M417227 五、新型說明： 【新型所屬之技術領域】 本創作係關於一種加工設備，特別係關於一種研磨加 工設備。 【先前技術】 工業發展的水平越高，各種產品或零組件的分類與設 計亦發精細，而為滿足此類市場需求，業者在製程機台方 面投入相當可觀的開發能量，以期在技術與成本上進一步 突破。由於不同製程機台的組裝加工脫離不了對基本工件 的需求，因此連帶使得各種研磨加工設備的重要性相對甚 南。 請參照圖1所示，其為一種習知的研磨加工設備1的 示意圖。研磨加工設備1包含一承載裝置11及二研磨裝 置12、13。該等研磨裝置12、13對應設置於承載裝置11 的左右兩側。因此，當一待加工之工件W由他處移至承載 裝置11後，研磨裝置12、13的砂輪121、131會對應於 工件W左右兩側的第一表面P1及第二表面P2,實施研磨 作業。 然而，習知的研磨加工設備1只可同時研磨加工工件 W之第一表面P1及第二表面P2,當要研磨加工如圖1之 工件W的第三表面P3、第四表面P4或其它表面時，必須 將工件W自研磨加工設備1取下，並以可研磨第三表面 P3、第四表面P4或其它表面之另一研磨加工設備研磨加 M417227 工。另外，研磨加工設備1也無法同時研磨加工第一表面 P1、第二表面P2、第三表面P3及第四表面P4。 承上，因研磨加工設備1無法研磨第三表面P3及第 四表面P4，更無法同時研磨第一表面P1、第二表面P2、 第三表面P3及第四表面P4，因此，當要（同時）研磨工 件W之第三表面P3及第四表面P4時，需更換另一研磨 加工設備研磨加工，如此，不僅使工件W的加工精度降 低，也會降低研磨加工的產能。 因此，如何提供一種研磨加工設備，不僅可提高工件 之加工精度，又可提升其產能，已成為重要課題之一。 【新型内容】 有鑑於上述課題，本創作之目的為提供一種可提高工 件之加工精度，又可提升其產能之研磨加工設備。 為達上述目的，依據本創作之一種研磨加工設備用以 研磨加工一工件。研磨加工設備包含一第一承載裝置、一 第二承載裝置、一固定裝置以及複數研磨裝置。第二承載 裝置設置於第一承載裝置，工件設置於第二承載裝置。固 定裝置設置於第一承載裝置之上。該等研磨裝置與固定裝 置連結，並對工件的至少四個不同的表面同時進行研磨加 工。 在一實施例中，第一承載裝置具有一驅動單元，驅動 單元驅動第二承載裝置於一第一軸向移動。 在一實施例中，第二承載裝置沿工件之長軸方向相對 5 M417227 固定裝置移動。 在一實施例中，該等研磨裝置分別設置於工件之兩 側。 在一實施例中 在一貫施例中 角度調整單元，該 旋轉。 ，該等研磨裝置的其中之二係可旋轉。 ’該等研磨裝置的I中之=分別具有一 等角度調整單元分別控制該等研磨裝置 在一實施例中，該等研磨裝置係可分別沿 平田间 及/或一第三軸向移動 在一實施例中，該等研磨裝置分別具有一驅動單元， 該等驅動單元分別驅動該等研磨裝置於第二軸向及/ 二轴向移動。 在-實施例中，第二軸向及第三軸向之間具有 夹 角，夾角為90度 在-I鮮j t，該等研磨|置的輯肖度分 度至180度之間。 、 在-實施财，f轉研縣置分料有—研 一驅動部件，該等驅動部件分別驅動該等研磨單元轉動' 在-實施例中，該等研磨裝置設置於Μ裝 侧、相反侧或相對側。 在-實施财，該等研磨t置係為錯位設置。 承上所述，因依據本創作 數研㈣* 磨加卫設備具有才 表面同時進行研LI磨; 猎此與白知相較，可藉由本| M417227 作之該等研磨裝置研磨加工物件之第三表面、第四表面， 也可同時研磨物件的第一表面、第二表面、第三表面及第 四表面，故並不需以另一研磨加工設備對物件研磨加工。 因此，本創作之研磨加工設備不僅可提高工件之加工精 度，又可提升其產能。另外，在本創作的一實施例中，該 等研磨裝置可為錯位設置，或設置於固定裝置之同一側、 相反侧或相對側。藉此，一樣可提高工件之加工精度，也 可提升其產能。 【實施方式】 以下將參照相關圖式’說明依本創作實施例之' —種研 磨加工設備，其中相同的元件將以相同的元件符號加以說 明。 請同時參照圖2A及圖2B所示，其中，圖2A為依據 本創作第一實施例之一種研磨加工設備2的示意圖，而圖 2B為圖2A之研磨加工設備2的俯視圖。研磨加工設備2 可用以研磨加工一工件W，工件W為一線性滑執或其他 相似之長形結構者，但不以此為限。其中，研磨加工設備 2包含一第一承載裝置21、一第二承載裝置22、一固定裝 置23以及複數研磨裝置。 第二承載裝置22設置於第一承載裝置21，而工件W 設置於第二承載裝置22,且視其規劃研磨的部分而決定其 基準面，如圖2所示，工件W以外側之第一表面P1為其 基準面。 7 M417227 第一承載裝置21具有一驅動單元（圖未顯示），而驅 動單元可驅動第二承載裝置22於一第一軸向X移動。其 中，第一軸向X為工件W之長轴軸向。於此，第二承載 裝置22可沿工件W之長軸方向相對於固定裝置23移動。 在本實施例中，第二承載裝置22具有一固定工件W 的承載元件R1，以承載工件W，而承載元件R1與工件W 外側的第一表面P1接觸，以提供工件W均勻穩定的支撐 力。在其他實施態樣中，第二承載裝置22則可具有容置 工件W的空間，例如凹槽。另外，第一承載裝置21具有 二軌道R2、R3，以承載第二承載裝置22及工件W，並提 供第二承載裝置22及工件W均勻穩定的支撐力，且工件 W可藉由第二承載裝置22於第一承載裝置21上移動。在 其他實施態樣中，第一承載裝置21亦可具有容置第二承 載裝置22的空間，例如凹槽。 固定裝置23設置於第一承載裝置21之上，具體而 言，兩者可以其他懸吊裝置（圖未示）維持彼此間的相對 位置關係。再者，複數研磨裝置是分別連結於固定裝置 23，由固定裝置23提供其足夠的支撐，且該等研磨裝置 分別設置於工件W之兩側。在本實施例中，係以四個研磨 裝置24a、25a、24b、25b為例。進一步而言，本實施例具 有二個固定裝置23a、23b，且實質上分別呈门字形，而其 中兩個研磨裝置24a、25a分別固定於固定裝置23a之一 端，另兩個研磨裝置24b、25b分別固定於固定裝置23b 之一端。詳細而言，如圖2A所示，相對於固定裝置23a， M417227 研磨裝置24a係設置於第二承載裝置22之左側，而研磨裝 置25a係設置於第二承載裝置22之右側。另外，相對於固 定裝置23b，研磨裝置24b係設置於第二承載裝置22之左 側，而研磨裝置25b係設置於第二承載裝置22之右側。 藉此，研磨裝置24a、25a、24b、25b可以對工件W之四 個不同的表面同時進行研磨加工。 以下，請再參照圖2A及圖2B以詳細說明本實施例之 研磨裝置24a、25a、24b、25b的作動方式。 研磨裝置24a、25a、24b、25b可分別沿一第二軸向A、 Y及/或一第三軸向B、Z移動，以同時研磨加工工件W。 於此，研磨裝置24a、25a、24b、25b可分別沿第二軸向A、 Y及第三軸向B、Z移動。值得一提的是，在其它的實施 態樣中，研磨裝置24a、25a、24b、25b可分別沿第二軸向 A、Y或第三轴向B、Z移動。於此並不加以限制。其中， 研磨裝置24a、25a、24b、25b可分別具有一驅動單元241a、 251a、241b、251b，該等驅動單元 241a、251a、241b、251b (圖2A未顯示241b)分別驅動研磨裝置24a、25a、24b、 25b於第二軸向A、Y及第三軸向B、Z移動。其中，第二 轴向A(Y)及第三軸向B(Z)的夾角可為任意角度，本 實施例係以90度為例作說明。當然，在其他實施態樣中， 第二軸向A(Y)及第三軸向B(Z)的夾角可視其需要， 例如可介於〇度至180度之間。 研磨裝置24a、25a、24b、25b更可分別具有一研磨 單元 242a、252a、242b、252b 及一驅動部件 243a、253a、 9 M417227 243b、253b (圖2A未顯示243b )，該等驅動部件243a、 253a、243b、253b可分別驅動該等研磨單元242a、252a、 242b、252b轉動，以對工件W進行研磨。其中，研磨單 元242a、252a、242b、252b可分別具有一砂輪或一磨輪， 本實施例是以砂輪為例作說明，且驅動部件243a、253a、 243b、253b 可分別驅動研磨單元 242a、252a、242b、252b 之砂輪運轉，藉由砂輪與驅動部件243a、253a、243b、253b 的配合可對工件W進行研磨加工。其中，需注意的是，研 磨裝置24a、25a ' 24b、25b的設計方式不應以本實施例為 限’可視需求有不同的方式’端以能提向研磨加工之效率 為優先考量。 