JP5189835B2 - Surface mount LED with reflective frame - Google Patents

Surface mount LED with reflective frame Download PDF

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JP5189835B2
JP5189835B2 JP2007330772A JP2007330772A JP5189835B2 JP 5189835 B2 JP5189835 B2 JP 5189835B2 JP 2007330772 A JP2007330772 A JP 2007330772A JP 2007330772 A JP2007330772 A JP 2007330772A JP 5189835 B2 JP5189835 B2 JP 5189835B2
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frame
led
reflective
reflective frame
electrode
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JP2009152482A (en
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純二 宮下
康介 土屋
拓也 舟久保
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Citizen Electronics Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Description

本発明は、表面実装型ＬＥＤ（Ｌｉｇｈｔ Ｅｍｉｔｔｉｎｇ Ｄｉｏｄｅ）に係り、このＬＥＤの識別マークに関する。   The present invention relates to a surface mounting type LED (Light Emitting Diode), and relates to an identification mark of the LED.

表面実装型ＬＥＤは、電極を施した基板上にＬＥＤ素子を搭載し、ダイボンドおよびワイヤボンド等により前記電極と導通を行い、前記ＬＥＤ素子および導通部保護のために光透過性樹脂で封止する。そして、前記表面実装型ＬＥＤは、電子機器等のプリント配線基板等に適宜実装される。   The surface-mounted LED has an LED element mounted on a substrate provided with an electrode, conducts with the electrode by die bonding, wire bonding, or the like, and is sealed with a light-transmitting resin to protect the LED element and the conducting portion. . And the said surface mount type LED is suitably mounted in printed wiring boards etc., such as an electronic device.

また、これら表面実装型ＬＥＤには、照射光を効率よく一方向に出力するために発光面を除く光透過性樹脂面に反射枠を形成する構造のものがある。（例えば、特許文献１）   Some of these surface-mount LEDs have a structure in which a reflective frame is formed on a light-transmitting resin surface excluding the light-emitting surface in order to efficiently output irradiation light in one direction. (For example, Patent Document 1)

しかるに、面実装型ＬＥＤを供給テープにマウント、あるいは電子機器等のプリント配線基板に自動搭載、あるいはプリント配線基板の目視検査または補修時には、前記面実装型ＬＥＤの極性識別が必要となる。このため、ＬＥＤ素子を樹脂封止する際に面実装型ＬＥＤの一部に極性識別マークを配置していた。（例えば、非特許文献１）   However, the polarity of the surface-mounted LED must be identified when the surface-mounted LED is mounted on a supply tape, automatically mounted on a printed wiring board such as an electronic device, or when the printed wiring board is visually inspected or repaired. For this reason, when the LED element is resin-sealed, a polarity identification mark is arranged on a part of the surface-mounted LED. (For example, Non-Patent Document 1)

特開２００２−３６８２８１号公報JP 2002-368281 A 日亜化学工業（株）「ＮＳＳＷ１００ＣＴ．ｐｄｆ」頁１０Nichia Corporation "NSSW100CT.pdf" Page 10

しかしながら、上記従来の技術には、以下の課題が残されている。
特許文献１では、表面実装型ＬＥＤを構成する基板と反射枠の接着強度を増加する構造と製法であって、裏面の電極の一部に電極配線形成と同一工程で極性識別マークを付与することは出来るが、発光面は光透過性樹脂封止後に反射枠形成をする構造であって、極性識別マークを考慮していないため、発光面側から極性を判別することができないという課題があった。 However, the following problems remain in the conventional technology.
In Patent Document 1, a structure and a manufacturing method for increasing the adhesive strength between a substrate constituting a surface-mounted LED and a reflection frame, and applying a polarity identification mark to a part of an electrode on the back surface in the same process as electrode wiring formation However, since the light emitting surface has a structure in which a reflection frame is formed after sealing with a light-transmitting resin and does not consider the polarity identification mark, there is a problem that the polarity cannot be determined from the light emitting surface side. .

