CN215774001U

CN215774001U - Heat sink device

Info

Publication number: CN215774001U
Application number: CN202121613840.7U
Authority: CN
Inventors: 陈志伟; 张正儒
Original assignee: Chunhong Electronic Technology Chongqing Co ltd
Current assignee: Chunhong Electronic Technology Chongqing Co ltd
Priority date: 2020-09-29
Filing date: 2021-07-15
Publication date: 2022-02-08
Anticipated expiration: 2031-07-15
Also published as: TWM622861U; CN216163097U; CN216146638U; TWI818284B; TWM617977U; TWM622843U; TWM623902U; CN215991705U; TW202213030A

Abstract

The utility model provides a heat dissipation device. The heat dissipation device comprises a temperature-equalizing plate unit, a base and a plurality of locking pieces, wherein the temperature-equalizing plate unit comprises a bottom and two side parts positioned on two opposite sides of the bottom; the base is arranged on the bottom of the temperature-uniforming plate unit and is positioned between the two side parts; the locking pieces are respectively arranged at the corners of the base; the two side parts are used for providing deformation resistance after the plurality of locking parts are pressed on the base.

Description

Heat sink device

Technical Field

The utility model relates to the field of heat dissipation, in particular to a heat dissipation device.

Background

According to modern requirements, computers and various electronic devices are rapidly developed and the performance thereof is continuously improved, but in the process, the heat dissipation problem caused by high-performance hardware is also followed. Generally, computers and various electronic devices usually use heat dissipation elements to dissipate heat, such as heat dissipation paste or heat dissipation fins to attach to electronic components to be dissipated, so as to draw out and dissipate heat. However, such heat dissipation methods have limited effectiveness, and other heat dissipation elements have been developed to promote heat conduction.

When the existing heat dissipation element is applied to a heat source, the heat dissipation element is often fixedly installed through a locking piece, however, in the locking process of each corner end of the heat dissipation element, as the performance of a new generation chip is improved, the pin number is continuously increased, the required lower pressure pound force of the chip is higher and higher, and the deformation and bending conditions of the whole heat dissipation element are more and more serious. This not only makes each component of the heat dissipation device unable to be precisely assembled, but also affects the original heat dissipation efficiency of the heat dissipation device.

Therefore, how to provide a heat dissipation device capable of solving the above problems is one of the issues to be overcome in the present industry.

SUMMERY OF THE UTILITY MODEL

The utility model mainly aims to provide a heat dissipation device capable of improving the heat dissipation effect.

The heat dissipation device comprises a temperature-equalizing plate unit, a heat dissipation unit and a heat dissipation unit, wherein the temperature-equalizing plate unit comprises a bottom and two side parts positioned on two opposite sides of the bottom; the base is arranged on the bottom of the temperature-uniforming plate unit and positioned between the two side parts; and a plurality of locking pieces which are respectively arranged at the corners of the base; the two side parts are used for providing deformation resistance after the plurality of locking parts are pressed on the base.

In the above heat dissipating device, the bottom portion and the two side portions are integrally formed.

In the aforementioned heat dissipation device, the two side portions are welded to the two opposite sides of the bottom portion.

In the heat dissipation device, the bottom and the two side portions have cavities formed therein, which are communicated with each other.

In the aforementioned heat dissipation device, the two side portions are perpendicular to the bottom portion, so that the vapor chamber unit is U-shaped.

In the above heat dissipation device, the two side portions are respectively located on a connection line of the plurality of locking members disposed on the same side of the base.

In the aforementioned heat dissipation device, the heat dissipation device further includes a heat dissipation fin set disposed on the base, contacting the bottom through the opening of the base, and located between the two side portions.

In the above heat dissipation device, the heat dissipation fin set includes a first fin set and two second fin sets disposed on opposite sides of the first fin set, and the base includes two seat portions and two beam portions disposed between the two seat portions to form the opening together with the two seat portions.

In the aforementioned heat dissipation device, the first fin group is in contact with the bottom through the opening and is partially disposed on the two seat portions, and the two second fin groups are respectively disposed on the two beam portions and are in contact with the two side portions.

In the aforementioned heat dissipation device, the arrangement direction of the fins of the first fin group is different from the arrangement direction of the fins of the two second fin groups.

In the above heat dissipation device, the heat dissipation device further includes a metal block unit, on which the bottom of the vapor chamber unit is disposed.

In the above heat dissipation device, the metal block unit is made of copper.

In the above heat dissipation device, the material of the temperature equalizing plate unit is stainless steel, aluminum or copper.

The utility model has the advantages that the design of the two side parts of the temperature equalizing plate unit in the heat radiating device can ensure that the acting force generated when the plurality of locking parts are pressed and connected with the base and the reacting force generated at the corners of the base and other positions of the base are offset by using the pulling force generated by the two side parts as the deformation resistance force, thereby overcoming the phenomenon of deformation and bending possibly generated by the whole heat radiating device and avoiding the problem that the original heat radiating efficiency is influenced because all components in the heat radiating device cannot be precisely combined.

Drawings

Fig. 1 is an exploded view of a heat dissipation device according to an embodiment of the utility model.

Fig. 2 is an overall schematic view of an embodiment of the heat dissipation device of the utility model.

Fig. 3 is an exploded view of another embodiment of the heat dissipation device of the present invention.

Fig. 4 is a schematic view of another embodiment of a vapor chamber unit in the heat dissipation device of the present invention.

Fig. 5 is a schematic view of an application of the heat dissipation device of the present invention.

FIG. 6 is an exploded view of the vapor chamber unit of FIG. 1.

The reference numbers are as follows:

1: heat dissipation device

10 temperature equalizing plate unit

101: bottom

102, 102' side part

103 chamber

104 upper plate

105 lower plate

11: base

111 seat part

112, 112' beam section

113 opening (C)

121,122,123,124 locking parts

13 radiating fin group

131 the first fin group

132,132' second fin group

14 metal block unit

F acting force

Reaction force F

T is pulling force

Detailed Description

While the embodiments of the present invention are described below with reference to specific embodiments, other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein, and may be implemented or applied by other different embodiments.

Referring to fig. 1 and fig. 2, the heat dissipating device 1 of the present invention includes a temperature equalizing plate unit 10, a base 11, and a plurality of locking members 121,122,123, and 124. The vapor-panel unit 10 has a bottom 101 and two sides 102, 102' on opposite sides of the bottom 101. In this embodiment, the bottom 101 and the two side portions 102,102 'of the vapor chamber unit 10 are integrally formed, for example, two sides of an originally flat vapor chamber can be bent to form the two side portions 102, 102', and the non-bent portion forms the bottom 101, and the two side portions 102,102 'are perpendicular to the bottom 101, so that the entire vapor chamber unit 10 can be U-shaped, and after bending, a cavity 103 is still formed in the bottom 101 and the two side portions 102, 102' (as shown in fig. 6, the vapor chamber unit 10 can be formed by an upper plate 104 and a lower plate 105, and the lower plate 105 has a groove therein to serve as the cavity 103 after being joined to the upper plate 104), and the cavity 103 can be provided with a capillary structure and filled with a working liquid, so that the vapor chamber unit 10 has high thermal conductivity.

The base 11 is disposed on the bottom 101 of the vapor-chamber plate unit 10 and between the two side portions 102, 102'. Specifically, the base 11 may include two seat portions 111 and two beam portions 112,112 ', two ends of each of the two beam portions 112, 112' are respectively disposed on two ends of the two seat portions 111, so that the two beam portions 112,112 'are located between the two seat portions 111, and the two seat portions 111 and the two beam portions 112, 112' may jointly form an opening 113. In the present embodiment, the base 11 is mainly disposed on and in contact with the bottom portion 101 of the vapor plate unit 10 through the two beam portions 112,112 ', and the two seat portions 111 are disposed at the front and rear ends of the bottom portion 101 of the vapor plate unit 10 and are not in contact with the top surfaces of the bottom portion 101 facing the two beam portions 112, 112', but the utility model is not limited thereto. After the base 11 is placed on the temperature plate unit 10, the sides of the two beam portions 112,112 'will contact the two side portions 102, 102' of the temperature plate unit 10.

