JP2015074042A - Grinding device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to grind the whole of a planar workpiece thinly and to grind the planar workpiece while remaining the outer periphery part, too, with one grinding machine.SOLUTION: First grinding means 14a, 14b grind the central area of a planar workpiece held by holding tables 12a to 12c. In a case of grinding the whole of the planar workpiece thinly, reciprocating means 18 positions second grinding means 15a, 15b at first grinding positions, and the second grinding means 15a, 15b grind the outer periphery area of the planar workpiece. In a case of grinding the planar workpiece while remaining the outer periphery part, the reciprocating means 18 positions the second grinding means 15a, 15b at second grinding positions, and the second grinding means 15a, 15b grind the intermediate area of the planar workpiece. By using the first grinding means 14a, 14b and the second grinding means 15a, 15b which can change the grinding positions, grinding the whole of the planar workpiece and grinding while remaining the outer periphery part are made possible.

Description

  The present invention relates to a grinding apparatus for grinding a plate-like workpiece.

  The grinding method for grinding a disk-shaped plate-shaped workpiece includes a grinding method for thinly grinding the entire plate-shaped workpiece, and a circular recess is formed in the central portion by grinding while leaving the outer peripheral portion of the plate-shaped workpiece. There is a grinding method in which an annular convex part is formed in the part. In any of the grinding methods, the occurrence of surface burn or the like is prevented by slightly tilting the rotating shaft of the grinding means and the rotating shaft of the holding table rather than in parallel. For this reason, by grinding in advance the holding surface of the holding table that holds the plate-like workpiece, the grinding surface of the grinding wheel and the holding surface of the holding table are made parallel, and the plate-like workpiece is ground in that state, The thickness of the workpiece is made uniform (see, for example, Patent Document 1).

JP 2008-60470 A

  However, since the diameter of the part to be ground is different between the case where the entire plate-shaped workpiece is ground thinly and the case where the outer peripheral part is left to be ground, a grinding wheel having a different outer diameter of the grinding wheel arranged in an annular shape is used. There is a need. In addition, since the rotating shaft of the grinding means and the rotating shaft of the holding table are not parallel, if the outer diameter of the grinding wheel changes, the holding surface of the holding table is correspondingly made uniform in order to make the thickness of the plate-like workpiece uniform. It is also necessary to change the shape.

  On the other hand, by tilting the rotation axis of the holding table or grinding wheel without changing the shape of the holding surface, even when trying to make the thickness of the plate-like workpiece uniform, the thickness of the plate-like workpiece is made uniform with high accuracy. It is not possible. For this reason, it is necessary to separately prepare a grinding device for thinly grinding the entire plate-like workpiece and a grinding device for grinding the outer peripheral portion.

  The present invention has been considered in view of such problems, and the whole plate-like workpiece can be thinly ground with one grinding device, and can be ground leaving the outer peripheral portion, and the plate-like workpiece can be ground. An object of the present invention is to make the thickness of the film uniform with high accuracy.

A grinding apparatus according to the present invention is equipped with a holding table that holds a disk-shaped plate-shaped workpiece and rotates the held plate-shaped workpiece, and a first grinding wheel in which a plurality of grinding wheels are arranged in an annular shape, A first grinding means that has a first grinding spindle that rotates a mounted first grinding wheel, and that grinds the plate-like workpiece held on the holding table, and a plurality of grinding wheels are arranged in an annular shape. A second grinding means for grinding the plate-like work held by the holding table, the second grinding wheel having a second grinding spindle mounted on the second grinding wheel, the second grinding spindle rotating the mounted second grinding wheel. The first grinding means for relatively approaching / separating the first grinding means and the holding table in the grinding feed direction, the second grinding means and the holding table relative to the grinding feed direction. Approach / separate second A grinding apparatus comprising: a grinding feed means; and a second advancing means for moving the second grinding means and the holding table relative to each other in the radial direction of the holding table. The grinding apparatus is mounted on the first grinding spindle. In the first grinding wheel, the outer diameter of the plurality of annular grindstones arranged in an annular shape is smaller than the radius of the plate workpiece, and the first grinding means is supported by the holding table. The second grinding wheel mounted on the second grinding spindle for grinding a central area including the center of the plate-like workpiece and not including the outer periphery of the plate-like workpiece is provided in the plurality of annularly arranged rings. The outer diameter of the grindstone is smaller than the radius of the plate-like workpiece, and the advance / retreat means relatively moves the second grinding means and the holding table to bring the second grinding means to the first grinding position. By positioning the second grinding means, the plate-like workpiece The outer peripheral area including the outer periphery is ground, and the advance / retreat means relatively moves the second grinding means and the holding table to position the second grinding means at the second grinding position. The second grinding means grinds an intermediate area that does not include the outer periphery of the plate-like workpiece.
The outer diameter of the plurality of grinding wheels arranged in an annular shape on the first grinding wheel is equal to or more than half of the radius of the plate-like workpiece, and the annular shape arranged on the second grinding wheel. The outer diameter of the plurality of grinding wheels is preferably equal to or less than the outer diameter of the plurality of grinding wheels arranged in an annular shape on the first grinding wheel.

