M417226 五、新型說明. 【新型所屬之技術領域】 本創作係關於一種加工設備，特別係關於一種研磨加 工設備。 【先前技術】 工業發展的水平越高，各種產品或零組件的分類與設 計亦發精細，而為滿足此類市場需求，業者在製程機台方 面投入相當可觀的開發能量，以期在技術與成本上進一步 突破。由於不同製程機台的組裝加工脫離不了對基本工件 的需求，因此連帶使得各種研磨加工設備的重要性相對甚 高。 圖1為一種習知的研磨加工設備的示意圖。請參照圖 1所示，研磨加工設備1包含一承載裝置11及二研磨裝置 12、13。該等研磨裝置12、. 13對應設置於承載裝置11的 左右兩侧。因此，當一待加工之工件W由他處移至承載裝 置11後，研磨裝置12、13的砂輪121、131會對應於工 件W左右兩側的第一表面P1及第二表面P2,實施研磨作 業。 然而，習知的研磨加工設備1只可研磨加工工件W之 第一表面P1及第二表面P2，當要研磨加工如圖1之工件 W的第三表面P3、第四表面P4或其它表面時，必須將工 件W自研磨加工設備1取下，並以可研磨加工第三表面 P3、第四表面P4或其它表面之另一研磨加工設備研磨加 M417226 工，如此，不僅使工件w的加工精度降低，也會降低研磨 加工的產能。 因此，如何提供一種研磨加工設備，不僅可提高工件 之加工精度，又可提升其產能，已成為重要課題之一。 【新型内容】 有鑑於上述課題，本創作之目的為提供一種可提高工 件之加工精度，又可提升其產能之研磨加工設備。 為達上述目的，依據本創作之一種研磨加工設備用以 研磨加工一工件。研磨加工設備包含一第一承載裝置、一 第二承載裝置、一固定裝置以及二研磨裝置。第二承載裝 置設置於第一承載裝置，工件設置於第二承載裝置。固定 裝置設置於第一承載裝置之上。研磨裝置與固定裝置連 結，該等研磨裝置可分別旋轉，並分別沿一第一軸向及一 第二轴向移動，以同時研磨加工工件。 在一實施例中，第一承載裝置具有一驅動單元，驅動 單元驅動第二承載裝置於一第三軸向移動。 在一實施例中，該等研磨裝置分別具有一驅動單元及 一角度調整單元，該等驅動單元分別驅動該等研磨裝置於 第一軸向及/或第二軸向移動，該等角度調整單元分別控制 該等研磨裝置旋轉。 在一實施例中，第一轴向及第二轴向之間具有一夾 角，夾角為90度。 在一實施例中，第二承載裝置沿工件之長軸方向相對 5 M417226 固定裝置移動。 在一實施例中，該等研磨裝置分別設置於工件之兩 側。 在一實施例中，該等研磨裝置對工件之至少二個不同 的表面同時研磨加工。 在一實施例中，該等研磨裝置的旋轉角度分別介於0 度至180度之間。 在一實施例中，該等研磨裝置分別具有一研磨單元及 一驅動部件，該等驅動部件分別驅動該等研磨單元轉動。 在一實施例中，該等研磨裝置設置於固定裝置之同一 側或相反側。 在一實施例中，該等研磨裝置為錯位設置。 在一實施例中，該等研磨裝置分別研磨工件之對向表 面。 承上所述，因依據本創作之一種研磨加工設備具有二 研磨裝置，且該等研磨裝置可分別旋轉，並分別沿一第一 轴向及/或一第二轴向移動，以同時研磨加工工件。藉此， 與習知相較，可藉由改變該等研磨裝置之位置及轉動角度 以研磨加工物件之第三表面、第四表面或其它表面，並不 需以另一研磨加工設備對物件研磨加工，因此，本創作之 研磨加工設備不僅可提高工件之加工精度，又可提升其產 能。另外，在本創作的另一實施例中，該等研磨裝置可為 錯位設置，或設置於固定裝置之同一側或相反側。藉此， 一樣使本創作之研磨加工設備可提高工件之加工精度，也M417226 V. New description. [New technical field] This creation is about a processing equipment, especially for a grinding and processing equipment. [Prior Art] The higher the level of industrial development, the finer classification and design of various products or components, and in order to meet the needs of such markets, the industry has invested considerable development energy in the process machine, with a view to technology and cost. Further breakthroughs. Since the assembly and processing of different process machines cannot be separated from the requirements of basic workpieces, the importance of various grinding and processing equipment is relatively high. Figure 1 is a schematic illustration of a conventional grinding processing apparatus. Referring to Figure 1, the polishing apparatus 1 includes a carrier 11 and two polishing devices 12, 13. The grinding devices 12, . 13 are correspondingly disposed on the left and right sides of the carrier device 11. Therefore, when the workpiece W to be processed is moved from the other to the carrying device 11, the grinding wheels 121, 131 of the grinding devices 12, 13 correspond to the first surface P1 and the second surface P2 on the left and right sides of the workpiece W, and are ground. operation. However, the conventional lapping apparatus 1 can only grind the first surface P1 and the second surface P2 of the workpiece W when the third surface P3, the fourth surface P4 or the other surface of the workpiece W of FIG. 1 is to be ground. The workpiece W must be removed from the grinding processing apparatus 1 and ground and machined by another grinding processing apparatus capable of grinding the third surface P3, the fourth surface P4 or other surfaces, so that not only the machining accuracy of the workpiece w is