TWM466294U - Electronic device and heat-dissipating module thereof - Google Patents

Description

Electronic device and its heat dissipation module

The present invention relates to an electronic device and a heat dissipation module thereof, and more particularly to an electronic device having a heat dissipation fin and a heat dissipation module thereof.

Ultra-thin notebook computers are increasingly popular portable electronic devices. Due to the introduction of touch screen technology, the change in usage behavior has caused the boundaries between notebook computers and tablet computers to become increasingly blurred. The multiple usage behavior affects the structure of the portable electronic device. In order to switch between the two modes of use of the notebook computer and the tablet computer, various types of portable electronic devices with adjustable structure are beginning to appear on the market. In general, the adjustment method is to allow the screen module of the portable electronic device and the host module to be used at different angles to achieve the most comfortable viewing angle. For example, when the portable electronic device is in the tablet usage mode, the screen module and the host module are in a state of being fitted to facilitate carrying or moving operations. When the portable electronic device is in the notebook mode, the screen module and the host module present a large angle, and the screen module can be erected on the host module.

However, the portable electronic device has different performance requirements in the tablet usage mode and the notebook usage mode. In the tablet mode, the portable electronic device is mostly used to execute applications with lower performance, so the generated thermal energy is relatively low. In the notebook mode, the portable electronic device is mostly used to execute applications with high performance, so the heat generated is relatively high.

Therefore, it is necessary to improve the heat dissipation performance of the portable electronic device to ensure the system stability of the portable electronic device in various usage modes.

The present invention provides an electronic device and a heat dissipation module thereof, thereby improving the heat dissipation performance of the electronic device.

The heat dissipation module disclosed in the present invention comprises a heat sink, and the heat sink comprises a first fin set and a second fin set. The first fin set includes a plurality of first fins side by side, and the first fin set of the above has a first average distribution density. The second fin set includes a plurality of second fins side by side, and the second fin set has a second average distribution density, wherein the second average distribution density is greater than the first average distribution density.

The electronic device disclosed in the present invention comprises a first casing, a heat source, a radiator, a fan and a heat pipe. The first housing has a plurality of heat dissipation holes. The heat source is disposed in the first housing. The heat sink is disposed in the first housing and corresponds to the heat dissipation holes. The heat sink includes a first fin set and a second fin set. The first fin set includes a plurality of first fins side by side, and the first fin set of the above has a first average distribution density. The second fin set includes a plurality of second fins side by side, and the second fin set has a second average distribution density, wherein the second average distribution density is greater than the first average distribution density. A row of air outlets of the fan faces the second fin set. The heat pipe is in thermal contact with the first fins of the first fin set, the second fins of the second fin set, and a heat source.

According to the electronic device and the heat dissipation module disclosed in the above, the arrangement of the first fins of the first fin group is relatively thin, so as to reduce the wind resistance and facilitate heat dissipation by natural convection. Moreover, the second fins of the second fin group are densely arranged to increase the heat dissipation area to facilitate heat dissipation by forced convection. Such an electronic device and a heat dissipation module have better heat dissipation efficiency.

The features, implementations, and effects of the present invention are described in detail below with reference to the drawings.

10‧‧‧Electronic devices

11‧‧‧First housing

111‧‧‧Upper surface

112‧‧‧ side surface

113‧‧‧ lower surface

114‧‧‧ vents

12‧‧‧ second housing

13‧‧‧Display module

14‧‧‧ Thermal Module

140‧‧‧heatsink

141‧‧‧First fin set

1411‧‧‧First fin

142‧‧‧second fin set

1421‧‧‧second fin

143‧‧‧Heat pipe

1431‧‧‧ first end

1432‧‧‧second end

144‧‧‧Fan

1441‧‧ vents

145‧‧‧thermal element

15‧‧‧heat source

16‧‧‧ motherboard

FIG. 1 is a schematic structural view of an electronic device in a flat panel use mode according to an embodiment of the present invention.

FIG. 2 is a schematic structural view of an electronic device in a notebook power usage mode according to an embodiment of the present invention.

Fig. 3 is a plan view of the structure according to Fig. 2.

Figure 4 is a bottom plan view of the structure according to Figure 2.

Figure 5 is a perspective view of the structure according to Figure 3.

Fig. 6 is a perspective enlarged view of a partial structure according to Fig. 4.

Please refer to FIG. 1 and FIG. 2 . FIG. 1 is a schematic structural diagram of an electronic device in a flat mode according to an embodiment of the present invention, and FIG. 2 is an electronic device used in a notebook according to an embodiment of the present invention. Schematic diagram of the pattern.