另外’研磨裝置24a、25a係為可旋轉。詳而言之，研 磨裝置24a、25a更可分別具有一角度調整單元244a、 254a，依工件w不同的加工需求，角度調整單元244&、 254a使研磨裝置24a、25a順時針或逆時針旋轉，以對工 件W表面的不同位置進行加工，藉此更可提高研磨裝置 24a、25a的自由度。當然，角度調整單元244&、25如的 設置位置並無特別限制。在本實施例中，研磨裳置24a、 25a之研磨單元242a、252a的旋轉角度可介於〇度至 度之間。不過，當研磨單元242a、252a研磨加工工件w 時’較佳者之研磨角度可介於〇度至90度之間，其中〇 度是研磨單元242a、252a平行於第二軸向a、γ ,而9〇 度是研磨單元242a、252a垂直於第二軸向a、γ (即平行 於第三軸向β、ζ)。另外，再說明的是，角度調整單元244a、 M417227 254a可分別以手動或自動（例如以伺服馬達驅動）方式§周 整該研磨裝置24a、25a的旋轉角度’於此並不加以限制。 值得一提的是，本實施例之研磨裝置24a、25a' 24b 25b可分別於第二軸向A、Y及第三軸向B、Z移動’故四 個研磨裝置24a、25a、24b、25b研磨加工時可分別具有一 個自由度（共8個自由度）。此外，第二承載裝置22可 ' 工件w之長轴方向（第一軸向X)相對固定裝置23移動 故可使研磨裝置24a、25a、24b、25b研磨加工時爲有另一 φ 自由度。因此，本創作之研磨加工設備2進行工件W之研 磨加工時可具有9個自由度（9個軸向）。 此外，本實施例之二個研磨裝置24a、25a設置於固疋 裝置23a之同一側，且為同一平面，而另二個研磨裝置 24b、25b係設置於固定裝置23b之同一側’且研磨裝置 • 24a、25a及研磨裝置24b、25b係分別設置於固定裝置23a 及23b之相對側。換言之，研磨裝置24a、25a於同一平面 並排，研磨裝置24b、25b亦於同一平面上並排’且研磨 .鲁裝置24a、25a與研磨裂置24b、25b係彼此相對设置°不 :過，在其它的實施例中，研磨裝置24a、25a可為前後錯位、 , 或者研磨裝置24a、25a及研磨裝置24b、25b設置於同一 固定裝置，且位於固定裝置的相反側。 以下續以上述實施例為例，並配合圖3所示’進一步 說明研磨裝置24a、25a、24b、25b之該等研磨單元242a、 252a、242b、252b研磨加工物件W之情況。為了清楚說 明，圖3只顯示研磨單元242a、252a、242b、252b及工件 M417227 W，且兩者之比例與圖2不同，兩者之比例亦與實際比例 不同。 如圖3所示，由於本創作之驅動單元241b、251b (圖 3未顯示）可分別驅動二個研磨裝置24b、25b之研磨單元 242b、252b於第二軸向A、Y移動，因此，研磨單元242b、 252b可同時研磨加工工件W之第二表面P2及第三表面 P3。另外，要研磨工件W之第四表面P4、第五表面P5、 第六表面P6、第七表面P7及第八表面P8時，可同時藉由 驅動單元241a、251a及角度調整單元244a、254a (圖3 未顯示）調整研磨單元242a、252a之位置及旋轉角度。例 如研磨單元242a、252a分別旋轉90度時（垂直於第二軸 向A、Y)可研磨加工第六表面P6、第七表面P7及第八 表面P8。另外，研磨單元242a、252a分別旋轉0度與90 度之間時，研磨單元242a可研磨加工第四表面P4，而研 磨單元252a可研磨加工第五表面P5，於此，二個研磨單 元242a、252a不僅可研磨工件W之對向表面（第四表面 P4及第五表面P5)，也可研磨工件W之上表面（第七表 面P7及第八表面P8 )。因此，本創作之研磨加工設備2 不僅可研磨加工物件W外侧之第二表面P2及第三表面 P3，且可不用更換其它的研磨加工設備而同樣可研磨加工 物件W内側之第四表面P4、第五表面P5、第六表面P6、 第七表面P7及第八表面P8。因此，可以本創作之研磨加 工設備2對工件W的至少四個不同的表面同時進行研磨加 工。 M417227 特別一提的是，也可於固定裝置23b上，且於兩研磨 裝置24b、25b之間設置另一個研磨裝置（圖未顯示），並 於研磨工件W之第二表面P2及第三表面P2的同時，以 該另一個研磨裝置同時研磨工件W之第六表面P6。這樣， 不僅可更快完成工件W之研磨加工工作，而且也可提高其 加工精度。 另外，請參照圖4所示，其為本創作第二實施例之一 種研磨加工設備3的示意圖。 本實施例之研磨加工設備3與前述實施例之研磨加工 設備2大致相同，而研磨加工設備3與研磨加工設備2主 要的不同是，研磨加工設備3只具有一固定設置33，且研 磨裝置34a、35a係設置於固定裝置33之一侧，而研磨裝 置34b、35b係設置於固定裝置33之相反侧。 此外，研磨加工設備3其它元件的技術特徵可參照研 磨加工設備2的相同元件，於此不再贅述。 另外，請參照圖5所示，其為本創作第三實施例之一 種研磨加工設備4的示意圖。 本實施例之研磨加工設備4與前述實施例之研磨加工 設備3大致相同，而研磨加工設備4與研磨加工設備3主 要的不同是，研磨裝置44a、45a係為前後錯位設置於固定 裝置43。 此外，研磨加工設備4其它元件的技術特徵可參照研 磨加工設備3的相同元件，於此不再贅述。 綜上所述，因依據本創作之一種研磨加工設備具有複 M417227 數研磨裝置，且該等研磨裝置可對工件的至少四個不同的 表面同時進行研磨加工。藉此，與習知相較，可藉由本創 作之該等研磨裝置研磨加工物件之第三表面、第四表面， 也可同時研磨物件的第一表面、第二表面、第三表面及第 四表面，故並不需以另一研磨加工設備對物件研磨加工。 因此，本創作之研磨加工設備不僅可提高工件之加工精 度，又可提升其產能。另外，在本創作的一實施例中，該 等研磨裝置可為錯位設置，或設置於固定裝置之同一側、 相反側或相對側。藉此，一樣可提高工件之加工精度，也 可提升其產能。 以上所述僅為舉例性，而非為限制性者。任何未脫離 本創作之精神與範疇，而對其進行之等效修改或變更，均 應包含於後附之申請專利範圍中。 【圖式簡單說明】 圖1為一種習知的研磨加工設備的示意圖； 圖2A為依據本創作第一實施例之一種研磨加工設備 的示意圖； 圖2B為圖2 A之研磨加工設備的俯視圖。 圖3為本創作第一實施例之研磨單元研磨加工工件的 不意圖， 圖4為依據本創作第二實施例之一種研磨加工設備的 示意圖；以及 圖5為依據本創作第三實施例之一種研磨加工設備的 14 M417227 示意圖。 【主要元件符號說明】 〔習知〕 1 :研磨加工設備 • 11 :承載裝置 12、13 :研磨裝置 ' 121、131 :砂輪 鲁 P1〜P4 :表面 W :工件 〔本創作〕 2、3、4 :研磨加工設備 ' 21、31、41 :第一承載裝置 ' 22、32、42 ··第二承載裝置 23a、23b、33、43 :固定裝置 24a、24b、25a、25b、34a、34b、35a、35b、44a、44b、 .· 45a、45b :研磨裝置 241a、241b、251a、251b、341a、351a、351b、441a、451a、 45lb :驅動單元 4 242a、242b、252a、252b、342a、342b、352a、352b、442a、 442b、452a、452b :研磨單元 243a、243b、253a、253b、343a、353a、353b、443a、453a、 453b :驅動部件 244a、244b、254a、254b、344a、354a、354b、444a、454a、 15 M417227 454b :角度調整單元 A、Y :第二轴向 Β、Ζ :第三轴向 Ρ1〜Ρ8 ··表面 R1 :承載元件 R2〜R3 :軌道 W :工件 X :第一軸向M417227 V. New description: [New technical field] This creation is about a processing equipment, especially for a grinding and processing equipment. [Prior Art] The higher the level of industrial development, the finer classification and design of various products or components, and in order to meet the needs of such markets, the industry