非特許文献１では、表面実装型ＬＥＤの反射枠に極性識別マークを印刷しているため、極性マーク付与に印刷工程が一工程増加するという課題があった。   In Non-Patent Document 1, since the polarity identification mark is printed on the reflection frame of the surface-mounted LED, there is a problem that the printing process is increased by one step for applying the polarity mark.

本発明は前述の課題に対して、表面実装型ＬＥＤの反射枠形成と同一工程で極性識別マークを付与することができて、発光面からの極性識別が容易な反射枠付表面実装型ＬＥＤを提供することを目的とする。   The present invention provides a surface-mounted LED with a reflective frame that can provide a polarity identification mark in the same process as the formation of a reflective frame of a surface-mounted LED and can easily identify the polarity from the light-emitting surface. The purpose is to provide.

本発明の反射枠付表面実装型ＬＥＤは、基本的には下記記載の構成要件を採用するものである。
基板上にＬＥＤ素子を搭載し、前記ＬＥＤ素子および前記ＬＥＤ素子と前記基板の電極導通部を光透過性樹脂で封止し、前記光透過性樹脂の発光面を除く光透過性樹脂に反射枠を形成した反射枠付表面実装型ＬＥＤにおいて、前記表面実装型ＬＥＤの対向するいずれかひとつの電極側の反射枠を非対称構造とし、前記反射枠の外側に島状樹脂部を形成し、前記反射枠は前記島状樹脂部の内側に形成されて、内側の反射枠とほぼ平行し、かつ前記内側の反射枠より浅く形成された二重の反射枠構造であることを特徴とする。
The surface-mount type LED with a reflective frame of the present invention basically employs the following constituent elements.
A LED element is mounted on a substrate, the LED element and the LED element and an electrode conducting portion of the substrate are sealed with a light transmissive resin, and a reflective frame is formed on the light transmissive resin excluding the light emitting surface of the light transmissive resin In the surface-mounted LED with a reflective frame, the reflective frame on one of the electrodes facing the surface-mounted LED has an asymmetric structure, and an island-shaped resin portion is formed outside the reflective frame, and the reflective The frame is formed inside the island-shaped resin portion, and has a double reflection frame structure formed substantially parallel to the inner reflection frame and shallower than the inner reflection frame .

また、前記表面実装型ＬＥＤのカソード側の反射枠が二重の反射枠構造であることを特徴とする。   Further, the reflective frame on the cathode side of the surface-mounted LED has a double reflective frame structure.

つまり、反射枠は光透過性樹脂の発光面を除く周囲を囲う形状であるが、前記表面実装型ＬＥＤの対向するいずれかひとつの電極側の外側に更にもうひとつ反射層を設けてある。そして、好ましくはカソード側の電極の反射枠を二重にしてある。   In other words, the reflective frame has a shape surrounding the periphery of the light-transmitting resin except the light emitting surface, but another reflective layer is provided on the outer side of any one of the electrodes facing the surface-mounted LED. Preferably, the reflection frame of the cathode side electrode is doubled.

また、前記表面実装型ＬＥＤのカソード側の反射枠は他の反射枠より厚いことを特徴とする。   The reflective frame on the cathode side of the surface-mounted LED is thicker than other reflective frames.

つまり、反射枠は光透過性樹脂の発光面を除く周囲を囲う形状であるが、対向するいずれかひとつの電極側のみ反射枠の層厚を違えてある。そして、好ましくはカソード側の電極の反射枠の層厚を厚くしてある。   That is, the reflecting frame has a shape surrounding the periphery of the light-transmitting resin except the light emitting surface, but the thickness of the reflecting frame is different only on one of the opposing electrode sides. Preferably, the thickness of the reflection frame of the cathode side electrode is increased.

本発明によれば、表面実装型ＬＥＤの発光面側から見える反射枠の形状がアノード側とカソードで明らかに異なる形状であることから、発光面からの極性識別が容易な反射枠付表面実装型ＬＥＤを提供することができる。また、この極性識別マークは、同一の反射枠形成工程で形成できることから、反射枠付表面実装型ＬＥＤの形成工程とコストを大幅に削減できる。   According to the present invention, since the shape of the reflective frame seen from the light emitting surface side of the surface-mounted LED is clearly different between the anode side and the cathode, the surface mounted type with the reflective frame can be easily distinguished from the light emitting surface. An LED can be provided. Moreover, since this polarity identification mark can be formed in the same reflection frame formation process, the formation process and cost of the surface mount type LED with a reflection frame can be greatly reduced.

本発明による面実装型ＬＥＤの実施形態を図面にもとづき説明する。本発明の最も特徴的な構造は、面実装型ＬＥＤの封止樹脂外側に形成する反射枠に極性表示部を形成することである。   An embodiment of a surface-mounted LED according to the present invention will be described with reference to the drawings. The most characteristic structure of the present invention is that a polarity display portion is formed on a reflection frame formed outside the sealing resin of the surface mount LED.

図１ａ、図１ｂ、図２，図３は本発明による反射枠付表面実装型ＬＥＤの第１の実施例である。図１ａは第１の実施例における反射枠付表面実装型ＬＥＤの正面図である。図１ｂは第１の実施例における反射枠付表面実装型ＬＥＤの側断面図である。図２は第１の実施例における反射枠付表面実装型ＬＥＤの断面図である。図３は第１の実施例における反射枠付表面実装型ＬＥＤの斜視図である。   FIG. 1a, FIG. 1b, FIG. 2, and FIG. 3 show a first embodiment of a surface-mounted LED with a reflective frame according to the present invention. FIG. 1a is a front view of a surface-mounted LED with a reflective frame in the first embodiment. FIG. 1b is a side sectional view of the surface-mounted LED with a reflecting frame in the first embodiment. FIG. 2 is a cross-sectional view of the surface-mounted LED with a reflective frame in the first embodiment. FIG. 3 is a perspective view of the surface-mounted LED with a reflective frame in the first embodiment.

まず、図１ａ、図１ｂ、図２、図３にもとづいて、第１の実施例における反射枠付表面実装型ＬＥＤ１００の特徴的な構造について説明する。
図１ａ、図１ｂ、図２，図３の反射枠付表面実装型ＬＥＤ１００において、ＬＥＤ素子１ａ、１ｂは、上下面に電極を施した基板２の上面電極３の上にダイボンドし、ＬＥＤ素子１ａ、１ｂのアノードおよびカソードは上面電極３の各電極と金ワイヤ１１を用いて導通接続してある。 First, a characteristic structure of the surface-mount type LED 100 with a reflective frame in the first embodiment will be described with reference to FIGS. 1a, 1b, 2, and 3. FIG.
In the surface-mounted LED 100 with a reflecting frame shown in FIGS. 1a, 1b, 2 and 3, the LED elements 1a and 1b are die-bonded on the upper surface electrode 3 of the substrate 2 having electrodes provided on the upper and lower surfaces thereof. The anode and cathode 1b are electrically connected to each electrode of the upper surface electrode 3 using gold wires 11.

上面電極３と下面電極４ａ、４ｂのパターンは銅ペースト８ａ、８ｂでそれぞれ導通していて、ここでは下面電極４ａがカソード電極、下面電極４ｂがアノード電極である。また、上面電極３と下面電極４ａ、４ｂのパターンはスルーホール９ａ、９ｂでも接続しているが、このスルーホール９ａ、９ｂは、表面実装型ＬＥＤ１００を電子機器等のプリント配線基板等に搭載した場合に表面実装型ＬＥＤとプリント配線との半田接続の強度確保のためである。フィルムレジスト１０は、後述の光透過性樹脂５を形成時に樹脂がスルーホール９ａ、９ｂに流入しないための保護膜である。   The patterns of the upper surface electrode 3 and the lower surface electrodes 4a and 4b are electrically connected by copper pastes 8a and 8b, respectively, where the lower surface electrode 4a is a cathode electrode and the lower surface electrode 4b is an anode electrode. The patterns of the upper surface electrode 3 and the lower surface electrodes 4a and 4b are also connected through through holes 9a and 9b. The through holes 9a and 9b are mounted on a printed wiring board or the like of an electronic device or the like. This is to ensure the strength of solder connection between the surface-mounted LED and the printed wiring. The film resist 10 is a protective film for preventing the resin from flowing into the through holes 9a and 9b when forming a light transmissive resin 5 described later.

