TWM502249U - Flexible LED substrate structure - Google Patents

Description

Flexible light-emitting diode substrate structure 【0001】

The present invention relates to a light-emitting diode substrate structure, and more particularly to a light-emitting diode substrate structure having a flexible translucent effect.

【0002】

In recent years, the development of light-emitting diodes (LEDs) has been rapid, the yield of related components has increased, and the prices have become more stable. The application of related products has become more popular and popular. Even with such self-illuminating components, products that require perspective requirements. Application and heat dissipation problems need to be overcome, and further development of applications for flexible devices still requires a lot of room for development.

[0003]

Since the body of the light-emitting diode is not transparent, in many translucent applications, only the transparency of the matching substrate can be used, and the spacing configuration of the light-emitting diodes can be matched to make the interval region retain the transparency, and the light-emitting two can be achieved. The polar substrate has an optical semi-transparent effect. However, due to the transparent substrate material, if the glass substrate is not flexible or curved, the current technical structure of the plastic substrate is still caused by the light-emitting diode. The heating effect causes a decrease in substrate life.

[0004]

Therefore, the main purpose of the present invention is to solve the traditional lack of the present invention. The present invention provides a flexible light-emitting diode substrate structure, which is a flexible transparent plastic substrate for a light-emitting diode in a light-emitting region of a light-emitting diode. The necessary through-openings are provided on one side, and the necessary gaps are reserved, and the light-emitting sections of the respective light-emitting diodes can be arranged at a pitch to retain the necessary light-transmitting area to achieve a visual semi-perspective effect. Accordingly, a flexible semi-transmissive light-emitting diode substrate structure is provided, which has thermal permeability and reduces heat storage of the flexible substrate, thereby improving the life of the flexible substrate.

[0005]

In order to achieve the above purpose, the present invention provides a flexible light emitting diode substrate structure, comprising: a first flexible substrate, a conductive layer, a first conductive adhesive layer, a plurality of light emitting diodes, and a The first soft board is bonded to the layer. The first flexible substrate has a plurality of first through openings arranged in a matrix, and a first spacing between the adjacent first through openings. The first transparent conductive layer has a plurality of first conductive lines disposed on one side of the first flexible substrate, and each of the first conductive lines has a first end and a second end, the first The end portion is located between the first through openings, and the second end portion extends on a side of the first flexible substrate. The first conductive adhesive layer is disposed on the first ends of the first conductive lines. The plurality of light-emitting diodes have a light-emitting area, the light-emitting area is electrically connected to a first electrode end and a second electrode end, and the first electrode end and the second electrode end are electrically connected to each of the first A first conductive adhesive layer on the first end of each side of the opening is disposed such that the light emitting region is located on the through opening. The first flexible board bonding layer is disposed on the second ends of the first conductive lines. The openings of the through openings on the first flexible substrate are larger than the light emitting regions to provide heat dissipation.

[0006]

In an embodiment of the present invention, the first flexible substrate surface has a hardened layer structure.

【0007】

In an embodiment of the present invention, the first flexible substrate is a transparent plastic film, and the transparent plastic film is a polyamide polymer, polycarbonate, polyethylene terephthalate, polymethyl methacrylate. Ester material or acrylic film material.

[0008]

In an embodiment of the present invention, the first transparent conductive layer is a metal or metal oxide or organic conductor material.

【0009】

In one embodiment of the present invention, the metal oxide is silver, nano silver, indium tin oxide.

[0010]

In one embodiment of the present invention, the organic conductor material is a carbon nanotube or poly 3,4-ethylenedioxythiophene.

[0011]

In an embodiment of the present invention, the first conductive adhesive layer and the first flexible board adhesive layer are silver glue and liquid anisotropic conductive glue (ACP, ACI).

[0012]

In an embodiment of the present invention, the other side of the first flexible substrate is provided with a second transparent conductive layer, and the second transparent conductive layer has a plurality of second conductive lines thereon, and the second conductive lines Each has a third end portion and a fourth end portion, the third end portion is located between the through openings and corresponding to the first end portions, and the fourth end portion extends on the side of the first flexible substrate Corresponding to the second end portion, and a second flexible board bonding layer is disposed on the fourth end portions, and the first flexible substrate is provided with a plurality of conductive through holes extending through the first flexible substrate The conductive through-pillar electrically connects the first end of the first transparent conductive layer and the third end of the second transparent conductive layer.

