CN215813112U - Aging device for chip resistor - Google Patents
Aging device for chip resistor Download PDFInfo
- Publication number
- CN215813112U CN215813112U CN202122089546.7U CN202122089546U CN215813112U CN 215813112 U CN215813112 U CN 215813112U CN 202122089546 U CN202122089546 U CN 202122089546U CN 215813112 U CN215813112 U CN 215813112U
- Authority
- CN
- China
- Prior art keywords
- probe
- circuit board
- fixing plate
- chip resistor
- aging device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model relates to the technical field of resistor aging, and discloses an aging device for a chip resistor, which comprises a test seat, a lower circuit board, a probe fixing plate and an upper circuit board.
Description
Technical Field
The utility model relates to the technical field of resistor aging, in particular to an aging device for a chip resistor.
Background
In the field of electronic circuits, resistors are often used to reduce voltage, distribute voltage, and limit current. The resistance may be classified into a fixed resistor, a variable resistor, and a sensitive resistor according to their structures and functions. The fixed resistors may be further classified into carbon film resistors, synthetic carbon film resistors, pyrolytic carbon film resistors, metal oxide film resistors, chemical deposition film resistors, metal nitride film resistors, and bulk metal film resistors according to the manufacturing material.
The resistor is subjected to a series of electrical tests before shipment or use to determine if the resistor is a qualified product. In the requirement of high stability resistor, the resistor needs to be power-on aged at rated power, and the aging time is generally 48 hours and 96 hours.
When the chip in the fixed resistor is aged in small batches, the chip resistor product has small volume and small electrode contact area, so that certain difficulty is caused when the chip resistor is electrically connected.
SUMMERY OF THE UTILITY MODEL
In view of the defects of the background art, the utility model provides an aging device for a chip resistor, and aims to solve the technical problem that certain difficulty exists in electrical connection due to small product size and small electrode contact points when the conventional chip resistor is aged in batches.
In order to solve the technical problems, the utility model provides the following technical scheme: a burn-in device for a chip resistor comprises a test seat, a lower circuit board, a probe fixing plate and an upper circuit board, wherein a plurality of placing grooves are formed in the top of the test seat, the lower circuit board is installed at the bottom of the test seat, an electrode switching contact is arranged at the corresponding position of each placing groove on the lower circuit board, a first signal interaction contact is further arranged on the lower circuit board, and the signal interaction contact is electrically connected with the electrode switching contacts through a lead; the probe fixing plate is installed at the top of the test seat, a probe hole is formed in the corresponding position of each placing groove on the probe fixing plate, a probe is installed in each probe hole, a probe switching contact and a second signal interaction contact are arranged on the upper circuit board, the probe switching contact point corresponds to the position of the probe, the upper end of the probe is electrically connected with the corresponding probe switching contact, and the probe switching contact point is electrically connected with the second signal interaction contact.
In one embodiment, the top of the test socket is provided with a groove, the bottom of the groove is provided with a plurality of placing grooves downwards, and the placing grooves penetrate through the test socket.
In a certain embodiment, a plurality of rows of placing grooves are formed in the bottom of the groove, and the number of the placing grooves in each row is the same.
In a certain embodiment, the bottom of the groove is further provided with a heat dissipation groove.
In a certain embodiment, the test seat is provided with a pin sleeve hole, the pin sleeve hole is internally provided with a pin sleeve, the probe fixing plate is provided with a pin hole, the pin hole is internally provided with a pin, and the pin is inserted into the pin sleeve.
In one embodiment, the probes are soldered to probe transfer contacts on the upper circuit board mounted on the probe mounting plate.
In one embodiment, the test socket has a first connector, the connection terminal of the first connector is electrically connected to the first signal contact, the probe fixing plate has a second connector, and the connection terminal of the second connector is electrically connected to the second signal contact.
In one embodiment, the upper circuit board is provided with a second heat sink.
In a certain embodiment, a protective cover is further installed on the top of the probe fixing plate, the upper circuit board is located in the protective cover, and a vent hole is formed in the top surface of the protective cover.
Compared with the prior art, the utility model has the beneficial effects that: when carrying out batch chip resistor ageing, place chip resistor in the standing groove earlier, chip resistor's one end is connected with the electrode switching contact electricity on the circuit board down, then install the probe fixed plate on the test seat, make chip resistor's the other end and the lower extreme electricity of probe be connected, because the upper end of probe is received on the mutual contact of second signal through the probe switching contact, consequently only need with test power supply add on the mutual contact of first signal and second signal can, the probe on electrode switching contact and the probe fixed plate on the circuit board down has accomplished chip resistor both ends and test power supply's connection automatically, and is easy and simple to handle.
Drawings
FIG. 1 is a schematic structural diagram of the present invention in an embodiment;
FIG. 2 is a schematic structural diagram of a test socket in an embodiment;
FIG. 3 is a schematic structural diagram of a probe fixing plate in the embodiment
FIG. 4 is a schematic structural view of an upper circuit board in the embodiment;
FIG. 5 is a schematic structural diagram of a protective cover in an embodiment;
fig. 6 is a schematic structural view of a single placing groove in the present embodiment;
fig. 7 is a schematic connection diagram of the chip resistor in this embodiment.
Detailed Description
The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic views illustrating only the basic structure of the present invention in a schematic manner, and thus show only the constitution related to the present invention.
As shown in fig. 1, the aging device for chip resistors comprises a test socket 2, a lower circuit board 1, a probe fixing plate 3, an upper circuit board 5 and a protective cover 6.
As shown in fig. 2, the top of the test socket 2 is formed with a groove 26, the bottom of the groove 26 is formed with a plurality of placing slots 20, and the structural schematic diagram of a single placing slot 20 is shown in fig. 7. In fig. 2, a plurality of rows of placing grooves 20 are formed at the top of the test socket 2, and the number of the placing grooves 20 in each row is the same. In actual use, the placing grooves 20 with different sizes may be formed in the target positions on the top of the test socket 2 according to actual requirements. In fig. 2, the test socket 2 further has a heat sink 21, a lower circuit board fixing hole 22, a boss hole 23, a probe fixing plate mounting hole 24, and a first connector mounting hole 25.
In actual use, heat generated when the chip resistor 7 is aged can be dissipated from the aging apparatus through the heat dissipation groove 21.
In fig. 1, the lower circuit board 1 is provided with a first mounting hole 11, and the lower circuit board 1 is mounted on the bottom of the test socket 2 by using screws to pass through the first mounting hole 11 and the lower circuit board fixing hole 22. The lower circuit board 1 is provided with electrode transfer contacts at the corresponding portions of each of the placing grooves 20, and since the placing grooves 20 in fig. 2 are arranged in a row, the lower circuit board 1 is provided with a plurality of strip-shaped gold-plated pads 10 as the electrode transfer contacts. The lower circuit board 1 is also provided with a first signal interaction contact which is electrically connected with the electrode switching contact through a lead.
In order to facilitate aging, a first connector is installed in the first connector installation hole 25 on the test socket 2, and a connection terminal of the first connector is electrically connected with the first signal interaction contact.
In fig. 3, a probe hole 30, a hollow groove 31, an upper circuit board mounting hole 32, a self-mounting hole 33, a pin sleeve hole 34, a second connector mounting hole 35, a pin 36, and a protective cover mounting hole 37 are formed in the probe fixing plate 3. When the probe fixing plate 3 is installed, screws sequentially penetrate through the self installation holes 33 and the probe fixing plate installation holes 24, the probe fixing plate 3 is installed at the top of the test seat 2, in addition, in order to facilitate connection, a shaft sleeve is installed in the shaft sleeve hole 23, a pin 36 is installed in the pin sleeve hole 34, and the pin 36 is inserted into the shaft sleeve to realize the positioning of the probe fixing plate 3. The probe holes 30 are vertically arranged corresponding to the positions of the placement grooves 20, and each probe hole is provided with a probe 4.
In fig. 4, the upper circuit board 5 is provided with a probe transit contact 50, a second signal interaction contact 51, a wire 52, a second self-mounting hole 53 and a second heat sink 54. The position of the probe transfer contact 50 corresponds to the position of the probe 4 up and down, the upper end of the probe 4 is welded on the probe transfer contact 50, and each probe transfer contact 50 is connected with each other through a wire 52 and is electrically connected with the second signal interaction contact 51.
In order to facilitate aging, a second connector is mounted in the second connector mounting hole 35 of the probe fixing plate 3, and a connection terminal of the second connector is electrically connected to the second signal interaction contact 51.
When the upper circuit board 5 is mounted, the upper circuit board 5 is mounted on the top of the probe fixing plate 3 using screws passing through the second self-mounting holes 53 and the upper circuit board mounting holes 32.
In fig. 1, when fixing the protective cover 6, the protective cover 5 is mounted on the top of the probe fixing plate 3 with the upper circuit board 5 inside the protective cover 5 using screws through the protective cover mounting holes 37. In addition, the top surface of the protective cover 5 is provided with a vent hole 50.
In practice, the heat generated during aging of the chip resistor 7 can be dissipated from the aging apparatus through the heat dissipation groove 21, the hollow groove 31, the second heat dissipation groove 54, and the vent hole 50.
The connection schematic diagram of the two ends of the chip resistor 7 can refer to fig. 7, when the batch resistor 7 is aged, the chip resistor 7 is placed in the placing groove 20, one end of the chip resistor 7 is electrically connected with the electrode switching contact on the lower circuit board 1, then the probe fixing plate 3 is installed on the test seat 2, the other end of the chip resistor 7 is electrically connected with the lower end of the probe 4, because the upper end of the probe 4 is connected to the second signal interaction contact 51 through the probe switching contact 50, only the test power supply needs to be added on the first connector and the second connector, the connection between the two ends of the chip resistor 7 and the test power supply is automatically completed through the electrode switching contact on the lower circuit board 1 and the probe 4 on the probe fixing plate 3, and the operation is simple and convenient.
In light of the above, it is clear that many changes and modifications can be made by the workers in the field without departing from the spirit and scope of the utility model. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (9)
1. The aging device for the chip resistor is characterized by comprising a test seat, a lower circuit board, a probe fixing plate and an upper circuit board, wherein a plurality of placing grooves are formed in the top of the test seat; the probe fixing plate is installed at the top of the test seat, a probe hole is formed in the corresponding position of each placing groove on the probe fixing plate, a probe is installed in each probe hole, a probe switching contact and a second signal interaction contact are arranged on the upper circuit board, the probe switching contact point corresponds to the position of the probe, the upper end of the probe is electrically connected with the corresponding probe switching contact, and the probe switching contact point is electrically connected with the second signal interaction contact.
2. The aging device for chip resistors as claimed in claim 1, wherein the top of the test socket is recessed, and the bottom of the recess is downwardly recessed to form a plurality of placement slots, and the placement slots extend through the test socket.
3. The aging device for the chip resistor as claimed in claim 2, wherein a plurality of rows of placing grooves are formed at the bottom of the groove, and the number of the placing grooves in each row is the same.
4. The aging device for the chip resistor as claimed in claim 2, wherein the bottom of the groove is further provided with a heat sink.
5. The aging device for chip resistors as claimed in claim 1, wherein the test socket has a pin hole, the pin hole has a pin sleeve, the probe fixing plate has a pin hole, and the pin hole has a pin inserted into the pin sleeve.
6. The aging apparatus for chip resistor as claimed in claim 1, wherein said probe is soldered to a probe transfer contact on said upper circuit board mounted on said probe fixing plate.
7. The aging device for chip resistor as claimed in claim 1, wherein a first connector is mounted on the test socket, a connection terminal of the first connector is electrically connected with the first signal interaction contact, a second connector is mounted on the probe fixing plate, and a connection terminal of the second connector is electrically connected with the second signal interaction contact.
8. The aging device for chip resistors as claimed in claim 1, wherein said upper circuit board has a second heat sink formed thereon.
9. The aging device for the chip resistor as claimed in claim 1, wherein a protective cover is further installed on the top of the probe fixing plate, the upper circuit board is located in the protective cover, and a vent hole is formed in the top surface of the protective cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122089546.7U CN215813112U (en) | 2021-08-31 | 2021-08-31 | Aging device for chip resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122089546.7U CN215813112U (en) | 2021-08-31 | 2021-08-31 | Aging device for chip resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215813112U true CN215813112U (en) | 2022-02-11 |
Family
ID=80154319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122089546.7U Active CN215813112U (en) | 2021-08-31 | 2021-08-31 | Aging device for chip resistor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215813112U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116482494A (en) * | 2023-03-22 | 2023-07-25 | 广东微容电子科技有限公司 | Chip type multilayer ceramic capacitor test fixture |
-
2021
- 2021-08-31 CN CN202122089546.7U patent/CN215813112U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116482494A (en) * | 2023-03-22 | 2023-07-25 | 广东微容电子科技有限公司 | Chip type multilayer ceramic capacitor test fixture |
| CN116482494B (en) * | 2023-03-22 | 2023-11-21 | 广东微容电子科技有限公司 | Chip type multilayer ceramic capacitor test fixture |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5296117B2 (en) | Probe device | |
| CN103703381B (en) | The probe card of power device | |
| CN102095946B (en) | General electrical testing device for packaging structures | |
| CN215813112U (en) | Aging device for chip resistor | |
| US8106671B2 (en) | Socketless integrated circuit contact connector | |
| US7132839B2 (en) | Ultra-short low-force vertical probe test head and method | |
| US7768283B1 (en) | Universal socketless test fixture | |
| JP5872391B2 (en) | Electronic component testing equipment | |
| US8188760B2 (en) | Curve tracer signal conversion for integrated circuit testing | |
| CN115932550A (en) | Semiconductor testing device | |
| CN209640378U (en) | The adapter base structure of test fixture | |
| JPH0829475A (en) | Contact probe of mounted substrate inspection device | |
| CN220473650U (en) | Aging board suitable for SOT23-3 packaged chip aging test | |
| CN215910593U (en) | Be suitable for field effect transistor to burn and smelt experimental board of smelting always | |
| CN218240296U (en) | Aging plate suitable for aging test of ULQ2003 triode array | |
| CN205229219U (en) | Detect first structure based on probe | |
| US20180299490A1 (en) | Probe and probe card including the same | |
| CN214014566U (en) | Control mainboard of electromagnetic heating equipment and electromagnetic heating equipment | |
| CN217443458U (en) | LV7745DEV crystal oscillator aging board | |
| CN220019735U (en) | Accurate resistance testing device for display panel | |
| CN213041949U (en) | Thermal resistance testing device of F-shaped packaged power device | |
| CN217443457U (en) | SG2803J driver array smelts board always | |
| CN220041403U (en) | Power consumption measuring device of memory chip | |
| CN213275680U (en) | Test jig for circuit board test tool | |
| CN208672677U (en) | A kind of great-power electronic module ageing fixture |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |