CN218274574U - Radiator module and cooling system - Google Patents

Abstract

Provided are a heat sink module and a heat dissipation system, the heat sink module including: the heat dissipation structure comprises a temperature equalizing plate substrate and heat dissipation fins arranged on the temperature equalizing plate substrate; the temperature equalizing plate substrate is provided with a convex block used for being in contact with a chip, and the surface of the convex block is provided with a first groove and a second groove intersected with the first groove; wherein the first trench extends over the surface of the bump and is not connected to the sidewalls of the bump, the second trench extends over the surface of the bump and is connected to the sidewalls of the bump, the first and second trenches for receiving a thermal interface material; and the heat dissipation system comprises a chip and the radiator module.

Description

Radiator module and cooling system

Technical Field

The application relates to the field of heat dissipation devices, in particular to a heat dissipation device module and a heat dissipation system.

Background

The surface of the conventional VC Vapor chamber substrate that contacts the chip is desirably made flat. However, in the practical application process, for the heat sink using the VC temperature equalization plate as the substrate, the contact surface of the VC temperature equalization plate and the chip often forms a complex curved surface.

Moreover, when the temperature changes, the parallelism of the surfaces of the VC temperature equalization plates of the heat sink in contact with the chip will further deteriorate, resulting in a poor heat dissipation effect.

To improve this problem, it is generally considered to fill the gap between the VC vapor chamber and the chip surface with a thermal interface material (e.g., silicone grease). However, with the temperature change occurring during the actual use, it is difficult for the thermal interface material to fill the gap well, and the heat dissipation performance is still not good.

SUMMERY OF THE UTILITY MODEL

Based on the above problems in the prior art, the embodiments of the present application provide a heat sink module and a heat dissipation system.

In one embodiment of the present application, there is provided a heat sink module including: the heat dissipation structure comprises a temperature equalizing plate substrate and heat dissipation fins arranged on the temperature equalizing plate substrate;

the temperature equalization plate substrate is provided with a convex block used for being in contact with a chip, and the surface of the convex block is provided with a first groove and a second groove intersected with the first groove;

wherein the first trench extends over the surface of the bump and is not connected to the sidewalls of the bump, the second trench extends over the surface of the bump and is connected to the sidewalls of the bump, and the first trench and the second trench are configured to receive a thermal interface material.

In the radiator module, the surface of the temperature equalizing plate substrate, which is used for being in contact with the chip, is provided with a groove structure, so that a micro-protrusion structure is formed on the contact surface, the groove or protrusion structure can improve the flowability of a thermal interface material, the binding force between the thermal interface material and the temperature equalizing plate substrate is improved, when the temperature changes, the thermal interface material can flow based on the groove structure, the gap between the temperature equalizing plate substrate and the chip can be effectively filled with the thermal interface material, the temperature equalizing plate substrate and the chip can be perfectly attached, and the heat dissipation effect is improved. And, this scheme can reduce because of exerting the probability that too big pressure causes the chip to damage in the radiator installation, under the condition that sets up the groove structure, when installing the radiator module, thermal interface material can be extruded to the ditch inslot, along with the atress changes, thermal interface material can be according to the controlled flow of the extending direction of ditch groove, the condition that the clearance was filled can be reflected from the condition that the ditch groove spilled over according to thermal interface material, can reduce the probability that causes the chip to damage because of the improper application of force, can promote the radiating effect under the condition of avoiding causing harmful effects to the chip.

In addition, the grooves are arranged on the contact surface of the substrate of the uniform temperature plate and the chip instead of the grooves arranged on the chip, so that the adverse effect of the grooves on the chip (the grooving process on the chip is complex and the chip is easy to damage) can be avoided, and the overall cost is reduced. The radiator module that this application embodiment provided can be applicable to multiple heat dissipation scene, but reuse, and the reuse rate is high.

In one embodiment, the heat sink module further includes a fixing plate fixedly connected to the isothermal board substrate for fixing the heat sink module to the circuit board carrying the chip, so that the isothermal board substrate of the heat sink module can be stably contacted with the surface of the chip, and the surface contact area between the isothermal board substrate and the chip is increased.

In one embodiment, the temperature equalization plate substrate further comprises a fixing portion for fixing the heat sink module to the circuit board, and the fixing plate surrounds the side surface of the temperature equalization plate substrate and covers the fixing portion. Through the combination of the fixing plate and the temperature-uniforming plate substrate, the fixing strength is increased, and the deformation of the temperature-uniforming plate substrate is avoided.