[0013]

In an embodiment of the present invention, the first flexible substrate is provided with a plurality of conductive through-pillars penetrating the first flexible substrate, and the conductive through-pillars electrically connect the first transparent conductive layers One end.

[0014]

In an embodiment of the present invention, a second flexible substrate and a transparent insulating adhesive layer are further included; the second flexible substrate has a plurality of second through openings, and the second flexible substrate a second transparent conductive layer is disposed on the side, the second transparent conductive layer has a plurality of second conductive lines, and each of the second conductive lines has a third end and a fourth end, the third end Between the second through openings of the second flexible substrate, the fourth end portion extends on one side of the second flexible substrate, and is provided on the fourth end portions. The second flexible conductive layer is electrically connected to the conductive through-pillars; the transparent insulating adhesive layer is disposed on the first flexible substrate and the second flexible Between the substrates.

[0015]

In one embodiment of the present invention, the transparent insulating adhesive layer is an acrylic component as a main component.

[0016]

In order to achieve the above object, the present invention further provides a flexible light emitting diode substrate structure, comprising: a first flexible substrate, a second flexible substrate, a plurality of light emitting diodes, and a transparent insulating adhesive. Floor. The first flexible substrate has a plurality of first through openings arranged in a matrix, and a first spacing between the adjacent first through openings; and a first side of the first flexible substrate a transparent conductive layer, the first transparent conductive layer has a plurality of first conductive lines, each of the first conductive lines has a first end portion and a second end portion, and the first end portion is located at the first through openings The second end portion extends on one side of the first flexible substrate, and the first end portion has a first conductive adhesive layer, and the second end portions have a first flexible board adhesive layer. The second flexible substrate has a plurality of second through openings arranged in a matrix and corresponding to the first through openings, and a second spacing between the adjacent second through openings, the second flexible a second transparent conductive layer is disposed on one side of the substrate, the second transparent conductive layer has a plurality of second conductive lines, and each of the second conductive lines has a third end portion and a fourth end portion. The third end portion is located between the second through openings, and the fourth end portion extends on one side of the second flexible substrate, and has a second conductive adhesive layer on the third end portions. A second flexible board adhesive layer is disposed on the fourth end. The plurality of light-emitting diodes each have a light-emitting area, and the light-emitting area is electrically connected to a first electrode end and a second electrode end. The first electrode end and the second electrode end are electrically connected to each of the first electrode ends. The first conductive adhesive layer at one end and the second conductive adhesive layer of the third end portion are disposed between the first through openings and the second through openings. The transparent insulating adhesive layer is disposed between the first flexible substrate and the second flexible substrate. The openings of the first through openings and the second through openings are larger than the light emitting area to provide heat dissipation.

[0017]

In an embodiment of the present invention, the first flexible substrate and the second flexible substrate surface have a hardened layer structure.

[0018]

In one embodiment of the present invention, the first flexible substrate and the second flexible substrate are transparent plastic films, and the transparent plastic film is a polyimide polymer, a polycarbonate, and a polyethylene terephthalate. Acid ester, polymethyl methacrylate or acrylic film material.

[0019]

In an embodiment of the present invention, the first transparent conductive layer and the second transparent conductive layer are metal or metal oxide or organic conductor materials.

[0020]

In one embodiment of the present invention, the metal oxide is silver, nano silver, indium tin oxide.

[0021]

In one embodiment of the present invention, the organic conductor material is a carbon nanotube or poly 3,4-ethylenedioxythiophene.

[0022]

In one embodiment of the present invention, the first conductive adhesive layer, the second conductive adhesive layer, the first flexible board adhesive layer and the second soft board adhesive layer are silver glue or liquid anisotropic conductive glue (ACP, ACI).

[0023]

In one embodiment of the present invention, the transparent insulating adhesive layer is an acrylic component as a main component.

[0046]

1‧‧‧First flexible substrate

[0047]

11‧‧‧First through opening

[0048]

12‧‧‧First spacing

[0049]

2‧‧‧First transparent conductive layer

[0050]

21‧‧‧First conductive line

[0051]

211‧‧‧ first end

[0052]

212‧‧‧second end

[0053]

3‧‧‧First conductive bonding layer

[0054]

4‧‧‧Lighting diode

[0055]

41‧‧‧Lighting area

[0056]

42‧‧‧first electrode end

[0057]

43‧‧‧second electrode end

[0058]

5‧‧‧First soft board bonding layer

[0059]

1'‧‧‧Second flexible substrate

[0060]

11’‧‧‧second through opening

[0061]

12’‧‧‧Second spacing

[0062]

2'‧‧‧Second transparent conductive layer

[0063]

21’‧‧‧Second conductive line

[0064]

211’‧‧‧ Third End

[0065]

212'‧‧‧ fourth end

[0066]

3'‧‧‧Second conductive adhesive layer

[0067]

5'‧‧‧Second soft board bonding layer

[0068]

6‧‧‧ Conductive through column

[0069]

7‧‧‧Transparent insulating bonding layer

[0070]

10‧‧‧ lamp holder

[0071]

101‧‧‧bent groove

[0024]

FIG. 1 is a front elevational view showing the structure of the flexible light-emitting diode substrate of the present invention.

[0025]

FIG. 2 is a side elevational view showing the structure of the flexible light-emitting diode substrate of the present invention.

[0026]

FIG. 3 is a schematic exploded view of the flexible light-emitting diode substrate structure and the lamp holder of the present invention.

[0027]

FIG. 4 is a schematic view showing the combination of the flexible light-emitting diode substrate structure and the lamp holder of the present invention.

[0028]

FIG. 5 is a schematic view showing another embodiment of the flexible light-emitting diode substrate structure of the present invention.

[0029]

FIG. 6 is a schematic view showing still another embodiment of the flexible light-emitting diode substrate structure of the present invention.

[0030]

FIG. 7 is a schematic view showing still another embodiment of the flexible light-emitting diode substrate structure of the present invention.

[0031]

The technical content and detailed description of this creation are now described as follows:

[0032]

Please refer to FIG. 1 and FIG. 2 , which are front and side views of the flexible light-emitting diode substrate structure of the present invention. As shown in the figure: the flexible light-emitting diode substrate structure of the present invention comprises: a first flexible substrate 1, a conductive layer 2, a first conductive adhesive layer 3, and a plurality of light-emitting diodes 4 And a first flexible board bonding layer 5.

[0033]

The first flexible substrate 1 may have a hardened layer structure (not shown) on the upper surface thereof, and a plurality of first through openings arranged in a matrix on the first flexible substrate 1 ( Or a groove-like through opening 11 , and a first spacing 12 between the adjacent first through openings 11 . In the figure, the first flexible substrate 1 is a transparent plastic film, and the transparent plastic film is nylon (Nylon, Polyamide, PA for polyamine polymer), polycarbonate (PC), poly. Polyethylene terephthalate (PET), polymethyl methacrylate (PMMA) or acrylic film.

[0034]

The first transparent conductive layer 2 is formed by dry or wet etching on a surface of the substrate to form a line or a screen printing as a line, and has a plurality of first conductive lines 21 thereon, and is disposed on the first flexible type The first end portion 211 is located between the first through openings 11 and the second end portion 212. The first end portion 211 is located between the first through ends 11 and the second end portion 212. Extending on one side of the first flexible substrate 1. In the figure, the first transparent conductive layer is a metal or metal oxide such as silver, nano silver, indium tin oxide (ITO) or an organic conductor material such as a carbon nanotube or a poly 3, 4-Ethylenedioxythiophene (PEDOT).

[0035]

The first conductive adhesive layer 3 is formed on the first end portion 211 of the first conductive lines 21 by screen printing or lithography to electrically bond the first electrode ends 42 of the light emitting diodes 4 . And a second electrode end 43. In the figure, the first conductive adhesive layer is silver paste, or is printed with ACP/ACI liquid anisotropic conductive adhesive mesh and then with the first electrode end 42 and the second electrode end of the light emitting diode 4. 43 is fixed by thermocompression.

[0036]

The plurality of LEDs 4 have a light-emitting region 41. The light-emitting region 41 is electrically connected to a first electrode end 42 and a second electrode end 43. The first electrode end 42 and the second electrode end 43 are electrically connected. The first conductive adhesive layer 3 on the first end portion 211 of the first through opening 11 is electrically connected to the first through opening 11 .

[0037]

The first flexible board bonding layer 5 is provided for bonding to a soft board (FPC). The first flexible board bonding layer is formed on the second end portion 212 of the first conductive lines 21 by screen printing or lithography. The second end portion 212 is provided with a first flexible board bonding layer 5, so that the second end portion 212 can be electrically connected to a flexible circuit board (not shown) or a flexible cable (not shown). The flexible circuit board or the flexible cable can be further electrically connected to an external control unit (not shown). In the figure, the first flexible board bonding layer 5 is silver glue or ACP/ACI liquid anisotropic conductive glue.

