TWM408119U - Spray-slit type substrate cleaning device - Google Patents

Spray-slit type substrate cleaning device Download PDF

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Publication number
TWM408119U
TWM408119U TW100202719U TW100202719U TWM408119U TW M408119 U TWM408119 U TW M408119U TW 100202719 U TW100202719 U TW 100202719U TW 100202719 U TW100202719 U TW 100202719U TW M408119 U TWM408119 U TW M408119U
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Taiwan
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chamber
fluid
fluid chamber
atomization
flow
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TW100202719U
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Chinese (zh)
Inventor
Mian-Ying Gong
Wen-Cheng Li
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Manz Taiwan Ltd
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Priority to TW100202719U priority Critical patent/TWM408119U/en
Publication of TWM408119U publication Critical patent/TWM408119U/en

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Description

M408119 五、新型說明: 【新型所屬之技術領域】 一種基板清洗裝置’尤其是一種將雙流體均勻並全面性 的霧化,以提升基板清潔效率的噴霧式之基板清洗裝置。 【先前技術】 薄膜電晶體(液晶顯示器)、電漿顯示面板及電致發光顯M408119 V. New description: [New technical field] A substrate cleaning device' is a spray type substrate cleaning device which is a uniform and comprehensive atomization of a two-fluid to improve the cleaning efficiency of the substrate. [Prior Art] Thin film transistor (liquid crystal display), plasma display panel and electroluminescence display

示器等平板顯示器上之基板是需要高精密加工之一種部件, 在基板進厅製程之如或處理後須進行該清洗製程,清洗製程 係對基板表面進行清潔,例如由藥液處理製程、沖洗(rinse) 製程以及乾燥製程組成,在清洗製程中,為了清除顆粒及污 染物而利用清洗液對基板進行處理時,為了提高清洗能力, 提出了在清洗液中混合清潔的乾燥空氣(clean dry air)而生 成雙流體’並將生成之雙流體放大之後以雜⑽ble)形態 衝擊至基板表面之基板清洗用雙流體喷嘴(以下稱為雙流體 噴嘴)。 請參考發明專利公· 2_咖之申請案的基板清洗 用雙流體喷嘴,參閱第—圖,基板清洗用雙流體喷嘴之剖面 :意圖’其包含有用於分別收容互不相同之流體的第—收容 π 100及第二收容部200;用於移送收容於該第一收容部⑽The substrate on the flat panel display such as the display is a component that requires high-precision processing. The cleaning process is performed after the substrate is processed or processed, and the cleaning process is to clean the surface of the substrate, for example, by a chemical treatment process, and a rinse process. (rinse) process and drying process composition, in the cleaning process, in order to remove particles and contaminants to clean the substrate with cleaning solution, in order to improve the cleaning ability, it is proposed to mix clean dry air in the cleaning solution (clean dry air And a two-fluid nozzle for substrate cleaning (hereinafter referred to as a two-fluid nozzle) that generates a two-fluid 'and amplifies the generated two-fluid and then impinges on the surface of the substrate in a hetero (10) ble) form. Please refer to the two-fluid nozzle for substrate cleaning in the application of the invention patent application. Referring to the drawings, the cross section of the two-fluid nozzle for substrate cleaning is intended to contain the first one for containing fluids different from each other. Storing π 100 and second accommodating portion 200; for transferring and accommodating in the first accommodating portion (10)