次に、反射枠付表面実装型ＬＥＤ１００の発光面側１２の構造を説明する。
ＬＥＤ素子１ａ、１ｂおよび上面電極３と金ワイヤ１１等の導通部は、これら導通部保護のため光透過性樹脂５（通常は透明なエポキシ樹脂）で覆い、光透過性樹脂５の発光面側１２を除く光透過性樹脂面に反射枠６（酸化チタンなどのフィラー混入樹脂）を形成してある。 Next, the structure of the light emitting surface side 12 of the surface-mounted LED 100 with a reflective frame will be described.
The LED elements 1a and 1b and the conductive parts such as the upper surface electrode 3 and the gold wire 11 are covered with a light transmissive resin 5 (usually a transparent epoxy resin) to protect these conductive parts, and the light emitting surface side of the light transmissive resin 5 is covered. A reflection frame 6 (filler-containing resin such as titanium oxide) is formed on the light-transmitting resin surface except for 12.

符号７は実施例１の極性識別マークである。
つまり、極性識別マーク７は、光透過性樹脂５の発光面側１２を除く周囲に形成したカソード側の反射枠６のさらに外側に反射枠６と同一部材で形成してある。 Reference numeral 7 denotes a polarity identification mark of the first embodiment.
That is, the polarity identification mark 7 is formed of the same member as the reflection frame 6 on the outer side of the cathode-side reflection frame 6 formed around the light-transmitting resin 5 except the light emitting surface side 12.

ここで、極性識別マーク７の形成方法の一例を説明する。
まず、導通部のある発光面側１２は光透過性樹脂５で覆う。次に、反射枠６を形成する部位をダイシングブレードで光透過性樹脂５を除去して溝を形成する。このダイシングブレード工程で反射枠付表面実装型ＬＥＤ１００の対向するいずれかの電極側（好ましくはカソード側）に極性識別マーク７の溝を同時に形成する。５ａ、５ｂ、５ｃは、ダイシングブレード工程で生じた光透過性樹脂５の島状樹脂部であって、島状樹脂部５ａと５ｂ間が極性識別マーク７となる。次に、ダイシングブレードで形成した溝に反射枠６を形成する樹脂を注入する。つまり、表面実装型ＬＥＤの対向するいずれかひとつの電極側の反射枠が二重の反射枠構造となっている。この反射枠６の外側に形成した反射層は照射光の効率には寄与しないが、発光面側１２から明瞭な極性マークとして識別できる。 Here, an example of a method for forming the polarity identification mark 7 will be described.
First, the light emitting surface side 12 with the conducting portion is covered with the light transmissive resin 5. Next, the light-transmitting resin 5 is removed from the portion where the reflection frame 6 is to be formed with a dicing blade to form a groove. In this dicing blade process, a groove for the polarity identification mark 7 is simultaneously formed on one of the opposing electrode sides (preferably the cathode side) of the surface-mounted LED 100 with a reflective frame. 5a, 5b, and 5c are island-shaped resin portions of the light-transmitting resin 5 generated in the dicing blade process, and the polarity identification mark 7 is formed between the island-shaped resin portions 5a and 5b. Next, a resin for forming the reflection frame 6 is injected into the groove formed by the dicing blade. That is, any one of the opposing electrode-side reflecting frames of the surface-mounted LED has a double reflecting frame structure. The reflection layer formed outside the reflection frame 6 does not contribute to the efficiency of the irradiation light, but can be identified from the light emitting surface side 12 as a clear polarity mark.