obtained. Lowering will also reduce the productivity of the grinding process. Therefore, how to provide a grinding processing equipment has not only improved the machining accuracy of the workpiece, but also increased its productivity, which has become one of the important topics. [New content] In view of the above problems, the purpose of this creation is to provide a grinding and processing equipment that can improve the processing accuracy of workpieces and increase their productivity. In order to achieve the above object, a grinding processing apparatus according to the present invention is used for grinding a workpiece. The grinding processing apparatus comprises a first carrying device, a second carrying device, a fixing device and two grinding devices. The second carrying device is disposed on the first carrying device, and the workpiece is disposed on the second carrying device. The fixture is disposed above the first carrier. The grinding device is coupled to the fixing device, and the grinding devices are respectively rotatable and respectively moved along a first axial direction and a second axial direction to simultaneously grind the workpiece. In one embodiment, the first carrier has a drive unit that drives the second carrier to move in a third axial direction. In one embodiment, the polishing devices each have a driving unit and an angle adjusting unit, and the driving units respectively drive the grinding devices to move in the first axial direction and/or the second axial direction, and the equal angle adjusting unit The rotation of the grinding devices is controlled separately. In one embodiment, the first axial direction and the second axial direction have an included angle with an included angle of 90 degrees. In one embodiment, the second carrier moves relative to the 5 M417226 fixture along the long axis of the workpiece. In one embodiment, the grinding devices are disposed on each of the two sides of the workpiece. In one embodiment, the polishing apparatus simultaneously grinds at least two different surfaces of the workpiece. In one embodiment, the angles of rotation of the grinding devices are between 0 and 180 degrees, respectively. In one embodiment, the polishing devices each have a polishing unit and a drive member that respectively drive the polishing units to rotate. In one embodiment, the grinding devices are disposed on the same side or opposite sides of the fixture. In an embodiment, the grinding devices are misaligned. In one embodiment, the polishing devices respectively grind the opposing surfaces of the workpiece. According to the above description, a grinding processing apparatus according to the present invention has two grinding devices, and the grinding devices are respectively rotatable and respectively moved along a first axial direction and/or a second axial direction for simultaneous grinding processing. Workpiece. Thereby, compared with the prior art, the third surface, the fourth surface or other surface of the processed object can be ground by changing the position and the rotation angle of the grinding device, and the object is not required to be ground by another grinding processing device. Processing, therefore, the grinding equipment of this creation can not only improve the processing precision of the workpiece, but also increase its production capacity. Additionally, in another embodiment of the present creation, the grinding devices may be misaligned or disposed on the same side or opposite sides of the fixture. In this way, the grinding processing equipment of the present invention can improve the processing precision of the workpiece,