has invested considerable development energy in the process machine, with a view to technology and cost. Further breakthroughs. Since the assembly and processing of different process machines cannot be separated from the requirements of basic workpieces, the importance of various grinding and processing equipment is relatively large. Referring to Figure 1, there is shown a schematic view of a conventional lapping apparatus 1. The lapping apparatus 1 comprises a carrying device 11 and two grinding devices 12, 13. The grinding devices 12 and 13 are correspondingly disposed on the left and right sides of the carrier device 11. Therefore, when the workpiece W to be processed is moved from the other to the carrying device 11, the grinding wheels 121, 131 of the grinding devices 12, 13 correspond to the first surface P1 and the second surface P2 on the left and right sides of the workpiece W, and are ground. operation. However, the conventional lapping apparatus 1 can simultaneously grind the first surface P1 and the second surface P2 of the workpiece W, when the third surface P3, the fourth surface P4 or other surface of the workpiece W as shown in FIG. 1 is to be ground. At this time, the workpiece W must be removed from the lapping processing apparatus 1 and ground with another grinding processing apparatus capable of grinding the third surface P3, the fourth surface P4 or other surfaces. Further, the polishing processing apparatus 1 cannot simultaneously polish the first surface P1, the second surface P2, the third surface P3, and the fourth surface P4. The first surface P1, the second surface P2, the third surface P3, and the fourth surface P4 cannot be simultaneously polished because the grinding processing apparatus 1 cannot grind the third surface P3 and the fourth surface P4, and therefore, When the third surface P3 and the fourth surface P4 of the workpiece W are polished, another polishing processing equipment needs to be replaced, so that not only the processing accuracy of the workpiece W is lowered, but also the throughput of the polishing processing is reduced. Therefore, how to provide a grinding processing equipment has not only improved the machining accuracy of the workpiece, but also increased its productivity, which has become one of the important topics. [New content] In view of the above problems, the purpose of this creation is to provide a grinding and processing equipment that can improve the processing accuracy of workpieces and increase their productivity. In order to achieve the above object, a grinding processing apparatus according to the present invention is used for grinding a workpiece. The lapping apparatus includes a first carrying device, a second carrying device, a securing device, and a plurality of lapping devices. The second carrying device is disposed on the first carrying device, and the workpiece is disposed on the second carrying device. The fixing device is disposed above the first carrier device. The polishing devices are coupled to the fixture and simultaneously machine at least four different surfaces of the workpiece. In one embodiment, the first carrier has a drive unit that drives the second carrier to move in a first axial direction. In one embodiment, the second carrier moves relative to the 5 M 417227 fixture along the long axis of the workpiece. In one embodiment, the grinding devices are disposed on each of the two sides of the workpiece. In an embodiment, the angle adjustment unit, in the consistent embodiment, rotates. Two of the grinding devices are rotatable. The one of the grinding devices has an equal angle