In one embodiment, the first grooves are transverse grooves and the second grooves are longitudinal grooves. In one embodiment, the first groove is an annular groove and the second groove is a radial groove.

In one embodiment, the first trench and the second trench have a depth ranging from 50 μm to 100 μm. In one embodiment, the width of the first and second trenches ranges from 200 μm to 2mm. In one embodiment, a ratio of a total area of the first trench and the second trench to a surface area of the bump is in a range of 10% to 25%. Through these microgrooves, guaranteed that when the chip temperature rose, thermal interface material can be filled the clearance of the increase between samming board base plate and the chip nearby for samming board base plate and chip can perfectly laminate.

In one embodiment, the temperature equalization plate substrate is a VC temperature equalization plate, a copper plate or an aluminum plate, and has high thermal conductivity and good heat dissipation effect.

In another embodiment of the present application, a heat dissipation system is provided, which includes a chip and the aforementioned heat sink module.

Drawings

Fig. 1A is a front view of a heat sink module according to an embodiment of the present disclosure.

Fig. 1B is a side view of a heat sink module according to an embodiment of the present disclosure.

Fig. 2A is a top view of a trench on a surface of a substrate of a thermal equalizer plate according to an embodiment of the present disclosure.

Fig. 2B is a side view of a trench on a surface of a bump in accordance with one embodiment provided herein.

Fig. 3 is a top view of a heat sink module according to an embodiment of the disclosure.

Fig. 4 is a schematic view of a groove on a surface of a substrate of a vapor chamber according to another embodiment of the disclosure.

Description of reference numerals:

31: fixing plate

32: temperature equalizing plate substrate

32a: bump

32b: fixing part

33: heat radiation fin

G1: first trench

G2: second trench

312: screw nail

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail by specific embodiments with reference to the accompanying drawings. It should be noted that the examples given herein are for illustration only and do not limit the scope of the present application.

The chip is usually soldered on a circuit board, and the chip generates heat in the use process, and in order to ensure the normal operation of the chip, the chip is usually cooled by using a radiator module. Many heat sink modules desirably employ a VC Vapor chamber substrate (Vapor Chambers substrate) that is made flat as a substrate, and the surface of the plate where the VC Vapor chamber contacts the chip is desirably made flat.

However, the inventors have found that the associated thermal processes during the fabrication and packaging of the chip, or temperature changes during use of the chip, may cause the chip to warp. In addition, the VC temperature equalizing plate is easy to have poor planeness and generate warping phenomenon through the processes of punch forming, high-temperature welding and the like in the production process of the VC temperature equalizing plate. In addition, the conventional heat sink is usually soldered on the VC temperature equalization plate with tin-based solder, so that the flatness of the VC temperature equalization plate is further deteriorated. Therefore, in practical applications, the surface of the VC temperature equalization plate in contact with the chip often forms a complex curved surface.

In addition, because the thermal expansion coefficients of the VC temperature equalization plate heat sink module and the chip are not the same, the deformation amount of the VC temperature equalization plate heat sink module and the chip is not the same when the temperature rises and drops, which further deteriorates the parallelism of the surfaces of the VC temperature equalization plate and the chip.

Therefore, at normal temperature, the surface of the VC temperature equalizing plate, which is in contact with the chip, forms a complex curved surface. At high temperatures, the parallelism between the two planes is worse.

If a Thermal Interface Material (Thermal Interface Material) is adopted to fill the gap between the VC temperature-uniforming plate and the surface of the chip, the Thermal contact resistance between the VC temperature-uniforming plate and the chip can be reduced by coating the Thermal Interface Material such as silicone grease between the heat radiator module and the chip. However, when the gap between the two planes changes with the temperature change, the thermal interface material cannot fill the gap well, which increases the thermal contact resistance between the VC isothermal board heat sink module and the chip, and the heat dissipation effect is not good.

In addition, in general, for a heat sink module using a VC temperature equalization plate as a substrate, the heat sink module is fixed to a circuit board and contacts with the surface of a chip by applying pressure to a spring screw, so that the VC temperature equalization plate contacts with the surface of the chip to form good heat conduction for heat dissipation. However, as the power consumption of the product is larger and larger, the size of the chip is larger and larger, and the contact plane between the corresponding VC temperature equalization plate and the chip is also larger and larger, so that the flatness of the VC temperature equalization plate is more and more difficult to control. When the temperature changes, the deformation amount of the VC temperature equalizing plate is inconsistent, and the parallelism of the surface of the VC temperature equalizing plate contacted with the chip is also reduced.

