TWM394423U - LED lamp - Google Patents

LED lamp Download PDF

Info

Publication number
TWM394423U
TWM394423U TW99208517U TW99208517U TWM394423U TW M394423 U TWM394423 U TW M394423U TW 99208517 U TW99208517 U TW 99208517U TW 99208517 U TW99208517 U TW 99208517U TW M394423 U TWM394423 U TW M394423U
Authority
TW
Taiwan
Prior art keywords
heat sink
heat
lamp
led
fixing
Prior art date
Application number
TW99208517U
Other languages
Chinese (zh)
Inventor
Wen-Lung Chin
Original Assignee
Wen-Lung Chin
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wen-Lung Chin filed Critical Wen-Lung Chin
Priority to TW99208517U priority Critical patent/TWM394423U/en
Publication of TWM394423U publication Critical patent/TWM394423U/en

Links

Description

五'新型說明: 【新型所屬之技術領域】 本創作屬高效率LED燈技術領域,提供照明使用,除具有 極佳的散熱、電絕緣效果外’更具有不須更換燈具而可直接替 換燈泡使用之功效。 【先前技術】 按’ LED是發光二極體(Light- emitting Diode)的縮寫, 是半導體材料製成的固態發光元件,材料使用III-V族化學元 素(如:磷化鎵(GaP)、砷化鎵(GaAs)等),發光原理是將電 能轉換為光,也就是對化合物半導體施加電流,透過電子與電 洞的結合,過剩的能量會以光的形式釋出,達成發光的效果, 屬於冷性發光,壽命長達十萬小時以上。LED最大的特點在於: 無須暖燈時間(idling time)、反應速度快、體積小、用電省、 耐震、污染低、適合量產,具高可靠度,容易配合應用上的需 要製成極小或陣列式的元件。惟因為LED是固態照明,即是利 用晶片通電,量子激態回復發出能量(光),但在發光的過程, 晶片内的光能量並不能完全傳至外界,不能出光的能量,在晶 片内部及封裝體内便會被吸收,形成熱。LED —般的轉換效率 約只有10%〜30%,所以1W的電,只有不到〇.2W變成你可以看 見的光’其它都是熱,若不散熱,這些熱量累積會對晶片效率 及壽命造成損傷。故要以高效率LED運用於照明設備首先要解 決散熱的問題。 M394423 本創作研創人先前提出097110126號高效率LED燈專利, 其主要係由LED模組、構裝基板、電路裝置及散熱燈座所構成, 該LED模組係設於構裝基板上,構裝基板為導熱性良好之金屬 構成’散熱燈座為散熱性良好之具多孔隙結構非金屬構成,並 直接成型成燈座外形,其具有内凹部,内凹部之開口端藉構裝 基板封閉,其内設有電路裝置,電路裝置則連結LED模組與外 • 部電源’當LE:D點亮時,其產生的熱可迅速的被構裝基板所傳 .鲁 導,並藉構裝基板與散熱燈座間之熱傳導及熱對流作用,使構 裝基板上之熱迅速的傳導至散熱燈座而散熱。以摒除習用 散熱大都採用金屬散熱片,或結合熱導管、致冷晶片、均熱板、 散熱風扇等方式為之,所普遍具有散熱效果不佳、散熱速度不 夠迅速、散熱模組結構複雜、成本高、不具電絕緣性安規通過 不易,以及由於所需搭配之散熱結構為非規格化設計,故必需 設計專㈣燈具方能使料缺失。惟财進—步降低材料成本 • 之空間。此即為現行習用技術存有最大之缺失,此缺失乃成業 界亟待克服之難題。 【新型内容】 本創作研創人馨於習用技術之缺失,積其多年實際從事精 _紐技I業產品之設計製造專業知識,經不斷研究、改良 後,终有本創作之研創成功,公諸於世。 緣疋本創作之主要目的在提供一種「led燈」,其主要係 由LED模組、散熱片及燈座所構成,該LED模組具有導熱部及 4 M394423 電連結部,散熱片為散熱性良好之非金屬構成,燈座為非金屬 材料直接成型成燈座外形,其具有内承部來容設前述散熱片, 該LED模組之導熱部與散熱片結合,電連結部則連結外部電 源’當LED點亮時’其產生的熱可迅速的被散熱片所傳導散 熱’本創作燈座可為-般非金屬材料如:塑料、喊或散熱陶 瓷直接形成一般燈座外形,並具電絕緣甚或散熱效能。 本創作另包括有導熱片,該導熱片設於LED模組導熱部與 散熱片間,當點亮LED㈣,其產生的熱可迅速的被導熱片所 傳導至散熱片而散熱。 前述燈座外緣設紐泡專用的金屬套、絕緣套及電源接觸 片,該金屬套及電源接觸片並與Li:D模組之電連結部電性連 結,以於習用燈泡燈具上使用;前述金屬套亦可於燈座外緣相 對位置處以鍍膜或塗層等方式形成導電金屬層者。 前述UD模組之電連結部連結有投射燈座專用之連結端 子,該連結端子並凸設出燈座底部外緣,以於習用投射燈具上 使用。 别述燈座設有增加散熱表面積之紋路及散熱孔者。 本創作前述LED模組及散熱片相對位置處設有穿孔,散熱 片下方設有具穿孔之固定片,另包括有固定件穿過LED模組、 散熱片及固定片之穿孔而將之固設;固定片另具有固定孔,以 藉固定棒自燈座底面由下方穿設而將LED模組及散熱片固定 於燈座者。 本創作另包括有燈罩,該燈罩為塑料一體成型,底部並具 有卡部,前述燈座相對位置設有卡部,以相互卡制固定者。 5 M394423 【實施方式】 為達成本創作前述目的之技術手段,茲列舉一實施例,並 配合圖式說明如後,貴審查委員可由之對本創作之結構、特徵 及所達成之功效’獲致更佳之瞭解。 首先,請參閱第一圖所示,由圖可知本創作主要包括有: LED模組(1),為規格化商品,其具有導熱部(1〇)及電連結 部(11),該模組之導熱部⑽與散熱片(2)結合(如黏合、 - 螺合…等),電連結部(11)則連結外部電源; ^ 散熱片⑵,為散熱性良好之具多孔隙結構(多孔隙結構即 具有南比表面積結構)非金屬構成,如可由熱導率高的非金屬 粉體製成,熱導率高的非金屬粉體諸如··氧化鋁Al2〇3、氧化 結Zr2〇、氮化铭Α1Ν、氮化石夕SiN、氮化硕ΒΝ、碳化鎢wc、 碳化石夕SiC、石墨C、結晶碳化矽、再結晶碳化矽RSic等而 以氮化鋁及碳化矽為佳,· 燈座(3) ’為非金屬材料直接成型成燈座外形,其具有内承 ^ · 部(30)來容設前述散熱片(2); 备LED點凴時,其產生的熱可迅速的被散熱片〇所傳導散 熱。 本創作前述燈座(3)可為-般非金屬材料如:以塑料射出成 $ ’具有電絕緣特性。其亦可由散熱性良好之具多孔隙結構(多 孔隙結構即具有高比表面積結構)非金屬構成【如由熱導率高 的非金屬粉體製成(如射出成型等),熱導率高的非金屬粉體諸 如·氧化IS Al2〇3、氧化錯Zr2〇、氮化銘A1N、氮化石夕SiN、 氮化领BN、碳麟WC、碳切sic、石墨c、結晶碳化石夕、 6 M394423 再結晶碳化矽RSiC等,而以氮化鋁及碳化矽為佳】,並直接 成型成燈座外形,如此兼具電絕緣及散熱效能。本創作燈座(3) 係直接形成一般燈座外形,可直接取代習用燈泡使用,具有不 須更換燈具可直接替換燈泡之功效【即本創作可直接於舊的燈 具上使用】 請參閱第二圖所示,圖示另種LED模組(1),該LED模組(1) 之導熱部(10)設於侧方,於本實施例中,該散熱片(2)於該LED 模組導熱部(10)相對位置設有導熱孔(2〇),以將該LED模組產 生的熱由導熱部(10)傳導至散熱片(2)而散熱。 請參閱第三、四圖所示,本創作另包括有導熱片,該導 熱片(4)設於LED模組導熱部(1〇)與散熱片(2)間,導熱片(4) 為導熱性良好之金屬構成【導熱良好之金屬如金、銀、銅、鐵、 鋁、鈷、鎳、鋅、鈦、錳等】,當點亮LED燈時,其產生的熱 可迅速的被導熱片(4)所傳導,並藉導熱片(4)與散熱片(2)間 之熱傳導作用,使導熱片(4)上之熱迅速的傳導至散熱片 而散熱。本創作導熱片(4)可直接成形於散熱片(2)上,【請參 閱第五圖所示,如以印刷或塗佈等方式直接於散熱片與led 模組(1)之結合部上,形成金屬導熱層(41)】,以減少部件、降 低成本。 請參閱第一至四圖,本創作前述燈座(3)外緣設有增加散熱 表面積之紋路(31)。 請參閱第五圖所示,本創作前述燈座⑶設有貫通内承部 (30)與燈座(3)外部之散熱孔(32),使燈座⑶内部之熱得以散 出,並具有對流作用,增強散熱效果。 7 M394423 請再參閱第一圖所示,本創作前述Led模組(i)具有穿孔 (12),散熱片(2)於LED模組穿孔(12)相對位置處設有穿孔 (21) ’散熱片(2)下方設有具穿孔(5〇)之固定片(5),另包括有 固定件(A)【固定件可為一般習知的螺栓、銷件等】穿過LED 模組穿孔(12)、散熱片穿孔(21)及固定片穿孔(5〇)而將模 組(1)、散熱片(2)及固定片(5)固設。本創作前述固定片(5) 另具有固定孔(51),以藉固定棒(B)【固定棒(B)可為一般的螺 栓、銷件等】自燈座(3)底面由下方穿設過固定片固定孔(51), 而將LED模組(1)及散熱片(2)等固定於燈座(3)者。