Si流體ί第—通道m ’在其端部形成有噴射該第一流 f ϋ射口 111 ;用於移送收容於該第二收容部200之 之:流^第二通道 ’在其端部形成有喷射該第二流體 一、射口 211;雙流體排出部4〇〇,以用於排出由該 、射口 111及第二噴射口 211喷射之流體相混合而生成之雙 3 流體;以及形成於該第二喷射口 211之前端部之引導部212, 以用於將由該第二噴射口 211喷射之該第二流體之喷射 引導至該第一噴射口 m。 然而習知技術的缺點在於液體及空氣混合時無法一直產 生均勻的雙流體,且第一喷射口及第二噴射口之間具有一間 距,使部份還未霧化的液體將直接掉落至基板上,因此混合 後雙流體之大小無法充分地被微粒化,導致清洗效率降低, 影響後續製程的處理,因此需要一種霧化效果佳以提升基板 清潔效率的一種喷霧式之基板清洗裝置。 【新型内容】 本創作的主要目的在於提供一種噴霧狹縫式之基板清洗 裝置,其係用以產生霧化型態的二相流體,並將霧化型態的 二相流體嘴灑至欲清洗的基板上,以提升基板的潔淨度進 而幫助於後續製程處理。 為達上述目的,本創作之具體技術手段包含有一霧化裝 置,該霧化裝置之内至少具有一第一流體腔室、一第二流體 腔室、一分流室及一霧化作用室,該第一流體腔室與該第二 流體腔室係為分隔設置且互不連通,該第一流體腔室及第二 流體腔室皆設於該霧化作用室之上,該第一流體腔室具有至 少一個氣體注入部,該至少一個氣體注入部可接設一氣體供 給管,該第一流體腔室與該霧化作用室之間設置有一第一通 道,該第二流體腔室具有至少一個液體注入部,該至少一個 液體注入部可接設一液體供給管,該第二流體腔室與該分流 室之間設有一第二通道,其中該分流室與該霧化作用室之間 設置有複數個分流孔,該霧化作用室之底端則連通於一排出 通道,該排出通道的底端出口係為一喷出口。The Si fluid ί-channel m' is formed at the end portion thereof to eject the first flow f ϋ 口 111; and is used for transfer to be accommodated in the second accommodating portion 200: the flow second channel 'is formed at the end thereof Spraying the second fluid one, the injection port 211; the two-fluid discharge portion 4〇〇 for discharging the double 3 fluid generated by mixing the fluid injected by the injection port 111 and the second injection port 211; The guiding portion 212 of the front end portion of the second injection port 211 is configured to guide the injection of the second fluid injected by the second injection port 211 to the first injection port m. However, the conventional technique has the disadvantage that a uniform two-fluid cannot always be generated when the liquid and the air are mixed, and a space is formed between the first injection port and the second injection port, so that some of the liquid that has not been atomized will be directly dropped to On the substrate, the size of the two fluids after mixing is not sufficiently micronized, resulting in a decrease in cleaning efficiency and affecting the subsequent process. Therefore, a spray type substrate cleaning device with good atomization effect to improve substrate cleaning efficiency is required. [New content] The main purpose of this creation is to provide a spray slit type substrate cleaning device for generating an atomized type two-phase fluid and sprinkling an atomized type two-phase fluid nozzle to be cleaned. On the substrate, the cleanliness of the substrate is improved to facilitate subsequent processing. In order to achieve the above object, the specific technical means of the present invention includes an atomizing device having at least a first fluid chamber, a second fluid chamber, a shunt chamber and an atomization chamber therein. a fluid chamber and the second fluid chamber are spaced apart from each other and are not in communication with each other, and the first fluid chamber and the second fluid chamber are disposed on the atomization chamber, the first fluid chamber having at least one gas An injection portion, the at least one gas injection portion may be connected to a gas supply tube, a first passage is disposed between the first fluid chamber and the atomization chamber, and the second fluid chamber has at least one liquid injection portion, At least one liquid injection portion may be connected to a liquid supply pipe, and a second passage is disposed between the second fluid chamber and the split flow chamber, wherein a plurality of split holes are disposed between the split flow chamber and the atomization chamber The bottom end of the atomization chamber is connected to a discharge passage, and the bottom end outlet of the discharge passage is a discharge port.