According to the grinding apparatus of the present invention, the advance / retreat means positions the second grinding means and the holding table at the first grinding position, whereby the entire plate-shaped workpiece can be ground thinly, and the advance / retreat means is the second advancement / retreat means. By positioning the grinding means and the holding table at the second grinding position, it is possible to perform grinding while leaving the outer peripheral portion of the plate-like workpiece. Therefore, the entire plate-shaped workpiece can be ground thinly with one grinding device, and can also be ground leaving the outer peripheral portion. In either case, since the position of the first grinding means does not change, the plate-like workpiece can be ground to a uniform thickness with high accuracy.
As the second grinding wheel, if the grinding wheel has the same outer diameter as the first grinding wheel, it is not necessary to prepare two types of grinding wheels, so that the inventory cost can be reduced.
In addition, as long as the second grinding wheel is configured to use a grinding wheel whose outer diameter is smaller than that of the first grinding wheel, it does not take time to replace the second grinding wheel having a high replacement frequency. The workload can be reduced.

The top view which shows a grinding device. FIG. 3 is a cross-sectional view taken along the line A-B-C-D in FIG. FIG. 2 is a cross-sectional view taken along the line ABCD of FIG. 1 during a TAIKO grinding process. The front view which shows another grinding device. The top view which shows the grinding range.

  A grinding apparatus 10 shown in FIG. 1 is configured to perform grinding for thinly grinding an entire disc-shaped plate-shaped workpiece (hereinafter referred to as “thin finish grinding”), and grinding by leaving the outer peripheral portion of the plate-shaped workpiece. It is an apparatus that can perform both grinding (hereinafter referred to as “TAIKO grinding”) in which a circular concave portion is formed on the outer peripheral portion and an annular convex portion is formed on the outer peripheral portion with a single grinding apparatus. The grinding apparatus 10 includes a turntable 11 that rotates around a rotation axis 119 parallel to the ± Z directions, three holding tables 12a to 12c arranged on the turntable 11, and two fixed support portions 13a. , 13b, and four grinding means 14a, 14b, 15a, 15b for grinding the plate-like workpieces held on the holding tables 12a-12c, and the grinding means 14a, 14b, 15a, 15b are moved in the ± Z direction. Four grinding feed means 16a, 16b, 17a, 17b for moving each grinding means toward and away from the holding tables 12a-12c, and two advancing / retreating means 18a, 18b for moving the grinding means 15a, 15b in the ± X direction, Is provided.

  Each holding table 12a to 12c sucks and holds a disk-shaped plate-like workpiece placed on the holding surfaces 121a to 121c, and has base parts 122a to 122a around the rotation axes 129a to 129c parallel to the ± Z directions. 122c rotates with the holding surfaces 121a-121c, and rotates the plate-shaped workpiece | work hold | maintained. As the turntable 11 rotates, the holding tables 12a to 12c move along the circumference of the turntable 11, and hold the rough grinding position where the held plate-like workpiece is ground by the grinding means 14a and 15a. The plate-like workpiece is positioned at a finish grinding position where it is ground by the grinding means 14b, 15b.

  Each of the grinding means 14a, 14b, 15a, 15b rotates a grinding wheel attached to the tip of the grinding spindle about the rotation shafts 149a, 149b, 159a, 159b. The grinding wheels 21a, 21b, 22a, and 22b attached to the grinding means 14a, 14b, 15a, and 15b each have a plurality of grinding wheels 211a, 211b, 221a, and 221b arranged in an annular shape on the lower surface of the disk-shaped base. ing.