前述固定 棒(B)可為金屬材質,以作為LED模組(1)連結外部電源之用。 請再參閱第三圖所示,本創作前述導熱片(4) MLE:D模組 穿孔(12)相對位置處設有穿孔(40),以藉固定件(A)穿過LED 模組穿孔(12)、導熱片穿孔(4〇)、散熱片穿孔(21)及固定片穿 孔(50)而將LED模組(1)、導熱片(4)、散熱片(2)及固定片(5) 固設。 β月再參閱第二圖所示,本創作前述散熱片(2)設有穿孔 (21),散熱片(2)下方設有具穿孔(50)之固定片(5),另包括有 固疋件(Α)【固定件可為一般習知的螺栓、銷件等】穿過[ED 模組穿孔(12)、散熱片穿孔(21)及固定片穿孔(5〇)而將led模 組(1)、散熱片(2)及固定片(5)固設。本創作前述固定片(5) 另具有固定孔(51),以藉固定棒(B)【固定棒(B)可為一般的螺 栓、銷件等】自燈座(3)底面由下方穿設過固定片固定孔(51), 而將LE:D模組(1)及散熱片(2)等固定於燈座(3)者。前述固定 棒(B)可為金屬材質’以作為LE:D模組(1)連結外部電源之用。 8 M394423 請再參閱第四圖所示,本創作前述導熱片(4)設有穿孔 (40),以藉固定件(A)穿過導熱片穿孔(4〇)、散熱片穿孔(21) 及固疋片穿孔(50)而將導熱片(4)、散熱片(2)及固定片(5)固 設。 請再參閱第一至六圖所示,本創作另包括有燈罩(6),該燈 罩為塑料一體成型,底部並具有卡部(60),前述散熱片(2)相 對位置設有卡部(22)【第一、二、四圖實施例】,以相互卡制 固定。或者,前述導熱片(4)相對位置設有卡部(42)【第三圖 實施例】,以相互卡制固定。如此可將燈罩(6)與燈座(3)等整 體固定穩固,可摒除習者採用黏固方式,無法有效固定,而無 法通過安規拉力測試的缺失。 再者’請參閱各相關圖式’前述燈座(3)外緣設有燈泡專用 的金屬套(C)、絕緣套(D)及電源接觸片(E)【該燈泡專用的金 屬套(C)、絕緣套(D)及電源接觸片(E)為國際通用規格,如 E-27、E-14等】’該金屬套(〇及電源接觸片(e)並與led模組 之電連結部(11)電性連結,以於習用燈泡燈具上使用;請參閱 第六圖所示’前述金屬套(c)亦可於燈座(3)外緣相對位置處以 鍍膜或塗層等方式形成導電金屬層(F)者。 請參閱第七圖所示’前述LED模組之電連結部(η)連結有 投射燈座專用之連結端子(G)【該投射燈座專用之連結端子(G) 為國際通用規格,如MR16等】,該連結端子(G)並凸設出燈座 (3)底部外緣’燈座(3)上設有反射罩(7),而構成LED投射燈, 如此即可以本創作直接插合於習用投射燈具上使用,而不必替 換原有的舊投射燈具者。 9 如此而達本創作設計目的,堪稱-實用之創作者β 综上所述,本創作所揭露之一種「LED燈」為昔所無, 曰見於國⑽公開之刊物上,理已具新雛之翻要件,又本 創作綠可摒除習用技術缺失,並達成本創作設計目的,亦已充 分符合新型補要件,銳法提出申請,謹請貴審查委員惠予 審查’並_本案糊,實感德便。 惟以上所述者,僅為本創作之一較佳可行實施例而已,並非 用以拘限本鋪之朗’舉凡熟悉此項技藝人士 ,運用本創作 說明書及中請專利範睛作之等效結構變化,理應包括於本創 作之專利範圍内。 【圖式簡單說明】 第一圖係本創作第一實施例立體分解圖。 第二圖係本創作第二實施例立體分解圖。 第三圖係具導熱片之第一實施例立體分解圖。 第四圖係具導熱片之第二實施例立體分解圖。 第五圖係本創作第一實施例組立剖面圖。 第六圖係本創作第二實施例組立剖面圖。 第七圖係本創作第三實施例組立剖面圖。 【主要元件符號說明】 (1) LED模組 (10)導熱冑 (11)電連結部 (12)穿孔 (2) 散熱片 M394423 (20)導熱孔 (22)卡部 (3)燈座 (21)穿孔 (30)内承部 (32)散熱孔 (4)導熱片 (31)紋路 (40)穿孔 (42)卡部 (5)固定片 (41)金屬導熱層 (50)穿孔 (6) 燈罩 (60)卡部 (7) 反射罩 (51)固定孔 (A)固定件 (B)固定棒 (C)金屬套 (D)絕緣套 (E)電源接觸片 (G)連結端子 (F)導電金屬層 11Five new description: [New technology field] This creation is a high-efficiency LED lamp technology field, providing lighting use, in addition to excellent heat dissipation and electrical insulation effect, it can directly replace the bulb without replacing the lamp. The effect. [Prior Art] Press 'LED is the abbreviation of Light-emitting Diode, which is a solid-state light-emitting element made of semiconductor material. The material uses III-V chemical elements (such as gallium phosphide (GaP), arsenic. Gallium (GaAs), etc., the principle of luminescence is to convert electrical energy into light, that is, to apply current to the compound semiconductor, through the combination of electrons and holes, excess energy will be released in the form of light, achieving the effect of luminescence, belonging to Cold lighting, life expectancy of more than 100,000 hours. The biggest features of LED are: no idling time, fast response, small size, low power consumption, low vibration, low pollution, suitable for mass production, high reliability, easy to match with the application needs to be made very small or Array of components. However, because the LED is solid-state lighting, that is, the power is applied by the wafer, and the quantum excited state returns energy (light), but in the process of illuminating, the light energy in the wafer cannot be completely transmitted to the outside, and the energy of the light cannot be emitted inside the wafer and The inside of the package will be absorbed to form heat. The general conversion efficiency of LED is only about 10%~30%, so 1W of electricity is less than 〇.2W becomes light that you can see. 