TW201300196A - Grinding processing method - Google Patents

Abstract

A grinding processing method is used for a grinding processing apparatus has plural grinding devices which are rotatable. The grinding processing method includes the steps of providing a work; fixing the work to the grinding processing apparatus; and adjusting the rotation angles and/or position of the grinding devices and performing grinding processing to the different surfaces of the work by the grinding devices simultaneously. The grinding processing method of the present invention can improve the accuracy and the calibration rate of products.

Description

Grinding method

The present invention relates to a method of grinding.

With the continuous advancement of technology, process equipment for various products has been gradually developed. Therefore, the importance of the grinding processing method for various grinding processing equipment is gradually increasing for the basic workpieces required for processing different process equipment.

Referring to FIG. 1, a conventional grinding processing apparatus 1 includes a fixing device 11 and two grinding devices 12, 13. The polishing apparatuses 12 and 13 are disposed on the left and right sides of the fixing apparatus 11 correspondingly. Referring to FIG. 1 and FIG. 2 simultaneously, the polishing processing method to which the polishing processing apparatus 1 is applied includes steps S1 to S3. Step S1 is to provide a workpiece, step S2 is to fix the workpiece to the grinding processing device, and step S3 is to simultaneously grind the two different surfaces of the workpiece by the grinding devices.

Therefore, when the workpiece W to be processed is placed on the fixing device 11, the grinding wheels 121, 131 of the grinding devices 12, 13 correspond to the surfaces P1, P2 on the left and right sides of the workpiece W. Thereby, the left and right side surfaces P1 and P2 of the workpiece W can be polished by the grinding wheels 121 and 131 of the polishing apparatuses 12 and 13, respectively.

However, since the lapping processing apparatus 1 is disposed on the left and right sides of the fixing device 11, if the surface P3 or other surface on the upper side of the workpiece W needs to be processed, the lapping processing apparatus 1 cannot be processed, and it is necessary to change to different grinding. The equipment can be processed by replacing the orientation of the workpiece W. As a result, problems such as reduction in processing accuracy and reduction in production capacity are caused.

Therefore, how to design a grinding processing method that can improve the precision of grinding processing and increase its productivity has become one of the important topics.

In view of the above problems, an object of the present invention is to provide a polishing processing method which can improve the precision of polishing processing and increase the productivity thereof.

To achieve the above object, a grinding processing method according to the present invention is applied to a grinding processing apparatus having a plurality of rotatable grinding apparatuses, the grinding processing method comprising the steps of: providing a workpiece; fixing the workpiece to the grinding processing apparatus; and adjusting The rotation angles and or positions of the polishing devices are simultaneously polished by the polishing devices on different surfaces of the workpiece.

In one embodiment, the workpiece is U-shaped, V-shaped or ㄩ-shaped after being ground.

In one embodiment, the grinding devices are each movable in a first axial direction and/or a second axial direction.

In one embodiment, the polishing devices each have a driving unit and an angle adjusting unit, and the driving units respectively drive the grinding devices to move in the first axial direction and/or the second axial direction, and the equal angle adjusting unit The rotation of the grinding devices is controlled separately.

In one embodiment, the angles of rotation of the grinding devices are between 0 and 180 degrees, respectively.

In one embodiment, the time during which the grinding process is performed is adjustable.

In an embodiment, the force applied by the grinding device to the workpiece is adjustable.

In one embodiment, the grinding devices are disposed in one of the grinding apparatus.

In one embodiment, the equal grinding device grinds the opposing surfaces of the workpiece, respectively.

As described above, the grinding processing method according to the present invention is applied to a grinding processing apparatus having a plurality of rotatable grinding apparatuses, and the grinding apparatuses are respectively disposed on different sides of the fixing apparatus. Therefore, when the upper surface or other surface of a workpiece needs to be polished, the rotation angle and or the position of the grinding unit can be adjusted by the grinding device to simultaneously grind the workpiece from different positions and directions. . This not only improves the precision of the grinding process, but also increases its production capacity.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a grinding processing method according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings, wherein the same elements will be described with the same reference numerals.