Mil 226 可提升其產能。 【貫施方式】 以下將參照相關圖式，說明依本創作實施例之一種研 磨加工設備，其中相同的元件將以相同的元件符號加以說 明。 請參照圖2所示，其為依據本創作第一實施例之一種 研磨加工設備2的示意圖。研磨加工設備2可用以研磨加 @ 工一工件W，工件W為一線性滑軌或其他相似之長形結 構者，但不以此為限。研磨加工設備2包含一第一承載裝 * 置21、一第二承載裝置22、一固定裝置23以及二研磨裝 . 置 24、25 ° 第二承載裝置22設置於第一承載裝置21，而工件W 設置於第二承載裝置22,且視其規劃研磨的部分而決定基 準面，如圖2所示，工件W以外侧之第一表面P1為基準 φ 面。 . 第一承載裝置21具有一驅動單元（圖未顯示），而驅 動單元可驅動第二承載裝置22於一第三軸向X移動。其 中，第三軸向X為工件W之長軸軸向。於此，第二承載 裝置22可沿工件W之長軸方向相對固定裝置23移動。 在本實施例中，第二承載裝置22具有一固定工件W . 的承載元件R1，以承載工件W，而承載元件R1與工件W 的外側第一表面P1接觸，以提供工件W均勻穩定的支撐 力。在其他實施態樣中，第二承載裝置22則可具有容置 7 M417226 工 二：W的空間，例如凹槽。另外，第-承載裝…有 思R2、R3，以承載第二承載裝置22及工件 =承載裝置22及工件-均句穩定的支樓力，且:: I:!由第二繼置22於第-承載裝置21上移動。： =施態樣中’第，置21亦可具有容置第動二: 载裝置22的空間，例如凹槽。. 置23設置於第一承載裝置21之上，具館而 ° 兩者可以其他懸吊裝詈f _ 位置關係。再者，-研磨維持彼此間的相對 署” 者—研磨裝置24、25分別連結於固定裝 固Λ裝置23個別提供⑽的支撐，且二個研磨 ，置24、25分別設置於工件w之兩側。進一步而令， =之、固定裝置23實質上呈门字形，而二個研輕置 ㈣固定於-端。詳細而言，相對於 ^=24設置於第：承載裝置22之左側；研磨裳^ 二、；第一承載裝置22之右側。藉此，研磨裝置24、25 。以對工件W之至少二個不同的表面同時研磨加工。 你/再參,U 2所不，以詳細說明研磨裝置24、25的 =方式。研隸置24、25與固定裝置23連結，且研磨 展置24、25可分別一楚 ±,, p , 弟一軸向A' Y及/或一第二軸向 B、=移動，以同時研磨加工工❹。於此，研磨裝置μ、 刀別具有一驅動單元241、心該等驅動料24!、251 :分別驅動二個研磨裝置24、25於第—轴向α、γ及蜮 夕勒其中’弟一軸向A⑺及第二軸向 ⑵的央角可為任意角度，本實施例以9G度為例作說 M417226 明。當然，在其他實施態樣中，第一軸向A (Y)及第二 軸向Β (Ζ)的夾角可視其需要，例如可介於0度至180 度。 另外，研磨裝置24、25更可分別具有一研磨單元242、 252及一驅動部件243、253，該等驅動部件243、253可 分別驅動該等研磨單元242、252轉動。其中，研磨單元 242、252可分別具有一砂輪或一磨輪，本實施例以砂輪為 例作說明，且驅動部件243、253可分別驅動研磨單元242、 • 252之砂輪運轉，藉由砂輪與驅動部件243、253配合可對 工件W進行研磨加工。其中，需注意的是，研磨裝置24、 ' 25的設計方式不應以本實施例為限，可視需求有不同的方 - 式，端以能提高研磨加工之效率為優先考量。 研磨裝置24、25更可分別具有一角度調整單元244、 254，依工件W不同的加工需求，角度調整單元244、254 使研磨裝置24、25順時針或逆時針旋轉，以對工件W表 • 面的不同位置進行加工，藉此更可提高研磨裝置24、25 的自由度。當然，角度調整單元244、254的設置位置並 無特別限制。在本實施例中，研磨裝置24、25之研磨單 元242、252的旋轉角度可介於0度至180度之間。不過， 當研磨單元242、252研磨加工工件W時，較佳者之研磨 角度可介於0度至90度之間，其中0度為研磨單元242、 . 252分別平行第一軸向A、Υ，而90度為研磨單元242、 252垂直於第一軸向A、Y。另外，再說明的是，角度調整 單元244、254可分別以手動或自動（例如以伺服馬達驅 9 動）方式調整該研磨裳置24、25的旋轉角度’於此並不 加以限制。 值知"k的疋，本發明之一個研磨裳置24、25可分 ^第軸向A、Y及/或第二軸向B、z移動，故二個研 笛裝置24、25研磨加工時可分別具有二個自由度。另外， 斟=載裝置22沿工件w之長轴方向（第三軸向X)相 I固定裝置23移動’故可使研磨裝置24、25研磨加工時 ^另自由度ϋ此，本創作之研磨加工設備2可具有 固自由度（5軸向）之研磨加工。 此外’本實施例之二個研磨裝置24、Μ設置於固定 23之同一側，且為同一平面。換言之，研磨裝置24、 並它的眚力… _ ΰ Z的冋-平面。不過’在 中’研磨裝置24、25亦可前後錯位、或設 置於固定裝置23之相反側。 “以下，以上逑貫施例為例，並配合圖3所示’進-步 物件w之情況。為了清楚^二·；70 242、252研磨加工 攻及工件W，且^楚况明’圖3只顯示研磨單元犯、 與實際比例不同。者之比例與圖2不同，兩者之比例亦 可分置::本創作之驅動單元 第一勒“^ 25之研磨單元242、252於 第車向A'Y及/或第二轴向b、z移動 儿242、252可同時分別研磨加 此研磨早 及第三表面P3。另外，當 之第二表面P2 田研磨工件w之第四表面p4、 M417226 第五表面P5、第六表面P6、第七表靣P7及第八表面P8 時，可藉由驅動單元241、251及角度調整單元244、254 調整研磨單元242、252之位置及旋轉角度，例如研磨單 元242、252分別旋轉90度時可研磨加工第六表面P6、第 七表面P7及第八表面P8。另外，研磨單元242、252分別 旋轉〇度與90·度之間時，研磨單元242可研磨加工第四 表面P4,而研磨單元252可研磨加工第五表面P5,於此， 二個研磨單元242、252可分別研磨工件W之對向表面（第 四表面P4及第五表面P5)。因此，本創作之研磨加工設備 2不僅可研磨加工物件W外側之第二表面P2及第三表面 P3，可不用更換其它的研磨加工設備而同樣可研磨加工物 件W内侧之第四表面P4、第五表面P5、第六表面P6、第 七表面P7及第八表面P8。 另外，請參照圖4所示，其為本創作第二實施例之一 種研磨加工設備3的示意圖。 本實施例之研磨加工設備3與前述實施例之研磨加工 設備2大致相同，而研磨加工設備3與研磨加工設備2主 要的不同是，研磨裝置34、35為前後錯位設置於固定裝 置23。 此外，研磨加工設備3其它元件的技術特徵可參照研 磨加工設備2的相同元件，於此不再贅述。 另外，請參照圖5所示，其為本創作第三實施例之一 種研磨加工設備4的示意圖。 本實施例之研磨加工設備4與前述實施例之研磨加工 M417226 設備2大致相同，而研磨加工設備4與研磨加工設備2主 要的不同是，研磨裝置44、45設置於固定裝置43之相反 側。 