  The first grinding feed means 16a feeds the first grinding means 14a in the -Z direction, and the grinding wheel 211a of the first grinding wheel 21a mounted on the tip of the first grinding spindle is rotating. The central area 33 (see FIGS. 2 and 3) of the plate-like workpiece can be roughly ground by pressing against the plate-like workpiece held by the holding tables 12a to 12c positioned at the grinding position. The center area 33 of the plate-shaped workpiece is a circular area that includes the center of the plate-shaped workpiece positioned on the rotation shafts 129a to 129c of the holding tables 12a to 12c and does not include the outer periphery of the plate-shaped workpiece.

  The second grinding feed means 17a feeds the second grinding means 15a in the -Z direction, and the second grinding wheel 22a grinding wheel 221a mounted on the tip of the second grinding spindle and rotating is roughly ground. The outer peripheral area 34 (see FIG. 2) or the intermediate area 35 (see FIG. 3) of the plate-like workpiece can be roughly ground by pressing against the plate-like workpiece held on the holding tables 12a to 12c positioned at the positions. . The outer peripheral area 34 of the plate-shaped workpiece is a donut-shaped region that includes the outer periphery of the plate-shaped workpiece and does not include the center of the plate-shaped workpiece. The plate-shaped workpiece intermediate area 35 is a donut-shaped region that does not include the outer periphery of the plate-shaped workpiece and does not include the center of the plate-shaped workpiece.

  The advancing / retreating means 18a advances and retracts the second grinding means 15a in the ± X direction, so that the rotation shafts 129a to 129c of the holding tables 12a to 12c positioned at the rough grinding position and the rotation shaft 159a of the second grinding means 15a. And the range on the plate workpiece to be ground by the second grinding means 15a changes. Thereby, the 2nd grinding means 15a can also grind the outer peripheral area 34 of a plate-shaped workpiece | work, and can also grind the intermediate area 35 of a plate-shaped workpiece | work.

  The first grinding feed means 16b feeds the first grinding means 14b in the -Z direction, and finish grinding the first grinding wheel 21b grinding wheel 211b mounted on the tip of the first grinding spindle and rotating. The center area 33 of the plate-like workpiece can be finish-ground by pressing against the plate-like workpiece held by the holding tables 12a to 12c positioned at the positions.

  The second grinding feed means 17b feeds the second grinding means 15b in the -Z direction, and finishes the grinding wheel 221b of the second grinding wheel 22b mounted on the tip of the second grinding spindle and rotating. By pressing against the plate-like workpieces held by the holding tables 12a to 12c positioned at the grinding position, the outer peripheral area 34 or the intermediate area 35 of the plate-like workpiece can be finish-ground.

  The advance / retreat means 18b advances and retracts the second grinding means 15b in the ± X direction, whereby the rotation shafts 129a to 129c of the holding tables 12a to 12c positioned at the finish grinding position and the rotation shaft 159b of the second grinding means 15b. And the range on the plate workpiece to be ground by the second grinding means 15b changes. Thereby, the 2nd grinding means 15b can also grind the outer peripheral area 34 of a plate-shaped workpiece | work, and can also grind the intermediate area 35 of a plate-shaped workpiece | work.

  In the grinding apparatus 10 shown in FIG. 1, when the holding tables 121a to 121c rotate counterclockwise, the plate-like workpieces held on the holding tables are sequentially positioned at the rough grinding position and the finish grinding, and rough grinding is performed. In the position, rough grinding is performed by the first grinding means 14a and the second grinding means 15a, and finish grinding is performed by the first grinding means 14b and the second grinding means 15b. Below, the case where the plate-shaped workpiece | work after rough grinding is finish-ground is demonstrated. Since the holding tables 12a to 12c are configured similarly, in the following, the holding tables 12a to 12c are collectively referred to as the holding table 12, the holding surfaces 121a to 121c are collectively referred to as the holding surface 121, and the base portions 122a to 122c are the base portions. The rotation shafts 129a to 129c are collectively referred to as a rotation shaft 129.