なお、極性識別マーク７の溝の深さは、図２に示すように他の反射枠６の溝より浅く形成してある。これは、識別マーク側の切り込み溝が多く、島状樹脂部５ｃに比べて５ａ、５ｂの幅が狭く、強度がない。樹脂部５ａ、５ｂの識別マーク側の切り込み溝が浅いのは樹脂部５ａ、５ｂの底部を連結して形成樹脂の強度を損なわないためである。   In addition, the depth of the groove | channel of the polarity identification mark 7 is formed shallower than the groove | channel of the other reflective frame 6, as shown in FIG. This is because there are many cut grooves on the identification mark side, the widths of 5a and 5b are narrower than the island-shaped resin portion 5c, and there is no strength. The reason why the cut grooves on the identification mark side of the resin portions 5a and 5b are shallow is that the bottom portions of the resin portions 5a and 5b are connected to each other so as not to impair the strength of the formed resin.

また、上述の反射枠付表面実装型ＬＥＤ１００の形成方法は、多数個取りを前提にした構造である。従って、前述のダイシングブレード工程が、あらかじめ反射枠６および極性識別マーク７を同時形成できる型枠形成工程であってもよい。   Moreover, the formation method of the above-mentioned surface mounting type LED100 with a reflective frame is a structure on the premise of multi-cavity. Therefore, the above-described dicing blade process may be a mold forming process in which the reflection frame 6 and the polarity identification mark 7 can be formed in advance.

次に、本発明による反射枠付表面実装型ＬＥＤの第２の実施例を説明する。図４は第２の実施例における反射枠付表面実装型ＬＥＤの斜視図である。実施例１と異なる点は、識別マークの形状であり、実施例１と同一の構成には同一の符号を付し、説明を省略する。   Next, a second embodiment of the surface mount type LED with a reflection frame according to the present invention will be described. FIG. 4 is a perspective view of a surface-mounted LED with a reflective frame in the second embodiment. The difference from the first embodiment is the shape of the identification mark. The same components as those of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

図４の反射枠付表面実装型ＬＥＤ２００において、２７ｂが実施例２の極性識別マークである。実施例１の極性識別マーク７が光透過性樹脂５の発光面側１２を除く周囲に形成した前記表面実装型ＬＥＤ１００の対向するいずれかひとつの電極側（好ましくはカソード側）の反射枠６のさらに外側に二重に反射枠を形成した構造であった。この実施例１の構造に対して、実施例２の極性識別マーク２７ｂは、他の反射枠と厚みを違えた（好ましくは他の反射枠より厚い）反射枠が１個である。   In the surface-mounted LED 200 with a reflective frame in FIG. 4, reference numeral 27 b is the polarity identification mark of the second embodiment. The polarity identification mark 7 of Example 1 is formed on the reflective frame 6 on any one electrode side (preferably the cathode side) facing the surface-mounted LED 100 formed around the light-transmitting resin 5 except the light emitting surface side 12. Furthermore, it was the structure which formed the reflective frame double on the outer side. In contrast to the structure of the first embodiment, the polarity identification mark 27b of the second embodiment has one reflecting frame that is different in thickness from the other reflecting frames (preferably thicker than the other reflecting frames).

つまり、極性識別マーク２７ｂの光透過性樹脂５との境界は照射光の効率に寄与し、かつ、極性識別マーク２７ｂと対向する反射枠６と厚みが異なるため、発光面側１２から明瞭な極性マークとして識別できる。   That is, the boundary between the polarity identification mark 27b and the light-transmitting resin 5 contributes to the efficiency of irradiation light, and the thickness is different from that of the reflection frame 6 facing the polarity identification mark 27b. It can be identified as a mark.