此外，研磨加工設備4其它元件的技術特徵可參照研 磨加工設備2的相同元件，於此不再贅述。 綜上所述，因依據本創作之一種研磨加工設備具有二 研磨裝置，且該等研磨裝置可分別旋轉，並分別沿一第一 轴向及/或一第二轴向移動，以同時研磨加工工件。籍此， 與習知相較，可藉由改變該等研磨裝置之位置及轉動角度 以研磨加工物件之第三表面、第四表面或其它表面，並不 需以另一研磨加工設備對物件研磨加工，因此，本創作之 研磨加工設備不僅可提高工件之加工精度，又可提升其產 能。另外，在本創作的另一實施例中，該等研磨裝置可為 錯位設置，或設置於固定裝置之同一側或相反側。藉此， 一樣使本創作之研磨加工設備可提高工件之加工精度，也 可提升其產能。 以上所述僅為舉例性，而非為限制性者。任何未脫離 本創作之精神與範疇，而對其進行之等效修改或變更，均 應包含於後附之申請專利範圍中。 【圖式簡單說明】 圖1為一種習知的研磨加工設備的示意圖； 圖2為依據本創作第一實施例之一種研磨加工設備的 示意圖； 12 實施例之研磨單元研磨加工工件的 圖3為本創作第— 示意圖； 二實施例之一種研磨加工設備的 圖4為依據本創作第 不意圖；以及 圖5為依據本創作第 示意圖。 三實施例之一 種研磨加工設備的 【主要元件符號說明】 〔習知〕 I :研磨加工設備 II :承載裝置 12 ' U :研磨裝置 121、131 :砂輪 Ρ1〜Ρ4 :表面 W :工件 〔本創作〕 2、3、4 :研磨加工設備 21 ' 31、41 :第一承載裝置 22 ' 32、42 :第二承載裝置 23、 33、43 :固定裝置 24、 25、34、35、44、45 :研磨裝置 241、 251、341、351、451 :驅動單元 242、 252、342、352、442、452 :研磨單元 243、 253、343、353、453 :驅動部件 13 M417226 角度調整單元 244 、 254 ' 344 ' 354 ' 454 : A、 Y :第一軸向 B、 Z :第二軸向 P1〜P8 :表面 R1 :承載元件 R2〜R3 :執道 W :工件 X :第三轴向 14The Mil 226 can increase its capacity. [Comprehensive Mode] Hereinafter, a polishing processing apparatus according to the present embodiment will be described with reference to the related drawings, in which the same elements will be denoted by the same reference numerals. Referring to Figure 2, there is shown a schematic view of a lapping apparatus 2 in accordance with a first embodiment of the present invention. The lapping apparatus 2 can be used to grind and add a workpiece W, which is a linear slide or other similar elongated structure, but is not limited thereto. The grinding processing apparatus 2 comprises a first carrying device 21, a second carrying device 22, a fixing device 23 and two grinding devices. 24, 25 ° The second carrying device 22 is disposed on the first carrying device 21, and the workpiece W is disposed on the second carrier 22, and the reference plane is determined depending on the portion planned to be polished. As shown in FIG. 2, the workpiece W is based on the outer first surface P1. The first carrying device 21 has a drive unit (not shown), and the drive unit can drive the second carrier 22 to move in a third axial direction X. The third axial direction X is the long axis axial direction of the workpiece W. Here, the second carrier 22 is movable relative to the fixture 23 along the long axis direction of the workpiece W. In the present embodiment, the second carrier device 22 has a carrier member R1 for fixing the workpiece W. to carry the workpiece W, and the carrier member R1 is in contact with the outer first surface P1 of the workpiece W to provide uniform and stable support of the workpiece W. force. In other embodiments, the second carrier 22 can have a space for accommodating 7 M417226: W, such as a groove. In addition, the first load carrying device has thoughts R2 and R3 to carry the second carrying device 22 and the workpiece=bearing device 22 and the workpiece-stable stable branching force, and :: I:! by the second relay 22 The first carrier device 21 moves. The value of the carrier device 22, such as a groove, may also be accommodated in the second embodiment. The cover 23 is disposed on the first carrying device 21, and the two can be suspended from each other. Furthermore, the polishing means 24 - 25 are respectively connected to the support of the fixed mounting device 23 (10), and the two grindings 24, 25 are respectively disposed on the workpiece w Further, the fixing device 23 is substantially in the shape of a gate, and the two grinding devices (four) are fixed at the end. In detail, it is disposed on the left side of the carrier device 22 with respect to ^=24; The second side of the first carrying device 22. Thereby, the grinding device 24, 25 is used to simultaneously grind at least two different surfaces of the workpiece W. You / again, U 2 does not, to explain in detail The grinding device 24, 25 = mode. The grinding device 24, 25 is coupled to the fixing device 23, and the polishing devices 24, 25 can be respectively a ±, Y, p, an axial A' Y and / or a second The axial direction B, = movement, to simultaneously grind the processing tool. Here, the polishing device μ, the blade has a driving unit 241, the driving material 24!, 251: respectively, driving the two polishing devices 24, 25 respectively - axial angles α, γ, and 蜮 勒 其中 ' ' ' 弟 一 轴向 轴 轴 轴 轴 轴 轴 轴 轴 轴 轴 轴 轴 轴 轴 轴 轴 轴In this embodiment, the angle of the 9G degree is taken as an example. In other embodiments, the angle between the first axial direction A (Y) and the second axial direction Ζ (Ζ) may be required, for example, may be 0. Further, the polishing devices 24, 25 may further have a polishing unit 242, 252 and a driving member 243, 253, respectively, which drive the polishing units 242, 252 to rotate, respectively. The grinding units 242, 252 can respectively have a grinding wheel or a grinding wheel. In this embodiment, the grinding wheel is taken as an example, and the driving members 243, 253 can respectively drive the grinding wheel of the grinding unit 242, 252 to operate by the grinding wheel and the driving part. 243, 253 can be used to grind the workpiece W. It should be noted that the design of the grinding device 24, '25 should not be limited to this embodiment, and the visual requirements have different squares, and the end can be improved. The efficiency of the grinding process is a priority. The grinding devices 24, 25 may each have an angle adjusting unit 244, 254. The angle adjusting units 244, 254 make the grinding devices 24, 25 clockwise or counterclockwise depending on the processing requirements of the workpiece W. Spin The degree of freedom of the polishing devices 24 and 25 can be further improved by processing the different positions of the surface of the workpiece W. Of course, the installation positions of the angle adjusting units 244 and 254 are not particularly limited. In this embodiment, The angle of rotation of the grinding units 242, 252 of the grinding devices 24, 25 may be between 0 and 180 degrees. However, when the grinding unit 242, 252 grinds the workpiece W, the preferred grinding angle may be between 0 degrees Between 90 degrees, wherein 0 degrees is the grinding unit 242, . 