  As shown in FIG. 2, the rotating shaft 149b of the first grinding means 14b is not parallel to the rotating shaft 129 of the holding table 12, but is slightly inclined with respect to the ± Z directions. Thus, since the rotation shaft 149b of the first grinding means 14b is inclined, the depth ground by the first grinding means 14b differs depending on the distance from the rotation shaft 129 of the holding table 12. Further, the rotating shaft 159b of the second grinding means 15b is not parallel to the rotating shaft 129 of the holding table 12, but is slightly inclined with respect to the ± Z directions. Since the rotation shaft 159b of the second grinding means 15b is inclined, the depth ground by the second grinding means 15b differs depending on the distance from the rotation shaft 129 of the holding table 12. Therefore, the holding surface 121 of the holding table 12 is provided with unevenness having an arc cross section corresponding to the depth to be ground. The plate-like workpiece 30 placed on the holding surface 121 is deformed along the unevenness of the holding surface 121 by being sucked. By performing grinding in this state, the plate-like workpiece can be ground to a uniform thickness with high accuracy regardless of the distance from the center. FIG. 2 illustrates the relationship between the holding table 12 located at the finish grinding position, the rotation shaft 149b of the first grinding means 14b, and the rotation shaft 159b of the second grinding means 15b. The same holds true for the relationship between the holding table 12 positioned at the rotation table, the rotation shaft 149ab of the first grinding means 14a, and the rotation shaft 159a of the second grinding means 15a.

  As shown in FIG. 2, when thin finish grinding is performed, the outermost periphery of the locus of the grinding wheel 211 b of the first grinding means 14 b passes through the rotation shaft 129 of the holding table 12. On the other hand, the 2nd grinding means 15b makes the outermost periphery of the locus | trajectory of the grinding wheel 221b pass the outer periphery of the plate-shaped workpiece 30. FIG. The position of the second grinding means 15b at this time is defined as a first grinding position. The position of the second grinding means 15b in the ± X direction is adjusted by the advance / retreat means 18b.

  Under this positional relationship, the holding table 12 is rotated, and the grinding wheel 211b and the grinding wheel 221b are brought into contact with the upper surface of the plate-like work 30 while being rotated, whereby the central area 33 and the outer periphery of the plate-like work 30 are contacted. Area 34 can be thin finish ground. Moreover, since the holding surface 121 is shaped in parallel with the respective grinding surfaces of the grinding wheel 211b and the grinding wheel 221b, the plate-like workpiece 30 can be finished to a uniform thickness. Furthermore, since the grinding by the first grinding means 14b and the grinding by the second grinding means 15b can be performed simultaneously, the productivity is not inferior to grinding by only one grinding means. The grinding by the first grinding means 14b and the grinding by the second grinding means 15b can be performed with a time difference.

  As shown in FIG. 3, when performing TAIKO grinding, the positional relationship between the first grinding means 14b and the holding table 12 is the same as in the case of thin finish grinding. On the other hand, the advancing / retreating means 18b positions the second grinding means 15b closer to the rotating shaft 129 of the holding table 12 than in the thin finish grinding shown in FIG. 2, and the outermost circumference of the locus of the grinding wheel 221b is plate-like. The workpiece 30 is positioned on the inner peripheral side with respect to the outer peripheral edge. The position of the second grinding means 15b at this time is defined as a second grinding position.

  Under such a positional relationship, the grinding wheel 211b of the first grinding means 14b grinds the central area 33 of the plate-like workpiece 30 and the grinding wheel 221b of the second grinding means 15b The intermediate area 35 is ground. When grinding is performed in this manner, the annular convex portion 31 remains on the outer peripheral side of the intermediate area 35. The central area 33 and the intermediate area 35, which are areas on the inner peripheral side with respect to the annular convex portion 31, are ground into a circular concave portion 32. Since the holding surface 121 is shaped in parallel with the grinding surfaces of the grinding wheel 211b and the grinding wheel 221b, the circular recess 32 can be finished to a uniform thickness. Further, the grinding by the first grinding means 14b and the grinding by the second grinding means 15b can be performed simultaneously, and productivity is not inferior to grinding by only one grinding means. The grinding by the first grinding means 14b and the grinding by the second grinding means 15b can be performed with a time difference.

  Thus, the position of the first grinding means 14b with respect to the rotating shaft 129 of the holding table 12 and the outer diameters 216 and 226 of the grinding wheels 211b and 221b of the grinding wheels 21b and 22b attached to the grinding means 14b and 15b are changed. Instead, by changing only the position of the second grinding means 15b, both the thin finish grinding and the TAIKO grinding can be performed with one grinding apparatus 10.

