200916210 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種基板清洗用雙流體喷嘴，尤其係關於 一種將兩種流體混合及放大之後噴射至基板表面之基板清 洗用雙流體噴嘴。 【先前技術】 通常，用於半導體晶片或TFT-LCD(Thin Film Transist〇r_BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a two-fluid nozzle for cleaning a substrate, and more particularly to a two-fluid nozzle for substrate cleaning which is obtained by mixing and amplifying two fluids and then ejecting it onto the surface of the substrate. [Prior Art] Generally, used for semiconductor wafers or TFT-LCDs (Thin Film Transist〇r_
Liquid Crystal Display，薄膜電晶體液晶顯示器），pDp (Plasma Display Panel，電聚顯示面板）及扯（心价〇Liquid Crystal Display, thin film transistor liquid crystal display), pDp (Plasma Display Panel) and pull (heart price 〇
Luminescence，電致發光）顯示器等平板顯示器（FpD : FiatFlat panel display such as Luminescence (electroluminescence) display (FpD : Fiat
Panel Display)上之基板是需要高精密加工之一種部件在 其製造過程中防止產生不良尤為重要。並且，隨著當今晝 面向大型化發展，在平板顯示器製造製程中被處理之基板 之尺寸亦趨於大型化。為了減少使用此種大面積基板製造 平板顯示器之成本’正在活躍地進行最小化製造過程中之 不良率之研究。 另外，半導體晶片或平板顯示器基板等是通過多種製造 製程製造的’而此種製造製程中表面處理製程是指用清洗 液、姓刻液或顯影液等處理液對基板表面進行處理而清洗 W_ing)、名虫刻（Etching)、顯影（Devei〇ping)或剝離 (StriPPing)基板之製程。即’在該表面處理製程中用該處 理液處理根據傳送機（conveyer)等移送機構以一定速度被 水平移送或以低傾斜角被傾斜移送之基板之上面、下面或 上下兩面而清洗、蝕刻、顯影或剝離基板。並且，經過包 133915.doc 200916210 括表面處理製程之多種製造製程，基板之表面被顆粒 (p_cle)及污染物所污染，目而為了清除此等顆粒及污染 物，在-部分製造製程之前後進行該清洗製程。清洗製程 為用於清潔基板表面之製程，例如由藥液處理製程、沖洗 (rinse)製程以及乾燦製程組成，尤其藥液處理製程是為/了 清除顆粒及污染物而利用去離子水（Dei〇nized 或化 學製劑（Chemical)等清洗液對基板表面進行處理之製程。 並且’在清洗製程中’ ^ 了清除顆粒及污染物而利用清洗 液對基板進行處理時，& 了提高清洗能力，提出了在清洗 液中混合清潔的乾燥空氣（Cleandryair)而生成雙流體，並 將生成之雙流體放大之後以泡沐（bubble)形態衝擊至基板 表面之基板清洗用雙流體喷嘴（以下稱為雙流體噴嘴）。 圖1為先前基板清洗用雙流體喷嘴之剖面圖。 多，、、、圖1可知，先刖基板清洗用雙流體喷嘴包括：第一 通道11 ’ U用於由主體10内部向噴射部14移送清潔的乾燥 空氣；第二通道12,以用於向該第一通道n之乾燥空氣之 移达路徑供給清洗液；移送通道丨3，其形成於該第一通道 11之移送路徑上，且為多次折曲之結構。 藉由該第一通道11移送之清潔的乾燥空氣與藉由該第二 通道12移送之清洗液在主體1()内料合而生成雙流體。並 且，形成於該主體10内部之雙流體沿著移送通道13被移 送，並精由主體10最下端之噴射部14以泡沫形態噴射至基 板S表面。 該移达通道13為多次折曲之結構，此種結構相比直線連 133915.doc 200916210 接，進一步延長了雙流體之移送路徑，從而可穩定雙流體 之壓力及流量而移送雙流體。 然而’先前雙流體喷嘴採取向主體10内部分別供給清洗 液及清潔的乾燥空氣之後簡單混合之方式，從而無法生成 大小均勻之雙流體液滴，因此，降低了清洗效率。尤其， 在移送通道13折曲成直角之部位上由於雙流體之停滞而產 生大量之氣泡’因此雙流體液滴之大小無法充分：被微粒 r-.The substrate on the Panel Display is a component that requires high precision processing. It is especially important to prevent defects during its manufacturing process. Moreover, as the scale of today's large-scale development has progressed, the size of substrates to be processed in the flat panel display manufacturing process has also become larger. In order to reduce the cost of manufacturing flat panel displays using such large-area substrates, research is being actively conducted to minimize the defect rate in the manufacturing process. In addition, a semiconductor wafer or a flat panel display substrate or the like is manufactured by a plurality of manufacturing processes. The surface treatment process in the manufacturing process refers to cleaning the surface of the substrate with a treatment liquid such as a cleaning solution, a surname solution or a developer solution, and cleaning the W_ing) , the process of Etching, Devei〇ping or StriPPing substrates. That is, in the surface treatment process, the treatment liquid is treated by a transfer mechanism such as a conveyor, which is horizontally transferred