252 are parallel to the first axial direction A, Υ, respectively, and 90 degrees is the grinding unit 242, 252 perpendicular to the first axial direction A, Y. In addition, it is to be noted that the angle adjusting units 244, 254 can adjust the rotation angle of the grinding skirts 24, 25 manually or automatically (for example, by a servo motor), and are not limited thereto. According to the value of "k", one of the grinding skirts 24, 25 of the present invention can be divided into the axial direction A, Y and / or the second axial direction B, z, so the two flute devices 24, 25 are ground. It can have two degrees of freedom respectively. In addition, the 斟=loading device 22 moves along the long axis direction (third axial direction X) of the workpiece w. The fixing device 23 moves, so that when the polishing devices 24 and 25 are ground, another degree of freedom is obtained. The processing device 2 can have a grinding process with a degree of freedom (5 axes). Further, the two polishing apparatuses 24 and Μ of the present embodiment are disposed on the same side of the fixed portion 23 and are the same plane. In other words, the grinding device 24, and its force... _ ΰ Z's 冋-plane. However, the 'in the middle' polishing apparatus 24, 25 may be misaligned back and forth or placed on the opposite side of the fixture 23. "In the following, the above example is taken as an example, and the situation of the 'in step object w' shown in Fig. 3 is used. For the sake of clarity ^2·; 70 242, 252 grinding processing attack workpiece W, and ^楚况明' 3 shows that the grinding unit is different from the actual ratio. The ratio of the two is different from that of Figure 2. The ratio of the two can also be divided: the driving unit of the creation is the first one of the grinding units 242 and 252 of the second Moving the 242, 252 to A'Y and/or the second axial direction b, z can simultaneously grind and add the abrasive early and third surface P3. In addition, when the second surface P2 is polished to the fourth surface p4, the M417226 fifth surface P5, the sixth surface P6, the seventh surface P7, and the eighth surface P8 of the workpiece w, the driving units 241, 251 and The angle adjusting units 244, 254 adjust the positions and rotation angles of the polishing units 242, 252. For example, when the polishing units 242, 252 are respectively rotated by 90 degrees, the sixth surface P6, the seventh surface P7, and the eighth surface P8 can be polished. In addition, when the polishing units 242, 252 are respectively rotated between 90 degrees and 90 degrees, the polishing unit 242 can grind the fourth surface P4, and the polishing unit 252 can grind the fifth surface P5. Here, the two polishing units 242 252 can respectively grind the opposing surfaces of the workpiece W (the fourth surface P4 and the fifth surface P5). Therefore, the polishing apparatus 2 of the present invention can not only grind the second surface P2 and the third surface P3 on the outer side of the workpiece W, but can also grind the fourth surface P4 of the inner side of the workpiece W without replacing other grinding processing equipment. Five surfaces P5, a sixth surface P6, a seventh surface P7, and an eighth surface P8. Further, please refer to Fig. 4, which is a schematic view of a polishing processing apparatus 3 according to a second embodiment of the present invention. The lapping apparatus 3 of the present embodiment is substantially the same as the lapping apparatus 2 of the foregoing embodiment, and the main difference between the lapping apparatus 3 and the lapping apparatus 2 is that the lapping means 34, 35 are disposed in the fixing means 23 in front and rear offset. Further, the