  In order to overlap the region that can be ground by the first grinding unit 14b and the region that can be ground by the second grinding unit 15b, at least the first grinding wheel 21b mounted on the first grinding unit 14b is not provided. The sum of the outer diameter of the grinding wheel 211b and the outer diameter of the grinding wheel 221b of the second grinding wheel 22b attached to the second grinding means 15b needs to be larger than the radius of the plate workpiece 30. . Since the outer diameter of the grinding wheel 221b is smaller than the outer diameter of the grinding wheel 211b, the outer diameter of the grinding wheel 211b needs to be larger than one half of the radius 308 of the plate workpiece 30.

  The position of the first grinding means 14b and the outer diameter of the grinding wheel 211b of the first grinding wheel 21b mounted on the first grinding means 14b are changed between thin finish grinding and TAIKO grinding. Therefore, in the central area 33, the plate-like workpiece 30 can be finished to a uniform thickness with high accuracy. Furthermore, since the thin finish grinding and the TAIKO grinding do not change the inclination of the rotary shaft 159b of the second grinding means 15b and the grinding wheel 221b does not need to be changed, the plate-like workpiece 30 can be formed in the intermediate area 35 and the outer peripheral area 34. A uniform thickness can be obtained with high accuracy.

  Since one grinding is performed using the two grinding means of the first grinding means 14b and the second grinding means 15b, the outer diameter of the grinding wheel is compared with the case of grinding using one grinding means. Can be reduced. Therefore, the torque of the grinding spindle can be reduced, and a small spindle motor can be used. For this reason, although the number of grinding means increases, the grinding apparatus 10 can be reduced in size.

  In the second grinding wheel 22b, the side surface of the grinding wheel 221b comes into contact with the plate-shaped workpiece 30 during TAIKO grinding, so that the side surface wear is larger and the replacement frequency is higher than the first grinding wheel 21, The outer diameter of the grinding wheel 221b of the second grinding wheel 22b attached to the second grinding means 15b is larger than the outer diameter of the grinding wheel 211b of the first grinding wheel 21b attached to the first grinding means 14a. Since it is small, it does not take time to replace the second grinding wheel 22b, and the work load can be reduced.

  The outer diameter of the grinding wheel 221b of the second grinding wheel 22b attached to the second grinding means 15b is equal to the outer diameter of the grinding wheel 211b of the first grinding wheel 21b attached to the first grinding means 14a. The structure may be equal to With such a configuration, it is not necessary to prepare two types of grinding wheels, the stock of replacement grinding wheels can be reduced, and the inventory cost can be reduced.

The outer diameter of the grinding wheel 211a of the first grinding wheel mounted on the first grinding means 14a for rough grinding is determined by the grinding of the first grinding wheel 21b mounted on the first grinding means 14b for finish grinding. It is equal to the outer diameter of the grindstone 211b. Further, the distance between the rotation shaft 149a of the first grinding means 14a for rough grinding and the rotation shaft 129 of the holding table 12 positioned at the rough grinding position is the same as that of the first grinding means 14b for finish grinding. It is equal to the distance between the rotating shaft 149b and the rotating shaft 129 of the holding table 12 positioned at the finish grinding position. Further, the inclination of the rotation shaft 149a of the first grinding means 14a for rough grinding is equal to the inclination of the rotation shaft 149b of the first grinding means 14b for finish grinding.
The outer diameter of the grinding wheel 211a of the second grinding wheel mounted on the second grinding means 15a for rough grinding is the same as that of the second grinding wheel 22b mounted on the second grinding means 15b for finish grinding. It is equal to the outer diameter of the grinding wheel 221b. The distance between the rotary shaft 159a of the second grinding means 15a for rough grinding during thin finish grinding and the rotary shaft 129 of the holding table 12 positioned at the rough grinding position is the finish during thin finish grinding. It is equal to the distance between the rotating shaft 159b of the second grinding means 15b for grinding and the rotating shaft 129 of the holding table 12 positioned at the finish grinding position. The distance between the rotary shaft 159a of the second grinding means 15a for rough grinding during the TAIKO grinding and the rotary shaft 129 of the holding table 12 positioned at the rough grinding position is the same as that for the finish grinding during the TAIKO grinding. It is equal to the distance between the rotating shaft 159b of the second grinding means 15b and the rotating shaft 129 of the holding table 12 positioned at the finish grinding position. Further, the inclination of the rotation shaft 159a of the second grinding means 15a for rough grinding is equal to the inclination of the rotation shaft 159b of the second grinding means 15b for finish grinding.
Therefore, the same effects as finish grinding can be obtained in rough grinding.