3 and FIG. 4, wherein FIG. 3 is a flow chart of the steps of a grinding processing method of the present invention, and FIG. 4 is a schematic view of the grinding processing apparatus 2 in conjunction with the flow chart of FIG. The grinding processing method of the present invention comprises the steps M1 to M3. In addition, the grinding processing method is applied to the grinding processing apparatus 2, and the grinding processing apparatus 2 may include a first carrying device 21, a second carrying device 22, a fixing device 23, and a plurality of grinding devices. Here, two polishing apparatuses 24 and 25 are taken as an example. In other grinding processing equipment, the number of grinding apparatuses may be two or more.

The step M1 of the grinding processing method is to provide a workpiece W; the step M2 is to fix the workpiece W to the polishing processing device 2; and the step M3 is to adjust the rotation angle and or position of the polishing devices 24, 25, and by the grinding The devices 24, 25 simultaneously grind different surfaces of the workpiece W. Wherein, the workpiece W is a linear slide or other similar elongated structure, but is not limited thereto.

Hereinafter, the polishing processing apparatus 2 will be described with reference to FIG. 4 again. The second carrier device 22 is disposed on the first carrier device 21, and the workpiece W is disposed on the second carrier device 22, and the reference surface is determined according to the portion planned to be polished. As shown in FIG. 4, the workpiece W is outside. The first surface P1 is a reference surface. In addition, the first carrying device 21 has a driving unit (not shown), and the driving unit can drive the second carrying device 22 to move in a third axial direction X. The third axial direction X is the long axis axial direction of the workpiece W. Here, the second carrier device 22 is movable relative to the fixture 23 along the long axis direction of the workpiece W.

In Fig. 4, the second carrier 22 has a carrier member R1 for fixing the workpiece W to carry the workpiece W, and the carrier member R1 is in contact with the outer first surface P1 of the workpiece W to provide a uniform and stable supporting force for the workpiece W. In other embodiments, the second carrier 22 can have a space for receiving the workpiece W, such as a groove. In addition, the first carrier device 21 has two rails R2 and R3 for carrying the second carrier device 22 and the workpiece W, and provides a uniform and stable supporting force for the second carrier device 22 and the workpiece W, and the workpiece W can be supported by the second carrier. The device 22 moves on the first carrier device 21. In other embodiments, the first carrier device 21 can have a space for receiving the second carrier device 22, such as a recess.

The fixing device 23 is disposed on the first carrying device 21, and specifically, the two can maintain relative positional relationship with each other by other hanging devices (not shown). Further, the two polishing devices 24 and 25 are respectively coupled to the fixing device 23, and the fixing device 23 individually provides sufficient support, and the two polishing devices 24 and 25 are respectively disposed on both sides of the workpiece W. Further, the fixing device 23 of Fig. 4 is substantially U-shaped, and the two grinding devices 24, 25 are respectively fixed at one end. In detail, the polishing device 24 is disposed on the left side of the second carrier device 22 with respect to the fixing device 23; the polishing device 25 is disposed on the right side of the second carrier device 22. Thereby, the grinding devices 24, 25 can simultaneously grind at least two different surfaces of the workpiece W.

The polishing devices 24, 25 are coupled to the fixtures 23, and the polishing devices 24, 25 are respectively moved in a first axial direction A, Y and/or a second axial direction B, Z to simultaneously grind the workpiece W. Here, the polishing devices 24, 25 respectively have a driving unit 241, 251, which drive the two grinding devices 24, 25 respectively in the first axial direction A, Y and / or the second axial direction B, Z moves. The angle between the first axial direction A(Y) and the second axial direction B(Z) may be any angle, and FIG. 4 is taken as an example with 90 degrees. Of course, in other embodiments, the angle between the first axial direction A (Y) and the second axial direction B (Z) may be as needed, for example, between 0 degrees and 180 degrees.