'Others are hot. If you don't dissipate heat, these heat accumulation will affect the efficiency and life of the chip. Cause damage. Therefore, the application of high-efficiency LEDs to lighting equipment must first solve the problem of heat dissipation. M394423 This creative researcher has previously proposed the patent of 097110126 high-efficiency LED lamp, which is mainly composed of LED module, component substrate, circuit device and heat-dissipating lamp holder. The LED module is set on the structure substrate and is assembled. The substrate is made of a metal having good thermal conductivity. The heat dissipating lamp holder is made of a non-metallic structure having a good heat dissipation property and is directly formed into a lamp holder shape, and has an inner concave portion, and the open end of the inner concave portion is closed by the mounting substrate. There is a circuit device inside, and the circuit device connects the LED module and the external power supply. When LE:D is lit, the heat generated can be quickly transmitted by the substrate, and the substrate is assembled. The heat conduction and heat convection between the heat dissipation lamp holders causes the heat on the structure substrate to be quickly transmitted to the heat dissipation lamp holder to dissipate heat. In order to eliminate the conventional heat dissipation, metal heat sinks are used, or combined with heat pipes, cooling chips, soaking plates, cooling fans, etc., generally have poor heat dissipation effect, fast heat dissipation speed, complicated heat dissipation module structure, and cost. High, non-electrical insulation safety is not easy to pass, and because the required heat dissipation structure is non-standardized design, it is necessary to design special (4) lamps to make the material missing. Only the money is in step-by-step to reduce the cost of materials. This is the biggest lack of current conventional technology, and this lack is a difficult problem to be overcome in the industry. [New Content] This creative researcher is fascinated by the lack of customary technology. He has been engaged in the design and manufacturing expertise of Jing_New Technology I products for many years. After continuous research and improvement, he has succeeded in the creation of this creation. Yu Shi. The main purpose of this creation is to provide a "LED lamp", which is mainly composed of an LED module, a heat sink and a lamp holder. The LED module has a heat conducting portion and a 4 M394423 electrical connection portion, and the heat sink is heat dissipation. A good non-metallic structure, the lamp holder is directly formed into a lamp holder shape by a non-metal material, and has an inner receiving portion for accommodating the heat sink, the heat conducting portion of the LED module is combined with the heat sink, and the electrical connecting portion is connected to the external power source. 'When the LED is lit, the heat generated by it can be quickly dissipated by the heat sink.' The lamp holder can be made of a non-metallic material such as plastic, shout or heat-dissipating ceramic to form a general lamp holder shape and have electricity. Insulation or even heat dissipation. The creation further includes a thermal conductive sheet disposed between the heat conducting portion of the LED module and the heat sink. When the LED (4) is lit, the heat generated by the LED can be quickly conducted by the thermal conductive sheet to the heat sink to dissipate heat. The outer edge of the lamp holder is provided with a metal sleeve, an insulating sleeve and a power contact piece for the bubble, and the metal sleeve and the power contact piece are electrically connected to the electrical connection portion of the Li:D module for use on the conventional light bulb lamp; The metal sleeve may also form a conductive metal layer by coating or coating at a relative position of the outer edge of the lamp holder. The electrical connection portion of the UD module is coupled to a connection terminal dedicated to the projection lamp holder, and the connection terminal protrudes from the outer edge of the bottom of the socket for use on a conventional projection lamp. The lamp holder is provided with a pattern and a heat dissipation hole for increasing the surface area of the heat dissipation. The above-mentioned LED module and the heat sink are provided with perforations at opposite positions, and a fixing piece with perforations is arranged under the heat sink, and the fixing member is fixed through the perforation of the LED module, the heat sink and the fixing piece. The fixing piece has a fixing hole for fixing the LED module and the heat sink to the lamp holder by the fixing rod from the bottom surface of the lamp holder. The present invention further includes a lamp cover which is integrally formed of plastic, and has a card portion at the bottom, and the lamp holder is provided with a card portion at a relative position to clamp each other. 