  Another grinding apparatus 10A shown in FIG. 4 includes a holding table 12 that holds a plate-shaped workpiece, positioning means 11A that positions the holding table 12 at a predetermined grinding position, and rotation that rotates the holding table 12 about a rotation shaft 129. A mechanism 123; an inclination adjusting mechanism 124 for adjusting the inclination of the holding table 12; a portal column 13 disposed above the holding table 12; and two grinding means for grinding a plate-like workpiece held on the holding table 12 14, 15; two grinding feed means 16, 17 for moving the grinding means 14, 15 in the ± Z direction; advance / retreat means 18 for moving the second grinding means 15 in the ± X direction; and the grinding apparatus 10A. And a control means 19 for performing the operation.

  When the tilt adjusting mechanism 124 adjusts the tilt of the holding table 12, the direction of the rotation shaft 129 of the holding table 12 changes. The control unit 19 controls the tilt adjustment mechanism 124 so that the angle formed by the rotation shaft 129 with respect to the ± Z direction is a predetermined angle.

  The 1st grinding means 14 rotates the 1st grinding wheel 21 with which the front-end | tip of the 1st grinding spindle 141 is mounted centering on the rotating shaft 149 parallel to +/- Z direction. In the first grinding wheel 21 mounted on the first grinding means 14, a plurality of grinding wheels 211 are annularly arranged on the lower surface of a disk-like base portion 212. On the other hand, the second grinding means 15 rotates the second grinding wheel 22 attached to the tip of the second grinding spindle 151 around a rotation axis 159 parallel to the ± Z direction. In the second grinding wheel 22 mounted on the second grinding means 15, a plurality of grinding wheels 221 are annularly arranged on the lower surface of a disk-like base portion 222.

  The outer diameter of the grinding wheel 211 of the first grinding wheel 21 mounted on the first grinding means 14 and the outer diameter of the grinding wheel 221 of the second grinding wheel 22 mounted on the second grinding means 15 Equally smaller than the radius of the plate workpiece.

  As shown in FIG. 5, the rotating shaft 149 of the first grinding means 14 is located in the −X direction of the rotating shaft 129 of the holding table 12, and the distance between the rotating shaft 149 and the rotating shaft 129 is constant. is there. On the other hand, the rotating shaft 159 of the second grinding means 15 is positioned in the + X direction of the rotating shaft 129 of the holding table 12, and the advance / retreat means 18 shown in FIG. 4 moves the second grinding means 15 in the ± X direction. By moving it, the distance between the rotating shaft 159 and the rotating shaft 129 changes.

  When performing thin finish grinding, the control means 19 controls the advance / retreat means 18 so that the second grinding means 15 is positioned at the first grinding position where the grinding range by the second grinding means 15 is the outer peripheral area. On the other hand, when performing TAIKO grinding, the control means 19 controls the advance / retreat means 18 so that the second grinding means 15 is positioned at the second grinding position where the grinding range by the second grinding means 15 is an intermediate area. In this way, both the thin finish grinding and the TAIKO grinding can be executed by one grinding apparatus 10A. In either case, the plate-like workpiece can be ground to a uniform thickness with high accuracy. it can.

  The outer diameter of the grinding wheel 221 of the second grinding wheel 22 attached to the second grinding means 15 and the outer diameter of the grinding wheel 211 of the first grinding wheel 21 attached to the first grinding means 14 are: Since they are equal, it is not necessary to prepare two types of grinding wheels, the stock of replacement grinding wheels can be reduced, and the inventory cost can be reduced. The outer diameter of the grinding wheel 221 of the second grinding wheel 22 attached to the second grinding means 15 is the outer diameter of the grinding wheel 211 of the first grinding wheel 21 attached to the first grinding means 14. A smaller configuration may be used. Then, the work load for exchanging the second grinding wheel 22 can be reduced.