at a constant speed, or is cleaned and etched by the upper surface, the lower surface, or the upper and lower surfaces of the substrate which is obliquely transferred at a low inclination angle. Develop or strip the substrate. Moreover, after various manufacturing processes including the surface treatment process of the package 133915.doc 200916210, the surface of the substrate is contaminated by particles (p_cle) and contaminants, in order to remove such particles and contaminants, before and after the partial manufacturing process. The cleaning process. The cleaning process is a process for cleaning the surface of the substrate, for example, a chemical treatment process, a rinse process, and a dry process, in particular, the chemical treatment process uses deionized water for removing particles and contaminants (Dei 〇nized or chemical (Chemical) cleaning solution to the surface of the substrate. And 'cleaning process' ^ remove particles and contaminants and use the cleaning solution to treat the substrate, & improve the cleaning ability, A two-fluid nozzle for cleaning a substrate (hereinafter referred to as a double) in which a cleaned air (Cleandryair) is mixed in a cleaning liquid to generate a two-fluid, and the generated two-fluid is amplified and then impinged on the surface of the substrate in a bubble form (hereinafter referred to as a double Fig. 1 is a cross-sectional view of a two-fluid nozzle for cleaning a substrate. In addition, FIG. 1 shows that the two-fluid nozzle for cleaning the substrate includes: the first passage 11' U is used for the inside of the main body 10 The spraying portion 14 transfers the clean dry air; the second passage 12 is for supplying the cleaning liquid to the conveying path of the drying air of the first passage n; a channel 丨3 formed on the transfer path of the first channel 11 and having a multi-folded structure. The cleaned dry air transferred by the first channel 11 and the cleaning by the second channel 12 The liquid is mixed in the main body 1 () to generate a two-fluid. Further, the two fluids formed inside the main body 10 are transferred along the transfer passage 13, and are ejected to the substrate in the form of foam by the lowermost portion of the ejection portion 14 of the main body 10. S surface. The transfer channel 13 is a multi-bending structure. This structure is connected to the straight line 133915.doc 200916210, which further extends the two-fluid transfer path, thereby stabilizing the pressure and flow of the two fluids and transferring the double Fluid. However, the previous two-fluid nozzle adopts a simple mixing method of supplying the cleaning liquid and the clean dry air to the inside of the main body 10, so that it is impossible to generate a two-fluid droplet of uniform size, thereby reducing the cleaning efficiency. In particular, in the transfer channel At the right angle of the 13-fold bend, a large number of bubbles are generated due to the stagnation of the two fluids. Therefore, the size of the two-fluid droplets cannot be sufficient: by the particles r-.
