M442468 五、新型說明： 【新型所屬之技術領域】 一種得以增加散熱效率並減少成本的LED散熱器，特 別係指-種LED晶片直接固晶於均溫板上，並且均溫板連 接-散熱裝置’使熱能直接自LED晶片傳導至均溫板，再 由均溫板解至散鱗置’使整雜熱效率制最佳化的 LED直導式散熱器。 【先前技術】 自LED問世起，效率高、壽命長、不易破損、反應速 度快、可靠性尚等傳統光源不及的優點，使得LED逐漸取 代傳統燈泡成為市場上的主流產品，並隨著政府大力提倡 節能以及環保，龐大的市場商機以及正面的產品形象誘使 無數廠商投入LED的研發，至此LED步入百家爭鳴的局 面。 然而’再好的產品亦有他的缺點’ LED雖有著以上各 種的優點，但是亦有眾多缺點，包括成本較傳統燈泡為高， 以致售價連帶抬升，以及效率會受高溫影響而急劇下降， 除浪費電力之餘也產生更多的熱能，並使溫度進一步上 升，形成惡性循環，如此一來，除浪費電力之外，亦縮短 LED的使用壽命，因此，LED散熱即成為LED相關產業製 造商的一個新課題。 此外’為了克服亮度不足的缺點，LH)陣列排設成為 一種主流的解決方式，然而LED陣列的散熱問題更是超越 般LED ’尤其是led陣列封裝後，封裝用的材質無可避 3 免的增加更多熱阻，導致LED溫度的增加，以及亮度的下 降’而且LED陣列g積的熱能無法散發時，更有可能造成 LED被燒毀。 目前，習知LED陣列大多製成成品再與導熱裝置或是 散熱裝置連結，大致需經過： 1·固晶：將LED晶片固定在LED支架上。低功率㈣的 封裝接合材料可使用熱導係數約3w/mK的銀膠，而lw 以上的高裤LED封裝，财顧鮮絲較高的錫 膏、金錫桿料等，以降低整體封裝的熱阻抗； 2·打線鍵合：_熱壓合、超音波楔合或以超音波辅助的 熱壓合方式’把倾約1Q//m的金線或織的兩端分別 連結到晶片及LED支架或基板上；及 3. 模造：把完成固晶及打線鍵合的LED支架，填充環氧樹 酯保護晶片’接著在約攝氏15〇度的條件下使環氧樹醋 進行父聯反應，增加環氧樹酯的硬度，並降低吸濕性。 4. 經由上述三點步驟將LED製成成品，再與導熱裝置或是 散熱裝置作連結。 上述封裴技;銜及材質無法有效發揮LED照明裝置運作 時的散熱鱗，其巾，LED支蚊是成為熱随的來源， 以致若未能鱗將廢綠ώ，賴驗在元件巾勢必對元 件的特性、壽命及可靠度產生不良的影響。 綜上所述，此類結構使用了 LED成品、導熱裝置以及 散熱裝置’趣過LED製程、導熱裝置製程、散熱裝置製 程以及成品的結合，致使整體成本提高，除此之外，咖 成品的LED支架造成LED的熱能無法直接的傳導至散熱 裝置，致使整體散熱效果不佳。 有#於此’本案創作人認為實有必要研發出一種可以 降低成本，並且提高散熱效果的一種創新LED照明裝置。 【新型内容】 爰是’本創作之主要目的在於LED晶片直接固晶於均 溫板及/或散熱器，熱能得快速傳導並散發，使散熱效率顯 著的提升，並藉由簡化元件以及減少製程來降低成本。 為達上揭目的，本創作設有一散熱裝置，上述散熱裝 置具有至少-受熱面’並且上述受熱面連接一均溫板，上M442468 V. New Description: [New Technology Field] A kind of LED heat sink that can increase heat dissipation efficiency and reduce cost, especially refers to the type of LED wafer directly fixed on the temperature equalizing plate, and the temperature equalizing plate connection-heat sink 'LED direct-conducting heat sink that allows thermal energy to be directly transmitted from the LED chip to the temperature equalizing plate, and then the uniform temperature plate is solved to the scatter scale to optimize the overall heat efficiency. [Prior Art] Since the advent of LED, the advantages of high efficiency, long life, not easy to break, fast response, and reliability are still incomparable with traditional light sources, making LED gradually replace traditional light bulbs as the mainstream products on the market, and with the government Advocating energy conservation and environmental protection, huge market opportunities and positive product image have attracted countless manufacturers to invest in LED research and development, and LED has entered a situation of contending. However, 'the best products have their shortcomings'. Although LEDs have all of the above advantages, they also have many shortcomings, including the cost is higher than that of traditional bulbs, so that the price increases, and the efficiency is drastically affected by high temperature. In addition to wasting power, it also generates more heat energy and causes the temperature to rise further, forming a vicious circle. As a result, in addition to wasting power, it also shortens the service life of LEDs. Therefore, LED heat dissipation becomes a manufacturer of LED related industries. A new topic. In addition, in order to overcome the shortcomings of insufficient brightness, LH array layout has become a mainstream solution. However, the heat dissipation problem of LED arrays is beyond that of LEDs. Especially after LED array packaging, the material used for packaging is inevitable. Adding more thermal resistance, resulting in an increase in LED temperature, and a decrease in brightness' and the thermal energy of the LED array g cannot be dissipated, it is more likely to