  In order for the area that can be ground by the first grinding means 14 and the area that can be ground by the second grinding means 15 to overlap, at least the grinding wheel of the first grinding wheel 21 that is mounted on the first grinding means 14. The sum of the outer diameter of 211 and the outer diameter of the grinding wheel 221 of the second grinding wheel 22 mounted on the second grinding means 15 needs to be larger than the radius of the plate workpiece. Since the outer diameter of the grinding wheel 211 and the outer diameter of the grinding wheel 221 are equal, the outer diameter of the grinding wheels 211 and 221 needs to be larger than one half of the radius of the plate-like workpiece.

  Further, there may be a plurality of holding tables as in the grinding apparatus 10 as long as the plate-like workpiece held on one holding table can be ground simultaneously by the first grinding means and the second grinding means. However, there may be only one holding table as in the grinding apparatus 10A.

10, 10A grinding device,
11 Turntable, 11A Positioning means, 119 Rotating shaft 12, 12a, 12b, 12c Holding table,
121, 121a, 121b, 121c holding surface,
122, 122a, 122b, 122c base,
123 rotation mechanism, 124 tilt adjustment mechanism,
129, 129a, 129b, 129c Rotating shaft 13 Portal column, 13a, 13b Support part,
14, 14a, 14b first grinding means, 141 first grinding spindle,
149, 149a, 149b rotary shafts 15, 15a, 15b second grinding means, 151 second grinding spindle,
159, 159a, 159b rotating shaft,
16, 16a, 16b first grinding feed means,
17, 17a, 17b second grinding feed means;
18, 18a, 18b advance / retreat means, 19 control means,
21, 21a, 21b first grinding wheel,
22, 22a, 22b second grinding wheel,
211, 211a, 211b, 221, 221a, 221b grinding wheel,
212, 212a, 212b, 222, 222a, 222b base,
30 plate workpiece, 31 annular convex part, 32 circular concave part,
33 Central area, 34 Outer peripheral area, 35 Middle area

Claims (3)

A holding table for holding a disk-shaped workpiece and rotating the held workpiece;
A plate-like workpiece having a first grinding spindle on which a first grinding wheel in which a plurality of grinding wheels are arranged in an annular shape is mounted, and having the first grinding spindle rotating the mounted first grinding wheel, held on the holding table First grinding means for grinding
The plate-like workpiece having a second grinding spindle on which a second grinding wheel in which a plurality of grinding wheels are arranged in an annular shape is mounted, and rotating the mounted second grinding wheel, is held on the holding table A second grinding means for grinding
First grinding feed means for relatively approaching and separating the first grinding means and the holding table in the grinding feed direction;
A second grinding feed means for relatively approaching and separating the second grinding means and the holding table in the grinding feed direction;
Advancing and retracting means for relatively moving the second grinding means and the holding table in the radial direction of the holding table;
A grinding apparatus comprising:
The first grinding wheel mounted on the first grinding spindle has an outer diameter of the plurality of annular grinding wheels arranged in an annular shape smaller than a radius of the plate-like workpiece,
The first grinding means includes a center of the plate-like workpiece held by the holding table, and grinds a central area not including the outer periphery of the plate-like workpiece,
The second grinding wheel mounted on the second grinding spindle has an outer diameter of the plurality of annular grinding wheels arranged in an annular shape smaller than a radius of the plate-like workpiece,
The advancing / retreating means relatively moves the second grinding means and the holding table to position the second grinding means at the first grinding position, so that the second grinding means becomes the plate-like workpiece. Grinding the outer periphery area including the outer periphery of
The advancing / retreating means relatively moves the second grinding means and the holding table to position the second grinding means at the second grinding position, so that the second grinding means becomes the plate-like workpiece. Grinding device that grinds the middle area that does not include the outer periphery of the. The outer diameter of the plurality of grinding wheels arranged annularly on the first grinding wheel is at least half of the radius of the plate-like workpiece,
The grinding according to claim 1, wherein an outer diameter of the plurality of grinding wheels arranged annularly on the second grinding wheel is equal to an outer diameter of the plurality of grinding wheels arranged annularly on the first grinding wheel. apparatus. The outer diameter of the plurality of grinding wheels arranged annularly on the first grinding wheel is at least half of the radius of the plate-like workpiece,
The outer diameter of the plurality of grinding wheels arranged annularly on the second grinding wheel is smaller than the outer diameter of the plurality of grinding wheels arranged annularly on the first grinding wheel. Grinding equipment.

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