. The heat dissipation device as claimed in claim 1, wherein the two side parts are welded to opposite sides of the bottom. The heat dissipation device according to claim 1, wherein the bottom and the two sides are formed with cavities communicating with each other. The heat dissipation device according to claim 1, wherein the two side parts are perpendicular to the bottom, so that the vapor chamber unit presents a U shape. The heat dissipation device according to claim 1, wherein the two side portions are respectively located on the connection line between the fasteners located on the same side of the base. The heat dissipation device of claim 1, wherein the heat dissipation fin set includes a first fin set and two second fin sets located on opposite sides of the first fin set, and the base It includes two seat parts and two beam parts arranged between the two seat parts to form the opening together with the two seat parts. The heat dissipation device as claimed in claim 7, wherein the first fin set is in contact with the bottom through the opening and is partially provided on the two seats, and the two second fin sets are respectively provided on the two seats. The beam portion is in contact with the two side portions respectively. The heat dissipation device of claim 7, wherein the fin arrangement direction of the first fin group is different from the fin arrangement direction of the two second fin groups. The heat dissipation device as claimed in claim 1 further includes a metal block unit for placing the bottom of the vapor chamber unit on it. The heat dissipation device according to claim 10, wherein the metal block unit is made of copper. The heat dissipation device according to claim 1, wherein the material of the vapor chamber unit is stainless steel, aluminum or copper.

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