adjusting unit for controlling the grinding devices, respectively. In one embodiment, the grinding devices are movable along a flat field and/or a third axis, respectively. In an embodiment, the polishing devices each have a drive unit that drives the polishing devices to move in the second axial direction and/or the two axial directions, respectively. In an embodiment, the second axial direction and the third axial direction have an included angle with an included angle of 90 degrees at -I, and the grinding is set to between 180 degrees. In the implementation of the financial, f-researched county-level distribution has - research a driving component, the driving components respectively drive the grinding unit to rotate 'in the embodiment, the grinding device is set on the armor side, the opposite side or Opposite side. In the implementation of the financial, the grinding t is set to be misaligned. According to the above, according to the creation of the number of research (four) * grinding and maintenance equipment has a surface to conduct research LI grinding at the same time; hunting this compared with Bai Zhi, can be used to grind the workpiece by this | M417227 The three surfaces and the fourth surface can also simultaneously grind the first surface, the second surface, the third surface and the fourth surface of the object, so that it is not necessary to grind the object with another grinding processing device. Therefore, the grinding equipment of this creation not only improves the processing precision of the workpiece, but also increases its productivity. Additionally, in an embodiment of the present invention, the grinding devices may be misaligned or disposed on the same side, opposite side or opposite side of the fixture. This also improves the machining accuracy of the workpiece and increases its productivity. [Embodiment] Hereinafter, a grinding processing apparatus according to the present embodiment will be described with reference to the related drawings, wherein the same elements will be denoted by the same reference numerals. 2A and 2B, wherein Fig. 2A is a schematic view of a lapping apparatus 2 according to the first embodiment of the present invention, and Fig. 2B is a plan view of the lapping apparatus 2 of Fig. 2A. The grinding processing apparatus 2 can be used to grind a workpiece W, which is a linear sliding or other similar elongated structure, but is not limited thereto. The grinding processing apparatus 2 includes a first carrying device 21, a second carrying device 22, a fixing device 23, and a plurality of grinding devices. The second carrying device 22 is disposed on the first carrying device 21, and the workpiece W is disposed on the second carrying device 22, and the reference surface is determined according to the portion of the planned grinding. As shown in FIG. 2, the workpiece W is the first outside. The surface P1 is its reference plane. 7 M417227 The first carrying device 21 has a driving unit (not shown), and the driving unit can drive the second carrying device 22 to move in a first axial direction X. The first axial direction X is the long axis axial direction of the workpiece W. Here, the second carrier 22 is movable relative to the fixture 23 in the long axis direction of the workpiece W. In the present embodiment, the second carrier device 22 has a carrier member R1 for fixing the workpiece W to carry the workpiece W, and the carrier member R1 is in contact with the first surface P1 outside the workpiece W to provide a uniform and stable supporting force for the workpiece W. . In other embodiments, the second carrier 22 can have