A plurality of locking members 121,122,123,124 are respectively provided at corners of the base 11. Specifically, the locking members 121,122,123, and 124 are provided mainly at both ends of each seat 111, and the beam portion 112 is located on a line connecting the

locking members

121 and 122. Similarly, the beam portion 112' is also located on the line between the

fasteners

123, 124. In this way, the side portion 102 adjacent to the beam portion 112 is also located on the line connecting the locking members 121,122 disposed on the same side of the base 11, and the side portion 102 'adjacent to the beam portion 112' is also located on the line connecting the locking members 123,124 disposed on the other side of the base 11.

As shown in fig. 5, when the heat dissipation device 1 of the present invention is applied, the acting force F and the reaction force F' generated when the locking

members

121 and 122 are pressed against the base 11 can be offset by the pulling force T provided by the side portion 102 as the deformation resistance, so as to overcome the deformation and bending phenomena possibly generated by the heat dissipation device 1, and avoid the problem that the components in the heat dissipation device cannot be precisely combined to affect the original heat dissipation performance.

In this embodiment, the heat dissipating device 1 of the present invention may further include a heat dissipating fin set 13, and the heat dissipating fin set 13 may be disposed on the base 11 and contact the bottom 101 through the opening 113, and is located between the two sides 102 and 102'. Specifically, the heat sink fin set 13 includes a first fin set 131 and two second fin sets 132 and 132' disposed on opposite sides of the first fin set 131. The first fin set 131 contacts the bottom 101 through the opening 113, and the portions of the first fin set 131 not contacting the bottom 101 are respectively disposed on the two seat portions 111, so that the first fin set 131 is located between the two beam portions 112, 112'. In addition, two second fin sets 132 and 132 ' are disposed on the two beam portions 112 and 112 ' and respectively contact the two side portions 102 and 102 '.

In the present embodiment, the heat dissipating fin set 13 is used to dissipate heat of the working fluid in the uniform temperature plate unit 10, and as the bottom 101 and the side portions 102 and 102 ' of the uniform temperature plate unit 10 are different in the arrangement direction, the fin arrangement directions of the first fin set 131 and the second fin set 132 and 132 ' located on the bottom 101 and the side portions 102 and 102 ' are different. For example, the fin arrangement direction of the first fin set 131 is perpendicular to the bottom 101, and the fin arrangement direction of the second fin sets 132 and 132 ' is parallel to the bottom 101 but perpendicular to the sides 101 and 102 ', so as to facilitate heat dissipation from the bottom 101 and the sides 102 and 102 ' in different directions.

Please refer to fig. 3, which illustrates another embodiment of the heat dissipation device of the present invention. The embodiment of fig. 3 is different from the embodiment of fig. 1 in that a metal block unit 14 is added, and the metal block unit 14 is used for the bottom 101 of the vapor chamber unit 10 to be disposed thereon, so that the heat conduction between the vapor chamber unit 10 and the heat generating source can be smoother. In the embodiment, the material of the metal block unit 14 may be copper, but the utility model is not limited thereto.