cause the LED to be burned. At present, most of the conventional LED arrays are made into finished products and then connected with a heat conducting device or a heat dissipating device, and generally need to go through: 1. Solid crystal: The LED chip is fixed on the LED bracket. The low-power (four) package bonding material can use silver paste with a thermal conductivity of about 3w/mK, and the high-pants LED package of lw or higher, with high solder paste and gold tin bar for lowering the overall package. Thermal impedance; 2·Wire bonding: _ thermocompression, ultrasonic wedge or ultrasonic-assisted thermocompression method. Connect the gold wire or woven end of the 1Q//m to the wafer and LED respectively. On the support or substrate; and 3. Molding: the LED holder that completes the die bonding and wire bonding, is filled with the epoxy resin to protect the wafer', and then the epoxy resin is subjected to a parent reaction at about 15 degrees Celsius. Increase the hardness of the epoxy resin and reduce the hygroscopicity. 4. The LED is made into a finished product through the above three steps, and then connected to a heat conducting device or a heat sink. The above-mentioned sealing technology; the title and material can not effectively play the heat-dissipating scale when the LED lighting device is in operation, and the towel, LED mosquito is the source of the heat, so that if the scale is not used, the green towel will be destroyed. The characteristics, lifetime and reliability of the components have an adverse effect. In summary, this type of structure uses LED finished products, heat-conducting devices, and heat-dissipating devices. The combination of LED process, heat-conducting device process, heat-dissipating device process, and finished product increases the overall cost. In addition, the finished product LED The thermal energy of the LED caused by the bracket cannot be directly transmitted to the heat sink, resulting in poor overall heat dissipation. There is a # here. The creators of this case believe that it is necessary to develop an innovative LED lighting device that can reduce costs and improve heat dissipation. [New content] 爰 is the main purpose of this creation is that the LED chip is directly bonded to the temperature equalizing plate and/or the heat sink, and the heat energy is quickly transmitted and distributed, so that the heat dissipation efficiency is significantly improved, and the component is simplified and the process is reduced. To reduce costs. In order to achieve the above object, the present invention is provided with a heat dissipating device, the heat dissipating device has at least a heat receiving surface, and the heating surface is connected to a temperature equalizing plate.
述均溫板表面直接固晶連接至少一LED晶片，且上述LED 晶片旁間隔排設至少―固接於上述均溫板表面的電路板， 又上述電路板與LED “之間另設有導線相互電性連接， 如此來’上述LED晶片運作時產生之熱能得直接傳導至 均溫板上’並且簡化製造步驟似職製造材料，進而降 低製造成本。 於本較佳實施例巾，上述LED ^ _排設成一咖 晶片組’上述電路板環設於上述LED晶片組外周形成一中 央開孔的圍繞結構’並於表面裸露有—組正、負極接點， 另外，上述均溫板於中心設有一真空腔體，並於上述真空 腔體内設有至少-金屬支撐件以及流體，上述金屬支擇: 係由金屬鋼粉經燒結成型的毛細結構，搭配設為散熱液或 純水之流體，並诚_蒸發及麟 熱能均勻傳導，更㈣溫板具細峨導性使^板將 排列二卜片亡:撕身受熱面相對側設為複數個間隔 3的:片結構’並與均溫板之間另設有—連接裝置相互 ，·且接固定，於本較佳f -m、 述連接裝置包含一螺孔、 以及1栓，上述螺孔以及貫穿螺孔分別位於 皿板騎鰱置_齡置，並以賴栓貫穿螺 =:使蝴咖卿瓣_，熱能得完 :v至雜枝，_錄置之則結構將熱能 散發於空氣中。 於另-較佳實施例中，本創作設有一散熱裝置，上述 散熱裝置具註少—受熱面，上較熱面表©直接固晶連 接至少- LED晶片，且上述咖晶片旁間隔排設至少一 固接於上述受熱面的電路板，又上述電路板與LED晶片之 間另設有導線相互電性連接，此外，上述散熱裝置於受熱 面相對側設為複數個間隔排列_片結構，如此一來，上 述LED晶片運作時產生之熱能得直接傳導至散熱裝置上， 再藉由散熱裝置之鰭片結構將熱能散發於空氣中，使散熱 效率最佳化，並且簡化製造步驟以及縮減製造材料，進而 降低製造成本。 