5 M394423 [Embodiment] In order to achieve the above-mentioned technical means for the purpose of the present invention, an embodiment will be exemplified, and with the following description, the review board member can better achieve the structure, characteristics and achieved effects of the present invention. To understanding. First, please refer to the first figure. It can be seen from the figure that the creation mainly includes: LED module (1), which is a standardized product, which has a heat conducting portion (1〇) and an electrical connecting portion (11), the module The heat conducting portion (10) is combined with the heat sink (2) (such as bonding, - screwing, etc.), and the electrical connecting portion (11) is connected to the external power source; ^ The heat sink (2) is a porous structure with good heat dissipation (polyporous) The structure has a non-metallic structure with a south specific surface area structure, such as a non-metallic powder which can be made of a high thermal conductivity, and a non-metallic powder having a high thermal conductivity such as alumina, Al2〇3, oxidized Zr2〇, nitrogen Α明Α1Ν, 氮化石夕SiN, 氮化 ΒΝ, tungsten carbide wc, carbon carbide SiC, graphite C, crystalline lanthanum carbide, recrystallized ruthenium carbide, etc., with aluminum nitride and tantalum carbide as the best, · lamp holder (3) 'For non-metallic materials, it is directly formed into a lamp holder shape, which has an inner part (30) to accommodate the aforementioned heat sink (2); when the LED is turned on, the heat generated can be quickly dissipated The film is transmitted to dissipate heat. The lamp holder (3) of the present invention can be made of a general non-metallic material such as a plastic injection material having an electrical insulation property of $'. It may also be composed of a non-metallic structure having a good heat dissipation property (a porous structure having a high specific surface area structure) [such as a non-metallic powder having a high thermal conductivity (such as injection molding), and having high thermal conductivity. Non-metallic powders such as oxidized IS Al2〇3, oxidized Zr2〇, nitrite A1N, nitrided SiN, nitrided BN, carbon lining WC, carbon cut sic, graphite c, crystalline carbonized carbide eve, 6 M394423 recrystallizes lanthanum carbide, such as RSiC, and aluminum nitride and tantalum carbide are preferred, and is directly formed into a lamp holder shape, which has both electrical insulation and heat dissipation. The lamp holder (3) directly forms a general lamp holder shape, which can directly replace the conventional lamp. It can directly replace the lamp without replacing the lamp. [This creation can be used directly on the old lamp] Please refer to the second As shown in the figure, another LED module (1) is illustrated. The heat conducting portion (10) of the LED module (1) is disposed on the side. In the embodiment, the heat sink (2) is disposed on the LED module. The heat conducting portion (10) is provided with a heat conducting hole (2〇) at a relative position to conduct heat generated by the LED module from the heat conducting portion (10) to the heat sink (2) to dissipate heat. Please refer to the third and fourth figures. The creation also includes a thermal conductive sheet. The thermal conductive sheet (4) is disposed between the heat conducting portion (1〇) of the LED module and the heat sink (2), and the thermal conductive sheet (4) is thermally conductive. Good-quality metal composition [good thermal conductivity metals such as gold, silver, copper, iron, aluminum, cobalt, nickel, zinc, titanium, manganese, etc.], when