化’從而先前雙流體噴嘴不足以用於微細之清洗製程中。 【發明内容】 本發明是為了解決上述問題而提出的，其目的在於提供 一種可生成超微粒態之大小均勻之雙流體液滴而噴射該雙 流體液滴之.基板清洗用雙流體喷嘴。 收谷部及第二收 用於移送收容於 為了實現上述目的，本發明包括：第— 容部’以用於分別收容互不相同之流體； 該第-收容部之卜流體之[通道，在其端部形成有喷 射該第一流體之第一噴射口；用於移送收容於該第二收容 部之第二流體之第二通道，在其端部形成有噴射該第二流 體之第二喷射u 雙流體排出部，以用於排出由該第一喷 射口及第二噴射口喷射之流體相混合而生成之雙流體；以 及形成於該第二嘴射口之前端部之引導部，以用於將由該 第二噴射Π噴射之該第二流體之噴射方向引導至該第一喷 如上所述，根據本發明破碎成超微粒態液滴之清洗液及 清潔的乾燥空氣混合而生成微細且大小均勻之雙流體，從 133915.doc 200916210 而可顯著提高基板清洗效率。並且，本發明之雙流體喷嘴 為内部不會產生氣泡之結構，從而穩定了向基板噴射雙流 體之壓力及流量，因此提高了喷射均勻度。 【實施方式】 以下，參照附圖來詳細說明本發明所提供之基板清洗用 雙流體噴嘴之較佳實施例。 圖2是根據本發明之實施例所提供之基板清洗用雙流體 喷嘴之剖面圖及局部放大剖面圖。 如圖2所示，本發明之實施例所提供之基板清洗用雙流 體喷嘴包括：第一收容部1〇〇及第二收容部2〇〇，以用於分 別收容互不相同之流體；第一通道11()，其具有喷射第一 流體之第一噴射口 111;第二通道21〇,其具有喷射第二流 體之第二喷射口 211 ’以及雙流體排出部4〇〇，以用於噴射 第一流體及第二流體混合生成之雙流體。 詳細說明上述結構如下。 該第一收容部100與第二收容部200形成於雙流體噴嘴内 部’且分別收容自外部供給之互不相同之流體，並且緩衡 收容於該各收容部之流體，從而穩定藉由第一喷射口 1 i i 及第二噴射口 211噴射之流體之喷射壓力。 該第一通道110為移送收容於第一收容部1〇〇之第一流體 之通道，其端部形成有第一噴射口 111，而被移送之第一 流體藉由該第一噴射口丨丨丨喷射。 該第一通道210為移送收容於第二收容部2〇〇之第二流體 之通C其缟。卩形成有第二噴射口 211，而被移送之第二 133915.doc 200916210 /;IL體藉由該第二噴射口 2 1 1喷射。在ifc匕，收容於該第-收 令。卩100之第—流體較佳為清潔的乾燥空氣，收容於苐二 收容部200之第二流體較佳為清洗液。 刀別自第一噴射口 U1及第二喷射口 211噴射之第一流體 及第一流體在該雙流體排出部400混合而生成雙流體，同 時該雙流體排向基板表面。 引導部212形成於第二噴射口 211之前端，並將由第二噴 射口 211噴射之第二流體之噴射方向引導至第一喷射口 ^ Ή 由》亥第喷射口 111喷射之第一流體之喷射方向朝下 ^而由第一喷射口 211噴射之第二流體之噴射方向朝該 第喷射口 111之側面。由此，根據引導部212將第二流體 喷射之方向與第一流體喷射之方向相統一。即，自該第二 噴射口 211噴射之第二流體沿著引導部212之傾斜面移動， 同時與自第一喷射口丨i丨喷射之第一流體混合之後生成雙 ⑺L體而生成之雙流體向由第一喷射口 1 1 1喷射之第一流 體之喷射方向噴射。 另外，自該第二喷射口 211喷射之第二流體衝擊至由該 第一喷射口 111延伸之側面而擴散成微細粒子。在此，兩 種流體混合成雙流體之過程如下。首先自第二喷射口 2i j 喷射之第二流體沿著引導部212之傾斜面移動，之後衝擊 至由第一噴射口丨丨丨延伸之側面而破碎成微細粒子，並在 雙流體排出部400内部擴散，由此，被微細粒子化而擴散 之第二流體與第一流體均勻混合而生成雙流體，並藉由雙 流體排出部400排出上述生成之雙流體。 133915.doc 200916210 該引導部212之傾斜面與第一喰鉍 ^ ^ 贸射口 111形成之角度❹較 佳為約1〇。至8〇。。傾斜面之角度M、於1〇。或超過80。時， 自第-喷射π 211喷射之流體不會沿著引導部212之傾斜面 移送而噴射至雙流體排出部4〇〇内部空間，從而引發濺水 現象由於此種錢水現象在生成雙流體時，會導致均句性 降低之問題。 並且，該第一通道11〇具有第一緩衝部ιΐ2，該第一緩衝 部112為朝形成有第一噴射口 1U之端部連續折曲之結構。 相比於第一通道110直線連接之情況，該第一緩衝部112延 長了流體之移送路徑，因此穩定了流體之壓力，從而可極 大提高雙流體排出部400之喷射均勻度。 ;該第喷射口 111並非形成於第一通道110之末端而 疋連接於通道中間，因而在該第一通道110之末端形成第 二緩衝部113。利用此種第二緩衝部113最大地緩衝了藉由 第一通道110移動之流體並進行噴射，從而可提高噴射均 勻度。 圖3是對應該圖2之局部放大剖面圖之另一實施例之局部 放大剖面圖。在此，與前面之附圖相同之符號指具有相同 功能之相同部件。 如圖3所示’本發明之另一實施例所提供之基板清洗用 雙流體噴嘴類似於圖2之結構，但是引導部3 12呈曲面狀。 由於此種形態’自第二喷射口 2 11噴射之第二流體沿著呈 平緩曲面狀之引導部312移動，從而提高了形成雙流體之 效率’並防止了濺水現象之發生。如參照圖2所述，本發 133915.doc 200916210 明之另一實施例所提供之基板清洗用雙流體喷嘴，自第二 喷射口 211喷射之苐二流體與自第一喷射口 111噴射之第— 流體混合而生成雙流體，並且生成之雙流體向自第一噴射 口 111噴射之第一流體之喷射方向噴射。 以上，依據較佳實施例對本發明進行了說明，但是本發 明之技術思想並不限定於此，熟習此項技術者在申請專利 範圍所記載之範圍内可以對其進行變形或變更實施，而此 種變形或變更皆屬於申請專利範圍之範圍。 【圖式簡單說明】 圖1為先前基板清洗用雙流體喷嘴之剖面圖； 圖2為根據本發明之實施例所提供之基板清洗用雙流體 喷嘴之剖面圖及局部放大剖面圖； 圖3為對應該圖2之局部放大剖面圖之另一實施例之局部 放大剖面圖。 主要符號說明：100為第一收容部，11〇為第一通道， ⑴為第-喷射口，112為第—緩衝部，113為第二緩衝 部’200為第二收容部，210為第二通道，211為第二喷射 口，212、312為引導部，彻為雙流體排出部。 【主要元件符號說明】 10 主體 11 第一通道 12 第二通道 13 移送通道 14 噴射部 133915.doc 200916210 100 第一收容部 110 第一通道 111 第一喷射口 112 第一緩衝部 113 第二緩衝部 200 第二收容部 210 第二通道 211 第二噴射口 212 、 312 引導部 400 雙流體排出部 S 基板 Θ 角度 133915.doc -12-Thus the previous two-fluid nozzle was not sufficient for use in a fine cleaning process. SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the invention is to provide a two-fluid nozzle for substrate cleaning which can generate a two-fluid droplet having a uniform particle size and ejecting the two-fluid droplet. The receiving portion and the second receiving portion are used for transferring the container. In order to achieve