Please refer to fig. 4, which shows another embodiment of the vapor chamber unit 10 of the heat dissipation device of the present invention. Unlike the above-mentioned vapor chamber unit 10 which is integrally formed and the bottom portion 101 and the side portions 102 and 102 'are formed by bending the flat vapor chamber, the bottom portion 101 of the vapor chamber unit 10 of the present embodiment is originally flat, and the side portions 102 and 102' are different from the bottom portion 101 and are disposed on the opposite sides of the bottom portion 101 by welding, so that the entire vapor chamber unit 10 can also be U-shaped. In addition, no matter the welding or bending process is adopted, a chamber which is communicated with each other is still formed inside the bottom part 101 and the two side parts 102, 102', and a capillary structure can be arranged in the chamber and filled with working liquid, so that the temperature-uniforming plate unit 10 has high heat conductivity.

In one embodiment, the material of the vapor chamber unit 10 may be stainless steel, aluminum or copper, but the utility model is not limited thereto.

In an embodiment, the vapor chamber unit 10, the base 11 and the heat sink fins 13 in the heat sink 1 of fig. 1 can be assembled together by a welding process. Similarly, the vapor chamber unit 10, the base 11, the heat sink fin set 13 and the metal block unit 14 in the heat sink 1 of fig. 3 can be assembled together by a welding process. The present invention is not limited to the above process.

In summary, with the design of the heat sink having two side portions, the acting force generated by the plurality of locking members when the locking members are pressed against the base, and the acting force generated by the plurality of locking members at the corners of the base and the reaction force generated at other positions of the base are offset by using the pulling force generated by the two side portions as the deformation-resistant force, so as to overcome the phenomenon of deformation and bending possibly generated by the whole heat sink, and avoid the problem that the original heat dissipation performance is affected because each component in the heat sink cannot be precisely combined.

The above embodiments are merely illustrative of the technical principles, features and effects of the present invention, and are not intended to limit the scope of the present invention, and those skilled in the art can modify and change the above embodiments without departing from the spirit and scope of the present invention. However, any equivalent modifications and variations using the teachings of the present invention should be covered by the scope of the claims. Rather, the scope of the utility model is as set forth in the following claims.

Claims

1. A heat dissipating device, comprising:

the temperature equalizing plate unit comprises a bottom and two side parts positioned on two opposite sides of the bottom;

the base is arranged on the bottom of the temperature-uniforming plate unit and positioned between the two side parts; and

the locking pieces are respectively arranged at the corners of the base;

the two side parts are used for providing deformation resistance after the plurality of locking parts are pressed on the base.

2. The heat dissipating device of claim 1, wherein the bottom portion and the two side portions are integrally formed.

3. The heat dissipating device of claim 1, wherein the two side portions are welded to opposite sides of the bottom portion.

4. The heat dissipating device of claim 1, wherein the bottom portion and the two side portions have cavities formed therein that communicate with each other.

5. The heat dissipating device of claim 1, wherein the two side portions are perpendicular to the bottom portion such that the vapor chamber plate unit has a U-shape.

6. The heat dissipating device of claim 1, wherein the two side portions are respectively located on a connection line of the plurality of locking members disposed on the same side of the base.

7. The heat dissipating device of claim 1, further comprising a set of heat dissipating fins disposed on the base and contacting the bottom through the opening of the base and between the two sides.

8. The heat dissipating device of claim 7, wherein said heat dissipating fin set comprises a first fin set and two second fin sets disposed on opposite sides of said first fin set, and said base comprises two seats and two beam portions disposed between said two seats to form said opening together with said two seats.

9. The heat dissipating device of claim 8, wherein the first set of fins contacts the bottom portion through the opening and is partially disposed on the two seat portions, and the two second sets of fins are disposed on the two beam portions and contact the two side portions, respectively.

10. The heat dissipating device of claim 8, wherein the first set of fins has a fin alignment direction different from the fin alignment directions of the two second sets of fins.

11. The heat dissipating device of claim 1, further comprising a metal block unit for the bottom of the vapor chamber unit to be disposed thereon.

12. The heat dissipating device of claim 11, wherein the metal block unit is made of copper.

13. The heat dissipating device of claim 1, wherein the temperature-uniforming plate unit is made of stainless steel, aluminum or copper.