TWM505061U - Light-emitting type package structure - Google Patents

Description

Illuminated package structure

This creation relates to a package structure, especially an illuminating package structure.

With the rapid development of the electronics industry, electronic products tend to be light, thin and short in terms of type, and gradually become a high-performance, high-function, high-speed research and development direction in terms of functions. Among them, the Light Emitting Diode (LED) has the advantages of long life, small size, high shock resistance and low power consumption, so it is widely used in electronic products for illumination needs, and therefore, industrially. The use of various electronic products and home appliances is becoming more and more popular.

FIG. 1 is a schematic cross-sectional view showing a conventional LED package structure 1. As shown in FIG. 1 , the LED package structure 1 includes a substrate 10 , a copper foil 11 , a transparent conductive layer 12 , a transparent insulating layer 13 , a light emitting diode wafer 14 , and a reflective layer 15 .

The substrate 10 has an opening 100 for accommodating the LED chip 14, and is Polyimide (PI) or Polyethylene Terephthalate (Polyethylene Terephthalate). PET) is used as a base material for a conventional double-sided flexible circuit board and has a light blocking function.

The copper foil 11 is disposed on the substrate 10 and on the lower surface 10a, 10b. On, and can be designed with patterned lines.

The light-emitting diode chip 14 is a vertical LED having an anode 140 and a cathode 141 on the upper and lower sides, respectively.

The transparent conductive layer 12 is bonded to the copper foil 11 by an insulating rubber material 120 such as double-sided tape, and the material thereof is indium tin oxide (ITO), aluminum zinc oxide (AZO) or indium zinc oxide (IZO). And the like, and the circuit pattern can be formed by the patterning process to electrically connect the anode 140 and the cathode 141 of the LED wafer 14 by the silver paste 16.

The transparent insulating layer 13 is disposed on the transparent conductive layer 12 and is made of a polymer transparent plastic such as PET or a cycloolefin copolymer (COC).

The reflective layer 15 is disposed on the transparent insulating layer 13 on the lower surface 10b of the substrate 10, and has a high reflectivity such as aluminum, copper, gold, silver, or the like.

However, in the conventional LED package structure 1, a transparent conductive layer 12 such as indium tin oxide (ITO) is required to be formed on the transparent insulating layer 13, and the material cost and manufacturing cost of the transparent conductive layer 12 and the transparent insulating layer 13 are required. Extremely high, the manufacturing cost of the LED package structure 1 is difficult to reduce.

Therefore, how to overcome the problems in the prior art has become a problem that is currently being solved.

In view of the above-mentioned deficiencies of the prior art, the present invention provides an illuminating package structure comprising: a solder resist layer; a metal layer disposed in the solder resist layer; and a light emitting element having opposite first and second sides And the first side borrows Bonded by an electrical conductor and electrically connected to the metal layer; and the dielectric body has opposite first and second surfaces, and the first surface is pressed against the solder resist layer, and the light is emitted The component is embedded in the dielectric body.

In the above-mentioned light-emitting package structure, the metal layer is a circuit layer, an aluminum layer or a copper layer.

In the above-mentioned light-emitting package structure, the conductive system is formed by silver glue, ultraviolet curing glue, an anisotropic conductive film, a solder alloy, a lead-free solder or a tin-gold eutectic solder.

In the above-mentioned light-emitting package structure, another metal layer is formed on the second surface of the dielectric body. For example, another solder resist layer is formed on the surface of the other metal layer.

In the foregoing light-emitting package structure, the light-emitting element is an LED die or a packaged LED package.

In the aforementioned light-emitting package structure, the dielectric system is formed by a flexible or rigid printed circuit board substrate.

As can be seen from the above, the light-emitting package structure of the present invention is mainly formed by forming the metal layer in the solder resist layer, and then pressing the dielectric body and the solder resist layer, thereby eliminating the need to fabricate a conventional transparent conductive layer (such as The wiring process on ITO), so compared with the conventional technology, the luminous package structure of the present invention can greatly reduce the manufacturing cost.

1‧‧‧LED package structure

10‧‧‧Substrate

10a‧‧‧ upper surface

10b‧‧‧ lower surface

100‧‧‧ openings

11‧‧‧ copper foil

12‧‧‧Transparent conductive layer

120‧‧‧Insulating rubber

13‧‧‧Transparent insulation

14‧‧‧Light Emitting Diode Wafer

140‧‧‧Anode

141‧‧‧ cathode

15,25‧‧‧reflective layer

16‧‧‧Silver glue

2,2’‧‧‧Lighted package structure

20‧‧‧ dielectric

20a‧‧‧ first surface

20b‧‧‧second surface

200‧‧‧ Conductive cylinder

21a, 21b‧‧‧ metal layer

21b’‧‧‧ circuit layer

23a, 23b‧‧‧ solder mask

230‧‧‧ openings

24,24’‧‧‧Lighting elements

24a‧‧‧ first side

24b‧‧‧ second side

240,240'‧‧‧ first electrode

241,241'‧‧‧second electrode

26,26’‧‧‧Electrical conductor

27‧‧‧Surface treatment layer

1 is a cross-sectional view of a conventional LED package structure; and FIG. 2 is a cross-sectional view showing a first embodiment of the illuminating package structure of the present invention; The second drawing is a schematic cross-sectional view of a second embodiment of the illuminating package structure of the present invention; and the third drawing is a schematic plan view of the illuminating package structure of the present invention comprising a plurality of illuminating elements.