[0038]

The light-emitting regions 41 of the above-mentioned light-emitting diodes can be arranged at a distance to retain the necessary light-transmitting region to achieve a visual semi-perspective effect. Accordingly, a flexible semi-transmissive light-emitting diode substrate structure is provided. The first through-openings 11 of the first flexible substrate 1 have an opening larger than the light-emitting area 41 of the light-emitting body 4 and are provided. The thermal permeability reduces the heat storage of the first flexible substrate 1 and improves the life of the first flexible substrate 1.

[0039]

Please refer to FIG. 3 and FIG. 4 , which are schematic diagrams of the structure and the lamp holder decomposition and combination of the flexible LED substrate. As shown in the figure, after the flexible structure of the flexible light-emitting diode substrate of the present invention is completed, the flexible light-emitting diode substrate structure can be mounted on the lamp holder 10, and the lamp holder 10 has a curved shape. In the slot 101, the first flexible substrate 1 is inserted into the curved slot 101, and the second end portion 212 of the conductive lines 21 on the first flexible substrate 1 is mounted on the inside of the socket 10. The slot on the flexible electrical board (not shown) is inserted, and under the control of the control unit (not shown), the light-emitting diodes 4 are controlled to be lit, or the various light sources are flashing. effect.

[0040]

Please refer to FIG. 5, which is a schematic diagram of another embodiment of the flexible light-emitting diode substrate structure of the present invention. As shown in the figure, this embodiment is substantially the same as the foregoing FIG. 1 to FIG. 4 , except that a second transparent conductive layer 2 ′ is disposed on the other side of the first flexible substrate 1 , and the second transparent layer is disposed. The conductive layer 2 ′ and the first transparent conductive layer 2 are located on different sides of the first flexible substrate 1 , and the second transparent conductive layer 2 ′ has a plurality of second conductive lines 21 ′ thereon, and the second The conductive wires 21 ′ each have a third end portion 211 ′ and a fourth end portion 212 ′. The third end portion 211 ′ is located between the through openings 11 , and the fourth end portion 212 ′ extends to the first On one side of the other side of the flexible substrate 1, a second flexible board bonding layer 5' is disposed on the fourth end portions 212'.

[0041]

A plurality of conductive through posts 6 penetrating the first flexible substrate 1 are disposed on the first flexible substrate 1 , and the conductive through posts 6 are electrically connected to the first ends of the first transparent conductive layers 2 . 211 and a third end portion 211' of the second transparent conductive layer 2'.

[0042]

Please refer to FIG. 6, which is a schematic diagram of still another embodiment of the flexible light-emitting diode substrate structure. As shown in the figure, the present embodiment is substantially the same as the foregoing FIG. 1 to FIG. 5 , and the difference is that the first flexible substrate 1 is provided with a plurality of conductive through-pillars 6 extending through the first flexible substrate 1 . The conductive through posts 6 electrically connect the first ends 211 of the first transparent conductive layers 2 . Further, a second flexible substrate 1 ′ is further disposed. The second flexible substrate 1 ′ has a plurality of second through openings 11 ′, and a second surface of the second flexible substrate 1 ′ is disposed on a side of the second flexible substrate 1 ′. a transparent conductive layer 2 ′, the second transparent conductive layer 2 ′ has a plurality of second conductive lines 21 ′, each of the second conductive lines 21 ′ has a third end portion 211 ′ and a fourth end portion 212 ′ The third end portion 211' is located between the second through openings 11' of the second flexible substrate 1'. The fourth end portion 212' extends on the side of the second flexible substrate 1'. a second flexible board bonding layer 5 ′ is disposed on the fourth end portion 212 ′, and the third end portion 211 ′ of the second transparent conductive layer 2 ′ is electrically connected to the conductive through posts 6 a portion of the first flexible substrate 1 and the second transparent conductive layer 2 ′ may be bonded to a transparent insulating adhesive layer 7 (not shown) to fix the first flexible substrate 1 and the The second transparent conductive layer 2', the transparent insulating adhesive layer is a main component of acrylic glue.