In addition, the polishing devices 24, 25 may further have a polishing unit 242, 252 and a driving member 243, 253, respectively, which drive the polishing units 242, 252 to rotate. The grinding units 242 and 252 respectively have a grinding wheel or a grinding wheel. FIG. 4 illustrates the grinding wheel as an example, and the driving members 243 and 253 can respectively drive the grinding wheels of the grinding units 242 and 252 to operate by the grinding wheel and the driving component 243. The 253 can be used to grind the workpiece W. It should be noted that the design of the grinding devices 24, 25 should not be limited to FIG. 4, and there are different ways of visually demanding, and the end is considered as a priority to improve the efficiency of the grinding process.

The grinding devices 24, 25 may each have an angle adjusting unit 244, 254. The angle adjusting units 244, 254 rotate the grinding devices 24, 25 clockwise or counterclockwise to the surface of the workpiece W depending on the processing requirements of the workpiece W. The processing is performed at different positions, whereby the degree of freedom of the polishing devices 24, 25 can be further improved. Of course, the installation position of the angle adjusting units 244, 254 is not particularly limited. In FIG. 4, the angle of rotation of the grinding units 242, 252 of the grinding devices 24, 25 can be between 0 and 180 degrees. However, when the grinding unit 242, 252 grinds the workpiece W, the preferred grinding angle may be between 0 and 90 degrees, wherein 0 degrees is the grinding unit 242, 252 parallel to the first axial direction A, Y, respectively. At 90 degrees, the grinding units 242, 252 are perpendicular to the first axial directions A, Y. In addition, it is to be noted that the angle adjusting units 244 and 254 can adjust the rotation angles of the grinding devices 24 and 25 manually or automatically (for example, by a servo motor), and are not limited thereto.

In addition, the two polishing devices 24 and 25 of FIG. 4 are disposed on the same side of the fixing device 23 and are in the same plane. In other words, the polishing devices 24, 25 are arranged side by side and disposed in the same plane of the second axial directions B, Z. However, in other embodiments, the polishing devices 24, 25 may also be misaligned back and forth or disposed on opposite sides of the fixture 23.

Therefore, when the workpiece W is disposed on the fixture 23, the rotation angles and or positions of the two polishing devices 24, 25 can be adjusted to perform a grinding process on different surfaces of the workpiece W.

Hereinafter, please refer to FIG. 5 to further explain the case where the polishing units 242 and 252 of the polishing apparatuses 24 and 25 polish the workpiece W. For the sake of clarity, FIG. 5 only shows the polishing units 242, 252 and the workpiece W, and the ratio of the two is different from that of FIG. 4, and the ratio of the two is also different from the actual ratio. Further, the polishing processing step is, for example, a surface smoothing or molding polishing of the workpiece W, and is formed into a U-shape, a V-shape, or a ㄩ shape after the polishing process. Here, the ㄩ-forming type polishing is exemplified.

As shown in FIG. 4 and FIG. 5, the driving units 241, 251 can respectively drive the grinding units 242, 252 of the two grinding devices 24, 25 to move in the first axial direction A, Y and/or the second axial direction B, Z. Therefore, the polishing units 242, 252 can simultaneously grind the second surface P2 and the third surface P3 of the workpiece W, respectively. In addition, when the fourth surface P4, the fifth surface P5, the sixth surface P6, the seventh surface P7, and the eighth surface P8 of the workpiece W are to be polished, the driving units 241 and 251 and the angle adjusting units 244 and 254 can be adjusted. The position and the rotation angle of the polishing units 242, 252, for example, when the polishing units 242, 252 are moved to the appropriate positions and rotated by 90 degrees, respectively, the sixth surface P6, the seventh surface P7, and the eighth surface P8 can be polished. In addition, when the grinding units 242, 252 are moved to the appropriate positions and rotated between 0 degrees and 90 degrees, respectively, the grinding unit 242 can grind the fourth surface P4, and the grinding unit 252 can grind the fifth surface P5, where The polishing units 242, 252 can respectively polish the opposite surfaces (the fourth surface P4 and the fifth surface P5) of the workpiece W. Therefore, the polishing processing apparatus 2 can not only polish the second surface P2 and the third surface P3 on the outer side of the workpiece W, but can also polish the fourth surface P4 and the fifth surface P5 inside the workpiece W without replacing other grinding processing equipment. a sixth surface P6, a seventh surface P7, and an eighth surface P8 (upper surface).