As semiconductor processes become more advanced, chips tend to use low dielectric constant (low-k) materials, and chips become more fragile. If the pressure applied to the heat radiator module and the chip in the mounting process is too large, the chip can be damaged or broken, and if the applied pressure is too small, the VC temperature equalizing plate of the heat radiator module cannot be effectively attached to the surface of the chip, so that the heat radiation effect is poor.

In view of this, the present disclosure provides a heat sink module and a heat dissipation system to improve heat dissipation effect. Among the heat sink module that this application embodiment provided, the surface that is used for on the samming board base plate and contacts with the chip is provided with the slot structure for form little protruding structure on the contact surface, these little protruding structure or slot structure can improve the mobility of thermal interface material, improve the cohesion between thermal interface material and the samming board base plate, ensure that the clearance between heat sink module and the chip is effectively filled by thermal interface material, make heat sink module and chip can perfectly laminate.

Fig. 1A is a front view of a heat sink module provided in an embodiment of the present application, and fig. 1B is a side view of the heat sink module provided in the embodiment of the present application. As shown in fig. 1A and 1B, the heat sink module may include a fixing plate 31, a vapor chamber substrate 32, and heat dissipation fins 33.

Wherein, the heat dissipation fins 33 are disposed on the vapor chamber substrate 32. The heat sink fins 33 are fixedly connected to the first surface of the thermal equalizer substrate 32. In one embodiment, the heat sink fins 33 are welded on the first surface of the thermal equalizer substrate 32, which may be a surface for facing away from the chip. The second surface of the vapor plate substrate 32 is for contacting the chip. The heat dissipation fins 33 may be VC uniform temperature plates, copper plates, aluminum plates, etc., which have high thermal conductivity and good heat dissipation effect.

The vapor chamber substrate 32 includes: a fixing portion 32b for fixing the heat sink module to a circuit board on which a chip to be heat-dissipated is carried, and a bump 32a for contacting the chip, the bump 32a being connected with the fixing portion 32b and protruding relative to the fixing portion 32 b. The vapor chamber substrate including the fixing portion 32b and the bump 32a may be an integrally formed structure, and the bump 32a and the fixing portion 32b may be regarded as different regions of the vapor chamber substrate 32. The temperature equalization plate substrate 32 can be a VC temperature equalization plate, a copper plate, an aluminum plate, etc., which has high thermal conductivity and good heat dissipation effect.

The fixing plate 31 is fixedly connected with the vapor chamber substrate 32, and is used for fixing the heat sink module on a circuit board carrying a chip. In one embodiment, the fixing plate 31 surrounds the side surface of the vapor chamber substrate 32 and covers the fixing portion 32b of the vapor chamber substrate 32 to increase the strength and prevent the vapor chamber substrate 32 from being deformed. In one embodiment, the fixing plate 31 is riveted with a plurality of spring studs having screw holes for fixing the heat sink module to the circuit board. In one embodiment, the fixing plate 31 is welded to the vapor chamber substrate 32. The fixing plate 31 may be a VC temperature equalization plate, an aluminum alloy plate, or the like.

Optionally, in some application scenarios, the fixing plate 31 may also be omitted, and in the case of omitting the fixing plate 31, the isothermal plate substrate 32 may be directly mounted on a chip or a circuit board carrying the chip, so that the isothermal plate substrate 32 is in contact with the surface of the chip. The specific installation mode of the radiator module can be various, for example, the radiator module can be installed through a screw, and the radiator module can also be installed through a spring plate or other buckle structures, so that the surface of the temperature equalizing plate substrate of the radiator module is in contact with the chip in a fitting mode.

In the embodiment of the present application, the surface of the bump 32a of the vapor chamber substrate 32 for contacting the chip is provided with grooves, including a first groove and a second groove, the first groove extends on the surface of the bump 32a and is not connected to the sidewall (or edge) of the bump 32a, and the first groove can be regarded as extending on the surface but not penetrating through the surface; the second trench extends over the surface of the bump 32a, intersects the first trench, and is connected to the sidewall (or edge) of the bump 32a, which can be considered as the second trench extends over and through the surface.

The first and second trenches are for receiving a thermal interface material. The Thermal interface material may be silicone grease (Thermal grease), silicone gel (Thermal gel), phase change material (Phase change material), thermal conductive adhesive (Thermal conductive adhesive), etc.

Alternatively, the depth of the first trench may range from 50 μm to 100 μm, e.g., 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm. The depth of the second trenches may range from 50 μm to 100 μm, e.g. 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm.