於本較佳實施例中，上述LED晶片陣列排設成一 LED 晶片組，上述電路板環設於上述LED晶片組外周形成一中 央開孔的圍繞結構，並於表面裸露有一組正、負極接點。 本創作的特點在於LED晶片直接固晶於均溫板及/或 散熱器，熱能得快速傳導並散發，有效提升散熱效率，並 且間化製造步驟以及縮減製造材料’進而降低製造成本。 【實施方式】 茲為便於更進一步對本創作之構造、使用及其特徵有 更深-層明確、詳實的認識與瞭解，爰舉出較佳實施例， 配合圖式詳細說明如下·· 請參閱第1圖至第3圖所示的第一較佳實施例，本創 作LED直導式散熱器主要設有-散熱褒置1〇，上述散熱裳 置10具有至少-父熱面1卜並於受熱面U相對側設為複 數個間隔排列的鰭片結構12，上述受熱面u上連接一均溫 板20 ’上述均溫板20表面直接固晶連接至少一 LED晶片 30，且上述LED晶片30旁間隔排設至少一固接於上述均 溫板20表面的電路板40，又上述電路板4〇與LED晶片 之間另設有導線50相互電性連接，於本較佳實施例中， 上述LED晶片30係由絕緣膠直接固晶於均溫板2〇上，上 述電路板40係由黏膠直接黏接於均溫板2〇上，然，上述 連接方式僅為方使說明本創作並非加以限制，亦可採用其 他材質以及連接方式加以固定，如導熱黏膠、卡扣 及鎖固等方式加以實施。 此外，上述LED晶片30陣列排設成一 LED晶片組， 上述電路板40環設於上述LED晶片組外周形成一十央開 孔的圍繞結構’並於絲減有—組正、負減點41，然\ 上述LED晶片30陣列排設僅為方便說明本創作並非加以 限制’亦可由單顆LED α及其简财絲加以實施。 另睛參閱第4圖及第5圖所示的均溫板20結構，上述 均溫板20於巾喊有—真空雜2卜上述真空腔體21内 ''金屬支撐件22以及流體23，並且上述金屬支β 液彰驗燒_的板_ ’觀設為散熱 均mn ’並由流體23的蒸發及凝結的特性，使 導I，然將熱能均書，更使均溫板2G具細圭的熱 …、、’上述所舉金屬支撐件a僅為方便說明本創作並 0以限制’亦可不設置金屬支撐件2 的金屬切件22來加以實施。U不3毛為。構 月再> 閱第I圖至第3圖所示的第一較佳實施例，上 述散絲置1G於受熱面11與均跳2〇之接_向下凹設 形成一對應形狀之嵌槽⑴，上述均溫板2G |設於上述受 熱面η的嵌槽m内，藉由上述嵌槽U1與均溫板2〇接觸 面積增加，使傳導效果提升，並纽的將均溫板％固定於 嵌槽111内。 除此之外，上述散熱裝置10與均溫板20之間另設有 一連接裝置60相互組接固定，上述連接裝置6〇包含一螺 孔61貝牙螺孔62以及一螺栓63，於本較佳實施例中， 上述連接裝置60設為雜，其巾，螺孔61係設於散熱裝 置10之嵌槽111内，貫穿螺孔62係設於均溫板2〇上，並 以上述螺栓63貫穿螺接固定，藉由上述散熱裝置10與均 m·板20之緊密結合，使導熱效果最佳化，然，上述螺栓式 結構僅為方便說明連接裝置60，並非加以限制，亦即本創 作另可採用黏貼、低溫熱焊以及卡扣固定等方式加以實施。 綜上幾點所述，上述LED晶片30運作時產生之熱能 得直接傳導至均溫板20上，再將熱能自均溫板2〇傳導至 M442468 政熱裝置10 ’亚由散熱裝置1G的則結構12將熱能散發 於二氣中’如此-來，整體散熱效率將達到最佳化，並且 簡化製造步_及縮賴造_ ’進叫健造成本。 請參閱第6圖及第7騎示的第二較佳實施例，本創 作設有-散齡置10’上述散熱輕1G具有至少一受熱面 η ’並於叉熱φ 11姉側設為複數個間隔排列的縛片結 構’上述受熱面11表面直接固晶連接至少—LED晶片3〇， 且上述LED 4 30旁咖排設至少—固接於上述受熱面 11的電路板40，又上述電路板4〇與咖晶片3〇之間另 設有導線50減電性連接於本較佳實施例中，上述led b曰曰片30係由絕緣膠直接固晶於受熱面u上，上述電路板 40係由黏膠直接黏接於受熱面u上，然，上述連接方式僅 為方便說明本創作並非加以限制，亦可採用其他材質以及 連接方式加以，如導翻纟膠、卡扣目定以及鎖固等方 式加以實施。 於本較佳實施例中’上述散歸置1G於受熱面u與 LED晶片30及電路板40之細面向下凹設形成一對應形 狀之嵌槽111，上述LED晶片30及電路板4〇裝設於上述 受熱面11的肷槽111内，藉由接觸面積增加，使傳導效果 提升，並有效的將LED晶片30及電路板4〇固定於嵌槽lu 内。 此外，上述LED晶片30陣列排設成一 LED晶片組， 上述電路板40環設於上述LED晶片組外周形成一中央開 孔的圍繞結構’並於表面裸露有一組正、負極接點4卜然， 9 上述LED晶片30陣列排設僅為方便說明本創作並非加以 限制’亦可由單顆LED以及其他排設方式來加以實施。 综上所述，上述LED晶片30運作時產生之熱能得直 接傳導至散熱裝置1〇上，再藉由散熱裝置1〇的鰭片結構 12將熱能散發於空氣中，如此一來，整體散熱效率將達到 最佳化，並且簡化製造步驟以及縮減製造材料，進而降低 製造成本。 以上所舉實施例，僅用為方便說明本創作並非加以限 制，在不離本創作精神範疇，熟悉此一行業技藝人士依本 創作申請專利_及顺說明所作之各種簡易變形與修 —飾’均仍應含括於以下申請專利範圍中。 【圖式簡單說明】 第1圖係本創作LED直導式散熱器第一較佳實施例之 立體圖； 第2圖係第1圖之俯視圖； 第3圖係第1圖之分解圖； 第4圖係第一較佳實施例中均溫板之俯視圖； 第5圖係第4圖之剖面圖； 第6圖係本創作LED直導式散熱器第二較佳實施例之 立體圖，以及 第7圖係第6圖之分解圖。 M442468 【主要元件符號說明】 10— -散熱裝置 11— 受熱面 111-嵌槽 12— ,if片結構 20- 均溫板 21- -真空腔體 ' 22—金屬支撐件 • 23-流體 30--LED 晶片 40- -電路板 41- 正、負極接點 50-導線 60- 連接裝置 61- 螺孔 φ 62--貫穿螺孔 63-螺检The surface of the uniform temperature plate is directly bonded to at least one LED chip, and the LED chip is spaced apart at least adjacent to a circuit board fixed to the surface of the temperature equalizing plate, and the circuit board and the LED are additionally provided with wires. Electrically connected, so that the thermal energy generated during the operation of the LED chip is directly transmitted to the temperature equalization plate and simplifies the manufacturing process to manufacture the material, thereby reducing the manufacturing cost. In the preferred embodiment, the above LED ^ _ The circuit board is arranged in the outer periphery of the LED chip group to form a surrounding structure of the central opening, and the surface is exposed with a set of positive and negative contacts. In addition, the above-mentioned temperature equalizing plate is disposed at the center. a vacuum chamber is provided, and at least a metal support member and a fluid are disposed in the vacuum chamber, and