CN216163097U

CN216163097U - Heat sink device

Info

Publication number: CN216163097U
Application number: CN202122025108.4U
Authority: CN
Inventors: 陈建佑; 叶恬利
Original assignee: Anhui Weihong Electronic Technology Co ltd
Current assignee: Anhui Weihong Electronic Technology Co ltd
Priority date: 2020-09-29
Filing date: 2021-08-25
Publication date: 2022-04-01
Anticipated expiration: 2031-08-25
Also published as: CN215991705U; TWM617977U; CN215774001U; TW202213030A; CN216146638U; TWM622861U; TWI818284B; TWM623902U; TWM622843U

Abstract

The utility model provides a heat dissipation device. The heat dissipation device is used for the memory modules in parallel in a plurality of rows and comprises at least one channel unit attached to one surface of the memory module; a first box unit provided at one end of the passage unit and having a first opening; the second box body unit is arranged at the other end of the channel unit and is provided with a second opening; the first box unit, the second box unit and the channel unit are filled with working fluid for absorbing heat energy generated by the storage module and flowing out of the heat sink for cooling.

Description

Heat sink device

Technical Field

The present invention relates to a heat dissipation device, and more particularly, to a heat dissipation device for multiple rows of parallel memory modules.

Background

According to modern requirements, computers and various electronic devices are rapidly developed and the performance thereof is continuously improved, but in the process, the heat dissipation problem caused by high-performance hardware is also followed. Generally, computers and various electronic devices usually use heat dissipation elements to dissipate heat, such as heat dissipation paste or heat dissipation fins to attach to electronic components to be dissipated, so as to draw out and dissipate heat.

The existing storage module adopts a water cooling scheme for solving the problem that high power is difficult to dissipate heat, but because the distance between the storage modules is narrow (for example, only 7mm), a water pipe of the water cooling scheme is difficult to penetrate, and the problem that a user is difficult to install is solved. In addition, for the convenience of mounting, the design of single-sided mounting of the memory module is adopted, but the problem of insufficient heat dissipation area of the single-sided heat dissipation technology is caused.

Therefore, how to provide a heat dissipation device capable of solving the above problems is one of the issues to be overcome in the present industry.

SUMMERY OF THE UTILITY MODEL

It is an object of the present invention to provide a heat sink that overcomes at least some of the problems of the prior art.

The heat sink of the utility model, is used for the multirow parallel memory module, the heat sink includes: at least one channel unit attached to one surface of the memory module; a first box unit provided at one end of the passage unit and having a first opening; the second box body unit is arranged at the other end of the channel unit and is provided with a second opening; the channel unit is communicated with the first box body unit and the second box body unit, working fluid is filled in the first box body unit, the second box body unit and the channel unit, the working fluid in the channel unit flows out through the second box body unit and the second opening and is cooled after absorbing heat energy generated by the storage module, and the cooled working fluid flows back into the channel unit through the first opening and the first box body unit.

The heat dissipation device further includes at least one heat conduction unit disposed between the channel unit and the memory module.

In the foregoing heat dissipation device, the number of the heat conducting units is two, and the two heat conducting units are respectively attached to two opposite surfaces of the memory module.

In the foregoing heat dissipation device, the heat conducting unit includes at least one heat dissipation pad, at least one heat separation plate, and at least one clamping unit, the heat separation plate is disposed on the storage module, the heat dissipation pad is disposed on the heat separation plate, and the clamping unit is configured to clamp the heat separation plate on the storage module.

In the heat dissipating device, the heat separating plate has a trapezoidal cross section.

In the above heat dissipation device, the first box unit has at least one first channel opening corresponding to the cross section of the channel unit, and the second box unit has at least one second channel opening corresponding to the cross section of the channel unit.

In the above heat dissipation device, the first channel opening and the second channel opening are respectively disposed on the bottom surfaces of the first box unit and the second box unit, and the first opening and the second opening are respectively disposed on the side surfaces of the first box unit and the second box unit.