the above object, the present invention includes: a first portion for respectively receiving fluids different from each other; and a channel for the first receiving portion a first injection port for injecting the first fluid, a second passage for transferring the second fluid contained in the second receiving portion, and a second injection for injecting the second fluid at an end portion thereof a two-fluid discharge portion for discharging a two-fluid generated by mixing the fluids injected by the first injection port and the second injection port; and a guide portion formed at an end portion of the second nozzle opening for use Directing the ejection direction of the second fluid ejected by the second ejection jet to the first ejection as described above, the cleaning liquid broken into ultra-fine particle droplets and the clean dry air according to the present invention are mixed to generate a fine and large size Uniform two-fluid, from 133915.doc 200916210 can significantly improve substrate cleaning efficiency. Further, the two-fluid nozzle of the present invention has a structure in which no bubbles are generated inside, thereby stabilizing the pressure and flow rate of ejecting the double fluid to the substrate, thereby improving the uniformity of ejection. [Embodiment] Hereinafter, preferred embodiments of the two-fluid nozzle for cleaning a substrate provided by the present invention will be described in detail with reference to the accompanying drawings. Fig. 2 is a cross-sectional view and a partially enlarged cross-sectional view showing a two-fluid nozzle for cleaning a substrate according to an embodiment of the present invention. As shown in FIG. 2, the two-fluid nozzle for cleaning a substrate according to an embodiment of the present invention includes: a first receiving portion 1〇〇 and a second receiving portion 2〇〇 for respectively receiving fluids different from each other; a passage 11() having a first injection port 111 for injecting a first fluid; a second passage 21'' having a second injection port 211' for injecting a second fluid and a dual fluid discharge portion 4A for The two fluids generated by mixing the first fluid and the second fluid are sprayed. The above structure will be described in detail as follows. The first accommodating portion 100 and the second accommodating portion 200 are formed inside the two-fluid nozzles, and respectively accommodate fluids different from each other supplied from the outside, and the fluids accommodated in the accommodating portions are balanced, thereby being stabilized by the first The injection pressure of the fluid injected from the injection port 1 ii and the second injection port 211. The first passage 110 is a passage for transferring the first fluid contained in the first receiving portion 1 , and the end portion is formed with a first injection port 111 , and the first fluid transferred is used by the first injection port.丨 Jetting. The first passage 210 is a passage C for transferring the second fluid accommodated in the second housing portion 2〇〇. The second injection port 211 is formed, and the second 133915.doc 200916210 / is transferred, and the IL body is ejected by the second injection port 2 1 1 . In ifc匕, it is contained in the first-receipt. Preferably, the fluid is preferably clean dry air, and the second fluid contained in the second receiving portion 200 is preferably a cleaning fluid. The first fluid injected from the first injection port U1 and the second injection port 211 and the first fluid are mixed in the two-fluid discharge portion 400 to generate a two-fluid, and the two fluids are discharged to the surface of the substrate. The guiding portion 212 is formed at the front end of the second ejection opening 211, and guides the ejection direction of the second fluid ejected by the second ejection opening 211 to the ejection of the first fluid ejected by the first ejection opening 111 The direction in which the second fluid is ejected by the first injection port 211 is directed downward toward the side of the first injection port 111. Thereby, the direction in which the second fluid is ejected is unified with the direction in which the first fluid is ejected according to the guiding portion 212. That is, the second fluid injected from the second injection port 211 moves along the inclined surface of the guiding portion 212 while being mixed with the first fluid injected from the first ejection port 生成i丨 to generate a double (7) L body to generate a two-fluid The injection is performed in the injection direction of the first fluid injected by the first injection port 111. Further, the second fluid injected from the second injection port 211 impinges on the side surface extending from the first injection port 111 to be diffused into fine particles. Here, the process of mixing the two fluids into a two-fluid is as follows. First, the second fluid ejected from the second ejection opening 2i j moves along the inclined surface of the guiding portion 212, then impacts to the side surface extended by the first ejection opening, and is broken into fine particles, and is in the two-fluid discharge portion 400. The inside is diffused, whereby the second fluid which is finely divided and diffused is uniformly mixed with the first fluid to generate a two-fluid, and the generated two-fluid is discharged by the two-fluid discharge unit 400. 133915.doc 200916210 The angle ❹ of the inclined surface of the guiding portion 212 and the first 贸 ^ ^ 射射口 111 is preferably about 1 〇. To 8 baht. . The angle M of the inclined surface is 1〇. Or more than 80. At this time, the fluid ejected from the first injection π 211 is not transferred along the inclined surface of the guide portion 212 and is ejected to the internal space of the two-fluid discharge portion 4, thereby causing splashing water due to the phenomenon of water vapor generation in the generation of the two-fluid phenomenon. At the time, it will lead to a problem of reduced uniformity. Further, the first passage 11A has a first buffer portion ι2, and the first buffer portion 112 is configured to be continuously bent toward an end portion where the first injection port 1U is formed. The first buffer portion 112 lengthens the fluid transfer path as compared with the case where the first passage 110 is linearly connected, thereby stabilizing the pressure