the metal is selected as follows: a capillary structure formed by sintering a metal steel powder, and a fluid which is set as a heat dissipating liquid or a pure water. And Cheng _ evaporation and Lin heat can be evenly conducted, and (4) the temperature plate has fine 峨 conductivity so that the board will be arranged in two pieces: the opposite side of the torn body is set to a plurality of intervals 3: the structure of the sheet and the temperature board Further, the connecting device is mutually connected and fixed. In the preferred f-m, the connecting device comprises a screw hole and a plug, and the screw hole and the through screw hole are respectively located on the plate riding device. Set, and the tying bolts through the snails =: make the butterfly _ _, the heat is finished: v to the stalks, the structure of the _ recorded thermal energy is emitted in the air. In another preferred embodiment, the creation The heat dissipating device is provided with a small heat-receiving surface, and the upper surface of the hot surface is directly bonded to at least the LED chip, and at least one of the circuit boards fixed to the heating surface is arranged next to the coffee chip. Further, a conductive wire is electrically connected between the circuit board and the LED chip, and the heat dissipating device is arranged on the opposite side of the heating surface as a plurality of spaced-distributed structures, so that the heat generated by the LED chip during operation is generated. It is directly transmitted to the heat sink, and the heat energy is dissipated into the air by the fin structure of the heat sink, thereby optimizing the heat dissipation efficiency, simplifying the manufacturing steps and reducing the manufacturing material, thereby reducing the manufacturing cost. In an example, the LED chip array is arranged as an LED chip set, and the circuit board ring is disposed on a periphery of the LED chip group to form a central opening surrounding structure, and a set of positive and negative contact points are exposed on the surface. The invention is characterized in that the LED chip is directly solid crystallized on the temperature equalizing plate and/or the heat sink, the heat energy is quickly transmitted and distributed, the heat dissipation efficiency is effectively improved, and the manufacturing steps are reduced and the manufacturing material is reduced, thereby reducing the manufacturing cost. It is convenient to further deepen the understanding, understanding and understanding of the structure, use and characteristics of this creation. The preferred embodiment is described below. The details are as follows: · Please refer to Figure 1 to Figure 3. In the first preferred embodiment, the LED direct-conducting heat sink of the present invention is mainly provided with a heat dissipating device 1 , and the heat dissipating skirt 10 has at least a parent hot surface 1 b and is set to a plurality on the opposite side of the heating surface U. The fin structure 12 is arranged at intervals, and the heating surface u is connected to a temperature equalizing plate 20'. The surface of the temperature equalizing plate 20 is directly bonded to at least one LED chip 30, and the LED chips 30 are arranged side by side. The circuit board 40 is fixed to the surface of the temperature equalizing plate 20, and the connecting circuit 50 is electrically connected to the LED chip. In the preferred embodiment, the LED chip 30 is connected to the LED chip 30. The insulating glue is directly fixed on the temperature equalizing plate 2〇, and the circuit board 40 is directly bonded to the temperature equalizing plate 2 by the adhesive. However, the above connection method is only for the purpose of explaining that the creation is not limited, and It can be fixed by other materials and connection methods, such as thermal adhesive, snap and lock. In addition, the array of the LED chips 30 is arranged as an LED chip set, and the circuit board 40 is disposed on the outer circumference of the LED chip group to form a surrounding structure of a ten-opening hole and is reduced by a group of positive and negative points 41. However, the above array of LED chips 30 is arranged only for convenience of description. This creation is not limited to it. It can also be implemented by a single LED α and its simple wire. Referring to the structure of the temperature equalizing plate 20 shown in FIG. 4 and FIG. 5, the above-mentioned temperature equalizing plate 20 has a vacuum metal body 22 and a fluid 23 in the vacuum chamber 21, and The above-mentioned metal branch β liquid is inspected for the _ plate _ 'view is set to heat dissipation mn ' and is characterized by the evaporation and condensation of the fluid 23, so that the heat conduction is even, so that the uniform temperature plate 2G has a fine The heat..., 'the above-mentioned metal support member a is only for convenience of explanation and is not limited to 'can be provided without the metal cutting member 22 of the metal support member 2. U is not 3 hairs. <<Following the Moon> Referring to the first preferred embodiment shown in FIG. 1 to FIG. 3, the above-mentioned loose filaments 1G are formed on the heating surface 11 and the outer jump 2 _ downwardly recessed to form a corresponding shape. The groove (1), the above-mentioned temperature equalizing plate 2G| is disposed in the groove m of the heating surface η, and the contact area of the groove U1 and the temperature equalizing plate 2 increases, so that the conduction effect is improved, and the uniform temperature plate is increased. It is fixed in the slot 111. In addition, a plurality of connecting devices 60 are disposed between the heat dissipating device 10 and the temperature equalizing plate 20, and the connecting device 6 includes a screw hole 61 and a bolt 63. In the preferred embodiment, the connecting device 60 is made of a dummy, and the screw hole 61 is disposed in the recess 111 of the heat sink 10, and the through screw hole 62 is disposed on the temperature equalizing plate 2, and the bolt 63 is used. Through the screwing and fixing, the heat conduction effect is optimized by the close combination of the heat dissipating device 10 and the m-plate 20, however, the bolt-type structure is only for convenience of explaining the connecting device 60, and is not limited, that is, the creation It can also be implemented by means of adhesion, low temperature heat welding and snap fastening. In summary, the thermal energy generated by the operation of the LED chip 30 is directly transmitted to the temperature equalizing plate 20, and then the thermal energy is transmitted from the temperature equalizing plate 2 to the M442468 thermal device 10'. Structure 12 dissipates thermal energy in the second gas. [This way, the overall heat dissipation efficiency will be optimized, and the manufacturing steps will be simplified and the manufacturing process will be