Alternatively, the width of the first trench may range from 200 μm to 2mm, such as 200 μm, 300 μm, 500 μm, 800 μm, 1mm, 1.5mm, 2mm, and the like. The width of the second trench may range from 200 μm to 2mm, e.g., 200 μm, 300 μm, 500 μm, 800 μm, 1mm, 1.5mm, 2mm, etc.

Alternatively, the ratio of the total area of the first and second trenches to the surface area of the bump 32a may range from 10% to 25%, for example 10%, 15%, 20%, 25%.

The bumps 32a with the grooves form micro-bump structures, which can improve the fluidity of the thermal interface material (such as silicone grease), improve the bonding force between the thermal interface material and the bumps 32a, ensure that the gaps between the bumps 32a and the chip are completely filled with the thermal interface material, and improve the heat dissipation effect.

Fig. 2A is a top view of a trench on a surface of a substrate of a thermal equalizer plate according to an embodiment of the present disclosure. As shown in fig. 2A, the bump 32A is provided with a first groove G1 and a second groove G2. Wherein, the first groove G1 is a transverse groove which extends transversely on the surface of the bump 32a and is not connected with the sidewall (or edge) of the bump 32 a; the second grooves G2 are longitudinal grooves extending longitudinally on the surface of the bump 32a, perpendicularly intersecting the first grooves G1, and connected to the sidewalls (or edges) of the bump 32 a.

The first groove G1 has a depth ranging from 50 μm to 100 μm and a width ranging from 200 μm to 2mm. The second groove G2 has a depth ranging from 50 μm to 100 μm and a width ranging from 200 μm to 2mm. The ratio of the total area of the first trenches G1 and the second trenches G2 to the surface area of the bump 32a is in the range of 10% to 25%. As can be seen from the side view shown in fig. 2B, the bumps 32a form a micro-bump structure based on the arranged groove structure, which can be used to improve the fluidity of the thermal interface material.

Fig. 3 is a top view of a heat sink module according to an embodiment of the present disclosure. The heat sink module has screws 312 for fixedly mounting the heat sink module to a circuit board carrying the chip. The screws 312 are generally arranged symmetrically, and for example, 4 or 6 symmetrically arranged screws 312 may be used to mount the heat sink module to the circuit board. When the groove structure is not arranged, a plurality of screws cannot be simultaneously screwed when the heat sink module is mounted, and therefore, the thermal interface material which originally can cover the gap cannot completely cover the whole chip surface after the screws are mounted.

After the groove structure is arranged on the surface of the vapor chamber substrate 32, the thermal interface material is pressed into the groove to be stored during the process of installing the screw 312, and the thermal interface material flows in the groove as the screw 312 is tightened. Due to the presence of the grooves, the direction of flow of the thermal interface material is altered from an otherwise arbitrary direction of divergence to a controlled direction, i.e., transverse and longitudinal. Meanwhile, due to the existence of the second groove connected to the sidewall (or edge) of the bump 32a, after the fixing screw 312 is installed, whether the thermal interface material completely covers the gap between the bump 32a and the chip surface can be determined according to whether the thermal interface material overflows from the side surface of the bump 32 a. That is, if the thermal interface material overflows to the outside of the bump 32a in the second longitudinal groove, it indicates that the thermal interface material has covered this portion of the area, and no further larger force needs to be applied to the same area, which may reflect that the thermal interface material has completely covered the entire gap between the bump 32a and the chip surface in some cases. The bonding contact state of the substrate and the chip of the temperature equalization plate can be reflected through the overflow condition of the thermal interface material in the groove.

When the temperature rises during use, the vapor chamber substrate 32 may be deformed or warped such that the flatness thereof becomes poor and the gap between the bump 32a and the chip becomes large. At this time, on the one hand, the thermal interface material stored in the groove can fill the increased gap nearby due to the influence of thermal expansion, and on the other hand, the groove is extruded due to the deformation of the temperature-uniforming plate substrate 32, so that the increased gap is filled nearby due to the overflow of the thermal interface material from the groove, and the bump 32a can be better attached to the chip.

Fig. 4 is a schematic view of a groove on a surface of a substrate of a vapor chamber according to another embodiment of the disclosure. As shown in fig. 4, the bump 32a is provided with a first groove G1 and a second groove G2. Wherein, the first groove G1 is an annular groove, which extends concentrically on the bump 32a and is not connected to the sidewall (or edge) of the bump 32 a; the second groove G2 is a radial groove that extends in the radial direction on the bump 32a, intersects the first groove G1, and is connected to a sidewall (or edge) of the bump 32 a.