The embodiments of the present invention are described below by way of specific embodiments, and those skilled in the art can readily appreciate other advantages and functions of the present invention from the disclosure of the present disclosure.

It is to be understood that the structure, the proportions, the size and the like of the drawings are only used in conjunction with the disclosure of the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present invention. The conditions are limited, so it is not technically meaningful. Any modification of the structure, change of the proportional relationship or adjustment of the size should remain in this book without affecting the effectiveness and the purpose of the creation. The technical content revealed by the creation can be covered. In the meantime, the terms "upper", "first", "second" and "one" as used in the specification are merely for convenience of description, and are not intended to limit the scope of the invention. Changes or adjustments in their relative relationship are considered to be within the scope of the creation of the creation of the product without substantial changes.

2 is a schematic cross-sectional view showing a first embodiment of the illuminating package structure 2 of the present invention.

As shown in FIG. 2, the light-emitting package structure 2 includes a dielectric body 20, a metal layer 21a, a patterned solder resist layer 23a, and a light-emitting element 24.

The patterned solder mask layer 23a is a solder resist layer such as transparent, green, black or other colors.

The metal layer 21a is embedded in the solder resist layer 23a, wherein the metal layer 21a is formed by electroplating copper, and a patterned wiring layer can be formed.

In this embodiment, the solder resist layer 23a is formed with a plurality of openings 230 such that a portion of the surface of the metal layer 21a is exposed to the openings 230, and the surface treatment layer 27 is formed in the opening 230. On the metal layer 21a.

Furthermore, in production, the metal layer 21a may extend to the edge or the empty area of the panel, as shown in FIG. 3, through the patterned solder mask opening to form external components (such as capacitors and inductors). End point of the resistor, etc.).

The light-emitting element 24 is embedded in the dielectric body 20. In this embodiment, the light-emitting element 24 is a horizontal face-up LED having a first side 24a and a second side 24b opposite thereto, and the first side 240a has a first electrode 240 thereon. And the second electrode 241, wherein the light emitting element 24 can be an LED die or a packaged LED package.

Furthermore, the first electrode 240 can be an anode or a cathode, and the second electrode 241 is opposite in polarity to the first electrode 240.

Moreover, the first electrode 240 and the second electrode 241 of the light-emitting element 24 are bonded to the metal layer 21a via the conductor 26, and the wiring of the metal layer 21a is designed to facilitate the simultaneous fabrication of the plurality of light-emitting elements 24. The product is shown in Figure 3.

In addition, the conductor 26 is, for example, a silver paste or an ultraviolet curing glue (commonly known as UV glue), anisotropic conductive film (ACF), solder alloy, lead-free solder or tin-gold eutectic solder.

The dielectric body 20 has a first surface 20a and a second surface 20b opposite to each other, and the light emitting element 24 is embedded in the dielectric body 20, and the first surface 20a is opposite to the solder resist layer 23a. The metal layer 21a is partially bonded to the first surface 20a of the dielectric body 20.

In this embodiment, the dielectric body 20 is a flexible or rigid printed circuit board substrate, such as a dielectric impregnated glass fiber woven prepreg, which is composed of a plurality of dielectric sheets, and at least one layer The power sheet may have an opening to accommodate the light emitting element 24. The color of the dielectric body 20 may be selected to be transparent, black, white, yellow or other colors.

Therefore, when the light-emitting package structure 2 is fabricated, the metal layer 21a is first formed in the solder resist layer 23a, and the light-emitting element 24 is disposed on the metal layer 21a, and then the dielectric body 20 is pressed together. The solder resist layer 23a is disposed between the solder resist layer 23a and the first surface 20a of the dielectric body 20, and the light emitting element 24 is embedded in the dielectric body 20.

In the subsequent process, the second surface 20b of the dielectric body 20 can also be selectively designed, such as pressing another metal layer 21b, and forming another patterned solder resist layer 23b on the other metal layer 21b. The other metal layer 21b covers the second side 24b of the light-emitting element 24. The other metal layer 21b can be designed as a heat dissipation layer, a circuit layer, a stress layer or a shielding layer, etc. according to requirements.

The second figure is a schematic cross-sectional view of a second embodiment of the illuminating package structure 2' of the present invention. The difference between this embodiment and the first embodiment is only in the aspect of the light-emitting element 24', and the other structures are substantially the same, so the differences are detailed below. Instead of repeating the same place.