If the other surfaces of the workpiece W need to be processed, the grinding processing equipment 2 can be directly processed and ground without removing the workpiece W and replacing the different grinding processing equipment or replacing the placement direction of the workpiece W. In this way, not only can the precision of the grinding process be improved, but also the production capacity can be increased.

It is worth mentioning here that the time during which the grinding process is carried out is adjustable, and the force applied by the grinding devices 24, 25 to the workpiece W is also adjustable. Further, the polishing apparatuses 24 and 25 may be disposed on the same side of the fixing device 23 in a misaligned manner or on the opposite side of the fixing device 23. Alternatively, when two grinding devices 24, 25 are provided on one side of the fixing device 23, other grinding devices (not shown) are also provided on the other side (for example, the opposite side) of the fixing device 23 to the workpiece W. Different surfaces are simultaneously ground.

In summary, the grinding processing method according to the present invention is applied to a grinding processing apparatus having a plurality of rotatable grinding apparatuses, and the grinding apparatuses are respectively disposed on different sides of the fixing apparatus. Therefore, when the upper surface or other surface of a workpiece needs to be polished, the rotation angle and or the position of the grinding unit can be adjusted by the grinding device to simultaneously grind the workpiece from different positions and directions. . This not only improves the precision of the grinding process, but also increases its production capacity.

The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations to the spirit and scope of the invention are intended to be included in the scope of the appended claims.

1, 2. . . Grinding equipment

11,23. . . Fixtures

12, 13, 24, 25. . . Grinding device

121, 131. . . Grinding wheel

twenty one. . . First carrier

twenty two. . . Second carrier

241, 251. . . Drive unit

242, 252. . . Grinding unit

243, 253. . . Drive unit

244, 254. . . Angle adjustment unit

A, Y. . . First axial direction

B, Z. . . Second axial direction

M1～M3, S1～S3. . . step

P1 ~ P8. . . surface

R1. . . Carrier element

R2 ~ R3. . . track

W. . . Workpiece

X. . . Third axial direction

Figure 1 is a schematic view of a conventional grinding processing apparatus;

2 is a flow chart showing the steps of a conventional grinding processing method;

3 is a flow chart showing the steps of a grinding processing method according to a preferred embodiment of the present invention;

Figure 4 is a schematic view of a grinding processing apparatus of the present invention;

Figure 5 is a schematic view of the grinding unit of Figure 4 grinding the workpiece.

M1～M3. . . step

Claims (10)

A grinding processing method for a grinding processing apparatus having a plurality of rotatable grinding apparatuses, the grinding processing method comprising the steps of: providing a workpiece; fixing the workpiece to the grinding processing apparatus; and adjusting the grinding apparatus Rotating angles and or positions, and simultaneously grinding different surfaces of the workpiece by the grinding devices. The method of grinding according to claim 1, wherein the grinding step is to perform surface smoothing or profile grinding on the workpiece. The grinding processing method of claim 1, wherein the workpiece is U-shaped, V-shaped or ㄩ-shaped after being ground. The method of grinding according to claim 1, wherein the grinding devices are respectively movable in a first axial direction and/or a second axial direction. The grinding processing method of claim 4, wherein the grinding devices each have a driving unit and an angle adjusting unit, and the driving units respectively drive the grinding devices in the first axial direction and/or The second axial movement, the equal angle adjustment units respectively control the rotation of the grinding devices. The grinding processing method of claim 1, wherein the grinding devices have a rotation angle of between 0 and 180 degrees, respectively. The grinding processing method according to claim 1, wherein the polishing processing time is adjustable. The method of grinding according to claim 1, wherein the force applied by the grinding device to the workpiece is adjustable. The method of grinding according to claim 1, wherein the grinding device is disposed in one of the fixing devices of the grinding processing device. The method of grinding according to claim 1, wherein the grinding devices respectively grind the opposing surfaces of the workpiece.