以上述べたように、本発明によれば、表面実装型ＬＥＤの対向するいずれかひとつの電極側の、好ましくはカソード側の電極の外側反射枠に更にもうひとつ反射層を設け、あるいは、前記表面実装型ＬＥＤの対向するいずれかひとつの電極側の、好ましくはカソード側の電極の反射枠の厚みを厚くして、対向するいずれかひとつの電極側の反射枠を非対称構造とすることで、反射枠形成と同一工程で極性識別マークを付与する。この結果、反射枠付表面実装型ＬＥＤを電子機器等のプリント配線基板等に実装後も発光面からの極性識別が容易で、大幅なコスト削減が可能な反射枠付表面実装型ＬＥＤを提供できる。   As described above, according to the present invention, another reflective layer is provided on the outer reflective frame of any one electrode facing, preferably the cathode side electrode of the surface-mounted LED, or the surface Reflection is achieved by increasing the thickness of the reflection frame of any one electrode side, preferably the cathode side electrode, of the mounting type LED, and making the reflection frame of any one electrode side facing the asymmetric structure. A polarity identification mark is provided in the same process as the frame formation. As a result, it is possible to provide a surface-mounted LED with a reflective frame that can easily identify the polarity from the light-emitting surface even after the surface-mounted LED with a reflective frame is mounted on a printed wiring board or the like of an electronic device or the like and can significantly reduce costs. .

第１の実施例における反射枠付表面実装型ＬＥＤの正面図である。It is a front view of surface mount type LED with a reflective frame in a 1st Example. 第１の実施例における反射枠付表面実装型ＬＥＤの側断面図である。It is a sectional side view of surface mount type LED with a reflective frame in a 1st Example. 第１の実施例における反射枠付表面実装型ＬＥＤの断面図である。It is sectional drawing of the surface mount type LED with a reflective frame in a 1st Example. 第１の実施例における反射枠付表面実装型ＬＥＤの斜視図である。It is a perspective view of surface mount type LED with a reflective frame in a 1st Example. 第２の実施例における反射枠付表面実装型ＬＥＤの斜視図である。It is a perspective view of surface mount type LED with a reflective frame in the 2nd example.

符号の説明Explanation of symbols

１００、２００ 反射枠付表面実装型ＬＥＤ
１ａ、１ｂ ＬＥＤ素子
２ 基板
３ 上面電極
４ａ、４ｂ 下面電極
５ 光透過性樹脂
６ 反射枠
７、２７ｂ 極性識別マーク
８ａ、８ｂ 銅ペースト
９ａ、９ｂ スルーホール
１０ フィルムレジスト
１１ 金ワイヤ
１２ 発光面側 100, 200 Surface mounted LED with reflective frame
DESCRIPTION OF SYMBOLS 1a, 1b LED element 2 Board | substrate 3 Upper surface electrode 4a, 4b Lower surface electrode 5 Light transmission resin 6 Reflective frame 7, 27b Polarity identification mark 8a, 8b Copper paste 9a, 9b Through hole 10 Film resist 11 Gold wire 12 Light emitting surface side

Claims (2)

基板上にＬＥＤ素子を搭載し、前記ＬＥＤ素子および前記ＬＥＤ素子と前記基板の電極導通部を光透過性樹脂で封止し、前記光透過性樹脂の発光面を除く光透過性樹脂に反射枠を形成した反射枠付表面実装型ＬＥＤにおいて、前記表面実装型ＬＥＤの対向するいずれかひとつの電極側の反射枠を非対称構造とし、前記反射枠の外側に島状樹脂部を形成し、前記反射枠は前記島状樹脂部の内側に形成されて、内側の反射枠とほぼ平行し、かつ前記内側の反射枠より浅く形成された二重の反射枠構造であることを特徴とする反射枠付表面実装型ＬＥＤ。 A LED element is mounted on a substrate, the LED element and the LED element and an electrode conducting portion of the substrate are sealed with a light transmissive resin, and a reflective frame is formed on the light transmissive resin excluding the light emitting surface of the light transmissive resin In the surface-mounted LED with a reflective frame, the reflective frame on one of the electrodes facing the surface-mounted LED has an asymmetric structure, and an island-shaped resin portion is formed outside the reflective frame, and the reflective The frame is formed on the inside of the island-shaped resin portion, and has a double reflection frame structure formed substantially parallel to the inner reflection frame and shallower than the inner reflection frame. Surface mount type LED. 前記表面実装型ＬＥＤのカソード側の反射枠が二重の反射枠構造であることを特徴とする請求項１記載の反射枠付表面実装型ＬＥＤ。
The surface-mount LED of the cathode-side surface-mounted LED with reflective frame of claim 1, wherein the reflective frame is a reflective frame structure of double.
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