The electronic device 10 of the present embodiment includes a first housing 11 , a second housing 12 pivotally mounted to the first housing 11 , and a display module 13 . An operation processor may be disposed in the first housing 11 to make the first housing 11 as a main housing of the electronic device 10 , and the surface of the first housing 11 may further have a plurality of heat dissipation holes 114 . The display module 13 is disposed on the second housing 12 to make the second housing 12 a screen housing of the electronic device 10. The display module 13 can be, but is not limited to, a touch screen.

The second housing 12 is rotatable relative to the first housing 11 to a retracted position of the first housing 11 (as shown in FIG. 1). At this time, the display module 13 is located on the side of the second casing 12 away from the first casing 11 to make the electronic device 10 in a state of using the flat panel. In addition, the second housing 12 is rotatable relative to the first housing 11 to a deployed position (shown in FIG. 2) at an angle to the first housing 11 to enable the electronic device 10 to be in an electrical usage mode. . At this time, the second housing 12 is no longer attached to the first housing 11 such that a plurality of heat dissipation holes 114 located on the surface of the first housing 11 and originally covered by the second housing 12 are exposed. In order to increase the heat dissipation efficiency of the electronic device 10 in the state of the notebook use mode.

Please refer to FIG. 3 to FIG. 6 , FIG. 3 is a plan view of the structure according to FIG. 2 , FIG. 4 is a bottom view of the structure according to FIG. 2 , and FIG. 5 is a diagram according to FIG. 3 . A perspective view of the structure, and Fig. 6 is a perspective enlarged view of the partial structure according to Fig. 4.

In more detail, the electronic device 10 further includes a motherboard 16, a heat source 15 and a heat dissipation module 14.

The motherboard 16 is located within the first housing 11. The heat source 15 is located in the first housing 11 The motherboard 16 is placed inside. The heat source 15 can be, but is not limited to, a processing chip of the electronic device 10, such as a central processing unit (CPU). The first housing 11 has an upper surface 111, a lower surface 113, and a side surface 112 connected to the upper surface 111 and the lower surface 113. The heat dissipation holes 114 are distributed on a portion of the upper surface 111, a portion of the side surface 112, and a portion of the surface. Lower surface 113. The heat dissipation module 14 is located in the first housing 11 , and the heat dissipation module 14 corresponds to the heat dissipation holes 114 on the first housing 11 .

The heat dissipation module 14 includes a heat sink 140, a fan 144, and a heat pipe 143.

The heat sink 140 is adjacent to the side surface 112 of the first housing 11 , and the heat sink 140 includes a first fin set 141 and a second fin set 142 . The first fin set 141 includes a plurality of first fins 1411 side by side, and the first fins 1411 of the above have a first average distribution density. The average distribution density of the so-called first fins 1411 refers to the number of first fins 1411 of the first fin group 141 within a unit length range. The second fin set 142 includes a plurality of second fins 1421 side by side, and the second fins 1421 of the above have a second average distribution density. The average distribution density of the so-called second fins 1412 refers to the number of second fins 1412 of the second fin set 142 over a unit length. In detail, in the embodiment, the first fins 1411 are equally spaced, and each of the adjacent first fins 1411 is spaced apart by a first distance D1. The second fins 1411 are also equally spaced, and each of the adjacent second fins 1421 is spaced apart by a second distance D2, which is less than the first distance D1. In other words, the arrangement density of the second fins 1421 is relatively dense, and the arrangement density of the first fins 1411 is relatively alienated. Moreover, the first fins 1411 of the embodiment are arranged side by side with the second fins 1421.

An air outlet 1441 of the fan 144 faces the second fins 1421 of the second fin set 142 , such that the second fins 1421 of the second fin set 142 are interposed between the heat dissipation holes 114 and the fan 144 on the side surface 112 . between.

The heat pipe 143 has a substantially L shape and has a first end 1431 and a second end 1432. It should be noted that the shape of the heat pipe 143 of the embodiment is an L shape, but is not limited thereto. In other embodiments, the shape of the heat pipe 143 may also be U-shaped or other suitable shape.

The electronic device 10 further includes a heat conducting component 145 that is stacked on the heat source 15. The first end 1431 of the heat pipe 143 is stacked on the heat conducting element 145 (that is, the heat conducting element 145 is interposed between the heat pipe 143 and the heat source 15), so that the first end 1431 of the heat pipe 143 is transparent. The heat conductive element 15 is 145 and is in thermal contact with the heat source 15. The second end 1432 of the heat pipe 143 is in thermal contact with the second fins 1421 of the second fin set 142, and the heat pipe 143 is in thermal contact with the central portion between the first end 1431 and the second end 1432. The first fins 1411 of the first fin set 141 are such that the first fin set 141 is interposed between the first end 1431 and the second end 1432 of the heat pipe 143.