of the fluid, so that the spray uniformity of the two-fluid discharge portion 400 can be greatly improved. The first injection port 111 is not formed at the end of the first passage 110 but is connected to the middle of the passage, so that the second buffer portion 113 is formed at the end of the first passage 110. With this second buffer portion 113, the fluid moved by the first passage 110 is maximally buffered and ejected, whereby the injection uniformity can be improved. Fig. 3 is a partially enlarged cross-sectional view showing another embodiment of a partially enlarged sectional view of Fig. 2; Here, the same reference numerals as in the previous drawings refer to the same components having the same function. As shown in Fig. 3, the two-fluid nozzle for substrate cleaning provided by another embodiment of the present invention is similar to the structure of Fig. 2, but the guide portion 312 has a curved shape. Since the second fluid ejected from the second ejection opening 211 moves along the guide portion 312 having a gentle curved surface, the efficiency of forming the two-fluid is improved and the occurrence of splashing is prevented. As described with reference to FIG. 2, the two-fluid nozzle for substrate cleaning provided by another embodiment of the present invention is disclosed in the above-mentioned 133915.doc 200916210, the second fluid injected from the second injection port 211 and the first sprayed from the first injection port 111. The fluid mixes to generate a two-fluid, and the generated two-fluid is injected toward the injection direction of the first fluid injected from the first injection port 111. The present invention has been described above based on the preferred embodiments, but the technical idea of the present invention is not limited thereto, and those skilled in the art can modify or modify the present invention within the scope of the claims. Such variations or modifications are within the scope of the claimed patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view of a two-fluid nozzle for substrate cleaning; FIG. 2 is a cross-sectional view and a partially enlarged cross-sectional view of a two-fluid nozzle for substrate cleaning according to an embodiment of the present invention; A partially enlarged cross-sectional view of another embodiment of a partially enlarged cross-sectional view of Fig. 2. The main symbols are as follows: 100 is the first receiving portion, 11 is the first passage, (1) is the first injection port, 112 is the first buffer portion, 113 is the second buffer portion '200 is the second receiving portion, and 210 is the second. The passage, 211 is a second injection port, and 212, 312 are guide portions, which are completely two-fluid discharge portions. [Main component symbol description] 10 Main body 11 First passage 12 Second passage 13 Transfer passage 14 Injection portion 133915.doc 200916210 100 First housing portion 110 First passage 111 First injection port 112 First buffer portion 113 Second buffer portion 200 second receiving portion 210 second passage 211 second injection port 212, 312 guide portion 400 dual fluid discharge portion S substrate 角度 angle 133915.doc -12-