the LED lamp is lit, the heat generated by it can be quickly transferred to the thermal pad (4) Conducted by the heat conduction between the heat conducting sheet (4) and the heat sink (2), so that the heat on the heat conducting sheet (4) is quickly conducted to the heat sink to dissipate heat. The heat conductive sheet (4) of the present invention can be directly formed on the heat sink (2), [refer to the fifth figure, such as printing or coating directly on the joint of the heat sink and the LED module (1). Form a metal heat conductive layer (41) to reduce parts and reduce cost. Referring to Figures 1 to 4, the outer edge of the lamp holder (3) of the present invention is provided with a texture (31) for increasing the surface area of the heat dissipation. Referring to the fifth figure, the lamp holder (3) of the present invention is provided with a heat dissipation hole (32) penetrating the inner bearing portion (30) and the lamp holder (3), so that the heat inside the lamp holder (3) is dissipated and has Convection action enhances heat dissipation. 7 M394423 Please refer to the first figure. The Led module (i) has a perforation (12). The heat sink (2) is provided with a perforation (21) at the relative position of the perforation (12) of the LED module. A fixing piece (5) with a perforation (5〇) is arranged under the piece (2), and a fixing piece (A) is further included [a fixing piece can be a conventionally known bolt, a pin piece, etc.] piercing through the LED module ( 12), the heat sink perforation (21) and the fixing piece perforation (5 〇) to fix the module (1), the heat sink (2) and the fixing piece (5). The fixing piece (5) of the present invention has a fixing hole (51) for fixing the rod (B) [the fixing rod (B) can be a general bolt, a pin, etc.] from the bottom surface of the lamp holder (3) from below. The fixing piece fixing hole (51) is passed through, and the LED module (1), the heat sink (2), and the like are fixed to the lamp holder (3). The fixing rod (B) may be made of a metal material to be used as an LED module (1) for connecting an external power source. Please refer to the third figure, the above-mentioned heat conductive sheet (4) MLE: D module perforation (12) is provided with a perforation (40) at the relative position of the module (A) to pass through the LED module through the fixing member (A) ( 12), the thermal plate perforation (4 〇), the fin perforation (21) and the fixing plate perforation (50) and the LED module (1), the thermal conductive sheet (4), the heat sink (2) and the fixing piece (5) Fixed. Referring to the second figure, the above-mentioned heat sink (2) is provided with a perforation (21), and a fixing piece (5) having a perforation (50) is disposed under the heat sink (2), and the fixing piece (5) is further included. Pieces (Α) [fixed parts can be commonly used bolts, pins, etc.] through the [ED module perforation (12), fin perforation (21) and fixed piece perforation (5〇) and the led module ( 1) Fix the heat sink (2) and the fixing piece (5). The fixing piece (5) of the present invention has a fixing hole (51) for fixing the rod (B) [the fixing rod (B) can be a general bolt, a pin, etc.] from the bottom surface of the lamp holder (3) from below. The fixing piece fixing hole (51) is passed through, and the LE:D module (1) and the heat sink (2) are fixed to the lamp holder (3). The fixing rod (B) may be made of metal material to be used as an LE:D module (1) for connecting an external power source. 