a space for receiving the workpiece W, such as a recess. In addition, the first carrier device 21 has two rails R2 and R3 for carrying the second carrier device 22 and the workpiece W, and provides a uniform and stable supporting force for the second carrier device 22 and the workpiece W, and the workpiece W can be supported by the second carrier. The device 22 moves on the first carrier device 21. In other embodiments, the first carrier 21 may also have a space for receiving the second carrier 22, such as a recess. The fixing device 23 is disposed on the first carrying device 21, and in particular, the two can maintain the relative positional relationship with each other by other suspension devices (not shown). Further, the plurality of polishing devices are respectively coupled to the fixing device 23, and the fixing device 23 provides sufficient support thereof, and the polishing devices are respectively disposed on both sides of the workpiece W. In the present embodiment, four polishing devices 24a, 25a, 24b, and 25b are exemplified. Further, the embodiment has two fixing devices 23a, 23b, and is substantially in the shape of a gate, respectively, wherein two of the grinding devices 24a, 25a are respectively fixed to one end of the fixing device 23a, and the other two grinding devices 24b, 25b They are respectively fixed to one end of the fixing device 23b. In detail, as shown in Fig. 2A, with respect to the fixing device 23a, the M417227 polishing device 24a is disposed on the left side of the second carrier device 22, and the polishing device 25a is disposed on the right side of the second carrier device 22. Further, the polishing device 24b is disposed on the left side of the second carrier device 22 with respect to the fixing device 23b, and the polishing device 25b is disposed on the right side of the second carrier device 22. Thereby, the polishing apparatuses 24a, 25a, 24b, 25b can simultaneously grind the four different surfaces of the workpiece W. Hereinafter, the operation of the polishing apparatuses 24a, 25a, 24b, and 25b of the present embodiment will be described in detail with reference to Figs. 2A and 2B. The grinding devices 24a, 25a, 24b, 25b are movable in a second axial direction A, Y and/or a third axial direction B, Z, respectively, to simultaneously grind the workpiece W. Here, the polishing apparatuses 24a, 25a, 24b, and 25b are movable in the second axial directions A, Y and the third axial directions B, Z, respectively. It is worth mentioning that in other embodiments, the grinding devices 24a, 25a, 24b, 25b are movable in the second axial direction A, Y or the third axial direction B, Z, respectively. This is not limited. Wherein, the polishing devices 24a, 25a, 24b, 25b can respectively have a driving unit 241a, 251a, 241b, 251b, and the driving units 241a, 251a, 241b, 251b (not shown in Fig. 2A) drive the polishing devices 24a, 25a, respectively. 24b, 25b move in the second axial direction A, Y and the third axial direction B, Z. The angle between the second axial direction A(Y) and the third axial direction B(Z) may be any angle. This embodiment is described by taking 90 degrees as an example. Of course, in other embodiments, the angle between the second axial direction A (Y) and the third axial direction B (Z) may be required, for example, between ten degrees and 180 degrees. The polishing devices 24a, 25a, 24b, 25b may further have a polishing unit 242a, 252a, 242b, 252b and a driving member 243a, 253a, 9 M417227 243b, 253b (not shown 243b in Fig. 2A), the driving members 243a, 253a, 243b, 253b can respectively drive the polishing units 