The first groove G1 has a depth ranging from 50 μm to 100 μm and a width ranging from 200 μm to 2mm. The second groove G2 has a depth ranging from 50 to 100 μm and a width ranging from 200 to 2mm. The ratio of the total area of the first trenches G1 and the second trenches G2 to the surface area of the bump 32a is in the range of 10% to 25%.

The annular and radial grooves allow the bumps 32a to form a micro-bump structure. The function of the grooves in this embodiment is the same as the function of the transverse and longitudinal grooves in the previous embodiments, and will not be described herein.

It should be noted that the trench structure in the above embodiments is only an example and does not limit the present application, and those skilled in the art may design other trench structures with regular or irregular shapes according to actual needs.

In one embodiment, the trench is formed by etching. After the rest procedures of the radiator module are finished, the etching procedure is carried out to avoid the influence of other procedures on the surface flatness of the temperature equalizing plate substrate 32. After etching, the uniform temperature plate substrate 32 can form micro-convex structures, and the micro-convex structures can improve the fluidity of the heat dissipation interface material, improve the bonding force between the thermal interface material and the uniform temperature plate substrate, enable the gap between the uniform temperature plate substrate 32 and the chip to be better filled by the thermal interface material, and reduce the contact thermal resistance.

In the present application, a micro groove is etched on the bump 32a of the temperature-uniforming plate substrate 32, so that the bump 32a can be perfectly attached to the chip. In addition, the micro grooves are arranged on the contact surface of the radiator module and the chip instead of the chip, so that the adverse effect of the micro grooves on the chip (the grooving process on the chip is complex and the chip is easy to damage) can be avoided, and the overall cost is reduced. The radiator module of this application can be applicable to multiple heat dissipation scene, but reuse rate is high.

In this application, when the radiator module is installed, because the trench structure on the surface of the temperature-uniforming plate substrate, after the thermal interface material is accommodated in the trench, the contact area between the radiator module and the surface of the chip is larger than that without the trench (considering the flatness problem between the surface of the chip and the temperature-uniforming plate substrate). The larger contact area reduces the problem of stress and stress concentration, thereby reducing the probability of chip cracking due to excessive screw pressure when tightening the screw.

Based on the same inventive concept, the embodiment of the present application further provides a heat dissipation system, which includes a chip and the aforementioned heat sink module. The heat sink module can be mounted on a circuit board carrying a chip and is used for contacting with the surface of the chip to dissipate heat of the chip. For other details of the heat sink module, reference may be made to the description in the foregoing embodiments, and further description is omitted here.

Although the present application has been described with reference to preferred embodiments, the present application is not limited to the embodiments described herein, and various changes and modifications may be made without departing from the scope of the present application.

Claims (10)

1. A heat sink module, comprising: the heat dissipation structure comprises a temperature equalizing plate substrate and heat dissipation fins arranged on the temperature equalizing plate substrate;

the temperature equalizing plate substrate is provided with a convex block used for being in contact with a chip, and the surface of the convex block is provided with a first groove and a second groove intersected with the first groove;

wherein the first trench extends over the surface of the bump and is not connected to the sidewalls of the bump, the second trench extends over the surface of the bump and is connected to the sidewalls of the bump, and the first trench and the second trench are for receiving a thermal interface material.

2. The heat sink module as recited in claim 1 wherein,

the radiator module further comprises a fixing plate which is fixedly connected to the temperature equalizing plate substrate and used for fixing the radiator module to a circuit board bearing the chip.

3. The heat sink module as recited in claim 2 wherein,

the temperature-uniforming plate substrate further comprises a fixing portion used for fixing the radiator module to the circuit board, and the fixing plate surrounds the side face of the temperature-uniforming plate substrate and covers the fixing portion.

4. The heat sink module as recited in claim 1 wherein,

the first grooves are transverse grooves, and the second grooves are longitudinal grooves.

5. The heat sink module as recited in claim 1 wherein,

the first groove is an annular groove, and the second groove is a radial groove.

6. The heat sink module as recited in claim 1 wherein,

the first trench and the second trench have a depth ranging from 50 μm to 100 μm.

7. The heat sink module as recited in claim 1 wherein,

the width of the first and second grooves ranges from 200 μm to 2mm.

8. The heat sink module as recited in claim 1,

the ratio of the total area of the first groove and the second groove to the surface area of the bump is in the range of 10-25%.

9. The heat sink module according to any one of claims 1-8,

the temperature equalizing plate substrate is a VC temperature equalizing plate, a copper plate or an aluminum plate.

10. A heat dissipation system comprising a chip and the heat sink module of any of claims 1-9.

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