M406801 五、新型說明： 【新型所屬之技術領域】 本創作是係關於一種積體電路元件測試裝置，尤护 種應用於所述測試裝置中’提供積體電路元件測試積 ，電路元件底部裸墊（e_pad ; exposed pad)電氣訊號量測 需求之裸墊測試模組。 '、 【先前技術】 如高功率積體電路元件應用於電子裝置時，於工作期 間’高功率積體電路元件會產生高溫，因而需要有良好的 散熱方式，避免高功率積體電路元件因高溫而故障或燒燬 ’以維持高功率積體電路元件正常工作，因此，高功率積 ，電路元件底部設計有金屬材質的裸墊（e_pad)，用以作為 政…、之用，並可利用所述的裸*(e_pad)作為接地或連接電 源訊號使用。於高功率積體電路元件測試時，大多是以簡 單的機構或接線方式接觸裸墊（e_pad)進行測試。 般而言，積體電路元件製造商是將所述裸墊（e_pad) 視為一般訊號的腳位，所述裸墊（e_pad)除上述散熱、接地 或連接電源訊號等功能外，近年來，基於設計者的需求而 進一步設計有其他不同的功能，因此，於積體電路元件進 行測式時’所述裸塾（e_pad)處有極小的電氣訊號量測需求 ’於測試時’亦利用前述既有的簡單機構或接線方式進行 測試。 惟則述積體電路元件之裸墊測試，因存在測試的誤差 過大，以致無法得知正確的測試結果，故此，對於積體電 3 M406801 路元件裸墊測試機構實有進—步改良之必要。 【新型内容】 本創作之主要目的在於提供一種積體電路元件之裸塾 測試模組，希藉此設計改善現有積體電路㈣裸塾測試方 式誤差大之缺陷。 為達成前揭目的，本創作所提出積體電路元件之裸塾 測試模組係包含： -絕緣基座，其具有分位於相對兩側的[表面以及 第二表面’所述絕緣基座中設有至少一穿孔，所述穿孔自 第一表面貫通至第二表面； 至少-電連接構件，所述電連接構件包含有分位於相 對兩端的第-接觸端以及第二接觸端，且電連接構件係裝 設於絕緣基座相應的穿?L，第一接觸端凸出第一 ： 第一接觸端凸出第二表面外； 至少-導電構件，係設於絕緣基座的第二表面，並盘 相應的電連接構件的第二接觸端電性連接；以及 /、 -電連接組件’係包含—絕緣載體以及設於絕緣 上之至少-連接端子’並以連接料連接相應的導電構件 藉由前揭積體電路元件之裸墊測試模組之設計， 可安裂於㈣料元件職裝置㈣試單元巾，裸^ 模組的電連接構件位於測試單元的複數電接觸端 Ή 使電連接構件經由導電構件及電連接組件連接測試袭^ 測試載板，如此於待測積體電路元件置入測試單元=、 其每-引腳與相應的電接觸端子電連接，’使 电塔元件 4 jJ4〇68〇1 底面的裸墊與該裸墊測試模組中相應的電連接構件電性接 觸，如此，於測試裝置經由積體電路元件的各引腳進行檢 測時，也能一併經由裸墊測試模組對裸墊（e_pad)進行一般 或微小的電氣訊號的量測，故能達到較佳的量測精度，提 高檢測的正確性。 【實施方式】M406801 V. New description: [New technical field] This creation is about a kind of integrated circuit component testing device. In particular, it is applied to the test device to provide the integrated circuit component test product, and the bottom of the circuit component is bare. (e_pad; exposed pad) The bare pad test module for electrical signal measurement requirements. ', [Prior Art] When high-power integrated circuit components are used in electronic devices, high-power integrated circuit components generate high temperatures during operation, so good heat dissipation is required to avoid high-power integrated circuit components due to high temperatures. And the fault or burnout 'to maintain the high-power integrated circuit components work normally, therefore, the high power product, the bottom of the circuit component is designed with a metal material bare pad (e_pad) for use as a government, and can be utilized The bare* (e_pad) is used as a ground or connected power signal. When testing high-power integrated circuit components, most of them are tested with a simple mechanism or wiring contact bare pad (e_pad). In general, an integrated circuit component manufacturer considers the bare pad (e_pad) as a pin of a general signal. In addition to the functions of heat dissipation, grounding, or connection of power signals, the bare pad (e_pad) has been in recent years. Further different functions are designed based on the designer's needs. Therefore, when the integrated circuit component is tested, there is a minimum electrical signal measurement requirement at the bare 塾 (e_pad). Test with existing simple mechanisms or wiring methods. However, when the bare pad test of the integrated circuit component is performed, the error of the test is too large, so that the correct test result cannot be known. Therefore, it is necessary for the integrated test of the integrated circuit 3 M406801 component bare pad test mechanism. . [New content] The main purpose of this creation is to provide a bare test module for integrated circuit components, and to design and improve the defects of the existing integrated circuit (4) naked test method. In order to achieve the foregoing, the bare die test module of the integrated circuit component proposed by the present invention comprises: an insulating base having a [surface and a second surface] disposed on opposite sides of the insulating base. Having at least one perforation, the perforation penetrating from the first surface to the second surface; at least - an electrical connection member, the electrical connection member comprising a first contact end and a second contact end located at opposite ends, and the electrical connection member Mounted on the corresponding base of the insulating base, the first contact end protrudes first: the first contact end protrudes from the second surface; at least the conductive member is disposed on the second surface of the insulating base, and The second contact end of the corresponding electrical connection member of the disk is electrically connected; and the electrical connection assembly comprises: an insulating carrier and at least a connection terminal disposed on the insulation and connecting the corresponding conductive member with the connecting material by The design of the bare pad test module of the pre-exposed integrated circuit component can be cracked in the (four) material component device (4) test unit towel, and the electrical connection member of the bare module is located at the plurality of electrical contact ends of the test unit. through The conductive member and the electrical connection component are connected to the test test board, so that the integrated circuit component to be tested is placed in the test unit=, and each pin is electrically connected to the corresponding electrical contact terminal, 'making the tower element 4 jJ4〇 The bare pad on the bottom surface of the 68〇1 is in electrical contact with the corresponding electrical connection member of the bare pad test module, so that when the test device is tested via the pins of the integrated circuit component, it can also be tested via the bare pad. The module performs general or small electrical signal measurement on the bare pad (e_pad), so that the measurement accuracy can be achieved and the detection accuracy is improved. [Embodiment]
如圖1及圖2所不，是揭示本創作積體電路元件之裸 蛰測試模組1係包含一絕緣基座彳〇、至少一電連接構件 2〇、至少一導電構件30以及一電連接組件4〇 ,其中： 所述絕緣基座1 〇係一絕緣材質製成的構件其具有 /第一表面11以及第二表面12，第一表面”與第二表 面1 2分位於相對的兩側面，所述絕緣基座1 〇尚設有複數 個固定孔1 3，以所述固定孔，3提供螺絲穿設其中，用以 固定於積體電路元件測試裝置中，所述絕緣基座^ 〇中設 有至少一穿孔14’所述穿孔14自第一表面11貫通至第 二表面1 2 ’於本較佳實施例是揭示絕緣基座1 〇中設有二 倜穿孔14 ’絕緣基座1 〇之第一表面I]形成一凸部1 5 , 所述穿孔1 4設於凸部1 5上。 所述電連接構件20可為一支或複數支，所述電連接 構件20的數量是依積體電路元件之裸墊（e_pad)電氣訊號 量測的需要而設定，其中，當應用對裸墊（e-pad)進行一般 的電氣訊號量測時’可使用單一電連接構件2〇，當對裸墊 (e-pad)進行微小電氣訊號量測時，則使用二支或二支以上 的電連接構件20，於本較佳實施例是揭示使用二電連接構 件20分別安敦於絕緣基座1 〇之二個穿孔1 *中，所述電 5 M406801 連接構件2〇可具有伸縮性的探針（POGO PIN)或其他具 有電乳連接功能的構件’所述電連接構件2〇具有一第一 接觸端21以及-第二接觸端22，第一接觸端與第二 接觸端22分位於相對的兩端，所述電連接構件2〇安裝於 絕緣基座1〇的穿孔14中，且第一接觸端21凸出絕緣基 座的第-表面U外’第二接觸端22凸出絕緣基座1〇 的第二表面12外。As shown in FIG. 1 and FIG. 2, the bare test module 1 for revealing the integrated circuit component includes an insulating base, at least one electrical connecting member 2, at least one conductive member 30, and an electrical connection. The component 4A, wherein: the insulating base 1 is made of an insulating material having a / first surface 11 and a second surface 12, the first surface" and the second surface 12 are located on opposite sides The insulating base 1 is further provided with a plurality of fixing holes 13 3, and the fixing holes 3 are provided with screws for fixing in the integrated circuit component testing device, the insulating base ^ The through hole 14 is provided with at least one through hole 14'. The through hole 14 extends from the first surface 11 to the second surface 1 2 '. In the preferred embodiment, the insulating base 1 is provided with a second through hole 14 'insulating base 1 The first surface I] forms a convex portion 15 , and the through hole 14 is disposed on the convex portion 15. The electrical connecting member 20 may be one or a plurality of branches, and the number of the electrical connecting members 20 is Set according to the needs of the bare pad (e_pad) electrical signal measurement of the integrated circuit component, wherein, when applied When a bare pad (e-pad) is used for general electrical signal measurement, a single electrical connection member can be used. When a small electrical signal measurement is performed on an e-pad, two or more are used. The electrical connecting member 20, in the preferred embodiment, discloses that the two electrical connecting members 20 are respectively disposed in the two through holes 1* of the insulating base 1 , and the electric 5 M406801 connecting member 2 can be stretchable. a probe (POGO PIN) or other member having an electric milk connection function, the electrical connection member 2 has a first contact end 21 and a second contact end 22, the first contact end and the second contact end 22 being located The opposite ends of the electrical connection member 2 are mounted in the through hole 14 of the insulating base 1 , and the first contact end 21 protrudes from the first surface U of the insulating base. The second contact end 22 protrudes from the insulation. The second surface 12 of the base 1 is outside.
所述導電構件30可為—個或複數個且相應於電連接 構件20的數f ’導電構件30是安裝於絕緣基座10的第 二表面12上，當導電構件3〇為複數個時，該複數個導電 構件30是間隔排列於絕緣基座10的第二表面12上，並 與相應的電連接構彳2Q電性連接，於本較佳實施例中， 所述導電構件3G巾設有組接孔31，並以組接孔31提供 電連接構件20的第二接觸端22插入其中。 所述電連接組件40係包含一絕緣载體4〇以及至少一 連接端子42 ’所述連接端子42設於絕緣載體4〇中，於 本較佳實施中’電連接組件4〇包含有複數連接端子42, 所述複數連接端子42間隔排列於絕緣載體4〇中，並以連 接端子42連接相應的導電構件3〇。 本創作裸墊測試模組彳應用於積體電路元件的測試裝 置2時，如圖3至圖4所示，是以其絕緣基座之第一 表面11朝上方式組設於測試裝置2上表面，並使裸墊測 試模組1的導電構件30位於測試單元2a的複數電接觸端 子2b之間，裸墊測試模組1的電連接組件4〇之連接端子 42與測试裝置2之測試載板2c中相應的電連接端子電性 6 M406801 連接。 如圖4以及圖5〜7所干，/ 進竹積體電路元件3測試時 ’係令待測積體電路元件3以远袖 ύ以棵墊3b(e-pad)朝下方式置 於測試裝置2的測試單元2a 士 , 2a中，並使待測積體電路元件3The conductive member 30 may be one or plural and the number f 'the conductive member 30 corresponding to the electrical connection member 20 is mounted on the second surface 12 of the insulating base 10 when the conductive member 3 is plural. The plurality of conductive members 30 are arranged on the second surface 12 of the insulating base 10 and electrically connected to the corresponding electrical connection structure 2Q. In the preferred embodiment, the conductive member 3G is provided. The hole 31 is assembled and the second contact end 22 of the electrical connection member 20 is provided with the assembly hole 31 inserted therein. The electrical connection assembly 40 includes an insulating carrier 4 〇 and at least one connection terminal 42 ′. The connection terminal 42 is disposed in the insulating carrier 4 ,. In the preferred embodiment, the electrical connection component 4 〇 includes multiple connections. The terminal 42, the plurality of connection terminals 42 are spaced apart from each other in the insulating carrier 4, and the corresponding conductive members 3 are connected by the connection terminals 42. When the original bare pad test module is applied to the test device 2 of the integrated circuit component, as shown in FIG. 3 to FIG. 4, the first surface 11 of the insulating base is assembled on the test device 2 in an upward manner. Surface, and the conductive member 30 of the bare pad test module 1 is located between the plurality of electrical contact terminals 2b of the test unit 2a, the connection terminal 42 of the electrical connection assembly 4 of the bare pad test module 1 and the test device 2 The corresponding electrical connection terminals in the carrier 2c are electrically connected 6 M406801. As shown in Fig. 4 and Figs. 5 to 7, when the test is performed on the circuit element 3 of the bamboo integrated circuit, the circuit component 3 to be tested is placed in the test with the long sleeve and the pad 3b (e-pad) facing downward. The test unit 2a of the device 2, 2a, and the integrated circuit component 3 to be tested
周邊的引腳3a分別與測試星 α ^ L 4早几2a相應的電接觸端子2b 電性接觸，積體電路元件3卮而认 > 袖 展面的稞墊3b且與該裸墊測 試模組1中相應的電連接欉杜 褥件2〇之第一接觸端21電性接 觸’之後，由測試裝置2公E,丨彡- 刀別經由該積體電路元件3的各 引腳3a進行檢測’以判斷積體電路元件3的功能是否符 合’同時另通過電連接構件2〇電性接觸裸塾3b(e.pad)進 行一般或微小的電氣訊號的量測。 以上所述僅是本創作的較佳實施例而已，並非對本創 作有任何形式上的限制，雖然本創作已以較佳實施例揭露 如上，然而並非用以限定本創作’任何所屬技術領域中具 有通常知識者，在不脫離本創作技術方案的範圍内，當可 利用上述揭示的技術内容做出些許更動或修飾等同變^的 等效實施例’但凡是未脫離本創作技術方案的内容，依據 本創作的技術實質對以上實施例所做的任何簡單修改、等 同變化與修飾’均仍屬於本創作技術方案的範圍内。 【圖式簡單說明】 圖1是本創作積體電路元件之裸墊測試模組之一較 實施例的立體分解示意圖。 圖2是圖1所示積體電路元件之裸塾測試模細較 施例組合後的立體示意圖。 圖3是圖i所示積體電路元件之裸塾測試模兔較佳實 7 M406801 施例與測試裝置的立體分解示意圖β 圖4是圖1所示積體電路元件之裸墊測試模組較佳實 施例組設於測試裝置中提供待測積體電路元件置放其上的 立體示意圖。 ^ 圖5是圖！所示積體電路元件之裸㈣ 施例組設於測試裝置中的俯視平面示意圖。 圖6是圖1所示積體電路 70件之稞墊測試模組較佳眚 施例組設於測試裝置中的側視剖面示意圖。 貫The peripheral lead 3a is electrically contacted with the electrical contact terminal 2b corresponding to the test star α ^ L 4 by 2a, respectively, and the integrated circuit component 3 卮 & & 袖 袖 袖 袖 袖 袖 袖 袖 袖 袖 袖 袖 袖 袖After the first contact end 21 of the corresponding electrical connection port 2 is electrically contacted, the test device 2 is connected to the pin 3a of the integrated circuit component 3 by the test device 2 The detection 'to determine whether the function of the integrated circuit component 3 is in conformity' is also measured by the electrical connection member 2 〇 electrically contacting the bare 塾 3b (e.pad) for measurement of a general or minute electrical signal. The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way. Although the present invention has been disclosed above in the preferred embodiment, it is not intended to limit the present invention. In general, the equivalents of the above-disclosed technical contents may be used to make some modifications or modifications to the equivalent embodiments of the present invention without any departure from the technical solutions of the present invention. Any simple modifications, equivalent changes, and modifications made to the above embodiments of the technical spirit of the present invention are still within the scope of the present technical solution. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective exploded view showing one of the bare pad test modules of the integrated circuit component of the present invention. Fig. 2 is a perspective view showing the combination of the bare test pattern of the integrated circuit component shown in Fig. 1 in comparison with the embodiment. FIG. 3 is a perspective exploded view of the naked die test die of the integrated circuit component shown in FIG. 7 and a test device. FIG. 4 is a comparison of the bare pad test module of the integrated circuit component shown in FIG. A preferred embodiment set is provided in the test device to provide a schematic view of the integrated circuit component to be tested. ^ Figure 5 is the picture! The bare (four) embodiment of the integrated circuit components shown is a top plan view of the test device. Fig. 6 is a side cross-sectional view showing the preferred embodiment of the mattress test module of the integrated circuit of Fig. 1 assembled in the test apparatus. Through
圖7是圖1 2 3 4 5 6圈圍處的局部放大示意圖。 【主要元件符號說明】 1裸墊測試模組 2a測試單元 2c測試載板 2測試裝置 2b電接觸端子 3a引腳 3積體電路元件_ 3b裸墊 1 1第一表面 1 3固定孔 1 5凸部 21第一接觸端 31組接孔 41絕緣載體Fig. 7 is a partially enlarged schematic view showing the periphery of Fig. 1 2 3 4 5 6 circle. [Main component symbol description] 1 bare pad test module 2a test unit 2c test carrier 2 test device 2b electrical contact terminal 3a pin 3 integrated circuit component _ 3b bare pad 1 1 first surface 1 3 fixed hole 1 5 convex Portion 21 first contact end 31 assembly hole 41 insulation carrier
8 1 0絕緣基座 2 12第二表面 3 14穿孔 4 20電連接構件 5 22第二接觸端 6 30導電構件 40電連接組件 42連接端子8 1 0 Insulation base 2 12 Second surface 3 14 Perforation 4 20 Electrical connection member 5 22 Second contact end 6 30 Conductive member 40 Electrical connection assembly 42 Connection terminal