242a, 252a, 242b, 252b to rotate to grind the workpiece W. The grinding unit 242a, 252a, 242b, 252b can respectively have a grinding wheel or a grinding wheel. In this embodiment, the grinding wheel is taken as an example, and the driving parts 243a, 253a, 243b, 253b can respectively drive the grinding units 242a, 252a, The grinding wheels of 242b and 252b are operated, and the workpiece W can be polished by the cooperation of the grinding wheel and the driving members 243a, 253a, 243b, and 253b. Among them, it should be noted that the design of the grinding devices 24a, 25a '24b, 25b should not be limited to the present embodiment, and the efficiency of the grinding process can be prioritized. Further, the polishing devices 24a and 25a are rotatable. In detail, the grinding devices 24a, 25a may further have an angle adjusting unit 244a, 254a respectively. The angle adjusting units 244 & 254a rotate the grinding devices 24a, 25a clockwise or counterclockwise according to different processing requirements of the workpiece w. By processing the different positions of the surface of the workpiece W, the degree of freedom of the polishing devices 24a, 25a can be further improved. Of course, the setting position of the angle adjusting unit 244 & 25 is not particularly limited. In the present embodiment, the angle of rotation of the grinding units 242a, 252a of the grinding skirts 24a, 25a may be between the degrees of twist and degree. However, when the grinding unit 242a, 252a grinds the workpiece w, 'the preferred grinding angle may be between ten and 90 degrees, wherein the twist is that the grinding units 242a, 252a are parallel to the second axial direction a, γ, And 9 degrees is that the grinding units 242a, 252a are perpendicular to the second axial direction a, γ (i.e., parallel to the third axial direction β, ζ). Further, it is to be noted that the angle adjusting units 244a, M417227 254a may be manually or automatically (e.g., driven by a servo motor) to circumscribe the rotation angles of the polishing apparatuses 24a, 25a, respectively, without limitation. It should be noted that the polishing apparatus 24a, 25a' 24b 25b of the present embodiment can be moved in the second axial direction A, Y and the third axial direction B, Z respectively, so that the four polishing apparatuses 24a, 25a, 24b, 25b Each of the grinding processes can have one degree of freedom (a total of 8 degrees of freedom). Further, the second carrier 22 can move the longitudinal axis direction (the first axial direction X) of the workpiece w relative to the fixing device 23, so that the polishing device 24a, 25a, 24b, 25b can be polished to have another φ degree of freedom. Therefore, the polishing apparatus 2 of the present invention can have 9 degrees of freedom (9 axial directions) when performing the grinding process of the workpiece W. In addition, the two polishing devices 24a, 25a of the present embodiment are disposed on the same side of the fixing device 23a and are in the same plane, and the other two polishing devices 24b, 25b are disposed on the same side of the fixing device 23b' and the polishing device • 24a, 25a and polishing devices 24b, 25b are respectively disposed on opposite sides of the fixtures 23a and 23b. In other words, the polishing devices 24a, 25a are arranged side by side in the same plane, and the polishing devices 24b, 25b are also arranged side by side on the same plane and polished. The Lu devices 24a, 25a and the polishing cracks 24b, 25b are arranged opposite each other. In the embodiment, the polishing devices 24a, 25a may be displaced back and forth, or the