8 M394423 Please refer to the fourth figure again. The heat conducting sheet (4) of the present invention is provided with a perforation (40) for passing through the fixing piece (A) through the perforation of the thermal pad (4〇), the fin perforation (21) and The heat-transfer sheet (4), the heat sink (2), and the fixing piece (5) are fixed by the through-hole perforation (50). Please refer to the first to sixth figures. The present invention further includes a lamp cover (6) which is integrally formed of plastic, and has a card portion (60) at the bottom, and the heat sink (2) is provided with a card portion at a relative position ( 22) [Examples of the first, second and fourth figures] are fixed by mutual clamping. Alternatively, the heat conducting sheet (4) is provided with a card portion (42) at a relative position (the third embodiment) to be fixed to each other. In this way, the lampshade (6) and the lamp holder (3) can be integrally fixed and stabilized, and the mold can be removed by the practitioner, and cannot be effectively fixed, and the lack of the safety tensile test cannot be passed. In addition, 'Please refer to the relevant drawings'. The outer edge of the lamp holder (3) is provided with a metal sleeve (C), an insulating sleeve (D) and a power contact piece (E) for the bulb. [The metal sleeve for the bulb (C) ), insulation sleeve (D) and power contact piece (E) are internationally accepted specifications, such as E-27, E-14, etc.] 'The metal sleeve (〇 and power contact piece (e) and the electrical connection with the led module) The part (11) is electrically connected for use on conventional light bulb lamps; please refer to the figure 6 in the above figure. 'The aforementioned metal sleeve (c) can also be formed by coating or coating at the relative position of the outer edge of the lamp holder (3). For the conductive metal layer (F), please refer to the connection terminal (G) dedicated to the projection lamp holder for the electrical connection portion (η) of the LED module shown in Figure 7 [The connection terminal for the projection lamp holder (G) ) for international common specifications, such as MR16, etc., the connecting terminal (G) is protruded from the bottom of the lamp holder (3). The lamp holder (3) is provided with a reflector (7) to form an LED projection lamp. In this way, the creation can be directly inserted into the conventional projection luminaire without having to replace the original old projection luminaire. 9 Thus, the purpose of the creation design is called - practical The creator β In summary, the “LED light” revealed by this creation is nothing in the past. It is seen in the publication of the National (10) publication, and it has already been replaced by new ones. And to achieve the purpose of this creative design, has also fully complied with the new supplementary elements, sharp law to apply, I would like to ask your review board to review the 'and _ this case paste, really feel good. Only the above, only for this creation A preferred embodiment is not intended to limit the franchise of the shop. Anyone who is familiar with the skill of the art, using this creation manual and the patent equivalents of the patents, should be included in the scope of this creation. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is an exploded perspective view of the first embodiment of the present creation. The second figure is an exploded perspective view of the second embodiment of the present creation. The third figure is a three-dimensional decomposition of the first embodiment of the thermally conductive sheet. Fig. 4 is a perspective exploded view of a second embodiment of a thermally conductive sheet. The fifth drawing is a sectional view of the first embodiment of the present invention. The sixth drawing is a sectional view of the second embodiment of the present creation. Benchuang A cross-sectional view of the third embodiment. [Description of main components] (1) LED module (10) Thermal conduction 胄 (11) Electrical connection (12) perforation (2) Heat sink M394423 (20) Thermal hole (22) Card part (3) Lamp holder (21) Perforation (30) Inner bearing part (32) Heat dissipation hole (4) Thermal sheet (31) Grain (40) Perforation (42) Card part (5) Fixing piece (41) Metal heat conduction Layer (50) perforation (6) lampshade (60) card portion (7) reflector cover (51) fixing hole (A) fixing member (B) fixing rod (C) metal sleeve (D) insulating sleeve (E) power contact piece (G) Connecting terminal (F) conductive metal layer 11

