TWM491942U - Crack detection mechanism - Google Patents

Description

Rupture detection mechanism

The present invention provides a rupture detecting mechanism, and more particularly, a rupture detecting mechanism that can be applied to a rupture state of a board (such as glass, wafer, etc.).

According to the existing industrial detection mechanism, which is known to be applied to a substrate or a related process, the industry only detects the substrate with four fixed photo-sensing sensors after the alignment of the static substrate. The integrity of the four corners, or the load cell weight change comparison, and the Charge-coupled Device (CCD) method to detect the state of the object.

Conventional wafers (wafer) can usually be bonded to a glass to use the glass as a carrier for related processes. After the wafer and glass are completed, the glass and wafer can be separated by laser debonding or the like. However, after the glass and the wafer are peeled off, there is a stress concentration on the edge of the irregular crack, which needs to be detected by the rupture detection mechanism to avoid the damage of the carrier such as glass and the wafer, causing customer losses. However, there is currently no industry in the industry. Applicable device for glass and wafer crack detection.

In summary, the creator feels that the above-mentioned deficiencies can be improved. He has devoted himself to research and cooperates with the application of academics, and finally proposes a design that is reasonable in design and effective in improving the above-mentioned deficiencies.

The technical problem to be solved by the present invention is to provide a rupture detecting mechanism which can be used for detecting the rupture state of a board (such as glass, wafer, etc.), and can reduce the cost and improve the detection function.

In order to solve the above technical problem, the present invention provides a rupture detecting mechanism, comprising: a rotating member; at least one sensor, the at least one sensor is disposed on the rotating member; and a first driving device, the rotating The piece is coupled to the first driving device, and the first driving device can drive the rotating member to rotate.

In order to solve the above technical problems, the present invention further provides a rupture detecting mechanism for detecting the rupture state of the glass and the wafer after peeling, wherein the glass and the wafer are defined as a detecting position, and the rupture detecting mechanism The device includes: a rotating member; at least one sensor, the at least one sensor is disposed on the rotating member; a first driving device, the rotating member is coupled to the first driving device, and the first driving device can drive the The rotating member rotates; and the rotating member, the at least one sensor and the first driving device can move into and out of the detecting position.

Preferably, the second driving device is further connected to the second driving device, and the rotating device, the at least one sensor and the first driving device are driven by the second driving device. Remove the detection location.

This creation has at least the following advantages:

The rupture detecting mechanism of the present invention includes a rotating member, a sensor and a first driving device. The first driving device can drive the rotating member to rotate, so that the sensor can rotate synchronously with the rotating member, and the sensor can move along the circular detecting line to achieve comprehensive detection effect, which can greatly reduce the cost. And improve the detection function.

When the rupture detection mechanism of the present invention detects the rupture of the sheet, the machine can be warned in time to avoid the loss of the glass and other plates affecting the customer.

In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings are only for reference and description, and are not intended to limit the creation.

1‧‧‧glass

2‧‧‧ wafer

3‧‧‧Clamp

4‧‧‧ extraction agency

5‧‧‧Rotating parts

6‧‧‧ sensor

61‧‧‧Detection line

7‧‧‧First drive

8‧‧‧Second drive

100‧‧‧Break detection mechanism

FIG. 1 is a front view of the creation of a rupture detecting mechanism.

FIG. 2 is a top plan view of the creation rupture detecting mechanism.

Please refer to FIG. 1 , which is a front view of the creation of a rupture detecting mechanism. The present invention provides a rupture detecting mechanism which can be applied to the detection of a broken state of a sheet. The type of the sheet is not limited, and may be, for example, various slab materials such as glass, wafer, and carrier. In the present embodiment, the rupture detecting mechanism 100 is applied to the detection of the ruptured state of the glass 1 and the wafer 2 after peeling. The wafer 2 is placed on a jig 3 which holds the wafer 2 in place. The wafer 2 is originally bonded to the glass 1 in the direction shown in FIG. 1. The top surface of the wafer 2 is originally bonded to the bottom surface of the glass 1 so as to carry the wafer 2 using the glass 1 as a carrier to perform the related process. When the glass 1 and the wafer 2 are to be separated, the glass 1 can be adsorbed and fixed by a pick-up mechanism 4 by a negative pressure method, and the glass 1 and the wafer 2 can be separated by laser peeling or chemical peeling, etc., due to the glass 1 and The stripping method of the wafer 2 belongs to the prior art, and is not the focus of the patent application, and therefore will not be described again.

The rupture detecting mechanism 100 includes a rotating member 5, at least one sensor 6 and a first driving device 7. The rotating member 5 is substantially a plate-like body, and its shape is not limited, and may be, for example, an elongated shape or a circular shape. In the present embodiment, the rotating member 5 is elongated. The rotating member 5 can be moved to above or below the plate to be detected in the rupture state (defined as a detecting position). In the embodiment, the rotating member 5 can be moved between the glass 1 and the wafer 2 (detection) The rupture detecting mechanism 100 can be used to detect the rupture state of the glass 1, and can of course be used to detect the rupture state of the wafer 2 so as to have the function of detecting the upper and lower ruptures. However, the detection position of the sheet is not limited. For example, the detection position may be located above the glass 1 or below the wafer 2. As long as the rupture detecting mechanism 100 is moved to a side adjacent to the sheet, the sheet can be used for the sheet. Rupture detection, but the setting of the rupture detecting mechanism 100 cannot affect the glass 1 and the wafer 2 The normal operation.