polishing devices 24a, 25a and the polishing devices 24b, 25b may be disposed on the same fixture and on the opposite side of the fixture. Hereinafter, the above embodiment will be exemplified, and the case where the polishing units 242a, 252a, 242b, and 252b of the polishing apparatuses 24a, 25a, 24b, and 25b are used to polish the workpiece W will be further described with reference to Fig. 3'. For the sake of clarity, Fig. 3 shows only the polishing units 242a, 252a, 242b, 252b and the workpiece M417227 W, and the ratio of the two is different from that of Fig. 2, and the ratio of the two is also different from the actual ratio. As shown in FIG. 3, since the driving units 241b, 251b (not shown in FIG. 3) of the present invention can respectively drive the polishing units 242b, 252b of the two polishing devices 24b, 25b to move in the second axial directions A, Y, therefore, grinding The units 242b, 252b can simultaneously grind the second surface P2 and the third surface P3 of the workpiece W. In addition, when the fourth surface P4, the fifth surface P5, the sixth surface P6, the seventh surface P7, and the eighth surface P8 of the workpiece W are to be polished, the driving units 241a, 251a and the angle adjusting units 244a, 254a can be simultaneously used ( Fig. 3 (not shown) adjusts the position and rotation angle of the polishing units 242a, 252a. For example, when the polishing units 242a, 252a are respectively rotated by 90 degrees (perpendicular to the second axis A, Y), the sixth surface P6, the seventh surface P7, and the eighth surface P8 can be polished. In addition, when the polishing units 242a, 252a are rotated between 0 and 90 degrees, respectively, the polishing unit 242a may grind the fourth surface P4, and the polishing unit 252a may grind the fifth surface P5, where the two polishing units 242a, The 252a can polish not only the opposing surfaces of the workpiece W (the fourth surface P4 and the fifth surface P5) but also the upper surfaces of the workpiece W (the seventh surface P7 and the eighth surface P8). Therefore, the polishing apparatus 2 of the present invention can not only grind the second surface P2 and the third surface P3 on the outer side of the workpiece W, but can also grind the fourth surface P4 of the inner side of the workpiece W without replacing other grinding processing equipment. The fifth surface P5, the sixth surface P6, the seventh surface P7, and the eighth surface P8. Therefore, at least four different surfaces of the workpiece W can be simultaneously ground by the grinding apparatus 2 of the present invention. M417227 In particular, another fixing device (not shown) may be disposed on the fixing device 23b between the two polishing devices 24b, 25b, and the second surface P2 and the third surface of the workpiece W are polished. At the same time as P2, the sixth surface P6 of the workpiece W is simultaneously polished by the other grinding device. In this way, not only the grinding work of the workpiece W can be completed more quickly, but also the machining accuracy can be improved. Further, please refer to Fig. 4, which is a schematic view of a polishing processing apparatus 3 according to a second embodiment of the present invention. The lapping apparatus 3 of the present embodiment is substantially the same as the lapping apparatus 2 of the foregoing embodiment, and the main difference between the lapping apparatus 3 and the lapping apparatus 2 is that the lapping apparatus 3 has only one fixed arrangement 33, and the grinding apparatus 34a 35a is provided on one side of the fixing device 33, and the polishing