In an embodiment, the heat dissipation device further includes a first joint unit and a second joint unit respectively disposed in the first opening and the second opening.

In the foregoing heat dissipation device, the channel units are attached to the opposite surfaces of the memory modules in different rows, and the number of the channel units is greater than that of the memory modules.

In the above heat dissipation device, the channel unit has a plurality of capillary channels therein, which are communicated with the first case unit and the second case unit.

In the heat dissipating device, the channel unit has a rectangular cross section with a width of 1.5mm and a height of 20mm, and one of the capillary channels has a rectangular cross section with a width of 0.76mm and a height of 0.72 mm.

The heat dissipation device has the advantages that the channel unit is simultaneously attached to the two opposite surfaces of the storage module, and the plurality of capillary channels in the channel unit can effectively absorb heat energy generated by the attached storage module and effectively improve the heat dissipation efficiency.

Drawings

Fig. 1 is an overall schematic view of the heat dissipation device of the present invention.

Fig. 2 is an exploded view of the heat dissipation device of the present invention.

Fig. 3 is a schematic cross-sectional view taken along line a-a in fig. 1.

Fig. 4 is an enlarged cross-sectional view of fig. 3 showing only two thermal separators.

Fig. 5 is an enlarged cross-sectional view showing only the channel unit in fig. 3.

The reference numbers are as follows:

10 channel unit

101 capillary channel

11 first housing unit

111 first opening

112 first passage opening

113 first cover

114 first case

12 second housing unit

121 second opening

122 second channel opening

123 second cover body

124: second box body

13, 13' heat conducting unit

131, 131' heat dissipation pad

132,132' thermal separating board

1321 inclined plane

133, 133' clamping unit

14 first bamboo joint head unit

15 second bamboo joint head unit

2, 2' storage module

3, 3' storage slot

W1, W2 width

H1, H2 high

Detailed Description

While the embodiments of the present invention are described below with reference to specific embodiments, other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein, and may be implemented or applied by other different embodiments.

Referring to fig. 1 and 2, the heat dissipation device of the present invention is applied to a plurality of rows of parallel storage modules 2, and includes at least one channel unit 10, a first box unit 11, a second box unit 12, a first bamboo joint unit 14, and a second bamboo joint unit 15. The channel unit 10 is attached to one surface of the memory module 2, the first case unit 11 is disposed at one end of the channel unit 10, and the second case unit 12 is disposed at the other end of the channel unit 10. In addition, the memory module 2 may be inserted into the memory slot 3.

In this embodiment, as shown in fig. 5, which is an enlarged cross-sectional view of the channel unit 10, the channel unit 10 has a plurality of capillary channels 101 extending along a length direction thereof, the plurality of capillary channels 101 may be a plurality of elongated grooves penetrating the channel unit 10 and used for connecting opposite ends of the first case unit 11 and the second case unit 12, and the structure of the capillary channels 101 has a function of a reinforcing structure, which can reinforce the structure of the channel unit 10, so that the channel unit 10 having the capillary channels 101 therein can bear a larger burst pressure than a general channel unit having no capillary channels therein. In one embodiment, the channel unit 10 may have an approximately rectangular cross section with a width W1 of 1.5mm and a height H1 of 20mm, and the capillary channel 101 may have an approximately rectangular cross section with a width W2 of 0.76mm and a height H2 of 0.72 mm. In addition, the thickness of the space between the capillary channels 101 may be 0.28mm, and the thickness of the capillary channel 101 from the outer surface of the channel unit 10 may be 0.37mm, but the present invention is not limited thereto.