As shown in FIG. 2', the light-emitting element 24' is a vertical LED having a first side 24a and a second side 24b opposite thereto, and the first side 24a and the second side 24b respectively have a first side An electrode 240' and a second electrode 241'.

Furthermore, the first electrode 240 of the light-emitting element 24' is bonded and electrically connected to the metal layer 21a by the electrical conductor 26.

Therefore, when the light-emitting package structure 2' is fabricated, the metal layer 21a is first formed in the patterned solder resist layer 23a, and the light-emitting element 24' is disposed on the metal layer 21a, and then the dielectric is pressed. The body 20 and the patterned solder resist layer 23a are disposed between the patterned solder resist layer 23a and the first surface 20a of the dielectric body 20, and the light-emitting element 24' is embedded in the body In the dielectric body 20.

In the present embodiment, the dielectric body 20 can be formed with a recess (not shown) for burying the light-emitting element 24' therein.

Moreover, the second surface 20b of the dielectric body 20 is pressed against another metal layer, and a blind hole is formed on the second surface 20b of the dielectric body 20 by laser perforation, and then a patterning process is performed. The other metal layer is formed into the circuit layer 21b', and the electric conductor 26' is formed in the blind hole, so that the circuit layer 21b' is electrically connected to the second electrode 241' by the electric conductor 26'. Thereafter, another patterned solder resist layer 23b is formed on the wiring layer 21b' such that the other patterned solder resist layer 23b covers the second side 24b of the light emitting element 24'. Specifically, the wiring layer 21b' and the conductor 26' are formed by electroplating copper.

In addition, the illuminating package structure 2' includes a reflective layer 25 disposed on the second surface 20b of the dielectric body 20 (eg, by adhesive bonding) Cooperating with the other solder resist layer 23b). However, the reflective layer 25 is selectively formed (ie, optional), and the reflective layer 25 is of various types and is not particularly limited.

In summary, the illuminating package structure 2, 2' of the present invention is mainly formed by forming the metal layer 21a in the patterned solder resist layer 23a, and then the patterned solder resist layer 23a together with the metal layer. 21a is pressed together on the dielectric body 20, so that the metal layer 21a and the solder resist layer 23a can be formed by a general printed circuit board circuit process, so that the illumination of the present invention is compared with the process of the conventional transparent conductive layer. The package structure 2, 2' can greatly reduce the manufacturing cost.

Further, since the material of the solder resist layer 23a is not required to be transparent, the application selectivity of the light-emitting package structures 2, 2' is increased.

Moreover, the light-emitting package structures 2, 2' of the present invention use a general circuit board bonding process, so that the overall thickness of the light-emitting package structures 2, 2' can be reduced.

In addition, the hermeticity of the light-emitting package structure 2, 2' of the present invention teaches that the LED package structure is better to facilitate application of the light-emitting package structure 2, 2' to outdoor products.

The above embodiments are intended to illustrate the principles of the present invention and its effects, and are not intended to limit the present invention. Anyone who is familiar with the art may modify the above embodiments without departing from the spirit and scope of the creation. Therefore, the scope of protection of this creation should be as listed in the scope of patent application described later.

2‧‧‧Lighting package structure

20‧‧‧ dielectric

20a‧‧‧ first surface

20b‧‧‧second surface

21a, 21b‧‧‧ metal layer

23a, 23b‧‧‧ solder mask

230‧‧‧ openings

24‧‧‧Lighting elements

24a‧‧‧ first side

24b‧‧‧ second side

240‧‧‧first electrode

241‧‧‧second electrode

26‧‧‧Electrical conductor

27‧‧‧Surface treatment layer

Claims (8)

An illuminating package structure includes: a solder resist layer; a metal layer formed in the solder resist layer; and a light emitting element having a first side and a second side opposite to each other, and the first side is coupled by a conductor And electrically connected to the metal layer; and the dielectric body has a first surface and a second surface opposite to each other, and the first surface is pressed against the solder resist layer to embed the light emitting element in the In the dielectric body. The illuminating package structure of claim 1, wherein the metal layer is a circuit layer. The illuminating package structure of claim 1, wherein the metal layer is an aluminum layer or a copper layer. The illuminating package structure according to claim 1, wherein the conductive system is formed by a silver paste, an ultraviolet curable adhesive, an anisotropic conductive film, a solder alloy, a lead-free solder or a tin-gold eutectic solder. The illuminating package structure of claim 1, wherein another metal layer is formed on the second surface of the dielectric body. The illuminating package structure of claim 5, wherein another solder resist layer is formed on the surface of the other metal layer. The illuminating package structure of claim 1, wherein the illuminating element is a light emitting diode (LED) die or a packaged LED package. The illuminating package structure according to claim 1, wherein The dielectric body is formed from a flexible or rigid printed circuit board substrate.