The heat source 15 generates heat to transfer the heat energy to the heat pipe 143 through the heat conduction member 145, and the heat pipe 143 uniformly transfers the heat energy to the first fins 1411 of the first fin group 141 and the second portions of the second fin group 142. Fin 1421. Since the arrangement density between each of the first fins 1411 is relatively thin, the wind resistance can be reduced to facilitate the natural convective airflow to flow through the airflow paths between the first fins 1411 to absorb the first fin group 141. The heat is dissipated.

As for the density of arrangement between each of the second fins 1421, the overall heat dissipation area of the second fin group 142 can be increased, and the forced convection generated by the exhaust of the fan 144 can be used to efficiently apply the second fin. The heat energy absorbed by the sheet group 142 is dissipated.

In contrast, the fins of the conventional heat sink fin group are designed to be equally spaced, so that the conventional heat sink fin group cannot simultaneously adopt the natural convection and the heat dissipation efficiency when forced convection is used. The heat sink 140 of the present embodiment can effectively improve the heat dissipation efficiency of the overall heat dissipation module 14 by using two sets of fins of different arrangement densities to simultaneously correspond to the natural convection mode and the forced convection mode.

According to the electronic device and the heat dissipation module of the above embodiment, the arrangement of the first fins of the first fin group is relatively thin, so as to reduce wind resistance and facilitate heat dissipation by natural convection. Moreover, the second fins of the second fin group are densely arranged to increase the heat dissipation area, thereby facilitating the matching of the wind to forcibly convect heat. The electronic device and the heat dissipation module are combined with the natural convection and the heat dissipation efficiency during forced convection to improve the overall heat dissipation effect of the electronic device and the heat dissipation module.

Although the present invention has been described above with reference to the preferred embodiments thereof, it is not intended to limit the present invention, and anyone skilled in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of patent protection of the creation shall be subject to the definition of the scope of the patent application attached to this specification.

10‧‧‧Electronic devices

11‧‧‧First housing

12‧‧‧ second housing

13‧‧‧Display module

Claims (11)

A heat dissipation module includes a heat sink, the heat sink includes: a first fin set including a plurality of first fins arranged side by side, the first fins having a first average distribution density; and a second fin a sheet set comprising a plurality of side by side second fins, the second fins having a second average distribution density, the second average distribution density being greater than the first average distribution density; and a heat pipe having thermal contact The first fins of the first fin set and the second fins of the second fin set. The heat dissipation module of claim 1, further comprising a fan, the air outlet of the fan facing the second fin set. The heat dissipation module of claim 1, wherein the first fins are arranged side by side with the second fins. The heat dissipation module of claim 1, wherein each of the adjacent first fins is separated by a first distance, and each of the adjacent second fins is separated by a second distance, the second distance being smaller than the The first distance. An electronic device includes: a first housing having a plurality of heat dissipation holes; a heat source disposed in the first housing; a heat sink disposed in the first housing and corresponding to the heat dissipation holes, the heat dissipation Contains: a first fin set including a plurality of side-by-side first fins, the first fins having a first average distribution density; and a second fin set including a plurality of second fins side by side, The second fins have a second average distribution density, the second average distribution density is greater than the first average distribution density; a fan, an exhaust vent of the fan faces the second fin set; and a heat pipe, heat Contacting the first fins of the first fin set, the second fins of the second fin set, and the heat source. The electronic device of claim 5, wherein the heat pipe has opposite first ends and a second end, the first end is in thermal contact with the heat source, and the second end is in thermal contact with the second fin set, The first fin set is between the first end and the second end. The electronic device of claim 5, wherein the first housing has an upper surface, a lower surface, and a side surface connected to the upper surface and the lower surface, the second fin set being on the side surface The vents are between the fan and the fan. The electronic device of claim 5, further comprising a heat conducting component interposed between the heat pipe and the heat source. The electronic device of claim 5, wherein the first fins are disposed side by side with the second fins. The electronic device of claim 5, further comprising a second housing and a display module, the second housing being pivotally disposed on the first housing and in a deployed position relative to the first housing Closing position Rotating between the two positions, the second housing is stacked on the first housing, and the display module is located on a side of the second housing away from the first housing. The electronic device of claim 5, wherein each of the adjacent first fins is separated by a first distance, and each of the adjacent second fins is separated by a second distance, the second distance being smaller than the first a distance.