devices 34b, 35b are disposed on the opposite side of the fixing device 33. Further, the technical features of the other components of the grinding processing apparatus 3 can be referred to the same components of the grinding processing apparatus 2, and will not be described herein. Further, please refer to Fig. 5, which is a schematic view of a polishing processing apparatus 4 according to a third embodiment of the creation. The lapping apparatus 4 of the present embodiment is substantially the same as the lapping apparatus 3 of the foregoing embodiment, and the main difference between the lapping apparatus 4 and the lapping apparatus 3 is that the lapping means 44a, 45a are disposed in the front and rear dislocations in the fixing means 43. Further, the technical features of the other components of the grinding processing apparatus 4 can be referred to the same components of the grinding processing apparatus 3, and will not be described herein. In summary, the grinding processing apparatus according to the present invention has a complex M417227 number grinding device, and the grinding device can simultaneously grind at least four different surfaces of the workpiece. Thereby, compared with the conventional one, the third surface and the fourth surface of the processed object can be ground by the grinding device of the present invention, and the first surface, the second surface, the third surface and the fourth surface of the object can also be simultaneously polished. The surface does not require the grinding of the object by another grinding equipment. Therefore, the grinding equipment of this creation not only improves the processing precision of the workpiece, but also increases its productivity. Additionally, in an embodiment of the present invention, the grinding devices may be misaligned or disposed on the same side, opposite side or opposite side of the fixture. This also improves the machining accuracy of the workpiece and increases its productivity. The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations to the spirit and scope of this creation shall be included in the scope of the appended patent application. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view of a conventional lapping apparatus; Fig. 2A is a schematic view of a lapping apparatus according to a first embodiment of the present invention; and Fig. 2B is a plan view of the lapping apparatus of Fig. 2A. 3 is a schematic view of a grinding unit for grinding a workpiece according to a first embodiment of the present invention, FIG. 4 is a schematic view of a grinding processing apparatus according to a second embodiment of the present invention; and FIG. 5 is a third embodiment of the present invention. Schematic of the 14 M417227 grinding machine. [Main component symbol description] [Practical] 1 : Grinding equipment • 11 : Carrier 12, 13: Grinding device '121, 131: Grinding wheel P1 to P4: Surface W: Workpiece [This creation] 2, 3, 4 : Grinding processing equipment '21, 31, 41: first carrying device '22, 32, 42 · · second carrying device 23a, 23b, 33, 43: fixing device 24a, 24b, 25a, 25b, 34a, 34b, 35a 35b, 44a, 44b, . . . 45a, 45b: polishing devices 241a, 241b, 251a, 251b, 341a, 351a, 351b, 441a, 451a, 45lb: drive units 4 242a, 242b, 252a, 252b, 342a, 342b, 352a, 352b, 442a, 442b, 452a, 452b: polishing units 243a, 243b, 253a, 253b, 343a, 353a, 353b, 443a, 453a, 453b: drive members 244a, 244b, 254a, 254b, 344a, 354a, 354b, 444a, 454a, 15 M417227 454b: angle adjustment unit A, Y: second axis Β, Ζ: third axis Ρ1~Ρ8 · surface R1: carrier member R2 to R3: track W: workpiece X: first axis to