The first case unit 11 may be formed by combining a first case 114 and a first cover 113, and the combined first case 114 and first cover 113 may form a chamber for containing a working fluid therein. The bottom surface of the first box 114 has at least one first channel opening 112, and the side surface of the first box 114 has a first opening 111. In one embodiment, the number of the first channel openings 112 can match the number of the channel units 10, and the opening shape of the first channel openings 112 conforms to the cross section of the channel units 10, so that the channel units 10 can be engaged with and seal the first channel openings 112. In addition, the first opening 111 is for the first bunchy head unit 14 to engage and seal.

The second case unit 12 may be formed by combining a second case 124 and a second cover 123, and the combined second case 124 and second cover 123 may form a chamber for containing a working fluid therein. The bottom surface of the second casing 124 has at least one second passage opening 122, and the side surface of the second casing 124 has a second opening 121. In an embodiment, the number of the second channel openings 122 may match the number of the channel units 10, and the opening shape of the second channel openings 122 conforms to the cross section of the channel units 10, so that the channel units 10 can be engaged with and seal the second channel openings 122. In addition, the second opening 121 is for the second bunchy head unit 15 to engage and seal.

Since the two ends of the channel unit 10 are connected to the first housing unit 11 and the second housing unit 12, respectively, the plurality of capillary channels 101 can communicate with the first housing unit 11 and the second housing unit 12. The working fluid filled in the first and

second case units

11 and 12 may flow into the capillary passage 101 to absorb the heat energy generated from the storage module 2. The first and second

joint units

14 and 15 can guide the working fluid to the outside of the heat dissipation device through a tube for heat dissipation, for example, a heat dissipation fan is installed on the tube. The working fluid in the tube, the first box unit 11, the second box unit 12 and the channel unit 10 can form a unidirectional circulation, for example, after the working fluid in the capillary channel 101 absorbs the heat energy generated by the storage module 2, the working fluid can flow out to the tube through the second box unit 12 and the second joint unit 15 on the second opening 121 for cooling, and the cooled working fluid flows back to the capillary channel 101 from the tube through the first joint unit 14 on the first opening 111 and the first box unit 11 for the next heat dissipation circulation.

In the present embodiment, at least one heat conducting unit 13 may be disposed between the channel unit 10 and the memory module 2 for increasing the heat dissipation efficiency. The heat conducting unit 13 includes at least one heat dissipation pad 131, at least one heat separation plate 132, and at least one clamping unit 133, the heat separation plate 132 is disposed on the storage module 2, the clamping unit 133 is used to clamp the heat separation plate 132 on the storage module 2, and the heat dissipation pad 131 may be disposed on the heat separation plate 132. In one embodiment, as shown in fig. 3, the number of the heat dissipation pads 131 and the heat separation plates 132 may be two, and the heat dissipation pads and the heat separation plates are respectively disposed on two opposite surfaces of the memory module 2, and the number of the clamping units 133 may also be two, and the clamping units are respectively clamped on two opposite ends of a long side of the memory module 2.

In an embodiment, the thermal separation plate 132 is a thin aluminum extrusion and has a single-side inclined structure, for example, the cross section of the thermal separation plate 132 may be trapezoidal, as shown in fig. 4, and the inclined surface 1321 of the trapezoidal shape is the opposite side of the thermal separation plate 132 to which the memory module 2 is attached, which allows the thermal pad 131 to have an inclined surface after being attached to the thermal separation plate 132, so that a user can plug and unplug the memory module 2 (which can be plugged and unplugged together with the thermal separation plate 132 or the heat conducting unit 13) without being hindered by the channel unit 10, thereby further facilitating plugging and unplugging.

In one embodiment, as shown in fig. 3, when there are a plurality of rows of parallel memory modules 2,2 'and slots 3, 3', the channel units 10 disposed between different rows of parallel memory modules 2,2 'can be attached to the opposite surfaces of the memory modules 2, 2' at the same time. More specifically, the channel unit 10 may be attached to the heat dissipation pads 131,131 'of the heat conduction units 13, 13' on the opposite surfaces of the storage modules 2,2 'at the same time, so that the working fluid in the channel unit 10 may absorb the heat energy generated from the different storage modules 2, 2' at the same time. In addition, in order to attach the channel units 10 to the opposite surfaces of the memory modules 2 and 2 'in parallel, the number of the channel units 10 may be greater than the number of the memory modules 2 and 2', for example, the number of the memory modules shown in fig. 3 is 8, and the number of the channel units 10 is 9, but the utility model is not limited thereto.