[0043]

Referring to FIG. 7, a schematic diagram of still another embodiment of the flexible light-emitting diode substrate structure of the present invention is shown. As shown in the figure, this embodiment is substantially the same as the foregoing FIG. 1 to FIG. 6 , except that a first transparent conductive layer 1 is disposed on one side of the first flexible substrate 1 , and the first transparent conductive layer is disposed. The first conductive portion 21 has a first end portion 211 and a second end portion 212. The first end portion 211 is located between the first through openings 11 and the second end portion 212 The first end portion 211 is provided with a first conductive adhesive layer 3, and the second end portion 212 has a first flexible board adhesive layer 5 thereon. The first electrode end 42 of the LED 4 is electrically connected to the first conductive adhesive layer 3.

[0044]

The second flexible substrate 1 ′ has a plurality of second through openings 11 ′ arranged in a matrix and corresponding to the first through openings 11 , and a second spacing between the adjacent second through openings 11 ′ 12', a second transparent conductive layer 2' is disposed on one side of the second flexible substrate 1', and the second transparent conductive layer 2' has a plurality of second conductive lines 21' thereon, and the second conductive lines Each of the wires 21 ′ has a third end portion 211 ′ and a fourth end portion 212 ′. The third end portion 211 ′ is located between the second through openings 11 ′, and the fourth end portion 212 ′ extends from the a second conductive adhesive layer 3 ′ is disposed on one side of the second flexible substrate 1 ′, and the second flexible adhesive layer 3 ′ is disposed on the fourth end portion 212 ′. 5', the transparent insulating adhesive layer 7 is bonded between the first flexible substrate 1 and the second flexible substrate 1', so that the second electrode end 43 of the light emitting diode 4 and the second conductive The bonding layer 3 ′ is electrically connected, and the light emitting region 41 is located between the first through openings 11 and the second through openings 11 ′. In the figure, the transparent insulating adhesive layer 7 is an acrylic component which is a main component.

[0045]

The above is only the preferred embodiment of the present invention and is not intended to limit the scope of the present invention. That is, the equal changes and modifications made by the patent application scope of this creation are covered by the scope of the creation patent.

1‧‧‧First flexible substrate

11‧‧‧First through opening

12‧‧‧First spacing

2‧‧‧First transparent conductive layer

21‧‧‧First conductive line

211‧‧‧ first end

212‧‧‧second end

3‧‧‧First conductive bonding layer

4‧‧‧Lighting diode

41‧‧‧Lighting area

42‧‧‧first electrode end

43‧‧‧second electrode end

5‧‧‧First soft board bonding layer

Claims (19)

A flexible light-emitting diode substrate structure includes: a first flexible substrate having a plurality of first through openings arranged in a matrix, and a first one between the adjacent first through openings a first transparent conductive layer having a plurality of first conductive lines disposed on one side of the first flexible substrate, each of the first conductive lines having a first end and a second end The first end portion is located between the first through openings, and the second end portion extends on a side of the first flexible substrate; a first conductive adhesive layer is disposed on the first conductive lines a plurality of light-emitting diodes having a light-emitting region, wherein the light-emitting region is electrically coupled to a first electrode end and a second electrode end, wherein the first electrode end and the second electrode end are respectively electrically connected The first conductive adhesive layer is disposed on the first end of the first through openings, such that the light emitting region is located on the first through openings; and a first flexible board adhesive layer is configured to be the first a second end of the conductive line; wherein the plurality of the first flexible substrate A through opening larger than the opening diameter of the light emitting region-based, to provide cooling. The flexible light-emitting diode substrate structure of claim 1, wherein the first flexible substrate surface has a hardened layer structure. The flexible light-emitting diode substrate structure of claim 1, wherein the first flexible substrate is a transparent plastic film, and the transparent plastic film is a polyimide polymer, a polycarbonate, and a poly Ethylene terephthalate, polymethyl methacrylate or acrylic film. The flexible light-emitting diode substrate structure of claim 1, wherein the first transparent conductive layer is a metal or metal oxide or an organic conductor material. The flexible light-emitting diode substrate structure according to claim 4, wherein the metal oxide is silver, nano silver, or indium tin oxide. The flexible light-emitting diode substrate structure of claim 4, wherein the organic conductor material is a carbon nanotube or a poly 3,4-ethylenedioxythiophene. The flexible light-emitting diode substrate structure of claim 1, wherein the first conductive adhesive layer and the first flexible board adhesive layer are silver glue or liquid anisotropic conductive glue. The flexible light-emitting diode substrate structure of claim 1, wherein the other side of the first flexible substrate is provided with a second transparent conductive layer, and the second transparent conductive layer has thereon a plurality of second conductive lines each having a third end portion and a fourth end portion, the third end portion being located between the first through openings and corresponding to the first end portions The fourth end portion extends on a side of the first flexible substrate and corresponds to the second end portion, and a second flexible board adhesive layer is disposed on the fourth end portions, the first flexible substrate A plurality of conductive through-pillars penetrating the first flexible substrate are electrically connected to the first end of the first transparent conductive layer and the third end of the second transparent conductive layer. The flexible light-emitting diode substrate structure of claim 1, wherein the first flexible substrate is provided with a plurality of conductive through-pillars penetrating the first flexible substrate, and the conductive conductive through The pillar electrically connects the first ends of the first transparent conductive layers. The flexible light-emitting diode substrate structure of claim 9, further comprising a second flexible substrate, wherein the second flexible substrate has a plurality of second through openings, a second transparent conductive layer is disposed on one side of the second flexible substrate, the second transparent conductive layer has a plurality of second conductive lines, and each of the second conductive lines has a third end and a fourth The third end portion is located between the second through openings of the second flexible substrate, and the fourth end portion extends on one side of the second flexible substrate, and The second end portion is provided with a second flexible board adhesive layer, and the third end portion of the second transparent conductive layer is electrically connected to the conductive through-pillars; a transparent insulating adhesive layer is disposed on the first flexible Between the substrate and the second flexible substrate. The flexible light-emitting diode substrate structure according to claim 10, wherein the transparent insulating adhesive layer is an acrylic component having a main component. A flexible light-emitting diode substrate structure includes: a first flexible substrate having a plurality of first through openings arranged in a matrix, and a first one between the adjacent first through openings a first transparent conductive layer is disposed on a side of the first flexible substrate, the first transparent conductive layer has a plurality of first conductive lines, and each of the first conductive lines has a first end and a second end The first end portion is located between the first through openings, and the second end portion extends on a side of the first flexible substrate, and the first end portions have a first conductive adhesive layer thereon. The second end portion has a first flexible board adhesive layer; a second flexible substrate has a plurality of matrix arrays corresponding to the first a second through-opening through the opening, a second spacing between the adjacent second through openings; a second transparent conductive layer on the second flexible substrate, the second transparent conductive layer Having a plurality of second conductive lines, each of the second conductive lines having a third end portion and a fourth end portion, the third end portion being located between the second through openings, the fourth end portion extending from a second conductive adhesive layer is disposed on one side of the second flexible substrate, and a second flexible adhesive layer is disposed on the fourth end portion; the plurality of light emitting diodes are disposed on the fourth end portion; Each of the first electrode ends and the second electrode end are electrically connected to the first electrode end and the second electrode end. The first electrode end and the second electrode end are electrically connected to the first end of the first end. The conductive adhesive layer and the second conductive adhesive layer of the third end portion are disposed between the first through openings and the second through openings; a transparent insulating adhesive layer is disposed on the conductive adhesive layer Between the first flexible substrate and the second flexible substrate; wherein the first Through the plurality of openings and a second through opening larger than the opening diameter based light emitting region, to provide cooling. The flexible light-emitting diode substrate structure of claim 12, wherein the first flexible substrate and the second flexible substrate surface have a hardened layer structure. The flexible light-emitting diode substrate structure of claim 12, wherein the first flexible substrate and the second flexible substrate are transparent plastic films, and the transparent plastic film is polyimide. Polymer, polycarbonate, polyethylene terephthalic Acid ester, polymethyl methacrylate or acrylic film material. The flexible light-emitting diode substrate structure of claim 12, wherein the first transparent conductive layer and the second transparent conductive layer are metal or metal oxide or organic conductor materials. The flexible light-emitting diode substrate structure according to claim 15, wherein the metal oxide is silver, nano silver, or indium tin oxide. The flexible light-emitting diode substrate structure according to claim 15, wherein the organic conductive material is a carbon nanotube or a poly 3,4-ethylenedioxythiophene. The flexible light-emitting diode substrate structure of claim 12, wherein the first conductive adhesive layer, the second conductive adhesive layer, the first flexible board adhesive layer and the second flexible board adhesive layer are Silver glue or liquid anisotropic conductive glue. The flexible light-emitting diode substrate structure according to claim 12, wherein the transparent insulating adhesive layer is an acrylic component as a main component.