因此本創作可有效解決習用技術之缺失,使喷射均勻度 更為統一,進而提升基板的潔淨度,藉以提升產品良率β A 【實施方.式】 以下配合圖式及元件符號對本創作之實施方式做更詳細 的說明,俾使熟習該項技藝者在研讀本說明書後能據以實施。 參閱第二圖,本創作之噴霧狹縫式之基板清洗裝置之立 體分解圖。本創作係有關一種噴霧式之基板清洗裝置丨,其 包含有一霧化裝置1,該霧化裝置1具有一第一流體腔室 一第二流體腔室13、一分流室15及一霧化作用室丨了,該第 一流體腔至11與該弟一流體腔室13係為分隔設置且不連 通,第一流體腔室11及第二流體腔室13皆設於該霧化作用 室17的上方,因此第一流體腔室Π及第二流體腔室13之内 的流體可下傳至該霧化作用室17之中。 該第一流體腔室11具有至少一個氣體注入部m,該氣 體注入部111可接設一氣體供給管(圖面未顯示),該第一流 體腔室11與5玄務化作用至17之間具有一第一流通道I”, 其中該第一流體腔室11與該霧化作用室17之間可進一步設 置至少-1置室115 ’該中置室115與該第一流通道113相 連通,該中置室115係供氣流迴旋其中,藉以增加氣流之壓 力及流量。 該第二流體腔室13具有至少一個液體注入部131,該液 體注入部131可接設一液體供給管(圖面未顯示),該第二流 體腔室13與該分流室15之間設有一第二流通道133,其中 該分流室15與該霧化作用室17之間設置有複數個微小的分 流孔(圖面未顯示),該等分流孔的孔洞大小並不加以限定, 只要能滿足讓氣體將通過分流孔151後水流霧化的大小即 可’該霧化作用室17之底端則連通於一排出通道19,該排 出通道19的底端出口係為一喷出口 191。 當氣體與液體皆經由氣體注入部111與液體注入部131 輸入到第一流體腔室11及第二流體腔室13中,其中氣體會 通過第一流通道113與中置室115到達至霧化作用室丨7之 中,液體則先後通過第二流通道133與分流室15,在分流室 15的液體透過該等分流孔分流成複數個細化水流,該等細化 水流受氣體衝擊與混合後而形成霧態,最後霧態化二相流體 會經由排出通道19從喷出口 191均勻喷灑至基板上,本創作 在霧化裝置1之内透過先將流體分流並霧態化,使得從霧化 ,置1噴灑出完全霧化的二減體,因此在基板上產生微小 氣泡或衝擊波等獅,且讀提升翁均自度,使得基板的 清潔效率大酿升,有祕後續製程處理,進喊升產品良 率。 以上所述者僅為用以轉本創作之較佳實施例,並非企 圖據以對補作做任何形式上之_,如,凡有在相同之 所__作之贿修飾·更,_包括 在本創作思圖保護之範脅。 M408119 【圖式簡單說明】 第一圖為習知技術之基板清洗用雙流體喷嘴之剖面示意 圖。 第二圖為本創作之喷霧狹縫式之基板清洗裝置之立體分 解圖。 【主要元件符號說明】 1霧化裝置 11第一流體腔室 13第二流體腔室 15分流室 17霧化作用室 111氣體注入部 113第一流通道 115中置室 131液體注入部 133第二流通道 19排出通道 191喷出口 100第一收容部 110第一通道 111第一喷射口 200第二收容部 210第二通道 211第二噴射口 7 M408119 400雙流體排出部 212引導部Therefore, this creation can effectively solve the lack of conventional technology, make the uniformity of the injection more uniform, and thus improve the cleanliness of the substrate, so as to improve the product yield β A [implementation method] The following implementation of the creation with the pattern and component symbols The method is explained in more detail, so that those skilled in the art can implement it after studying the specification. Referring to the second figure, a perspective view of the spray slit type substrate cleaning apparatus of the present invention is shown. The present invention relates to a spray type substrate cleaning device comprising an atomizing device 1 having a first fluid chamber, a second fluid chamber 13, a shunt chamber 15, and an atomization chamber The first fluid chamber 11 and the second fluid chamber 13 are spaced apart from each other, and the first fluid chamber 11 and the second fluid chamber 13 are disposed above the atomization chamber 17, so Fluid within the fluid chamber and the second fluid chamber 13 can be passed down into the atomization chamber 17. The first fluid chamber 11 has at least one gas injection portion m, and the gas injection portion 111 can be connected to a gas supply tube (not shown), and the first fluid chamber 11 and 5 have a function between a first flow channel I", wherein the first fluid chamber 11 and the atomization chamber 17 are further provided with at least -1 chamber 115'. The center chamber 115 is in communication with the first flow channel 113. The chamber 115 is configured to supply a gas flow to swirl therein, thereby increasing the pressure and flow rate of the gas flow. The second fluid chamber 13 has at least one liquid injection portion 131, and the liquid injection portion 131 can be connected to a liquid supply tube (not shown). A second flow passage 133 is disposed between the second fluid chamber 13 and the split chamber 15, wherein a plurality of minute split holes are disposed between the split chamber 15 and the atomization chamber 17 (not shown) The size of the holes of the split holes is not limited as long as the size of the water flow after the gas passes through the split holes 151 can be satisfied. The bottom end of the atomization chamber 17 is connected to a discharge passage 19, which The bottom end outlet of the discharge passage 19 It is a discharge port 191. When both the gas and the liquid are input into the first fluid chamber 11 and the second fluid chamber 13 via the gas injection portion 111 and the liquid injection portion 131, the gas passes through the first flow passage 113 and the center chamber. 115 reaches the atomization chamber 丨7, and the liquid passes through the second flow passage 133 and the split chamber 15, and the liquid in the split chamber 15 is split into the plurality of fine water flows through the split holes, and the refined water flow After being impinged and mixed by the gas, a mist state is formed, and finally the atomized two-phase fluid is uniformly sprayed from the discharge port 191 to the substrate via the discharge passage 19, and the present invention transmits the mist and the mist through the atomizing device 1 first. In order to make a completely atomized diminishing body from atomization, the micro-bubble or shock wave is generated on the substrate, and the reading is improved, so that the cleaning efficiency of the substrate is greatly increased. The follow-up process is handled, and the product yield is increased. The above is only a preferred embodiment for the transfer of the original creation. It is not an attempt to make any form of supplements, for example, where the same is true. __British repair ·More, _ includes the threat of protection in this creation. M408119 [Simple description of the diagram] The first figure is a schematic cross-sectional view of a two-fluid nozzle for substrate cleaning according to the prior art. 3D exploded view of the substrate cleaning device of the slit type. [Description of main component symbols] 1 atomizing device 11 first fluid chamber 13 second fluid chamber 15 splitting chamber 17 atomizing chamber 111 gas injection portion 113 in the first flow channel 115 Room 131 liquid injection portion 133 second flow channel 19 discharge channel 191 discharge port 100 first housing portion 110 first channel 111 first injection port 200 second housing portion 210 second channel 211 second injection port 7 M408119 400 dual fluid Discharge portion 212 guide portion