The number of the sensors 6 is not limited, and may be, for example, one, two or several, etc., the sensor 6 is disposed on the rotating member 5, so that the sensor 6 can rotate synchronously with the rotating member 5. . The type of the sensor 6 is not limited, and may be appropriately changed according to needs, preferably but not limited to a photo sensor or an image sensor, etc., and the sensor 6 may be a non-contact type. Detector. The position where the sensor 6 is disposed is not limited, and the sensor 6 may be disposed at the middle, one end, both ends or other suitable positions of the rotating member 5.

The first driving device 7 can be a rotating device such as a cylinder (such as a rotating cylinder) or a motor (such as a servo motor). The rotating member 5 is connected to the first driving device 7, that is, the rotating member 5 is connected to the first driving device 7. The power output shaft, the first driving device 7 can be used to drive the rotating member 5 to rotate, so that the sensor 6 can rotate synchronously with the rotating member 5 to achieve the comprehensive detection effect. When the rotating member 5 rotates, the sensor 6 can be moved along the circular detecting line 61 (as shown in FIG. 2). However, the angle at which the rotating member 5 rotates is not limited, and may be, for example, 180 degrees or 360 degrees, and the angle at which the rotating member 5 rotates may be changed as needed.

In the embodiment, the rotating member 5, the sensor 6 and the first driving device 7 are arranged in a movable manner, and the rotating member 5, the sensor 6 and the first driving device 7 can move into or out of the glass 1 and the wafer. Between 2 (detection position). Specifically, the rupture detecting mechanism 100 of the present invention may further include a second driving device 8, which may be a cylinder, a motor, etc., and the first driving device 7 is appropriately connected to the second driving device. The device 8 is used to drive the rotating member 5, the sensor 6 and the first driving device 7 to move into the detecting position by the second driving device 8, and to remove the detecting position after the detection is completed. In this embodiment, the second driving device 8 is a slide cylinder, and the second driving device 8 can drive the rotating member 5, the sensor 6 and the first driving device 7 to move horizontally in and out in a linear reciprocating manner. Detection location.

The manner in which the second driving device 8 drives the rotating member 5, the sensor 6 and the first driving device 7 is not limited. For example, the second driving device 8 can also drive the rotating member. 5. The sensor 6 and the first driving device 7 are moved in and out of the detecting position by various means such as swinging, rotating or lifting. However, since the configuration in which the driving member is moved by the driving device is a conventional technique, and the present creation does not limit the configuration of the second driving device 8, it will not be described again.

In addition, when the rotating member 5, the sensor 6 and the first driving device 7 are moved, they can also be guided with appropriate slide rails, slides or linear bearings to make the components stably operate. In addition, an appropriate sensor can be provided to detect and position, so that each component can accurately reach the positioning.

Please refer to FIG. 2 , which is a schematic top view of the creation of the rupture detecting mechanism. The first driving device 7 (shown in FIG. 1) can be used to drive the rotating member 5 to rotate, so that the sensor 6 can rotate synchronously with the rotating member 5, and the sensor 6 can move along the circular detecting line 61. In order to achieve comprehensive detection, the cost can be greatly reduced and the detection function can be improved. The creation rupture detecting mechanism 100 can be attached to a single-chip machine application, and can be used for any partial rupture detection, detection of any corner rupture rupture and pulverization rupture detection, etc., so as to timely warn the machine and avoid cracking of glass and the like. Affecting wafers causes customer losses.

However, the above description is only the preferred embodiment of the present invention, and it is not intended to limit the scope of patent protection of this creation. Therefore, the equivalent changes made by using this creation specification and the contents of the schema are all included in the right of this creation. Within the scope of protection, it is given to Chen Ming.

1‧‧‧glass

2‧‧‧ wafer

3‧‧‧Clamp

4‧‧‧ extraction agency

5‧‧‧Rotating parts

6‧‧‧ sensor

7‧‧‧First drive

8‧‧‧Second drive

100‧‧‧Break detection mechanism

Claims (11)

A rupture detecting mechanism includes: a rotating member; at least one sensor, the at least one sensor is disposed on the rotating member; and a first driving device, the rotating member is coupled to the first driving device, The first driving device can drive the rotating member to rotate. The rupture detecting mechanism of claim 1, wherein the rotating member, the at least one sensor, and the first driving device are movable into and out of a detecting position. The rupture detecting mechanism of claim 2, further comprising a second driving device coupled to the second driving device, wherein the rotating member is driven by the second driving device, the at least one sensing And the first driving device moves into and out of the detecting position. The rupture detecting mechanism of claim 3, wherein the second driving device is a cylinder or a motor. The rupture detecting mechanism of claim 1, wherein the at least one sensor is a non-contact sensor. The rupture detecting mechanism of claim 1, wherein the first driving device is a cylinder or a motor. A rupture detecting mechanism is applied to detect the rupture state of the glass and the wafer after peeling, and the glass and the wafer are defined as a detecting position, and the rupture detecting mechanism comprises: a rotating member; at least one sensor The at least one sensor is disposed on the rotating member; a first driving device is coupled to the first driving device, the first driving device can drive the rotating member to rotate; and the rotating member, the at least the rotating member A sensor and the first driving device can move into and out of the detecting position. The rupture detecting mechanism of claim 7, further comprising a second driving device connected to the second driving device, wherein the rotating member is driven by the second driving device, the at least one sensing And the first driving device moves into and out of the detecting position. The rupture detecting mechanism of claim 8, wherein the second driving device is a cylinder or a motor. The rupture detecting mechanism of claim 7, wherein the at least one sensor is a non-contact sensor. The rupture detecting mechanism of claim 7, wherein the first driving device is a cylinder or a motor.