reduced. Referring to FIG. 6 and the second preferred embodiment of the seventh riding device, the present invention is provided with a scatter length of 10'. The heat dissipating light 1G has at least one heated surface η ' and is set to plural on the fork heat φ 11 姊 side. a spacer structure of the plurality of spacers, wherein the surface of the heating surface 11 is directly bonded to at least the LED chip 3〇, and the LED 4 30 is disposed at least—the circuit board 40 fixed to the heating surface 11 and the circuit A wire 50 is electrically connected between the board 4 and the chip 3 in a preferred embodiment. The LED b is directly bonded to the heating surface u by an insulating glue. The 40 series is directly adhered to the heating surface u by the adhesive. However, the above connection method is only for convenience. The creation is not limited, and other materials and connection methods may be used, such as lead-turning glue, snap-on, and Locking and other methods are implemented. In the preferred embodiment, the above-mentioned bulk placement 1G is recessed on the heating surface u and the thin faces of the LED chip 30 and the circuit board 40 to form a corresponding shape of the recess 111, and the LED chip 30 and the circuit board 4 are mounted. In the gutter 111 of the heating surface 11, the contact area is increased to improve the conduction effect, and the LED chip 30 and the circuit board 4 are effectively fixed in the recess. In addition, the LED chips 30 are arranged in an array of LED chips, and the circuit board 40 is disposed on the outer periphery of the LED chip group to form a central opening surrounding structure and has a set of positive and negative contacts 4 on the surface. 9 The above array of LED chips 30 is arranged only for convenience of description. This creation is not limited to it. It can also be implemented by a single LED and other arrangement methods. In summary, the heat generated by the operation of the LED chip 30 is directly transmitted to the heat sink 1 , and the heat is dissipated into the air by the fin structure 12 of the heat sink 1 , thereby achieving overall heat dissipation efficiency. Optimization will be achieved, and manufacturing steps will be simplified and manufacturing materials reduced, thereby reducing manufacturing costs. The above embodiments are used for convenience only to illustrate that the present invention is not limited. In the spirit of the creative spirit, those skilled in the art are familiar with the various patents and simplifications of the invention. It should still be included in the scope of the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a first preferred embodiment of the LED direct-conducting heat sink of the present invention; Fig. 2 is a plan view of Fig. 1; Fig. 3 is an exploded view of Fig. 1; 1 is a plan view of a temperature equalizing plate in a first preferred embodiment; FIG. 5 is a cross-sectional view of FIG. 4; FIG. 6 is a perspective view of a second preferred embodiment of the LED direct conducting heat sink of the present invention, and a seventh embodiment The figure is an exploded view of Figure 6. M442468 [Description of main components] 10— Heat sink 11—heating surface 111-fitting 12—, if sheet structure 20—soaking plate 21—vacuum cavity' 22—metal support • 23-fluid 30-- LED chip 40 - - circuit board 41 - positive and negative contact 50 - wire 60 - connection device 61 - screw hole φ 62 - through screw hole 63 - screw check