Claims (1)

M408119 六、申請專利範圍: ,一種噴霧狹縫式之基板清洪往 穿今霖㈣罢々免 裝置,其係其包含有一霧化裝 置,務^置之内至少具有-第—流體腔室一第二流體 腔^二流室及-霧化作用室,該第1體腔室與該第二 流體腔痛為分喊置且互不連通,該第—流雜室及第二 流體腔㈣設於該魏翻室之上,轉-流體腔室具有至 少-個亂體注人部’駐少—個氣體私料接設〆氣體供 給官,該第-流體腔室與該霧化作用室之間設置有〆第一流M408119 VI. Scope of Application: A spray slit type substrate clearing to the current Lin (4) annihilation device, which comprises an atomizing device, at least having a - fluid chamber a second fluid chamber, a second flow chamber, and an atomization chamber, wherein the first body chamber and the second fluid chamber are separated from each other and are not connected to each other, and the first flow chamber and the second fluid chamber (4) are disposed at the Above the Wei-turning chamber, the transfer-fluid chamber has at least one chaotic body injection portion, which is located in a small gas-storage unit, and is provided between the first fluid chamber and the atomization chamber. There is a first stream 通道,該第二流體腔室具有至少一個液體注入部,該至少一 個液體庄入部可接5又一液體供給管,該第二流體腔室與該分 流室之間設有一第二流通道,其中該分流室與該霧化作用室 之間設置有複數個分流孔,該霧化作用室之底端則連通於一 排出通道,該排出通道的底端出口係為一噴出口。 2.依據申請專利範圍第1項所述之噴霧狹縫式之基板清洗裝置, 其中該霧化裝置進一步設置有一中置室,該中置室係位於該第 一流體腔室與該霧化作用室之間,且該中置室與該第一流通道 相連通。 9a channel, the second fluid chamber has at least one liquid injection portion, the at least one liquid entrainment portion is connectable to another liquid supply pipe, and a second flow channel is disposed between the second fluid chamber and the diverter chamber, wherein A plurality of diverting holes are disposed between the diverting chamber and the atomizing chamber, and a bottom end of the atomizing chamber is connected to a discharge passage, and a bottom end outlet of the discharge passage is a discharge port. 2. The spray slit type substrate cleaning apparatus according to claim 1, wherein the atomizing device is further provided with a centering chamber located in the first fluid chamber and the atomization chamber And the central chamber is in communication with the first flow channel. 9
TW100202719U 2011-02-14 2011-02-14 Spray-slit type substrate cleaning device TWM408119U (en)

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