In summary, with the design of the channel unit of the heat dissipation device of the present invention being attached to two opposite surfaces of the memory module at the same time, the plurality of capillary channels in the channel unit can effectively absorb the heat energy generated by the attached memory module, and can effectively increase the heat dissipation efficiency. In addition, each element of the heat dissipation device is in a modular design, different numbers of channel units can be arranged according to actual requirements, and replacement and maintenance are convenient. In addition, the design of the inclined surface of the thermal partition plate in the heat dissipation device allows the heat dissipation pad not to be damaged and to be repeatedly plugged when the storage module is plugged, and the heat dissipation pad can absorb assembly tolerance and ensure effective contact between the channel unit and the storage module.

The above embodiments are merely illustrative of the technical principles, features and effects of the present invention, and are not intended to limit the scope of the present invention, and those skilled in the art can modify and change the above embodiments without departing from the spirit and scope of the present invention. It is intended that the following claims cover all such modifications and changes as fall within the true spirit and scope of the utility model. Rather, the scope of the utility model is as set forth in the following claims.

Claims

1. A heat sink for a plurality of rows of memory modules in parallel, the heat sink comprising:

at least one channel unit attached to one surface of the memory module;

a first box unit provided at one end of the passage unit and having a first opening; and

the second box body unit is arranged at the other end of the channel unit and is provided with a second opening;

the channel unit is communicated with the first box body unit and the second box body unit, working fluid is filled in the first box body unit, the second box body unit and the channel unit, the working fluid in the channel unit is used for absorbing heat energy generated by the storage module and flows out through the second box body unit and the second opening for cooling, and the cooled working fluid flows back into the channel unit through the first opening and the first box body unit.

2. The heat dissipating device of claim 1, further comprising at least one heat conducting unit disposed between the channel unit and the memory module.

3. The heat dissipating device of claim 2, wherein the number of the heat conducting units is two, and the two heat conducting units are respectively attached to two opposite surfaces of the memory module.

4. The heat dissipating device of claim 2, wherein the heat conducting unit comprises at least one heat dissipating pad, at least one heat separating plate and at least one clamping unit, the heat separating plate is disposed on the memory module, the heat dissipating pad is disposed on the heat separating plate, and the clamping unit is used for clamping the heat separating plate on the memory module.

5. The heat dissipating device of claim 4, wherein the thermal separator plate has a trapezoidal cross-section.

6. The heat dissipating device of claim 1, wherein the first case unit has at least one first passage opening corresponding to a cross section of the passage unit, and the second case unit has at least one second passage opening corresponding to a cross section of the passage unit.

7. The heat dissipating device of claim 6, wherein the first opening and the second opening are disposed on the bottom of the first housing unit and the second housing unit, respectively, and the first opening and the second opening are disposed on the side of the first housing unit and the second housing unit, respectively.

8. The heat dissipation device of claim 6, further comprising a first joint unit and a second joint unit disposed in the first opening and the second opening, respectively.

9. The heat dissipating device of claim 1, wherein the number of the channel units is plural, so as to be attached to the opposite surfaces of the memory modules arranged in parallel in different rows at the same time, and the number of the channel units is larger than that of the memory modules.

10. The heat dissipating device of claim 1, wherein the channel unit has a plurality of capillary channels therein communicating the first housing unit and the second housing unit.

11. The heat dissipating device of claim 10, wherein the channel unit has a rectangular cross-section with a width of 1.5mm and a height of 20mm, and one of the plurality of capillary channels has a rectangular cross-section with a width of 0.76mm and a height of 0.72 mm.