technical features of the other components of the grinding processing apparatus 3 can be referred to the same components of the grinding processing apparatus 2, and will not be described herein. Further, please refer to Fig. 5, which is a schematic view of a polishing processing apparatus 4 according to a third embodiment of the creation. The lapping apparatus 4 of the present embodiment is substantially the same as the lapping M417226 apparatus 2 of the foregoing embodiment, and the main difference between the lapping apparatus 4 and the lapping apparatus 2 is that the lapping means 44, 45 are disposed on the opposite side of the fixing means 43. Further, the technical features of the other components of the grinding processing apparatus 4 can be referred to the same components of the grinding processing apparatus 2, and will not be described herein. In summary, the grinding processing apparatus according to the present invention has two grinding devices, and the grinding devices are respectively rotatable and respectively moved along a first axial direction and/or a second axial direction for simultaneous grinding processing. Workpiece. Accordingly, it is possible to grind the third surface, the fourth surface or other surface of the workpiece by changing the position and the rotation angle of the grinding device as compared with the conventional one, without grinding the object with another grinding processing device. Processing, therefore, the grinding equipment of this creation can not only improve the processing precision of the workpiece, but also increase its production capacity. Additionally, in another embodiment of the present creation, the grinding devices may be misaligned or disposed on the same side or opposite sides of the fixture. In this way, the grinding equipment of the present invention can improve the processing precision of the workpiece and increase the productivity. The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations to the spirit and scope of this creation shall be included in the scope of the appended patent application. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a conventional grinding processing apparatus; FIG. 2 is a schematic view of a grinding processing apparatus according to a first embodiment of the present invention; The present invention is a schematic view; FIG. 4 of a grinding processing apparatus of the second embodiment is based on the present invention; and FIG. 5 is a schematic view according to the present invention. [Main component symbol description] of a grinding processing apparatus of the third embodiment [Generally known] I: Grinding processing apparatus II: Carrier device 12' U: Grinding device 121, 131: Grinding wheel Ρ1 to Ρ4: Surface W: Workpiece [This creation 〕 2, 3, 4: grinding processing equipment 21 ' 31, 41: first carrying device 22 ' 32, 42: second carrying device 23, 33, 43: fixing device 24, 25, 34, 35, 44, 45: Grinding device 241, 251, 341, 351, 451: driving unit 242, 252, 342, 352, 442, 452: grinding unit 243, 253, 343, 353, 453: driving member 13 M417226 angle adjusting unit 244, 254 '344 ' 354 ' 454 : A, Y : first axial direction B, Z : second axial direction P1 〜 P8 : surface R1 : carrier element R2 〜 R3 : way W : workpiece X : third axial direction 14