Claims (1)

8·如申請專利範圍第1項所述之「LED燈」,其中,該燈座 設有貫通内承部與燈座外部之散熱孔。 9·如申請專利範圍第1項所述之「LED燈」,其中,該LED 模組具有穿孔,散熱片於LED模組穿孔相對位置處設有穿孔, 散熱片下方設有具穿孔之固定片,另包括有固定件穿過哪模 組穿孔、散熱片穿孔及固定片穿孔而將LED模組、散熱片及固 定片固設’前述固^另具有固定孔,以藉固定棒自燈座底面 由下方穿設過固定片固定孔,而將LED模組及散熱片固定於燈 座者。 1〇·如申請專利範圍第9項所述之「LED燈」,其中,該LED 模組導熱部與散刻間設有導熱片,該導熱片於LED模組穿孔 相對位置處設有穿孔,以藉固定件穿過LED模組穿孔、導熱片 穿孔、散熱片穿孔及固定片穿孔而將LED模組、導熱片、散熱 片及固定片固設者。 11. 如申請專利範圍第9項所述之「LED燈」,其中,該固定 棒為金屬材質,作為LED模組連結外部電源。 12. 如申請專利範圍第4項所述之「LED燈」,其中,該散熱 片設有穿孔,散熱片下方設有具穿孔之固定片,另包括有固定 件穿過LED模組穿孔、散熱片穿孔及固定片穿孔而將LED模 組、散熱片及固定片固設,前述固定片另具有固定孔,以藉固 定棒自燈座底面由下方穿設過固定片固定孔,而將LED模組及 散熱片固定於燈座者。 13·如申請專利範圍第<2項所述之「LED燈」,其中,該led 13 M394423 模Μ導熱部與散熱片間設有導熱片,該導熱片設有穿孔,以藉 固定件穿過導熱片穿孔、散熱片穿孔及固定片穿孔而將導熱 片、散熱片及固定片固設者。 14.如申請專利範圍第丨2項所述之rLED燈」,其中,該固定 棒為金屬材質’作為LE)D模組連結外部電源。 15·如申請專利範圍第1項所述之「LED燈」,其另包括有燈 罩,該燈罩為塑料一體成型,底部並具有卡部,該散熱片相對 位置設有卡部,以相互卡制固定。 16.如申清專利範圍第1項所述之「led燈」,其中,該led 模組導熱部與散熱片間設有導熱片,另包括有燈罩,該燈罩為 塑料一體成型,底部並具有卡部,前述導熱片相對位置設有卡 部,以相互卡制固定者。 17·如申請專利範圍第1項所述之「LED燈」,其中,該燈座 外緣設有魏專關金屬套、絕緣套及魏接觸#,該金屬套 及電源接觸片並與LED模組之電連結部電性連結者。 18·如申請專利範圍第Π項所述之「LED燈」,其中,該金 屬套係於燈斜緣姆位置處⑽斜電金屬層取代者。 19·如申請專利範圍第1項所述之「LED燈」,其中,該LED 模組之電連結部連結有投射燈座專用之連結端子,該連結端子 並凸設出燈座底部外緣者。 148. The "LED lamp" of claim 1, wherein the lamp holder is provided with a heat dissipation hole penetrating the inner receiving portion and the outer portion of the lamp holder. 9. The "LED lamp" of claim 1, wherein the LED module has a perforation, the heat sink is provided with a perforation at a relative position of the perforation of the LED module, and a perforated fixing piece is disposed under the heat sink. The utility model further comprises a module through which the fixing member passes through, the through hole of the heat sink and the through hole of the fixing piece, and the LED module, the heat sink and the fixing piece are fixed, and the fixing body has a fixing hole to fix the bottom surface of the lamp holder by the fixing rod. The fixing piece fixing hole is bored from below, and the LED module and the heat sink are fixed to the lamp holder. 1 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The LED module, the heat conducting sheet, the heat sink and the fixing piece are fixed by the through hole of the LED module through the fixing member, the through hole of the heat conducting sheet, the through hole of the heat sink and the through hole of the fixing piece. 11. The "LED lamp" as described in claim 9 wherein the fixing bar is made of a metal material and is connected to an external power source as an LED module. 12. The "LED lamp" as claimed in claim 4, wherein the heat sink is provided with a perforation, and a fixing piece having a perforation is arranged under the heat sink, and the fixing member passes through the LED module for perforation and heat dissipation. The through hole and the fixing piece are perforated to fix the LED module, the heat sink and the fixing piece, and the fixing piece further has a fixing hole, so that the fixed piece fixing hole is penetrated from the bottom surface of the lamp holder from below by the fixing bar, and the LED die is used The set and the heat sink are fixed to the lamp holder. 13) The "LED lamp" described in the <2 patent application, wherein the led 13 M394423 is provided with a heat conducting sheet between the heat conducting portion and the heat sink, and the heat conducting sheet is provided with a perforation for wearing by the fixing member. The heat conductive sheet, the heat sink, and the fixing piece are fixed by the perforation of the heat conductive sheet, the perforation of the heat sink, and the perforation of the fixing piece. 14. The rLED lamp of claim 2, wherein the fixing bar is made of a metal material as a LE module to connect an external power source. 15. The "LED lamp" as described in claim 1 further includes a lamp cover which is integrally formed of plastic and has a card portion at the bottom, and the heat sink is provided with a card portion at a relative position to be mutually engaged. fixed. 16. The "LED lamp" as described in claim 1, wherein the LED module is provided with a heat conducting sheet between the heat conducting portion and the heat sink, and further comprises a lamp cover, the lamp cover is integrally formed of plastic, and has a bottom portion and has In the card portion, the opposite side of the heat-conducting sheet is provided with a card portion to clamp the holders to each other. 17. The "LED lamp" as described in item 1 of the patent application scope, wherein the outer edge of the lamp holder is provided with a Wei special metal sleeve, an insulating sleeve and a Wei contact #, the metal sleeve and the power contact piece and the LED mold The electrical connection of the group is electrically connected. 18. The "LED lamp" as described in the scope of claim 2, wherein the metal sleeve is replaced by a diagonal metal layer at the oblique edge of the lamp (10). 19. The "LED lamp" of claim 1, wherein the electrical connection portion of the LED module is coupled to a connection terminal dedicated to the projection lamp holder, and the connection terminal protrudes from the outer edge of the lamp holder bottom. . 14
TW99208517U 2010-05-07 2010-05-07 LED lamp TWM394423U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW99208517U TWM394423U (en) 2010-05-07 2010-05-07 LED lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW99208517U TWM394423U (en) 2010-05-07 2010-05-07 LED lamp

Publications (1)

Publication Number Publication Date
TWM394423U true TWM394423U (en) 2010-12-11

Family

ID=45083214

Family Applications (1)

Application Number Title Priority Date Filing Date
TW99208517U TWM394423U (en) 2010-05-07 2010-05-07 LED lamp

Country Status (1)

Country Link
TW (1) TWM394423U (en)

Similar Documents

Publication Publication Date Title
BRPI0709070A2 (en) support body for components or circuits
JP3142963U (en) High efficiency LED lamp
KR101038213B1 (en) Speedy heat radiation apparatus for high luminant LED
TWM345341U (en) Light-emitting structure
CN201487854U (en) High thermal conductivity LED lamp
CN201575346U (en) High efficiency led lamp
CN101545620A (en) Led lamp
TWI398602B (en) High efficiency LED lights
TWI393838B (en) LED lights
TWI338109B (en)
TWM394423U (en) LED lamp
TWM374538U (en) High-efficiency LED (light emitting diode) lamp
CN201836667U (en) Led lamp
CN201269415Y (en) LED lamp
TWM341808U (en) High-efficiency LED (light emitting diode) lamp
TWI424593B (en) Light - emitting diodes of the thermal substrate and thermal module structure
CN102052581A (en) High-efficient LED (light emitting diode) lamp
CN102242873A (en) LED (light emitting diode) lamp
KR20200064373A (en) LED security light with improved heat dissipation function
JP3160879U (en) High efficiency LED lamp
EP2341275A1 (en) LED lamp having higher efficiency
JP5487505B2 (en) LED lamp
TWM405140U (en) Stacked type heat dissipation module
TWI458135B (en) Combination of LED Lamp Base and Lamp Base
JP2009259738A (en) Highly efficient led lamp

Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees